Cooling device

Abstract

Cooling device for dissipating heat from an object to be cooled, such as an electronic component, for example a chip, arranged in particular on a printed circuit board, comprising a cooling fluid line for the flow of cooling fluid, a base component (11) having one or more cooling fluid line sections, and a heat sink (14), preferably made of solid material and preferably plate-shaped, which can be arranged on an object to be cooled and for absorbing waste heat from the object to be cooled and for conducting the waste heat to the cooling fluid flowing through the cooling fluid line of the cooling device during operation, in particular such a heat sink (14) made of metal or a thermally conductive metal alloy, characterized in that the heat sink (14) is arranged on a cooling component (12) of the cooling device which has at least one cooling fluid line section.the cooling component (12) is movably connected to the base component (11) via a fluid-conducting connection of this cooling fluid line section to a cooling fluid line section of the base component (11), so that the cooling component (12) and the base component (11) can be moved relative to each other as required to adjust the position of the heat sink (14) of the cooling component (12), wherein the cooling component (12) movably connected to the base component (11) has a base body, in particular injection-molded plastic, which together with the heat sink (14), to whose inside the base body of the cooling component (12) is fluid-tightly connected, forms a section of the cooling fluid line of the cooling component (12).

Description

[0001] The present invention relates to a cooling device for dissipating heat from an object to be cooled, such as an electronic component, for example a processor chip, arranged in particular on a printed circuit board, comprising a cooling fluid line for the flow of cooling fluid, a basic component having one or more cooling fluid line sections, and a heat sink, preferably made of solid material and preferably plate-shaped, which can be arranged on an object to be cooled and for absorbing waste heat from the object to be cooled and for transferring the waste heat to the cooling fluid flowing through the cooling fluid line of the cooling device during operation, in particular such a heat sink made of metal or a thermally conductive metal alloy.

[0002] Cooling devices for dissipating heat from objects to be cooled are also known as heat exchangers and are used in many areas of technology. Such cooling devices are particularly important in the cooling of battery systems for electric vehicles, as well as power electronics components, busbars, and processor chips. The aforementioned cooling device is typically part of a cooling system that includes a pump and other components, with the system ensuring that a cooling medium, such as water, is continuously circulated through the cooling device.

[0003] In the type of cooling device described above, the actual cooling element, which is usually in contact with the object to be cooled, is often part of the base component, which includes sections of the cooling fluid line for the inlet and outlet of the cooling medium. It can, for example, form the single, flat underside of the base component of the cooling device and be attached to the end faces of several adjacent objects to be cooled.

[0004] This type of cooling system is disadvantageous, among other things, when several adjacent objects need to be cooled simultaneously, whose end faces should theoretically lie in the same plane, but exhibit slight height differences due to manufacturing tolerances, for example. While these tolerances can be compensated for to a certain extent with intermediate layers of thermal paste, the thickness of this thermal paste impairs heat dissipation from the objects being cooled. This can be critical for particularly heat-sensitive components or components with high heat generation, such as high-performance chips, meaning that only very thin layers of thermal paste are permissible. However, manufacturing tolerances often exceed this permissible layer thickness.

[0005] US 4 882 654 A discloses a liquid heat exchanger for connection with an electronic component that is mounted on a fixed support, wherein a connection between the fixed support and the heat exchanger can be flexible or rigid.

[0006] The object of the present invention is therefore to further develop the aforementioned cooling devices. In particular, it should also be possible to compensate for larger manufacturing tolerances.

[0007] This problem is solved according to the invention by a cooling device having the features of claim 1.

[0008] A cooling device according to the invention is accordingly characterized in that the cooling element is arranged on a cooling component of the cooling device which has a cooling fluid line section of the cooling fluid line of the cooling device, and which is movably connected to the base component by means of a fluid-conducting connection of this cooling fluid line section to a cooling fluid line section of the base component, so that the cooling component and the base component can be moved relative to each other as required to adjust the position of the cooling element of the cooling component either towards each other or away from each other.

[0009] Advantageously, according to the invention, the heat sink is no longer part of the base component of the cooling device, but is arranged on a separate cooling component, or possibly a part thereof, which in turn is movably connected to the base component. Advantageously, therefore, the relative position of the heat sink of the cooling component could be changed even after the base component of the cooling device has already been fixed in place (before or even during operation).

[0010] Thus, it would be conceivable, for example, that the base component has an additional (possibly fixed) heat sink, and that the cooling device is initially positioned in operation so that this additional heat sink is arranged on a first object to be cooled or – possibly with the aid of thermal paste – placed against its contact surface to be cooled. The heat sink of the cooling component, which is movably connected to the base component, could then, due to its mobility relative to the base component, be positioned on another object to be cooled. This second object might be roughly in the same plane as the first object to be cooled, but its contact surface might differ slightly in height from that of the first object, perhaps due to manufacturing tolerances.

[0011] It is understood, moreover, that according to the invention, not only adjustments to the position of the cooling element of the cooling component are possible within the scope of manufacturing tolerances, but also – depending on the implementation of the basic idea of ​​the invention – on a larger scale.

[0012] As regards the heat sink of the cooling component which is movably connected to the base component, it is preferably designed in the shape of a plate and / or has cooling fins.

[0013] According to a preferred embodiment of the invention, the cooling fluid line section of the base component (particularly fixed to the base component) and the cooling fluid line section of the cooling component (particularly fixed to the cooling component), which is movably connected to the base component, each have a preferably terminal, and in particular hollow cylindrical, hollow body (partial) section. For the movable connection of the base component and the cooling component according to the invention, the two hollow body (partial) sections are connected to each other in a fluid-conducting manner, in particular by sliding, axial movement. This is preferably achieved by inserting or sliding one hollow body section, in particular the hollow body section of the cooling component, precisely coaxially into the interior of the other hollow body section, in particular the hollow body section of the base component.To seal the two hollow body sections that are movable relative to each other, (at least) one sealing ring may be used.

[0014] The cooling fluid could be supplied to the cooling component or its cooling fluid line section via the aforementioned hollow body sections. Advantageously, once the cooling fluid has absorbed the waste heat from the object being cooled via the heat sink, it is discharged from the cooling component, preferably back to the base component or into another cooling fluid line section of the base component. Accordingly, the cooling fluid would first flow into the (first) cooling fluid line section of the base component, then into the cooling fluid line section of the cooling component, and subsequently into the next cooling fluid line section of the base component.

[0015] Generally speaking, according to a further embodiment of the aforementioned design, it can be provided that the cooling fluid line section of the cooling component movably connected to the base component has a second preferably terminal, in particular hollow cylindrical hollow body (part) section, that a further or second cooling fluid line section of the base component has a preferably terminal, in particular hollow cylindrical hollow body (part) section, and that for the movable connection of base component and cooling component, these two hollow body (part) sections are also connected to each other, in particular slidably, axially movable and fluid-conducting.This is also preferably achieved by inserting one hollow body section, in particular the second hollow body section of the cooling component, precisely coaxially into the interior of the other hollow body section, in particular the hollow body section of the further cooling fluid line of the base component, preferably also using at least one sealing ring that seals the two hollow body sections against each other in a fluid-tight manner.

[0016] The heat sink of the cooling component can extend along a plane that runs at an angle, in particular perpendicular to the two opposite directions of movement in which the cooling component and the base component can be moved towards or away from each other as required.

[0017] Furthermore, an inner surface of the cooling element, which extends particularly in a transverse axial plane (transverse axial with regard to the axial relative movement between the respective hollow body sections), can form one of the inner wall surfaces of the cooling fluid line section of the cooling component that defines the cooling medium. Accordingly, during operation of the cooling device, the cooling medium would / could flow directly past the inside of the cooling element and absorb the waste heat from the object being cooled.

[0018] Preferably, the inner wall surfaces of the cooling fluid line section of the cooling component, opposite the inner surface of the cooling element, can form force-compensating surfaces, so that fluid pressure forces acting on the inner surface of the cooling element, caused by the pressure of a cooling fluid flowing through the cooling element (especially axial fluid pressure forces, axial with reference to the axial relative movement between the respective hollow body sections), are canceled out by corresponding opposing fluid pressure forces acting on these force-compensating surfaces (especially axial fluid pressure forces). This prevents, for example, the movable cooling element from exerting forces on the contact surface of the object it is cooling, despite the movement of the cooling element relative to the base component according to the invention. This could otherwise be problematic, especially with sensitive objects.

[0019] One of the force compensation surfaces can advantageously be formed by an inner wall surface of the or each hollow body section of the cooling component, extending in particular transversely axially, which defines a terminal connection channel of this hollow body section, extending in particular transversely axially, through which cooling fluid can flow from the cooling fluid section of the base body to the cooling fluid section of the cooling component (or vice versa).

[0020] The cooling component, which is movably connected to the base component, can further be operatively connected to the base component by means of a pre-tensionable clamping element of the cooling device, preferably by means of a spring, which is supported on one side by the base component and on the other side by the cooling component. In particular, by means of such a clamping element, the pre-tension of which can be effected by a relative movement between the cooling component and the base component, which moves the cooling component and the base component towards each other or would move them towards each other.

[0021] In its pre-tensioned state, the clamping element can exert forces on the cooling component and the base component, which move or would move the cooling component and the base component away from each other, so that, if desired, contact or pressing forces can be exerted on the contact surface of the object to be cooled, thus guaranteeing stable heat transfer between the cooling element and the contact surface during operation.

[0022] Furthermore, the basic component can have a first base body made of, in particular, injection-molded plastic, which is fluid-tightly connected, in particular by forming one or more cooling fluid line sections, to a second base body of the basic component, which is in particular deep-drawn, preferably solid, and in particular made of metal or a thermally conductive metal alloy.

[0023] One or each hollow body section of the cooling fluid line section of the basic component can preferably be formed by the first basic body made of plastic.

[0024] Furthermore, one or each hollow body section of the cooling fluid line section of the base component can extend from a first (especially large-area) side of the second base body of the base component through a (possibly respective) passage hole in this second base body, end on or beyond a (especially large-area) side of the second base body opposite the first side, and in particular be axially movably connected there to one or each hollow body section of the cooling fluid line section of the cooling component movably connected to the base component.

[0025] Furthermore, according to a further embodiment of the invention, the second base body of the basic component can at least partially form an additional heat sink for absorbing waste heat from objects to be cooled and for transferring the waste heat to the cooling fluid flowing through the cooling fluid line of the cooling device during operation. This is achieved in particular by the second base body having at least one cooling area, the inner surface of which, which is opposite an outer surface that can be arranged on a cooling object (in particular directly without lateral offset), forms an inner wall surface of a cooling fluid line section of the basic component.

[0026] The cooling component, which is movably connected to the base component, can further comprise a base body, particularly one made of injection-molded plastic, which, together with the heat sink (to whose inner surface this base body of the cooling component is fluid-tightly connected), forms a section of the cooling fluid line of the cooling component. The plastic base body can also simultaneously form or shape the hollow body section(s) of the cooling fluid line of the cooling component, or the hollow body sections can be formed accordingly by the plastic base body.

[0027] The aforementioned section of the cooling fluid line of the cooling component, formed by the base body made of plastic and the cooling element of the cooling component, and in particular extending transversely axially, can furthermore connect the two hollow body sections of the cooling fluid line of the cooling component in a fluid-conducting manner.

[0028] With regard to the fluid-tight connection of the first plastic base body of the cooling device with the second base body of the base component and / or the fluid-tight connection of the cooling element of the cooling component with the plastic base body of the cooling component, this is preferably a material-locking and / or form-locking connection.

[0029] This material- and / or form-fit connection may preferably involve nano- and / or microstructures produced by physical and / or chemical processes, which are incorporated into the surface of the connection area of ​​the second base body of the base component or into the surface of the connection area of ​​the heat sink of the cooling component. In particular, nano- and / or microstructures that increase the surface area in the connection area and / or have undercut recesses and / or barbs.

[0030] Further features of the present invention will become apparent from the attached patent claims, the following description of preferred embodiments and the attached drawings.

[0031] It shows: Fig. 1 A first embodiment of a cooling device according to the invention, comprising a base component and a cooling component movable relative to it, shown in an oblique view from above; together with an object to be cooled by it, namely a computer chip, Fig. 2 an isolated representation of the cooling component of the cooling device made of Fig. 1 together with the object to be cooled in an oblique view from above, Fig. 3 an isolated representation of the basic component made of Fig. 1 in oblique view from below, Fig. 4. Turn off the cooling unit Fig. 1 with the object to be cooled in a longitudinal section, Fig. 5 the cooling unit Fig. 1 with the object to be cooled in a cross-section, Fig. 6 a second embodiment of a cooling device according to the invention with a base component and a cooling component movable relative to it in an oblique view from above; together with an object to be cooled by it, namely a computer chip, Fig. 7 an isolated representation of the cooling component of the cooling device Fig. 6 together with the object to be cooled in an oblique view from above, Fig. 8 an isolated representation of the basic component made of Fig. 6 in oblique view from below, Fig. 9 the cooling unit Fig. 6 with the object to be cooled in a longitudinal section, Fig. 10 the cooling unit Fig. 6 with the object to be cooled in a cross-section.

[0032] In the Fig. Figures 1-5 show a cooling device 10 which, according to the invention, has a basic component 11 and a cooling component 12 that is movable relative to it.

[0033] The cooling device 10 also has a cooling fluid line 13, through which cooling fluid, such as water, can be guided along a heat sink 14 of the cooling device 10 in order to dissipate waste heat absorbed by the heat sink 14 from an object 15 to be cooled, in this case an example of a high-performance computer chip.

[0034] The cooling device 10 is part of an otherwise known cooling system which includes, among other things, a cooling fluid source and a pump that delivers the cooling fluid through the cooling fluid line 13 of the cooling device 12 (neither of which are shown).

[0035] As will be described in more detail below, the cooling fluid line 13 of the cooling device 10 consists of several sections.

[0036] The basic component 11 has in this case a cooling fluid line section 16 and a cooling fluid line section 17 of the cooling fluid line 13, and the cooling component 12 has a cooling fluid line section 18.

[0037] During operation of the cooling device 10 or the cooling system, the cooling fluid is supplied from the cooling fluid source to the cooling fluid line section 16 of the base component 11, then flows through the cooling fluid line section 18 of the cooling component 12, absorbs the waste heat of the cooling body 14 (in this case equipped with a plurality of cooling fins 34) by flowing along an inner surface 19 of the cooling body 14 which forms an inner wall of the cooling fluid line section 18, and finally flows into the cooling fluid line section 17 of the base component 11, from which it is then returned to the cooling fluid source.

[0038] Both the cooling fluid line section 16 and the cooling fluid line section 17 of the basic component 11 each have a terminal hollow body section 16a or 17a, which each forms a first subsection of the respective cooling fluid line section 16 or 17.

[0039] The terminal hollow body sections 16a and 17a of the cooling fluid line section 16 and 17 are, in the present case, components of a first basic body 21 made of plastic, which also has line walls 22 and 23 that are integrally connected to these hollow body sections 16a and 17a.

[0040] These pipe walls 21 and 23, together with a plate-shaped second, solid base body 24 of the basic component 11 made of metal, in this case aluminum, to which they are fluid-tightly connected, form further cooling fluid pipe sections 16b and 17b of the respective cooling fluid pipe section 16 and 17, respectively, running perpendicular to the hollow body sections 16a and 17a or transversely axially to them. The hollow body sections 16a and 17a are connected directly to these further cooling fluid pipe sections 16a and 16b in a fluid-conducting (one-piece) manner.

[0041] The hollow body sections 16a and 17a of the respective cooling fluid line section 16 or 17 of the base component 11 each extend from a first large-area side 25 of the second base body 24 of the base component 11 through a passage hole 29 in this second base body 24 and end on or beyond the large-area second side 26 of the second base body 24 opposite the first side 25.

[0042] The cooling fluid line section 18 of the cooling component 12 also has hollow body sections 18a and 18b respectively, which accordingly form subsections of the cooling fluid line section 18 of the cooling component 12.

[0043] On the second side 26 of the second basic body 24, the hollow body sections 16a and 18a are connected in pairs, as are the hollow body sections 17a and 18b.

[0044] These connections are designed in such a way that (sliding) axial relative movements between the hollow body sections of the respective pair of hollow body sections 16a, 18a or 17a, 18b are possible (which, for example, a worker could initiate if necessary), so that as a result the basic component 11 and the cooling component 12 can also be moved relative to each other.

[0045] Each hollow body section 18a and 18b has an outer diameter at its end, in a connection area where the hollow body sections 16a, 18a and 17a, 18b are slidably connected to each other, which is slightly smaller than the inner diameter of the respective associated hollow body section 16a and 17a of the cooling fluid line 16 and 17 of the base component 11, so that during the manufacture of the cooling device 10 each hollow body section 18a, 18b could be inserted coaxially into the interior of the respective associated hollow body section 16a and 16b.

[0046] This allows the hollow body sections 16a and 18a or the hollow body sections 17a and 18b, and thus also the cooling component 12 on the one hand and the base component 11 on the other, to be moved by a worker in the axial direction relative to each other (overcoming frictional or holding forces), either towards each other or away from each other, if required.

[0047] Fluid tightness is achieved by means of a sealing ring 33, which is arranged under contact on the outside of the hollow body section 18a or 18b and on the inside of the hollow body section 16a or 17a between the respective pairs of the mutually associated hollow body sections 16a, 18a or 17a, 18b, i.e. it is ensured that fluid cannot flow outwards in the respective connection area between the hollow body sections of each pair 16a, 18a or 17a, 18b.

[0048] As can be seen, the possibilities of being able to move the cooling component 12 and the base component 11 axially towards each other as required are limited by a respective stop surface 20 or an end stop of the hollow body section 16a or 17a of the base component 11, against which the respective free end of the hollow body section 18a or 18b of the cooling component 12 may strike.

[0049] There are also limits to the possibilities of moving the cooling component 12 and the base component 11 axially away from each other, since from a certain distance between them the hollow body sections 18a and 18b would be pulled out of the hollow body sections 16a and 17a respectively to such an extent that there is no longer a fluid-tight connection.

[0050] The cooling component 12, which is movably connected to the base component 11, has in the present case a base body 27 made of plastic, which is in particular injection-molded. This base body forms, on the one hand, the hollow body sections 18a, 18b of the cooling fluid line section 18 of the cooling component 12, which form the respective subsections of the cooling fluid line section 18, and on the other hand, together with the heat sink 14, to whose inner surface 19 the base body 27 is fluid-tightly connected, forms a transversely axially extending subsection 18c of the cooling fluid line section 18, which fluidly connects the two hollow body sections 18a, 18b.

[0051] This section 18c, which runs transversely axially or perpendicularly to the hollow body sections 18a, 18b, is formed by the base body 27 and the cooling element 14 of the cooling component 12 or by its inner side 19.

[0052] Regarding the fluid-tight connection between the base bodies 21 and 24 of the base component 11, i.e., between the first base body 21 made of plastic and the second base body 24 made of metal, this is a material-locking and / or form-locking connection. This connection involves nano- and / or microstructures created by physical and / or chemical processes in the metal surface of the corresponding connection area of ​​the second base body 24 made of metal of the base component 11. Preferably, these are nano- and / or microstructures that increase the metal surface area in the connection area and / or have undercut recesses and / or barbs.

[0053] The fluid-tight connection between the metal heat sink 14 of the cooling component 12 and its plastic base body 27 can be formed in the same way.

[0054] In the Fig.Figures 6-10 show a further embodiment 28 of a cooling device according to the invention. Identical or similar components are provided with the same reference numerals as in cooling device 10, unless otherwise specified. Unless otherwise specified, the following discussion focuses primarily on the differences between cooling device 28 and cooling device 10.

[0055] A special feature of the cooling device 28 is that the cooling component 12 has suitably arranged and designed force compensation surfaces 31, which ensure that, as a result, the fluid pressure of the cooling fluid flowing through the cooling device 28 during operation does not trigger any resulting axial forces (i.e., forces in the direction of movement of the cooling component 12 or in the direction of the relative movement between the pairs of hollow body sections 16a, 18a or 17a, 18b) that could potentially damage the object 15 to be cooled. This is because any axial forces of the cooling fluid acting on the cooling element 14 in the direction of the object 15 are compensated in the cooling device 28 by corresponding axial counterforces acting in the opposite direction, which the cooling fluid simultaneously exerts on the force compensation surfaces 31.

[0056] For this purpose, in the cooling device 28 (in contrast to the cooling device 10) each hollow body section 18a, 18b extends from the second side 26 of the second base body 24 of the base component 11 (from below) through the respective passage hole 29 and ends beyond or on the first side 25 of the second base body 25, forming a respective transversely extending connection channel 30, which connects to the cooling fluid line section 16b or 17b extending (coaxially to this) on the first side 25 of the second base body 24 and whose transversely extending inner wall surface (a region thereof) forms one of the force compensation surfaces 31.

[0057] Furthermore, the hollow body sections 16a, 17a, into which the hollow body sections 18a and 18b are inserted, also extend largely on the first side 26 of the second basic body 25 of the basic component 11.

[0058] Another special feature of the cooling device 28 is that the cooling component 12 is operatively connected to the base component 11 by means of a pre-tensionable clamping element 32 of the cooling device which is supported on the one hand on the base component 11 and on the other hand on the cooling component 12, in this case by means of a spring.

[0059] With the aid of the clamping element 32, forces are then applied to the cooling component 12 in a targeted manner during operation, in which the base component 11 is usually positioned in a fixed location (downwards in the drawings), causing the cooling element 14 of the cooling component 12 to be pressed or squeezed against the object 15 to be cooled, thus ensuring a permanent contact of the cooling element 14 with the object 15 to be cooled and therefore optimal heat transfer between the object 15 to be cooled and the cooling element 14. Reference symbol list: 10 Cooling unit 11 Basic component 12 Cooling component 13 Cooling fluid line Cooling device 14 heat sinks 15 Item to be cooled 16 Cooling fluid line section basic component 16a Hollow body section 16b Cooling fluid line section 17 Cooling fluid line section basic component 17a Hollow body section 17b Cooling fluid line section 18 Cooling fluid line section Cooling component 18a Hollow body section 18b Hollow body section 18c transverse axial cooling fluid line section 19 Inside of heat sink 20 Stop surface hollow body section 21 first basic body basic component 22 conduit wall 23 conduit wall 24 second basic body basic component 25 first page second basic body basic component 26 second page basic body basic component 27 Basic body cooling component 28 Cooling unit 29 Through hole 30 connection channels 31 force compensation surfaces 32 clamping element 33 Sealing ring 34 cooling fins

Claims

[1] Cooling device for dissipating heat from an object to be cooled, such as an electronic component, for example a chip, arranged in particular on a printed circuit board, comprising a cooling fluid line for the flow of cooling fluid, a basic component (11) having one or more cooling fluid line sections, and a heat sink (14), preferably made of solid material and preferably plate-shaped, which can be arranged on an object to be cooled and for absorbing waste heat from the object to be cooled and for transferring the waste heat to the cooling fluid flowing through the cooling fluid line of the cooling device during operation, in particular such a heat sink (14) made of metal or a thermally conductive metal alloy, characterized by, that the heat sink (14) is arranged on a cooling component (12) of the cooling device which has at least one cooling fluid line section of the cooling fluid line, which is movably connected to the base component (11) by means of a fluid-conducting connection of this cooling fluid line section to a cooling fluid line section of the base component (11), so that the cooling component (12) and the base component (11) can be moved relative to each other as required to adjust the position of the heat sink (14) of the cooling component (12) either towards each other or away from each other, wherein the cooling component (12) which is movably connected to the base component (11) has a base body made of plastic, in particular injection-molded, which together with the heat sink (14), to whose inside the base body of the cooling component (12) is fluid-tightly connected, forms a partial section of the cooling fluid line section of the cooling component (12). [2] Cooling device according to claim 1, characterized by, that the cooling element (14) of the cooling element (12) which is movably connected to the base element (11) is plate-shaped and / or has cooling fins and extends along a plane which is angular, in particular perpendicular to the two opposite directions of movement in which the cooling element (12) and the base element (11) can be moved towards or away from each other as required relative to each other. [3] Cooling device according to claim 1 or 2, characterized by, that the cooling fluid line section of the base component (11) and the cooling fluid line section of the cooling component (12) movably connected to the base component (11) each have a preferably terminal, in particular hollow cylindrical, hollow body section, and that for the movable connection of the base component (11) and the cooling component (12) the two hollow body sections are connected to each other in a fluid-conducting manner, in particular slidingly, axially movable, preferably by inserting one hollow body section, in particular the hollow body section of the cooling component (12), precisely coaxially into the interior of the other hollow body section, in particular the hollow body section of the base component (11), preferably using a sealing ring that fluid-tightly seals the two hollow body sections against each other. [4] Cooling device according to claim 3, characterized bythat the cooling fluid line section of the cooling component (12) movably connected to the base component (11) has a second terminal, in particular hollow cylindrical, hollow body section, that a second cooling fluid line section of the base component (11) also has a preferably terminal, in particular hollow cylindrical, hollow body section, and that for the movable connection of the base component (11) and the cooling component (12) these two hollow body sections are also connected to each other, in particular slidably, axially movable and fluid-conducting, preferably by inserting one hollow body section, in particular the second hollow body section of the cooling component (12), precisely coaxially into the interior of the other hollow body section, in particular the hollow body section of the second cooling fluid line section of the base component (11), preferably using a sealing ring that fluid-tightly seals the two hollow body sections against each other. [5] Cooling device according to one or more of the preceding claims, characterized by , that an inner side of the cooling element (14) of the cooling element (12) which extends in particular in a transverse axial plane and is movably connected to the base element (11) forms one of the inner wall surfaces of the cooling fluid line section of the cooling element (12) which limit the cooling medium. [6] Cooling device according to one or more of the preceding claims, characterized by , that the inner wall surfaces of the cooling fluid line section of the cooling component (12) opposite the inside of the cooling body (14) form force compensation surfaces, so that the fluid pressure forces acting on the inside of the cooling body (14) caused by the pressure of a fluid flowing through the cooling component (12), in particular axial fluid pressure forces, are canceled out by corresponding opposing fluid pressure forces acting on these compensation surfaces, in particular axial fluid pressure forces. [7] Cooling device according to one or more of the preceding claims, at least according to claim 3 and claim 6, characterized by , that a force compensation surface is formed by an inner wall surface of the or each hollow body section of the cooling component (12), which extends in particular transversely axially and which defines a terminal connection channel of this hollow body section, extending in particular transversely axially, through which the cooling fluid can flow from the (respective) cooling fluid section of the base body to the cooling fluid section of the cooling component (12) (or vice versa). [8] Cooling device according to one or more of the preceding claims, characterized by, that the cooling component (12) which is movably connected to the base component (11) is operatively connected to the base component (11) by means of a pre-tensionable clamping element of the cooling device which is preferably supported on one side by the base component (11) and on the other side by the cooling component (12), preferably by means of a spring, in particular by means of such a clamping element, the pre-tension of which can be effected by a relative movement between the cooling component (12) and the base component (11) which moves the cooling component (12) and the base component (11) towards each other or could move them towards each other. [9] Cooling device according to claim 8, characterized by , that the clamping element in its prestressed state exerts forces on the cooling component (12) and the base component (11) which move or would move the cooling component (12) and the base component (11) away from each other. [10] Cooling device according to one or more of the preceding claims, characterized by, that the basic component (11) has a first base body made of, in particular, injection-molded plastic, which is connected in a fluid-tight manner, in particular by forming one or more cooling fluid line sections, to a second base body, preferably deep-drawn, preferably solid, in particular made of metal or a thermally conductive metal alloy. [11] Cooling device according to claim 10, characterized by , that one or each hollow body section of the cooling fluid line section of the basic component (11) is formed by the first basic body. [12] Cooling device according to claim 10 or 11, characterized by, that one or each hollow body section of the cooling fluid line section of the base component (11) extends from a first (in particular large-area) side of the second base body of the base component (11) through a (possibly respective) passage hole in this second base body, ends on or beyond the (in particular large-area) side of the second base body opposite the first side and is axially movably connected there to one or each hollow body section of the cooling fluid line section of the cooling component (12) movably connected to the base component (11). [13] Cooling device according to one or more of the preceding claims 10-12, characterized by, that the second basic body forms at least in part a further cooling body (24) for absorbing waste heat from objects to be cooled and for transferring the waste heat to cooling fluid flowing through the cooling fluid line of the cooling device during operation, in particular by the second basic body having at least one cooling area, the inside of which, which is opposite an outside which can be arranged on a cooling object, forms an inner wall surface of a cooling fluid line section of the basic component (11). [14] Cooling device according to one or more of the preceding claims, characterized by , that the base body of the cooling component (12) which is movably connected to the base component (11) forms the or each hollow body section of the cooling fluid line section of the cooling component (12). [15] Cooling device according to claim 1, characterized by, that the subsection of the cooling fluid line section of the cooling component (12) formed by the base body of the cooling component (12) and the cooling element (14) of the cooling component (12), in particular the transversely axially extending subsection, connects the two hollow body sections of the cooling fluid line section of the cooling component (12) to each other in a fluid-conducting manner. [16] Cooling device according to one or more of the preceding claims, characterized by, that the fluid-tight connection of the first and second base body of the base component (11) and / or the fluid-tight connection of the heat sink of the cooling component (12) with the base body of the cooling component (12) is a material- and / or form-fit connection, and that nano- and / or microstructures produced by physical and / or chemical processes are involved in this material- and / or form-fit connection in the surface of the connection area of ​​the second base body of the base component (11) or in the surface of the connection area of ​​the heat sink of the cooling component (12), in particular nano- and / or microstructures that cause an increase in the surface area in the connection area and / or have undercut recesses and / or barbs.

Images