Assembly unit with wired electronic power components and their assembly with a motor housing

Abstract

Assembly (1; 101) with wired electronic power components for an inverter of an electric compressor of an air conditioning system, comprising a support frame structure (2; 102) with a base (5; 105) forming a top and a bottom of the support frame structure (2; 102) and having a plurality of passages from the top to the bottom for fasteners for attaching the support frame structure (2; 102) to a motor housing (15; 115), wherein a receiving cavity (21; 121) or a plurality of receiving cavities (21; 121) is formed on the bottom of the base (5; 105) in which a wired power module or a plurality of discrete wired power semiconductors (3; 103) is embedded, and wherein in each receiving cavity (21; 121) a contact area (22; 122) for localized contact of the receiving cavity (21; 121) with an upward-facing surface (3c; 103c) of the power semiconductor (3;103) or power module, while the opposite downward-facing surface (3b; 103b) of the power semiconductor (3; 103) forms part of the lower outer surface of the assembly (1; 101), and wherein the support frame structure (2; 102) has a compliant area (23; 123) above the receiving cavities (21; 121) which is bendable in the direction of the thickness of the power semiconductor (3; 103) or the power module relative to the other areas of the support frame structure (2; 102), further comprising a plurality of busbars (4) arranged within the support frame structure (2; 102), wherein the support frame structure (2; 102) has grooves on the underside of the base (5; 105) adapted to the busbars (4) into which the busbars (4) are secured by pressing them in.

Description

[0001] The invention relates to a mounting assembly with wired electronic power components, in particular for an inverter of an electric compressor of an air conditioning system. Furthermore, the invention relates to an assembly of this mounting assembly with a motor housing of the compressor.

[0002] Electric compressors for automotive air conditioning systems that utilize brushless electric motors require inverter electronics to convert direct current from the power grid into the required multiphase alternating current. This is achieved using a multi-half-bridge configuration formed by an array of discrete, leaded power semiconductors (IGBTs or MOSFETs) or by an integral leaded power module. A power module comprises the arrangement of at least two semiconductor chips on a substrate, including contact points. The multiphase current requires a connection from the inverter's power stage to the corresponding phase winding end of the electric motor or to a pin of an electrical housing feedthrough. This connection is often established using busbars.In addition, the heat generated within the power semiconductors, such as insulated-gate bipolar transistors (IGBTs) or metal-oxide-semiconductor field-effect transistors (MOSFETs), must be effectively dissipated. The best way to dissipate this heat is via a suitable cooling surface on the motor housing, through whose internal volume cold suction gas circulates. This requires a suitable contact pressure, with which each power semiconductor is pressed against the cooling surface, taking into account the individual thickness of each power semiconductor. Finally, the inverter should be designed for easy mounting on the main body of the compressor, preferably in the form of a simple modular inverter.

[0003] Arrangements are known from the prior art in which the power semiconductors and busbars of the inverter are mounted on a usually metallic carrier. The power semiconductors and busbars must be insulated from the carrier by suitable measures. The carrier itself must be mounted to the motor housing. Conventionally, the power semiconductors are insulated from the carrier by a foil with good thermal conductivity. The busbars are guided in a separate busbar housing, which is mounted to the metallic carrier. The carrier with the mounted power semiconductors and busbars, or with the busbar housing, is screwed on using a seal and a thermally conductive intermediate layer.

[0004] JP 2008-258241 A describes a semiconductor device comprising the following components: a plurality of semiconductor modules in which semiconductor elements are sealed with a resin and through-holes are arranged; leaf springs arranged on the upper surfaces of the semiconductor modules; a reinforcing beam arranged on the upper surfaces of the leaf springs; and a cooler shaped to be larger than the size of the lower surfaces of the semiconductor modules and mounted on the lower surfaces of the semiconductor modules. Furthermore, first brackets are provided for attaching the semiconductor modules to the cooler by inserting them into the through-holes of the semiconductor modules via the reinforcing beam and the leaf springs from the reinforcing beam side.Finally, the semiconductor device comprises a frame part which is fixedly arranged on the surface of the cooler with the semiconductor modules arranged thereon in order to enclose the outer periphery of the arrangement of the semiconductor modules.

[0005] JP 2004 - 190 547 A relates to an inverter assembly for a motor-driven vehicle compressor. The inverter assembly comprises a base plate, a power semiconductor module, a smoothing capacitor, a busbar assembly, and a printed circuit board. It is preassembled into an inverter assembly and installed in the motor-driven compressor by attaching the base plate of this inverter assembly to the outer casing surface of the motor-driven compressor. This is intended to facilitate installation work.

[0006] JP 2011-157873 A discloses an electric compressor with an integrated inverter. This comprises an inverter box provided on an outer periphery of a housing, and an inverter having a control board, which is housed and installed in the inverter box. In the electric compressor, which is provided with an electrical component mounted on a surface of a control board and forming the inverter, a flat heat dissipation part is formed in the inverter box, which forms an outer wall of the housing and runs parallel to a control board of the inverter. The electrical component is arranged in a space between the flat heat dissipation part and the control board, and a plurality of the electrical components with different heights are brought into direct contact with the flat heat dissipation part on their rear sides.

[0007] DE 100 52 191 C1 relates to a cooling assembly and a method for manufacturing a cooling assembly. The cooling assembly comprises a cooling plate, a circuit board spaced parallel to the cooling plate, and at least two electronic components to be cooled, which are arranged between the cooling plate and the circuit board. The components are pressed against the cooling plate by a pressing element mounted on the cooling plate. The pressing element comprises a frame and two spring tongues formed within the frame.

[0008] The object underlying the invention is, in particular, to arrange and support the power electronic components in such a way that each power semiconductor or power module is pressed directly against the cooling surface on the motor housing with an appropriate contact force, regardless of the thickness of the respective power semiconductor or power module. Furthermore, such an arrangement should be easy to mount on the main part of the compressor, ideally in the form of a simple modular inverter.

[0009] The object of the invention is achieved by a mounting assembly with wired electronic power components according to the features of the independent claims. Further developments are specified in the subclaims. This mounting assembly is particularly suitable for an inverter of an electric compressor of an air conditioning system. The mounting assembly comprises a support frame structure with a base that forms a top and a bottom of the support frame structure and has a plurality of passages from the top to the bottom for fastening elements for fastening the support frame structure to a motor housing. On the underside of the base, a receiving cavity or a plurality of receiving cavities is formed, in which a wired power module or a plurality of discrete wired power semiconductors is embedded.In each receiving cavity, a contact area is formed for localized contact of the receiving cavity with an upward-facing surface of the power semiconductor or power module, while the opposite, downward-facing surface of the power semiconductor or power module forms part of the lower outer surface of the mounting assembly. Preferably, there is line contact or point contact between the contact area of ​​the receiving cavity of the support frame structure and the upward-facing surface of the power semiconductor or power module. According to the invention, the support frame structure has a flexible area above the receiving cavities, which is bendable in the direction of the thickness of the power semiconductor or power module relative to the other areas of the support frame structure.

[0010] The assembly with the wired electronic power components thus comprises a plurality of discrete power semiconductors or a single integral wired power module, as well as a support frame structure within which the plurality of discrete power semiconductors or a single integral wired power module is arranged and which can be attached to a motor housing of an electric compressor. The fastening means are preferably screws.

[0011] According to the invention, the mounting assembly with the wired electronic power components also comprises a plurality of busbars, which are also arranged within the support frame structure. If no busbars are used, for example, in compressors where pins of the electrical housing feedthrough are directly connected to the circuit board, the mounting assembly can consist solely of the power semiconductors and the support frame structure. The support frame structure can be positioned below the inverter's circuit board.According to an advantageous embodiment of the invention, the bottom of the support frame structure has openings through which the connecting legs of the wired power semiconductors or of the wired power module are guided and extend through the support frame structure to such an extent that they can be passed through the circuit board of the inverter positioned in the support frame structure and soldered to the circuit board of the inverter.

[0012] The support frame structure provides both receiving cavities for each power semiconductor or power module and, if necessary, also grooves for one or more busbars. Busbars can be pressed into their assigned grooves and positioned and held by the ribs, each of which is traversed by the groove, which provide a tight fit with the corresponding busbar. According to the invention, the support frame structure has grooves on the underside of the base that are adapted to the busbars, into which the busbars are fastened by pressing. The discrete power semiconductors or the power module are positioned, as already mentioned, within suitable receiving cavities within the support frame structure.The busbar ends, like the connecting legs of the leaded power semiconductors or the leaded power module, can be fed through suitable openings in the base of the support frame structure and extend far enough through the support frame structure that they can be passed through the circuit board of the inverter and soldered to the circuit board of the inverter.

[0013] A further aspect of the invention relates to an assembly of the above-mentioned assembly unit with a motor housing of a compressor. When mounted on the motor housing of the compressor, the support frame structure is fastened to the motor housing of the compressor by a plurality of fastening elements, preferably screws. The support frame structure and the power semiconductors or the power module integrated therein are pressed against a cooling surface. Each receiving cavity for a power semiconductor or the power module within the support frame structure has a contact area to apply the required contact pressure to the top side of the power semiconductor. The support frame structure has flexible areas such that it enables adaptation of the support frame structure to differences in the thickness of the discrete power semiconductors or the power module by bending the support frame structure.Screw points and contact elements are positioned in such a way that no mechanical over-determination occurs. For example, in cases where discrete power semiconductors are used, it is preferable to place no more than two power semiconductors between two screws. This ensures that all power semiconductors have sufficient contact force with the cooling surface. The power semiconductors can be arranged in a rectangular, triangular, irregular, or circular pattern. To improve thermal conductivity and to electrically insulate the power devices and busbars from the cooling plane, an intermediate layer of thermally conductive material, more specifically a layer of thermally highly conductive, electrically insulating thermally conductive material, is advantageously placed beneath the mounting assembly, i.e., between the mounting assembly and the cooling surface of the motor housing. The support frame structure is preferably made of plastic.In case the plastic material is not strong enough to generate sufficient contact pressure against the power devices, plastic overmolded or inlaid metallic reinforcements can be used within the support frame structure.

[0014] Further details, features, and advantages of embodiments of the invention will become apparent from the following description of exemplary embodiments with reference to the accompanying drawings. They show: Fig. 1A: a mounting assembly in a perspective view looking towards the top of a support frame structure, Fig. 1B: the mounting assembly in a top view of the underside of the support frame structure with embedded power semiconductors and busbars, Fig. 1C: the assembly in connection with a printed circuit board, with a view of the printed circuit board with the busbar ends and connecting legs of the power semiconductors penetrating it, Fig. 1D: a perspective view of a motor housing with a mounting assembly mounted thereon, Fig. 2: an exploded view of an assembly comprising the motor housing with pins of electrical housing feedthroughs and with a cooling surface, an intermediate layer of a thermally conductive material and the mounting assembly with circuit board, Fig. 3: a sectional view of the assembly with the power semiconductors in the screwed state, Fig. 4A: a mounting assembly in a perspective view looking at the top of a hexagonal support frame structure, Fig. 4B: the mounting assembly in a top view of the underside of the hexagonal support frame structure with embedded power semiconductors, Fig. 4C: the assembly in connection with a printed circuit board with a view of the printed circuit board with the connecting pins of the power semiconductors penetrating it, Fig. 4D: a perspective view of a motor housing with the mounting assembly with hexagonal support frame structure mounted thereon, Fig. 5: an exploded view of an assembly comprising the motor housing with pins of electrical housing feedthroughs and with a cooling surface, an intermediate layer of a thermally conductive material and the mounting assembly with printed circuit board, Fig. 6: a sectional view of the assembly with the power semiconductors in the screwed state,

[0015] The Fig. 1A and Fig. 1B schematically show the basic structure of a mounting assembly 1, which comprises a support frame structure 2 and wired electronic power components arranged therein in the form of a plurality of discrete wired power semiconductors 3 and busbars 4.

[0016] The Fig. 1A shows the mounting assembly 1 in a perspective view looking at the top of the support frame structure 2, which has a base 5 enclosed by an edge 6. The base 5 of the support frame structure 2 has various openings 7, 8, wherein connecting legs 3a of the power semiconductors 3 are passed through one group of openings 7 and busbar ends 4a are passed through another group of openings 8. In addition, the support frame structure 2 has a plurality of, according to Fig. 1A has four sleeves 9 projecting through the base 5 of the support frame structure 2 for guiding and supporting fastening elements. The fastening elements are located according to the Fig. 1A in the form of screws 10, the screw heads of which must be larger than the inner diameter of the sleeve 9, so that the screw head can be pressed as a stop and / or contact surface against the end face of the sleeve on the top side of the support frame structure 2 or against a washer placed on this end face. Using the screws 10 as fastening means, which are inserted from the top side, the support frame structure 2 can be attached to a motor housing.

[0017] The Fig. 1B shows the mounting assembly 1 in a plan view of the support frame structure 2 with leaded power semiconductors 3 embedded in receiving cavities of the support frame structure 2, each with three connecting legs 3a, which are guided through the openings 7 in the base 5 of the support frame structure 2, and busbars 4 with the busbar ends 4a, which are guided through further openings 8 in the base 5 of the support frame structure 2. The Fig. 1B also shows the screw ends of the screws 10 protruding through the base 5 of the support frame structure 2.

[0018] The Fig. 1C shows the assembly 1 in conjunction with an inverter circuit board 11, viewed from above onto this circuit board 11. The busbar ends 4a and terminal pins 3a of the wired power semiconductors protrude through the circuit board 11. For this purpose, the busbar ends 4a and terminal pins 3a of the power semiconductors are first guided through suitable openings in the base of the support frame structure 2 and extend far enough through the support frame structure 2 that they can be passed through openings 12, 13 in the circuit board 11 resting on the support frame structure 2 and soldered to the circuit board 11. A further group of openings 14 in the circuit board 11, on the other hand, is penetrated by the aforementioned sleeves 9, which serve as fastening devices, namely for guiding and supporting the screws 10.The screw head of the screws 10 is smaller than the corresponding opening 14 and is pressed as a stop and / or contact surface not against the circuit board 11, but against the respective upper end face of the sleeve 9.

[0019] The Fig. 1D shows a perspective view of a motor housing 15 with the mounting assembly 1 mounted thereon. The connecting pins 3a of the power semiconductors 3 and the busbar ends 4a are passed through the various openings 7, 8 in the base 5 of the support frame structure 2. The screws 10 are inserted through the sleeves 9 as fastening means for attaching the mounting assembly 1 to the motor housing, with the screw head being pressed against the end face of the sleeve on the top side of the support frame structure 2 as a stop and / or contact surface.

[0020] The Fig. Figure 2 shows an exploded view of the assembly comprising the motor housing 15, an intermediate layer 16 made of a thermally conductive material, and the mounting assembly 1. The mounting assembly 1 comprises the support frame structure 2, on the underside of which (not visible) the power semiconductors are embedded in receiving cavities and busbars are embedded in fits, and carries on its upper side a printed circuit board 11 through which the connecting pins 3a of the power semiconductors and the busbar ends 4a protrude. The motor housing 15 has, in the area for mounting the support frame structure 1, cooling surfaces 17 through which coolant flows, as well as pins 18 of electrical housing feedthroughs oriented perpendicular to the cooling surfaces 17, which are arranged according to Fig. 2 are arranged in a row of three. The mounting assembly 1 is fastened to the motor housing 15 by means of screws 10, wherein the support frame structure 2 with its underside, on which wired power semiconductors and the busbars are embedded in cavities, is pressed against the area of ​​the motor housing 15 in which the cooling surfaces 17 and pins 18 of the electrical housing feedthroughs are located. In order to improve thermal conductivity and to electrically insulate the wired power semiconductors and busbars from the cooling surfaces, an intermediate layer 16 of thermally insulating heat-conducting material is placed beneath the mounting assembly 1, such that the heat-conducting material is located between the cooling surfaces 17 of the motor housing 15 and the power semiconductors 3.At the same time, the intermediate layer 16 has several recesses 19 for the screws 10 and a larger recess 20 for all three pins 18 of the electrical housing feedthrough.

[0021] The Fig. 3 shows a sectional view of the assembly 1 with the leaded power semiconductors 3 in the screwed state. The support frame structure 2 is positioned below the circuit board 11 of the inverter. The support frame structure 2 has receiving cavities 21 on its underside for each power semiconductor 3, wherein these receiving cavities 21 are each open downwards. The power semiconductors 3, insulated gate bipolar transistors (IGBTs) in the example shown, are positioned in these receiving cavities 21 and thus within the support frame structure 2, wherein the downward-facing surface 3b of the power semiconductor 3 is uncovered by the support frame structure 2 due to the position of the opening of the receiving cavity 21. Each receiving cavity 21 has a contact area 22 designed for local contact of the receiving cavity 21 with the upper surface 3c of the power semiconductor 3.When mounted inside the compressor motor housing, which is shown in . Fig. 3 is shown schematically without the motor housing, the support frame structure 2 is pressed against the cooling surface of the motor housing (also not shown) by a plurality of screws 10, which are inserted into the sleeves 9 projecting from the circuit board to the underside. The screw head 10a is pressed against the upper end face of the sleeve 9 as a stop and / or contact surface. The support frame structure 2 itself has elasticity in the area above the receiving cavities, so that an adaptation of the support frame structure 2 to deviations in the thickness of the power semiconductor 3 is possible by bending this flexible area 23 of the support frame structure 2. The bending of the flexible area 23 of the support frame structure 2 in the screwed state is in Fig. 3 is shown schematically. The screws 10 and contact areas 22 are positioned in such a way that no mechanical static overdetermination occurs. Thus, exactly two power semiconductors 3 are arranged in a row between two screws 10. The fact that no more than two power semiconductors 3 are arranged in a row between two screws 10 enables all power semiconductors 3 to be pressed against the motor housing of the compressor with an appropriate contact force with their lower surface 3b uncovered by the support frame structure 2. The contact area 22 of each receiving cavity 21 is designed such that line contact exists between the power semiconductors 3 and the inner support frame structure 2, wherein the contact line runs perpendicular to the direction of bending of the flexible area 23 of the support frame structure 2.

[0022] The Fig. Figure 4A shows a mounting assembly 101 as an exemplary embodiment for the case where no busbars are used, for example, in compressors where the pins of the electrical housing feedthrough are directly connected to the printed circuit board. Thus, this mounting assembly 101 consists solely of the wired power semiconductors 103 and the support frame structure 102. Fig. 4A shows a perspective view looking at the top of the support frame structure 102, which has a hexagonal edge 106. The base 105 of the support frame structure 102 has three rows of six linearly arranged openings 107, each row extending from a central region of the base 105 of the support frame structure 102 to an area close to the edge 106. The three rows extend in different directions, and the angle between two adjacent rows is preferably 120°. The openings 107 are provided for the housing feedthrough of the connection legs of the power semiconductors. In addition, the support frame structure 102 according to Fig. 4A has an opening for the introduction of a screw 110 in the region of every second corner of the hexagonal edge 106, resulting in a triangular arrangement for these openings and for the screws 110.

[0023] The Fig. Figure 4B shows the mounting assembly 101 in a plan view of the underside of the hexagonal support frame structure 102 with a total of six embedded power semiconductors 103, which are arranged in pairs, i.e., in three groups of two. Fig. 4B also shows the screw ends of the screws 110 projecting through the base 105 of the support frame structure 102. Each power semiconductor 103 has three connecting legs 3a, which are guided through the openings 107 in the base 105 of the support frame structure 102. Due to the paired arrangement of the power semiconductors 103, the total of six connecting legs 103a of the adjacent power semiconductors 103 are arranged in a row such that they can be guided through corresponding six openings 107 of one of the above-mentioned linearly arranged rows of openings 107. The Fig. 4B also shows the screw ends of the screws 110 protruding through the bottom 105 of the support frame structure 102.

[0024] The Fig. 4C shows the mounting assembly 101 in conjunction with a printed circuit board 111, with a view of the printed circuit board 111 with the connecting legs 103a of the power semiconductors penetrating it. For this purpose, the connecting legs 103a of the power semiconductors are first fed through suitable openings in the bottom of the support frame structure 102 and extend far enough through the support frame structure 102 that they can be passed through openings 112 in the printed circuit board 111 resting on the support frame structure 102 and soldered to the printed circuit board 111.

[0025] The Fig. Figure 4D shows a perspective view of a motor housing 115 with the mounting assembly 101 with a hexagonal support frame structure 102 mounted thereto by means of screws. The connecting pins of the power semiconductors are passed through the aforementioned multiple groups of openings in the base of the support frame structure 102. Furthermore, during assembly, pins 118 of the electrical housing feedthrough from the motor housing 115 are also passed through corresponding openings in the base of the support frame structure 102 and visibly protrude.

[0026] The Fig. 5 shows an exploded view of an assembly comprising the motor housing 115 with the pins 118 of the electrical housing feedthrough and with a cooling surface 117, an intermediate layer 116 made of a thermally conductive material, and the mounting assembly 101. The mounting assembly 101 comprises the support frame structure 102, on the underside of which (not visible) the power semiconductors are embedded in receiving cavities. The motor housing 115 has, in the area for mounting the support frame structure 102, cooling surfaces 117 through which coolant flows, as well as pins 118 of electrical housing feedthroughs oriented perpendicular to the cooling surfaces 117. In comparison to the exemplary embodiment according to Fig. 2, the three pins 118 of the electrical housing feedthrough are spaced further apart from one another and have a substantially triangular arrangement. The base 105 of the support frame structure 102 has corresponding through-openings, so that the pins 118 of the electrical housing feedthrough also protrude through the support frame structure 102 during assembly. The mounting assembly 101 is fastened to the motor housing 115 by means of screws 110, with the support frame structure 102 being pressed with its underside, on which the power semiconductors are embedded in receiving cavities, against the area of ​​the motor housing 115 in which the cooling surfaces 117 and pins 118 of the electrical housing feedthroughs are located.To improve thermal conductivity and to electrically insulate the power semiconductors and busbars from the cooling surfaces, an intermediate layer 116 of thermally insulating thermal interface material is placed beneath the mounting assembly 101, so that the thermal interface material is located between the cooling surfaces 117 of the motor housing 115 and the power semiconductors 103. At the same time, the intermediate layer 116 has three triangularly arranged recesses 120 for all three pins 118 of the electrical housing feedthrough.

[0027] The Fig. 6 shows a sectional view of the mounting assembly 101 with the power semiconductors 103 in the screwed state. The support frame structure 102 is positioned below the circuit board 111 of the inverter. The support frame structure 102 has receiving cavities 121 on its underside for each power semiconductor 103, wherein these receiving cavities 121 are each open downwards. The power semiconductors 103, in the example shown, insulated gate bipolar transistors (IGBTs), are positioned in these receiving cavities 121 and thus within the support frame structure 102, wherein the downward-facing surface 103b of the power semiconductor 103 is uncovered by the support frame structure 102 due to the position of the opening of the receiving cavity 121. Each receiving cavity 121 has a contact area in the form of a contact element 122 designed for a local contact of the receiving cavity 121 with the upper surface 103c of the power semiconductor 103.When mounted inside the compressor motor housing, which is shown in . Fig. 6 is shown schematically without the motor housing, the support frame structure 102 is pressed against the cooling surface of the motor housing (also not shown) by a plurality of screws 110. The support frame structure 102 itself has a flexible element 123 in the area above the receiving cavities and thus an elasticity, so that an adaptation of the support frame structure 102 to deviations in the thickness of the power semiconductor is possible by bending this flexible element 123 of the support frame structure 102. The bending of the flexible area or element 123 of the support frame structure 102 in the screwed state is shown in Fig. 6. The screws 110 and contact elements 122 are positioned in such a way that no mechanical static overdetermination occurs. Thus, exactly two power semiconductors 103 are always arranged between two screws 110, as can also be seen from the Fig. 4B. This allows all power semiconductors 103 to be pressed against the compressor's motor housing with appropriate contact force with their lower surface 103b uncovered by the support frame structure 102. List of reference symbols 1 assembly module with wired electronic power components 2 Support frame structure 3 power semiconductors 3a connecting pins 3b downward facing surface of the power semiconductor 3c upward facing surface of the power semiconductor 4 busbar 4a Busbar ends 5 Bottom of the support frame structure 6 Edge of the support frame structure 7 openings for connecting pins of the power semiconductors 8 openings for busbar ends 9 sleeves 10 screws 10a screw head 11 Circuit board 12 openings for connection pins in the circuit board 13 openings for busbar ends in the circuit board 14 openings for sleeves and screws in the circuit board 15 Engine housing 16 Intermediate layer made of thermally conductive material 17 Cooling surface 18 pin of electrical housing feedthrough 19 Recess in the intermediate layer for the screws 20 Recess in the intermediate layer for the pins of the electrical housing feedthrough 21 Receiving cavity for power semiconductors 22 Contact area 23 Bending of the inner support frame structure 101 Assembly module with wired electronic power components 102 Support frame structure 103 power semiconductors 103a connecting pins 103b downward-facing surface of the power semiconductor 103c upward-facing surface of the power semiconductor 105 Bottom of the support frame structure 106 Edge of the support frame structure 107 openings for connecting pins of the power semiconductors 110 screws 111 circuit board 112 openings for connecting pins of the power semiconductors in the circuit board 115 Engine housing 116 Intermediate layer made of thermally conductive material 117 Cooling surface 118 Pin of electrical housing feedthrough 120 Recess in the intermediate layer for the pins of the electrical housing feedthrough 121 Receiving cavity for power semiconductors 122 Contact element 123 flexible element of the support frame

Claims

[1] Mounting assembly (1; 101) with wired electronic power components for an inverter of an electric compressor of an air conditioning system, comprising a support frame structure (2; 102) with a base (5; 105) which forms a top side and a bottom side of the support frame structure (2; 102) and has a plurality of passages from the top side to the bottom side for fastening elements for fastening the support frame structure (2; 102) to a motor housing (15; 115), wherein on the bottom side of the base (5; 105) a receiving cavity (21; 121) or a plurality of receiving cavities (21; 121) is formed, in which a wired power module or a plurality of discrete wired power semiconductors (3; 103) is embedded, and wherein in each receiving cavity (21; 121) a contact area (22; 122) for a local contact of the Receiving cavity (21; 121) with an upwardly facing surface (3c; 103c) of the power semiconductor (3;103) or power module, while the opposite, downward-facing surface (3b; 103b) of the power semiconductor (3; 103) forms part of the lower outer surface of the mounting assembly (1; 101), and wherein the support frame structure (2; 102) has a flexible region (23; 123) above the receiving cavities (21; 121) which is bendable in the direction of the thickness of the power semiconductors (3; 103) or the power module relative to the other regions of the support frame structure (2; 102), further comprising a plurality of busbars (4) arranged within the support frame structure (2; 102), wherein the support frame structure (2; 102) has grooves on the underside of the base (5; 105) which are adapted to the busbars (4), into which grooves the busbars (4) are fastened by being pressed in. [2] Mounting assembly (1; 101) according to claim 1, characterized byin that the base (5; 105) of the support frame structure (2; 102) has openings (7; 107) through which the connecting legs (3a; 103a) of the wired power semiconductors (3; 103) or of the wired power module are guided and extend through the support frame structure (2; 102) to such an extent that they can be passed through a printed circuit board (11; 111) of the inverter positioned on the support frame structure (2; 102) and soldered to the printed circuit board (11; 111) of the inverter. [3] Mounting assembly (1) according to claim 1, characterized by that the busbar ends (4a) are guided through suitable openings (8) in the base (5; 105) of the support frame structure (2; 102) and extend so far through the support frame structure (2; 102) that they can be passed through a circuit board (11; 111) of the inverter positioned on the support frame structure (2; 102) and soldered to the circuit board (11; 111) of the inverter. [4] Mounting assembly (1; 101) according to one of claims 1 to 3, characterized by that there is line contact or point contact between the contact area (22; 122) of the receiving cavity (21; 121) and the upwardly facing surface (3c, 103c) of the power semiconductor (3; 103) or power module. [5] Mounting assembly (1; 101) according to one of claims 1 to 4, characterized by that the support frame structure (2; 102) is made of plastic material. [6] Mounting assembly (1; 101) according to one of claims 1 to 4, characterized by that plastic-coated metallic reinforcements are used within the support frame structure (2; 102). [7] Assembly of a mounting assembly (1; 101) according to one of claims 1 to 6 with a motor housing (15; 115) of a compressor, wherein the support frame structure (2; 102) is fastened to the motor housing (15; 115) by a plurality of screws (10; 110) and the power semiconductors (3; 103) arranged in the support frame structure (2; 102) or the power module are / is pressed against a cooling surface (17; 117). [8] Assembly according to claim 7, characterized by that an intermediate layer (16; 116) made of heat-conducting material is placed below the mounting assembly (1; 101), between the mounting assembly (1; 101) and the cooling surface (17; 117) of the motor housing (15; 115). [9] Assembly according to claim 7 or 8, characterized by that in cases where discrete power semiconductors (3; 103) are used, no more than two power semiconductors (3; 103) are placed between two screws (10; 110).

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