Plasma-enhanced chemical vapor deposition equipment
CN309963602SActive Publication Date: 2026-05-05SHANGHAI MICRO SEMI WORLD
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Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Designs(China)
- Current Assignee / Owner
- SHANGHAI MICRO SEMI WORLD
- Filing Date
- 2025-09-17
- Publication Date
- 2026-05-05
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Figure 000007_ABST
Abstract
1. Name of the product in this design: Plasma-enhanced chemical vapor deposition equipment. 2. Application of this design: Used for chemical vapor deposition of thin films on the surface of semiconductor substrates. 3. The key design feature of this product is its shape. 4. The image or photograph that best illustrates the design's key points: a 3D model.
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