Electronic component

Abstract

Electronic component with - a connection carrier (1) comprising a cover surface (1a), a first electrical connection point (11) and a second electrical connection point (12), - an organic, active area (2) on the top surface (1a), - a first electrode (31) that electrically connects the active area (2) and the first electrical connection point (11), - an encapsulation layer (4) that protects the active area (2) from moisture and atmospheric gases, wherein - the electronic component can be contacted from the outside via the first electrical connection point (11) and the second electrical connection point (12), - the encapsulation layer (4) is in direct contact with the connector carrier (1) in certain places, - the connecting carrier (1) consists of at least two electrically conductive solid bodies (13) and a single electrically insulating connecting element (14), - the at least two electrically conductive solid bodies (13) are connected to each other by the single electrically insulating connecting element (14), and - the only electrically insulating connecting element (14) is arranged in a lateral direction exclusively between the at least two electrically conductive solid bodies (13) of the connecting carrier (1).

Description

[0001] An electronic component is specified.

[0002] The publication DE 10 2011 076 733 A1 describes an electronic component.

[0003] The publication DE 10 2012 202 924 A1 describes an organic, optoelectronic component.

[0004] The publication DE 10 2011 077 687 A1 describes an organic light-emitting diode.

[0005] The publication DE 10 2010 002 398 A1 describes an organic light-emitting diode display.

[0006] Publication WO 2013 / 051230 A1 describes an organic electroluminescent element.

[0007] The publication JP 2006-032058 A describes a light-emitting component.

[0008] One task to be solved is to specify an electronic component that is particularly versatile.

[0009] According to the invention, an electronic component according to claim 1 is specified. The electronic component comprises a terminal carrier comprising a cover surface, a first electrical connection point and a second electrical connection point, an organic, active area on the cover surface, a first electrode that electrically connects the active area and the first electrical connection point, and an encapsulation layer that protects the active area from moisture and atmospheric gases, wherein the electronic component can be contacted externally via the electrical connection points, the encapsulation layer is in direct contact with the terminal carrier in certain locations, and the terminal carrier consists of at least two electrically conductive solid bodies and a single electrically insulating connecting element.the at least two electrically conductive solid bodies are connected to each other by the single electrically insulating connecting element, and the single electrically insulating connecting element is arranged exclusively between the at least two electrically conductive solid bodies of the connecting carrier.

[0010] According to at least one embodiment of the electronic component, the electronic component comprises a terminal carrier. The terminal carrier includes a top surface, a bottom surface opposite the top surface, and side surfaces that connect the top surface and the bottom surface. The terminal carrier further comprises a first electrical terminal and a second electrical terminal. The terminals of the terminal carrier allow the electronic component to be contacted from outside the electronic component. That is, the electronic component can be contacted externally via the electrical terminals.

[0011] The mounting bracket is, in particular, the mechanically supporting and load-bearing component of the electronic component. That is, the components of the electronic component are arranged, especially on the top surface of the mounting bracket, and are mechanically supported, carried, and held together by the mounting bracket. The mounting bracket can, for example, be designed like a plate, meaning that the lateral extent of the mounting bracket in its main direction of extension is greater than the vertical extent of the mounting bracket perpendicular to its main plane of extension. The mounting bracket can, for example, have a rectangular base.

[0012] The electronic component comprises an organic, active area designed, for example, to generate and / or receive electromagnetic radiation. This electronic component could be, for instance, an optoelectronic component such as an organic light-emitting diode (OLED) and / or an organic photodiode. Furthermore, it could be an electronic microcontroller or another type of organic power component.

[0013] The terminal carrier can serve as a substrate for the electronic component. This means that the components of the electronic component, particularly the organic active area and electrodes for contacting the organic active area, are directly applied to the terminal carrier. For example, the components of the electronic component are produced directly on the terminal carrier's top surface. The terminal carrier then represents the only mechanically supporting component of the electronic component, and the organic active area is not applied to any other substrate.

[0014] The electronic component comprises a first electrode that electrically connects the active area and the first electrical connection point. For example, the first electrode can be directly connected to the first electrical connection point and the active area. The first electrode can be at least partially transparent or reflective. The first electrode can be made of a metal and / or a transparent conductive oxide such as ITO (indium thin oxide - indium tin oxide). The first electrode can be in contact with the organic active area, particularly over a large area. That is, the first electrode can cover a large area of ​​the top or bottom surface of the active area. For example, the first electrode covers at least 50%, and in particular at least 75%, of a top or bottom surface of the active area.Within the manufacturing tolerances, the top and bottom surfaces of the active area can be arranged parallel to the top surface of the terminal carrier. The first electrode can also completely cover the top or bottom surface of the active area. Furthermore, the first electrode can be composed of multiple materials; for example, it can be made of a transparent conductive oxide and a metal. The first electrode can be in direct contact with the terminal carrier at certain points on its top surface.

[0015] The electronic component includes an encapsulation layer that protects the active area from moisture and atmospheric gases. This encapsulation layer can be, for example, a thin-film encapsulation. It can be produced by deposition processes such as chemical vapor deposition (CVD), physical vapor deposition (PVD), sputtering, atomic layer deposition (ALD), or other deposition methods. In particular, the encapsulation layer can include at least one ALD layer produced using an ALD process. That is, at least this encapsulation layer is formed using an ALD process.

[0016] Using an ALD process, very thin films with a polycrystalline or amorphous structure can be produced. Since the growth rate of a film produced by ALD is proportional to the number of reaction cycles used to create it, precise control of the film thickness is possible. The ALD process allows for the production of particularly uniform films, meaning films of exceptionally consistent thickness. Furthermore, the monolayer growth inherent in the ALD process results in very dense films with few crystal defects.

[0017] In other words, at least one encapsulation layer has been deposited using an ALD process such as flash ALD, photoinduced ALD, or another ALD method.

[0018] An encapsulation layer produced using an ALD process can be clearly distinguished from layers produced using alternative methods such as conventional CVD (Chemical Vapor Deposition) via electron microscopy and other semiconductor analysis methods. The characteristic that the encapsulation layer is an ALD layer is therefore a tangible feature that can be verified on the finished electronic semiconductor chip.

[0019] The encapsulation layer, which is an ALD layer, is formed with an electrically insulating material and has, for example, a thickness between 0.05 nm and at most 500 nm, in particular between at least 30 nm and at most 50 nm, for example, a thickness of 40 nm. The encapsulation layer can comprise a plurality of sublayers arranged on top of each other. The encapsulation layer contains or consists of, for example, one of the following materials: Al₂O₃, SiO₂, SiN. It is also possible, in particular, for the encapsulation layer, which is an ALD layer, to contain a combination of these materials.

[0020] The encapsulation layer prevents the passage of moisture and / or atmospheric gases from the environment of the electronic component through the encapsulation layer to the organic, active area. The encapsulation layer is arranged around the active area. For example, the active area is then completely sealed off from the environment by the encapsulation layer and another component of the electronic component, such as the terminal carrier. The encapsulation layer can also cover other components of the electronic component, such as the first electrode or additional electrodes. In particular, the encapsulation layer can be in direct contact with components of the electronic component, such as the active area or electrodes, at certain points.

[0021] The encapsulation layer is at least partially permeable to the electromagnetic radiation emitted or detected in the active area. The encapsulation layer can, for example, be clear or transparent.

[0022] The encapsulation layer is in direct contact with the connector carrier in certain areas. This means that the encapsulation layer directly covers the connector carrier in some areas, allowing all the other components of the electronic component to be located between the connector carrier and the encapsulation layer. In this way, the encapsulation layer, together with the connector carrier, can form an enclosure for the remaining components of the electronic component.

[0023] According to at least one embodiment of the electronic component, the component comprises a terminal carrier with a cover surface and a first electrical connection point, as well as a second electrical connection point. The electronic component further comprises an organic, active area, which is intended, for example, for generating and / or receiving electromagnetic radiation and which is arranged on the cover surface of the terminal carrier. The electronic component further comprises a first electrode that electrically connects the active area and the first electrical connection point, as well as an encapsulation layer that protects the active area from moisture and atmospheric gases. The electronic component can be contacted externally via the electrical connection points of the terminal carrier, and the encapsulation layer is in direct contact with the terminal carrier in certain areas.

[0024] In the electronic component described here, the terminal carrier, which provides the electrical connections for external contacting of the electronic component, serves as the substrate for the organic active area. The components of the electronic component can be directly applied to the terminal carrier, so that the terminal carrier then acts as the substrate for the electrodes and the organic active area. This means that the electronic component can be processed directly on the carrier, which also provides the electrical contact for operating the components of the electronic component.

[0025] The electronic component has an encapsulation layer that protects the active area from moisture and atmospheric gases, while the electrical connections of the electronic component remain free of this encapsulation layer during manufacturing. This means that the encapsulation layer does not need to be opened to connect the electronic component; the electrical connections remain uncovered.

[0026] The electrical connection points can be designed in different ways on the connection carrier, so that a particularly versatile use of the electronic component is possible.

[0027] The electronic components described here, which in particular include an organic, active area, require an electrical and mechanical connection to the system in which they operate. High component efficiency and stable electro-optical properties necessitate an electrical connection with low and permanently stable electrical resistance. The mechanical connection should withstand stresses such as tensile, compressive, and shear forces, as well as vibrations, without the connection to the system or within the component becoming loose.

[0028] It has been shown that, in particular, the use of a connection carrier as a mechanically supporting and load-bearing component of the electronic component enables easy handling and especially simple and cost-effective system integration of the electronic component. The connection points can be designed, for example, as plug-in contacts or SMT contacts. The electrical and mechanical connection functions are thus implemented particularly cost-effectively.

[0029] Furthermore, in the electronic component described here, the proportion of inactive area can be kept very small. For this purpose, the organic, active area can have a cross-sectional area that corresponds to at least 75%, preferably at least 85%, of the surface area of ​​the connection carrier. This means that almost the entire surface area of ​​the connection carrier can be covered by the active area, so that the proportion of inactive area in the component is very small.

[0030] Furthermore, in the electronic component described here, the connection points are integrated into the terminal carrier and are not subsequently added using techniques such as bonding, soldering, welding, or gluing. This reduces the resistance between the connection point and the electrodes for the organic, active area.

[0031] Since the connection points remain free of the encapsulation layer at all times during the manufacturing of the electronic component, the encapsulation does not need to be removed or penetrated before a measurement procedure, for determining the electronic properties of the component, and / or before connecting the component. Because removing or penetrating the encapsulation layer is associated with higher process costs and yield losses, because the organic layers and / or the encapsulation layer can be damaged, and because electro-optical characterization of the component during the manufacturing process is delayed by prior removal or penetration of the encapsulation layer, the electronic component described here is characterized by particularly high manufacturing efficiency.

[0032] The terminal carrier is formed with at least two electrically conductive solid bodies connected to each other by at least one electrically insulating connecting element. The terminal carrier thus comprises at least two electrically conductive elements, the solid bodies. The electrically conductive solid bodies are arranged laterally spaced apart from each other and mechanically connected to each other by the at least one electrically insulating connecting element. For example, the solid bodies can be embedded in the electrically insulating connecting element at their side surfaces. The electrically conductive solid bodies are then free of the electrically insulating connecting element on their top surface facing the active area and on their bottom surface facing away from the active area. That is to say, the solid bodies can, in particular, extend completely through the terminal carrier and are freely accessible on the top and bottom surfaces of the terminal carrier.

[0033] The electrically conductive solids are formed with or consist of a metal, for example. At least one electrically insulating connecting element can be formed with glass, a ceramic material, or a plastic material.

[0034] The electrically conductive solid bodies are preferably in direct contact with the electrical connection points of the connection carrier, or each electrical connection point of the connection carrier is formed by a region of an electrically conductive solid body of the connection carrier. Furthermore, the electrically conductive solid bodies are in electrically conductive contact, particularly direct contact, with the electrodes for contacting the active area, wherein at least one of the electrodes may also be formed by one of the solid bodies.

[0035] According to at least one embodiment of the electronic component, the electrical connection points are formed on a bottom surface facing away from the top surface and / or on a side surface of the connector carrier that extends transversely to the top surface. For example, the electrical connection points can be formed by the bottom surfaces of the electrically conductive solids facing away from the active area. Furthermore, it is possible that the electrically conductive solids project outwards from at least one side surface of the connector carrier and are configured there as pins or sockets for plug-in contact. However, the pins or sockets can also be recessed into at least one of the solids, so that no element protrudes from the side surface of the component.

[0036] This means that the electrically conductive solid bodies of the connector carrier then form contact bodies laterally, which may be coded according to the electrical polarity and / or contain a locking function and / or may be bent downwards towards the bottom surface of the connector carrier and / or upwards towards the top surface of the connector carrier.

[0037] Depending on the material used to form the electrically insulating connecting element, the connector can be flexible or rigid. The connector is specifically not intended for radiation emission or entry and can therefore be reflective. For this purpose, the base material of the electrically insulating connecting element can be filled with radiation-reflecting or radiation-scattering particles, such as titanium dioxide. The electrically insulating connecting element can then appear white, for example. The electrically conductive solid bodies can be made of a reflective material, particularly a reflective metal.Furthermore, it is possible that the terminal carrier has a reflective coating on its surface facing the active area, or that a reflective layer is formed on the terminal carrier between the active area and the terminal carrier. The reflective layer can also function as an electrode for electrically connecting the active area.

[0038] According to at least one embodiment of the electronic component, the electrical connection points can be made electrically contactable via a plug connector. In particular, it is possible that the electrical connection points are designed as plug connectors. Different polarities of the electrical connection points can be encoded by a different design of the plug connector, so that connecting the electronic component with the wrong polarity via the plug connector is not possible. For example, the plug connectors can be formed by appropriately designed areas of the electrically conductive solid body of the connector carrier.

[0039] According to at least one embodiment of the electronic component, the active area borders directly on the terminal carrier in certain locations and is directly electrically connected to it. In this embodiment, the terminal carrier acts as an electrode for the active area. This means that in certain locations, no additional material is arranged between the terminal carrier and the active area; instead, the active area is directly energized by the terminal carrier. The active area then borders directly on the top surface of the terminal carrier in certain locations.

[0040] For example, one of the electrically conductive solid bodies can be in direct contact with the active area. This electrically conductive solid body can have a surface facing the active area, the area of ​​which corresponds to at least 50%, and in particular at least 75%, of the cross-sectional area of ​​the active area. This means that, in this embodiment, the active area is energized over a large area via the solid body. This embodiment is particularly advantageous with regard to efficient heat dissipation from the active area during operation of the electronic component. A large portion of the heat generated during operation can be efficiently dissipated via the electrically conductive solid body.

[0041] According to at least one embodiment of the electronic component, an electrically insulating buffer layer is arranged in certain areas between the active area and the top surface of the terminal carrier. This insulating buffer layer can cover areas of the electrically conductive solids and the electrically insulating connecting element, and may also be in direct contact with them. The buffer layer can also be in direct contact with the terminal carrier at certain points on its top surface. The buffer layer can exhibit encapsulating properties and protect the active layer from moisture and atmospheric gases. Furthermore, the buffer layer can also have planarizing functions, meaning it can compensate for any unevenness on the top surface of the terminal carrier.In an embodiment in which the active area borders directly on the connecting carrier in certain places, the buffer layer in this area may have a recess or may not be present, so that, for example, one of the electrically conductive solid bodies can represent an electrode for contacting the active area.

[0042] According to at least one embodiment of the electronic component, the buffer layer is an ALD layer or the buffer layer comprises an ALD layer. If the buffer layer is an ALD layer, it is particularly well suited to protecting the active layer from moisture and atmospheric gases.

[0043] According to at least one embodiment of the electronic component, the encapsulation layer is an ALD layer or the encapsulation layer comprises an ALD layer. In particular, it is possible that the encapsulation layer and the buffer layer have a similar structure. That is, the encapsulation layer and the buffer layer can, for example, comprise the same sequence of different layers. In particular, the buffer layer and the encapsulation layer can comprise several layers, and especially several ALD layers, stacked on top of each other.

[0044] According to at least one embodiment of the electronic component, the component comprises a second electrode that electrically connects the active area and the second electrical connection point, wherein the second electrode is arranged between the connection carrier and the active area, and the first electrode is arranged on the side of the active area facing away from the connection carrier. The first electrode is at least partially transparent to radiation, so that electromagnetic radiation to be generated or received during operation can pass through the first electrode.

[0045] The second electrode can, for example, be positioned between the terminal carrier and the active area, covering the active area as completely as possible or completely on its base surface facing the terminal carrier. The second electrode can be designed to reflect radiation, so that it is configured to reflect electromagnetic radiation to be generated or detected in the active area.

[0046] According to at least one embodiment of the electronic component, the component includes at least one via through the buffer layer, in which at least one of the electrodes penetrates the buffer layer. That is, the buffer layer is open at at least one location, and the material of at least one electrode penetrates the buffer layer at the opening. For example, it is possible in this way for the buffer layer to completely cover the top surface of the terminal carrier facing the active area and to have openings to the terminal carrier only in the area of ​​the vias. The vias through the buffer layer can be produced, for example, by laser ablation.

[0047] According to at least one embodiment of the electronic component, the active area, apart from the vias, is completely enclosed by ALD layers in the buffer layer. In this embodiment, the electronic component comprises a buffer layer and an encapsulation layer, each containing at least one ALD layer. The buffer layer and the encapsulation layer abut each other, for example, on the sides of the component on the terminal carrier. The buffer layer completely covers the terminal carrier, except for the vias to the electrodes, and the encapsulation layer completely covers the surface of the remaining components of the component facing away from the terminal carrier. In this way, the active area, which contains an organic material, is completely surrounded by ALD layers.Such a component is characterized by a particularly long service life, as the active area is especially well protected against moisture and atmospheric gases.

[0048] According to at least one embodiment of the electronic component, the electrically conductive solid bodies of the connector carrier are connected to the at least one electrically insulating connecting element without any fasteners. The solid bodies can be connected to the at least one electrically insulating connecting element, for example, by injection molding, so that no further connecting material is arranged between the solid bodies and the at least one connecting element. Alternatively, the at least one electrically insulating connecting material can be bonded or sintered.

[0049] According to at least one embodiment of the electronic component, the connector carrier is designed as a film. For example, the connector carrier can be a combination of metal and plastic films. In this way, the connector carrier can be made particularly thin and flexible.

[0050] According to at least one embodiment of the electronic component, the component exhibits singulation marks on its side surfaces. For example, a large number of electronic components can be processed simultaneously on a connector carrier assembly. After encapsulation is achieved by applying the encapsulation layer, singulation into individual electronic components can occur through the encapsulation layer and the connector carrier. In this case, at least the connector carrier exhibits traces of a singulation process, such as laser cutting, on the component's side surfaces. Furthermore, the cutting process can form connection points on the connector carrier's side surfaces, configured as sockets or plugs, which can be electrically connected via a plug connector.

[0051] In particular, the electrically conductive solids partially form the outer surface of the electronic component. This means that the electronic component is laterally bounded by the electrically conductive solids in the area of ​​the connector carrier.

[0052] The electronic component described here will be explained in more detail below using exemplary embodiments and the corresponding figures. Based on the schematic sectional views of the Fig. 1 and Fig. Section 2 provides a more detailed explanation of exemplary embodiments of an electronic component described here. Based on the schematic sectional views and top views of the connection carriers of the electronic components described here, according to the Fig. 3A, Fig. 3B, Fig. 4 and Fig. Section 5 provides a more detailed explanation of further examples of the electronic components described here.

[0053] Identical, similar, or similarly effective elements in the figures are marked with the same reference symbols. The figures and the relative sizes of the elements depicted within them are not to be considered to scale. Rather, individual elements may be exaggerated for clarity and / or to improve representation.

[0054] The schematic sectional view of the Fig. Figure 1 shows an embodiment of an electronic component described herein. The electronic component comprises a connector 1. The connector 1 comprises a top surface 1a, a bottom surface 1b, and side surfaces 1c connecting the top surface and the bottom surface.

[0055] In the present embodiment, the connection carrier comprises two electrically conductive elements, which are designed as electrically conductive solid bodies 13. The electrically conductive solid bodies 13 are made, for example, of a metal. The first connection point 11 and the second connection point 12 are arranged on the undersides of the electrically conductive solid bodies 13. The electronic component can be contacted from the outside via these two connection points. In the embodiment of the Fig. 1. For example, surface mounting (SMT) would be possible using a surface mounting technique.

[0056] The two electrically conductive solid bodies 13 are connected to each other by an electrically insulating connecting element 14, which is formed, for example, with a plastic such as an epoxy resin or a silicone, which is connected to the electrically conductive solid bodies 13 by injection molding without the use of a connecting agent.

[0057] The electronic component further comprises an active region 2, which includes an organic material. The component can, for example, be used for generating or receiving radiation, with the radiation being generated or received in the active region 2. The component is then, for example, an organic light-emitting diode (OLED) or an organic photodiode (OPD).

[0058] The electronic component further comprises a first electrode 31. The first electrode 31 is electrically connected to one of the electrically conductive solid bodies 13 and to the first connection point 11, and is, for example, in direct contact with an electrically conductive solid body 13. A buffer layer 5, which is electrically insulating, is arranged between the first electrode 31 and the connection carrier 1, at least in the area of ​​the electrically insulating connecting element 14.

[0059] The buffer layer 5 can be produced by printing and / or a deposition technique. In particular, the buffer layer 5 can comprise at least one ALD layer. The buffer layer 5 completely covers the electrically insulating connecting element 14 and also covers the transition between the electrically insulating connecting element 14 and the electrically conductive solids 13. In this way, the buffer layer 5, especially if it contains at least one ALD layer, can seal any potential leaks between the electrically conductive solids 13 and the electrically insulating connecting element 14, since the connection area between these two elements is completely covered.

[0060] The buffer layer 5 has at least one via 51 through which the first electrode extends. The first electrode 31 extends from the via 51 across the buffer layer 5 and the active area 2, completely covering the latter, for example, on its surface facing away from the terminal carrier 1. The first electrode 31 can be at least partially transparent to radiation.

[0061] The buffer layer 5 is in the exemplary embodiment of the Fig. 1 optional. For example, it is also possible that buffer layer 5 is not present and that the active area 2 extends to where in the Fig. 1 the buffer layer 5 is shown.

[0062] In the exemplary embodiment of the Fig. In this embodiment, the active area 2, with its base surface facing the connection carrier 1, directly abuts a solid body 13, which thus forms the second electrode for the electrical connection of the active area 2. For example, the solid body 13 can be designed to reflect radiation. In this embodiment, a particularly simple large-area contact is possible with good heat dissipation of the active area 2.

[0063] The electronic component further comprises an encapsulation layer 4, which may contain at least one ALD layer. The encapsulation layer 4 borders the terminal carrier 1 in certain areas. The active area 2 is protected from moisture and atmospheric gases by the encapsulation layer 4.

[0064] In the exemplary embodiment of the Fig. 2 covers the buffer layer 5, unlike in the embodiment of the Fig. The terminal carrier 1 is almost completely covered on its top surface and is only interrupted by the vias 51 for contacting the electrodes 31, 32. The encapsulation layer 4 and the buffer layer 5 abut directly on the top surface 1a of the terminal carrier in the edge region of the component, so that, apart from the vias 51, the active area 2 is completely enclosed by the buffer layer 5 and the encapsulation layer 4. In this embodiment, it is particularly possible that the buffer layer 5 and the encapsulation layer 4 contain at least one ALD layer or consist of at least one ALD layer.

[0065] In the exemplary embodiment of the Fig. Furthermore, a second electrode 32 is present, which is arranged on the underside of the active area 2 facing away from the terminal carrier 1. The second electrode 32 is, for example, at least partially radiation-reflecting. An electrically insulating planar layer 6 can be arranged on the buffer layer 5 between the second electrode 32 and the terminal carrier 1. This planar layer 6 completely covers the buffer layer 5 and compensates for unevenness in the terminal carrier 1 and / or the buffer layer 2. The planar layer 6 is optional and can, if necessary, also be part of the buffer layer 5.

[0066] In connection with the Fig. 3A and Fig. Figure 3B shows an exemplary embodiment of a connector carrier for an electronic component described herein, illustrated by a schematic sectional view and a schematic top view. In this embodiment, the solid bodies 13 are connected to one another by an electrically insulating connecting element 14, which interlocks with the solid bodies 13 by means of a structuring of the solid bodies 13 on their facing side surfaces. The electrically insulating connecting element 14 can, for example, be connected to the solid bodies 13, i.e., the electrically conductive elements of the connector carrier, by an injection molding process.

[0067] In connection with the Fig. Figure 4 describes an embodiment of the connection carrier 1 in which a reverse polarity-protected contact arrangement of the connection points 11, 12 is ensured. The electrically insulating connecting element 14 is arranged in a cross shape in the top view, and the first and second connection points 11, 12 are arranged on the underside of the connection carrier 1 in diagonal quadrants of the cross formed by the connecting element.

[0068] In connection with the Fig.Figure 5 shows a schematic top view of an embodiment of an electronic component described herein, in which first and second electrical connection points 11, 12 are formed on the side surfaces of the solid body 13 in the form of contact elements. The contact elements can be, for example, plugs or sockets, which are designed differently for the different polarities of the connection points, thus ensuring reverse polarity protection.

Claims

[1] Electronic component with - a connection carrier (1) comprising a cover surface (1a), a first electrical connection point (11) and a second electrical connection point (12), - an organic, active area (2) on the top surface (1a), - a first electrode (31) that electrically connects the active area (2) and the first electrical connection point (11), - an encapsulation layer (4) that protects the active area (2) from moisture and atmospheric gases, wherein - the electronic component can be contacted externally via the first electrical connection point (11) and the second electrical connection point (12), - the encapsulation layer (4) is in direct contact with the connector carrier (1) in certain places, - the connecting carrier (1) consists of at least two electrically conductive solid bodies (13) and a single electrically insulating connecting element (14), - the at least two electrically conductive solid bodies (13) are connected to each other by the single electrically insulating connecting element (14), and - the only electrically insulating connecting element (14) is arranged in a lateral direction exclusively between the at least two electrically conductive solid bodies (13) of the connecting carrier (1). [2] Electronic component according to the previous claim, wherein the first electrical connection point (11) and the second electrical connection point (12) are formed on a bottom surface (1b) facing away from the top surface (1a) and / or on a side surface (1c) of the connection carrier (1) extending transversely to the top surface (1a). [3] Electronic component according to one of the preceding claims, wherein the first electrical connection point (11) and the second electrical connection point (12) can be electrically contacted via a plug connection. [4] Electronic component according to one of the preceding claims, wherein the active area (2) is locally directly adjacent to the connector carrier (1) and is directly electrically connected to the connector carrier (1). [5] Electronic component according to one of the preceding claims comprising an electrically insulating buffer layer (5) which is arranged locally between the active area (2) and the cover surface (1a) of the connector carrier (1). [6] Electronic component according to the previous claim, wherein the buffer layer (5) protects the active area from moisture and atmospheric gases. [7] Electronic component according to one of the two preceding claims, wherein the buffer layer (5) is an ALD layer or comprises an ALD layer. [8] Electronic component according to any of the preceding claims, wherein the encapsulation layer (4) is an ALD layer or comprises an ALD layer. [9] Electronic component according to one of the preceding claims with a second electrode (32) which electrically connects the active area (2) and the second electrical connection point (12) to each other, wherein the second electrode (32) is arranged between the connection carrier (1) and the active area (2) and the first electrode (31) is arranged on the side of the active area (2) facing away from the connection carrier (1). [10] Electronic component according to claim 5 with at least one via (51) through the buffer layer in which at least one of the electrodes (31, 32) penetrates the buffer layer. [11] Electronic component according to claim 10, wherein the active area (2) is completely enclosed by ALD layers apart from the vias (51) by the buffer layer (5). [12] Electronic component according to one of the preceding claims, wherein the active area (2) is provided for generating and / or receiving electromagnetic radiation.

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