Component and method for manufacturing a component

Abstract

Component (10) with a support (1) and at least one main body (2H), in which - the main body has a semiconductor body (2), - the carrier has a mounting surface (1M) on which the main body is arranged, - a storage structure (3) is formed on the mounting surface and projects vertically beyond the mounting surface, and - the main body is directly adjacent to the storage structure, so that the position of the main body is limited by the storage structure at least along a lateral direction.

Description

[0001] A component, in particular an optoelectronic component, is described. Furthermore, a method for manufacturing a component, in particular an optoelectronic component, is described.

[0002] For the integration of heterogeneous microsystems, components can be transferred from a semiconductor wafer to a substrate using a sticking tool or multiple sticking tools. To fabricate a component, the components can be precisely and reliably picked from the semiconductor wafer and placed onto the substrate using the sticking tool or tools before the tool is removed from the corresponding component(s). To prevent shifting of the component positions on the substrate, the removal of the sticking tool should be performed with great care. This requires more effort, particularly more time, for the fabrication of the component or microsystem.

[0003] DE 10 2016 004 592 A1 describes a device for aligning a component, wherein the device includes a carrier with alignment structures, which are designed in particular as angled L-shaped projections on a surface of the carrier. The components can be applied from a wafer to the carrier using a punch as a transfer tool, wherein the respective alignment structures form boundary walls for the components.

[0004] DE 101 05 872 A1 describes a process in which one of the circumferential surfaces of a chip projecting into a depression and / or a circumferential surface of the depression has a layer. The chips are mixed with a suitable solution and rinsed over the support substrate, the layer enhancing the attraction between the chip and the depression generated by capillary forces when the chip is deposited in the depression. A matrix display incorporates this arrangement, with the chips of the matrix display being individually addressable.

[0005] US 4 999 077 A describes a manufacturing process for a matrix of scanning units.

[0006] DE 10 2014 110 719 A1 describes a semiconductor device comprising a semiconductor chip with an active region designed to generate radiation, a radiation emission surface parallel to the active region, and a shaped body partially integrally formed with the semiconductor chip, which at least partially forms at least one side face of the semiconductor device. The semiconductor device also has a mounting surface for securing the semiconductor device. The semiconductor device includes a spacer extending beyond the radiation emission surface in a vertical direction perpendicular to the radiation emission surface.

[0007] One problem to be solved is to specify a component, in particular an optoelectronic component, that exhibits exceptionally high alignment accuracy. A further problem is to specify a reliable and cost-effective method for manufacturing a component, in particular one described herein.

[0008] These tasks are accomplished by the components and the method according to the independent claims. Further embodiments of the component or of the method for manufacturing the component are the subject of the further claims.

[0009] A structural element is specified, comprising a support and at least one main body arranged on the support.

[0010] According to at least one embodiment of the component, the main body comprises a semiconductor body. The component is designed, in particular, for generating or detecting electromagnetic radiation. For example, the semiconductor body has an active zone which, during operation of the component, is configured to generate or detect electromagnetic radiation, for instance, in the ultraviolet, visible, or infrared spectral range. The main body is, in particular, arranged directly on the substrate. It is possible that the component comprises a plurality of main bodies, each preferably comprising a semiconductor body, wherein the main bodies are, in particular, arranged on the same substrate. In lateral directions, the main bodies are, in particular, spatially spaced apart from one another. For example, the main bodies can be individually electrically contacted. However, it is also possible that the main bodies are electrically connected to one another.

[0011] A lateral direction is understood to be a direction that runs parallel to a principal extensional surface of the beam, for example, parallel to a principal extensional surface of the beam's mounting surface. A vertical direction is understood to be a direction that is perpendicular to the principal extensional surface of the beam, for example, perpendicular to the beam's mounting surface. The vertical and lateral directions are perpendicular or orthogonal to each other.

[0012] According to at least one embodiment of the component, the carrier has a mounting surface. The mounting surface is, in particular, an exposed surface for receiving the main body or bodies. The mounting surface is preferably an adhesive surface of the carrier, which is specifically designed to fix the position of the main body, at least temporarily, on the mounting surface.

[0013] According to at least one embodiment of the component, a storage structure is formed on the mounting surface. This storage structure can project beyond the mounting surface in a vertical direction. In particular, the main body is directly adjacent to the storage structure. Such an arrangement allows the position of the main body to be limited by the storage structure, at least along a lateral direction.

[0014] According to at least one embodiment of the component, the storage structure has at least one boundary element. In particular, the boundary element abuts the main body, preferably directly. The boundary element can limit the main body on the mounting surface at least along one lateral direction or along several lateral directions. The component or the component's support can have a plurality of boundary elements. In particular, each of the boundary elements is uniquely assigned to a single main body, and preferably vice versa. For example, the component does not have a boundary element that simultaneously abuts two or more different main bodies. Alternatively, however, it is possible that the boundary element is designed, for example with regard to its geometry or spatial extent, such that at least two or more main bodies can abut the same boundary element.

[0015] According to at least one embodiment of the component, it has a plurality of main bodies on the same support. Each main body can abut the storage structure, for example, exactly one boundary element of the storage structure, whereby the positions of the individual main bodies are at least partially determined by the positions of the boundary elements. The boundary elements of the storage structure allow for optimization of the adjustment accuracy of the main body or bodies on the mounting surface.

[0016] In at least one embodiment of the component, it comprises a support and at least one main body, the support having a mounting surface on which the main body is arranged. In particular, the main body comprises a semiconductor body. A storage structure is formed on the mounting surface and projects beyond the mounting surface along the vertical direction. The main body is directly adjacent to the storage structure, such that the position of the main body is limited by the storage structure at least along a lateral direction.

[0017] The support structure increases the positioning accuracy of the main body(s) on the mounting surface. When the main body or bodies are applied to the mounting surface using an adhesive punch or punches, the main body or bodies can be sheared off at the support structure, thus facilitating the removal of the adhesive punch or punches from the main body or bodies. The support structure primarily serves as a stop for the main body or bodies during the removal of the punch or punches. Therefore, the support structure simplifies the removal of the main body or bodies from the adhesive punch or punches, enabling reliable and rapid application of the main body or bodies to the substrate.

[0018] According to at least one embodiment of the component, the storage structure has at least one limiting element. The limiting element is, in particular, directly adjacent to the main body. The limiting element can have the same or, preferably, a lower vertical height than the vertical height of the main body. For example, the ratio of the vertical height of the limiting element or the storage structure to the vertical height of the main body is between 0.4 and 1 (inclusive), for example, between 0.6 and 1 (inclusive), or between 0.8 and 1 (inclusive). To detach the punch, the main body can be sheared laterally at the limiting element.

[0019] The vertical height of the boundary element or storage structure refers specifically to its vertical extension above the mounting surface. In other words, the vertical height of the boundary element or storage structure indicates the height that projects above the mounting surface. It is possible that the storage structure, particularly the boundary element, may have a section located below the mounting surface. The total vertical height of the storage structure or boundary element is determined by the combined vertical heights of the storage structure or boundary element above and below the mounting surface.

[0020] According to at least one embodiment of the component, the storage structure has a boundary element that has a greater vertical height than the vertical height of the main body. Preferably, the boundary element partially covers the main body in a top view of the mounting surface. The boundary element can have a curved, angled, or branched shape. For example, the boundary element is L-shaped in a top view of the mounting surface and / or in a sectional view. In a sectional view, the boundary element is, for example, L-shaped and, in particular, rotated 90° or 180° clockwise. Such a boundary element has the form of a collar structure. The storage structure can have a plurality of such boundary elements.

[0021] According to at least one embodiment of the component, the main body has electrical contact surfaces on a surface facing the substrate. These electrical contact surfaces can be configured as electrical contact layers. In particular, the electrical contact surfaces are designed for electrical contacting the main body or the semiconductor body. The contact surfaces can be assigned to different electrical polarities of the main body or the component. It is possible that the electrical contact surfaces are arranged exclusively on the surface of the main body facing the substrate. For example, the main body is a semiconductor chip, particularly one with contact surfaces exclusively on the back. For example, the main body is a flip chip.

[0022] According to at least one embodiment of the component, the carrier has electrical connection surfaces. In particular, the electrical contact surfaces of the main body are electrically connected to the electrical connection surfaces of the carrier. The electrical connection surfaces of the carrier can be assigned to different electrical polarities of the component. For example, the connection surfaces are electrically connected to conductor tracks of the carrier. It is possible that the connection surfaces are surfaces of the conductor tracks. Alternatively, it is possible that the electrical connection surfaces of the carrier are surfaces of through-holes that extend, in particular, through the carrier or at least through a base body of the carrier, such that the through-holes can be electrically contacted, for example, on a rear side of the carrier facing away from the main body.It is also possible that the connection surfaces are surfaces of connection layers arranged on the carrier or on the base body of the carrier, wherein the connection layers are preferably electrically connected to the conductor tracks or to the through contacts of the carrier.

[0023] According to at least one embodiment of the component, it has several main bodies. The main bodies can be arranged spatially spaced apart from one another on the mounting surface. Preferably, the storage structure has a plurality of boundary elements. The main bodies can each be directly adjacent to one of the boundary elements, such that the positions of the main bodies are limited by the associated boundary elements at least along one or more lateral directions. For example, each of the main bodies is uniquely assigned to one of the boundary elements, and in particular, vice versa. For example, the component is a heterogeneous microsystem with microelectronic components and / or circuits. The main bodies can be LEDs, in particular micro-LEDs.

[0024] According to at least one embodiment of the component, the carrier has an adhesive top layer. In particular, the mounting surface is formed by a surface of the top layer. In a top view of the mounting surface, the top layer can at least partially or completely cover the electrical connection surfaces. To establish electrical connections between the connection surfaces of the carrier and the electrical contact surfaces of the main body, the main body can be pressed into the top layer such that the electrical contact surfaces of the main body are in direct electrical contact with the electrical connection surfaces of the carrier. For example, the main body has contact layers with spikes that extend through the top layer to the connection surfaces of the carrier.

[0025] According to at least one embodiment of the component, the cover layer is formed from an electrically insulating material. For example, the cover layer has an adhesive surface facing the semiconductor body. It is also possible for the cover layer to be formed from an adhesion-promoting material. For example, the cover layer is formed from a so-called spin-on material. Such a cover layer is particularly free of topographic steps and is planar. Furthermore, such a material can have a high degree of tackiness sufficient to adhere the main body to the mounting surface, particularly temporarily.

[0026] According to at least one embodiment of the component, the deposit structure extends through the cover layer to the electrical connection surfaces. Viewed from above, the deposit structure can partially cover the connection surfaces. In particular, the cover layer, the deposit structure, and the connection layers with the connection surfaces are formed from different materials. The deposit structure can be formed on the connection surfaces before the cover layer is applied to them.

[0027] According to at least one embodiment of the component, the carrier has an adhesive top layer, with the depositing structure arranged on this top layer. The depositing structure, which is preferably made of an electrically conductive material, can be electrically insulated from the contact surfaces by the top layer. Alternatively, the depositing structure can be made of an electrically insulating material.

[0028] According to at least one embodiment of the component, the storage structure is formed as part of the cover layer. In particular, the cover layer and the storage structure are formed integrally. The storage structure can have a plurality of boundary elements, which are designed as vertical protrusions of the cover layer.

[0029] According to at least one embodiment of the component, the carrier has a base body. The base body can be made of an electrically insulating or an electrically conductive material. The carrier can have electrical connection surfaces and an intermediate layer. In particular, the intermediate layer is arranged along the vertical direction between the base body and the connection surfaces or between the base body and the cover layer. For example, the intermediate layer is arranged at least partially in the vertical direction between the base body and the connection layers.

[0030] According to at least one embodiment of the component, the mounting surface of the carrier is formed by the electrical connection surfaces. The carrier can be designed without the cover layer described above. The connection surfaces are, in particular, partially accessible. The storage structure can be arranged on the electrical connection surfaces. It is possible that the storage structure and the connection layers are made of the same material as the connection surfaces or of different materials. For example, the storage structure is made of a metal or of an electrically insulating material. The intermediate layer is, in particular, made of an electrically insulating material. The intermediate layer is preferably electrically insulating. If the connection layers or the connection surfaces are located on the intermediate layer, they can be spatially separated from each other and / or electrically insulated from each other. According to at least one embodiment of the component, the boundary element of the storage structure, viewed from above on the mounting surface, is designed as a point, a strip, or an angled element. If the boundary element is strip-shaped or angled, it can have a lateral width that is particularly greater than a corresponding width of the main body. If the boundary element is point-shaped, the storage structure can have several such point-shaped boundary elements to which the main body directly abuts. It is possible for a single main body to abut two or more than two, for example, three or four point-shaped boundary elements. In this case, the main body has a lateral width that is particularly greater than a corresponding lateral width of the point-shaped boundary element.

[0031] In at least one embodiment of a method for manufacturing a component, a plurality of main bodies are provided. Each main body can comprise a semiconductor body. The main bodies are preferably arranged on an auxiliary carrier such that they are removable from the auxiliary carrier. In other words, the main bodies can be detached from the auxiliary carrier without being damaged. A carrier with a mounting surface for receiving at least one or all of the main bodies is also provided. A storage structure is formed on the mounting surface and projects vertically beyond it. By means of an adhering punch or a plurality of adhering punches, at least one or all of the main bodies are transferred from the auxiliary carrier to the mounting surface of the carrier.The main body, or multiple main bodies, is sheared off the support structure to detach the adhering punch(es) from the main body(s). The support structure thus acts as a boundary, stop, or obstacle during the shearing process, ensuring that the punch can be reliably detached from the main body, particularly without any displacement of its position. After the punch is detached from the main body, the main body is located directly adjacent to the support structure. For example, the main body is in direct physical contact with a boundary element of the support structure.

[0032] According to at least one embodiment of the method, the storage structure has a plurality of limiting elements. Several main bodies are simultaneously detached from the auxiliary carrier by means of several adhering stamps and transferred to the mounting surface at the same time.

[0033] The main bodies are sheared off the adhering punches, particularly at the limiting elements, and thus detached from them. The punches are, in particular, polymer punches, silicone punches, or PDMS (polydimethylsiloxane) punches. For example, the punch has an exposed adhesive surface for receiving at least one of the main bodies. The punch can be made of an elastic, especially stretchable, material. The limiting elements facilitate the shearing of the main bodies off the adhering punches and, at the same time, define the positions of the main bodies on the mounting surface, so that their arrangement on the mounting surface can be precisely adjusted.

[0034] According to at least one embodiment of the method, the main bodies are mechanically connected to the auxiliary carrier exclusively via breakable or detachable retaining structures. The retaining structures are preferably designed such that they release the main bodies, particularly under mechanical load, so that the main bodies can be detached from the auxiliary carrier and thus transferred or printed. The mechanical load can be a tensile or compressive force exerted on the retaining structure. For example, the retaining structures are designed with respect to their geometries and / or materials such that they are mechanically breakable or detachable under mechanical load. The main bodies can be glued to the punches so that they can be picked up one after the other or in groups from the auxiliary carrier and transferred to the mounting surface of the carrier.

[0035] The support structures are located directly adjacent to the main body. They can be positioned laterally, below, and / or partially above the respective main body. If the support structures are located below a main body, for example, between the main body and the auxiliary support, the main body may partially or completely cover the support structures when viewed from above. If the support structures are located exclusively laterally to a main body, the support structures and the main body may be free of overlap when viewed from above the auxiliary support. It is possible that the support structure(s) is / are configured such that it is / are partially laterally and partially above the associated main body. After detachment from the auxiliary support, the main body may exhibit remnants or separation marks from the support structures.

[0036] According to at least one embodiment of the method, the support structure is temporarily formed on the mounting surface. The support structure can be removed after the main body has been fixed to the mounting surface. For example, the support structure is removed from the mounting surface after the main body or bodies have been sheared off. The support structure is preferably made of a coating material, in particular a photostructurable material. A support structure made of such a material can be easily structured on the mounting surface and, if necessary, later removed from the mounting surface.

[0037] The method described here for manufacturing one or more components is particularly suitable for manufacturing the component described herein. The characteristics described in connection with the component can therefore also be applied to the method, and vice versa.

[0038] Further preferred embodiments and developments of the component and of the method for manufacturing the component are described below in conjunction with the Fig. Examples 1A to 6 are explained.

[0039] They show: Fig. 1A, Fig. 1B, Fig. 1C, Fig. 1D, Fig. 1E and Fig. 1F Schematic representations of various process steps of a process for manufacturing a component, Fig. 2A, Fig. 2B and Fig. 2C Schematic representations of a support for a building element in sectional view and in top view of the mounting surface, Fig. 3 and Fig. 4 schematic representations of further embodiments of a support for a building element in sectional views, and Fig. 5 and Fig. 6 schematic representations of further embodiments of a component in sectional views.

[0040] Identical, similar, or similarly functioning elements are marked with the same reference symbols in the figures. The figures are schematic representations and therefore not necessarily to scale. Rather, comparatively small elements, and especially layer thicknesses, may be exaggerated for clarity.

[0041] In Fig. In 1A, a plurality of main bodies 2H are arranged on an auxiliary carrier 1H. The main bodies 2H are spatially spaced apart from each other in lateral directions. Each main body 2H can have a semiconductor body 2. In particular, the main bodies 2H are mechanically connected to the auxiliary carrier 1H via retaining structures 5. Preferably, the main bodies 2H are mechanically connected to the auxiliary carrier 1H exclusively via the retaining structures 5. In other words, the retaining structures 5 are the only connecting elements between the auxiliary carrier 1 and the main bodies 2H. The retaining structures 5 directly abut both the main bodies 2H and the auxiliary carrier 1H. In particular, the retaining structures 5 are designed to be mechanically breakable, so that the main bodies 2H can be detached from the auxiliary carrier 1H, for example, by breaking the retaining structures 5.

[0042] According to Fig. In 1A, the main bodies 2H are each assigned to one of the support structures 5, and preferably vice versa. The support structure 5 is arranged partly laterally to the associated main body 2H and partly on a surface of the associated main body 2H facing away from the auxiliary support 1H. In plan view, the support structure 5 partially covers the surface of the associated main body 2H. In contrast to the Fig. 1A It is possible that the retaining structures 5 are arranged exclusively below the main bodies 2H or exclusively laterally to the main bodies 2H. In particular, there is a gap 25, especially a cavity 25, between the auxiliary support 1H and the associated main body 2H. The retaining structures 5 are particularly adjacent to the gap 25. The gaps 25 may be previously filled with a sacrificial layer, which is removed after the retaining structures 5 have formed. In particular, the retaining structures 5 are arranged such that they are mechanically broken by lifting or pressing down on the main bodies 2H. The main bodies 2H can thus be removed individually or in groups from the auxiliary support 1.

[0043] According to Fig. In section 1B, a support 1 is provided. The support 1 has a base body 11, an intermediate layer 12, and a top layer 13. The support 1 also has a plurality of connection layers 7, each of which has a surface 71 or 72 facing away from the base body 11. The surfaces 71 or 72 can each be formed as the first connection surface 71 or as the second connection surface 72 of the support 1. Along the vertical direction, the intermediate layer 12 is arranged between the base body 11 and the top layer 13 or between the base body 11 and the connection layers 7. The intermediate layer 12 is, in particular, an electrically insulating layer.

[0044] The top layer 13 is formed, in particular, from an electrically insulating material and may include an adhesion promoter. For example, the top layer 13 is formed from an epoxy material, such as an INTERVIA© material. Preferably, the top layer 13 is formed from a spin-on material, which is applied, in particular, by rotational coating to the base body 11, the intermediate layer 12, and / or the connection layers 7. In particular, the top layer 13 has a surface 1M facing away from the base body 11, which is formed, for example, as a mounting surface 1M of the carrier 1. The mounting surface 1M is, in particular, an exposed and adhesive surface of the carrier 1. In a top view of the mounting surface 1M, the top layer 13 can partially or completely cover the connection layers 7 or the connection surfaces 71 and 72.

[0045] The carrier 1 has a storage structure 3 that projects along the vertical direction beyond the mounting surface 1M. Outside the storage structure 3, the mounting surface 1M can be planar. Outside the areas of the storage structure 3 and the areas provided for the electrical contacting of the main body 2H, the cover layer 13 can completely cover the connection layers 7 or the connection surfaces 71 and 72 in plan view.

[0046] The storage structure 3 has a plurality of boundary elements 3B. According to Fig. The boundary elements 3B extend through the cover layer 13 to the connection layers 7. Each boundary element 3B has a total vertical height 3GV. The total vertical height 3GV is therefore also the total vertical height of the storage structure 3. The boundary elements 3B project from the mounting surface 1M above the mounting surface 1M by a vertical height 3V. The storage structure 3, or the boundary element, thus has a vertical height 3V above the mounting surface 1M.

[0047] According to Fig. 1B The main bodies 2H are removed from the auxiliary carrier 1H, in particular by breaking or detaching the retaining structures 5, either individually or in groups. For this purpose, an adhesive punch 4 or a plurality of adhesive punches 4 can be used. The main bodies 2H can be glued to the punches 5, detached from the auxiliary carrier 1H and / or from the retaining structures 5, and, in particular, transferred to the mounting surface 1M of the carrier 1 by the punches 4 in the same process step.

[0048] In particular, the main bodies 2H each have an exposed surface facing away from the auxiliary carrier 1H, which is preferably planar. The main bodies 2H can be attached to the punches 4 by a direct bonding process. The punches 4 are preferably made of a plastic material, for example, an elastic material. In particular, the punches 4 are designed such that they can be peeled off the main bodies 2H by a slow shearing motion, leaving the main bodies 2H on the mounting surface 1M. In this way, the main bodies 2H can be printed onto the mounting surface 1M individually or in groups. The main bodies 2H are thus designed to be printable. According to Fig. 1B, the main body 2H has a vertical height 2V. In particular, the vertical height 2V of the main body is equal to or less than the vertical height 3V or the total vertical height 3GV of the associated boundary element 3B.

[0049] In Fig. Figure 1C schematically shows the support 1 in a top view of the mounting surface 1M. The mounting surface 1M is formed by a surface of the cover layer 13. In a top view of the mounting surface 1M, the cover layer completely covers the underlying connection layers 7. The support 1 can have a plurality of adjacent connection layers 7, with at least one limiting element 3B of the storage structure 3 arranged on each of the connection layers 7. In a top view of the mounting surface 1M, the limiting element 3B can partially cover the first connection surface 71 or the second connection surface 72.

[0050] In Fig. In 1C, the limiting element 3B, viewed from above on the mounting surface 1M, has the form of an angled or branched strip on the connection surface 71 or 72. If a main body 2H is fixed on the mounting surface 1M or on the connection surface 71 or 72, the limiting element 3B can limit the main body 2H in at least one lateral direction or in two lateral directions. In contrast to the Fig. 1C The limiting element 3B can have other shapes, such as a simple strip, a curved strip, or a rectangle, for example, a square. Alternatively, the limiting element 3B can be designed as a point. The limiting elements 3B can be formed from several separate points, such as two, three, or four points, on the mounting surface 1M, in particular on the same connection surface 71 or 72.

[0051] According to Fig. In step 1D, the main bodies 2H are placed onto the mounting surface 1M. The main body 2H can initially be positioned on the mounting surface 1M such that it is laterally spaced from the storage structure, in particular from its associated boundary element 3B. Thus, there is a lateral gap between the main body 2H and the associated boundary element 3B. The position of the main body 2H on the mounting surface 1M is therefore initially adjusted optically using the punch 4. The main body 2H is, for example, in direct physical contact with the mounting surface 1M or with the cover layer 13. This is achieved by means of a process similar to that described in the... Fig. 1E The lateral shearing movement indicated by the arrow, in which the main body 2H is moved laterally, approximately perpendicular to the main body's orientation, until it reaches the associated limiting element 3B, and the storage structure 3 with the limiting element 3B acts as a stop or obstacle for the main body 2H, allows the punch 4 or punches 4 to be detached from the main body 2H, i.e., peeled off. In other words, the main body 2H remains stuck against the limiting elements 3B and thus directly borders the limiting elements 3B or the storage structure 3. Any displacement of the main body 2H can therefore be corrected.

[0052] In Fig. 1F is a component 10 shown schematically in sectional view. The component 10 is in particular designed by a method according to the Fig. 1A to 1E can be manufactured. This is in the Fig. The component 10 shown in 1F thus essentially corresponds to the one shown in the Fig. 1E illustrated embodiment for a component 10. In contrast, contact surfaces or contact points 61 and 62 are in the Fig. 1F schematically represented. Such contact surfaces or contact points 61 and 62 can also be located at the points shown in the Fig. 1A to 1E may be present, but these are not shown for clarity. The contact surfaces or contact points 6, 61 and 62 are formed exclusively on a surface of the main body 2H facing the support 1. In particular, the main body 2H has a first contact surface 61, which is assigned to a first electrical polarity of the main body 2H or of the component 10. The main body 2H has a second contact surface 62, which is assigned to a second electrical polarity of the main body 2H or of the component 10, different from the first electrical polarity.

[0053] The contact points 61 and 62 can each have a pointed shape, allowing them to pierce the cover layer 13 with only slight pressure and thus reach the connection surface 71 or 72. Alternatively, the contact points 61 and 62 can be flat. Another option is to bring the contact surfaces 61 or 62 of the main body 2H into electrical contact with the underlying electrical connection surfaces 71 and 72 through tempering steps, utilizing the thermal shrinkage of the cover layer 13.

[0054] The one in Fig. The embodiment shown in Figure 2A for a support 1 essentially corresponds to the one shown in the Fig. The carrier 1 shown in Figure 1A is different. In contrast, the deposit structure 3 is arranged on the top layer 13, specifically exclusively on the top layer 13. The boundary elements 3B of the deposit structure 3 do not extend into or through the top layer 13. The top layer 13 is located vertically in certain areas between the deposit structure 3 and the connecting layer 7 associated with the boundary element 3B. The deposit structure 3 is thus applied to the top layer 13 only after the top layer 13 has been formed. This has the advantage that the boundary elements 3B do not cause disturbances in the flow of the material of the top layer 13, for example, during the spin coating process. The deposit structure 3 can be made of an electrically conductive material, such as a metal like copper or gold.The covering layer 13, which is designed to be electrically insulating, electrically isolates the depositing structure 3 from the connecting layers 7.

[0055] The in the Fig. 2B and Fig. The embodiments for a support 1 shown in 2C essentially correspond to the one in the Fig. 1C illustrated embodiment for a support 1. In contrast, in the Fig. 2B and Fig. Figure 2C shows that the carrier 1 has a first contact surface 71 and a second contact surface 72 spatially separated from the first contact surface 71. Due to the spatial separation of the contact surfaces 71 and 72, they are electrically isolated from each other. The main body 2H can be applied to the mounting surface 1M such that the first contact surface 61 is in electrical contact with the first contact surface 71 and the second contact surface 62 of the main body 2H is in electrical contact with the second contact surface 72 of the carrier 1. Fig. 2B and Fig. 2C shows only a section of beam 1 in plan view. In contrast, beam 1 can have multiple first connection surfaces 71 and multiple second connection surfaces 72.

[0056] According to Fig. 2B is a boundary element 3B configured such that, in plan view of the mounting surface 1M, it bridges the connection surfaces 71 and 72. In other words, in plan view, the boundary element 3B of the storage structure 3 at least partially covers both the first connection surface 71 and the second connection surface 72. The boundary element 3B can be in the form of a strip. The storage structure 3 can have a plurality of such boundary elements 3B, each of which is assigned to exactly one of the first connection surfaces 71 and exactly one of the second connection surfaces 72.

[0057] Unlike in the Fig. 2B are the boundary elements 3B in the Fig. 2C is implemented as a point. In particular, several boundary elements 3B, such as two or more than two boundary elements 3B, are located on a single connection surface 71 or 72. As in the Fig. As shown schematically in Figure 2C, the adjacent connection surface 71 can be free of the boundary elements 3B. The support 1 can thus have pairs of first and second connection surfaces 71 and 72, each pair consisting of a first connection surface 71 and a second connection surface 72 preferably being configured to receive at least one main body 2H. One or more boundary elements 3B can be arranged on one of the connection surfaces 71 or 72. The other connection surface 71 or 72 of the pair can be free from being covered by the boundary element 3B or by the storage structure 3.

[0058] The one in Fig. The embodiment shown in section 3 essentially corresponds to the one described in the Fig. 2A shows an embodiment of a carrier 1. In contrast, the deposit structure 3 is formed as part of the cover layer 13. The deposit structure 3 with the boundary elements 3B and the remaining areas of the cover layer 13 can be made of the same material. It is possible that the cover layer 13 is made of a photostructurable material. The deposit structure 3 with the boundary elements 3B can be formed by exposing the photostructurable material. Alternatively, it is possible that the cover layer 13 is made of a different electrically insulating material.

[0059] The top layer 13 borders directly on the connecting layers 7. The top layer 13 is formed with the deposit structure 3 according to... Fig. 3. It is possible that a first partial layer of the cover layer 13 is initially applied to the base body 11, or to the intermediate layer 12, or to the connecting layers 7. To form the deposit structure 3, a second partial layer of the cover layer 13 is applied to the first partial layer, the second partial layer being subsequently structured, particularly in relation to the boundary elements 3B.

[0060] The one in Fig. The embodiment shown in section 4 essentially corresponds to the one described in the Fig. 3. In the embodiment shown, the carrier 1 is a carrier. In contrast, the storage structure 3 is arranged directly on the connection layer 7 or on the connection layers 7. The carrier 1 is, in particular, free of the cover layer 13 described above. The mounting surface 1M is formed, in particular, by the surfaces of the connection layers 7.

[0061] In particular, the connection surfaces 71 and 72 partially form the mounting surface 1M. In this case, the connection layers 7 can have a solder layer or an electrically conductive connecting layer.

[0062] The boundary elements 3B of the storage structure 3 can be made of an electrically conductive or an electrically insulating material. It is possible that the boundary elements 3B are made of a photostructurable material. In particular, the storage structure 3 is formed from a photoresist layer. In all described embodiments, it is possible that the storage structure is removed from the component 10 after the main body 2H has been applied or after the main bodies 2H have been applied. If a main body 2H is applied to the component 10, approximately as described above, the storage structure can be removed from the component 10. Fig. When the mounting surface 1M shown in Figure 4 is applied, a contact surface 61 or 62 can already be in direct electrical contact with the connection surface 71 or 72 upon placement on the mounting surface 1M. In this case, piercing the cover layer 13 to create an electrical contact between the contact points of the main body 2H and the connection layers 7 of the carrier 1 is not necessary.

[0063] The one in Fig. The embodiment shown in section 5 essentially corresponds to the one described in the Fig. 4. Exemplary embodiment for a support 1 or for a component 10 shown. In contrast, the main bodies 2H are shown on the mounting surface 1M. Such main bodies 2H can be mounted on a surface in the Fig. 2A, Fig. 3 and Fig. The components 10 are arranged on the carrier 1 shown in Figure 4. Alternatively, the component 10 may have a single main body 2H. If the component 10 has multiple main bodies 2H, the main bodies 2H of the same component 10 may be electrically connected to each other or electrically insulated from each other. The main bodies 2H may, for example, be individually controllable. In other words, the main bodies 2H may be individually electrically contactable. Alternatively, the main bodies 2H may be designed as optoelectronic or electrical components that form an electronic system comprising light-emitting components, light-detecting components, circuits, and / or control units. The main bodies 2H may be optoelectronic components, protective elements, circuits, and / or control units.

[0064] According to Fig. In Figure 5, the storage structure 3 has a plurality of boundary elements 3B. In plan view, the boundary element 3B can partially cover the main body 2H. In particular, the boundary element 3B has a first sublayer that abuts the main body 2H laterally, and especially directly abuts it. The boundary element 3B has a second sublayer arranged on the first sublayer, which partially covers the main body 2H in plan view. In plan view, the second sublayer at least partially covers the first sublayer and projects laterally beyond the first sublayer. In this case, the boundary element 3B has a so-called collar structure.

[0065] The one in Fig. The embodiment shown in section 6 essentially corresponds to the one described in the Fig. The embodiment shown in Figure 1F is an embodiment of a component 10. In contrast, the storage structure 3 is no longer present in the completed component 10. Furthermore, in the Fig. Figure 6 shows that the first contact surface 61 and the second contact surface 62 are in electrical contact with the first terminal surface 71 and the second terminal surface 72, respectively, wherein the first terminal surface 71 and the second terminal surface 72 can be assigned different polarities of the main body 2H or the component 10. In a top view, the terminal surfaces 71 and 72 can be arranged analogously to those shown in the Fig. 2B and Fig. The connection surfaces 71 and 72 shown in 2C must be designed accordingly.

[0066] In all embodiments described here, it is possible for the connection surfaces 71 and 72 to be externally electrically contactable on one side surface, on several side surfaces, on a rear surface facing away from the main body 2H, and in particular exclusively on the rear surface of the carrier 1. If the connection surfaces 71 and 72 are externally electrically contactable exclusively on the rear surface of the carrier 1, the carrier 1 can be configured differently from the Fig. 6 through-contacts that are accessible on the back of the carrier. In particular, the through-contacts extend from the back of the carrier 1 through the base body 11 and the intermediate layer 12 to the connection layer 7 or to the connection surfaces 71 and 72. Reference symbol list 10 building elements 1 carrier 11 Basic body of the carrier 12 Intermediate layer of the carrier 13 Top layer of the carrier 1M mounting surface 1H Auxiliary carrier 2H Main Body 2 Semiconductor bodies 2V vertical height of the main body 25 space 3 Filing structure 3B Boundary element 3V vertical height of the boundary element / vertical height of the storage structure 3GV vertical total height of the boundary element / vertical total height of the storage structure 4 stamps 5. Holding structure / holding layer 6 Contact area 61 first contact surface 62 second contact surface 7 Connection layer 71 first connection area 72 second connection surface

Claims

[1] Component (10) comprising a support (1) and at least one main body (2H), wherein - the main body has a semiconductor body (2), - the carrier has a mounting surface (1M) on which the main body is arranged, - a storage structure (3) is formed on the mounting surface and projects vertically beyond the mounting surface, and - the main body is directly adjacent to the storage structure, so that the position of the main body is limited by the storage structure at least along a lateral direction. [2] Component (10) according to claim 1, wherein the storage structure (3) has at least one limiting element (3B) that is directly adjacent to the main body (2H) and has a vertical height (3V) equal to or less than a vertical height (2V) of the main body. [3] Component (10) according to claim 2, wherein the ratio of the vertical height (3V) of the limiting element (3B) or the storage structure (3) to the vertical height (2V) of the main body (2H) is between inclusive 0.4 and inclusive 1. [4] Component (10) according to claim 1, wherein the storage structure (3) has a limiting element (3B) which has a greater vertical height (3V) than a vertical height (2V) of the main body (2H), wherein the limiting element is directly adjacent to the main body and partially covers the main body in a top view of the mounting surface (1M). [5] Component (10) according to any one of the preceding claims, wherein - the main body (2H) has electrical contact surfaces (6, 61, 62) on a surface of the main body facing the support (1), - the electrical contact surfaces are set up for electrical contacting of the semiconductor body (2), and - the carrier has electrical connection surfaces (71, 72) wherein the electrical contact surfaces of the main body are electrically connected to the electrical connection surfaces of the carrier. [6] Component (10) according to any one of the preceding claims, wherein - several main bodies (2H) are arranged spatially apart from each other on the mounting surface (1M), - the storage structure (3) has a plurality of boundary elements (3B), and - the main bodies each directly adjoin one of the boundary elements, so that the positions of the main bodies are limited at least along a lateral direction by the associated boundary elements. [7] Component (10) according to one of claims 1 to 6, wherein the carrier (1) has an adhesive top layer (13) and electrical connection surfaces (71, 72), wherein - the mounting surface (1M) is formed by a surface of the top layer, - in plan view of the mounting surface, the top layer at least partially covers the electrical connection surfaces (71, 72), and - the storage structure (3) extends through the top layer to the electrical connection surfaces. [8] Component (10) according to one of claims 1 to 6, wherein the carrier (1) has an adhesive top layer (13) and electrical connection surfaces (71, 72), wherein - the mounting surface (1M) is formed by a surface of the top layer, - in plan view of the mounting surface, the top layer at least partially covers the electrical connection surfaces (71, 72), and - the storage structure (3) is arranged on the top layer and is separated from the electrical connection surfaces by the top layer. [9] Component (10) according to one of claims 1 to 6, wherein the carrier (1) has an adhesive top layer (13) and electrical connection surfaces (71, 72), wherein - the mounting surface (1M) is formed by a surface of the top layer, - in plan view of the mounting surface, the top layer at least partially covers the electrical connection surfaces (71, 72), and - the deposit structure (3) is formed as part of the top layer. [10] Component (10) according to one of claims 1 to 6, wherein the carrier (1) has a base body (11), electrical connection surfaces (71, 72) and an intermediate layer (12), wherein - the mounting surface (1M) is formed by the electrical connection surfaces, - the intermediate layer is arranged along the vertical direction between the base body and the electrical connection surfaces, and - the storage structure (3) is arranged on the electrical connection surfaces. [11] Component (10) according to one of the preceding claims, wherein the storage structure (3) has a limiting element (3B) which, in plan view of the mounting surface (1M), is designed as a point, strip or angled element. [12] Method for manufacturing a component (10) comprising the following steps: - Providing a plurality of main bodies (2H), each comprising a semiconductor body (2) and arranged on an auxiliary carrier (1H), wherein the main bodies are designed to be removable from the auxiliary carrier; - Providing a carrier (1) with a mounting surface (1M) for receiving at least one of the main bodies, wherein a storage structure (3) is formed on the mounting surface and projects vertically beyond the mounting surface; - Transferring at least one of the main bodies from the auxiliary support to the mounting surface of the support by means of an adhering punch (4); and - Shearing off the main body at the depositing structure to detach the adhering stamp from the main body. [13] The method of claim 12, wherein - the storage structure (3) has a plurality of boundary elements (3B), - several main bodies (2H) are simultaneously detached from the auxiliary carrier (1H) and transferred to the mounting surface (1M) using several adhering punches (4), and - the main bodies are sheared off the adhering stamps at the boundary elements and thus detached from them. [14] Method according to one of claims 12 to 13, wherein the main bodies (2H) are mechanically connected to the auxiliary carrier (1H) exclusively via breakable or detachable retaining structures (5). [15] Method according to any one of claims 12 to 14, wherein the storage structure (3) is temporarily formed on the mounting surface (1M), the storage structure being removed after fixing the main body (2H) on the mounting surface.

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