Multilayer system with a layer as a separating layer for supporting thin wafers in semiconductor production, use of the layer system in and method for thinning a wafer
A three-layer composite on the wafer surface addresses handling challenges by stabilizing thin wafers, enabling efficient and cost-effective production and coating of thinner wafers with reduced mechanical stress.
Patent Information
- Application Number
- DE102006009394
- Authority / Receiving Office
- DE · DE
- Patent Type
- Patents
- Current Assignee / Owner
- Filing Date
- 2006-03-01
- Publication Date
- 2025-07-31
- Estimated Expiration
- Not applicable · inactive patent
AI Technical Summary
Conventional methods face challenges in processing thin wafers due to mechanical loads during thinning, protective film removal, and subsequent handling, particularly in coating the rear side, leading to difficulties in handling and increased production costs.
A three-layer layer composite is applied to the wafer surface, comprising a separating layer with enhanced adhesion on one side and a soft elastomer layer to stabilize the wafer, followed by a mechanically stable layer, allowing direct application of a carrier system without a separate separating layer, simplifying handling and reducing mechanical stress.
Enables reliable, cost-effective production of thinner wafers with reduced mechanical stress, facilitating easier handling and coating processes, and improving production efficiency.
Smart Images
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Abstract
Claims
[1] Layer system containing a layer composite (4, 5, 6) as a carrier for coating the surface (2) of a wafer (1) provided with components (7) during thinning of the wafer (1) and subsequent separation of the components (7), wherein the layer composite consists of three layers, - wherein the first layer (4) is a separating layer through which the layer composite connected to the surface (2) of the wafer (1) can be detached from the wafer (1), - the second layer (5) is an elastomer layer, - the third layer (6) is a polyimide film and - wherein the elastomer of the second layer (5) is silicone. [2] Layer system according to claim 1, wherein the elastomer of the second layer (5) is crosslinkable. [3] Layer system according to one of claims 1 to 2, further comprising a removable protective film (9) on the first layer (4). [4] Use of a layer composite (4, 5, 6) as defined in one of claims 1 to 2 as a carrier for coating the surface (2) of a wafer (1) provided with components (7) during thinning of the wafer (1) and the subsequent singulation of the components (7). [5] Method for thinning a wafer (1) having a surface (2) provided with components (7) and subsequently singulating the components (7), comprising the step - covering the front side (2) of the wafer (1) provided with components (7) with a layer composite (4, 5, 6) as defined in one of claims 1 to 2 as a carrier during thinning of the wafer (1) and subsequent singulation of the components (7), wherein the separating layer (4) is located on the side of the layer composite (4, 5, 6) facing the wafer front side (2). [6] Method according to claim 5, wherein the layer composite (4, 5, 6) is pressed or bonded to the front side (2) of the wafer (1) provided with components (7). [7] The method according to claim 5 or 6, further comprising the step - Crosslinking the elastomer of the second layer (5). [8] Method according to one of claims 5 to 7, wherein the front side (2) of the wafer (1) provided with components (7) has etching or scratch trenches (8).
Citation Information
Patent Citations
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