Phase change substrate
CN309884067SActive Publication Date: 2026-03-31CHONGQING CLOUDCHILD TECH CO LTD
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Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Designs(China)
- Current Assignee / Owner
- Filing Date
- 2025-06-23
- Publication Date
- 2026-03-31
Smart Images
Figure 000007_ABST
Abstract
1. The name of the design product: phase change substrate. 2. The use of the design product: the product is mainly used for packaging of power semiconductor module or power semiconductor device, and for heat dissipation of power semiconductor module during operation. 3. The design points of the design product: in shape. 4. The picture or photo that best shows the design points: perspective view.
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