PROCESSING SYSTEM AND PROCESSING PROCESS

Abstract

For providing a machining system that can accurately measure the position of a workpiece without increasing the machining cycle time. A machining system according to one aspect of the present disclosure comprises: a holding device that holds a plurality of workpieces; a measuring device that measures a plurality of workpieces held on the holding device; and a machining device that machines the plurality of workpieces held on the holding device, wherein the holding device has a reference part that is positioned or position-detected by the machining device, and wherein the measuring device comprises: a measuring unit that measures a positional relationship of the plurality of workpieces held on the holding device relative to the reference part, and an input unit that uses a recording medium or communication to receive positional information of the plurality of workpieces.which is measured by the measuring unit, to be entered at the machining device, and wherein the machining device comprises: a holding device coordinate system specification unit which specifies a coordinate system of the holding device by positioning or measuring the position of the reference part of the holding device, and a workpiece coordinate system setting unit which individually sets coordinate systems of each of the plurality of workpieces, based on a coordinate system of the holding device specified by the holding device coordinate system specification unit, and the position information entered from the input unit.

Description

BACKGROUND OF THE INVENTION Field of invention

[0001] The present invention relates to a machining system and a machining method. State of the artThis text has been copied by the DPMA from the original sources. It does not contain any drawings. The tables and formulas may be of unsatisfactory quality.

[0002] When machining a workpiece in a machining device, such as, for example, a In machining centers, there are cases where measuring the position of a workpiece (including position information) is necessary. that is held in the machining device, and deciding on the relative position between a tool and necessitate a workpiece. If the shape of a workpiece is measured within a machining device, Since the cycle time is lengthening, there are concerns that processing efficiency will decrease. Additionally, if the When measuring a workpiece by pausing long-term machining, the temperature of the workpiece is measured. The temperature of the machining device will drop during the measurement and will rise again during the machining process; Therefore, there is a risk that machining accuracy will decrease due to thermal offset.

[0003] As a method for measuring the positions of a workpiece in a relatively short time, there is a method which an image processing technique is used. As an example, patent document 1 listed below discloses a Machining device comprising: a mobile device that holds a workpiece, a photographic device that is attached to a A photography area is provided where the photographing of a modified part of a mobile device is permitted. held workpiece; a position displacement detection means which is based on a measurement by the Photographic equipment detects positional shift of the processed part in the photographed image and a The workpiece correction device corrects positional displacement and removes the workpiece from the The photography area is moved to the editing area by propelling the mobile device using the Position shift and a predetermined movement distance from the photography area up to a Editing area for editing the edited part.

[0004] Patent document 1: Japanese unexamined patent application, publication number JP 2007-265237 A SUMMARY OF THE INVENTION

[0005] As disclosed in patent document 1, if, for example, a photographic device within a When a processing device is provided, there is a concern that one will not be able to adequately Photographing the workpiece is difficult due to contamination of the photographic equipment by dust, cutting oil, etc. Due to lighting of the workpiece, vibration, etc., it is no longer able to accurately measure the position of the workpiece. For this reason, technology has been required that is capable of accurately measuring the position of a workpiece. without extending the processing cycle time.

[0006] A machining system according to one aspect of the present disclosure includes: a holding device which a holding device that can hold a large number of workpieces; a measuring device that can hold a large number of workpieces on the holding device is held, measures; and a machining device which measures the plurality of parts held on the holding device workpieces are machined, wherein the holding device has a reference part which is guided by the machining device is positioned or position detected, and in which the measuring device has: a measuring unit which a measures the positional relationship of the multitude of workpieces held on the holding device relative to the reference part, and an input unit that is a recording medium or communication for inputting position information of the multitude of workpieces which are measured by the measuring unit, used on the machining device, and wherein the The machining device includes: a holding device coordinate system specification unit, which defines a coordinate system the holding device specified, by positioning or measuring the position of the reference part of the holding device, and a Workpiece coordinate system setting unit that individually sets the coordinate systems of each of the multitude of workpieces sets, based on a coordinate system defined by the holding device coordinate system specification unit specified holding device and the position information entered from the input unit.

[0007] A processing method according to another aspect of the present disclosure includes the steps: Holding a large number of workpieces in a holding device that has a reference part defined by a Machining device is positioned or position is detected; measuring a positional relationship of the multitude of Workpieces held on the fixture relative to the reference part; moving the fixture to the This text has been copied by the DPMA from the original sources. It does not contain any drawings. The tables and formulas may be of unsatisfactory quality. Machining device; specifying a coordinate system of the holding device by positioning or Position measurement of the reference part of the Holding device in the machining device; setting the coordinate systems of each of the multitude of workpieces individually, based on the coordinate system of the holding device, and the positional relationship of the multitude of Workpieces relative to the reference part; and machining of the workpiece using the machining device under Use of the workpiece's coordinate system.

[0008] According to one aspect of the present disclosure, the machining system can determine the position of a workpiece. Measure accurately without increasing the machining cycle time. List of characters Fig. 1 is a schematic drawing showing the configuration of a machining system according to a The embodiment of the present disclosure is shown; Fig. 2 is a schematic top view showing a holding device of a machining system according to the the present revelation shows; and Fig. 3 is a flowchart showing a machining sequence of a machining system according to the present Revelation shows. DETAILED DESCRIPTION OF THE INVENTION

[0009] An embodiment of the present disclosure is described below with reference to the drawings described. Fig. 1 is a schematic drawing showing the configuration of a machining system 100 according to a An embodiment of the present disclosure is shown. The machining system 100 machines a workpiece W.

[0010] The machining system 100 includes: a holding device 1 that holds a plurality of workpieces W; a Measuring device 2, which measures the plurality of workpieces W held on the holding device 1; and a Machining device 3, which processes the multitude of workpieces W held on the holding device 1.

[0011] The holding device 1, as illustrated in Fig. 2, has a plurality of holding parts 11, each of which holds the workpieces W hold, and a reference part 12 which is positioned or position-detected by the machining device 3.

[0012] The holding part 11 holds each of the workpieces W in order to be relatively immobile on the holding device 1 until in the Measuring device 2 measures, and then the machining is completed by machining device 3. For this reason The holding part 11 can have a configuration that detachably holds the workpiece W, such as a electromagnetic force-generating means or clamping means, or may have an engagement structure such that the Workpiece W held using an additional means of engagement, such as a screw can be.

[0013] In this way, the holding device 1 has a plurality of holding parts 11 and when a plurality of Since workpieces W are held in the holding device 1, it is not easy to precisely position the individual workpieces W. to position and hold. In other words, the multitude of workpieces W can be positioned on the holding device 1. Have positioning errors relative to the holding part 11.This text has been copied by the DPMA from the original sources. It does not contain any drawings. The tables and formulas may be of unsatisfactory quality.

[0014] The reference part 12 is configured by the measuring device 2 and the machining device 3 to be position-detectable or positionable. More specifically, the reference part 12 can be a structure, such as a hole, A notch, protrusion or the like may be established, and may be a corner of the outer edge of the holding device 1. Additionally, the reference part 12 can be a marker that allows a position to be optically detected, based on the configuration of the measuring device 2 and the processing device 3.

[0015] The reference part 12 can simply be one according to the configuration of the device configurations of the measuring device. 2 and the processing device 3; however, preferably a plurality of them is provided. With other In other words, the holding device 1 preferably has a plurality of reference parts 12. The machining device 3 This can result in a difference between the position of the measuring device 2, the holding device 1, and the position of the Detect and compensate for machining device 3.

[0016] The holding device 1 is preferably made of a material with a low thermal resistance. Expansion coefficients are formed, such as in iron-nickel alloy materials, by machining with the required force. high precision. More specifically, as an upper limit for the coefficient of linear expansion (absolute value) at 20°C of the -6 -6 The material of the holding device 1 is preferably 10×10⁻⁶ / K and more preferably 2×10⁻⁶ / K. By adjusting the The coefficients of linear expansion of the material of the holding device 1 are limited to no more than the upper limit, making it possible to suppressing the shifting of the relative position of the workpiece W and the resulting machining error, by means of a Temperature change between measuring the workpiece W in the measuring device 2 and ending the machining process by the processing device 3.

[0017] The measuring device 2 comprises: a measuring unit 21, which determines the positional relationship of the plurality of on the Holding device 1 held Workpieces W are measured relative to the reference part 12; an input unit 22 provides position information for the multitude of the measuring unit 21 measured workpieces W at the machining device 3 using a recording medium or input of communication; and a temperature adjustment unit 23, which adjusts the temperature of the Holding device 1 adjusted to a temperature that is essentially the same as the temperature inside the Processing device 3 is.

[0018] While the machining device 3 is machining a workpiece W on the holding device 1, the Measuring device 2 preferably the position of the workpiece W held on the holding device 1, offered by subsequent processing, and the position of the reference part 12 of the holding device 1. This makes it possible to determine the To reduce the idle time of machining of the machining device 3 and consequently the cycle time of machining, and to improve machining efficiency. Additionally, by reducing the idle time of the machining device 3. If the cycle time is shortened, it is possible to prevent a temperature drop due to a processing break of the processing device 3. suppress. This makes it possible to suppress the thermal offset of the machining device 3. To reduce processing errors.

[0019] The measuring unit 21 can determine the position of the reference part 12 of the holding device 1 and the position of each workpiece. W measures and can measure the position of each workpiece W in a state that defines the reference part 12 of the Holding device 1 is positioned at a predetermined position.

[0020] The measuring unit 21 can be established as a configuration comprising, for example, a contact probe, which contacts the workpiece W and measures the contact position of the contact probe; however, it can be considered a known This text has been copied by the DPMA from the original sources. It does not contain any drawings. The tables and formulas may be of unsatisfactory quality. Configuration with a camera 24 that photographs the holding device 1, which holds the multitude of workpieces W, and an image processing unit 25, which determines the positions of the multitude of workpieces W, and, if required, the position of the Reference part 12, based on the image photographed by camera 24, is calculated and established.

[0021] The camera 24 can be established as a configuration comprising a two-dimensional image sensor element, such as It features a CCD image sensor and a CMOS image sensor. The image processing unit 25 can, for example, be equipped with Reading a predetermined image processing program into a computer device with a CPU, memory, etc. This can be achieved. By establishing such a configuration, it is possible to control the positions of the numerous workpieces. To measure W in an extremely short time.

[0022] The input unit 22 can be configured to receive the position information of each object measured by the measuring unit 21. Workpiece W at the machining device 3 as the coordinates in the coordinate system of the holding device 1 to be entered, set based on the coordinate of reference part 12, or as a combination of coordinates of each Workpiece W and coordinates of the reference part 12 in the coordinate system of the measuring device 2.

[0023] The recording medium used to input the position information at the processing device 3 is not particularly restricted; however, it may be an IC tag installed on the holding device 1, or the like. The input unit 22 is used to input the position information at the processing device 3. Communication can be carried out through a means of communication that is used to transmit various Information is used that is necessary to operate the measuring device 2 and the operation of the To induce processing device 3 to cooperate, and can use wireless or wired communication. Communication.

[0024] The temperature adjustment unit 23 adjusts the temperature of the holding device 1 within the measuring device 2 to a temperature that is essentially equal to the temperature of the location where the holding device 1 is located during the The workpiece W is held within the machining device 3. Since the temperature within the If the processing device 3 becomes hotter than the ambient temperature during processing, the temperature- Adjustment unit 23 is configured to have a heater 26. The heater 26 can supply heat directly to the holding device 1. The holding device 1 can be heated by means of radiant heat, or the holding device 1 surrounding it can be heated. Heat the air.

[0025] The temperature adjustment unit 23 can be established as a configuration that provides a Machining device temperature detection section 27, which measures the temperature Tt within the The processing device 3 detects a measuring device temperature detection section 28, which measures the temperature Tm within the measuring device 2, and a heater control section 29, which controls the output of the heater 26, that the difference between the temperature Tt inside the machining device 3 and the temperature Tm inside the measuring device 2 is reduced. In addition, the temperature adjustment unit 23 can further serve as a means for The holding device 1 shall have a cooling mechanism, for example a cooling fan or the like, which draws in outside air and directs it onto The holding device 1 is blowing.

[0026] The temperature adjustment unit 23 is preferably configured to be able to adjust the temperature of the holding device 1. to adjust the position measurement of the workpiece W, and preferably the temperature of the Holding device 1, on which the position measurement of the workpiece W is carried out, and the temperature of the Holding device 1 during readiness, in which the position measurement of the workpiece W is subsequently and afterwards. This text has been copied by the DPMA from the original sources. It does not contain any drawings. The tables and formulas may be of unsatisfactory quality. is carried out. Since the time for temperature adjustment of the holding device 1 does not thereby affect the cycle time of the The measurement time by the measuring unit 21 will be extended, the measuring device 2 will not be a reason for this. to extend the processing of the processing device 3.

[0027] As the upper limit for the difference between the temperature of the holding device 1 during the measurement by The measuring unit 21 and the temperature within the processing device 3 are preferably set to 10°C. By adjusting the difference between the temperature of the holding device 1 during measurement by the measuring unit 21 and the If the temperature within the machining device 3 does not exceed the upper limit, it is possible to... To suppress machining errors caused by thermal offset. It should be noted that even in a case where where the coefficient of thermal expansion of the holding device 1 is sufficiently small that there is a possibility that If a thermal offset occurs in the workpiece W, it is preferred to control the temperature of the holding device 1 in the Measuring device 2 is to be adjusted using the temperature adjustment unit 23, regardless of the material of the holding device 1.

[0028] The machining device 3 comprises: a holding device coordinate system specification unit 31, which the coordinate system is specified during the machining of the holding device 1, by means of positioning or Position measurement of the reference part 12 of the holding device 1; a workpiece coordinate system setting unit 32, which individually sets the coordinate system of each of the multitude of workpieces W, based on the input unit entered position information; and a machining unit 33, which machine the workpiece W using the Coordinate system of the workpiece, which is set by the workpiece coordinate system setting unit 32, edited.

[0029] The holding device coordinate system specification unit 31 specifies the coordinate system of the Holding device 1 relative to the coordinate system of the machining device 3, that is, specifies the position and Position of the holding device 1 within the processing device 3.

[0030] The workpiece coordinate system setting unit 32 sets the coordinate systems of individual workpieces wine, That is, it converts the machining coordinates, which are specified by the machining program, into the Coordinates of the coordinate system of the workpiece W.

[0031] The machining unit 33 adjusts the operation of the tool according to the arrangement of each workpiece W under Use of the workpiece's coordinate system, which is set by the workpiece coordinate system setting unit 32 is set up, and each workpiece W is processed appropriately.

[0032] Although the processing carried out by the processing unit 33 is not particularly limited, it It is possible to exemplify drilling, laser processing, grinding, etc.

[0033] In the machining system 100, the method of machining the plurality of workpieces W includes (Processing method according to the embodiment of the present disclosure) as shown in Fig. 3: one step of the Holding the multitude of workpieces W in the holding device 1 (step S01: holding step); one step of the feeding process the holding device 1 to the measuring device 2 (step S02: holding device feed step); a step of adjusting the Temperature of holding device 1 (step S03: temperature adjustment step); one step of measuring the positions of the A multitude of workpieces W, which are held by the holding device 1 (step S04: measuring step); one step of moving the holding device 1 to the processing device 3 (step S05: holding device movement step); one step of entering the position information of the workpiece W from the measuring device 2 to the Machining device 3 (step S06: position information input step); a step of specifying the Coordinate system of the holding device 1 (step S07: holding device coordinate system specification step); one Step of setting the coordinate system of each workpiece W (Step S08: Workpiece coordinate system- Setting step); one step of machining each workpiece W (step S09: machining step); and one step of the Removing the holding device 1 from the machining device 3 (step S10: holding device removal step). This text has been copied by the DPMA from the original sources. It does not contain any drawings. The tables and formulas may be of unsatisfactory quality.

[0034] In the holding step of step S01, the respective workpieces W are held in the holding part 11 of the holding device 1. This holding step can be performed successively and can cause the multitude of workpieces W to each is held in advance in a variety of holding devices 1.

[0035] In the holding device feed step of step S02, the device that holds the multitude of workpieces W in the holding step is used. Holding device 1 of the measuring device 2 is supplied.

[0036] In the temperature adjustment step of S03, the temperature of the holding device 1 holding the workpieces W is adjusted accordingly. adjusted so that it is a temperature that is essentially equal to the temperature inside the machining device 3 is, by means of the temperature adjustment unit 23.

[0037] In the measuring step of step S04, the positional relationship of the plurality of objects held by the holding device 1 is determined. Workpieces W are measured relative to the reference part 12 of the holding device 1 by the measuring unit 21.

[0038] In the holding device movement step of step S03, the position of the workpiece W is measured Holding device 1 was caused to move from measuring device 2 to processing device 3. Movement can be performed manually by the operator; however, it is preferred, for example, to have it to be carried out automatically using a transport system or the like.

[0039] In the position information input step of S06, the position information of the workpiece W, which was obtained in the measuring step The measurement is taken from the measuring device 2 at the processing device 3 and entered via the input unit 22.

[0040] In the holding device coordinate system specification step of step S07, the coordinates of the reference part are 12 of the holding device 1 is specified by the holding device coordinate system specification unit 31. With other In the position information input step, this is done by measuring the position of the reference part 12 or by positioning the Reference part 12 at a predetermined position brought the coordinate system of the machining device 3 into The coordinate system of the holding device 1 is convertible.

[0041] In the workpiece coordinate system setting step of step S08, the coordinate systems of the The corresponding workpieces W are individually adjustable, meaning the coordinate system of the Machining device 3 is brought to be converted into the coordinate system of each workpiece W, based on the position information entered by the input unit 22 and the information in the holding device- Coordinate system specification step specified coordinate system of the holding device 1, by which Workpiece coordinate system setting unit 32.

[0042] In the machining step of step S09, each workpiece W is machined using the coordinate system of this Workpiece W is machined by machining unit 33. In other words, machining unit 33 processes the workpiece. exactly the workpiece W by converting machining data based on a machining program is decided, and as a relative movement between the workpiece W and the tool in the coordinate system of the The workpiece W being machined is represented in the coordinate system of the machining device 3.

[0043] In the holding device removal step of step S10, the device holding the workpiece W is Holding device 1 ejected from machining device 3. Next workpiece to be machined is W. Machining device 3 becomes ready to receive. Therefore, before the completion of this holding device removal step, preferably, each step is performed in parallel, so that the measuring step for the holding device 1, which holds the workpiece W, This text has been copied by the DPMA from the original sources. It does not contain any drawings. The tables and formulas may be of unsatisfactory quality.

[0044] In the manner described above, the machining system 100 of the present embodiment confirms the setting error of the A multitude of workpieces W relative to the holding device 1 in the measuring device 2, and by performing only one Positioning or position measurement of the reference part 12 of the holding device 1 in the machining device 3 is It is possible to specify the position of each of the numerous workpieces W and to machine them precisely. For this reason Can the machining system 100 shorten the machining interval in the machining device 3 and the Improve production efficiency. Additionally, the processing system 100 can compensate for temperature changes. Suppress machining device 3 and a machining error caused by thermal offset, reduce by shortening the machining interval in the machining device 3.

[0045] Although an embodiment of a machining system and machining method according to the present As explained above, the processing system and processing procedures are in accordance with the present disclosure Disclosure is not limited to the aforementioned embodiment. Additionally, the following information is provided in the present document: The effects described in this embodiment are merely the most preferred effects that are covered by the present disclosure. are generated, and the effects from the machining system and the machining process according to the present Disclosures are not limited to those described in the present embodiment.

[0046] In the processing system according to the present disclosure, the temperature adjustment unit can be omitted. Additionally, in the processing system of the present disclosure, the temperature adjustment unit can only adjust the temperature adjust a single holding device. In the machining process according to the present disclosure, the The holding step is performed after the holding device feed step. In other words, in Machining methods according to the present disclosure: the workpiece is held after the The holding device is arranged in the measuring device. Reference symbol list 1 Holding device 2 Measuring device 3 Machining device 11 Holding part 12 Reference section 21 Unit of measurement 22 Input unit 23 Temperature adjustment unit 24 camera 25 image processing units 26 stokers 27 Machining device temperature detection section 28 Measuring device temperature detection section 29 Heater control section 31 Holding device coordinate system specification unit 32 Workpiece coordinate system setting unitThis text has been copied by the DPMA from the original sources. It does not contain any drawings. The tables and formulas may be of unsatisfactory quality. 33 Machining device 100 processing systems W workpiece QUOTES INCLUDED IN THE DESCRIPTION

[0000] This list of documents cited by the applicant was generated automatically and is solely for the purpose of Included for the better information of the reader. The list is not part of the German patent or... Utility model application. The DPMA accepts no liability for any errors or omissions. Cited patent literature

[0000] JP 2007265237 A

[0004]

Claims

1. Processing system, comprehensive: a holding device (1) that holds a plurality of workpieces (W); a measuring device (2) which measures a plurality of workpieces (W) which are held on the holding device (1); and a processing device (3) which can accommodate the plurality of workpieces (W) held on the holding device (1) edited wherein the holding device (1) has a reference part (12) which is positioned by the machining device (3) or position is detected, and the measuring device (2) has: a measuring unit (21) that establishes a positional relationship between the plurality of workpieces held on the holding device (1) (W) measures relative to the reference part (12), and an input unit (22) which includes a recording medium or communication for inputting position information of the A large number of workpieces (W) which are measured by the measuring unit (21) at the machining device (3) used, and wherein the processing device (3) comprises: a holding device coordinate system specification unit (31) which specifies a coordinate system of the holding device (1) specified, by positioning or measuring the position of the reference part (12) of the holding device (1), and a workpiece coordinate system setting unit (32) that individually sets coordinate systems for each of the multitude of workpieces (W) are set based on a coordinate system defined by the holding device coordinate system- specification unit (31) specified holding device (1) and the input from the input unit (22) Position information.

2. Machining system according to claim 1, wherein the holding device (1) comprises a plurality of reference parts (12). This text has been copied by the DPMA from the original sources. It does not contain any drawings. The tables and formulas may be of unsatisfactory quality.

3. Machining system according to claim 1 or 2, wherein the measuring device (2) is a temperature adjustment unit (23) features which adjusts the temperature of the holding device to a temperature essentially equal to a Temperature within the processing device (3) is.

4. Machining system according to one of claims 1 to 3, wherein a linear coefficient of expansion of the material of the -6 Holding device (1) is not larger than 10×10 / K.

5. Processing system according to one of claims 1 to 4, wherein the measuring unit (21) comprises: a camera (24), which the holding device (1), which holds the multitude of workpieces (W), photographs, and an image processing unit (25), which calculates the position of the multitude of workpieces (W) and the position of the reference part (12), based on the Image taken by the camera (24).

6. Machining system according to any one of claims 1 to 5, wherein the measuring device (2) measures the surface on the Holding device (1) performs the holding of the workpieces (W), which are then fed to the subsequent processing, while the processing device (3) is processed.

7. Processing procedure, comprising the following steps: Holding a plurality of workpieces (W) in a holding device (1) which has a reference part (12) defined by a The processing device (3) is positioned or its position is detected; Measuring a positional relationship of the plurality of workpieces (W) that are held on the holding device (1), relative to to the reference part (12); Moving the holding device (1) to the processing device (3); Specifying a coordinate system of the holding device (1) by positioning or measuring the position of the reference part (12) the holding device (1) in the processing device (3); Setting the coordinate systems of each of the multitude of workpieces (W) individually, based on the Coordinate system of the holding device (1), and the positional relationship of the plurality of workpieces (W) relative to the Reference part (1); and Machining the workpiece (W) using the machining device (3) and the coordinate system of the workpiece (W).