Leadframe (ETSSOP-5L-8R)
CN309976673SActive Publication Date: 2026-05-12JIAXING YAXIN MICROELECTRONICS TECH CO LTD
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Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Designs(China)
- Current Assignee / Owner
- JIAXING YAXIN MICROELECTRONICS TECH CO LTD
- Filing Date
- 2025-10-28
- Publication Date
- 2026-05-12
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Figure 000001_ABST
Abstract
1. The name of the design product: lead frame (ETSSOP-5L-8R). 2. The use of the design product: chip carrier for integrated circuits. 3. The design points of the design product: in shape. 4. The picture or photo that best indicates the design points: front view. 5. The design product is a thin product, and the left view, right view, top view, and bottom view are omitted.
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