Wafer sawing machine
CN309976973SActive Publication Date: 2026-05-12HEFEI AIKARIS INTELLIGENT EQUIP CO LTD
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Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Designs(China)
- Current Assignee / Owner
- HEFEI AIKARIS INTELLIGENT EQUIP CO LTD
- Filing Date
- 2025-07-30
- Publication Date
- 2026-05-12
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Figure 000008_ABST
Abstract
1. The name of the design product: wafer dicing machine. 2. The use of the design product: for wafer dicing process. 3. The design points of the design product: in shape. 4. The picture or photo that best shows the design points: perspective view 1.
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