Large-size diamond single crystal wafer cutting positioning clamp

By employing a precise positioning and stable clamping design for a large-size diamond single-wafer cutting positioning fixture, the problem of low cutting accuracy in existing technologies has been solved, achieving efficient and stable cutting results.

CN224240025UActive Publication Date: 2026-05-15WUXI QIYONG SEMICON TECH CO LTD
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
WUXI QIYONG SEMICON TECH CO LTD
Filing Date
2025-04-21
Publication Date
2026-05-15

AI Technical Summary

Technical Problem

The lack of an effective adjustment mechanism in existing technologies makes it difficult to meet the requirements of high-precision cutting, resulting in low dimensional accuracy of the cut wafers and affecting product quality.

Method used

The large-size diamond single crystal wafer cutting and positioning fixture uses components such as rotating blocks, rotating plates, fixed plates, rotating blocks, side plates, and threaded rods for precise positioning and stable clamping. Combined with the setting of anti-slip pads and soft pads, it achieves precise positioning and stable clamping, preventing the wafer from shifting during the cutting process.

Benefits of technology

It improves cutting efficiency and precision, enhances structural stability and reliability, facilitates installation and maintenance, and ensures the stability and safety of wafers during the cutting process.

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Abstract

The utility model provides a large-size diamond single crystal wafer cutting positioning clamp, which relates to the technical field of positioning clamps, and comprises a bottom plate, a mounting block is arranged on the surface of the bottom plate, a rotating plate is arranged at the top end of the bottom plate, a fixed plate is arranged at the top end of the rotating plate, a rotating block is arranged in the fixed plate, and the rotating block is arranged on the top end of the rotating plate. A side plate is arranged on the side face of the rotating block, a threaded rod is arranged in the side plate, a rotating handle is arranged on the right side of the threaded rod, accurate positioning and stable clamping are achieved, the mounting blocks are evenly distributed at the four corners and provided with mounting grooves, the rotating plate rotates through the rotating blocks, and the fixing plates are symmetrically distributed and rotationally connected with the rotating blocks. The side plates are rotationally connected with the fixed plates and the rotating blocks, the threaded rods are rotationally connected with the rotating blocks through the threaded grooves, and the anti-slip pads are arranged on the side faces of the clamping plates, so that cutting efficiency and precision are improved, meanwhile, the wafers are effectively prevented from moving in the cutting process through the anti-slip pads, the overall structure is stable and reliable, and installation and maintenance are convenient.
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Description

Technical Field

[0001] This utility model relates to the field of positioning fixture technology, and in particular to a positioning fixture for cutting large-size diamond single crystal wafers. Background Technology

[0002] Diamond is a mineral composed of carbon, an allotrope of graphite, with the chemical formula C, and is the precursor to the common diamond. Diamond is the hardest naturally occurring substance in nature. Graphite can be synthesized into synthetic diamonds under high temperature and pressure. Diamond has a wide range of uses, including in handicrafts, industrial cutting tools, and is also a precious gemstone. Diamond wafers are commonly used synthetic stones.

[0003] The production process of diamond single crystal wafers requires the use of cutting equipment, which in turn requires the use of positioning fixtures to fix the diamond single crystal wafers in place.

[0004] In the prior art, such as the positioning fixture for cutting diamond single crystal wafers disclosed in Chinese Publication No. CN213674901U, a positioning cylinder and a limiting plate are included. The limiting plate is located at the top of the positioning cylinder. A placement groove is provided inside the positioning cylinder. An installation cavity is provided on the inner side of the inner wall of the placement groove. A miniature positioning cylinder is installed on the inner wall of the installation cavity by screws. A locking groove is provided on the inner wall of the installation cavity. An adjusting ball is locked in the locking groove. A receiving cavity is provided on the inner wall of the locking groove. A miniature motor is installed on the inner wall of the receiving cavity by screws. The adjusting ball is installed on the output shaft of the miniature motor. This utility model can position the diamond single crystal wafer through the miniature positioning cylinder. The fixing block and the pressure relief block can protect the diamond single crystal wafer and the miniature positioning cylinder. Furthermore, the position of the diamond single crystal wafer can be easily adjusted by adjusting the adjusting ball, and the cutting position can be easily controlled by the limiting plate. Therefore, it is very convenient to use.

[0005] The above-mentioned technology has achieved the effect of allowing multiple people to use it simultaneously, but there are still some shortcomings, specifically:

[0006] If existing technologies lack effective adjustment mechanisms, it is difficult to meet the requirements of high-precision cutting, resulting in low dimensional accuracy of the cut wafers and affecting product quality. Utility Model Content

[0007] The large-size diamond single crystal wafer cutting and positioning fixture proposed in this utility model achieves precise positioning and stable clamping. Its mounting blocks are evenly distributed at the four corners and are provided with mounting grooves. The rotating plate rotates through the rotating blocks. The fixed plates are symmetrically distributed and rotatably connected to the rotating blocks. The side plates are rotatably connected to the fixed plates and rotating blocks. The threaded rod is rotatably connected to the rotating blocks through the threaded grooves. The clamping plate is provided with anti-slip pads on the side, thereby improving cutting efficiency and accuracy. At the same time, the anti-slip pads effectively prevent the wafer from shifting during the cutting process, improving the overall structural stability and reliability, and facilitating installation and maintenance, thus solving the problems mentioned in the background art.

[0008] To achieve the above objectives, the present invention adopts the following technical solution: a large-size diamond single crystal wafer cutting and positioning fixture, comprising a base plate, a mounting block disposed on the surface of the base plate, a rotating plate disposed at the top of the base plate, a fixing plate disposed at the top of the rotating plate, a rotating block disposed inside the fixing plate, a side plate disposed on the side of the rotating block, a threaded rod disposed inside the side plate, a handle disposed on the right side of the threaded rod, a rotating shaft disposed on the left side of the threaded rod, a clamping plate disposed on the left side of the rotating shaft, a locking rod disposed at the top of the rotating block, a lifting block disposed at the top of the locking rod, and a guide rod disposed on the right side of the clamping plate.

[0009] Preferably, the mounting blocks are evenly distributed at the four corners of the base plate, and the top of each mounting block is provided with a mounting groove. The rotating plate rotates at the top of the base plate via the rotating blocks.

[0010] Preferably, the fixed plates are symmetrically distributed at the top left and right ends of the rotating plate, and the rotating block is rotatably connected to the fixed plates through a rotating groove.

[0011] Preferably, the side plates are symmetrically distributed at the left and right ends of the rotating block, the side plates are rotatably connected to the fixed plate, the threaded rod is rotatably connected to the rotating block through the threaded groove, and the side of the clamping plate is provided with an anti-slip pad.

[0012] Preferably, the locking rod is slidably connected to the rotating block via a locking groove, the locking rod is slidably connected to the fixing plate via a sliding groove, the lifting block is slidably connected to the fixing plate, and the guide rod is slidably connected to the rotating block via a guide groove.

[0013] Preferably, the mounting block has a retaining plate inside, the surface of the retaining plate has a soft pad, and the top of the retaining plate has a protective cover.

[0014] Preferably, the card plates are evenly distributed at the bottom end of the cover, the card plates are slidably connected to the mounting block, and the soft pad is slidably connected to the mounting block.

[0015] Compared with the prior art, the advantages and positive effects of this utility model are as follows:

[0016] 1. In this utility model, precise positioning and stable clamping are achieved through a rotating block, rotating plate, fixed plate, rotating groove, rotating block, side plate, threaded groove, threaded rod, handle, rotating shaft, clamping plate, anti-slip pad, slot, clamping rod, lifting block and sliding groove. The mounting blocks are evenly distributed at the four corners and are provided with mounting grooves. The rotating plate rotates through the rotating block. The fixed plate is symmetrically distributed and rotatably connected to the rotating block. The side plate is rotatably connected to the fixed plate and the rotating block. The threaded rod is rotatably connected to the rotating block through the threaded groove. Anti-slip pads are provided on the side of the clamping plate, thereby improving cutting efficiency and accuracy. At the same time, the anti-slip pads effectively prevent the wafer from shifting during the cutting process, improving the overall structural stability and reliability, and facilitating installation and maintenance.

[0017] 2. In this utility model, efficient protection and precise positioning are achieved through the card plate, soft pad and protective cover. The card plate is evenly distributed and slidably connected to the mounting block. The soft pad is also slidably connected to the mounting block. The presence of the soft pad increases the friction, avoids the card plate from sliding during use, and improves the cutting accuracy. The design of the protective cover further protects the fixing screws and prevents them from being accidentally bumped or contaminated during operation. Attached Figure Description

[0018] Figure 1 A three-dimensional structural view of a large-size diamond single crystal wafer cutting and positioning fixture is provided for this utility model;

[0019] Figure 2 An exploded perspective view of the base of the large-size diamond single crystal wafer cutting and positioning fixture proposed in this utility model;

[0020] Figure 3 This utility model proposes a large-size diamond single crystal wafer cutting and positioning fixture. Figure 2 Enlarged 3D view of the structure at point A in the middle;

[0021] Figure 4 An exploded perspective view of the clamping plate of the large-size diamond single crystal wafer cutting and positioning fixture proposed in this utility model;

[0022] Figure 5 This utility model proposes a large-size diamond single crystal wafer cutting and positioning fixture. Figure 4 Enlarged 3D view of the structure at point B.

[0023] Legend: 1. Base plate; 2. Mounting block; 3. Mounting groove; 4. Rotating block; 5. Rotating plate; 6. Fixing plate; 7. Rotating groove; 8. Rotating block; 9. Side plate; 10. Threaded groove; 11. Threaded rod; 12. Turning handle; 13. Rotating shaft; 14. Clamping plate; 15. Anti-slip pad; 16. Slot; 17. Clamping rod; 18. Lifting block; 19. Slide groove; 20. Clamping plate; 21. Soft pad; 22. Protective cover; 23. Guide rod; 24. Guide groove. Detailed Implementation

[0024] To better understand the above-mentioned objectives, features, and advantages of this utility model, the present utility model will be further described below with reference to the accompanying drawings and embodiments. It should be noted that, unless otherwise specified, the embodiments and features described in these embodiments can be combined with each other.

[0025] Many specific details are set forth in the following description in order to provide a full understanding of the present invention. However, the present invention may also be implemented in other ways different from those described herein. Therefore, the present invention is not limited to the specific embodiments disclosed in the following specification.

[0026] Example 1: As Figures 1-2 , Figures 4-5 As shown, this utility model provides a technical solution: a large-size diamond single crystal wafer cutting and positioning fixture, including a base plate 1, mounting blocks 2 disposed on the surface of the base plate 1, a rotating plate 5 disposed at the top of the base plate 1, a fixing plate 6 disposed at the top of the rotating plate 5, a rotating block 8 disposed inside the fixing plate 6, a side plate 9 disposed on the side of the rotating block 8, a threaded rod 11 disposed inside the side plate 9, a handle 12 disposed on the right side of the threaded rod 11, a rotating shaft 13 disposed on the left side of the threaded rod 11, a clamping plate 14 disposed on the left side of the rotating shaft 13, a locking rod 17 disposed at the top of the rotating block 8, a lifting block 18 disposed at the top of the locking rod 17, a guide rod 23 disposed on the right side of the clamping plate 14, and mounting blocks 2 evenly distributed at the four corners of the base plate 1. The top of the mounting block 2 is provided with a mounting groove 3. The rotating plate 5 rotates on the top of the base plate 1 via the rotating block 4. The fixing plate 6 is symmetrically distributed on the left and right ends of the top of the rotating plate 5. The rotating block 8 is rotatably connected to the fixing plate 6 via the rotating groove 7. The side plate 9 is symmetrically distributed on the left and right ends of the rotating block 8. The side plate 9 is rotatably connected to the fixing plate 6. The threaded rod 11 is rotatably connected to the rotating block 8 via the threaded groove 10. The side of the clamping plate 14 is provided with an anti-slip pad 15. The clamping rod 17 is slidably connected to the rotating block 8 via the clamping groove 16. The clamping rod 17 is slidably connected to the fixing plate 6 via the sliding groove 19. The lifting block 18 is slidably connected to the fixing plate 6. The guide rod 23 is slidably connected to the rotating block 8 via the guide groove 24.

[0027] In this embodiment, stable installation and convenient disassembly of the clamp are achieved. The symmetrical distribution and flexible rotation design of the rotating plate 5 and the fixed plate 6, combined with the precise linkage of the rotating block 8 and the side plate 9, make the wafer positioning more accurate and the operation more flexible. The ingenious combination of the threaded rod 11 and the handle 12, as well as the fine connection between the rotating shaft 13 and the clamping plate 14, provide stable clamping force and fine adjustment function. The sliding connection between the locking rod 17 and the lifting block 18 ensures the stability and safety of the wafer during the cutting process, improves cutting efficiency and accuracy, and enhances the convenience and safety of operation.

[0028] Example 2: As Figures 1-3As shown, the mounting block 2 has a retaining plate 20 inside, a soft pad 21 on the surface of the retaining plate 20, a cover 22 on the top of the retaining plate 20, the retaining plates 20 are evenly distributed at the bottom of the cover 22, the retaining plates 20 are slidably connected to the mounting block 2, and the soft pad 21 is slidably connected to the mounting block 2.

[0029] In this embodiment, the clamp provides enhanced support and protection for the wafer, preventing damage during the cutting process. The soft pad 21 also effectively increases friction, preventing accidental slippage of the wafer. The sliding connection between the clamping plate 20 and the mounting block 2, along with the design of the soft pad 21, makes the clamp more flexible and stable during operation, significantly improving cutting accuracy and efficiency. This solves the problems of wafer damage and unstable operation in traditional technologies, providing a more reliable and efficient technical solution for the cutting of large-size diamond single wafers.

[0030] The working principle of this embodiment is as follows: Before use, place the base plate 1 in the required position and firmly fix it in place with the mounting slot 3 and mounting block 2. Then, pinch the cover 22 to align the clamping plate 20 with the mounting slot 3 and press it down, so that the clamping plate 20 drives the soft pad 21 to slide down through the mounting slot 3 at the top of the mounting block 2. When the clamping plate and the soft pad 21 have completely slid into the interior of the mounting block 2 through the mounting slot 3, and the cover 22 is attached to the top of the mounting block 2, the diamond single crystal is placed on the top of the rotating plate 5. Then, pinch the handle 12 to rotate, so that the threaded rod 11 rotates through the threaded groove 10 inside the rotating block 8 and rotates on the side of the clamping plate 14 through the rotating shaft 13. At this time, the guide rod 23 moves together with the clamping plate 14. The guide rod 23 slides through the guide groove 24 inside the clamping plate 14. When the clamping plate 14 contacts the diamond single crystal wafer, it can firmly fix the diamond single crystal wafer. At this time, the anti-slip pad 15 can prevent the diamond single crystal wafer from slipping during processing. During use, the operator can pinch the rotating plate 5 and rotate it, so that the rotating plate 5 rotates at the top of the base plate 1 through the rotating block 4 to achieve the effect of left and right adjustment. Then pinch the lifting block 18 and pull it upward, so that the locking rod 17 slides upward inside the fixed plate 6 through the sliding groove 19 and slides out of the rotating block 8 through the locking groove 16. Then pinch the side plate 9 and rotate it, so that the rotating block 8 rotates inside the fixed plate 6 through the rotating groove 7, and drives the clamping plate 14 to rotate together through the threaded rod 11 to achieve the effect of rotating and adjusting the diamond single crystal wafer.

[0031] The above description is merely a preferred embodiment of the present utility model and is not intended to limit the present utility model in any other way. Any person skilled in the art may make changes or modifications to the above-disclosed technical content to create equivalent embodiments for application in other fields. However, any simple modifications, equivalent changes, and modifications made to the above embodiments based on the technical essence of the present utility model without departing from the technical solution of the present utility model shall still fall within the protection scope of the technical solution of the present utility model.

Claims

1. A large-size diamond single-crystal wafer cutting and positioning fixture, including a base plate (1), characterized in that: The base plate (1) is provided with a mounting block (2) on its surface. The top of the base plate (1) is provided with a rotating plate (5). The top of the rotating plate (5) is provided with a fixing plate (6). The inside of the fixing plate (6) is provided with a rotating block (8). The side of the rotating block (8) is provided with a side plate (9). The inside of the side plate (9) is provided with a threaded rod (11). The right side of the threaded rod (11) is provided with a handle (12). The left side of the threaded rod (11) is provided with a rotating shaft (13). The left side of the rotating shaft (13) is provided with a clamping plate (14). The top of the rotating block (8) is provided with a locking rod (17). The top of the locking rod (17) is provided with a lifting block (18). The right side of the clamping plate (14) is provided with a guide rod (23).

2. The large-size diamond single-wafer cutting and positioning fixture according to claim 1, characterized in that: The mounting blocks (2) are evenly distributed at the four corners of the base plate (1). The top of the mounting blocks (2) is provided with mounting grooves (3). The rotating plate (5) rotates at the top of the base plate (1) via the rotating block (4).

3. The large-size diamond single-wafer cutting and positioning fixture according to claim 1, characterized in that: The fixed plate (6) is symmetrically distributed at the top left and right ends of the rotating plate (5), and the rotating block (8) is rotatably connected to the fixed plate (6) through the rotating groove (7).

4. The large-size diamond single-wafer cutting and positioning fixture according to claim 1, characterized in that: The side plates (9) are symmetrically distributed on the left and right ends of the rotating block (8). The side plates (9) are rotatably connected to the fixed plate (6). The threaded rod (11) is rotatably connected to the rotating block (8) through the threaded groove (10). The side of the clamping plate (14) is provided with an anti-slip pad (15).

5. The large-size diamond single-wafer cutting and positioning fixture according to claim 1, characterized in that: The lever (17) is slidably connected to the rotating block (8) through the slot (16), the lever (17) is slidably connected to the fixed plate (6) through the slide groove (19), the lifting block (18) is slidably connected to the fixed plate (6), and the guide rod (23) is slidably connected to the rotating block (8) through the guide groove (24).

6. The large-size diamond single-wafer cutting and positioning fixture according to claim 1, characterized in that: The mounting block (2) has a card plate (20) inside, the surface of the card plate (20) is provided with a soft pad (21), and the top of the card plate (20) is provided with a cover (22).

7. The large-size diamond single-wafer cutting and positioning fixture according to claim 6, characterized in that: The card plate (20) is evenly distributed at the bottom of the cover (22). The card plate (20) is slidably connected to the mounting block (2). The soft pad (21) is slidably connected to the mounting block (2).