Substrate removal from a support

Abstract

Procedure, comprehensive: Providing a fragmented substrate, Applying a release agent to at least one section of the divided substrate, but not to the entire substrate; Transferring the divided substrate onto a carrier; and Removing at least one section of the divided substrate from the support.

Description

TECHNICAL AREA

[0001] The present application relates to methods and devices relating to the removal of a section of a substrate from a support. BACKGROUND

[0002] In the semiconductor industry, substrates, such as semiconductor wafers, are mounted on a carrier for various processing steps. For example, the substrate can be mounted on a grinding tape for grinding or other processes that thin it. The substrate can then be transferred from the grinding tape to a dicing tape. The substrate typically adheres to these tapes due to an adhesive applied to at least one side of the tape.

[0003] In some situations, it may be desirable to remove a section of the substrate from the respective belt without affecting the adhesion of the remaining substrate. For example, if, as in the situation mentioned above, the substrate is mounted on a dividing belt and has been cut into several pieces, it may be necessary to remove some sections, such as a peripheral section of the substrate, which can prove difficult under certain circumstances.

[0004] US patent 2009 / 0098684 A1 discloses a method for manufacturing a thin semiconductor chip, in which an adhesive layer is applied to an outer region of an active surface of a wafer containing components, and a rigid body is attached to the active surface through the adhesive layer. The wafer is then thinned. Finally, the rigid body is removed.

[0005] WO 2012 / 087780 A2 discloses various soluble adhesives. A wafer can be applied to a support strip which has an adhesive layer.

[0006] US patent 2013 / 0084658A1 discloses a method in which a cut wafer with an adhesive layer is mounted on a substrate. The adhesive layer is then weakened, for example by radiation, to allow the removal of individual dies.

[0007] It is therefore an objective of the present application to provide possibilities to facilitate the removal of a section of a substrate from a support. BRIEF SUMMARY

[0008] Methods according to claim 1 or 10 and a device according to claim 15 are provided. The dependent claims define further embodiments. BRIEF DESCRIPTION OF THE DRAWINGS Fig. Figure 1 shows a block diagram of a device according to one embodiment; Fig. 2 shows a flowchart illustrating a method according to one embodiment; and the Fig. Figures 3A to 3C show diagrams illustrating various elements and processing stages of different embodiments. DETAILED DESCRIPTION OF ILLUSTRATORY EXECUTION FORMS

[0009] Various embodiments are discussed in detail below with reference to the accompanying drawings. It should be noted that these embodiments serve only as examples and are not to be understood as limiting the scope of this application. For example, features from different embodiments can be combined to form new embodiments. On the other hand, it should be noted that while embodiments are comprehensively described as comprising a multitude of features or elements, this is not to be understood as indicating that all of these features or elements are necessary for the implementation of embodiments. Conversely, other embodiments may include fewer features, alternative features, and / or additional features compared to the embodiments described.

[0010] Several embodiments involve removing one or more sections of a substrate from a support. To facilitate such removal, in some embodiments a release agent is applied to one or more sections of the substrate that are to be removed from the support later, for example, before the substrate is mounted to the support.

[0011] While embodiments described below use semiconductor wafers such as silicon wafers as examples of substrates, the techniques, devices, and methods disclosed herein can also be applied to other substrates, for example, glass substrates. While ribbons are used as examples of supports, other types of supports can also be used, for example, glass supports, metal supports, or plastic supports that can be coated with an adhesive on at least one side.

[0012] Now, referring to the characters, in Fig. Figure 1 shows a device that can be used for processing substrates according to one embodiment. The device of Fig. Figure 1 is shown comprising a plurality of different devices 10, 11, 12, and 13. While these devices are shown as separate blocks, two or more of the devices shown can also be integrated within a single device, such that the single device performs the corresponding functions. Alternatively, different devices can be arranged remotely, for example, even in different rooms or different buildings, with substrates being transported between the devices. Furthermore, other embodiments may include only some of the devices shown. Fig. The devices shown in Figure 1 may include additional devices and / or alternative devices. It should also be noted that additional devices for performing other operations during substrate processing between the devices shown in Figure 1 may be required. Fig. Devices 10-13 shown in 1 can be provided.

[0013] In the device of Fig. 1. One or more grinding devices 10 (hereinafter simply referred to as grinding device 10) are provided. A substrate can be thinned in the grinding device 10. It should be noted that the grinding device 10 is merely an example of a device that can be used for substrate processing prior to the application of a release agent (see below), and in other embodiments other types of processing, for example etching, may occur additionally or alternatively. Furthermore, as described in Fig. 1. Substrates are fed to the grinding device 10, indicated by an arrow. These substrates can be unprocessed substrates or substrates that have undergone prior processing. In some embodiments, the substrates can be semiconductor wafers, for example, silicon wafers. In some embodiments, semiconductor devices can be formed on the substrate.

[0014] In other embodiments, the grinding device 10 can be omitted, and processed or unprocessed substrates can be fed directly to one or more release agent application devices 11 (hereinafter simply referred to as release agent application devices 11). The release agent application device 11 applies a release agent, i.e., a substance that facilitates layer separation, to one or more sections of the substrate. For example, a release agent based on fluorosilicone or a fluoropolymer can be used. In some embodiments, the release agent can be a radiation-sensitive material, for example, one that is sensitive to ultraviolet radiation.

[0015] Conventional techniques can be used to apply the release agent to desired sections of the substrate. For example, the release agent can be applied to the desired sections using a nozzle. Alternatively, a photoresist can be applied to the substrate and then removed from the substrate at the desired sections. Subsequently, the release agent can be applied to the entire substrate, for example, by centrifugation. As the remaining photoresist dissolves, the release agent is removed from all but the desired sections. Other techniques can also be employed.

[0016] After the release agent has been applied by the release agent application device 11, one or more transfer devices 12 (hereinafter referred to simply as transfer device 12) transfer the substrate to a carrier, for example, an adhesive tape. After the transfer, one or more removal devices (hereinafter referred to as a removal device 13) serve to remove one or more sections of the substrate, onto which the release agent was previously applied, from the carrier. For this purpose, the removal device 13 may, for example, include a source of ultraviolet light if the release agent is sensitive to ultraviolet light.

[0017] After the sections of the substrate have been removed by the removal device 13, as indicated by an arrow, the remaining substrates can be further processed or treated, for example, shipped to a customer.

[0018] In Fig. 2 A flowchart is shown that illustrates a procedure according to one embodiment. While certain actions or events are referred to Fig. As described in section 2, it should be noted that additional measures or events for the treatment of a substrate may occur before, after, and / or between the events described in section 2. Fig. The measures or events described in section 2 may take place. The procedure of Fig. 2 can be used with the device of Fig. It can be implemented using 1, but can also be implemented using other devices.

[0019] In step 20, a release agent is applied to one or more sections of a substrate, for example, sections of a semiconductor wafer. The semiconductor wafer could, for example, be a cut chip on a sanding belt. The release agent could, for example, comprise fluorosilicone or a fluoropolymer, as described above, but is not limited to these.

[0020] In embodiment 21, the substrate is transferred to a carrier, for example, an adhesive tape or another type of carrier coated with an adhesive. In these embodiments, the substrate is transferred to the carrier in such a way that the release agent is interposed between the substrate and the carrier.

[0021] In step 22, one or more substrate sections, onto which the release agent was applied in step 20, are removed from the support. Removing the one or more substrate sections from the support may involve activating the release agent, for example, using ultraviolet radiation. In some embodiments, a peripheral section, for example, an annular section, of the substrate may be removed from the support.

[0022] To further illustrate the embodiments of the Fig. 1 and Fig. 2 show the Fig. 3A to 3C is an implementation example at various stages of processing. The implementation example of Fig. Sections 3A to 3C serve only illustrative purposes and are not to be understood as restrictive, but merely serve to provide a more thorough understanding of some of the points mentioned above with reference to the Fig. 1 and Fig. 2 described characteristics, measures or events using a non-restrictive example.

[0023] In Fig. 3A A substrate 31, in this case a cut semiconductor wafer, i.e., a semiconductor wafer cut into a multitude of separate sections such as plates or chips, is provided on a conveyor belt 32. It should be noted that the Fig. Sectional views 3A to 3C show that semiconductor substrates usually have a generally circular shape with a flattened side. However, other substrate shapes can be used. Substrate 31 has a peripheral ring-shaped section 33. For example, substrate 31 can be in the Fig. The stage shown in 3A has just been ground and / or etched to be thinned. The annular peripheral section 33 is an example of a section of the substrate that will later be removed from a support. Therefore, as shown in Fig. Figure 3A shows a release agent 34 being applied to the underside (side facing away from the abrasive belt 32) of the annular peripheral section 33 using an applicator 30, for example, an applicator in which the release agent 34 is applied to the annular peripheral section 33 using a nozzle. Other techniques for applying the release agent 34 can also be used, as explained above.

[0024] In Fig. In 3B, the substrate 31, together with its annular peripheral section 33, was transferred from the abrasive belt 32 to a carrier 35, for example, a dividing belt, provided between handling sections 36. The substrate 31 is transferred to the dividing belt 35 such that the release agent 34 is interposed between the annular peripheral sections 33 and the dividing belt 35. The release agent 34 can, for example, comprise a fluoropolymer or a fluorosilicone or any other suitable release agent. Furthermore, in Fig. Figure 3B schematically shows a UV light source 37, which can then activate the release agent 34 to facilitate the removal of the annular peripheral section 33 from the dividing belt 35. This removal is then Fig. 3C shown.

[0025] In Fig. In step 3C, the substrate 31 is provided together with the dividing belt 35 on blocks 39 and 310. Block 39 is extended in a ring-shaped manner around block 310.

[0026] Block 310 is separated from block 39 by a cutting line 315. As indicated by arrows 312, 313, and 314, after removal of the annular peripheral section 33, facilitated by the separating agent 34, the substrate 31, which may, for example, comprise semiconductor devices to be shipped to a customer, remains at positions 38 on block 310, while the remaining section (not belonging to the finished product) remains on block 39. The use of the separating agent facilitates the removal of the annular peripheral section 33 in some embodiments compared to conventional solutions that do not use a separating agent.

[0027] While the separating agent 34 in the example of the Fig.In other embodiments, a release agent may be additionally or alternatively applied to another or more other substrate sections in order to facilitate the removal of this or these at a stage of processing.

Claims

[1] Procedure, encompassing: Providing a fragmented substrate, Applying a release agent to at least one section of the divided substrate, but not to the entire substrate; Transferring the divided substrate onto a carrier; and Removing at least one section of the divided substrate from the support. [2] Method according to claim 1, wherein transferring the substrate to the support comprises transferring the substrate to the support in such a way that the release agent is inserted between the at least one section of the substrate and the support. [3] Method according to claim 1 or 2, wherein the separating agent comprises a fluoropolymer. [4] Method according to any one of claims 1-3, wherein the separating agent comprises a fluorosilicone. [5] Method according to any one of claims 1-4, wherein the substrate comprises a semiconductor wafer. [6] Method according to any one of claims 1-5, wherein the carrier has a band. [7] Method according to claim 6, wherein the belt comprises a dividing belt. [8] Method according to any one of claims 1-7, wherein the at least one section of the substrate comprises a peripheral section of the substrate. [9] Method according to any one of claims 1-8, wherein removing the at least one substrate section comprises irradiating the substrate with ultraviolet light. [10] Procedures, including: Providing a divided substrate on a first support; Applying a release agent to a peripheral section of the substrate on a side facing away from the first support, but not to the entire substrate; Transferring the dissected substrate from the first support to a second support in such a way that the separating agent is interposed between the peripheral section of the dissected substrate and the second support; and Removal of the peripheral section of the divided substrate from the second support. [11] Method according to claim 10, wherein the substrate comprises a divided substrate. [12] Method according to claim 10 or 11, wherein the first carrier comprises a sanding belt. [13] Method according to one of claims 10-12, wherein the second carrier has a dividing belt. [14] Method according to any one of claims 10-13, wherein the release agent comprises at least a fluoropolymer and / or a fluorosilicone. [15] Device comprising: a release agent application device, designed to apply a release agent to at least one peripheral section of a divided substrate, but not to the entire substrate; and a removal device designed to remove at least one peripheral section of the substrate from a support. [16] Device according to claim 15, further comprising a transfer device, configured for transferring the substrate onto the carrier. [17] Device according to claim 16, wherein the transfer device is configured to transfer the substrate onto the carrier, wherein the separating agent is inserted between the substrate and the carrier. [18] Device according to one of claims 15-17, wherein the release agent application device comprises an applicator and wherein the applicator has a nozzle. [19] Device according to one of claims 15-18, wherein the distance device comprises a source of ultraviolet light. [20] Device according to one of claims 15-19, further comprising a grinding device configured for grinding the substrate prior to feeding the substrate to the release agent application device.

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