Electronic component and method for its manufacture

Abstract

Electronic component comprising a printed circuit board (30) and an electronic component (10), in which - the electronic component (10) comprises a substrate (11), an encapsulation layer (13), an electronic structure (12) arranged between the substrate (11) and the encapsulation layer (13), and at least one first electrically conductive contact layer (14) arranged next to the encapsulation layer (13) on the substrate (11) and electrically connected to the electronic structure (12), - the printed circuit board (30) comprises a carrier layer (32) and at least one second electrically conductive contact layer (31), - the printed circuit board (30) is arranged next to the encapsulation layer (13) on the substrate (11), - the first electrically conductive contact layer (14) and the second electrically conductive contact layer (31) are electrically connected to each other, and - the carrier layer (32) and the encapsulation layer (13) each have at least one alignment structure (20) which interlock and define the position of the printed circuit board (30) to the electronic component (10) in at least one spatial direction, wherein - the encapsulation layer (13) and the support layer (32) have mutually facing end faces (231, 232) on which the at least one alignment structure (20) is formed, wherein the at least one alignment structure (20) on the encapsulation layer (13) has the contour of a recess (211, 212) or a tab (221, 222) and the at least one alignment structure (20) on the support layer (32) has the contour of a tab (221, 222) or a recess (211, 212), wherein the at least one alignment structure (20) on the encapsulation layer (13) extends in a principal extent plane of the encapsulation layer (13) and wherein the at least one alignment structure (20) on the support layer (32) extends in a principal extent plane of the support layer (32), and wherein the at least one alignment structure (20) on the carrier layer (32) and at least one alignment structure (20) on the encapsulation layer (13) are formed in such a way thatthat the tab (221, 222) can be inserted into the recess (211, 212), and , - the tab (221, 222) and / or the recess (211, 212) are designed in such a way that the tab (221, 222) at least partially releases itself from the recess (211, 212) under a predetermined tensile or compressive load.

Description

[0001] The present invention relates to an electronic component, in particular an optoelectronic component, comprising an electronic component and a printed circuit board, as well as a method for manufacturing such an electronic component.

[0002] Publication DE 10 2014 104 247 A1 relates to an OLED display device and an associated flexible printed circuit board.

[0003] The publication DE 10 2013 105 128 A1 describes an optoelectronic component.

[0004] Publication WO 2015 / 014 906 A1 also concerns an optoelectronic component.

[0005] One task to be solved is to specify such an electronic component that is particularly reliable and efficient to manufacture and mechanically robust. Another task to be solved is to specify a method for manufacturing such an electronic component.

[0006] These problems are solved by an electronic component with the features of claim 1 and by a method with the features of claim 9. Advantageous embodiments of the electronic component and the method are specified in the dependent claims.

[0007] The electronic component comprises an electronic component. This electronic component can be an optoelectronic component, in particular an organic optoelectronic component. The optoelectronic component can be configured to emit and / or detect electromagnetic radiation, especially light, during operation. For example, this electronic component could be an organic light-emitting diode (OLED).

[0008] The electronic component comprises an electronic structure. If the electronic structure is an optoelectronic structure, it has an active area in which electromagnetic radiation can be generated or detected during intended use.

[0009] The electronic component further comprises a substrate on which the electronic structure is arranged. The substrate is, in particular, one or essentially the sole supporting component of the electronic component, which provides the component with at least part of its mechanical stability. The substrate can, for example, be transparent to radiation generated or to be detected in the active area of ​​the electronic component.

[0010] The electronic component further comprises an encapsulation layer that covers the electronic structure on the side facing away from the substrate, in particular completely covering it except for contact layers for electrically connecting the electronic structure. The side of the electronic structure facing away from the substrate can be in direct contact with the encapsulation layer. The encapsulation layer can also cover the side faces of the electronic structure. The side faces are the surfaces that connect the surface of the electronic structure facing the substrate and the surface facing away from the substrate. The encapsulation layer preferably also covers at least a portion of the surface of the substrate facing the electronic component in areas where the substrate is not covered by the electronic structure.Therefore, all outer surfaces of the electronic structure are either covered by the substrate or by the encapsulation layer.

[0011] The encapsulation layer can be multilayered, so that its properties result from the properties of the individual or multiple sublayers. One sublayer can be particularly gas-tight, giving the encapsulation layer a particularly high degree of hermeticity. This means that the encapsulation layer preferably consists, at least partially, of a material, such as metal or ceramic, especially aluminum, into which gases and moisture have particularly poor penetration. The encapsulation layer then largely prevents contact between the electronic structure and gases, especially oxygen or process gases, or moisture. Furthermore, the encapsulation layer can be reflective for radiation generated or detected in the active region of the optoelectronic structure.Furthermore, the encapsulation layer can comprise a material, such as aluminum, which is particularly robust against mechanical stress. This prevents the encapsulation layer from being breached by scratches on its surface. The encapsulation layer can also have a heat-distributing effect, so that heat generated during the component's operation is dissipated particularly efficiently. For this purpose, the encapsulation layer is formed, for example, from a metal, especially aluminum.

[0012] The electronic component further comprises at least one first electrical contact layer, which consists of an electrically conductive material, for example, a metallic material. The electronic component can be electrically contacted via this first electrical contact layer and, for example, connected to an electronic control circuit. The main extent plane of the first electrical contact layer is, for example, parallel to the main extent plane of the substrate. Furthermore, the first electrical contact layer is located on the surface of the substrate facing the encapsulation layer in an area that is not covered by the encapsulation layer.

[0013] The electronic component also comprises a printed circuit board, in particular a flexible printed circuit board, which includes at least one substrate layer, at least one conductive track, and at least one second electrical contact layer. The substrate layer is preferably made at least substantially of an electrically insulating material, in particular a flexible electrically insulating material. The conductive track is made substantially of an electrically conductive material, in particular metal, and is electrically connected to the second electrical contact layer. The second electrical contact layer is also made substantially of an electrically conductive material, in particular metal, and has an area that is not covered by the substrate layer.

[0014] The substrate layer and the encapsulation layer preferably each have a principal extent plane. The printed circuit board (PCB) is arranged on the area of ​​the substrate not covered by the encapsulation layer, adjacent to the encapsulation layer. The position of the PCB relative to the electronic component, perpendicular to the principal extent plane of the encapsulation layer, is defined by the PCB resting on the substrate or the first electrical contact layer at that point.

[0015] The substrate layer and the encapsulation layer each have at least one interlocking alignment structure. These serve to align the printed circuit board (PCB) relative to the electronic component in at least one spatial direction by means of a mechanical stop. In other words, the alignment structures define the position of the PCB relative to the electronic component in at least one spatial direction.

[0016] The carrier layer and the encapsulation layer have opposing end faces, on which the alignment structure is formed. The alignment structure formed on the encapsulation layer preferably extends at least substantially in the principal plane of the encapsulation layer. The alignment structure formed on the carrier layer preferably extends at least substantially in the principal plane of the carrier layer. Perpendicular to the respective principal plane, the alignment structure has the contour of a recess or a tab. The tab and the recess can be formed on either the encapsulation layer or the carrier layer. The alignment structures are designed such that the encapsulation layer and the carrier layer are complementary to each other.In this case, "complementary" means that for each tab on the carrier layer or encapsulation layer, the other component has a corresponding recess. If the carrier layer has a tab, a recess is formed on the end face of the encapsulation layer facing the carrier layer, into which the tab can be inserted. If the encapsulation layer has a tab, a recess is formed on the end face of the carrier layer facing the encapsulation layer, into which the tab can be inserted.

[0017] The contours of the tab and the recess are designed such that the tab can be inserted into the recess. "Insertable" in this context means that the printed circuit board can be positioned on the substrate so that the recess contour laterally surrounds the tab contour. This means the tab does not lie on the layer in which the recess is formed.

[0018] The tab and the recess can be shaped such that they have positional play relative to each other. This means that the tab can be moved within the recess, essentially parallel to its main plane of extension, until it reaches a mechanical stop.

[0019] Alternatively, the tab and the recess can be shaped in such a way that, within the manufacturing tolerances, they have no positional play relative to each other. This means that the relative position of the recess to the tab is uniquely determined by inserting the tab into the recess.

[0020] The alignment structures enable the printed circuit board to be aligned relative to the electronic component. The facing ends of the tab and the recess are partially in direct mechanical contact, thus forming a mechanical stop. Specifically, the substrate layer and the encapsulation layer are in direct contact only in the area of ​​the alignment structures, particularly at their facing ends, and are spaced apart laterally in other areas.

[0021] According to at least one embodiment, the alignment structures define the distance between the facing end faces of the substrate layer and the encapsulation layer by means of a mechanical stop. The alignment structures define the position of the printed circuit board relative to the electronic component, parallel to the main extension plane of the encapsulation layer.

[0022] In particular, the printed circuit board can be oriented relative to the electronic component such that the end faces of the substrate and the encapsulation structure are in direct mechanical contact only in the area of ​​the alignment structures. This means that the alignment structures, due to the contour of the recess and the contour of the tab, form a mechanical stop that defines the distance between the facing end faces of the substrate and the encapsulation layer. This mechanical stop can define the maximum and / or minimum distance between the facing end faces of the encapsulation and substrate layers.

[0023] A gap between the facing end faces of the substrate layer and the encapsulation layer is advantageous, for example, to reduce mechanical stress within the electronic component due to different thermal expansions of its various components, for example during its operation.

[0024] According to at least one embodiment, the printed circuit board is positioned relative to the electronic component such that the first and second contact layers are arranged overlapping each other; in particular, the first and second contact layers are arranged to completely overlap within the tolerance range. Overlapping here means that the second contact layer covers the first contact layer in a top view perpendicular to the principal extent plane of the first contact layer.

[0025] According to at least one embodiment, the contour of the recess and the tab, parallel to the main extension direction of the end face on which the respective alignment structure is formed, has a width that tapers towards the respective end face, and the tab is dimensioned such that, when inserted into the recess, it has clearance relative to it. The maximum width of the tab is greater than the minimum width of the recess. This represents a possible geometry by means of which a mechanical stop is implemented that defines the maximum distance between the end faces of the carrier layer and the encapsulation layer.

[0026] The tab and / or the recess is designed in such a way that the tab releases from the recess under a predetermined tensile or compressive load.

[0027] For example, differing thermal expansion rates within the electronic component can exert tensile and / or compressive stresses on the alignment structures. To reduce the risk of resulting damage to the electronic component, the alignment structures can be designed such that the tab at least partially detaches from the recess under a predetermined tensile and compressive load. Detachment of the tab from the recess means, in particular, that after detachment, the principal plane of extension of the tab and the principal plane of extension of the recess no longer lie, at least partially, in the same plane. The tab can be designed to be made of a sufficiently flexible material so that, upon reaching a predetermined tensile or compressive load, the tab deforms and detaches from the recess.Alternatively or additionally, the tab and / or the recess can have a geometry (for example, chamfered end faces) which facilitates the release of the tab from the recess.

[0028] According to at least one embodiment, the tab has a predetermined breaking point. This breaking point allows the tab to detach from the carrier layer or the encapsulation layer in the event of a predetermined tensile or compressive load. The breaking point runs, for example, in the plane or parallel to the plane along which the carrier layer or encapsulation layer extends. The breaking point can be formed by a reduced thickness of the carrier layer or the encapsulation layer. Alternatively, the breaking point can be formed by perforations in the carrier layer or the encapsulation layer.

[0029] According to at least one embodiment, the tab is separated from the substrate layer or the encapsulation layer. For example, the finished electronic component has only the recess and no longer a tab. In particular, the tab can be separated from the encapsulation layer or the substrate layer in such a way that the substrate layer and the encapsulation layer are not in direct mechanical contact in any area.

[0030] According to at least one embodiment of the electronic component, the position along the front face and / or the contour of the tab and the recess represents a code, so that only matching circuit boards and electronic components can be combined with each other.

[0031] The coding can be achieved through geometric properties of the recess and the tab. For example, the tab can only be inserted into the recess when the circuit boards and electronic components are related. Alternatively or additionally, the position of the recess and the tab, along their facing end faces, is complementary, but only when the circuit boards and electronic components are related.

[0032] According to at least one embodiment of the electronic component, the printed circuit board and the electronic component are mechanically connected to each other by means of a connecting element. The connecting element mechanically connects the printed circuit board and the substrate at least in the region of the first and second contact layers. In particular, the connecting element between the printed circuit board and the substrate is additionally arranged laterally to the contact layers in further regions. In particular, no connecting element is arranged in the region of the alignment structures.

[0033] The fastener can additionally connect the first and second contact surfaces electrically. The fastener can be an anisotropic, electrically conductive fastener, in particular an adhesive filled with conductive particles. Specifically, the fastener exhibits lower conductivity parallel to its main plane of extension than perpendicular to its main plane of extension. The fastener can be formed in one piece and be in direct mechanical contact with several first and / or second contact layers. Preferably, only overlapping first and second contact layers are electrically connected to each other by means of the anisotropic electrical conductivity of the fastener.

[0034] A method for manufacturing an electronic component as described above comprises the following steps: providing an electronic component and a printed circuit board, placing the printed circuit board and aligning it relative to the electronic component by means of at least two alignment structures, and metallurgically bonding the printed circuit board and the electronic component.

[0035] The printed circuit board (PCB) is placed on the electronic component next to the encapsulation layer, with the side containing the second contact layer facing the side containing the first contact layer. The PCB is positioned so that the tab is inserted into the recess.

[0036] The circuit board is then moved relative to the electronic component, in particular essentially parallel to the main extension plane of the substrate, until a mechanical stop of the alignment structures occurs, at which point these, in particular their end faces, are in direct contact as intended.

[0037] Advantageously, the printed circuit board is aligned with the electronic component in such a way that the first and second contact layers, viewed from above on their main extension planes, overlap each other, in particular completely overlapping each other within the manufacturing tolerances.

[0038] Advantageously, the circuit board is aligned with the electronic component in such a way that the carrier layer and the encapsulation layer are only in direct mechanical contact in a sub-area of ​​the alignment structures.

[0039] The printed circuit board and the electronic component are then mechanically bonded together. In particular, the first and second contact layers are electrically connected by means of this bonded connection.

[0040] According to at least one embodiment of the manufacturing process, the position of the printed circuit board relative to the electronic component is defined parallel to the end face of the encapsulation layer by means of a mechanical stop of the alignment structures. The mechanical stop is realized by direct mechanical contact between the encapsulation layer and the substrate layer, at least in a partial area of ​​the alignment structures.

[0041] According to at least one embodiment of the manufacturing process, the distance between the end faces of the encapsulation layer and the support layer is defined by means of a mechanical stop of the alignment structures. The mechanical stop is realized by direct mechanical contact between the encapsulation layer and the support layer, at least in a partial area of ​​the alignment structures.

[0042] The alignment structures preferably define both the distance between the end faces of the encapsulation layer and the support layer as well as the position parallel to the main extension direction of the mutually facing end faces of the support layer and the encapsulation layer.

[0043] According to at least one embodiment of the manufacturing process, after the printed circuit board is connected to the electronic component, the tab is separated from the substrate or encapsulation layer, for example, by means of a laser cutting process. Alternatively, the tab can have a predetermined breaking point along which it is separated by a tensile force.

[0044] Further advantageous designs and advanced training options result from the following in conjunction with the Fig. Examples and embodiments described in sections 1A to 9.

[0045] They show: Fig. 1A, a schematic representation of a top view of a first embodiment of an electronic component without an associated circuit board; Fig. 1B, a schematic representation of a sectional view of the embodiment according to Fig. 1A along the line AA shown there; Fig. 2A, a schematic representation of a top view of a first embodiment of an electronic component, i.e. an electronic component with associated printed circuit board; Fig. 2B, a schematic representation of a sectional view of the embodiment according to Fig. 2A along the line BB shown there; Fig. 2C, a schematic representation of a sectional view of the embodiment according to Fig. 2A along the line CC shown there; Fig. 3, a schematic representation of a top view of a second embodiment of an electronic component; Fig. 4, a schematic representation of a top view of a third embodiment of an electronic component; Fig. 5, a schematic representation of a top view of a fourth embodiment of an electronic component; Fig. 6, a schematic representation of a top view of an example of an electronic component; Fig. 7, a schematic representation of a top view of another embodiment of an electronic component; Fig. 8, a schematic representation of a top view of an example of an electronic component; Fig. 9, a schematic representation of a top view of another embodiment of an electronic component.

[0046] In the various examples, embodiments, and accompanying figures, similar or similarly appearing elements are each marked with the same reference symbols. The figures and the relative sizes of the elements shown in the figures are not to be understood as being to scale. Rather, individual elements, for example, layers, may be depicted as exaggeratedly large compared to the other elements for better understanding and / or clarity.

[0047] The in the Fig. 1A and Fig. Figure 1B illustrates an electronic component 10 comprising a substrate 11 with two principal surfaces, the principal surfaces extending parallel to the principal extension plane of the substrate 11. An electronic structure 12, an encapsulation layer 13, and two first electrical contact layers 14 are arranged on one of the principal surfaces.

[0048] The electronic structure 12 is covered by an encapsulation layer 13 on sides where it is not covered by the substrate 11, except for electrical connecting tracks leading to the electrical contact layers 14.

[0049] The encapsulation layer 13 is designed such that the two first electrical contact layers 14 are arranged next to the encapsulation layer 13 on the substrate 11 and are exposed on the substrate 11.

[0050] The encapsulation layer 13 has end faces which are arranged between the main surfaces of the encapsulation layer 13. The encapsulation layer 13 has a recess 211 and a tab 221 on its end face 231 facing the first electrical contact layers 14. The recess 211 and the tab 221 are arranged adjacent to the first contact layers 14. In this embodiment, the tab 221 and the recess 211 are arranged parallel to the end face 231 and offset from the first contact layers 14. In an alternative embodiment, which is not shown here, the tab 221 and the recess 211 can also be arranged perpendicular to the end face 231 and offset from the first contact layers 14.

[0051] The electronic component 10 is an organic optoelectronic component with an organic optoelectronic structure applied to the substrate 11, which emits or detects optoelectronic radiation during operation. The two first electrical contact layers 14, which are made, for example, of a metallic material, in particular chromium and / or aluminum and / or molybdenum, are electrically connected to the optoelectronic structure 12 and serve to electrically connect the optoelectronic structure to an external electronic control circuit. Such organic optoelectronic components are described, for example, in DE 10 2012 220 724 A1.

[0052] The substrate 11 can be made of a material transparent to the radiation to be emitted or detected, for example, glass or plastic. The encapsulation layer 13 can advantageously be made of a sufficiently moisture- and gas-tight material, for example, metal or ceramic, particularly aluminum. It can be multilayered and thus exhibit particularly high hermeticity against moisture and oxygen. Furthermore, the encapsulation layer can advantageously have particularly high reflectivity towards the radiation emitted or detected by the optoelectronic structure during operation.

[0053] In the Fig. The embodiment illustrated in 2A to 2C is a complete electronic component comprising an electronic component 10 and a printed circuit board 30.

[0054] The electronic component 10 differs from that of the embodiment according to the Fig. 1A and Fig. 1B in the arrangement of the two first electrical contact layers 14 and the two alignment structures 20 along the end face 231 of the encapsulation layer 13. The two first electrical contact layers 14 are arranged between the tab 221 and the recess 211.

[0055] The printed circuit board 30 comprises a carrier layer 32 and two secondary contact layers 31. The printed circuit board 30 is arranged adjacent to the encapsulation layer 13, overlapping the substrate 11 such that the two secondary contact layers 31 and the two first contact layers 14 overlap each other when viewed from above along their main planes of extension. A tab 222 and a recess 212 are formed on an end face 232 of the carrier layer 32 facing the encapsulation layer 13. The tab 222 of the carrier layer 32 is arranged in the recess 211 of the encapsulation layer 13, and the tab 221 of the encapsulation layer 13 is arranged in the recess 212 of the carrier layer 32.

[0056] The contours of the recesses 211, 212 and tabs 221, 222 are designed such that the tabs 221, 222 can be inserted into the recesses 211, 212 with some play. The widths of the contours of the recesses 211, 212 and the tabs 221, 222, parallel to the main direction of extension of the respective end face 231, 232 on which they are arranged, taper towards the respective end face 231, 232. The maximum width of the tabs 221, 222 is greater than the minimum width of the recesses 211, 212. Thus, a predetermined distance can be created along the main surface of the substrate 11 between the end faces 231, 232 of the support layer 32 and the encapsulation layer 13 by pulling these two components apart. At the same time, the position of the circuit board 30 relative to the electronic component 10 is defined along the main extension direction of the end faces 231, 232.When the circuit board 30 and the electronic component 10 are pulled apart, the distance between the encapsulation layer 13 and the carrier layer 32 and the position parallel to the mutually facing end faces 231, 232 are defined by means of a mechanical stop on the contours of the alignment structures.

[0057] The gap between the end faces 231, 232 reduces the risk of tensile and compressive forces acting on the printed circuit board 30 due to differing thermal expansions within the component, particularly between the encapsulation layer 13 and the substrate 11. These forces could damage the mechanical and electrical connection between the printed circuit board 30 and the electronic component 10, or damage the printed circuit board 30 itself. The carrier layer 32 and the encapsulation layer 13 are in direct mechanical contact with each other only in the area of ​​the alignment structure.

[0058] The tab 221, 222 can be formed from a sufficiently flexible material such that, upon reaching a predetermined tensile or compressive load, the tab 221, 222 deforms and releases from the recess 211, 212. For example, the tab 222 formed on the support layer 32 is formed from a polymer, in particular polyimide, and the tab 221 formed on an encapsulation layer 13 is formed from a metal, in particular aluminum. Alternatively or additionally, the tab 221, 222 can have a geometry that facilitates its release from the recess 211, 212. For example, the tab 221, 222 may have at least a reduced thickness and / or a perforation perpendicular to its main extension plane and / or an end face which does not run parallel to the end face of the recess 211, 212.The release of the tab 221, 222 from the recess 211, 212 means that after release the principal extension plane of the contour of the tab 221, 222 and the principal extension plane of the contour of the recess 211, 212 do not lie in one plane or the tab 221, 222 is not mechanically connected to the carrier layer 32 or the encapsulation layer 13 on which it is formed.

[0059] By allowing the tabs 221, 222 to detach from the recesses 211, 212 under excessive tensile or compressive stress, the risk of damage to the electronic component due to tensile or compressive stresses that may act between the circuit board 30 and the encapsulation layer 13 is reduced.

[0060] The printed circuit board 30 and the electronic component 10 are mechanically connected to each other by means of a bonding agent 40. Furthermore, the bonding agent 40 electrically connects the first contact layer 14 and the second contact layer 31. For example, the bonding agent can be formed from an anisotropic conductive adhesive, in particular from ACF (anisotropic conductive film), which is especially epoxy resin-based. The bonding agent 40 can extend continuously over several first and second electrical contact layers 14, 31. In order to prevent, if necessary, an electrical short circuit of the electrically adjacent contact layers, the bonding agent has a suitable anisotropic electrical conductivity, such that only the first and second electrical contact layers 14, 31 that are superimposed on each other are electrically connected by the bonding agent 40.

[0061] The in Fig. The embodiment of an electronic component shown in Figure 3 has an alternative configuration of the alignment structure 20, in which tabs 221 (here specifically two, but there can also be more) are formed exclusively on the encapsulation layer 13 and associated recesses 212 are formed exclusively on the support layer 32.

[0062] The in Fig. The embodiment of an electronic component shown in Figure 4 has an alternative configuration of the alignment structure 20, in which tabs 222 are formed exclusively on the carrier layer 32 and associated recesses 211 are formed exclusively on the encapsulation layer 13.

[0063] The Fig. Figure 5 shows an alternative embodiment of the alignment structures 20, in which the tabs 221, 222 and the recesses 211, 212 have substantially constant widths parallel to the main direction of extension of the associated end faces 231, 232. In this embodiment, the position of the printed circuit board parallel to the main direction of extension of the end face 231 of the encapsulation layer 13 is defined by the mechanical stop of the alignment structures 20. Additionally, the distance between the end faces 231, 232 can be defined by means of the alignment structures 20. The tabs 221, 222 and the recesses 211, 212 have a length perpendicular to the end faces 231, 232. The difference between the length of the tab 221, 222 and the length of the associated recess 211, 212 defines the amount of the distance between the end faces 231, 232.The length of the tab 221, 222 is greater than the length of the recesses 211, 212 by the amount of the distance between the end faces 231, 232. The mechanical stop, which defines the distance between the end faces 231, 232, is achieved by pushing the electronic component 30 and the circuit board 10 together perpendicular to the end faces 231, 232.

[0064] The in Fig. The example shown in section 6 differs from the embodiment shown in the illustration. Fig. 4 by the fact that the tabs 222 have predetermined breaking points in the form of perforations. The perforations are arranged in an area where the tabs border the end face 232 of the carrier layer 32. The perforations facilitate the removal of the tabs 222 after the material-bonded mechanical joining of the electronic component 10 and the printed circuit board 30. Alternatively, the tab in the area of ​​the perforations can be left intact after the material-bonded mechanical joining, but can be designed such that the tabs 222 tear away from the carrier layer 32 under excessive tensile stress, for example, due to thermal expansion in the component. Alternatively or additionally, the predetermined breaking points on the tabs 222 can also be designed in the form of a reduced tab thickness.

[0065] The Fig. Figure 7 shows an alternative embodiment of the alignment structure 20, in which the tabs 221, 222 and the recesses 211, 212 have T-shaped contours. In this embodiment, the position of the printed circuit board 30 perpendicular to the end face 231 of the encapsulation layer 13 is defined by laterally pulling the printed circuit board 30 and the electronic component 10 apart by means of the mechanical stop of the alignment structure 20. Additionally, a mechanical stop determines the position of the printed circuit board 30 parallel to the end face 231 when the printed circuit board 30 is moved along the main extension direction of the end face 231 of the encapsulation layer 13.

[0066] The Fig. Figure 8 shows an alternative in which the tabs 222 are separated from the substrate. Separating the tabs after aligning the printed circuit board 30 relative to the electronic component 10 can be achieved, for example, by laser cutting. If the tab has a predetermined breaking point, it can be separated from the substrate 32 by tensile force. The predetermined breaking point can be, for example, in the form of perforations or a locally reduced thickness of the tab 222.

[0067] The Fig. Figure 9 shows an alternative embodiment of the alignment structures 20, in which different geometries of the alignment structures are formed on an electronic component. A tab 222 and a complementary recess 211 have a T-shaped contour. Another tab 222 and a complementary recess 211 have a trapezoidal contour. When the printed circuit board 30 and the electronic component 10 are pulled apart, the mechanical stop of the trapezoidal alignment structures defines the position of the printed circuit board 30 perpendicular to the end face 231 of the encapsulation layer 13 and parallel to the main extension direction of the end face 231 of the encapsulation layer 13. In addition, a mechanical stop of the T-shaped alignment structures 20 in a further area determines the distance between the opposing end faces 231, 232 of the encapsulation layer and the support layer 32.

[0068] The embodiment according to Fig. Figure 9 combines the advantages of T-shaped and trapezoidal alignment structures. The trapezoidal alignment structures define, at a first point, the position of the printed circuit board relative to the encapsulation layer both parallel and perpendicular to the main extension direction of the end face 231 of the encapsulation layer 13. In contrast, the T-shaped alignment structures, in this embodiment, define, at a second point, only the position of the printed circuit board relative to the encapsulation layer in the perpendicular direction to the main extension direction of the end face 231 of the encapsulation layer. This design allows for a larger permissible manufacturing tolerance of the positions of the alignment structures 20 along the end faces 231, 232 relative to each other.

[0069] In the above-shown versions of the Fig. 1A, Fig. 2A, Fig. 3, Fig. 4, Fig. 6, Fig. 7, Fig. 8, Fig. 9 defines the distance between the facing end faces 231,231 in two areas. Thus, a constant distance between the facing end faces 231,232 can be ensured within the manufacturing tolerances. Reference symbol list 10 electronic component 11 Substrat 12 electronic structure 13 Encapsulation layer 14 first contact layer 20 Alignment structure 211 Recess in the encapsulation layer 212 Recess in the carrier layer 221 Tab on the encapsulation layer 222 Tab on the carrier layer 231 Front face of the encapsulation layer 232 Front side on the carrier layer 30 circuit boards 31 second contact layer 32 Carrier layer 40 fasteners

Claims

[1] Electronic component comprising a printed circuit board (30) and an electronic component (10), wherein - the electronic component (10) comprises a substrate (11), an encapsulation layer (13), an electronic structure (12) arranged between the substrate (11) and the encapsulation layer (13), and at least one first electrically conductive contact layer (14) arranged next to the encapsulation layer (13) on the substrate (11) and electrically connected to the electronic structure (12), - the printed circuit board (30) comprises a carrier layer (32) and at least one second electrically conductive contact layer (31), - the printed circuit board (30) is arranged next to the encapsulation layer (13) on the substrate (11), - the first electrically conductive contact layer (14) and the second electrically conductive contact layer (31) are electrically connected to each other, and - the carrier layer (32) and the encapsulation layer (13) each have at least one alignment structure (20) which interlock and define the position of the printed circuit board (30) to the electronic component (10) in at least one spatial direction, wherein - the encapsulation layer (13) and the support layer (32) have mutually facing end faces (231, 232) on which the at least one alignment structure (20) is formed, wherein the at least one alignment structure (20) on the encapsulation layer (13) has the contour of a recess (211, 212) or a tab (221, 222) and the at least one alignment structure (20) on the support layer (32) has the contour of a tab (221, 222) or a recess (211, 212), wherein the at least one alignment structure (20) on the encapsulation layer (13) extends in a principal extent plane of the encapsulation layer (13) and wherein the at least one alignment structure (20) on the support layer (32) extends in a principal extent plane of the support layer (32), and wherein the at least one alignment structure (20) on the carrier layer (32) and at least one alignment structure (20) on the encapsulation layer (13) are formed in such a way thatthat the tab (221, 222) can be inserted into the recess (211, 212), and, - the tab (221, 222) and / or the recess (211, 212) are designed in such a way that the tab (221, 222) at least partially releases itself from the recess (211, 212) under a predetermined tensile or compressive load. [2] Electronic component according to the previous claim, wherein the at least one alignment structure (20) on the encapsulation layer (13) and the at least one alignment structure (20) on the support layer (32) define the position of the printed circuit board (30) to the electronic component (10) parallel to the end face (231) of the encapsulation layer (13) by means of a mechanical stop. [3] Electronic component according to one of the preceding claims, wherein the at least one alignment structure (20) on the encapsulation layer (13) and the at least one alignment structure (20) on the support layer (32) define a distance between the mutually facing end faces (231, 232) of the support layer (32) and the encapsulation layer (13) by means of a mechanical stop. [4] Electronic component according to one of the preceding claims, wherein the first electrically conductive contact layer (14) and the second electrically conductive contact layer (31) are arranged overlapping each other. [5] Electronic component according to one of the preceding claims, wherein the recess (211, 212) and the tab (221, 222) in the main extension plane of the encapsulation layer (13) or the support layer (32) have a width parallel to the respective end face (231, 232) on which the respective at least one alignment structure (20) is formed, which tapers towards the respective end face (231, 232). [6] Electronic component according to one of the preceding claims, wherein the position of the at least one alignment structure (20) on the encapsulation layer (13) and the at least one alignment structure (20) on the support layer (32) along the end faces (231, 232) and / or the contour of the tab (221, 222) and the recess (211, 212) represent a code such that only related printed circuit boards (30) and electronic components (10) can be combined with each other. [7] Electronic component according to one of the preceding claims, wherein the printed circuit board (30) and the electronic component (10) are mechanically connected to each other by means of a connecting means (40). [8] Electronic component according to claim 7, wherein the connecting means (40) electrically connects the first electrically conductive contact layer (14) and the second electrically conductive contact layer (31). [9] A method comprising the following steps for the manufacture of an electronic component according to any of the preceding claims: - Providing an electronic component (10) and a printed circuit board (30); - Placing the printed circuit board (30) and aligning it relative to the electronic component (10) using at least two alignment structures (20); - material-bonded connection of the circuit board (30) and the electronic component (10). [10] Method according to claim 9, wherein, during alignment by means of the at least one alignment structure (20) on an encapsulation layer (13) and the at least one alignment structure (20) on a support layer (32), the position of the printed circuit board (30) relative to the electronic component (10) is defined parallel to an end face (231) of the encapsulation layer (13) by means of a mechanical stop and / or a distance between the end face (231) of the encapsulation layer (13) and an end face (232) of the support layer (32) is defined by means of a mechanical stop. [11] Method according to one of claims 9 to 10, in which, after the material bonding of the printed circuit board (30) with the electronic component (10), a tab (221, 222) is separated from the printed circuit board (30) or the encapsulation layer (13).

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