Device with organic light-emitting display and method for manufacturing the same

Abstract

Device with organic light-emitting display, comprising: a display unit (200) formed on a substrate (100), wherein the display unit (200) comprises a plurality of EL devices (24) having a first electrode (241), a second electrode (243) and a light emission layer (242) between the first and the second electrode (241, 243); Metal wires (300) formed on an outer section of the substrate (100), wherein the metal wires (300) are horizontally spaced from the display unit (200) so that they do not contact any elements of the display unit (200); and a thin-film encapsulation layer comprising at least one organic layer (410) and at least one inorganic layer (510) which are alternately layered on the display unit (200) to tightly enclose the display unit (200), wherein at least one organic layer (410) is separated from the metal wires (300) so that it is not in contact with the metal wires (300), wherein the at least one organic layer comprises a first organic layer (410) adjacent to the display unit (200) and a second organic layer (420) located on the first organic layer (410), wherein the at least one inorganic layer (510) is arranged between the two wherein the first organic layer (410) is separated from the metal wires (300) so that it does not overlap the metal wires (300), and the second organic layer (420) is arranged so that it partially overlaps the metal wires (300) without touching the metal wires (300).

Description

AREA OF INVENTION

[0001] The present embodiments relate to a device with an organic light-emitting display, in particular a device with an organic light-emitting display having a thin-film encapsulation layer with an improved structure, and a method for manufacturing the device with an organic light-emitting display. DESCRIPTION OF THE RESPECTIVE STATE OF THE TECHNOLOGY

[0002] An organic light-emitting display device generally comprises a display unit with a structure in which a light-emitting layer made of an organic material is arranged between an anode and a cathode. When different voltages are applied to the anode and the cathode, holes injected from the anode and electrons injected from the cathode recombine in the light-emitting layer, generating excitons. When the excitons transition from an excited state to a ground state, light is emitted and images are displayed.

[0003] Direct exposure of the light-emitting layer of the display unit to moisture can easily lead to a deterioration of its light-emitting properties. Therefore, to address this problem, the light-emitting layer is covered by an encapsulation layer. Currently, a thin-film encapsulation layer is primarily used, in which organic and inorganic layers are layered alternately.

[0004] The inorganic layers prevent moisture from penetrating the display unit, while the organic layers, instead of preventing moisture penetration, primarily serve to ensure the flexibility or flatness of the thin-film encapsulation layer. The organic layers cannot actually prevent moisture penetration. Therefore, if the organic layers come into contact with a moisture source outside the thin-film encapsulation layer, external moisture can penetrate the display unit via the organic layers and thereby impair the light-emitting layer.

[0005] Currently, various metal wires, including wires for a static electricity blocking protection circuit, are provided on an outer section of the substrate of the organic light-emitting display (OLD). However, during the formation of a thin-film encapsulation layer, the organic layers of the encapsulation layer generally partially cover the metal wires located on the outer section of the substrate. This creates a path for moisture ingress, allowing external moisture to penetrate the display unit and reducing its lifespan. External moisture can penetrate through the side faces of the metal wires with insufficient edge coverage and subsequently reach the organic layers of the encapsulation layer covering the metal wires.It therefore appears that a pathway is formed in the organic layers along which the moisture penetrates to the display unit.

[0006] Alternatively, the metal wires can be covered by an organic layer, the thin-film encapsulation layer can cover both the metal wires and the organic layer, and a first organic layer of the thin-film encapsulation layer can be in direct contact with the organic layer. In this case, external moisture penetrates through the organic layer covering the metal wires and, via the first organic layer of the thin-film encapsulation layer, reaches the display unit, thereby damaging the organic light-emitting display device.

[0007] Alternatively, if the organic layers of the thin-film encapsulation layer cover the metal wires, the organic layers may spread outwards in a liquid phase along the side faces of the metal wires before they harden. In this case, if the inorganic layers of the thin-film encapsulation layer cannot cover the extended sections of the organic layers, external moisture may penetrate through these extended sections to the display unit, thereby damaging the organic light-emitting display device.

[0008] As described above, the formation of a pathway for moisture ingress accelerates the deterioration of the display unit and significantly reduces the lifespan of the device with an organic light-emitting display. Therefore, effective countermeasures are necessary to remedy the problems described above.

[0009] US 2003 / 0094615 A1 discloses a light-emitting device comprising a substrate on which a display area consisting of a light-emitting element is formed, and a sealing substrate which is attached by a resin material to a shielding pattern formed in an outer section of the display area.

[0010] US 8,159,127 B2 relates to a display device. The display device comprises a circuit substrate with a driver circuit; a planar layer extending over the driver circuit; a display area containing organic light-emitting devices; a bank layer arranged on the planar layer; an organic protective layer extending over the display area; and an inorganic protective layer extending over the organic protective layer. Furthermore, both the planar layer and the bank layer are each separated into a portion arranged in the display area and a portion arranged in the peripheral area.

[0011] US 2010 / 0200846 A1 discloses a display device comprising a substrate with organic light-emitting diodes (OLEDs) mounted thereon. A thin-film encapsulation layer covers the OLEDs. Finally, a non-organic layer is formed below the thin-film encapsulation layer along one edge of the same.

[0012] US 2012 / 0091477 A1 relates to an OLED display comprising a substrate; a display unit formed on the substrate; a trapping layer arranged on the outside of the display unit; and a thin-film encapsulation layer formed from an organic and inorganic film, wherein the thin-film encapsulation layer covers the entire display unit and at least part of the trapping layer.

[0013] DE 10 2012 203 530 A1 discloses a display device with an auxiliary metal layer formed on a substrate. A common voltage line is formed on the substrate, which is directly connected to the auxiliary metal layer. SUMMARY

[0014] The present embodiments provide: a device with an organic light-emitting display with an improved thin-film encapsulation layer to effectively block the penetration of moisture from outside a display unit to the display unit, and a method for manufacturing the device with the organic light-emitting display.

[0015] According to one aspect of the present embodiments, a device with an organic light-emitting display is provided, comprising: a display unit formed on a substrate; metal wires formed on an outer section of the substrate; and a thin-film encapsulation layer formed by alternating layers of at least one organic layer and at least one inorganic layer on the display unit for tightly enclosing the display unit, wherein the at least one organic layer is separated from the metal wires so that it is not in contact with the metal wires.

[0016] According to the above structure, since the organic layer closest to the display unit is completely separated from the metal wires formed on an outer section of the substrate, the penetration of moisture to the display unit via the metal wires can be prevented.

[0017] The at least one organic layer is the first organic layer formed on the display unit in the vertical direction. The at least one organic layer is preferably formed such that it completely covers the top surface and the side surfaces of the display unit.

[0018] All layers of the thin-film encapsulation layer completely enclose the top surface and side surfaces of the display unit, as well as the top surface and side surfaces of the respective layers of the thin-film encapsulation layer below them.

[0019] The at least one organic layer is formed vertically above the display unit and is separated by the at least one inorganic layer from a further organic layer formed vertically above the metal wires.

[0020] The outermost layer of the thin-film encapsulation layer can be an organic layer or an inorganic layer.

[0021] The at least one organic layer comprises a first organic layer adjacent to the display unit and a second organic layer formed on top of the first organic layer, with the at least one inorganic layer arranged between them. "Adjacent" in this context means the first organic layer closest to the display unit in a vertical and / or horizontal direction.

[0022] The organic layer can consist of three or more organic layers, including an additional organic layer alongside the first organic layer and the second organic layer.

[0023] The first organic layer is separated from the metal wires so that it does not overlap the metal wires, while the second organic layer partially overlaps the metal wires without touching them.

[0024] A layer of the thin-film encapsulation layer that is in direct contact with the display unit can be an inorganic layer or an organic layer.

[0025] At least one additional organic layer and / or one of the inorganic layers can be formed on the metal wires.

[0026] The organic layer of the thin-film encapsulation layer may comprise polyimide, acrylic, epoxy, silicon or allyl, and the at least one additional organic layer on the metal wires comprises acrylic or polyimide.

[0027] The inorganic layer of the thin-film encapsulation layer can include AlOx, SiNx, SiOx, SiOxNy, indium tin oxide (ITO), aluminum zinc oxide (AZO), ZnO or ZrO, and the inorganic layer on the metal wires can include SiNx or SiOx.

[0028] According to a further aspect of the present embodiments, a method for manufacturing a device with an organic light-emitting display is provided, the method comprising: forming a display unit on a substrate; forming metal wires on an outer section of the substrate; and forming a thin-film encapsulation layer by alternately layering at least one organic layer and at least one inorganic layer on the display unit to tightly enclose the display unit, wherein the at least one organic layer is separated from the metal wires so that it is not in contact with the metal wires.

[0029] The outermost layer of the thin-film encapsulation layer can be an organic layer or an inorganic layer.

[0030] The at least one organic layer comprises a first organic layer adjacent to the display unit and a second organic layer formed on the first organic layer, with the at least one inorganic layer arranged between the two.

[0031] The organic layer can consist of three or more organic layers, including an additional organic layer alongside the first organic layer and the second organic layer.

[0032] The first organic layer is separated from the metal wires so that it does not overlap the metal wires, while the second organic layer partially overlaps the metal wires without touching them.

[0033] A layer of the thin-film encapsulation layer that is in direct contact with the display unit can be an inorganic layer.

[0034] A layer of the thin-film encapsulation layer that is in direct contact with the display unit can be an organic layer.

[0035] At least one organic layer and one inorganic layer can be formed on the metal wires.

[0036] The organic layer of the thin-film encapsulation layer can comprise polyimide, acrylic, epoxy, silicon or allyl, and the organic layer on the metal wires can comprise acrylic or polyimide.

[0037] The inorganic layer of the thin-film encapsulation layer can include AlOx, SiNx, SiOx, SiOxNy, indium tin oxide (ITO), aluminum zinc oxide (AZO), ZnO or ZrO, and the inorganic layer on the metal wires can include SiNx or SiOx. BRIEF DESCRIPTION OF THE DRAWINGS

[0038] The above and further features and advantages of the present embodiments can be seen even more clearly in the detailed description of exemplary embodiments with reference to the accompanying drawings. It shows: Fig. 1A A top view of a device with an organic light-emitting display according to one embodiment; Fig. 1B a cross-sectional view of the device with organic light-emitting display along a line AA of Fig. 1A; Fig. 2 a cross-sectional view of a device with an organic light-emitting display according to a further embodiment; Fig. 3 a cross-sectional view of a device with organic light-emitting display according to a further embodiment; Fig. 4 a partially enlarged top view of some pixels included in a display unit; Fig. 5 a corresponding circuit diagram of a in Fig. 4 pixels shown; Fig. 6 a cross-sectional view of the pixel along a line CC of Fig. 4; and Fig. 7 a cross-sectional view of the pixel along a line DD of Fig. 4. DETAILED DESCRIPTION

[0039] The following is a description of embodiments with reference to the attached drawings.

[0040] Identical elements are consistently designated with the same numbers. In the description of the present embodiments, a detailed description of technologies or structures commonly used in connection with the embodiments is omitted if it might unnecessarily obscure the subject matter of the embodiments.

[0041] For clarity, layers and areas are depicted as exaggeratedly thick in the drawings. It should also be understood that when a layer is described as being "on" another layer or substrate, this layer may be located directly on top of the other layer or substrate, or there may be intervening layers.

[0042] Fig. Figure 1A is a top view of a device with an organic light-emitting display according to one embodiment, and Fig. 1B is a cross-sectional view of the device with organic light-emitting display along a line AA of Fig. 1A. Fig. Figure 4 is a partially enlarged top view showing some pixels of a display unit 20, and Fig. 5 is a corresponding circuit diagram of a pixel.

[0043] Firstly, referring to Fig. 1A and Fig. In the device with organic light-emitting display of the present embodiments, a display unit 200 for displaying images on a substrate 100 is arranged, and on the display unit 200, organic layers 410 and 420 and inorganic layers 510 and 520 are alternately layered as thin-film encapsulation layers. Each uppermost layer of the thin-film encapsulation layer completely covers the layer below it. The display unit 200 is thus tightly enclosed between the substrate 100 and the thin-film encapsulation layers 410, 420, 510, and 520.

[0044] Metal wires 300, used as a protective circuit to block static electricity, are arranged on an outer section of the substrate 100. The metal wires 300 are horizontal and spaced away from the display unit 200 so that they do not come into contact with elements of the display unit 200. Since the metal wires 300 and the organic layers 410 and 420 of the thin-film encapsulation layer only slightly block the penetration of moisture compared to the inorganic layers 510 and 520, if weak sections of the metal wires 300, through which moisture easily penetrates, are connected to the organic layers 410 and 420 of the thin-film encapsulation layer, a path is formed along which external moisture penetrates to the display unit 200.The weak sections are sections of the metal wires 300 with insufficient profiles, a section not completely covered by an inorganic layer, a section covered by an organic layer in direct contact with an organic layer of the thin-film encapsulation layer, such as an acrylic or polyimide layer, or an extended section of the organic layer of the thin-film encapsulation layer along a side face of the metal wires (which may be covered by an organic or inorganic layer separate from the thin-film encapsulation layer) that the inorganic layer cannot completely cover. According to the current embodiment, the structure of the device with an organic light-emitting display is thus improved in such a way that a path for moisture ingress is not formed.The characterized structure is described below, and the detailed structure of the display unit 200 is also described herein.

[0045] In display unit 200 there is a plurality of in Fig. The 4 pixels shown are formed, and each pixel can be defined by a Fig. The corresponding circuit diagram shown in section 5 can be expressed.

[0046] According to the representation in Fig. 4 and Fig. 5 each pixel comprises a first thin-film transistor (TFT) 21 for switching, at least a second TFT 23 for driving, a capacitor 22 and an organic electroluminescence device (hereinafter referred to as “EL device”) 24.

[0047] The first TFT 21 is controlled by a sampling signal applied to a gate line 26 in such a way that it transmits a data signal applied to a data line 27.

[0048] The second TFT 23 determines an amount of electric current induced in the EL device 24 according to the data signal transmitted by the first TFT 21, for example a voltage difference Vgs between a gate and a source.

[0049] The capacitor 22 stores the data signal transmitted by the first TFT 21 for the duration of one image.

[0050] To implement the circuit described above, a device with an organic light-emitting display with a structure corresponding to the illustration in [reference] is used. Fig. 4, Fig. 6 or Fig. 7 trained; this is described in more detail below.

[0051] According to the representation in Fig. 4, Fig. 6 and Fig. 7 a buffer layer 111 is formed on a substrate 100 and the first TFT 21, the second TFT 23, the capacitor 22 and the EL device 24 are formed on the buffer layer 111.

[0052] According to the representation in Fig. 4 and Fig. 6 the first TFT 21 comprises a first active layer 211 formed on the buffer layer 111, a gate insulating layer 112 formed on the first active layer 211 and a gate electrode 212 formed on the gate insulating layer 112.

[0053] The first active layer 211 can be configured as an amorphous silicon thin film or a polycrystalline silicon thin film. Such an active semiconductor layer has a source region and a drain region that are doped with high concentrations of N-type or P-type impurities. Alternatively, the first active layer 211 can comprise an oxide semiconductor. The oxide semiconductor can, for example, be an oxide of a material selected from group 12, 13, and 14 metal elements, such as zinc (Zn), indium (In), gallium (Ga), tin (Sn), cadmium (Cd), germanium (Ge), or hafnium (Hf), and combinations thereof. The first active layer 211 can, for example, comprise GIZO[(In₂O₃)a(Ga₂O:)b(ZnO)c] (a, b, c are real numbers satisfying the conditions a ≥ 0, b ≥ 0, and c > 0, respectively).

[0054] The gate insulating layer 112 is arranged on the first active layer 211, and the gate electrode 212 is formed in a predefined area on the gate insulating layer 112. The gate electrode 212 is connected to the gate line 26, which applies the TFT on / off signals.

[0055] An intermediate insulator 113 is formed on the gate electrode 212, and a source electrode 213 and a drain electrode 214 are configured to be in contact with the source region and the drain region of the first active layer 211, respectively, via contact holes. The source electrode 213 is connected to the first active layer 211 to provide the data signal. Fig. 6 shown data line 27 connected, and the drain electrode 214 is connected to a first charging electrode 221 of the capacitor 22 to supply the capacitor 22 with electrical energy.

[0056] A passivation layer 114 comprising SiO2 or SiNx is formed on the source and drain electrodes 213 and 214, and a leveling layer 115 comprising acrylic, polyimide or BCB is formed on the passivation layer 114.

[0057] Capacitor 22 is located between the first TFT 21 and the second TFT 23 and stores a drive voltage required to control the second TFT 23 for the duration of an image. As shown in Fig. 4 and Fig. 6 The capacitor 22 can comprise: a first charging electrode 221 connected to the drain electrode 214 of the first TFT 21, a second charging electrode 222 formed on the first charging electrode 221, which overlaps the first charging electrode 221 and is electrically connected to a control energy line 25 that applies control energy, and the intermediate insulator 113 formed between the first charging electrode 221 and the second charging electrode 222, which acts as a dielectric.

[0058] According to the representation in Fig. 4 and Fig. 7. The second TFT 23 comprises a second active layer 231 formed on the buffer layer 111. The second active layer 231 includes a source region and a drain region highly doped with N-type or P-type impurities. The second active layer 231 may also include an oxide semiconductor. The oxide semiconductor may, for example, be an oxide of a material selected from group 12, 13, and 14 metal elements, such as zinc (Zn), indium (In), gallium (Ga), tin (Sn), cadmium (Cd), germanium (Ge), or hafnium (Hf), and combinations thereof. The second active layer 231 may, for example, comprise GIZO[(In₂O₃)a(Ga₂O₃)b(ZnO)c] (a, b, c are real numbers satisfying the conditions a ≥ 0, b ≥ 0, and c > 0, respectively).On the second active layer 231, a gate electrode 232 is formed to provide TFT on / off signals. This gate electrode is connected to the first charging electrode 221 of the capacitor 22, with the gate insulating layer 112 positioned between them. The gate electrode 232 also includes a source electrode 233, which is connected to the drive energy line 25 to provide a reference voltage to the second active layer 231, and a drain electrode 234, which connects the second TFT 23 to the EL device 24 to apply electrical drive energy to the EL device 24. The intermediate insulator 113 is arranged between the gate electrode 232 and the source and drain electrodes 233 and 234, and the passivation layer 114 is arranged between the source and drain electrodes 233 and 234 and a first electrode 241, which is an anode of the EL device 24.

[0059] On the first electrode 241, an insulating, acrylic-encompassing flattening layer 115 is arranged, and predetermined openings 244 are formed in the flattening layer 115 in order to form the EL device 24 in each of the openings 244.

[0060] The EL device 24 emits red, green, and blue light in response to an electric current, thus displaying predetermined image information. The EL device 24 comprises the first electrode 241, which is an anode connected to the drain electrode 234 of the second TFT 23 for receiving positive electrical energy from the drain electrode 234; a second electrode 243, which is a cathode arranged to cover entire pixels for providing negative electrical energy; and a light-emitting layer 242 arranged between the first and second electrodes 241 and 243 for emitting light.

[0061] The light emission layer 242 can comprise a low molecular weight or a high molecular weight organic material. If the low molecular weight organic material is used, the light emission layer 242 can have a single- or multi-layered structure comprising at least one layer selected from the group consisting of a hole injection layer (HIL), a hole transport layer (HTL), an emission layer (EML), an electron transport layer (ETL), and an electron injection layer (EIL). Examples of available organic materials may include: copper phthalocyanine (CuPc), N,N'-di(naphthalen-1-yl)-N,N'-diphenylbenzidine (NPB), tris-8-hydroxyquinoline aluminum (Alq3), and the like.

[0062] If a high molecular weight organic material is used, the light-emitting layer (HTL) can have a structure comprising the HTL and EML. The HTL can comprise poly(3,4-ethylenedioxythiophene) (PEDOT), and the EML can comprise an organic polymer material based on polyphenylenevinylene (PPV) and polyfluorene. In the light-emitting layer 242, a unit pixel can consist of subpixels emitting red, green, or blue light. Alternatively, the light-emitting layer can typically extend across all subpixels without depositing electroluminescent material in each subpixel. The light-emitting layer can be formed by vertically layering or mixing layers containing the red, green, and blue light-emitting materials. Other colors can also be combined, particularly if white light is emitted.Furthermore, a color conversion layer or a color filter may be provided to convert the white light into a predetermined colored light.

[0063] However, the light emission layer 242 is very sensitive to moisture, and therefore, when moisture penetrates to the display unit 200, the image display properties of the device with organic light-emitting display are slightly impaired.

[0064] Once again on Fig. 1A and Fig. Referring to 1B, the structure of the device with organic light-emitting display according to the embodiment is described below.

[0065] The in Fig. The display unit 200 shown comprises the pixels described above, and the images are displayed on display unit 200. The in Fig. 4, Fig. 6 and Fig. The 7 TFTs, capacitors and EL devices shown are arranged in the display unit 200.

[0066] The thin-film encapsulation layer 410, 420, 510, and 520 is formed on the display unit 200 in such a way as to protect the display unit 200 from external moisture and oxygen. The display unit 200 is completely covered from above by the thin-film encapsulation layer 410, 420, 510, and 520. The thin-film encapsulation layer has a structure in which a first organic layer 410, a first inorganic layer 510, a second organic layer 420, and a second inorganic layer 520 are layered in the aforementioned order. The first organic layer 410 directly and completely covers the display unit 200, the first inorganic layer 510 completely covers the first organic layer 410, and subsequently, the second organic layer 420 is completely covered by the second inorganic layer 520.Therefore, when forming the thin-film encapsulation layer by alternating the organic and inorganic layers, performance characteristics such as the prevention of moisture penetration and flexibility can be achieved.

[0067] In this embodiment, the first organic layer 410, which is closest to the display unit 200 in the vertical direction, is completely separated or spaced apart from the metal wires 300, so that it is not in direct contact with the metal wires 300. Since the first organic layer 410 is in direct contact with the display unit 200, if the first organic layer 410 comes into contact with an external moisture source, a path for moisture to penetrate to the display unit 200 could be formed. Therefore, in the present embodiment, the first organic layer 410 is completely separated from the metal wires 300, which could potentially represent a moisture source, thus preventing moisture from penetrating to the display unit 200 from the outside.

[0068] Consequently, according to the structure in which the metal wires 300, which may represent the source of moisture, are completely separated from the first organic layer 410 adjacent to the display unit 200, the possibility of moisture penetrating to the display unit 200 via the metal wires 300 and the first organic layer 410 can be fundamentally excluded.

[0069] The device with organic light-emitting display with the above structure can be manufactured using the following methods.

[0070] First, the display unit 200 and the metal wires 300 are formed on the substrate 100. The metal wires 300 can be formed using a structuring process that is carried out independently of the processes for forming the display unit 200. Alternatively, the metal wires 300 can be formed during the formation of the source and drain electrodes 233 and 234 (see Fig. 7) the display unit 200 shall be formed using the same deposition material as the source and drain electrodes 233 and 234.

[0071] Furthermore, the thin-film encapsulation layer is formed on the display unit 200, and, as described above, the first organic layer 410 is formed separately from the metal wires 300, so that it does not overlap the metal wires 300 in a vertical section through the display device. The first inorganic layer 510 is then formed on the first organic layer 410. The second organic layer 420 is also formed. Due to the arrangement of the second organic layer 420 on the display unit 200 and the arrangement of the inorganic layer 510 between them, the organic layer 420 can overlap the metal wires 300 in a vertical section through the display device. Fig. 1A and Fig. The display device shown in 1B partially overlaps. Furthermore, the second inorganic layer 520 is formed as the outermost layer of the thin-film encapsulation layer.

[0072] The first and second organic layers 410 and 420 can comprise polyimide, acrylic, epoxy, silicon or allyl, and the first and second inorganic layers 510 and 520 can comprise AlOx, SiNx, SiOx, SiOxNy, ITO, AZO, ZnO or ZrO.

[0073] The first and second organic layers 410 and 420 of the thin-film encapsulation layer can be formed using a monomer, and the monomer can comprise at least one of the following: acrylic-based monomer, epoxy-based monomer, silicon-based monomer, and allyl-based monomer. A monomer layer is formed by various processes, such as flash evaporation, thermal evaporation, atomization, spraying, screen printing, inkjet printing, and slot die coating, and the monomer layer can be cured using light, such as ultraviolet (UV) radiation or visible radiation. The organic layers 410 and 420 are not limited to the monomer layer. Furthermore, the first organic layer 410 of the thin-film encapsulation layer must be separated from the metal wires 300, as described above.

[0074] In the device with organic light-emitting display manufactured as described above, the first organic layer 410, which is in contact with the display unit 200, and the metal wires 300 on the outer section of the substrate 100 are completely separated from each other, thus fundamentally preventing moisture from penetrating to the display unit 200 via the metal wires 300 and the first organic layer 410. By using the above structure, the reduction in service life caused by moisture ingress can be effectively counteracted.

[0075] Variations of the basic structure above are described below.

[0076] In the previous embodiment, the thin-film encapsulation layer comprising the organic and inorganic layers is formed only on the display unit 200. In the embodiment described in Fig. In the modified example 2 shown, an organic layer 310 and an inorganic layer 320 can be formed on the metal wires 300. This can be a single-layer structure of either an organic or inorganic layer, or it can be a structure consisting of organic and inorganic layers 310 and 320. Fig. A comprehensive two-layer structure may be formed. Furthermore, the organic layer 310 and the inorganic layer 320, which are formed on the metal wires 300, can be formed prior to the formation of the thin-film encapsulation layer. For example, the organic and inorganic layers 310 and 320 can be formed during the formation of devices such as the TFT of the display unit 200. By forming the organic and inorganic layers 310 and 320 on the metal wires 300 in this way, the possibility of moisture penetrating to the display unit 200 via a layer in contact with the metal wires 300 can be further reduced. The organic layer 310 can comprise polyimide or acrylic, and the inorganic layer 320 can comprise SiNx, SiOx, or a combination thereof.

[0077] In the structure of the present embodiment, when the first organic layer 410 of the thin-film encapsulation layer forms on the metal wires 300 covered by the organic and inorganic layers 310 and 320, the first organic layer 410 can spread outwards in a liquid phase along the side surfaces of the metal wires 300, and consequently, external moisture can penetrate to the display unit 200 via the first organic layer 410. Therefore, the first organic layer 410 of the thin-film encapsulation layer must be separated from the metal wires 300.

[0078] The first and second organic layers 410 and 420 of the thin-film encapsulation layer can, for example, comprise a monomer, and the monomer can comprise at least one of the following: acrylic-based monomer, epoxy-based monomer, silicon-based monomer, and allyl-based monomer. A monomer layer is formed by various processes, such as flash evaporation, thermal evaporation, atomization, spraying, screen printing, inkjet printing, and slot die coating, and the monomer layer can be cured by light, such as ultraviolet (UV) radiation or visible radiation. The organic layers 410 and 420 are not limited to the monomer layer. Furthermore, the first organic layer 410 of the thin-film encapsulation layer must be separated from the metal wires 300, as described above.

[0079] The organic and inorganic layers 310 and 320 on the metal wires 300 can be formed using general layer formation processes, such as a coating, exposure and development process.

[0080] Furthermore, in the above embodiment, the inorganic layer 520 is the outermost layer of the thin-film encapsulation layer; however, the organic layer 420 can also be the outermost layer of the thin-film encapsulation layer.

[0081] According to the device with organic light-emitting display of the present embodiment, the first organic layer 410 in contact with the display unit 200 is completely separated from the metal wires 300, which may represent the source of moisture, and the metal wires 300 are covered by the organic and inorganic layers 310 and 320, respectively. As shown in the illustration, in this embodiment, the organic layer 410 is also separated from the organic layer 310 formed above the metal wires 300 to prevent the ingress of moisture. The possibility of moisture penetrating to the display unit 200 via the metal wires 300 and the first organic layer 410 can therefore be fundamentally blocked. This effectively prevents the reduction in the product's service life caused by moisture ingress.

[0082] Another modified example is described below with reference to 3.

[0083] At the in Fig.In the embodiment shown in Figure 3, the first organic layer 410 of the thin-film encapsulation layer is formed vertically above the display unit 200, while the first inorganic layer 510 is in direct contact with the display unit 200 from above and with the first organic layer 410 from below. According to the present embodiment, the second inorganic layer 520, the second organic layer 420, and a third inorganic layer 530 are layered on top of the first inorganic layer 510 in that order. This prevents moisture ingress even if the metal wires 300 and the first organic layer 410 become connected to each other, creating a path for moisture penetration, because the first inorganic layer 510 encloses the display unit 200.

[0084] The first and second organic layers 410 and 420 can comprise polyimide, acrylic, epoxy, silicon and / or allyl, and the first, second and third inorganic layers 510, 520 and 530 can comprise AlOx, SiNx, SiOx, SiOxNy, ITO, AZO, ZnO and / or ZrO.

[0085] According to the device with organic light-emitting display of the present embodiment, the first organic layer 410 closest to the display unit 200 in the vertical and / or horizontal direction is completely separated from the metal wires 300, which may represent the source of moisture, and furthermore, the display unit 200 is completely covered by the first inorganic layer 510. The possibility of moisture penetrating to the display unit 200 via the metal wires 300 and the first organic layer 410 is therefore fundamentally blocked. This effectively prevents the reduction in the product's service life caused by moisture ingress.

Claims

[1] Device with organic light-emitting display, comprising: a display unit (200) formed on a substrate (100), wherein the display unit (200) comprises a plurality of EL devices (24) having a first electrode (241), a second electrode (243) and a light emission layer (242) between the first and the second electrode (241, 243); Metal wires (300) formed on an outer section of the substrate (100), wherein the metal wires (300) are horizontally spaced from the display unit (200) so that they do not contact any elements of the display unit (200); and a thin-film encapsulation layer comprising at least one organic layer (410) and at least one inorganic layer (510) which are alternately layered on the display unit (200) to tightly enclose the display unit (200), wherein at least one organic layer (410) is separated from the metal wires (300) so that it is not in contact with the metal wires (300), wherein the at least one organic layer comprises a first organic layer (410) adjacent to the display unit (200) and a second organic layer (420) located on the first organic layer (410), wherein the at least one inorganic layer (510) is arranged between the two wherein the first organic layer (410) is separated from the metal wires (300) so that it does not overlap the metal wires (300), and the second organic layer (420) is arranged so that it partially overlaps the metal wires (300) without touching the metal wires (300). [2] Device with organic light-emitting display according to claim 1, wherein an outermost layer of the thin-film encapsulation layer is an organic layer (420) or an inorganic layer (520). [3] Device with organic light-emitting display according to claim 1 or 2, wherein the organic layer comprises three or more organic layers, including at least one additional organic layer (310) besides the first organic layer (410) and the second organic layer (420). [4] Device with organic light-emitting display according to one of the preceding claims, wherein a layer of the thin-film encapsulation layer that is in direct contact with the display unit (200) is an inorganic layer (510). [5] Device with organic light-emitting display according to any one of the preceding claims 1 to 4, wherein a layer of the thin-film encapsulation layer that is in direct contact with the display unit is an organic layer (410). [6] Device with organic light-emitting display according to claim 3, wherein the at least one additional organic layer (310) and / or one of the inorganic layers is formed on the metal wires (300). [7] Device with organic light-emitting display according to claim 6, wherein the organic layer of the thin-film encapsulation layer comprises polyimide, acrylic, epoxy, silicon or allyl and the at least one additional organic layer (310) on the metal wires (300) comprises acrylic or polyimide. [8] Device with organic light-emitting display according to claim 6 or 7, wherein the inorganic layer of the thin-film encapsulation layer comprises AlOx, SiNx, SiOx, SiOxNy, indium tin oxide (ITO), aluminum zinc oxide (AZO), ZnO or ZrO and the inorganic layer on the metal wires comprises SiNx or SiOx. [9] Method for manufacturing a device with an organic light-emitting display, the method comprising: Forming a display unit (200) on a substrate (100), wherein the display unit (200) comprises a plurality of EL devices (24) having a first electrode (241), a second electrode (243) and a light emission layer (242) between the first and the second electrode (241, 243); Forming metal wires (300) as a protective circuit on an outer section of the substrate (100), wherein the metal wires (300) are horizontally spaced from the display unit (200) so that they do not contact any elements of the display unit (200); and Forming a thin-film encapsulation layer by alternating layers of at least one organic layer and at least one inorganic layer on the display unit (200) to tightly enclose the display unit (200), wherein at least one organic layer (410) is separated from the metal wires (300) so that it is not in contact with the metal wires (300), wherein the at least one organic layer comprises a first organic layer (410) adjacent to the display unit (200) and a second organic layer (420) located on the first organic layer (410), wherein the at least one inorganic layer (510) is arranged between the two wherein the first organic layer (410) is separated from the metal wires (300) so that it does not overlap the metal wires (300), and the second organic layer (420) is arranged so that it partially overlaps the metal wires (300) without touching the metal wires (300).

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