Magnetic power coupling to an integrated circuit module

Abstract

A method comprising: providing an integrated circuit module (155) with an integrated circuit chip (150) and a secondary winding (140, 215) configured to generate an induced alternating current based on a magnetic flux; providing a primary winding (135, 230) outside and near the integrated circuit module coupled to a main power supply corresponding to an alternating current generating the magnetic flux; and converting the induced alternating current into a direct current with a voltage level to supply power to the integrated circuit chip (150).

Description

FIELD OF THE INVENTIONThe present invention relates to integrated circuits and more particularly relates to techniques for powering integrated circuits.BACKGROUNDConventional processors, such as central processing units (CPUs) and graphics processing units (GPUs), require a high current, low voltage power supply. A typical processor may require a power supply that provides a current up to 150 amperes (A) and a voltage of less than 1 volt (V). The provision of a high current, low voltage power supply on a package or module that houses the integrated circuit of the processor electrically causes a number of problems including voltage drop (i.e., IR drop) in the lead (e.g., trace fabricated on a printed circuit board) that connects a switching voltage regulator to the module, and high lead impedance resulting from the impedance of a power supply network that carries power from the module to the integrated circuit chip.In a data center, processor power typically originates from 480VAC (Volt AC) of three phase power that is downconverted to 240VAC or 120VAC and then downconverted to 12 VDC via a switching voltage regulator before being downconverted to the processor supply voltage (e.g., 3.3 VDC, etc.) by a second switching voltage regulator. The three step down conversion process results in significant losses. However, direct conversion from a high voltage power supply (e.g., 480VAC, 240VAC, or 120VAC) is problematic due to the isolation, isolation, and leakage current requirements associated with handling high voltage lines. Therefore, there is a need to address these problems and / or other problems that arise in the prior art. U.S. Pat. No. 6,597,593 B1 discloses a converter in an IC circuit which provides direct current for a functional circuit. US 2014 / 0 133186 A1 discloses a circuit in a power converter. It is an object of the invention to reduce losses during conversion.OVERVIEWThis object is achieved by the features of the independent claims. Preferred embodiments are described in the dependent claims. A magnetic coupling system for magnetic power supply is disclosed. An integrated circuit module includes an integrated circuit chip and a secondary winding configured to generate an induced alternating current in response to an alternating magnetic flux. A primary winding is disposed outside the integrated circuit module proximate the integrated circuit module and is coupled to a main power supply corresponding to an alternating current that generates the magnetic flux. The induced alternating current is converted to a direct current at a voltage level to supply power to the integrated circuit chip.BRIEF DESCRIPTION OF THE DRAWINGSFIG. 1A shows a flow diagram of a method 100 for providing power to an integrated circuit according to an embodiment; FIG. 1B illustrates a coupling system for magnetic power supply according to an embodiment; FIGS. 2A, 2B, and 2C show cross-sectional views of the magnetic power supply coupling system of FIG. 1B, according to an embodiment; FIGS. 2D and 2E show the PCB of FIGS. 2A, 2B, and 2C, according to an embodiment; FIG. 2F shows a cross-sectional view of the magnetic power supply coupling system of FIG. 1B with a primary winding implemented in the PCB according to an embodiment. FIG. 3A shows a primary full-bridge inverter and a secondary full-bridge rectifier configured as a coupling system for magnetic power supply according to an embodiment; FIG. 3B shows a primary half-bridge inverter and a secondary half-bridge rectifier configured as a coupling system for magnetic power supply according to an embodiment; FIG. 3C shows a primary flyback converter and a secondary rectifier configured as a magnetic power supply coupling system according to another embodiment; FIG. 3D shows a primary flyback converter and a further primary rectifier configured as a coupling system for magnetic power supply according to a further embodiment; FIG. 4A illustrates a multi-phase coupling system for magnetic power supply according to another embodiment; FIG. 4B shows a cross-sectional view of the magnetic power supply coupling system of FIG. 1B, according to an embodiment; FIG. 4C illustrates the unequipped PCB 410 of FIG. 4B, according to an embodiment; FIG. 4D shows a cross-sectional view of the PCB of FIG. 4B, according to an embodiment; and FIG. 5 illustrates an illustrative system in which the various architectures and / or functions of the various previous embodiments may be implemented.DETAILED DESCRIPTIONThe low voltage, low current electrical distribution problems associated with conventional processor power supplies and the high voltage voltage voltage signal handling problems required for direct conversion can be reduced by magnetically coupling power into an integrated circuit module. In the context of the following description, the integrated circuit module is a package that includes an integrated circuit chip and at least a portion of a transformer. An alternating current is supplied to a primary winding of the transformer to induce a changing magnetic field in the vicinity of a secondary winding of the transformer included in the integrated circuit module. The changing magnetic flux induces an alternating current in the secondary winding, and the alternating current is converted into a DC (direct current) voltage via a rectifier, and then downconverted into a supply voltage of the integrated circuit chip as needed.FIG. 1A shows a flow diagram of a method 100 for providing power to an integrated circuit according to an embodiment. Although the method 100 is described in connection with the systems of FIGS. 1B-2A-F, 3A-3D, 4A-4E, and 5, those skilled in the art will appreciate that any system that performs the method 100 is within the scope of embodiments of the present invention.In one embodiment, a magnetic power supply coupling system is configured to perform method 100. The magnetic power supply coupling system may be electrically connected to an integrated circuit chip to supply power to the integrated circuit chip. In step 105, an integrated circuit module is provided that includes an integrated circuit chip and a secondary winding configured to generate an induced alternating current based on a magnetic flux.In step 110, a primary winding is provided that is disposed outside the integrated circuit module proximate the integrated circuit module and is coupled to a main power supply corresponding to an alternating current that generates the magnetic flux. The magnetic flux is generated in the magnetic core of the primary winding and the secondary winding. Although the windings of transformers themselves are inductors, in the context of the following description, the windings are referred to in their property as a component of a transformer (i.e., an insulated winding on a core) rather than an inductor. The main power supply corresponds to a first voltage level and a first current, and may be a high voltage, low current power supply. In one embodiment, the first voltage level is a high voltage level and the first current is a small current. The power is the product of the first current and the first voltage. A first part of the magnetic core is a component of a primary inductor and is separated from the integrated circuit module. A second part of the magnetic core is a component of a secondary inductance and is included in the integrated circuit module.In one embodiment, the first portion of the magnetic core is a primary core formed by a C-shaped piece of magnetic material (e.g., ferrite), with a primary winding wound around at least a portion of the primary core. In the following description, the first current is an alternating current (AC) flowing through the primary winding, thereby generating the magnetic flux, and the magnetic flux changes depending on the alternating current. In one embodiment, the AC current is a square wave having a frequency between 100 kHz and 1 MHz. In the context of the following description, the primary core and the primary winding form the primary inductance. The primary inductance may serve as a high voltage primary side of a transformer including the magnetic core.In one embodiment, the second portion of the magnetic core is a secondary core formed by another C-shaped piece of magnetic material, with a secondary winding wound around at least a portion of the secondary core. In one embodiment, opposing ends of the primary core are physically coupled to opposing ends of the secondary core. In the following description, the secondary core and the secondary winding form the secondary inductance. The secondary inductance may serve as a low voltage secondary side of the transformer including the magnetic core.In step 115, the induced alternating current is converted to a direct current having a second voltage level to supply power to the integrated circuit chip. The alternating current is induced in the secondary winding by the changing magnetic flux and the induced current is converted into a second current to power the integrated circuit chip. An AC voltage induced in the secondary winding by the magnetic flux is converted into a DC voltage having the second voltage level to supply power to the integrated circuit chip. In an embodiment, the second voltage level at which the power is supplied to the integrated circuit chip is lower than a DC voltage level corresponding to the main power supply. In an embodiment, the induced current and the second current supplying power to the integrated circuit chip are each greater than the first current corresponding to the main power supply.The second voltage and the second current correspond to a power supplied to the integrated circuit, and may be a low voltage, high current power supply. In one embodiment, the second voltage level is a supply voltage for the integrated circuit, such as V dd. In an embodiment, a rectifier circuit is configured to receive the induced current and the induced voltage and generate the second current and the second voltage level. In an embodiment, the rectifier circuit is included in the package and is coupled to the integrated circuit chip via a filter circuit. In one embodiment, the rectifier circuit is a "synchronous rectifier" configured with MOSFETs.More illustrative information regarding optional functions / architectures of various embodiments will now be provided, which may or may not be established according to the desires of the user in connection with the preceding embodiments. It is to be clearly understood that the following information is provided for illustrative purposes and should not be considered as limiting in any way. For example, any of the following features may optionally be incorporated with or without the other features described.FIG. 1B illustrates a coupling system for magnetic power supply 130, according to an embodiment. The magnetic power supply coupling system 130 includes a primary winding 135 and an integrated circuit module 155 coupled to the primary winding 135 via a magnetic circuit. A magnetic flux 160 generated by the primary winding 135 flows through the magnetic circuit. In one embodiment, the primary winding 135 is replaced with a primary inductance having a primary winding and the first portion of the magnetic core that is a piece of magnetic material forming a primary core.The integrated circuit module 155 includes a secondary winding 140, a rectifier circuit 145, an inductor 148, and an integrated circuit chip 150. In one embodiment, the secondary winding 140 is replaced with a secondary inductance that includes a secondary winding and the second portion of the magnetic core that is a piece of magnetic material that forms a secondary core. In one embodiment, at least a portion of the secondary core is enclosed by the secondary winding 140 to form a low voltage secondary winding of a transformer.The rectifier circuit 145 is electrically connected to the secondary winding 140 and may be fully or partially integrated in the integrated circuit chip 150. The integrated circuit chip 150 may be packaged on a package substrate in a device package that also includes the rectifier circuit 145 and / or the inductor 148 and at least a portion of the secondary winding 140 to form the integrated circuit module 155. In an embodiment, the secondary winding 140 and at least a portion of the secondary core are included in the integrated circuit module. A remaining portion of the secondary core (i.e., the opposite ends) may protrude outward from the component package of the integrated circuit module 165.The rectifier circuit 145 is configured to convert current and voltage induced in the secondary winding 140 into a second current and voltage level, which are supplied to the integrated circuit chip 150. The component package may be electrically connected to a PCB. In one embodiment, the inductor 148 may be omitted.FIG. 2A shows a cross-sectional view of the magnetic power supply coupling system 130 of FIG. 1B, according to an embodiment. A secondary core 220 and a secondary winding 215 function as a low voltage secondary winding of a transformer. The integrated circuit module 155 shown in FIG. 1B includes the integrated circuit chip 150 and may also include a package substrate 205, the secondary core 220, and the secondary winding 215. In an embodiment, the second part of the magnetic core of the transformer is integrated into the integrated circuit module 155 by attaching a U- or C-shaped piece of magnetic material to the back side of the package substrate 205 as the secondary core 220. A piece of copper tape may be laid over the U- or C-shaped piece of magnetic material to provide the secondary winding 215 for the secondary inductance. The secondary winding 215 is electrically coupled to the package substrate 205 at opposite ends of the copper ribbon to supply current and voltage to the integrated circuit module 155. The current and voltage are induced in the secondary winding 215 by the magnetic flux. A magnetic circuit is completed by a primary core 225 and a primary winding 230 which serve as a high voltage primary inductance of the transformer to generate the magnetic flux.In one embodiment, the primary core 225 is a U- or C-shaped piece of magnetic material inserted into a PCB 210 below the package substrate 205. In one embodiment, the PCB 210 is a low voltage PCB. In one embodiment, the primary core 225 is formed from two L-shaped pieces of magnetic material to facilitate mounting a bobbin on the primary core 225. In other embodiments, the shape of the magnetic core formed by the primary core 225 and the secondary core 220 may be different from the "pear shape" shown in FIG. 2A. For example, the shape of the magnetic core may be a rectangular, oval, or other closed shape. The circumference of the primary core 225 and / or the secondary core 220 may be different over the length of the respective core. For example, the circumference of the secondary core 220 may be smaller near the secondary winding 215. Similarly, the circumference of the primary core 225 may become larger as the distance from the opposite ends passing through the PCB 210 increases. A magnetic resistance of the magnetic core decreases as the cross-sectional area of the core increases, magnetic resistance=I / μA, where I is the length of the circle, μ is the permeability of the material, and A is the cross-sectional area.The integrated circuit module 155 may be electrically connected to the PCB 210 by conventional means, such as an electrical coupling 222. Examples of electrical coupling mechanisms include solder balls, a connector, a socket, or the like, which may connect the package substrate 205 to the PCB 210 to exchange signals between the two. The primary core 225 is configured to pass through one or more openings in the PCB 210 and is physically coupled to the secondary core 220. In an embodiment, the primary core 225 is pressed against the secondary core 220 by mechanical springs or clamps, such that the primary core 225 is physically coupled to the secondary core 220 and forms the magnetic circuit. In one embodiment, the primary core 225 is physically coupled to the secondary core 220 using solder material or adhesive. In one embodiment, primary winding 230 is provided for high voltage signals and secondary winding 215 is provided for low voltage signals.In one embodiment, high voltage signals are not transported by the PCB 210 or the integrated circuit module 155. Indeed, in one embodiment, there are no electrical power connections from the PCB 210 to the integrated circuit module 155, rather power is supplied to the integrated circuit module 155 magnetically by the flux flowing through the magnetic circuit that induces current and voltage in the secondary winding.The magnetic power supply coupling system 130 may avoid any voltage drops (i.e., IR losses) associated with distributing power between the primary inductor and the integrated circuit module 155. The second voltage level and the second current provide low voltage, high current direct current (DC) power generated directly in the integrated circuit module 155 by the rectifier circuit 145. Therefore, in one embodiment, the transport of the low voltage supply to the integrated circuit module 155 is unnecessary, and there are no voltage drops from the distribution of the low voltage supply. Compared to a conventional implementation that converts a high voltage, low current AC power supply to a low voltage, high current DC power supply (i.e., a separate step-up-down converter) for use by the integrated circuit chip 150, the number of magnetic components can be reduced because only a single stage is required for conversion instead of three stages.FIG. 2B shows another cross-sectional view of the magnetic power supply coupling system 130 of FIG. 1B, according to an embodiment. The cross-sectional view shown in FIG. 2B is rotated 90 degrees about a vertical axis compared to the cross-sectional view shown in FIG. 1A. As shown in FIG. 2B, a U- or C-shaped piece of magnetic material is bonded to the back surface of the package substrate 205 to form the secondary core 220, and a piece of copper tape is disposed over the U- or C-shaped piece of magnetic material. The copper tape forms the secondary winding 215 and is electrically connected to the package substrate 205 at opposite ends of the copper tape to supply the induced current and voltage to the integrated circuit module 155. The current and voltage are induced in the secondary winding 215 by the magnetic flux generated in the magnetic core. The magnetic circuit is closed by the primary core 225. The primary winding 230 is wound around the primary core and serves as a high voltage primary winding of the transformer.FIG. 2C shows another cross-sectional view of the magnetic power supply coupling system 130 of FIG. 1B, according to an embodiment. As shown in FIG. 2C, the U- or C-shaped piece of magnetic material is connected to the back side of the package substrate 205 forming the secondary core 220, and the piece of copper tape positioned over the U- or C-shaped piece of magnetic material is at least partially recessed into a package substrate 255. Opposite ends of the secondary core 225, which are physically connected to the primary core 225, may protrude from a component package enclosing the integrated circuit module 155. The integrated circuit module 155 may include the integrated circuit chip 150, the package substrate 255, the secondary winding 215, and at least a portion of the secondary core 220.The transformer formed by the primary core 225 and primary winding 230, as well as the secondary core 220 and secondary winding 215, may be used in an inverter circuit configuration electrically coupled to the primary winding 230 that is further described in connection with FIGS. 3A-3D. The turns ratio between the primary winding 230 and the secondary winding 215 is selected such that when the voltage across the primary winding 135 is a high voltage level associated with a main power supply (e.g., 120VAC, 240VAC, 480VAC), the induced voltage is at a low voltage level (e.g., 2 VAC, etc.), it can be more easily converted to a DC voltage level by the rectifier circuit 145. In one embodiment, the frequency of the main power supply is 500 kHz. When the AC voltage is applied to the primary winding 230, the alternating current flows through the primary winding 230 and a low level voltage (e.g., nominally 2VAC) is induced at the secondary winding 215. With a single turn in secondary winding 215 of the secondary inductor (as shown in FIGS. 2A, 2B, and 2C ), the number of turns required in primary winding 230 is 60, 120, or 240 (for 120 VAC, 240 VAC, or 480 VAC with a 1.4 times peak voltage). Compared to the number of turns used in a full-bridge inverter circuit, the number of turns is halved for a half-bridge inverter circuit configuration. In one embodiment, a second piece of copper tape runs over another piece of magnetic material to form a storage inductor L 1, such as the storage inductor 148 shown in FIG. 1B.FIG. 2D illustrates a PCB 260 that may be used in place of the PCB 210 of FIGS. 2A, 2B, and 2C, according to an embodiment. Two holes 240 for physically coupling the secondary core 220 to the primary core 225 are formed through the PCB 260. A primary winding 235 is arranged as conductive traces on the PCB 260 to be each spiral around a hole 240 in opposite directions (e.g., clockwise and counterclockwise) as shown by the conceptual primary winding 232. The conductive traces provide an electrical connection through which the first current flows.FIG. 2E illustrates the PCB 260 of FIG. 2D, according to an embodiment. The traces on the PCB 260 that form the primary winding 235 appear as circles instead of spirals. The gap in each circle is where the web is routed to the next deeper layer of the PCB 260. The number of layers in the PCB 260 may limit the number of turns in the primary winding 230, assuming that each turn occupies a separate layer of the PCB 260.FIG. 2F shows a cross-sectional view of the magnetic power supply coupling system 130 of FIG. 1B with a primary winding 235 configured in the PCB 260 according to an embodiment. The turns of primary winding 235 are traces in PCB 260. As shown in FIG. 2F, the U- or C-shaped piece of magnetic material forming the secondary core 220 is at least partially recessed into the package substrate 255, and the piece of copper tape disposed over the U- or C-shaped piece of magnetic material is also at least partially recessed into a package substrate 255. Similarly, primary winding 235 is recessed into PCB 260.FIG. 3A shows a phase of a primary full-bridge inverter 310 and a secondary full-bridge rectifier 320 configured as a coupling system for magnetic power supply according to an embodiment. The secondary full-bridge rectifier 320 may be configured as the rectifier circuit 145 shown in FIG. 1B. The integrated circuit 300 is implemented as the integrated circuit chip 150 shown in FIG. 1B. In one embodiment, integrated circuit 300 is a processor circuit. In one embodiment, L1is the storage inductor 148 shown in FIG. 1B.Two primary full-bridge inverters 310 may be included in the magnetic flux source 135 shown in FIG. 1B, where each primary full-bridge inverter 310 is one of two synchronized phases used to generate the alternating current and voltage in the primary winding 135. The amount of current that can be provided by each of the two phases is limited so that each phase provides half of the current and half of the power. Each phase comprises a specific transformer. In one embodiment, each of the two phases receives a 480VAC155 mA feed corresponding to the main power supply and generates a 1VD 75A output corresponding to the power supply for integrated circuit chip 150. In one embodiment, a 3-phase rectifier circuit and a storage capacitor are arranged between the main power supply and V in IN. In another embodiment, a 3-phase power factor correction circuit is provided between the main power supply and V IN.In one embodiment, the primary full bridge inverter 310 receives the main power supply at input V IN and generates the magnetic flux 160 in a primary inductance T1. The magnetic flux is generated when a voltage is applied across the inductor T 1. The magnetic flux 160 induces an AC voltage and a current corresponding to a secondary inductance T 2 and received by the rectifier circuit 145. In one embodiment, the secondary full bridge rectifier 320 generates an output voltage level V OUT of 1 VDCand an output current I OUT of 75A due to the magnetic flux 160. The inductor L 1 and the capacitor C 1 are a filter circuit that smoothes the induced voltage to generate a steady V OUT. V OUT is the second voltage level, and I OUT is the second current generated based on the induced voltage and the current. The transformer (i.e., T 1 and T 2) is shared, wherein the secondary core of the secondary inductor T 2 is integrated into the integrated circuit module 155, and wherein the primary core of the primary inductor T 1 is configured in a high voltage module that is physically coupled to the secondary core.The primary full bridge inverter 310 switches the primary winding 230 using four high voltage (e.g., up to 600 volts or more) power metal oxide semiconductor field effect transistors (MOSFETs) M 1, M 2, M 3, and M 4. The transistors are driven sequentially, activating transistors M2 and M4 to apply a first voltage level V IN( e.g., +480 volts) to primary winding 230, and thereafter turning off transistors M2 and M4 and turning on transistors M1 and M4 to form a free-wheeling path for the first current through primary winding 230 with zero V voltage across primary winding 230. Thereafter, transistor M4 is turned off and transistor M3 is turned on (with M1 still on) to apply the first voltage level in the reverse direction (e.g., -480 volts) to primary winding 230. Finally, transistors M 1 and M 3 are turned off and transistors M 2 and M 3 are turned on to provide a free wheeling path for the first current through primary winding 230 in the other direction. The first current changes direction through the primary winding 230 and generates the magnetic flux 160 in the magnetic core. In one embodiment, the transformer formed by T1 and T2 has a turns ratio of 240:1, with 240 turns on primary winding 230 and 1 turn on secondary winding 215. Thus, when a first AC voltage of + / -480 volts is applied to the primary winding 230, + / -2 volts occurs as the induced voltage across the secondary winding 215.The switching events for turning on and off the transistor pairs in the primary full bridge inverter 310 may be timed such that a single transistor pair is activated and turns off before another transistor is activated and turns on. A dead time when only one transistor is turned on or no transistors are turned on allows the first current to charge or discharge a switching node so that the next activation operation occurs at a zero crossing of the transistors being activated. For example, when M2 and M4 transition to M1 and M4, M2 is switched before M1. The drain of M1 is discharged, whereby M1 turns on at a voltage of zero applied to M1 when it is driven. Switching with a voltage of zero across a transistor reduces the power losses due to the switching operation.The induced voltage is rectified by a secondary full bridge rectifier 320 comprising transistors M 5, M 6, M 7 and M 8. In one embodiment, transistors M 5, M 6, M 7, and M 8 are low voltage planar MOSFETs. Therefore, the transistors M 5, M 6, M 7, and M 8 can be integrated into the integrated circuit chip 150 including the integrated circuit 300.When transistors M 2 and M 4 of primary full-bridge inverter 310 of primary full-bridge inverter 310 are activated, transistors M 6 and M 8 are activated (and transistors M 5 and M 7 are deactivated) to apply the induced voltage level (e.g., +2 V) to inductor L 1. Similarly, when transistors M 1 and M 3 are activated, transistors M 5 and M 7 are activated (and transistors M 6 and M 8 are deactivated) to apply the induced voltage level (e.g., +2 V) to inductor L 1. Note that although the polarity of the voltage at T2 changes, the voltage at L1 is positive due to the signals driving transistors M5, M6, M7 and M8. Whenever transistors M1 and M4 are activated or transistors M2 and M3 are activated, all four transistors M5, M6, M7 and M8 are activated to provide a low impedance path around a loop through L1 and a filter capacitor C1 while the transformer is short circuited.The output voltage of the secondary full-bridge rectifier 320 is controlled by the controlling widths of alternating polarity pulses of the first voltage level (e.g., + / -480 volt pulses) generated by controlling the transistors M 1, M 2, M 3, and M 4 such that the polarity changes at T 1. The second current I OUT is supplied to the integrated circuit 300. Control may be provided as part of the primary full bridge inverter 310. Signals from the integrated circuit module 155 are provided to the controller to sense V OUT with the capacitor C1, and signals from the controller are transmitted to the integrated circuit module 155 to synchronize the drive signals that enable and disable the transistors M 5, M 6, M 7, and M 8.If isolation between T 1 and T 2 is not required, a common ground line may be provided for the primary full-bridge inverter 310 and the secondary full-bridge rectifier 320. In one embodiment, a controller configured to generate the control signals for the transistors is located on the primary side of the system and control signals exchanged between the primary full bridge inverter 310 and the secondary full bridge rectifier 320 are routed via a low voltage connection unit. If isolation between T1 and T2 is required, the control signals may be transmitted between the secondary full-bridge rectifier 320 and the primary full-bridge inverter 310 by optical or magnetic coupling. When T 1 and T 2 are isolated from each other, the low power supplies (e.g., ground) of the secondary full-bridge rectifier 320 and the primary full-bridge inverter 310 may be at different voltage levels.FIG. 3B shows a primary half bridge inverter 315 and the secondary full bridge rectifier 320 configured as a magnetic power supply coupling system according to an embodiment. Two primary half-bridge inverters 315 may be included in the magnetic flux source 135 shown in FIG. 1B, where each primary half-bridge inverter 315 and transformer is one of two synchronized phases used to generate the alternating current and the AC voltage across the primary winding 135. In the primary half bridge inverter 315, a capacitor C 3 and a resistor R 3 are arranged in parallel with each other, and replace the transistor M 3 in the primary full bridge inverter 310. Similarly, a capacitor C4 and a resistor R4 are connected in parallel and replace the transistor M4 in the primary full-bridge inverter 310. The voltage at the node between resistors R3 and R4 is maintained at about half the voltage level of V IN.The transistors are driven in sequence, activating transistor M2 to apply a first voltage level V IN / 2 ( for example +240 volts) to the node between R3 and R4. The AC voltage across primary winding 230 is V IN- V IN / 2. Subsequently, transistor M2 is deactivated to provide a free wheeling path for the first current through primary winding 230, and the voltage across primary winding 230 drops to 0 V when the magnetic field drops and current is induced in T2. Then, transistor M1 is activated to apply the first voltage level V IN / 2 - GND in the opposite direction (e.g., -240 volts) to the primary winding 230. Finally, transistor M 1 is deactivated to provide a free-wheeling path for the first current through primary winding 230 in the other direction. The first current changes direction through the primary winding 230 and generates the magnetic flux 160 in the magnetic core, and an induced voltage occurs at the secondary winding 215.FIG. 3C shows a primary flyback converter 330 and a secondary rectifier 340 configured as a coupling system for magnetic power supply according to another embodiment. In the primary flyback converter 330, the transistors M 1, M 2, M 3, and M 4 included in the primary full-bridge inverter 310 are replaced with a transistor M 10 and a dissipative element 325 (for example, a damping element). In one embodiment, transistor M 10 is a power MOSFET. Transistor M10 is activated to charge the magnetizing inductance of primary inductor T1. Thereafter, the transistor M 10 is deactivated and the magnetic flux stored in T 1 is discharged via the second inductance T 2 when the transistor M 10 is deactivated, thereby inducing current through T 2 and a voltage at T 2. When M10is deactivated, energy stored in the leakage inductance of the transformer is dissipated via the dissipative element 325.In comparison with the secondary full-bridge rectifier 320, the inductance L 1 is omitted from the secondary rectifier 340, and the transistors M 5, M 6, M 7 and M 8 are replaced by a transistor M 9. Transistor M 9 is activated when transistor M 10 is deactivated, and transistor M 9 is deactivated when transistor M 10 is activated. A body diode 342 inherent to the transistor M 9 indicates a direction of the current induced by the magnetic flux 160. The inductance L 1 may be omitted from the secondary rectifier 340 because the magnetizing inductance of the transformer functions as a storage inductance.FIG. 3D shows a primary flyback converter 335 and the secondary rectifier 340 configured as a magnetic power supply coupling system according to another embodiment. In the primary flyback converter 335, the transistors M 1, M 2, M 3, and M 4 included in the primary full-bridge inverter 310 are replaced with transistors M 11 and M 12 and diodes 336 and 338. In one embodiment, transistors M 11 and M 12 are power MOSFETs. Transistors M11 and M12 are activated to charge primary inductor T1. Thereafter, the transistors M 11 and M 12 are deactivated. Current flowing through T 1 generates a magnetic field corresponding to the magnetic flux 160. The magnetic flux that occurs when M 11 and M 12 are turned on discharges via the secondary inductor T 2 when the transistors M 11 and M 12 are deactivated, so that the voltage at T 1 varies and a current is induced by T 2 and a voltage at T 2.The transistor M 9 in the secondary rectifier 340 is activated when the transistors M 11 and M 12 are deactivated, and M 9 is deactivated when the transistors M 11 and M 12 are activated. When transistors M11 and M12 are deactivated, the leakage inductance of primary inductance T1 is relieved by diodes 336 and 338. Diodes 336 and 338 are configured to return the energy stored in the leakage inductance of the transformer to the power supply. In another embodiment, the primary flyback inverter 335 is replaced with a forward inverter circuit.A polyphase coupling system for magnetic power supply can be established by using multiple inverter-rectifier pairs and corresponding transformers. FIG. 4A illustrates a polyphase coupling system for magnetic power supply 400 according to another embodiment. The transformer corresponding to each primary inverter 430 and secondary rectifier 420 operates during one of four different phases to supply the second voltage and current to the integrated circuit 300. In one embodiment, each phase is driven in an interleaved manner to minimize ripple in V in. It should be noted that the multiple phases may use a common "return path" branch of the transformer as long as each phase has its own "input branch" to ensure that the magnetic flux of one phase is separated from turns of the other phases.The four primary inverters 430 generate a magnetic flux 460 that induces a current and voltage in a corresponding secondary rectifier 420 during one of the four phases. The primary inverters 430 and the secondary rectifiers 420 may be implemented as the primary full-bridge inverter 310 and the secondary full-bridge rectifier 320, the primary half-bridge inverter 315 and the secondary full-bridge rectifier 320, the primary flyback converter 330 and the secondary rectifier 340, respectively, or as the primary flyback converter 335 and the secondary rectifier 340.FIG. 4B shows a cross-sectional view of the magnetic power supply coupling system of FIG. 1B, according to an embodiment. The filter capacitor C 1 included in the rectifier circuit 145 (shown in FIGS. 3A-3D ) may be configured as an array of capacitors 410, where the capacitors are connected in parallel and disposed on the package substrate 205. The array of capacitors 410 is disposed on the opposite side of the package substrate 205 as compared to the integrated circuit chip 150. The integrated circuit module 155 shown in FIG. 1B may include the integrated circuit chip 150, the package substrate 205, the capacitor array 410, the secondary winding 215, and at least a portion of the secondary core 220. The integrated circuit module 155 is electrically coupled to a PCB 410. The PCB 410 may replace the PCB 210 shown in FIGS. 2A-2C and the PCB 260 shown in FIGS. 2D-2F.FIG. 4C illustrates the un-populated PCB 410 of FIG. 4B, according to an embodiment. The area occupied by the array of capacitors 410 that lies on the PCB 410 under the package substrate 205 is the capacitor array mounting area 405. The PCB 410 may include a single hole or pair of holes for coupling the secondary core 220 to the primary core 225 for each small transformer, wherein a set of the small transformers each form a transformer for a phase of multiple phases. In an embodiment, a portion (e.g., a pair) of the set of transformers may implement a phase of the magnetic power supply coupling system 400 shown in FIG. 4A.FIG. 4D shows a cross-sectional view of the PCB 410 of FIG. 4B, according to an embodiment. The cross-sectional view is a plane that passes through the secondary cores 220 as a section, wherein the secondary windings 215 are electrically connected to the package substrate 205. The secondary core 220 of each small transformer is coupled to a corresponding primary core 225 disposed on the bottom of the PCB 410. A portion of the set of transformers may implement a phase of the magnetic power supply coupling system 400 shown in FIG. 4A.FIG. 5 illustrates an illustrative system 500 in which the various architectures and / or functions of the various previous embodiments may be implemented. As shown, a system 500 is provided that includes at least one central processor 501 connected to a communication bus 502. The communication bus 502 may be configured using any suitable protocol, such as one or more protocols in the form of PCI (peripheral component interconnect), PCI express, AGP (accelerated graphics port), HyperTransport, or by one or more other bus protocols or one or more point-to-point communication protocols. The system 500 further includes a main memory 504. Control logic (software) and data are stored in main memory 504, which may take the form of random access memory (RAM).The system 500 further includes input devices 512, a graphics processor 506, and a display 508, i.e., a conventional CRT (cathode ray tube), an LCD (liquid crystal display), an LED (light emitting diode), a plasma display, or the like. User input is received by the input devices 512, for example, a keyboard, a mouse, a touch-sensitive pad, a microphone, and the like. In one embodiment, graphics processor 506 may include multiple shading modules, a raster module, etc. Each of the foregoing modules may be disposed on a single semiconductor platform to form a graphics processing unit (GPU).In the present specification, a single semiconductor platform refers to a single semiconductor-based integrated circuit or chip. It should be noted that the term single semiconductor platform also includes multi-chip modules with improved connectivity that simulate on-chip operation and offer substantial improvements over the use of a conventional central processing unit (CPU) and bus implementation. Of course, the various modules may also be separately arranged or provided in various combinations of semiconductor platforms according to the desires of the user.The system 500 may also include a secondary storage 510. The secondary storage 510 includes, for example, a hard disk drive and / or a removable storage drive representing a floppy disk drive, a magnetic tape drive, a compact disk drive, a digital versatile disk (DVD) drive, a recording device, a universal serial bus (USB) flash memory. The removable storage drive reads from and / or writes to a removable storage unit in a well known manner.Computer programs or computer control logic algorithms may be stored in main memory 504 and / or secondary memory 510. Such computer programs, when executed, enable system 500 to perform various functions. Memory 504, memory 510, and / or any other memory are possible examples of computer readable media.In one embodiment, the architecture and / or functions of the various previous figures may be implemented in connection with the central processor 501, the graphics processor 506, an integrated circuit (not shown) having at least a portion of the characteristics of both the central processor 501 and the graphics processor 506, a chipset (i.e., a group of integrated circuits configured to operate as a unit and sold as such to perform associated functions, etc.), and / or another integrated circuit for that purpose.Further, the architecture and / or functions of the various previous figures may be implemented in the context of a general computer system, a printed circuit board system, a game console system tailored for entertainment purposes i9st, an application specific system, and / or any other desired system. For example, system 500 may take the form of a desk top computer, a portable computer, a server computer, a worksite computer, game consoles, an embedded system, and / or any type of logic. Furthermore, the system 500 may take the form of various other devices including, without limitation, a personal digital assistant (PDA), a cellular telephone device, a television, etc.Although not shown, the system 500 may be connected to a network (e.g., a telecommunications network, a local area network (LAN), a wireless network, a wide area network (WAN) such as the Internet, a device-to-device network, a cable network, or the like) for communication purposes.

Claims

A method comprising: providing an integrated circuit module (155) having an integrated circuit chip (150) and a secondary winding (140, 215) configured to generate an induced alternating current based on magnetic flux; providing a primary winding (135, 230) external to the integrated circuit module and proximate the integrated circuit module with coupling to a main power supply corresponding to an alternating current generating the magnetic flux; and converting the induced alternating current to a direct current having a voltage level to supply power to the integrated circuit chip (150).The method of claim 1, wherein the voltage level is lower than a voltage level associated with the main power supply.The method of claim 1, wherein the direct current is greater than the alternating current that generates the magnetic flux.The method of claim 1, further comprising a full bridge inverter circuit (310) coupled to the primary winding and configured to generate the alternating current that generates the magnetic flux.The method of claim 4, wherein the primary winding (135, 230) comprises a conductive trace formed as part of a printed circuit board.The method of claim 1, wherein a primary inductance comprises a first portion of a magnetic core and the primary winding (135, 230), and a secondary inductance comprises a second portion of the magnetic core and the secondary winding.The method of claim 6, wherein the first portion of the magnetic core is physically coupled to the second portion of the magnetic core.The method of claim 6, wherein the secondary winding comprises a single winding over the second portion of the magnetic core.The method of claim 6, wherein the second portion of the magnetic core is at least partially recessed into a package substrate on which the integrated circuit chip is mounted.The method of claim 1, wherein a rectifier circuit connected to the secondary winding is configured to convert the induced alternating current to the direct current having the voltage level to supply power to the integrated circuit chip.The method of claim 10, further comprising an inductor coupled between the rectifier circuit (145) and the integrated circuit chip.A magnetic power supply coupling system comprising: an integrated circuit module (155) comprising: an integrated circuit chip (150); and a secondary winding (140, 215) configured to generate an induced alternating current based on a magnetic flux, wherein the induced alternating current is converted to a direct current at a voltage level for supplying power to the integrated circuit chip; and a primary winding (135, 230) external to the integrated circuit module (155) and proximate to the integrated circuit module, coupled to a main power supply corresponding to an alternating current that generates the magnetic flux.The magnetic power supply coupling system of claim 12, further comprising a rectifier circuit (145) connected to the secondary winding (140, 215) and configured to convert the induced alternating current to the direct current at the voltage level.The magnetic power supply coupling system of claim 12, wherein the voltage level is lower than a voltage level associated with the main power supply.The magnetic power supply coupling system of claim 12, wherein the direct current is greater than the alternating current that generates the magnetic flux.The magnetic power supply coupling system of claim 12, further comprising a full bridge inverter circuit (310) connected to a primary winding of the primary winding and configured to generate the alternating current that generates the magnetic flux.The magnetic power supply coupling system of claim 12, wherein a primary inductance comprises a first portion of a magnetic core and the primary winding (135, 230), and a secondary inductance comprises a second portion of the magnetic core and the secondary winding.An integrated circuit module (155), the integrated circuit module comprising: an integrated circuit chip (150); a secondary winding (140, 215) configured to generate an induced alternating current based on magnetic flux, the magnetic flux being generated by a primary winding (135, 230) external to the integrated circuit module and coupled to a main power supply corresponding to an alternating current; and a rectifier circuit (145) configured to convert the induced alternating current into a direct current at a voltage level for supplying power to the integrated circuit chip.The integrated circuit module of claim 18, wherein the voltage level is lower than a voltage level associated with the main power supply.The integrated circuit module of claim 18, wherein the direct current is greater than the alternating current that generates the magnetic flux.

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