Multi-size compatible chemical mechanical planarization equipment
CN310070401SActive Publication Date: 2026-07-03吉姆西半导体科技(无锡)股份有限公司
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Designs(China)
- Current Assignee / Owner
- 吉姆西半导体科技(无锡)股份有限公司
- Filing Date
- 2025-11-28
- Publication Date
- 2026-07-03
Smart Images
Figure 000007_ABST
Abstract
1. Name of the product in this design: Multi-size compatible chemical mechanical planarization equipment. 2. Application of this design: It is used in the semiconductor manufacturing field to perform chemical mechanical polishing (CMP) on semiconductor wafers of various sizes to achieve high-precision planarization of the wafer surface. 3. The key design feature of this product is its shape. 4. The image or photograph that best illustrates the design's key points: a 3D model.
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