Component and method for manufacturing a component

Abstract

component (10) comprising a substrate (1), a functional organic layer stack (6), a hermetically sealed self-supporting barrier layer (8), a first electrode (2), a second electrode (3), an electrically insulating connecting layer (7) and an encapsulation layer (9), wherein - the functional layer stack (6) is arranged between the substrate (1) and the barrier layer (8), - the barrier layer (8) in plan view of the substrate (1) covers the functional layer stack (6) and forms a step (80) laterally of the functional layer stack (6) with the substrate (1) and / or with a layer arranged on the substrate (1), - the encapsulation layer (9) covers the step (80) so that the functional layer stack (6) is hermetically sealed laterally by the barrier layer (8) and the encapsulation layer (9), - the barrier layer (8) is formed in the form of a metal foil and has a vertical thickness (D8) between 10 µm and 200 µm inclusive, and is directly covered by the encapsulation layer (9), - the functional layer stack (6) is located directly between the first electrode (2) and the second electrode (3) and the connecting layer (7) is arranged directly between the barrier layer (8) and the second electrode (3) on a side of the functional layer stack (6) facing away from the substrate (1), - the encapsulation layer (9) directly covers side surfaces of the bonding layer (7) and the barrier layer (8), and - the connecting layer (7) is in direct contact with a first electrical contact track (20) and a second electrical contact track (30) on the substrate (1), whereas the barrier layer (8) ends at a distance from these contact tracks (20, 30).

Description

[0001] A component and a method for manufacturing a component are specified.

[0002] Flat organic electronic components are sensitive to environmental influences such as oxygen and moisture, as well as to external mechanical stresses. To encapsulate such components, a lid can be glued or laminated across its entire surface. Alternative solutions include gluing lids with cavities at the edges, attaching lids using a glass frit, or employing thin-film encapsulation.

[0003] The publications DE 11 2004 000 937 B4, DE 10 2012 214 411 A1, DE 10 2012 223 046 A1, DE 10 2012 109 140 A1, DE 102 22 964 B4, US 2014 / 0 158 991 A1, JP 2003 - 272 830 A and CN 1 02 983 279 A concern encapsulations of organic light-emitting diodes.

[0004] One task is to specify a simplified manufacturing component with a high degree of hermeticity. Another task is to specify a reliable and cost-effective method for manufacturing such a component.

[0005] These problems are solved by the components having the features of claims 1 and 14 and by the method according to claim 8. Preferred embodiments are the subject of the dependent claims.

[0006] The device comprises a substrate and a functional layer stack arranged on the substrate. The functional layer stack contains, for example, a plurality of organic layers. The functional layer stack may include an active organic layer that emits or detects electromagnetic radiation, such as UV radiation, visible light, or infrared radiation, during operation of the device. Furthermore, the functional layer stack may contain a first charge transport layer, such as a hole transport layer, and a second charge transport layer, such as an electron transport layer. The active organic layer may be arranged vertically between the first and second charge transport layers. For example, the device is an organic light-emitting diode (OLED).

[0007] A vertical direction is defined as a direction perpendicular to a principal extension plane of the organic active layer. A lateral direction is defined as a direction parallel to the principal extension plane of the organic active layer.

[0008] The substrate is preferably made of a radiation-permeable, and more preferably transparent, material. The substrate may contain glass or consist entirely of glass. In particular, the substrate is permeable to the electromagnetic radiation generated during the operation of the component and may be clear, transparent, or translucent. The substrate has a first main surface facing away from the layer stack, which, for example, serves as a radiation emission surface of the component. Furthermore, the substrate has a second main surface facing the layer stack.

[0009] The component features a barrier layer, with the functional layer stack arranged between the substrate and the barrier layer. The barrier layer is self-supporting. In other words, the barrier layer is designed to remain mechanically stable under its own weight even without mechanical support from other layers and does not disintegrate. In particular, the barrier layer is impermeable to liquids and gases, i.e., hermetically sealed.

[0010] The barrier layer can be made of an inorganic material, such as a metal, glass, or plastic. It can be prefabricated and applied to the functional layer stack. For example, the barrier layer can be in the form of a film, such as a metal or glass foil. A film is defined as a layer that is flexible, primarily due to its own weight, yet self-supporting and therefore mechanically stable, with its vertical thickness being many times smaller than its lateral thickness, for example, by a factor of at least ten, twenty, or fifty.

[0011] A bonding layer can be arranged between the functional layer stack and the barrier layer, for example, to attach the barrier layer to the functional layer stack. This bonding layer can be an adhesive layer, such as one containing an adhesive. Alternatively, the barrier layer can be formed on the functional layer stack using a coating process. In this case, the bonding layer can be omitted.

[0012] According to at least one embodiment of the component, the barrier layer completely covers the functional layer stack laterally when viewed from above the substrate. That is, the functional layer stack is completely covered by the barrier layer along at least one lateral direction. The barrier layer can also completely cover the entire functional layer stack.

[0013] The barrier layer forms a step laterally to the layer stack, particularly with the substrate and / or with a layer arranged on the substrate. This means that the step can be formed, in particular, by the barrier layer and the substrate, or by the barrier layer and the layer arranged on the substrate, or by the barrier layer and the substrate as well as the layer arranged on the substrate.

[0014] A step is understood to be a geometric structure comprising a first, a second, and a third surface, wherein the first and third surfaces are vertically spaced apart and, in particular, connected to each other by the second surface. A step formed by the barrier layer and the substrate, and / or by the barrier layer and a layer arranged on the substrate, is understood to be, in particular, a step in which only the first and second surfaces are at least partially formed by surfaces of the barrier layer, wherein the third surface is formed at least by a surface of the substrate or at least by a surface of the layer arranged on the substrate. The first surface, for example, runs parallel or substantially parallel to the first or second principal surface of the substrate.The second surface can be partially or completely formed by a surface of the barrier layer. The step can be frame-like around the stack of layers. In other words, the step can laterally surround the stack of layers, forming a closed or open frame.

[0015] According to at least one embodiment of the component, it has an encapsulation layer that covers the step. Due to this covering, the functional layer stack can be hermetically sealed laterally by the barrier layer and the encapsulation layer. If the step is covered by the encapsulation layer, the encapsulation layer covers at least part of the second surface of the step. For example, a common connecting line formed by the barrier layer and the substrate and / or by the barrier layer and a layer arranged on the substrate is covered, preferably completely covered, by the encapsulation layer. The encapsulation layer can be made of a material such as glass, metal, plastic, or epoxy. Laterally hermetically sealed means that the penetration of liquids or gases from a lateral direction into the functional layer stack is completely or almost completely prevented.

[0016] The component thus comprises a substrate, a functional layer stack, a self-supporting, in particular hermetically sealed, barrier layer, and an encapsulation layer. The functional layer stack is arranged between the substrate and the barrier layer. Viewed from above, the barrier layer covers the functional layer stack. Laterally to the layer stack, the barrier layer forms a step with the substrate and / or with a layer arranged on the substrate, with the encapsulation layer covering this step, so that the functional layer stack is hermetically sealed laterally by the barrier layer and the encapsulation layer.

[0017] Due to the hermetically sealed, self-supporting, and therefore mechanically stable barrier layer, the functional layer stack, which is sensitive to humidity, harmful gases, and external mechanical influences, is protected. Creep of environmental influences under the barrier layer, particularly at the interfaces between the barrier layer and the substrate or between the barrier layer and another layer arranged on the substrate, can be completely or almost completely prevented by covering the step and thus also the interfaces with the encapsulation layer. A thin barrier layer allows for cost-effective coverage of the step without significant effort.In contrast to a conventional dense bonding structure between the substrate and the barrier layer, a dense covering of the step by the encapsulation layer can be implemented more easily and cost-effectively.

[0018] According to at least one embodiment of the component, the barrier layer is made of a metal, such as aluminum. The barrier layer can also be made of glass or a plastic. In particular, the barrier layer is in the form of a film. The barrier layer has a vertical thickness that is, in particular, between 10 µm and 1 mm, between 10 µm and 200 µm, between 10 µm and 50 µm, or between 10 µm and 30 µm. A thickness of this order of magnitude provides the barrier layer with sufficient mechanical stability and, at the same time, a sufficient degree of hermeticity. Furthermore, a step formed by the barrier layer of this size can be covered or reshaped without much effort. When reshaped, the barrier layer can at least partially or completely replicate the shape of the step.To simplify the covering or forming process, the encapsulation layer can have a vertical thickness that differs from the vertical thickness of the barrier layer by no more than 50%, approximately no more than 30%, or no more than 20%. The encapsulation layer can be in the form of a prefabricated film.

[0019] According to at least one embodiment of the component, it has an absorption layer. Liquids or gases that might penetrate the encapsulation layer and / or the barrier layer can be absorbed by the absorption layer and thus kept away from the functional layer stack, thereby further increasing the component's lifetime. In addition, the absorption layer can act as a damping layer against external mechanical influences.

[0020] The absorption layer can be arranged between the functional layer stack and the barrier layer. Alternatively, the absorption layer can be located entirely to the side of the functional layer stack or at least partially to the side of the functional layer stack. In the vertical direction, the absorption layer is preferably arranged between the barrier layer and the substrate. For example, a portion of the absorption layer arranged to the side of the functional layer stack, or the entire absorption layer, forms a frame on the substrate that surrounds the functional layer stack laterally. In the lateral direction, the frame is particularly located between the functional layer stack and the encapsulation layer.The absorption layer arranged vertically between the layer stack and the encapsulation layer, and the absorption layer arranged laterally to the layer stack, can be designed as two separate layers or as one continuous layer.

[0021] According to at least one embodiment of the component, it has a first and a second electrode. In the vertical direction, the functional layer stack is arranged, in particular, between the first and second electrodes. The first electrode is preferably radiation-transparent and arranged between the functional layer stack and the substrate. The first electrode can be made of a radiation-transparent and electrically conductive material. The second electrode is preferably radiation-reflecting.

[0022] According to at least one embodiment of the component, it has a first contact track and a second contact track, wherein the first and second contact tracks are arranged, in particular, laterally to the functional layer stack on the substrate. For example, the first electrode is electrically connected to the first contact track and the second electrode to the second contact track. The component can be electrically contacted externally, in particular via the contact tracks. For example, the contact tracks can be electrically contacted on a side of the substrate facing the layer stack. In particular, the first contact track, the second contact track, and the first electrode are located at approximately the same vertical height on the substrate. An insulating structure can be arranged between the first electrode and the second contact track, such that the first electrode and the second contact track are laterally spaced and electrically insulated from each other.

[0023] According to the method for manufacturing the component, which comprises a substrate, a functional layer stack, a hermetically sealed and self-supporting barrier layer, and an encapsulation layer, the substrate is first provided. The functional layer stack is applied to the substrate. In a subsequent process step, the barrier layer is applied to or formed on the functional layer stack, wherein, in a top view of the substrate, the barrier layer covers the functional layer stack and forms a step laterally of the layer stack with the substrate and / or with a layer arranged on the substrate. Preferably, the barrier layer is formed in the form of a film. The step is then covered by the encapsulation layer, so that the functional layer stack is hermetically sealed laterally by the barrier layer and the encapsulation layer.

[0024] The covering seals any potential leaks between the barrier layer and the substrate, or between the barrier layer and a layer placed on the substrate, thus completely or almost completely preventing environmental influences such as moisture or harmful gases from creeping under the barrier layer. Covering or molding the step represents a simplified, effective, and cost-efficient method for achieving a hermetically sealed encapsulation of the functional layer stack.

[0025] The barrier layer is attached to the functional layer stack by means of a bonding layer. The barrier layer can be a prefabricated layer, particularly in the form of a film, such as a metal or glass foil. The bonding layer contains, in particular, a pressure-sensitive adhesive. Alternatively, the barrier layer can be formed on the functional layer stack, for example, by means of a coating process. In such cases, the bonding layer can be omitted.

[0026] According to at least one embodiment of the method, the encapsulation layer is applied to the barrier layer either over a surface or in specific areas. It is also possible for the encapsulation layer to be applied to or formed on the barrier layer only in the immediate vicinity of the step, so that, viewed from above, the barrier layer is only partially covered by the encapsulation layer. In particular, this results in the encapsulation layer forming a frame-like structure on the substrate.

[0027] For example, the encapsulation layer is formed on the barrier layer using a physical vapor deposition (PVD) process, such as plasma-assisted deposition. The encapsulation layer can be an inorganic material, such as a metal, plastic, or glass, or it can be made of inorganic materials. For example, the encapsulation layer is made of lithographic glass. If the encapsulation layer contains a metal, such as copper or nickel, or a metal oxide, it can be applied to the barrier layer using an electroplating process. Alternatively or additionally, the encapsulation layer can be formed by a soldering process, such as a fluxless and / or lead-free soldering process, or by an ultrasonic soldering process, such as a silver-based ultrasonic soldering process.

[0028] The process is particularly suitable for manufacturing the component described above. The features described in connection with the component can therefore also be applied to the process, and vice versa.

[0029] Further advantages, preferred embodiments and further developments of the component result from the following in conjunction with the Fig. Figures 1A to 4B illustrate exemplary implementations. They show: Fig. 1A a schematic representation of an exemplary embodiment of a component, Fig. 1B a schematic representation of the in the Fig. 1A of the component shown in plan view, and Fig. 2 to 4B schematic representations of further embodiments of a component.

[0030] Identical, similar, or similarly functioning elements are marked with the same reference symbols in the figures. The figures are schematic representations and therefore not necessarily to scale. Rather, comparatively small elements, and especially layer thicknesses, may be exaggerated for clarity.

[0031] A first embodiment of a component 10 is shown in Fig. Figure 1A shows a schematic representation. The component 10 comprises a substrate 1, an organic functional layer stack 6 arranged on the substrate 1, and a barrier layer 8. In the vertical direction, the functional layer stack 6 is arranged between the substrate 1 and the barrier layer 8.

[0032] The substrate 1 has a first main surface 11 facing away from the layer stack 6, which, for example, serves as a radiation emission surface of the component 10, and a second main surface 12 facing the layer stack 6. In particular, the first main surface 11 and the second main surface 12 define the substrate 1 in the vertical direction. The substrate 1 is, for example, transparent to electromagnetic radiation generated during the operation of the component 10. Preferably, the substrate contains glass or consists of glass.

[0033] The functional layer stack 6 includes an organic active layer 63. During operation of the device, the active layer 63 emits electromagnetic radiation, for example, in the ultraviolet, visible, or infrared spectral range. Alternatively, the active layer 63 can be configured to detect electromagnetic radiation. The layer stack 6 also includes a first charge transport layer 61 and a second charge transport layer 62, with the organic active layer 63 positioned between the first and second charge transport layers. The first and second charge transport layers can each comprise or consist of an organic material. For example, the first and second charge transport layers can be configured as electron transport layers and hole transport layers, respectively, or vice versa.These charge transport layers serve to inject the holes and electrons into the organic active layer 63.

[0034] The component 10 has a first electrode 2 on a side of the layer stack 6 facing the substrate 1 and a second electrode 3 on a side of the layer stack 6 facing away from the substrate 1 for electrical contacting the layer stack 6. In particular, the first electrode 2 borders the second main surface 12 of the substrate 1. The first electrode 2 is, in particular, radiolucent and can contain transparent conductive materials, such as transparent conductive oxides. Examples of transparent conductive oxides are metal oxides, such as zinc oxide, tin oxide, cadmium oxide, titanium oxide, indium oxide, or indium tin oxide (ITO). The second electrode 3 is, for example, radioreflective. For example, the second electrode 3 contains a metal such as aluminum, rhodium, palladium, copper, or silver.

[0035] The component 10 comprises a first contact track 20 and a second contact track 30 spaced laterally from the first contact track 20. The first contact track 20 is in direct electrical contact with the first electrode 2. The second contact track 30 can be in direct electrical contact with the second electrode 3, the second electrode 3 extending laterally from a side of the layer stack 6 facing away from the substrate 1 to the second contact track 30. The contact tracks 20 and 30 are arranged directly on the substrate 1. That is, the contact tracks 20 and 30 abut the second main surface 12 of the substrate. In particular, the first contact track 20 and / or the second contact track 30 are free of overlaps with the organic active layer 63 in a top view.

[0036] In the lateral direction, an insulating structure 4, containing, for example, polyimide, is arranged between the second contact track 30 and the second electrode 2. The second electrode 3 covers the first insulating structure 4, at least partially. The second contact track 30 and the second electrode 3 can be made of the same material or of different materials. The first contact track 20 and the second contact track 30 can contain a metal, such as chromium, copper, aluminum, or alloys thereof.

[0037] The first contact track 20, the contact track 30, and the first electrode 2 are arranged, for example, at the same vertical height on the substrate 1. Along a lateral direction, the first contact track 20 can extend across the entire lateral width of the first electrode 2, thus largely preventing voltage drops in the first electrode 2 along the lateral direction and resulting in a particularly homogeneous luminance of the component. The component 10 is surface-mountable via the first contact track 20 and the second contact track 30. That is, the component 10 can be externally electrically connected from the rear side, namely from one of the main surfaces 11 of the substrate 1, via the first contact track 20 and the second contact track 30. For example, the component 10 can be electrically connected to a transistor via the contact tracks.

[0038] In the Fig. In 1A, a barrier layer 8 is arranged on a side of the layer stack 6 facing away from the substrate 1. The barrier layer 8 can be designed as a prefabricated film, which is attached to the layer stack 6, in particular by means of a bonding layer 7. For example, the bonding layer 7 contains a pressure-sensitive adhesive, wherein the adhesion of the bonding layer is pressure- and / or temperature-dependent. Alternatively, the barrier layer 8 can be formed on the layer stack 6, for example, by means of a coating process. The barrier layer 8 is, in particular, a metal layer, such as an aluminum layer. The bonding layer 7 is, in particular, electrically insulating. The barrier layer 8 can also be electrically insulating. For example, the barrier layer 8 contains a plastic or glass. Preferably, the barrier layer 8 is hermetically sealed.

[0039] The barrier layer 8 is particularly self-supporting. That is, the barrier layer 8 can exist as an independent layer, for example in the form of a film, even without mechanical support from other layers. For example, the barrier layer 8 has a vertical thickness D8 between 10 µm and 1 mm, for example between 10 µm and 200 µm, or between 10 µm and 50 µm or between 10 µm and 30 µm. In a top view of the substrate 1, the barrier layer 8 preferably completely covers the layer stack 6, so that the layer stack 6 is hermetically sealed by the barrier layer 8, at least in the vertical direction.

[0040] In the Fig. 1A forms the barrier layer 8 laterally to the side of the layer stack 6 with the contact lines 20 and 30 arranged on the substrate, or together with the connecting layer 7 arranged on the substrate 1, a step 80. In areas of the second main surface of the substrate 1 that are free of the contact lines 20 and 30, the barrier layer 8 can form the step 80 with the substrate 1.

[0041] Step 80 has a first surface 81, a second surface 82, and a third surface 83. The first surface 81 and the third surface 83 are vertically spaced apart and can each run parallel to the first main surface 11 of the substrate 1. The second surface 82 extends vertically, connecting the first surface 81 with the third surface 83. The second surface 82 runs transversely, and in particular perpendicularly, to the first surface 81 in the vertical direction. It is also possible that the second surface 82 forms an acute or obtuse angle with the first surface 81 or with the third surface 83. Furthermore, a transition between the second surface 82 and the first surface 81 or the third surface 83 can be rounded. A rounded transition further simplifies the covering or shaping of step 80.

[0042] In the Fig. 1A, the first surface 81 of stage 80, is a partial surface of the barrier layer 8 facing away from the substrate 1. The third surface 83 is a surface of a layer arranged on the substrate 1, facing away from the substrate 1, in this case the surface of the first contact strip 20 or the second contact strip 30. In areas of the second main surface 12 that are not covered by either the first contact strip 20 or the second contact strip 30, the third surface 83 can be a surface of the substrate 1, namely a partial area of ​​the second main surface 12. The second surface 82 of stage 80 is at least partially formed by a surface of the barrier layer 8. In the Fig. 1A, the second surface 82 is formed partly by a surface of the barrier layer 8 and partly by a surface of the connecting layer 7. It is also possible that the second surface 82 is formed exclusively by a surface of the barrier layer 8.

[0043] In Fig. 1A, the step 80 is covered by an encapsulation layer 9. The step 80 is covered if the second surface 82 and, in particular, also the third surface 83 are at least partially covered by a covering layer, such as the encapsulation layer 9. In particular, the covering layer borders the step 80 and replicates the shape of the step 80, at least partially. For example, the first, second, and third surfaces of the step 80 are all covered by the encapsulation layer 9, with the second surface 82 being completely covered.Due to the covering, connection points in the immediate vicinity of a common connection line formed by barrier layer 8 and substrate 1, or by barrier layer 8 and a layer arranged on substrate 1, are covered by the encapsulation layer 9, thus largely or completely preventing the ingress of environmental influences such as liquids or gases under barrier layer 8. The connection line can form a closed frame around the layer stack 6. Because the layer 80 is covered by the encapsulation layer 9, the functional layer stack 6 can be reliably hermetically sealed laterally by barrier layer 8 and the encapsulation layer 9.

[0044] The encapsulation layer 9 has a vertical thickness D9 that differs from the vertical thickness D8 of the barrier layer 8 by, for example, at most 50%, at most 30%, or at most 20%. The thicknesses D8 and D9 of the barrier layer 8 and the encapsulation layer 9, respectively, are thus of a comparable order of magnitude, which simplifies the achievement of reliable coverage and / or forming. Specifically, the barrier layer 8 is an aluminum layer and the encapsulation layer 9 is a glass layer.

[0045] The encapsulation layer 9 can be formed on the barrier layer 8 by means of a physical vapor deposition process, such as a plasma-enhanced vapor deposition process. Alternatively, the encapsulation layer 9 can be applied to the barrier layer 8 by means of an electroplating process. Alternatively or additionally, the encapsulation layer 9 can be applied to or formed on the barrier layer 8 by a soldering process, in particular an ultrasonic soldering process, to form the step. The latter can be achieved by first applying the encapsulation layer 9 to the barrier layer 8 and then soldering it to cover the step 80.

[0046] In Fig. 1B is a schematically depicted component 10 in a top view. This embodiment essentially corresponds to the one in the Fig. 1A described embodiment, wherein the dashed line AA' in the Fig. 1B on the in the Fig. 1A indicates the sectioning plane AA'.

[0047] In the Fig. In the top view of substrate 1, the encapsulation layer 9 completely covers the layer stack 6 and the barrier layer 8. The encapsulation layer 9 itself can be hermetically sealed, so that the layer stack 6 is hermetically sealed in the vertical direction not only by the barrier layer 8 but also by the encapsulation layer 9. The first contact track 20 and the second contact track 30 project beyond the encapsulation layer 9 to the side of the layer stack 6. On the second main surface 12 of the substrate 1, the first contact track 20 and the second contact track 30 are freely accessible, so that the component 10 can be electrically contacted from the rear via one of its sides facing away from the first main surface 11 of the substrate 1. It is also possible to apply an additional protective layer, such as a scratch-resistant layer, to the encapsulation layer 9.

[0048] Fig. Figure 2 shows a schematic representation of another embodiment of a component. This embodiment essentially corresponds to the embodiment in the Fig. 1A. In contrast, the barrier layer 8 borders the first contact track 20 and the second contact track 30. In particular, the barrier layer 8 is electrically insulating. In some areas, the barrier layer 8 can border the substrate 1. The second surface 82 of stage 80 is formed exclusively by a vertical surface of the barrier layer 8. Furthermore, the encapsulation layer 9 can only border the barrier layer 8 at its edges, in the Fig. 2 exclusively laterally to cover the layer stack 8. The encapsulation layer 9 can form a closed frame or, if necessary to avoid an electrical short circuit, an open frame around the layer stack 6. In the Fig. 2 has barrier layer 8 side surfaces and an upper surface facing away from the layer stack 6, wherein the side surfaces are partially covered by the encapsulation layer 9 and the upper surface of barrier layer 8 is free from the encapsulation layer 9.

[0049] Fig. Figure 3 shows a schematic representation of another embodiment of a component. This embodiment essentially corresponds to the embodiments in the Fig. 1A and Fig. 2. In contrast, the upper surface of the barrier layer 8 is partially covered by the encapsulation layer 9. Fig. In the top view of substrate 1, the encapsulation layer 9 and the layer stack 6 are free of overlaps. However, partial overlap is also possible.

[0050] The side surfaces of the barrier layer 8 are, in particular, completely covered by the encapsulation layer 9. Laterally to the barrier layer 8, the encapsulation layer 9 extends from the second surface 82 of the step 80 in the lateral direction over a distance that is, in particular, wider than the thickness D9 of the encapsulation layer 9. In the Fig. 3. The contact paths 20 and 30 each form a step with the second main surface 12 of the substrate, with these steps being partially covered by the encapsulation layer 9. This reliably prevents creep beneath the barrier layer 8, the contact paths 20 and 30, and the encapsulation layer 9.

[0051] In the Fig. 4A is a further embodiment of a component shown schematically, which is essentially the same as the one described in the Fig. This corresponds to the embodiment shown in Figure 1A. In contrast, an absorption layer 5, which absorbs in particular moisture and gases, is arranged between the functional layer stack 6 and the barrier layer 8. The absorption layer 5 is designed in particular as a liquid-absorbing layer, for example as a water-binding layer. In the Fig. 4A the absorption layer 5 is arranged in a vertical direction between the connecting layer 7 and the barrier layer 8.

[0052] Fig. Figure 4B shows a schematic representation of another embodiment of a component. This embodiment essentially corresponds to the embodiment in the Fig. 4A. In contrast, the absorption layer 5 is arranged laterally to the functional layer stack 6 and vertically between the barrier layer 8 and the substrate 1. In particular, the absorption layer 5 forms an open or closed frame that laterally surrounds the functional layer stack 6. The second surface 82 of the step 80 is partially formed by a surface of the absorption layer 5. It is also possible that the barrier layer 8 forms a step with the absorption layer 5 or completely covers the absorption layer 5 vertically, so that the second surface 82 is free of a surface of the absorption layer 5.

[0053] In the lateral direction, the absorption layer 5 is surrounded by the encapsulation layer 9. The absorption layer 5 is thus arranged laterally between the layer stack 6 and the encapsulation layer 9. Fig. 4B is the absorption layer 5 in top view of the substrate 1, free from any overlap with the layer stack 6. In the Fig. 4A The absorption layer 5, viewed from above on the substrate 1, covers the layer stack 6 at least partially, and in particular completely. It is also possible that the absorption layer 5 is designed such that it has a region which, as in the Fig. 4A shows the layer stack 6 covered, and has another area which, as in the Fig. 4B is shown arranged to the side of the layer stack 6.

[0054] A dense covering of the step represents a simplified and effective method for hermetically sealing the functional layer stack, thereby preventing environmental influences from creeping under the step.

Claims

[1] Component (10) comprising a substrate (1), a functional organic layer stack (6), a hermetically sealed self-supporting barrier layer (8), a first electrode (2), a second electrode (3), an electrically insulating connecting layer (7) and an encapsulation layer (9), wherein - the functional layer stack (6) is arranged between the substrate (1) and the barrier layer (8), - the barrier layer (8) in plan view of the substrate (1) covers the functional layer stack (6) and forms a step (80) laterally of the functional layer stack (6) with the substrate (1) and / or with a layer arranged on the substrate (1), - the encapsulation layer (9) covers the step (80) so that the functional layer stack (6) is hermetically sealed laterally by the barrier layer (8) and the encapsulation layer (9), - the barrier layer (8) is formed in the form of a metal foil and has a vertical thickness (D8) between 10 µm and 200 µm inclusive, and is directly covered by the encapsulation layer (9), - the functional layer stack (6) is located directly between the first electrode (2) and the second electrode (3) and the connecting layer (7) is arranged directly between the barrier layer (8) and the second electrode (3) on a side of the functional layer stack (6) facing away from the substrate (1), - the encapsulation layer (9) directly covers side surfaces of the bonding layer (7) and the barrier layer (8), and - the connecting layer (7) is in direct contact with a first electrical contact track (20) and a second electrical contact track (30) on the substrate (1), whereas the barrier layer (8) ends at a distance from these contact tracks (20, 30). [2] Component according to the preceding claim, wherein the vertical thickness (D8) of the barrier layer (8) is between 10 µm and 50 µm inclusive. [3] Component according to any of the preceding claims, wherein the encapsulation layer (9) has a vertical thickness (D9) which differs by no more than 50% from the vertical thickness (D8) of the barrier layer (8). [4] Component according to one of the preceding claims, wherein an absorption layer (5) that absorbs gases or moisture is arranged in a vertical direction between the functional layer stack (6) and the barrier layer (8). [5] Component according to one of claims 1 to 3, in which an absorption layer (5) that absorbs gases or moisture is arranged at least partially laterally to the side of the functional layer stack (6) and in a lateral direction between the barrier layer (8) and the substrate (1). [6] Component according to one of the preceding claims, wherein - the first electrode (2) is electrically connected to the first contact track (20) and the second electrode (3) is electrically connected to the second contact track (30), and - the first contact lane (20) and the second contact lane (30) are each arranged laterally to the side of the functional layer stack (6), and - the component (10) can be electrically contacted on a side of the substrate (1) facing the functional layer stack (6) via the first and second contact tracks (20, 30). [7] Device according to one of the preceding claims, wherein the functional layer stack (6) comprises an organic active layer (63) which emits electromagnetic radiation during operation of the device. [8] Method for manufacturing a component (10), wherein a component (10) is manufactured according to one of the preceding claims, comprising the following steps: a) Providing the substrate (1); b) Applying the functional layer stack (6) to the substrate (1), c) Applying the barrier layer (8) to the functional layer stack (6), wherein the barrier layer (8) covers the functional layer stack (6) and forms the step (80) laterally to the functional layer stack (6), and d) Covering the step (80) with the encapsulation layer (9) so that the functional layer stack (6) is hermetically sealed laterally by the barrier layer (8) and the encapsulation layer (9). [9] Method according to the preceding claim, wherein the barrier layer (8) is attached to the functional layer stack (6) by means of the bonding layer (7) comprising an adhesive. [10] Method according to one of the two preceding claims, wherein the encapsulation layer (9) is formed on the barrier layer (8) by means of a physical deposition process from the vapor phase. [11] Method according to one of claims 8 to 9, wherein the encapsulation layer (9) is formed from a metal and is applied to the barrier layer (8) by means of an electroplating process. [12] Method according to any one of claims 8 to 11, wherein the encapsulation layer (9) is formed to cover the step (80) by a soldering process or by an ultrasonic soldering process. [13] Method according to any one of claims 8 to 12, wherein - the component is an organic light-emitting diode whose functional layer stack (6) is laterally hermetically sealed, and - in top view of the substrate (1) the encapsulation layer (9) completely covers the functional layer stack (6) and the barrier layer (8). [14] Component (10) comprising a substrate (1), a functional organic layer stack (6), a hermetically sealed self-supporting barrier layer (8) and an encapsulation layer (9), wherein - the functional layer stack (6) is arranged between the substrate (1) and the barrier layer (8), - the barrier layer (8) in plan view of the substrate (1) covers the functional layer stack (6) and forms a step (80) laterally of the functional layer stack (6) with the substrate (1) and / or with a layer arranged on the substrate (1), - the encapsulation layer (9) covers the step (80) so that the functional layer stack (6) is hermetically sealed laterally by the barrier layer (8) and the encapsulation layer (9), - the component is an organic light-emitting diode whose functional layer stack (6) is laterally hermetically sealed, - the barrier layer (8) is formed in the form of a film and has a vertical thickness (D8) between 10 µm and 1 mm inclusive, - the encapsulation layer (9) has a vertical thickness (D9) that differs by no more than 50% from the vertical thickness (D8) of the barrier layer (8), and - in top view of the substrate (1) the encapsulation layer (9) completely covers the functional layer stack (6) and the barrier layer (8).

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