Package, method for forming a package, chip card and method for forming a chip card

Abstract

Package (200), comprising: an electronic leadless module (100) having a top surface (100T), a bottom surface (100B) and side surfaces (100S) between the top surface (100T) and the bottom surface (100B), the electronic leadless module (100) comprising: • an electronic circuit (250), • a plurality of electrical contact pads (103) electrically conductively coupled to the electronic circuit (250) on the underside (100B) of the electronic leadless module (100); • and encapsulation material (105) partially encapsulating the electronic circuit (250), wherein the electrical contact pads (103) are at least partially free of encapsulation material (105); wherein the electronic leadless module (100) has an anchoring region (120) on at least one side surface (100S); a support frame (220) supporting the leadless electronic module (100), the underside of which faces the support frame (220); wherein the side surface (100S) extends below the anchoring region (120) parallel to the top or bottom further in the direction of the support frame (220) than in the anchoring region (120); and Filling material (224) in the anchoring area (120) for attaching the electronic leadless module (100) to the support frame (220).

Description

[0001] The invention relates to a package, a method for forming a package, a chip card and a method for forming a chip card.

[0002] For a Package 400 containing an electronic Leadless Module 300 (see for example Fig. 4A and the associated leadless module in Fig. 3A), according to the state of the art, mechanical robustness may be so low that further processing of the package and / or operation may result in damage, possibly even functional impairment.

[0003] Currently, such an electronic leadless module 300 is provided, for example, in the form of a sensor module, e.g., a biometric sensor, e.g., a fingerprint sensor. The electronic leadless module 300 is typically arranged in an opening of a carrier tape 442 (also referred to as module tape), and a gap between side walls of the carrier tape 442 and side walls of the leadless module 300 is sealed with a resin 224.

[0004] However, the gap is typically very narrow, so that not all points in the gap may be reached, for example, in particular if the leadless module is not arranged completely centrally in the opening, and / or the adhesive effect of the resin with respect to the leadless module is insufficient for a permanent attachment of the module under load.

[0005] The package with the leadless module can, for example, be embedded in a chip card, e.g., a chip card for banking applications. In such a case, the package 400 can be subjected to bending stresses, for example, which can cause the seal to crack, detach, or otherwise become damaged, potentially leading to failure in the field. Such a vulnerability can also become apparent during a stress test, causing the package to fail standard stress tests.

[0006] Furthermore, controlled dispensing of the resin exclusively into the gap can be difficult, so small amounts of resin may be accidentally dispensed onto the sensor surface. This can impair sensor function.

[0007] DE 10 2018 118 337 A1 discloses an electronic module. The electronic module may comprise a carrier and an integrated component die having a top surface, a bottom surface, and an outer side edge. The integrated component die may comprise a first surface recessed from the bottom surface and a second surface extending between the bottom surface and the first surface. The second surface may be laterally recessed from the outer side edge. The electronic module may comprise a mounting compound having a first part arranged between the bottom surface of the integrated component die and the carrier and a second part arranged along at least a part of the second surface of the integrated component die.

[0008] DE 10 2020 108 927 A1 discloses a sensor device. The sensor device comprises a fingerprint sensor having a silicon-based area sensor, a sensor surface, and an electrically conductive contact region arranged laterally adjacent to the sensor surface, which is configured to be touched when the contact surface is touched with a finger in order to bring the finger to a predetermined potential. The sensor device also comprises an antenna coupled to the fingerprint sensor for inductively coupling the fingerprint sensor to a booster antenna.

[0009] There is therefore a need for a package with an electronic leadless module that has greater robustness and / or simplified manufacturing, wherein there is in particular a need to be able to apply the simplified manufacturing to a manufacturing process in which the electronic leadless module is embedded in a carrier tape, e.g. in a roll-to-roll process.

[0010] A package according to claim 1, a chip card according to claim 13, a method of forming a package according to claim 14, and a method of forming a chip card according to claim 20 are provided. Further embodiments are described in the dependent claims.

[0011] In various embodiments, a package is provided that includes an electronic leadless module (short: leadless module or module), the side wall of which is provided with an anchoring region (for example, in the form of a recess, e.g., a step, chamfer, or groove, or as an inclined side wall that is closer to a central region of the leadless module at the upper end than at the lower end). The anchoring region provides space for a filler material, in particular for a larger amount of filler material than in the prior art.

[0012] The anchoring area allows for stronger mechanical anchoring of the filler material in the leadless module, which increases the mechanical robustness of the package.

[0013] In various embodiments, the anchoring region may be open to a top surface of the leadless module, which facilitates placement of the filler material in a gap between the leadless module and a side wall of an opening in which the leadless module is placed. Accordingly, inadvertent placement of the filler material on a top surface of the module can be avoided, which prevents functional impairment, particularly in the case where the leadless module is configured as a (e.g., biometric) sensor.

[0014] In various embodiments, the anchoring region can be formed such that it is not open to a top side of the leadless module, but rather the leadless module is formed such that its top side can be fitted into an opening essentially without gaps. In this case, the filler material can be introduced into the opening, for example, in front of the leadless module and displaced during assembly of the leadless module until it extends into the anchoring region. The buffer region enlarged by means of the anchoring region can make it easier to achieve a metering of the filler material, which prevents excess filler material from escaping next to the top side of the leadless module, and can prevent functional impairment.

[0015] In other words, various embodiments provide a package comprising an electronic leadless module with non-planar sidewalls (or at least one non-planar sidewall) to form an undercut for fill material adjacent to the sidewall. Thus, the leadless module and the fill material are mechanically anchored or interlocked with each other, which increases the mechanical stability of the package. Furthermore, the thickness of the fill material in the anchoring area is increased, which further increases the mechanical stability of the fill material and thus of the package.

[0016] Embodiments of the invention are illustrated in the figures and are explained in more detail below.

[0017] It shows Fig. 1 shows three different schematic views of a leadless module for use in a package according to various embodiments; Fig. 2 illustrates a method for forming a package according to various embodiments; Fig. 3A schematic views of a leadless electronic module according to a prior art; Fig. 3B, Fig. 3C and Fig. 3D shows three schematic views of an electronic leadless module for use in a package according to various embodiments; Fig. 4A two schematic views of a package according to a prior art; Fig. 4B shows two schematic views of a package according to various embodiments; Fig. 5 shows a schematic representation of a chip card according to various embodiments; Fig. 6 is a flowchart of a method for forming a package according to various embodiments; and Fig. 7 is a flowchart of a method for forming a chip card according to various embodiments.

[0018] In the following detailed description, reference is made to the accompanying drawings, which form a part hereof, and in which is shown by way of illustration specific embodiments in which the invention may be practiced. In this regard, directional terminology such as "top", "bottom", "front", "back", "fore", "rear", etc., will be used with reference to the orientation of the described figure(s). Since components of embodiments can be positioned in a number of different orientations, the directional terminology is for the purpose of illustration and is in no way limiting. It is to be understood that other embodiments may be utilized and structural or logical changes may be made without departing from the scope of the present invention.It is understood that the features of the various exemplary embodiments described herein may be combined with one another unless specifically stated otherwise. The following detailed description is therefore not to be taken in a limiting sense, and the scope of the present invention is defined by the appended claims.

[0019] Throughout this description, the terms "connected," "attached," and "coupled" are used to describe both a direct and indirect connection, a direct or indirect connection, and a direct or indirect coupling. In the figures, identical or similar elements are provided with identical reference numerals where appropriate.

[0020] Fig. 1 shows three different schematic views (top view, bottom view and side view) of a leadless module 100 for use in a package 200 according to various embodiments. Fig. 2 shows in three individual representations an illustration of a method for forming a package 200 according to various embodiments. Fig. 3B, Fig. 3C and Fig. 3D show three schematic views (top view, side view and an enlarged section of the side view) of an electronic leadless module 100 for use in a package 200 of various embodiments, and Fig. 4B shows two schematic views (top view and partial cross-sectional view) of a package 200 according to various embodiments.

[0021] In various embodiments, the package 200 may include a leadless electronic module 100 having a top surface 100T, a bottom surface 100B, and side surfaces 100S between the top surface 100T and the bottom surface 100B.

[0022] The electronic leadless module 100 may include an electronic circuit 250. The electronic circuit 250 is only Fig. 2B, since the person skilled in the art will know how an electronic circuit 250 can be formed in an electronic leadless module 100. To configure the leadless module 100 as a sensor module, the electronic circuit 250 can, for example, include circuit components for operating the sensor and for transmitting data to and from the sensor. Alternatively or additionally, the electronic leadless module 100 can be provided with another typical functionality, and the electronic circuit 250 can be configured accordingly.

[0023] The leadless electronic module 100 may have a plurality of electrical contact pads 103 electrically coupled to the electronic circuit 250 on the underside 100B of the leadless electronic module 100.

[0024] The leadless electronic module 100 may further comprise encapsulation material 105 that partially encapsulates the electronic circuit 250. The encapsulation material 105 may be arranged as needed and substantially as known in the art, for example, on a top side 100T of the leadless module, e.g., to protect a sensor surface, on the side surfaces 100S, and / or on a bottom side 100B, wherein the electrical contact pads 103 may be at least partially free of the encapsulation material 105.

[0025] Typical designs of leadless modules include a Land Grid Array (LGA) module, a Ball Grid Array (BGA) module, and a Quad-Flat-No-Lead (QFN) module.

[0026] When encapsulating module components with the encapsulation material 105, a so-called matrix molding process is typically used. The module components are arranged in matrix form on a common substrate (e.g., as a 10x10 matrix) and encapsulated together, i.e., provided with a common continuous layer of the encapsulation material 105. Such an arrangement is referred to herein as a multi-module composite.

[0027] For separation, separation processes are used that are similar to those known from wafer processing, for example sawing, laser processing, breaking or a combination of these processes.

[0028] The electronic leadless module 100 may have an anchoring area 120 on at least one side surface 100S, the design and function of which is explained in more detail below.

[0029] In various embodiments, the anchoring region 120 can be formed during dicing, for example by means of two-stage sawing, for example first with a wide saw blade up to, for example, approximately half the wafer thickness, and then with a thin saw blade to completely separate the modules, so that the thickness difference between the thin saw blade and the thick saw blade forms the anchoring region 120 as a recess (open to the top), or by means of a combination of sawing and laser cutting, or the like. Fig. 4B, the width of the gap between the module 100 and the support frame 220, which is increased by the recess open to the top side 100T, is designated by W1 (for comparison, see the gap width W2 in the representation of the prior art in Fig. 4A). A saw blade with a V-shaped cross-section can be used to form inclined side walls 100S that are not perpendicular to the top or bottom, but are further away from a central region of the leadless module 100 on a bottom side of the leadless module 100 than on a top side of the leadless module 100. An embodiment with an inclined side wall section as the anchoring region 120 is shown in Fig. 3C. In various embodiments, the inclined region may extend from the top surface 100T to the bottom surface 100B of the leadless module 100.

[0030] In various embodiments, an etching process can be used for the separation. Depending on the choice of a mask material, an etchant, and other etching parameters such as etching time, this can achieve back etching, i.e., forming the anchoring region 120 that is not open to the top side 100T but only or substantially only to the side (facing away from the side surface 100S), or an anchoring region 120 that is open to the top side 100T.

[0031] In various embodiments, the anchoring region 120 may be formed after singulation, as a process performed on a single leadless module 100, for example, by machining the side surface 100S, e.g., mechanically or by means of a laser. However, such a process is typically expensive.

[0032] The package 200 may further comprise a carrier frame 220 that carries the electronic leadless module 100. During the insertion of the leadless module 100 into the carrier frame 220, an electrically conductive connection may be established between the electrical contact pads 103 of the leadless module 100 and corresponding contacts 204 of the carrier frame 220. This is shown in Fig. 4. In Fig. 2 shows an example of a support frame 220 having contact surfaces 206 for contact-based communication with the electronic circuit. Fig. 4B, additional antenna windings 440 for contactless communication are shown. In general, the package 200 can be designed for any suitable use, in particular for use in a chip card 500 (see Fig. 5) and the associated known forms of use, i.e. as a contact-based module, contactless module or as a dual-interface module.

[0033] The package 200 may further include filler material 224 in the anchoring region 120 for securing the leadless electronic module 100 to the support frame 220. The filler material 224 may partially or completely fill the anchoring region 120.

[0034] In various embodiments, the filler material 224 can be a filler material 224 essentially known in the prior art, e.g., a so-called underfill material or a printable paste, which may initially be viscous and later harden or cure, e.g., a resin, e.g., an epoxy resin. The filler material 224 can, for example, be introduced into a gap 255 between the leadless module 100 already in the opening and the support frame 220 by means of a filling or printing device, or can be arranged in front of the leadless module 100 in the opening 202 (the bottom of which may be closed in this case). If the bottom of the opening 202 is open, a thixotropic filler material 224 can be used, which does not flow away on its own after being arranged.The filling material 224 can be placed in such a way that when the leadless module 100 is inserted, it flows preferably in the direction of the side walls 100S and not in the direction of the open bottom.

[0035] In Fig. 3B to 3D illustrate various designs of the anchoring region 120.

[0036] The anchoring region 120 should be open to the top 100T of the leadless module 100 or be arranged in a central region of the side surface, but not open downwards, so that the mechanical anchoring of the leadless module 100 can be effected by means of the filling material 224 arranged in the anchoring region 120.

[0037] The anchoring region 120 can be formed on one, several or all side surfaces 100S of the leadless module 100.

[0038] In a direction from the top side 100T to the bottom side 100B, a shape of the anchoring area 120 may be linear (as in Fig. 3C), polygonal, curved (e.g. as a circular segment, e.g. semicircular as in Fig. 3D) or a combination of these (as in Fig. 3B), essentially in any convenient form.

[0039] In various embodiments, the anchoring region 120 can extend (e.g., parallel to the top or bottom of the leadless module 100) along the entire side surface, e.g., along several (e.g., two opposite) or, e.g., all side surfaces 100S. In principle, however, even an anchoring region 120 formed only on a portion of the side surface 100S provides improved anchoring of the leadless module 100 to the support frame 220.

[0040] In various embodiments, a height of the anchoring region 120 may, as required, be between about 5% and about 95% of the height of the leadless module 100, for example between about 20% and about 70%, e.g., about 50%.

[0041] A depth of the anchoring area 120 can also be designed taking into account the design of the leadless module 100, e.g., it may be necessary to design the recess 120 shallow if the integrated circuit 250 extends very far towards the side surface 100S in order to avoid damage to the integrated circuit 250.

[0042] Fig. 6 shows a flowchart 600 of a method for forming a package according to various embodiments.

[0043] The method may include forming a leadless electronic module having a top side, a bottom side, and side surfaces between the top side and the bottom side, an electronic circuit, a plurality of electrical contact pads electrically coupled to the electronic circuit on the bottom side of the leadless electronic module, and encapsulation material partially encapsulating the electronic circuit, wherein the electrical contact pads are at least partially free of encapsulation material (at 610).

[0044] The method may further include forming an anchoring region on at least one side surface of the leadless electronic module (at 620), arranging the leadless electronic module in an opening of a support frame (at 630), and arranging filler material in the anchoring region for securing the leadless electronic module to the support frame (at 640).

[0045] Fig.7 is a flowchart 700 of a method for forming a chip card according to various embodiments.

[0046] The method may include providing a chip card body 550 having a receiving opening (at 710) and arranging a package 200 according to an embodiment in the receiving opening (at 720).

[0047] Some examples of implementation are summarized below.

[0048] Embodiment 1 is a package. The package has an electronic leadless module with a top side, a bottom side and side surfaces between the top side and the bottom side, wherein the electronic leadless module has an electronic circuit, a plurality of electrical contact pads on the bottom side of the electronic leadless module that are electrically conductively coupled to the electronic circuit, and encapsulation material that partially encapsulates the electronic circuit, wherein the electrical contact pads are at least partially free of encapsulation material, and wherein the electronic leadless module has an anchoring region on at least one side surface. The package can further have a carrier frame that carries the electronic leadless module, wherein the bottom side faces the carrier frame; wherein the side surface extends below the anchoring region parallel to the top or bottom side.Bottom side extends further towards the support frame than in the anchoring area; and filler material in the anchoring area for attaching the leadless electronic module to the support frame.

[0049] Embodiment 2 is a package according to embodiment 1, wherein the anchoring region is formed as a recess or as an upper section of an inclined side surface.

[0050] Embodiment 3 is a package according to embodiment 1 or 2, wherein the anchoring region is open towards the top of the electronic leadless module.

[0051] Embodiment 4 is a package according to one of the embodiments 1 to 3, wherein the anchoring region extends along the entire side surface, for example parallel to the top and / or bottom of the leadless module.

[0052] Embodiment 5 is a package according to one of the embodiments 1 to 4, wherein the at least one side surface has a plurality of side surfaces, each with an anchoring region.

[0053] Embodiment 6 is a package according to any one of embodiments 1 to 5, wherein the electronic leadless module has an anchoring region on each side surface.

[0054] Embodiment 7 is a package according to one of the embodiments 1 to 6, wherein the side surface in the anchoring region runs in a direction from the top side to the bottom side linearly, with a plurality of linear sections, curved, for example in the form of a circular section, or with a combination of these courses.

[0055] Embodiment 8 is a package according to any one of embodiments 1 to 7, wherein the support frame has an opening for receiving the electronic leadless module.

[0056] Embodiment 9 is a package according to embodiment 8, wherein the electronic leadless module is positively secured in the opening of the carrier frame.

[0057] Embodiment 10 is a package according to any one of embodiments 1 to 9, wherein the filler material comprises or consists of an adhesive.

[0058] Embodiment 11 is a package according to one of the embodiments 1 to 10, wherein the filling material completely fills the anchoring region.

[0059] Embodiment 12 is a package according to one of the embodiments 1 to 11, wherein the bottom side of the electronic leadless module is formed as a land grid array, a ball grid array or a quad-flat no leads package.

[0060] Embodiment 13 is a package according to one of the embodiments 1 to 12, wherein the electronic leadless module is configured as a sensor module.

[0061] Embodiment 14 is a chip card. The chip card may comprise a chip card body with a receiving opening and a package according to any one of embodiments 1 to 13, wherein the package is received in the receiving opening.

[0062] Embodiment 15 is a method for forming a package. The method comprises forming a leadless electronic module having a top side, a bottom side, and side surfaces between the top side and the bottom side, an electronic circuit, a plurality of electrical contact pads on the bottom side of the leadless electronic module that are electrically conductively coupled to the electronic circuit, and encapsulation material that partially encapsulates the electronic circuit, wherein the electrical contact pads are at least partially free of encapsulation material. The method further comprises forming an anchoring region on at least one side surface of the leadless electronic module, arranging the leadless electronic module in an opening of a carrier frame, wherein the bottom side faces the carrier frame, wherein the side surface is parallel to the top or bottom side.bottom side below the anchoring area extends further towards the support frame than in the anchoring area; and arranging filler material in the anchoring area for attaching the leadless electronic module to the support frame.

[0063] Embodiment 16 is a method according to embodiment 15, wherein forming the anchoring region comprises forming a recess or forming an inclined side surface that is inclined to be closer to a central region of the leadless module in the upper region than in the lower region.

[0064] Embodiment 17 is a method according to embodiment 15 or 16, wherein the anchoring region is open towards the top of the leadless electronic module.

[0065] Embodiment 18 is a method according to any one of embodiments 15 to 17, wherein the anchoring region extends along the entire side surface.

[0066] Embodiment 19 is a method according to one of embodiments 15 to 18, wherein the at least one side surface has a plurality of side surfaces, each with an anchoring region.

[0067] Embodiment 20 is a method according to any one of embodiments 15 to 19, wherein the leadless electronic module has an anchoring region on each side surface.

[0068] Embodiment 21 is a method according to one of the embodiments 15 to 20, wherein the side surface in the anchoring region runs in a direction from the top side to the bottom side linearly, with several linear sections, curved, for example in the form of a circular section, or with a combination of these courses.

[0069] Embodiment 22 is a method according to one of the embodiments 15 to 21, wherein the anchoring region is formed in the multi-module composite.

[0070] Embodiment 23 is a method according to one of the embodiments 15 to 22, wherein the formation of the anchoring region takes place during a separation of the electronic leadless modules from a multi-module assembly.

[0071] Embodiment 24 is a method according to embodiment 22 or 23, wherein the formation of the anchoring region comprises sawing to form the anchoring region and sawing with a thinner saw blade or breaking to sever the multi-module composite below and / or above the anchoring region.

[0072] Embodiment 25 is a method according to one of embodiments 15 to 24, wherein the formation of the anchoring region takes place after separating the electronic leadless modules from a multi-module assembly.

[0073] Embodiment 26 is a method according to any one of embodiments 15 to 25, wherein forming comprises at least one method of a group of methods, the group comprising sawing, grinding, laser machining, and etching.

[0074] Embodiment 27 is a method according to any one of embodiments 15 to 26, further comprising: arranging the electronic leadless module in an opening of the carrier frame.

[0075] Embodiment 28 is a method according to embodiment 27, which further comprises positively fastening the electronic leadless module in the opening of the carrier frame.

[0076] Embodiment 29 is a method according to any one of embodiments 15 to 28, wherein the filler material comprises or consists of an adhesive.

[0077] Embodiment 30 is a method according to any one of embodiments 15 to 29, wherein the filling material completely fills the anchoring region.

[0078] Embodiment 31 is a method according to any one of embodiments 27 to 30, wherein the filler material is arranged after the electronic leadless module has been arranged in the anchoring region.

[0079] Embodiment 32 is a method according to any one of embodiments 27 to 30, wherein the filler material is arranged in the opening before arranging the leadless electronic module and fills the anchoring region after arranging the leadless electronic module.

[0080] Embodiment 33 is a method according to any one of embodiments 15 to 32, wherein the bottom side of the electronic leadless module is formed as a land grid array, a ball grid array, or a quad-flat no leads package.

[0081] Embodiment 34 is a method according to any one of embodiments 15 to 33, wherein the electronic leadless module is configured as a sensor module.

[0082] Embodiment 35 is a method for forming a chip card. The method may include providing a chip card body with a receiving opening and arranging a package according to one of embodiments 1 to 13 in the receiving opening.

[0083] Further advantageous embodiments of the device result from the description of the method and vice versa.

Claims

[1] Package (200), comprising: an electronic leadless module (100) having a top side (100T), a bottom side (100B) and side surfaces (100S) between the top side (100T) and the bottom side (100B), the electronic leadless module (100) comprising: • an electronic circuit (250), • a plurality of electrical contact pads (103) electrically coupled to the electronic circuit (250) on the underside (100B) of the leadless electronic module (100); • and encapsulation material (105) partially encapsulating the electronic circuit (250), wherein the electrical contact pads (103) are at least partially free of encapsulation material (105); wherein the electronic leadless module (100) has an anchoring region (120) on at least one side surface (100S); a support frame (220) supporting the leadless electronic module (100), the underside of which faces the support frame (220); wherein the side surface (100S) extends below the anchoring region (120) parallel to the top or bottom further in the direction of the support frame (220) than in the anchoring region (120); and Filling material (224) in the anchoring area (120) for attaching the electronic leadless module (100) to the support frame (220). [2] The package according to claim 1, wherein the anchoring region (120) is formed as a recess, or as an upper portion of an inclined side surface (100S). [3] The package (200) according to claim 1 or 2, wherein the anchoring region (120) is open towards the top side (100T) of the leadless electronic module. [4] The package (200) according to any one of claims 1 to 3, wherein the anchoring region (120) extends along the entire side surface (100S). [5] The package (200) according to any one of claims 1 to 4, wherein a plurality of the side surfaces (100S) each have an anchoring region (120). [6] The package (200) according to any one of claims 1 to 5, wherein the leadless electronic module (100) has an anchoring region (120) on each side surface (100S). [7] The package (200) according to one of claims 1 to 6, wherein the side surface (100S) in the anchoring region (120) extends in a direction from the top side (100T) to the bottom side (100B) linearly, with a plurality of linear sections, curved, for example in the form of a circular section, or with a combination of these courses. [8] The package (200) according to any one of claims 1 to 7, wherein the support frame (220) has an opening (202) for receiving the leadless electronic module (100). [9] The package (200) according to claim 8, wherein the electronic leadless module (100) is positively secured in the opening (202) of the support frame (220). [10] The package (200) according to any one of claims 1 to 9, wherein the filling material (224) completely fills the anchoring region (120). [11] The package (200) according to any one of claims 1 to 10, wherein the bottom side (100B) of the leadless electronic module (100) is formed as a land grid array, a ball grid array or a quad flat no leads package. [12] The package (200) according to one of claims 1 to 11, wherein the electronic leadless module (100) is configured as a sensor module. [13] Chip card (500), comprising: a chip card body with a receiving opening; and a package (200) according to one of claims 1 to 12, wherein the package (200) is received in the receiving opening. [14] A method for forming a package, the method comprising: Forming a leadless electronic module having a top side, a bottom side and side surfaces between the top side and the bottom side, an electronic circuit, a plurality of electrical contact pads on the bottom side of the leadless electronic module that are electrically conductively coupled to the electronic circuit, encapsulation material that partially encapsulates the electronic circuit, wherein the electrical contact pads are at least partially free of encapsulation material (610); Forming an anchoring region on at least one side surface of the electronic leadless module (620); arranging the electronic leadless module in an opening of a support frame, wherein the underside faces the support frame, wherein the side surface extends parallel to the top or bottom below the anchoring region further in the direction of the support frame than in the anchoring region; and Arranging filler material in the anchoring area for attaching the electronic leadless module to the support frame (640). [15] The method according to claim 14, wherein the formation of the anchoring region takes place in the multi-module composite. [16] The method according to claim 14 or 15, wherein the formation of the anchoring region takes place during a separation of the electronic leadless modules from a multi-module assembly. [17] The method according to claim 15 or 16, wherein the forming of the anchoring region comprises sawing to form the anchoring region and sawing with a thinner saw blade or breaking to sever the multi-module composite below and / or above the recess. [18] The method according to claim 14, wherein the formation of the anchoring region takes place after separating the electronic leadless modules from a multi-module assembly. [19] The method according to any one of claims 14 to 18, wherein forming the anchoring region comprises at least one method of a group of methods comprising: saws; Grind; laser processing; and Etching. [20] A method for forming a chip card, the method comprising: Providing a chip card body with a receiving opening (710); and Arranging a package according to one of claims 1 to 12 in the receiving opening (720).

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