Sensor substrate with electronics and its use

Abstract

Electrically conductive sensor substrate (1) comprising at least one electrically conductive sensor material in combination with an electrically non-conductive support, with at least two areas, a first, transparent area which serves as a sensor and reacts upon touch and / or approach with analog value changes which can be detected as analog electrical signals and a second, further area which provides digital signals, wherein the sensor substrate has conductors which lead from the first area to at least one component which is arranged on and / or on the second area, and wherein the component converts analog value changes of the sensor into digital signals.

Description

[0001] The invention relates to a sensor substrate, such as a touch sensor with integrated electronics, for example with a chip. The invention also relates to the use of the sensor substrate.

[0002] Newer electronic components are increasingly being miniaturized, with particular attention paid to cost-effective manufacturing.

[0003] A crucial component in the design of electronic input devices such as touch sensors (also known as touchscreens), other sensors, and / or displays is the surrounding electronics, particularly the arrangement and / or connection of the driver electronics to the actual sensor and / or display. The driver electronics always include integrated circuits implemented on chips, i.e., wafers, for example, made of silicon. The driver electronics convert, for instance, the numerous individual analog signals from the touch sensor into digital signals that require significantly fewer lines for transmission—for example, only four.

[0004] These are sensors and displays with associated electronics, for example, from the publication "Development of a Display Module Using Flip Chip on Flex" by J. Simon, J. Gwiasda et al. of the Technical University of Berlin, published in Proceedings of the 1995 Japan International Electronic Manufacturing Technology Symposium, Omiya, Japan, 1995, pp. 48-51. There, the driver electronics are connected to the sensor or display via a printed circuit board, one or more chips, and various SMDs (surface-mounted devices) on one or both sides of the board, using conductors such as solder joints and / or electrically conductive adhesives, especially anisotropic conductive film (ACF) adhesives.Conventional printed circuit boards (PCBs) are flexible plastic substrates that provide space for the chip, necessary SMDs, ACF bonding pads (connection points with electrical contacts), and, if necessary, the associated wiring. These are connected to a corresponding end device via a contact type such as ZIF (Zero Insertion Force) contact. Due to the size and material used for flexible PCBs, the costs and manufacturing effort are considerable.

[0005] From US 2015 / 0 169 103 A1, an electrically conductive substrate is known which includes a transparent area and an area for transmitting the signals.

[0006] From US patent 2013 / 0038378A1, an electrically conductive sensor substrate is known, comprising contact pads and a controller unit. The controller unit is not attached to the substrate.

[0007] From US 2008 / 0 314 654 A1 a sensor with connecting electrodes is known and the A / D conversion is mentioned, but it is not revealed where a component for A / D conversion is to be placed.

[0008] From EP 2 907 010 B1, a touch sensor with a tail is known, wherein a component is galvanically coupled via contact connections in the contact area. The A / D conversion is not addressed.

[0009] Up to now, touch sensors – preferably transparent – ​​have generally been manufactured on conductive sensor substrates such as expensive, electrically conductive, and transparent metal oxides, for example, ITO (indium tin oxide), on corresponding carriers. This material is not only expensive but also difficult to handle. Therefore, parts made from this material are also relatively costly.

[0010] The circuit board with the driver electronics is currently bonded to the electrically conductive transparent sensor substrate in at least one process step, preferably, but not necessarily, using an electrically conductive adhesive. This is the most cost-effective solution.

[0011] A disadvantage is that the adhesive bond has to be created separately, resulting in both material costs for the circuit board and the effort required for gluing. In addition to the disadvantage that gluing or bonding also means an additional manufacturing effort, which is particularly complex because handling the transparent metal oxide sensor substrates is tricky.

[0012] Therefore, the purpose of the present invention is to overcome the disadvantages of the prior art and to simplify the connection of driver electronics to input modules such as sensors, touch sensors and / or displays.

[0013] This problem is solved by the subject matter of the present application, as disclosed in the description, figures and claims.

[0014] Accordingly, the solution to the problem and the subject matter of the present invention is an electrically conductive sensor substrate comprising at least one electrically conductive sensor material in combination with an electrically non-conductive carrier, with at least two areas, a first, transparent area which serves as a sensor and reacts upon contact and / or approach with analog value changes which can be detected as analog electrical signals, and a second, further area which provides digital signals, wherein the sensor substrate has conductors which lead from the first area to at least one component which is arranged on and / or at the second area, and wherein the component converts analog value changes of the sensor into digital signals.

[0015] Furthermore, the present invention relates to the use of such a sensor substrate as a touch sensor, in a touchscreen, a display and / or in other electronic devices with a transparent input module.

[0016] The second area lies at least partially on the sensor substrate, but may be supplemented by a printed circuit board or part of a printed circuit board. This second area is referred to as the "post-processing area" because it transmits the changes in value generated in the transparent first area of ​​the sensor substrate to evaluation electronics in the form of digital signals. The second area is, for example, a tail with an electrical connection option such as a ZIF, non-ZIF, crimp contact, solder contact, and / or pads for contact springs.

[0017] A component that converts analog value changes of the sensor area into digital signals and can be used in touch sensors is, for example, a microcontroller or a touch controller.

[0018] The term "component" here refers to one or more individual electronic elements such as a chip, capacitor, resistor, transistor, diode, inductor, capacitance, coil, relay, each individually or in groups, possibly also in the form of a module on a printed circuit board or a piece of a printed circuit board.

[0019] A "module" refers to one or more individual electronic elements that are grouped together and mounted on, under and / or attached to a printed circuit board or a piece of a printed circuit board.

[0020] The general finding of the invention is that, by using a suitable sensor substrate and a suitable arrangement of the conductor tracks and lines, it is possible to realize the following on a single carrier: - comprising a sensor, a transparent conductive area, - at least one component that outputs the analog value changes of the sensor as digital signals, and finally - the conductor tracks and / or lines in between that lead to or serve for contacting, such as the ZIF contact.

[0021] In this context, a "sensor substrate" is defined as an electrically conductive and preferably at least partially transparent sensor substrate. For example, it could be a transparent, electrically conductive metal oxide layer, such as an ITO layer, or the well-known PolyTC®, which is a metal wire mesh where the non-transparent metal wires are so narrow that the mesh can be designed to appear transparent to the human eye. This electrically conductive layer is bonded to a support, such as a transparent, non-electrically conductive plastic film, and / or to a support to form the sensor substrate. However, a sensor substrate can also be a conductive transparent layer made of, for example, conductive nanowires, partially or completely embedded in a transparent plastic matrix. The sensor substrate is generally known to those skilled in the art from the technology for manufacturing touch sensors.

[0022] The term "conductor traces" here refers to the conductor traces of PolyTC®, which, due to their thinness, can be laid out on a plastic film despite their non-transparent material, especially metal wire, in such a way as to ensure planar electrical conductivity while maintaining transparency. Conductor traces differ from wires in that they can appear transparent even though they are made of non-transparent material.

[0023] In this context, "conductors" are understood to mean electrical conductors that, for example, connect an electrical component to an electrical contact, such as a bonding pad. A conductor in this sense can be formed by a pattern of multiple conductive traces. The conductors may be transparent or opaque and are, for example, in the form of screen-printed conductive pastes. Conventional conductors, such as those used in printed circuit boards, circuit boards, and electronics in general, are used as examples of "conductors." A conductor within the meaning of the present invention can also comprise one or more contacts.

[0024] According to an advantageous embodiment of the invention, the component, for example a chip and / or a module, is not completely located on a single sensor substrate with the first area, but is connected to the sensor substrate via bonding pads, ZIFs and / or other contacts, wherein the component is preferably mechanically stabilized, i.e., for example as a module and / or connected to the tail of the sensor substrate on a stiffening plate.

[0025] In principle, the sensor substrate includes at least one first region that is transparent to the human eye. The substrate is typically a transparent plastic film, such as a transparent PET film, which is covered with conductive traces in such a way as to ensure transparency for the human eye. These conductive traces can be transparent and / or opaque. Even with predominantly opaque traces, a carefully selected thickness and width, as well as their arrangement, can still result in a region containing these conductive traces that is transparent to the human eye.

[0026] According to the present invention, the term "sensor" refers to all transparent parts of electronic devices with a transparent input module, i.e., all devices comprising transparent areas. Examples include touch screens and / or displays and other input modules that are divided into individual fields which can be activated capacitively or resistively by touch and / or proximity and which can convert touch, pressure, temperature, magnetism, and light, individually or collectively, into electrical signals. Other sensors, such as optical sensors that emit or absorb radiation, inductive sensors with transparent areas, temperature sensors, pressure sensors, and similar sensors, are also included within the scope of the invention as "sensors."

[0027] Touch sensors are known, for example, from the applicant's patents with the official file numbers DE 10 2011 115 851 B4, DE 102011 111 506 B4 and EP 3092551 B1.

[0028] A sensor material for the sensor substrate to generate planar electrical conductivity is, for example, commercially available ITO and / or the metal wire mesh known to those skilled in the art as PolyTC®, among other things from US 2012 / 0193130 A1 of the applicant, in particular silver wire mesh.

[0029] A sensor substrate comprises, for example, sensor material in the form of non-transparent conductive traces with a thickness ranging from 2 nm to 5 µm. These traces are arranged parallel to the surface of a transparent substrate, forming a pattern such that the spacing within the pattern ensures transparency for the human eye while maintaining the substrate's conductivity. The sensor material is bonded to a substrate, such as a transparent plastic.

[0030] For example, such a sensor substrate has individually electrically connectable electrically conductive segments formed from conductor tracks.

[0031] For example, individual segments have a width ranging from 500 µm to 15 mm. These segments form, for example, conductors.

[0032] The conductor tracks can be transparent or non-transparent, with a width ranging from 1 µm to 40 µm, or – in the case of transparent conductor tracks – of course, larger dimensions.

[0033] The connection between the conductive traces on the sensor substrate and the traces of the chip and / or the SMDs is made, for example, via electrical contacts such as bonding pads with electrically conductive adhesive, such as the aforementioned ACF and / or ICA (isotropic conductive adhesive), and / or solder joints, and / or via through-holes. For mechanical stabilization of the chip and / or the SMDs, stiffening plates and / or smaller circuit board components may be used.

[0034] It is preferably provided that the second area is covered with conductor tracks and / or lines leading to the chip and / or SMDs, optionally as a module at least partially mounted on a circuit board, and is connected to the sensor substrate by conductive adhesive, conductive pads, solder connections and / or vias.

[0035] In one embodiment, the second area on the sensor substrate is designed as a "tail," which is conventionally formed by a separately manufactured circuit board attached to the touch sensor—for example, by gluing. According to the invention, this tail is formed by the sensor substrate itself, particularly its carrier, so that the circuit board is completely or partially eliminated, and the necessary components and wires are connected and mounted on or to the same carrier, which is the part of the sensor substrate with the transparent area, instead of on a separately manufactured circuit board. These components can be surface-mounted devices (SMDs) on the surface of the tail, which forms the second area of ​​the sensor substrate, or alternatively or additionally via through-holes, with both sides of the sensor substrate carrier being usable for arranging the components.

[0036] Advantageously, the second area includes bonding pads, which serve to contact the conductor tracks of the sensor substrate with those of the component or, if applicable, the circuit board on which the component is mounted.

[0037] Preferably, the tail also has a ZIF contact, which is an external contact where the lines of the driver electronics converge and via which the touch sensor and its associated driver electronics can be connected to external modules and / or circuit boards.

[0038] Contact can be made vertically, for example by mounting a chip on the tail. Contact can also be made horizontally, i.e., laterally, by connecting the sensor substrate's conductors, forming traces, and / or connecting traces to the chip's traces via a connector such as a bonding pad. This connection can also be at the end of the chip.

[0039] Depending on the design, the connection of the lines of the sensor substrate and, for example, the chip, can be mechanically stabilized by an additional stiffening.

[0040] For this purpose, a stiffening plate is attached to the underside of the sensor substrate carrier, at the point where it connects to the driver electronics components. This can be, for example, a plastic plate, such as a PET plate, with a thickness of less than 500 µm, particularly between 100 and 400 µm, preferably between 150 and 300 µm, for example, approximately 200 µm. This stiffening plate is simply glued on, for example.

[0041] Despite one or more stiffening plates, the sensor substrate is preferably flexible, i.e., bendable.

[0042] The invention will now be explained in more detail using exemplary embodiments: Fig. Figure 1 shows a touch sensor with driver electronics, in which the components of the driver electronics are vertically connected to the sensor substrate. Fig. Figure 2 shows a touch sensor with driver electronics, in which the components of the driver electronics are horizontally connected to the sensor substrate. Fig. Figure 3 shows various possibilities for the touch sensor with driver electronics on a sensor substrate, including encapsulation of the driver electronics and / or protective film on the sensor substrate.

[0043] Fig. 1 is divided into Fig. 1a and Fig. 1b. Fig. Figure 1a shows the unassembled version with chip 6 next to tail 2 and Fig. Figure 1b shows the assembled product with chip 6 on tail 2.

[0044] In detail, it shows Fig. Figure 1, a large white rectangle, represents the first area, here the transparent sensor 1, with touch buttons (not shown). This sensor 1 comprises, for example, non-transparent conductive traces on a transparent substrate arranged in a pattern. The sensor's structure corresponds, for example, to the designs known from DE 102011 115 851 B4, DE 102011 111 506 B4, and EP 3092551 B1, but can also be implemented using other flexible transparent substrates combined with conductive sensor materials—such as plastic films with nanowires. In any case, sensor 1 comprises a number of touch fields that, during operation, generate analog electrical signals. These signals are transmitted via conductors to one or more contact points. There, the analog signals converge and are forwarded to the driver electronics.The components of the driver electronics include, for example, a chip 6 with an integrated circuit and other SMDs in which the analog signals are converted to digital signals.

[0045] The electrical connection between the driver electronics and the touch sensor is made according to the [document / reference] in [document / reference]. Fig. In the example shown, this is achieved by contacts on the same sensor substrate, so-called bonding pads – contacts 3 and 4. According to the prior art, external lines or wires are required for this electrical connection, running from the touch sensor to a circuit board – which is unnecessary here – on which the components of the driver electronics are arranged. This is eliminated by the invention.

[0046] The bonding pads and contacts 3 and 4 of the driver electronics are located on the same substrate and are made of the same sensor material as the input fields of sensor 1, and can be manufactured in exactly the same way – preferably in the same production step. This is particularly preferably achieved by printing a transparent film with opaque conductive traces. According to a preferred embodiment, the patterns of the conductive traces form electrically individually controllable segments.

[0047] The sensor substrate is preferably a transparent, flexible carrier with a metal wire mesh in the form of opaque, thin conductive traces applied at such a fine resolution, for example by printing with metal paste, that they appear transparent to the human eye. This technique is also used, for example, to construct the lines and connections for the driver electronics. According to a preferred embodiment of the invention, the applicant's product PolyTC®, also known in the trade as "metal mesh," is used for this purpose.

[0048] This material is characterized by high metallic conductivity at high sensor sampling rates and signal quality. It also has high optical transparency and colorfastness. For example, it can be manufactured cost-effectively using a roll-to-roll production process.

[0049] In Fig. 1 is the second area, the so-called "tail" 2, which is also visible. The first and second areas are preferably completed in the same process. Endless strips of the sensor substrate can be produced in a continuous process.

[0050] On tail 2 are bonding pads 3 and 4 for the IN and OUT of the driver electronics, for example a chip 6. In the Fig. In the embodiment shown in Figure 1, the bonding pads 3 and 4 are arranged in two groups.

[0051] In Fig. Figure 1a shows the left-hand representation of chip 6, which is not yet connected, away from tail 2, so that in the finished product, as in Fig. As shown in Figure 1b, the concealed bonding pads 3 and 4 are visible in this top view. At the lower end of tail 2 is contact 5, which is, for example, a ZIF contact. Contact 5 transmits digital signals. Bonding pads 3 and 4 are arranged in two groups here.

[0052] Arrow 7 symbolizes how chip 6 is mounted onto tail 2. In Fig. 1b clearly shows that the entire chip 6 is mounted on the tail 2 according to the specification of arrow 7.

[0053] Fig. 2 shows a touch sensor with driver electronics such as Fig. 1. Just like Fig. 1 is also Fig. 2 divided into Fig. 2a - not yet assembled - and Fig. 2b - assembled -.

[0054] The difference to Fig. 1 is at Fig. 2 in the arrangement of bonding pads 3 and 4, which represent IN and OUT for the components of the driver electronics, for example the chip 6. These bonding pads 3 and 4 are implemented, for example, as ACF pads, which are areas made of conductive adhesive through which contacts can be established.

[0055] As in Fig. As can be seen in Figure 2a, the bonding pads 3 and 4 are not offset here, but arranged in a group, for example in a row, so that a corresponding chip 6 connects horizontally – i.e., laterally – to the second area, at Tail 2, and is not mounted vertically on Tail 2. This is a variant of the embodiment shown in Fig. 1 is shown.

[0056] Arrow 7 again shows how chip 6, possibly mechanically stabilized by a mini circuit board, is mounted to tail 2, here laterally, again covering bonding pads 3 and 4, because these are the connections, as in Fig. 2b is recognizable. Chip 6 protrudes here from the outline of the sensor substrate, which forms the touch sensor 1 and the tails 2.

[0057] This corresponds to the embodiment in which the second area, comprising a component, for example a chip, does not lie or does not lie completely on a single sensor substrate with the first area, but rather extends over it and is connected to the sensor substrate and thus to the first area via a miniaturized circuit board, bonding pads, ZIFs and / or other contacts.

[0058] But here too, as in Fig. 1. Neither a circuit board for chip 6 nor cables, wires, or other connections from the sensor substrate to chip 6 are required. Chip 6 here always stands in for other SMDs, i.e., components of the driver electronics.

[0059] Fig. Figure 3 shows various possibilities for encapsulation and / or stiffening of the touch sensor with driver electronics on a sensor substrate.

[0060] Fig. 3 is divided into the Fig. 3a, Fig. 3b, Fig. 3c, and Fig. 3d. In addition, there are the corresponding cross-sectional representations 3e, 3f and 3g.

[0061] The embodiment of the invention shown here is particularly stable and / or mechanically robust, or particularly resilient with regard to operating conditions such as temperature, radiation, environmental influences, etc. For this purpose, a sensor substrate comprising a first area, the touch sensor 1, and a second area, the tail 2, is coated with a film 12 – for example, a protective film – so that the conductor tracks and the touch sensor are protected from environmental influences as well as from mechanical damage.

[0062] The foil 12 can be applied wholly or partially to the first and / or second area of ​​the sensor substrate. In Fig. Figure 3 shows an embodiment in which the film 12 is applied completely, i.e., covering the entire surface of the sensor substrate. Only an outer part of the second area, i.e., of the tail 2, remains uncoated with the film 12, so that the sensor substrate 11 is visible – unhatched. This corresponds to the representation of the sensor substrate in Figure 3. Fig. 1 and Fig. 2.

[0063] The sensor substrate here is a transparent conductive functional layer, for example made of metal mesh, comprising a transparent carrier 10 with non-transparent conductor tracks 15. The conductor tracks 15 are, for example, segmented and form the individual touch buttons or the connections to the bonding pad contacts 16.

[0064] It is located on the sensor substrate 11 of the touch sensor 1 with tail 2 of the Fig. 3 a film 12, which can be, for example, a thin plastic film such as a PET (polyethylene terephthalate) film. The film 12 is preferably a protective film and is provided on the surface of at least some areas of the sensor substrate.

[0065] The film 12 is described as "thin" because it is preferably a film with a layer thickness of less than 30µm, in particular less than 20µm and especially with a layer thickness in the range between 10 and 18 µm, i.e. for example with a layer thickness of 12 µm or 16µm.

[0066] For example, the foil 12 is glued, lasered, laminated and / or printed onto the sensor substrate 11.

[0067] In particular, lasering the film 12 can also be used to create a laser through-hole 17 through the film 12 for contacting the chip 6, for example via bonding pads or contacts 16, such as electrically conductive adhesives and / or solder connections, to the sensor substrate 11. The driver electronics, for example an SMD component 14 and 7 or a chip 6, are then applied to the film 12. The SMD component 14 can itself be housed, i.e., encapsulated, or as a bare die without encapsulation.

[0068] When encapsulating an SMD component 14 and / or a chip 6, a plastic, such as a lacquer, in particular a UV-curing lacquer, can again be used. For example, a drop of UV lacquer 18 is applied, which encapsulates a chip. This encapsulation can be seen in the cross-sectional images 3e, 3f and 3g.

[0069] Optionally, as can also be seen in cross-sectional images 3e, 3f, and 3g, a stiffening plate 19 can be provided. This stiffening plate serves to increase the mechanical stability at the point on the sensor substrate 11 where the SMD components and / or the chip 13 are located. The plate 19 is preferably located on the side of the sensor substrate 11 opposite the SMD component 14 or the chip 6. This is also shown in cross-sectional images 3e, 3f, and 3g.

[0070] In cross-sectional images 3e to 3g, the transparent carrier 10 and the non-transparent, electrically conductive conductor tracks 15 lying on it can be seen, which together form the sensor substrate 11. The film 12 lies on the conductor tracks 15 to protect them from environmental influences. A chip 6 is bonded, contacted, and / or glued to each conductor track 15 via a bonding pad contact 16, such as an electrically conductive adhesive ACF, ICA, and / or a solder joint. This either creates a through-contact 17, i.e., a "hole" through the film 12 – as shown in Fig. 3e shown - or by the carrier 10 of the sensor substrate 11 - as in Fig. Figure 3f shows the use of a through-contact. The stiffening plate 19 is located on the side of the sensor substrate 11 opposite the chip 6, consisting of carrier 10 and conductor tracks 15.

[0071] The Fig. 3a and Fig. Figure 3b shows the embodiments that are realized in the cross-sectional images 3e and 3f. Fig. Figure 3a shows the sensor 1, which is almost completely sealed with film 12, with the SMD component(s) 14 located on a side of the touch sensor 1 furthest from the tail 2. The SMD component 14 and / or the chip 6 are arranged, as shown in cross-sectional images 3e or 3f, on an area encapsulated by the film 12. To contact the chip 6 or SMD component 14, a through-hole 17 is created in the film 12 – for example, by laser engraving – see [reference]. Fig. 3e - or in the carrier of the sensor substrate - see Fig. 3f - generated.

[0072] The Fig. 3c and Fig. Figure 3d shows the alternative mounting of the SMD components 14 and / or the chip 6, in which no film 12 is provided around the chip 6 and / or the SMD component(s) 14. This naturally eliminates the need for a through-hole 17 through the film 12 to the bonding pad contact 16 of the chip 6 and / or the SMD components 14 with the conductor tracks 15. This difference from cross-sectional images 3e and 3f is visible in cross-sectional image 3g. Otherwise, the embodiments from the Fig. 3c and Fig. 3d, respectively of the cross-sectional image 3g, the embodiments 3a and 3b.

[0073] The sensor presented here for the first time, which delivers digital signals, makes it much easier, more compact and cheaper to manufacture sensors, as no wires and long connections are required to generate the digital signals. Reference symbol list 1. First area, sensor, transparent 2 second area, tail 3 Bonding Pads 4 Bonding Pads 5 Contacting ZIF digital signals 5' ZIF analog signal contact 6 Chip 7 Mounting arrow 10 transparent carriers 11 Sensor substrate 12 slides 14 SMDs 15 conductor track 16 Bonding Pads Contact 17 Laser through-contact 18 Encapsulation of an SMD 14 or a chip 6 19 stiffening plates

Claims

[1] Electrically conductive sensor substrate (1) comprising at least one electrically conductive sensor material in combination with an electrically non-conductive support, with at least two areas, a first, transparent area which serves as a sensor and reacts upon touch and / or approach with analog value changes which can be detected as analog electrical signals and a second, further area which provides digital signals, wherein the sensor substrate has conductors which lead from the first area to at least one component which is arranged on and / or on the second area, and wherein the component converts analog value changes of the sensor into digital signals. [2] Sensor substrate according to claim 1, wherein the at least one component (6, 14) is arranged horizontally on the sensor substrate (11). [3] Sensor substrate according to claim 1, wherein the at least one component (6, 14) is arranged vertically on the sensor substrate (11). [4] Sensor substrate according to one of the preceding claims, wherein the component (6,14) is connected to the sensor substrate (11) via contacts (5'). [5] Sensor substrate according to any of the preceding claims, comprising bonding pads (3,4,16). [6] Sensor substrate according to one of the preceding claims, wherein the component (6, 14) is connected to the sensor substrate (11) via bonding pads (3, 4, 16). [7] Sensor substrate according to one of the preceding claims, wherein the bonding pads (3,4,16) on the sensor substrate (11) form the “IN” and “OUT” of the component (6,14). [8] Sensor substrate according to any one of the preceding claims 5 to 7, wherein the bonding pads (3, 4, 16) are arranged in two groups. [9] Sensor substrate according to any one of the preceding claims 5 to 7, wherein the bonding pads (3, 4, 16) are arranged in a group. [10] Sensor substrate according to one of the preceding claims, wherein the component comprises a chip (6). [11] Sensor substrate according to one of the preceding claims, wherein the sensor substrate (11) comprises a transparent carrier (10) and conductor tracks (15) arranged thereon. [12] Sensor substrate according to any of the preceding claims, wherein the bonding pads (3,4,16) comprise a material selected from the group consisting of: “anisotropic conductive films ACF” adhesives, “isotropy conductive adhesive”, ICA adhesives and / or solder compounds, as well as any combinations of the aforementioned compounds. [13] Sensor substrate according to one of the preceding claims, wherein the second region is designed as a so-called tail. [14] Sensor substrate according to one of the preceding claims, comprising a stiffening plate (19). [15] Sensor substrate according to one of the preceding claims, comprising at least a portion of a protective film (12) on its surface. [16] Sensor substrate according to one of the preceding claims, wherein at least one component is encapsulated. [17] Sensor substrate according to one of the preceding claims, wherein the protective film (12) is glued, lasered and / or laminated onto the sensor substrate. [18] Sensor substrate according to one of the preceding claims, comprising a through-contact. [19] Sensor substrate according to one of the preceding claims, which can be produced as an endless strip in a continuous process. [20] Sensor substrate according to one of the preceding claims, which can be produced by printing. [21] Sensor substrate according to any of the preceding claims, which is elastic and flexible. [22] Sensor substrate according to one of the preceding claims, which is part of a touch sensor, a display, an electronic component. [23] Use of a sensor substrate according to any one of claims 1 to 22 in a touchscreen, a display and / or in other electronic devices with a transparent input module.

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