MEMS device

Abstract

MEMS device (10), comprising: a solid electrode (12) having a main area (12m); and a movable electrode (14) which is arranged in an insulated manner and spaced apart from the fixed electrode (12) by a distance; wherein the movable electrode (14), which has a base surface substantially parallel to the main surface (12m) of the fixed electrode (12) and an end face (14f) laterally adjacent to one or more spacers (18), is suspended in relation to the fixed electrode (12) by means of one or more spacers (18) comprising an insulating material, wherein the movable electrode (14) is attached to the one or more spacers (18) via the end face (14f) of the movable electrode (14), wherein one or more spacers (18) are attached to the two electrodes (12, 14), and wherein the insulating material insulates the fixed and the movable electrodes (12, 14) from each other.

Description

AREA

[0001] Embodiments of the present disclosure relate to a MEMS device, a MEMS device used as an accelerometer, humidity sensor, bolometer or pressure sensor, and a method for manufacturing a MEMS device. BACKGROUND

[0002] A MEMS device, also known as a microelectromechanical system, is frequently used as a sensor, for example, as an accelerometer, pressure sensor, or sound wave sensor (microphone). All these MEMS devices have a moving element, such as a diaphragm or a cantilever arm, and the movement of this element, caused, for example, by a change in pressure or acceleration, can be detected capacitively. A common MEMS device consists of a movable electrode as the moving element and a fixed electrode opposite the moving electrode, so that a change in the distance between the two electrodes (due to the movement of the moving element) can lead to a change in capacitive measurement.

[0003] MEMS components are disclosed, for example, in DE 699 34 620 T2, which deals with a semiconductor accelerometer, DE 44 44 149 A1, which deals with a semiconductor yaw sensor, and DE 10 2011 081 641 A1, which shows a sensor. Furthermore, patent documents EP 2 230 497 A1 and EP 1 994 384 B1 should also be mentioned as additional prior art.

[0004] DE 195 09 160 A1 discloses a dual MISFET accelerometer. DE 602 17 924 T2 discloses an electrothermal self-locking MEMS switch and method. DE 42 34 969 A1 discloses a microtransducer. DE 103 10 342 A1 discloses a tunable capacitor. US 2009 / 0 014 340 A1 discloses systems and methods for detecting glucose in a sample. US 2011 / 0 063 773 A1 discloses a MEMS device. JP 2006-186 540 A discloses a high-frequency switch.

[0005] Typically, MEMS devices exhibit an imprinted capacitance, primarily determined by the two electrodes, and a parasitic capacitance of the MEMS device itself. The capacitance change, indicative of the movement of the moving element, is often relatively small compared to the total capacitance of the MEMS device. To compensate for manufacturing-related variations, especially those related to the parasitic capacitance, funds are allocated for offsetting. Consequently, there is a need for an improved method that allows for the reduction of parasitic capacitance. SUMMARY

[0006] One embodiment of the disclosure provides a MEMS device comprising a fixed electrode having a main surface and a movable electrode. The movable electrode is arranged in an insulated manner and spaced apart from the fixed electrode. The movable electrode, which has a base surface substantially parallel to the main surface of the fixed electrode and an end face laterally adjacent to one or more spacers, is suspended relative to the fixed electrode by means of one or more spacers comprising an insulating material, the movable electrode being attached to the one or more spacers via the end face of the movable electrode. The one or more spacers are attached to the two electrodes, the insulating material isolating the fixed and the movable electrodes from each other.

[0007] Another embodiment provides a MEMS device comprising a substrate with a fixed electrode having a main surface and a movable electrode having a base surface substantially parallel to the main surface of the fixed electrode and an end surface laterally adjacent to one or more spacers.The movable electrode is suspended from the fixed electrode by means of one or more spacers having an insulating oxide at their corners, the movable electrode being attached to the one or more spacers via the end face of the movable electrode; the one or more spacers being attached to the two electrodes; the distance between the fixed electrode and the movable electrode being variable, and a change in the distance resulting in a change in capacitance, the insulating material isolating the fixed and the movable electrodes from each other.

[0008] According to a further embodiment, a MEMS device comprises a fixed electrode having a main surface and a movable electrode having a base surface substantially parallel to the main surface of the fixed electrode and an end face laterally adjacent to one or more spacers, and being arranged in an insulated manner and spaced apart from the fixed electrode. The movable electrode is suspended relative to the fixed electrode by means of one or more spacers comprising an insulating material, the movable electrode being attached to the one or more spacers via the end face of the movable electrode, the one or more spacers being attached to the two electrodes.In this case, the base area of ​​one or more spacers is at least twenty times smaller than the base area of ​​the movable electrode, with the insulating material isolating the fixed and the movable electrodes from each other.

[0009] Another embodiment provides a method for manufacturing a MEMS device. The method comprises placing a sacrificial layer on a fixed electrode with a main surface, and placing a movable electrode, which has a base surface substantially parallel to the main surface of the fixed electrode and an end surface laterally adjacent to one or more spacers, over the sacrificial layer, such that a layer stack comprising the sacrificial layer and the movable electrode is formed.Furthermore, the method comprises providing one or more spacers comprising an insulating material adjacent to the layer stack, such that the movable electrode is attached to the one or more spacers via the end face of the movable electrode, and removing the sacrificial layer at least in a section that is flush with a section of the movable electrode, such that the movable electrode is spaced from the fixed electrode by a distance related to the thickness of the sacrificial layer. This results in the movable electrode being suspended relative to the fixed electrode by means of the one or more spacers, the one or more spacers being attached to the two electrodes, and the insulating material isolating the fixed and the movable electrodes from each other. BRIEF DESCRIPTION OF THE DRAWINGS

[0010] In the following, embodiments of the present disclosure are discussed with reference to the accompanying drawings, wherein Fig. Figure 1 shows a schematic cross-sectional view of a MEMS device with two electrodes which, according to a first embodiment, are suspended relative to each other by means of one or more spacers; Fig. 2a and Fig. 2b show a cross-sectional view and a top view of another MEMS device according to an embodiment; Fig. 3a to 3f successive steps of a process for manufacturing the MEMS device of Fig. 2a and Fig. 2b show; Fig. 4a shows a top view of a MEMS device which, according to one embodiment, is used as an accelerometer; Fig. 4b shows a top view of a MEMS device used as a pressure sensor according to one embodiment; and Fig. 5a and Fig. 5b shows a cross-sectional view and a top view of a further MEMS device comprising two electrodes which, according to a further embodiment, are suspended relative to each other by means of one or more spacers embedded in one of the electrodes. DETAILED DESCRIPTION

[0011] In the following, various embodiments of the teachings disclosed herein are described with reference to Fig. 1 to 5 are discussed, wherein in the drawing objects with completely identical or similar functions have been given the same reference numerals, so that objects which in different embodiments are designated with completely identical reference numerals are interchangeable and the description thereof is applicable to all.

[0012] Fig. Figure 1 shows a cross-sectional view of a MEMS device 10 with a fixed electrode 12 and a movable electrode 14. Here, the fixed electrode 12 and the movable electrode 14 are arranged such that they are opposite each other, with a distance 16 between them. In one embodiment, the two electrodes 12 and 14 are essentially parallel to each other. The two electrodes 12 and 14 are spaced apart from each other by means of one or more spacers 18. The one or more spacers are arranged between and attached to the two electrodes 12 and 14. In detail: The spacers 18 can be attached to the fixed electrode 12 by means of a main surface 12m facing the movable electrode 14. Furthermore, the spacers 18 are attached to the movable electrode 14 by means of an end face 14f of the movable electrode 14; i.e.,that one or more spacers 18 are arranged laterally adjacent to the movable electrode 14 (and consequently laterally adjacent to each other). The reason for the lateral arrangement of the movable electrode 14 and the spacers 18 is discussed below, following a discussion of the overall structure and functionality of the MEMS device 10.

[0013] The fixed electrode 12 is stationary; for example, it can be arranged on a substrate (not shown). Conversely, the movable electrode 14 is movable at least along a first direction (illustrated by arrow 16). To achieve this movement, the movable electrode 14 forms or possesses a deformation zone. Alternatively, the deformation zone can be formed at the junction or boundary between the movable electrode 14 and the spacer 18, or by the spacer 18 itself. In general, with regard to the one or more spacers 18, this means that the purpose of the one or more spacers 18 is to provide a suspension for the movable electrode 14 relative to the fixed electrode 12.

[0014] The two electrodes 12 and 14 form a capacitance; therefore, the two electrodes 12 and 14 are insulated from each other. For this reason, the spacers 18 have an insulating material, such as an oxide or a nitride. Alternatively, the spacer 18 can have a different insulating material, for example, monosilicon, where the doping is selected such that the monosilicon is non-conductive.

[0015] The range of motion is designed such that the distance 16 is variable. A change in the distance 16 causes a change in capacitance. Consequently, a change in distance or a movement of the movable electrode 14 due to the change in capacitance can be detected. Thanks to the lateral connection between the movable electrode 14 and the spacers 18 by means of the end faces 14f, it is possible to avoid large sections of the electrodes 12 and 14 facing each other with an oxide layer in between. It should be noted that these areas typically give rise to parasitic capacitances. The reason for this is that parasitic capacitance is mainly caused in areas of the oxide, or more generally, the dielectric, due to the difference in capacitance compared to the dielectric constant ε. Hohlraum of the cavity (here 1.0, cf. the area marked 16) increased dielectric constant ε Abstandsstück(e.g., for oxide 3,9). Consequently, the structure of the MEMS device 10 allows for the reduction of the areas primarily responsible for parasitic capacitance. In other words, this embodiment has the advantage that the capacitance is mainly determined by the overlap area of ​​the two electrodes 12 and 14 and the distance 16 between the two electrodes 12 and 14. Therefore, the MEMS device 10 has a reduced parasitic capacitance compared to prior art MEMS devices, thanks to the way the movable electrode 14 is suspended. This leads to improved electrical characteristics. A key benefit is that the circuit for evaluating the movement of the movable electrode 14 no longer requires a means of offsetting the signal from the device 10.

[0016] With reference to Fig. 2a and Fig. Section 2b discusses a further embodiment of a MEMS device 10'. The MEMS device 10' is described here in Fig. 2a shown in a cross-sectional view (AA), wherein Fig. Figure 2b shows a top view of the device 10'. The device 10' comprises a substrate 20 on which the fixed electrode 12 is formed, or more generally, which comprises the fixed electrode 12. The second electrode 14 is arranged at a distance 16 above the surface 12m. According to this embodiment, the movable electrode 14 is suspended by means of several spacers 18a, 18b, 18c, and 18d. Here, the electrode forms a membrane 14 and has a deformation zone located next to or at the boundary between the membrane 14 and the spacers 18a, 18b, 18c, and 18d. The several spacers 18a, 18b, 18c, and 18d are arranged at the corners of the movable electrode 14 with openings between them. It should be noted that the openings are marked by reference numerals 19a, 19b, 19c and 19d. As can be seen from the embodiment of Fig. As can be seen in Figure 2b, the openings 19a, 19b, 19c and 19d are arranged on the longitudinal sides of the rectangular membrane 14.

[0017] As can be seen particularly in the top view 2b, the combined base area of ​​the several spacers 18a, 18b, 18c, and 18d is significantly smaller compared to the base area of ​​the movable electrode 14. For example, the ratio between the two base areas can be 1:10, 1:20, or even 1:100. Assuming an exemplary size of the movable electrode 14 of 35 µm × 35 µm (up to 200 µm × 200 µm), the base area of ​​each spacer 18a, 18b, 18c, or 18d is less than 70 µm or less than 20 µm. 2(less than 5% or 1% of the base area of ​​the movable electrode 14). The base area is related to the sum of all spacers 18a, 18b, 18c, and 18d. Consequently, the respective base area of ​​an individual spacer 18a, 18b, 18c, or 18d can be less than 2.5% or even less than 0.25% of the base area of ​​the movable electrode 14 (depending on the number of spacers 18a, 18b, 18c, and 18d). This leads to the improved electrical characteristic discussed above.

[0018] According to a further embodiment, a conductor 26 can be arranged on one of the spacers 18a, 18b, 18c, or 18d to electrically connect the movable electrode 14. This conductor 26 is arranged as a layer extending along the surface of the spacer 18a from the substrate 20 to the movable electrode 14. To insulate the conductor from the electrode 12, the substrate 20 can, according to a further embodiment, include an insulator 28 arranged between the conductor 26 and the electrode 12. According to this further embodiment, the conductor 26 can include a section 26a extending through the insulator 28 into the substrate 20.

[0019] With reference to Fig. Sections 3a to 3f discuss an exemplary method for manufacturing the MEMS device 10'.

[0020] Fig. Figure 3a shows a first step of providing the substrate 20 and the solid electrode 12 on the substrate 20. A sacrificial layer 32 is then applied to the surface 12m of the solid electrode 12, as shown by Fig. Figure 3b illustrates this. In one embodiment, the sacrificial layer 32 can be applied to the entire surface 12m of the electrode 12, wherein the thickness of the sacrificial layer 32 is selected based on the distance 16 (see Figure 3b). Fig. 2a).

[0021] The sacrificial layer 32 can be made of SiGe or another material that can be etched by isotropic etching. Using SiGe as the sacrificial layer 32 has the advantage that the movable electrode 14, which, for example, has monocrystalline silicon, can be formed by epitaxy. The etching rate of the sacrificial layer 32 is different (e.g., higher) from the etching rate of the membrane 14 or another functional layer (e.g., electrodes 12, 14, and 32, or spacer 18) to allow selective (wet or dry) etching of the sacrificial layer 32.

[0022] Fig. Figure 3c shows the procedure after the movable electrode 14 has been deployed on the sacrificial layer 32. The movable electrode 14 can comprise polysilicon, monosilicon, or a metal, such as an alloy, with the selected material typically depending on the material of the sacrificial layer 32 and, in particular, on the technology used to remove the sacrificial layer 32. Specifically, polysilicon, monosilicon, and nitride are typically used as the material for the movable electrode 14 when the MEMS device is manufactured in the initial stage of production (FEOL, Front End of Line), while a movable metal electrode 14 is typically used when the MEMS device 10' is manufactured in the final stage of production (BEOL, Back End of Line). It should be noted that monosilicon enables the fabrication of a robust and reliable electrode 14 with a low voltage gradient.Furthermore, the material of the movable electrode 14 is selected depending on the material of the spacers 18 (which are provided during one of the next processes).

[0023] In detail: Fig. Figure 3c illustrates the process of structuring the movable electrode 14. Here, the layer stack comprising the two layers 14 and 32 is etched such that the shape, e.g., the rectangular shape, of the movable electrode 14 is defined. In other words, this means that the structure of the layer stack 14, 32 is defined by applying lithography and / or anisotropic etching technologies. The result of this process is... Fig. In the illustrated process 3c, a layer stack 14, 32 with the desired final shape of the movable electrode 14.

[0024] The next process, illustrated by Fig. Step 3d is the provision of the spacers 18. This process is carried out such that the spacers 18 are arranged around the layer stack 14, 32. Consequently, the spacers 18 are typically provided laterally next to the movable electrode 14 or next to the layer stack 14, 32, e.g., by depositing the spacer oxide. The deposition of the spacer 18 is carried out such that its thickness substantially corresponds to the thickness of the layer stack, in order to enable the connection between the movable electrode 14 and the spacers 18, and in such a way that a good (adhesive) bond between the movable electrode 14 and the spacers 18 is achieved.

[0025] The spacers 18 can be provided in a structured manner, e.g., using a mask, such that the base area is as small as possible to reduce the parasitic capacity, as explained above. Providing the spacers 18 in a structured manner also allows them to be provided in such a way that the openings (cf. Fig. 19a, Fig. 19b, Fig. 19c and Fig. 19d) are arranged between them. These openings serve the purpose of enabling the removal of the sacrificial layer in one of the subsequent processes. Alternatively, the shape of the spacers 18, and consequently the base area as well as the openings of the spacers 18, can be subsequently limited by another (e.g., anisotropic) etching process.

[0026] As through Fig. As illustrated in Figure 3e, the sacrificial layer 32 is to be removed by the next step. This can be done by isotropic (wet or dry) etching. Good accessibility is achieved thanks to the openings between the spacers 18. After the removal of the sacrificial layer 32, the movable electrode 14 is suspended by the laterally attached spacers 18. It should be noted that in one embodiment the sacrificial layer 32 is completely removed, but alternatively it can be mainly or at least partially removed, i.e., more than 75%, 90%, or even 99%, with respect to the entire sacrificial layer area 32.

[0027] Fig. Figure 3f shows a final, optional step of the manufacturing process, in which the movable electrode 14 is electrically contacted. Here, the electrical conductor 26 is provided on the surface of one of the spacers 18, such that the conductor 26 extends from the substrate 20 to the second electrode 14.

[0028] It should be noted that the described manufacturing process may optionally include further processes, such as polishing or planarizing.

[0029] Fig. Figure 4a shows another MEMS device 10", which is related to the MEMS device 10' of Fig. 2a is essentially the same or similar, wherein the movable electrode 14" is designed as a cantilever. The hammer-shaped cantilever 14" is suspended by means of two spacers, namely spacers 18a and 18b. As regards the other elements, namely the first electrode 12, the substrate 20, the conductor 26, and the insulator 28, the MEMS device 10" is the same or similar to the MEMS device 10'. The MEMS device 10" shown can be used as an accelerometer. According to a further embodiment, the accelerometer 10" can comprise a cover which is arranged on the substrate 20 such that the MEMS structure with the two electrodes 12 and 14" (14) is shielded from the environment.

[0030] Fig. Figure 4b shows another MEMS device 10'''. The other MEMS device 10''' is the MEMS device 10' of Fig. 2a substantially the same or similar, wherein the openings 19a, 19b, 19c, and 19d are closed by further spacers 36a, 36b, 36c, and 36d. Due to the additional spacers 36a, 36b, 36c, and 36d, the movable electrode 14 forms a closed diaphragm, so that the cavity between the two electrodes 12 and 14 is hermetically sealed. This enables the use of the MEMS device 10''' for various applications. For example, the closed diaphragm 14 allows the formation of a pressure sensor because a pressure difference between the pressure inside the closed cavity and the external pressure leads to a deformation of the diaphragm 14, which can be measured capacitively, as explained above.

[0031] From a manufacturing perspective, it should be noted that the spacers 36a, 36b, 36c and 36d are formed on the substrate 20 or on the solid electrode 12 after the sacrificial layer (see Fig. 3e) has been removed.

[0032] Although the spacers in the embodiments discussed above were considered in the context of a spacer arrangement in which the spacers are arranged around the movable electrode 14, it should be noted that one or more spacers can also be arranged within the electrode area 14. Such an arrangement is discussed below.

[0033] Fig. 5a and Fig. Figure 5b shows another MEMS device 10'''', wherein the MEMS device 10"" is in Fig. 5a by a cross-sectional view (AA) and in Fig. Figure 5b illustrates this by a top view. The MEMS device 10"" comprises the substrate 20 with the fixed electrode 12"'''' and the movable electrode 14"'''', which is spaced apart from the surface 12m of the fixed electrode 12 by a distance 16. As illustrated, the movable electrode 14"'''' is suspended by means of a spacer 18"'''' located within a region of the movable electrode 14. This means that the spacer 18"'''' extends from the surface 12m through the movable electrode 14"'''', so that the spacer 18"'''' is embedded within the movable electrode 14"''''.

[0034] Alternatively, the MEMS device 10'''' shown can also comprise several spacers 18'''' embedded in the movable electrode 14''''. According to a further embodiment, the conductor for electrically connecting the movable electrode 14'''' can be arranged inside the spacers 18'''' (not shown).

[0035] The fabrication of the MEMS device 10'''' is essentially similar to the fabrication of the MEMS devices discussed above. During the process of determining the shape of the movable electrode 14'''', a hole for the spacer 18'''' (through which the spacer 18'''' should extend) is created in the movable electrode 14'''' and the sacrificial layer 32 (see Figure 1). Fig. 3c). Integrating the one or more holes for the one or more spacers 18'''' into the movable electrode 14'''' can be based on lithography technologies and / or anisotropic etching.

[0036] With regard to Fig. 2a, Fig. 2b and on Fig. 4a It should be noted that the MEMS 10' and 10" shown can be used as humidity sensors. In this case, a liquid film adhering to the membrane 14, for example, proportionally changes the capacitance of the MEMS device 10' or 10", so that a detectable capacitance allows conclusions to be drawn about the corresponding humidity. This change in capacitance caused by the liquid film is quite small, making the principle described above, which allows one to avoid or reduce parasitic capacitance, advantageous.

[0037] According to further embodiments, the MEMS device 10' forms a bolometer. It is advantageous that the material of the spacers 18a, 18b, 18c and / or 18d can be selected depending on a desired, e.g., reduced, thermal conductivity.

[0038] Although membrane 14 was discussed in the context of a rectangular membrane, it should be noted that the shape of membrane 14 can be different, for example round.

[0039] Referring to Fig. 5a and Fig. 5b It should be noted that a MEMS device according to a further embodiment may comprise spacers 18'''' embedded in the movable electrode 14'''', as well as spacers 18a, 18b, 18c and 18d surrounding the electrode 14'''', as shown by Fig. 2a and Fig. 2b shown.

[0040] In general, the embodiments described above merely illustrate the basic idea of ​​the present disclosure. It is understood that modifications and variations of the arrangements and details described herein will be obvious to other persons skilled in the art. Therefore, it is intended that the scope of protection be limited only by the appended claims and not by the specific details presented here for description and explanation.

Claims

[1] MEMS device (10), comprising: a solid electrode (12) having a main area (12m); and a movable electrode (14) which is arranged in an insulated manner and spaced apart from the fixed electrode (12) by a distance; wherein the movable electrode (14), which has a base surface substantially parallel to the main surface (12m) of the fixed electrode (12) and an end face (14f) laterally adjacent to one or more spacers (18), is suspended in relation to the fixed electrode (12) by means of one or more spacers (18) comprising an insulating material, wherein the movable electrode (14) is attached to the one or more spacers (18) via the end face (14f) of the movable electrode (14), wherein one or more spacers (18) are attached to the two electrodes (12, 14), and wherein the insulating material insulates the fixed and the movable electrodes (12, 14) from each other. [2] MEMS device (10) according to claim 1, wherein the solid electrode (12) is formed by a substrate or attached to a substrate. [3] MEMS device (10) according to claim 1 or 2, wherein the movable electrode (14) has a square shape and wherein the movable electrode (14) is suspended at one or more corners of the movable electrode (14) by means of one or more spacers (18). [4] MEMS device (10) according to one of claims 1 to 3, wherein the one or more spacers (18) are embedded in the movable electrode (14). [5] MEMS device (10) according to any one of claims 1 to 4, wherein one or more spacers (18) comprise an oxide or nitride. [6] MEMS device (10) according to any one of claims 1 to 5, wherein the one or more spacers (18) comprise a different material or lattice structure compared to the material or lattice structure of the movable electrode (14). [7] MEMS device (10) according to any one of claims 1 to 6, wherein a base area of ​​one or more spacers (18) is at least 10 times smaller compared to a base area of ​​the movable electrode (14). [8] MEMS device (10) according to any one of claims 1 to 7, wherein the distance between the fixed electrode (12) and the movable electrode (14) is variable and wherein a change in distance leads to a change in capacitance. [9] MEMS device (10) according to any one of claims 1 to 8, wherein the movable electrode (14) is electrically contacted by means of a conductor arranged on one of the one or more spacers (18). [10] MEMS device (10) according to one of claims 1 to 9, wherein the one or more spacers (18) are separated from each other by an opening which extends along the movable electrode (14). [11] MEMS device (10) according to one of claims 1 to 10, wherein the movable electrode (14) is designed as a cantilever arm. [12] MEMS device (10) according to claim 11, wherein the MEMS device (10) forms an accelerometer or a humidity sensor. [13] MEMS device (10) according to one of claims 2 to 12, wherein the one or more spacers (18) have a material which has a reduced thermal conductivity compared to a material of the movable electrode (14) or the substrate. [14] MEMS device (10) according to claim 13, wherein the MEMS device forms a bolometer. [15] MEMS device (10) according to one of claims 10 to 14, wherein a further spacer (18) is arranged in the area of ​​the opening to hermetically seal a cavity under a membrane formed by the movable electrode (14). [16] MEMS device (10) according to claim 15, wherein the MEMS device (10) forms a pressure sensor. [17] MEMS device (10), comprising: a substrate with a solid electrode (12) having a main area (12m); and a movable electrode (14) which is arranged in an insulated manner and spaced apart from the fixed electrode (12) by a distance, wherein the movable electrode (14) has a square shape; wherein the movable electrode (14), which has a base surface substantially parallel to the main surface (12m) of the fixed electrode (12) and an end face (14f) laterally adjacent to one or more spacers (18), is suspended on the fixed electrode (12) by means of one or more spacers having an insulating oxide at their corners, wherein the movable electrode (14) is attached to the one or more spacers (18) via the end face (14f) of the movable electrode (14); wherein one or more spacers (18) are attached to the two electrodes (12, 14); wherein the distance between the fixed electrode (12) and the movable electrode (14) is variable and wherein a change in distance leads to a change in capacitance, wherein the insulating material insulates the fixed and the movable electrodes (12, 14) from each other. [18] MEMS device (10), comprising: a solid electrode (12) having a main area (12m); and a movable electrode (14) having a base surface substantially parallel to the main surface (12m) of the fixed electrode (12) and an end face (14f) laterally adjacent to one or more spacers (18) and which is arranged in an insulated manner and spaced apart from the fixed electrode (12) by a distance; wherein the movable electrode (14) is suspended from the fixed electrode (12) by means of one or more spacers (18) comprising an insulating material, wherein the movable electrode (14) is attached to the one or more spacers via the end face (14f) of the movable electrode (14), wherein one or more spacers (18) are attached to the two electrodes (12, 14), wherein a base area of ​​one or more spacers (18) is at least 20 times smaller than a base area of ​​the movable electrode (14), wherein the insulating material insulates the fixed and the movable electrodes (12, 14) from each other. [19] Method for manufacturing a MEMS device (10), comprising: Providing a sacrificial layer above a fixed electrode (12) with a main area (12m); Providing a movable electrode (14) having a base surface substantially parallel to the main surface (12m) of the fixed electrode (12) and an end surface (14f) laterally adjacent to one or more spacers (18) above the sacrificial layer, such that a layer stack comprising the sacrificial layer and the movable electrode (14) is formed; Providing one or more spacers (18) comprising an insulating material adjacent to the layer stack, such that the movable electrode (14) is attached to the one or more spacers (18) via the end face (14f) of the movable electrode (14); and Removing the sacrificial layer at least in a section that is aligned with a section of the movable electrode (14) such that the movable electrode (14) is spaced apart from the fixed electrode (12) by a distance which is related to the thickness of the sacrificial layer; wherein the movable electrode (14) is suspended from the fixed electrode (12) by means of one or more spacers (18), wherein the one or more spacers (18) are attached to the two electrodes (12, 14), and wherein the insulating material insulates the fixed and the movable electrodes (12, 14) from each other. [20] Method according to claim 19, wherein the provision of one or more spacers (18) is carried out in such a way that an opening is formed between them. [21] Method according to claim 19 or 20, wherein providing the one or more spacers (18) comprises anisotropic etching and / or applying lithography to define a base area of ​​the one or more spacers (18). [22] Method according to claim 21, wherein the anisotropic etching and / or application of lithography is carried out such that the base area of ​​one or more spacers (18) is at least 10 times smaller than the base area of ​​the movable electrode (14). [23] Method according to any one of claims 20 to 22, wherein the removal of the sacrificial layer comprises etching or isotropic etching through the opening. [24] Method according to any one of claims 20 to 23, further comprising closing the opening by means of a further spacer (18) after the sacrificial layer has been removed. [25] Method according to any one of claims 19 to 24, further comprising determining the area of ​​the layer stack by applying lithography and / or anisotropic etching prior to providing one or more spacers (18). [26] Method according to claim 25, wherein determining the area of ​​the layer stack comprises forming at least one hole in the layer stack for the one or more spacers (18), and wherein the one or more spacers (18) are embedded in the movable electrode (14). [27] Method according to any one of claims 19 to 26, wherein the removal of the sacrificial layer takes place in a section in which the fixed electrode (12) is aligned with the entire movable electrode (14). [28] Method according to any one of claims 19 to 27, wherein the etching rate of the sacrificial layer differs from the etching rate of the membrane and / or the spacer (18).

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