Processing device that removes an annular reinforcement part with a protruding shape from a wafer

Abstract

A processing apparatus (2) that removes an annular reinforcing part (24) having a protruding shape from a wafer (4), wherein the annular reinforcing part (24) is formed in the protruding shape on a part of a rear surface (4b) of the wafer (4), the part of the rear surface (4b) corresponding to an outer peripheral excess area (20), the processing apparatus (2) comprising: a wafer cassette table (8) on which a wafer cassette (6) in which a plurality of wafers (4) are accommodated is placed; a wafer removal mechanism (10) that removes the wafer (4) from the wafer cassette (6) placed on the wafer cassette table (8); a wafer table (12) supporting one side of a front surface (4a) of the wafer (4) carried out by the wafer carrying-out mechanism (10); a frame accommodating unit (66) accommodating a plurality of annular frames (64), each having an opening portion (64a) formed therein for accommodating the wafer (4); a frame removal mechanism (68) that removes the frame (64) from the frame housing unit (66); a frame table (70) supporting the frame (64) fed out by the frame feeding out mechanism (68); a tape adhering unit (98) disposed above the frame table (70) and adhering a tape (96) to the frame (64); a tape-attached frame (64') conveying mechanism (100) that conveys the frame (64') to which the tape (96) is adhered to the wafer table (12), positions the opening part (64a) of the frame (64) on the rear surface (4b) of the wafer (4) carried by the wafer table (12), and places a tape-attached frame (64') on the wafer table (12); a tape pressure bonding unit (102) that performs pressure bonding of the tape (96) of the tape-attached frame (64') to the rear surface (4b) of the wafer (4); a frame unit carrying-out mechanism (192) that carries a frame unit (U) in which the tape (96) of the tape-attached frame (64') and the rear surface (4b) of the wafer (4) are pressure-bonded by the tape pressure-bonding unit (102) away from the wafer table (12) and temporarily places the frame unit (U) on a temporary placement table (204); a reinforcing member removing unit (194) that cuts and removes the annular reinforcing member (24) from the wafer (4) of the frame unit (U) placed on the transition placement table (204); a ringless unit removal mechanism (196) for removing a ringless unit resulting from the removal of the annular reinforcing member (24) from the reinforcing member removal unit (194); and a frame cassette table (200) on which a frame cassette (198) is placed, which accommodates the ringless unit fed out by the ringless unit feeding out mechanism (196), wherein the wafer removal mechanism (10) has a Bernoulli chuck mechanism (44) which discharges gas to the rear surface (4b) of the wafer (4) and generates a negative pressure, and the gas is an inert gas, and the wafer carrying-out mechanism (10) discharges the inert gas from the Bernoulli chuck mechanism (44) to inhibit oxidation of the back surface (4b) of the wafer (4) when the wafer (4) is carried out.

Description

BACKGROUND OF THE INVENTIONField of the invention

[0001] The present invention relates to a processing apparatus that removes an annular reinforcing part having a protruding shape from a wafer, the annular reinforcing part being formed in the protruding shape at a part of a rear surface corresponding to an outer peripheral excess area. Description of related technology

[0002] A wafer in which a device region, in which multiple devices such as integrated circuits (ICs) and large-scale integrations (LSIs) are defined by planned division lines, and an outer peripheral excess region surrounding the device region are formed on a front surface, is ground to a desired thickness by grinding a back surface. Thereafter, the wafer is divided into individual device chips by a dividing device or a laser processing device, and the respective device chips obtained by the division are used for electronic devices such as mobile phones and personal computers.

[0003] The present applicant has proposed the following procedure. Predetermined processing is performed in such a way that an annular reinforcement portion remains on a portion of a rear surface corresponding to an outer peripheral excess area to facilitate conveyance of a ground wafer. Thereafter, a dividing band is attached to the rear surface of the wafer, and the wafer is supported by a frame. Then, the annular reinforcement portion is removed from the wafer (see, for example, Japanese Patent Application Laid-Open No. 2010-62375). PRESENTATION OF THE INVENTION

[0004] However, the following problems exist. It is difficult to adhere the division band to the back surface of the wafer, in which the annular reinforcement portion is formed in a protruding shape on the part of the back surface corresponding to the outer peripheral excess area to bond the wafer to the frame. In addition, it is difficult to cut and remove the annular reinforcement portion from the wafer. Therefore, productivity is low.

[0005] Therefore, it is an object of the present invention to provide a processing apparatus with which the work of adhering a division band to the back surface of a wafer in which an annular reinforcing part is formed in a projecting shape at a part of the back surface corresponding to an outer peripheral excess area to join the wafer to a frame is easy, and it is easy to cut the annular reinforcing part and remove it from the wafer.

[0006] According to one aspect of the present invention, a processing apparatus is provided that removes an annular reinforcement portion having a protruding shape from a wafer, the annular reinforcement portion being formed in the protruding shape on a portion of a rear surface of the wafer, the portion of the rear surface corresponding to an outer peripheral excess area. The processing apparatus comprises: a wafer cassette table on which a wafer cassette housing a plurality of wafers is placed; a wafer removal mechanism that removes the wafer from the wafer cassette placed on the wafer cassette table; a wafer table supporting one side of a front surface of the wafer removed by the wafer removal mechanism; a frame housing unit that houses a plurality of annular frames, each of which has an opening portion formed therein;which accommodates the wafer, a frame carrying-out mechanism that carries the frame out of the frame accommodating unit, a frame table that supports the frame carried out by the frame carrying-out mechanism, a tape adhering unit that is arranged above the frame table and adheres a tape to the frame, a tape-attached frame carrying mechanism that carries the frame with the tape adhered to it to the wafer table, positions the opening part of the frame on the rear surface of the wafer carried by the wafer table, and places a tape-attached frame on the wafer table, a tape pressure-bonding unit that pressure-bonds the tape of the tape-attached frame to the rear surface of the wafer, a frame unit carrying-out mechanism that supports a frame unit,in which the tape of the frame with the tape attached and the back surface of the wafer are pressure-bonded by the tape pressure-bonding unit, is conveyed away from the wafer table, and the frame unit is temporarily placed on a transition placement table; a reinforcement member removal unit that cuts and removes the annular reinforcement member from the wafer of the frame unit placed on the transition placement table; a ringless unit removal mechanism that removes a ringless unit resulting from the removal of the annular reinforcement member from the reinforcement member removal unit; and a frame cassette table on which a frame cassette is placed that houses the ringless unit removed by the ringless unit removal mechanism. The wafer removal mechanism includes a Bernoulli chuck mechanism.which expels gas to the back surface of the wafer and creates a negative pressure, and the gas is an inert gas, and the wafer ejection mechanism expels the inert gas from the Bernoulli chuck mechanism to inhibit oxidation of the back surface of the wafer when the wafer is ejected.

[0007] Preferably, the tape pressure bonding unit includes an upper chamber disposed above the wafer table, a lower chamber in which the wafer table is housed, a lifting mechanism that raises and lowers the upper chamber and creates a closed state in which the upper chamber is brought into contact with the lower chamber and an open state in which the upper chamber is separated from the lower chamber, a vacuum part that places the upper chamber and the lower chamber in a vacuum state in the closed state, and an atmosphere opening part that opens the upper chamber and the lower chamber to the atmosphere. The upper chamber sprays inert gas onto the back surface of the wafer supported by the wafer table to inhibit oxidation of the back surface of the wafer.In a state where the tape of the tape-attached frame is positioned on the back surface of the wafer, the lifting mechanism is operated to maintain the closed state, the spraying of the inert gas is stopped, and a vacuum state is created. Pressure-bonding the tape of the tape-attached frame to the back surface of the wafer is performed by a pressing roller arranged in the upper chamber. Furthermore, the wafer table preferably includes a heating unit.

[0008] The processing apparatus according to the aspect of the present invention is configured as described above. Thus, a work of adhering a division band to the back surface of the wafer is easy, in which the annular reinforcing part in the protruding shape is formed on the part of the back surface corresponding to the outer peripheral excess area to connect the wafer to the frame. In addition, it is easy to cut the annular reinforcing part and remove it from the wafer, and productivity becomes favorable. Further, in the processing apparatus according to the aspect of the present invention, the inert gas is sprayed from the Bernoulli chuck mechanism to the back surface of the wafer when the wafer carrying-out mechanism carries out the wafer.Therefore, oxidation of the back surface (for example, the back surface coated with a metal foil made of copper or the like) of the wafer can be inhibited.

[0009] The above and other objects, features and advantages of the present invention, as well as the mode for carrying them into effect, will best become apparent and the invention itself will be best understood by studying the following description and appended claims with reference to the attached drawings which show a preferred embodiment of the invention. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a perspective view of a machining apparatus according to an embodiment; Fig. 2 is a perspective view of a wafer for which processing by the method shown in Fig. 1 shown processing device is executed; Fig. 3 is a perspective view of a wafer cassette table, etc., as shown in Fig. 1 shown; Fig. 4 is a perspective view of a Fig. 1 depicted hand; Fig. 5 is a perspective view of a Fig. 1 frame accommodation unit, etc.; Fig. 6A is a perspective view of a tape adhesion unit, etc. in a state in which a Fig. 1 frame table shown is positioned at a lowering position; Fig. 6B is a perspective view of the tape adhesion unit, etc. in a state in which the Fig. 1 frame table is positioned at a lifting position; Fig. 7 is an exploded perspective view of a Fig. 1 shown band pressure connection unit; Fig. 8 is a sectional view illustrating a state in which pressing of a tape by a pressing roller is started in a tape press-joining step; Fig. 9 is a sectional view illustrating a state in which the pressing of the tape by the pressing roller in the tape press-joining step is completed; Fig. 10 is a perspective view of a Fig. 1 shown reinforcement member removal unit; Fig. 11 is a schematic diagram illustrating the state in which an origin of an annular reinforcing part of the wafer is irradiated with a laser beam in a reinforcing part removing step; Fig. 12 is a perspective view of a first lifting table of the Fig. 1 shown reinforcement member removal unit; Fig. 13A is a perspective view of a partition part of the Fig. 1 shown reinforcement member removal unit; Fig. 13B is an enlarged perspective view of Fig. 13A shown support substrates; Fig. 14 is a perspective view of a disposal part of the Fig. 1 shown reinforcement member removal unit; Fig. 15 is a schematic diagram illustrating a state in which attachments are in contact with a Fig. 1 shown table head and an outer diameter of the table head is detected; Fig. 16 is a schematic diagram illustrating a state in which the wafer is sucked and held by a second elevating table in the reinforcing member removing step; Fig. 17 is a schematic diagram illustrating a state in which the attachments of the reinforcement member removing unit are caused to act on an outer periphery of the annular reinforcement member in the reinforcement member removing step; Fig. 18 is a schematic diagram illustrating a state in which the reinforcing member has been separated from the wafer in the reinforcing member removing step; Fig. 19 is a perspective view of a reversing mechanism of a Fig. 1 illustrated removal mechanism for the ringless unit; Fig. 20 is a perspective view of a support member for the ringless unit and a pressing member of the Fig. 1 illustrated removal mechanism for the ringless unit; and Fig. Fig. 21 is a perspective view illustrating a state in which an accommodating step of a ringless unit is carried out. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENT

[0010] An embodiment of the present invention will be described below with reference to the accompanying drawings.

[0011] Referring to Fig. 1, a processing apparatus, designated as a whole by the numeral 2, includes a wafer cassette table 8 on which a wafer cassette 6 in which a plurality of wafers are accommodated is placed, a wafer carrying-out mechanism 10 that carries out a wafer from the wafer cassette 6 placed on the wafer cassette table 8, and a wafer table 12 that supports the front surface side of the wafer carried out by the wafer carrying-out mechanism 10.

[0012] In Fig. 2 shows a wafer 4 being processed by the processing apparatus 2. On a front surface 4a of the wafer 4, a component region 18 in which a plurality of components 14, such as the IC and the LSI, are divided in a grid-like manner by planned division lines 16, and an outer peripheral excess region 20 surrounding the component region 18 are formed. In Fig. In FIG. 2, a boundary 22 between the device region 18 and the outer peripheral excess region 20 is represented by a two-dot chain line for convenience. However, the line representing the boundary 22 does not actually exist. An annular reinforcing part 24 is formed in a protruding shape in the outer peripheral excess region 20 on the rear surface 4b side of the wafer 4, and a thickness of the outer peripheral excess region 20 is greater than that of the device region 18. Further, a notch 26 representing the crystal orientation is formed on a peripheral edge of the wafer 4.

[0013] As in Fig. As shown in Figure 3, a plurality of wafers 4 are accommodated in the wafer cassette 6 in the up-down direction at intervals in the state where the front surfaces 4a are facing upward. The wafer cassette table 8 of the illustrated embodiment includes an upper plate 28 on which the wafer cassette 6 is placed and a support plate 30 that supports the upper plate 28. The upper plate 28 may be capable of raising and lowering, and a lifting mechanism may be arranged that moves the upper plate 28 up and down and positions it at an arbitrary height.

[0014] The description is made with reference to Fig. 3. The wafer removal mechanism 10 has a Y-axis movable component 32 which can move in a Y-axis direction which is Fig. 3, and a Y-axis feed mechanism 34 that moves the Y-axis movable component 32 in the Y-axis direction. The Y-axis feed mechanism 34 includes a ball screw 36 coupled to a lower end of the Y-axis movable component 32 and extending in the Y-axis direction, and a motor 38 that rotates the ball screw 36. The Y-axis feed mechanism 34 converts a rotational motion of the motor 38 into a linear motion through the ball screw 36 and transmits the linear motion to the Y-axis movable component 32 to move the Y-axis movable component 32 in the Y-axis direction along a pair of guide rails 40 extending in the Y-axis direction.

[0015] An X-axis direction that is Fig. 3 is represented by an arrow X, is a direction orthogonal to the Y-axis direction and a Z-axis direction which is in Fig. 3, the up-down direction is orthogonal to the X-axis direction and the Y-axis direction. An XY plane defined by the X-axis direction and the Y-axis direction is essentially horizontal.

[0016] As in Fig. 3, the wafer carrying-out mechanism 10 of the illustrated embodiment includes a carrying arm 42 and a hand 44 disposed at the tip of the carrying arm 42, which supports the rear surface 4b of the wafer 4 housed in the wafer cassette 6 and turns the front and rear sides of the wafer 4 over. The carrying arm 42 is disposed on an upper surface of the Y-axis movable component 32 and is driven by a suitable drive source (not shown), such as an air drive source or an electric drive source. This drive source drives the carrying arm 42 and positions the hand 44 to a freely selected position in each of the X-axis direction, the Y-axis direction, and the Z-axis direction. In addition, the drive source turns the hand 44 upside down.

[0017] With reference to Fig. 4, the hand 44 is a Bernoulli chuck mechanism that ejects inert gas and generates negative pressure to support the wafer 4 in a non-contact manner. The hand 44 of the illustrated embodiment has a C-shape as a whole, and a plurality of gas ejection ports 46 connected to an inert gas supply source (not shown) are formed in a single surface of the hand 44. As the inert gas supplied from the gas supply source, in addition to rare gas such as helium (He) or neon (Ne), nitrogen (N2) may also be used. A plurality of guide pins 48 are attached to an outer peripheral edge of the hand 44 at intervals in the circumferential direction. Each guide pin 48 is configured to be movable in a radial direction of the hand 44.

[0018] The wafer-carrying-out mechanism 10 pushes, as shown in Fig. 3 and Fig. 4, after positioning the hand 44 on the rear surface 4b side (lower side) of the wafer 4 in the wafer cassette 6 placed on the wafer cassette table 8, the hand 44 discharges the inert gas of N2 or the like from the gas discharge ports 46 of the hand 44 to the rear surface 4b of the wafer 4 to generate a negative pressure on a single surface of the hand 44 by the Bernoulli effect, and sucks and carries the wafer 4 from the rear surface 4b side in a non-contact manner by the hand 44. Horizontal movement of the wafer 4 sucked and carried by the hand 44 is restricted by the corresponding guide pins 48.

[0019] Then, the wafer carrying-out mechanism 10 carries out the wafer 4 sucked and carried by the hand 44 from the wafer cassette 6 by moving the Y-axis movable component 32 and the carrying arm 42. Furthermore, the wafer carrying-out mechanism 10 sprays the inert gas N2 or the like to the back surface 4b of the wafer 4 when carrying out the wafer 4, and can thus reduce oxidation of the back surface 4b (for example, the back surface coated with a metal foil made of copper or the like) of the wafer 4.

[0020] As in Fig. 4, the wafer carrying-out mechanism 10 of the illustrated embodiment includes a notch detection unit 50 that detects the position of the notch 26 of the wafer 4. For example, the notch detection unit 50 may include a light emitting element 52 and a light receiving element 54 spaced apart from each other in the up-down direction, and a drive source (not shown) that rotates at least one of the guide pins 48 of the hand 44.

[0021] The light-emitting element 52 and the light-receiving element 54 can be mounted on the Y-axis movable component 32 or a conveying path through a suitable support (not shown). Furthermore, the wafer 4 sucked and carried by the hand 44 rotates due to the rotation of the guide pin 48 when the guide pin 48 rotates by the drive source described above. It is preferable that an outer peripheral surface of the guide pin 48, which is rotated by the drive source, be formed of a suitable synthetic resin to securely transmit the rotation of the guide pin 48 to the wafer 4.

[0022] The notch detection unit 50 can detect the position of the notch 26 by rotating the wafer 4 by the drive source via the guide pin 48 in the state where the wafer 4 is sucked and carried by the hand 44 and an outer periphery of the wafer 4 is positioned between the light-emitting element 52 and the light-receiving element 54. This makes it possible to adjust the orientation of the wafer 4 to any desired orientation.

[0023] As in Fig. 3, the wafer table 12 is arranged next to the wafer-carrying-out mechanism 10. The wafer table 12 of the illustrated embodiment includes an annular support part 56 that supports the outer peripheral excess portion 20 of the wafer 4 and causes the part on the inner side to be non-contact relative to the outer peripheral excess portion 20, and a frame support part 58 that is arranged around an outer periphery of the annular support part 56 and supports a frame 64 to be described later (see Fig. 5). On an upper surface of the annular support member 56, a plurality of suction holes 60 are formed at intervals in the circumferential direction, and each suction hole 60 is connected to a suction source (not shown). The part located on the inner side in the radial direction relative to the annular support member 56 in the wafer table 12 is a circular recess 62 that is hollow downward. Further, the wafer table 12 of the illustrated embodiment includes a heating unit (not shown) such as a heater that heats the wafer 4 placed on the wafer table 12.

[0024] When the hand 44 rotates 180° to flip the front and back sides of the wafer 4, and the wafer 4 is placed on the wafer table 12 in a state where the front surface 4a of the wafer 4 is facing downward, the outer peripheral excess portion 20 of the wafer 4 is supported by the annular support member 56, and the component portion 18 of the wafer 4 is disposed in the recess 62. Although the wafer 4 is placed on the wafer table 12 in a state where the front surface 4a on which the components 14 are formed is facing downward, the components 14 do not come into contact with the wafer table 12, and therefore, damage to the components 14 is prevented.Further, the wafer table 12 prevents deviation of the position of the wafer 4 by actuating the suction source and generating a suction force for each suction hole 60 to suck and hold the outer peripheral excess portion 20 after the outer peripheral excess portion 20 is supported by the annular support member 56.

[0025] Referring to Fig. 5, the processing apparatus 2 further includes a frame accommodating unit 66 that accommodates a plurality of annular frames 64 each having an opening portion 64a for accommodating the wafer 4 formed therein, a frame carrying-out mechanism 68 that carries the frame 64 out of the frame accommodating unit 66, and a frame table 70 that supports the frame 64 carried out by the frame carrying-out mechanism 68.

[0026] As in Fig. 5, the frame housing unit 66 of the illustrated embodiment includes a housing 72, a lifting plate 74 arranged to be moved up and down within the housing 72, and a lifting mechanism (not shown) that moves the lifting plate 74 up and down.

[0027] A Z-axis guide component 78 extending in the Z-axis direction is formed on the side surface of the housing 72 on the side opposite in the X-axis direction. Fig. 5. The lift plate 74 is supported by the Z-axis guide component 78 so that it can move up and down, and the lift mechanism that moves the lift plate 74 up and down is arranged within the Z-axis guide component 78. The lift mechanism could, for example, include a ball screw coupled to the lift plate 74 and extending in the Z-axis direction, and a motor that rotates this ball screw.

[0028] On the side surface of the housing 72 at the X-axis direction in Fig. A door 76 is arranged on the side near the housing 72, to which a handle 76a is attached. In the frame housing unit 66, the frames 64 can be housed within the housing 72 by grasping the handle 76a and opening the door 76. Furthermore, an opening part 80 is provided at an upper end of the housing 72.

[0029] As in Fig. 5, the frames 64 are housed by being stacked on an upper surface of the lifting plate 74 within the casing 72. The frame 64 at the uppermost level of the plurality of stacked frames 64 is lifted out from the opening portion 80 of the casing 72 by the frame lifting mechanism 68. Further, when the frame 64 is lifted out from the opening portion 80, the frame housing unit 66 appropriately lifts the lifting plate 74 by the lifting mechanism and positions the frame 64 at the uppermost level at the position from which this frame 64 can be lifted out by the frame lifting mechanism 68.

[0030] The description is made with reference to Fig. 5. The frame delivery mechanism 68 includes an X-axis guide component 82 mounted on a suitable support (not shown) and extending in the X-axis direction, an X-axis movable component 84 movably supported in the X-axis direction by the X-axis guide component 82, an X-axis feed mechanism (not shown) that moves the X-axis movable component 84 in the X-axis direction, a Z-axis movable component 86 movably supported in the Z-axis direction by the X-axis movable component 84, and a Z-axis feed mechanism (not shown) that moves the Z-axis movable component 86 in the Z-axis direction.

[0031] The X-axis feed mechanism of the frame removal mechanism 68 could include a ball screw coupled to the X-axis movable component 84 and extending in the X-axis direction, and a motor that rotates this ball screw. The Z-axis feed mechanism could include a ball screw coupled to the Z-axis movable component 86 and extending in the Z-axis direction, and a motor that rotates this ball screw.

[0032] The Z-axis movable component 86 of the frame removal mechanism 68 includes a support portion 88 that supports the frame 64. The support portion 88 of the illustrated embodiment includes a rectangular support plate 90 and a plurality of suction pads 92 disposed on a lower surface of the support plate 90. Each suction pad 92 is connected to a suction source (not shown).

[0033] The frame carrying-out mechanism 68 sucks and holds the frame 64 at the top level housed in the frame housing unit 66 through the suction pads 92 of the holding part 88, and then moves the X-axis movable component 84 and the Z-axis movable component 86. Accordingly, the frame carrying-out mechanism 68 carries the sucked and held frame 64 out of the frame housing unit 66 at the top level.

[0034] As in Fig. As shown in Figure 5, the frame table 70 is supported by a Z-axis guide component 94 so that it can rise and lower between a lowering position indicated by solid lines and a lifting position indicated by two-dot chain lines. A suitable drive source (e.g., an air drive source or an electric drive source) is connected to the Z-axis guide component 94, which moves the frame table 70 up and down between the lowering position and the lifting position. The frame table 70 receives the frame 64, which has been lifted out by the frame-carrying-out mechanism 68, at the lowering position.

[0035] As in Fig. 1 and Fig. 5, the processing device 2 has a tape adhesion unit 98 (see Fig. 1) arranged above the frame table 70 and having a belt 96 adhered to the frame 64, a conveying mechanism 100 for a frame with the belt attached (see Fig. 5) which conveys the frame 64 to which the tape 96 is adhered (hereinafter often referred to as a “tape-attached frame 64'”) to the wafer table 12, positions the opening part 64a of the frame 64 on the rear surface 4b of the wafer 4 carried by the wafer table 12, and places the tape-attached frame 64' on the wafer table 12, and a tape pressure bonding unit 102 (see Fig. 1) which performs pressure bonding of the tape 96 of the tape-attached frame 64' to the rear surface 4b of the wafer 4.

[0036] With reference to Fig. 6A and Fig. 6B, the tape adhering unit 98 of the illustrated embodiment includes a roll tape supporting part 104 that supports a roll tape 96R in which the tape 96 is wound before use, a tape receiving part 106 that receives the used tape 96, a tape pulling out part 108 that pulls out the tape 96 from the roll tape 96R, a pressure-connecting part 110 that pressure-connects the pulled-out tape 96 to the frame 64, and a cutting part 112 that cuts the tape 96 projecting from an outer periphery of the frame 64 along the frame 64.

[0037] As in Fig. 6A and Fig. 6B, the roller belt support member 104 includes a support roller 114 rotatably supported by a corresponding bracket (not shown) about an axis extending in the X-axis direction. Supported by the support roller 114 is the roller belt 96R, in which the release paper 116 for protecting an adhesive surface of the belt 96 is attached to the adhesive surface of the belt 96 and wound into a circular cylindrical shape.

[0038] The tape take-up part 106 has a take-up roller 118 supported by a corresponding bracket (not shown) for rotation about an axis line extending in the X-axis direction, and a motor (not shown) that rotates the take-up roller 118. As shown in Fig. 6A and Fig. 6B, the tape receiving part 106 receives the used tape 96 in which a circular opening part 120 is formed corresponding to the part adhered to the frame 64 by rotating the take-up roller 118 by the motor.

[0039] The description is made with reference to Fig. 6A and Fig. 6B. The tape pull-out part 108 includes a pull-out roller 122 disposed below the support roller 114 of the roller tape support part 104, a motor (not shown) that rotates the pull-out roller 122, and a driven roller 124 that rotates in conjunction with the rotation of the pull-out roller 122. The tape pull-out part 108 pulls the tape 96, gripped by the pull-out roller 122 and the driven roller 124, from the roller tape 96R by rotating the driven roller 124 together with the pull-out roller 122 by the motor.

[0040] The release paper 116 is separated from the belt 96 that has passed between the discharge roller 122 and the driven roller 124, and the separated release paper 116 is received by a release paper receiving part 126. The release paper receiving part 126 of the illustrated embodiment includes a released paper receiving roller 128 disposed above the driven roller 124 and a motor (not shown) that rotates the released paper receiving roller 128. Further, the belt 96 from which the release paper 116 has been separated passes through a guide roller 130 disposed at a distance from the discharge roller 122 in the Y-axis direction and is guided to the receiving roller 118.

[0041] The pressure-connecting part 110 includes a pressing roller 132 movably disposed in the Y-axis direction and a Y-axis feed mechanism (not shown) that moves the pressing roller 132 in the Y-axis direction. The Y-axis feed mechanism of the pressure-connecting part 110 may include a suitable drive source (for example, an air drive source or an electric drive source).

[0042] As in Fig. 6A and Fig. 6B, the cutting portion 112 includes a Z-axis guide component 134 attached to a suitable support (not shown) and extending in the Z-axis direction, a Z-axis movable component 136 movably supported in the Z-axis direction by the Z-axis guide component 134, and a Z-axis feed mechanism (not shown) that moves the Z-axis movable component 136 in the Z-axis direction. The Z-axis feed mechanism of the cutting portion 112 could be a configuration including a ball screw coupled to the Z-axis movable component 136 and extending in the Z-axis direction, and a motor that rotates this ball screw.

[0043] The cutting part 112 further includes a motor 138 attached to a lower surface of the tip of the Z-axis movable component 136, and an arm piece 140 rotated by the motor 138 about an axis extending in the Z-axis direction. First and second depending pieces 142a and 142b are attached to a lower surface of the arm piece 140 at a distance from each other. A circular cutter 144 is supported by the first depending piece 142a for rotation about an axis orthogonal to the Z-axis direction. A hold-down roller 146 is supported by the second depending piece 142b for rotation about an axis orthogonal to the Z-axis direction.

[0044] The tape adhesion unit 98 draws out the tape 96 not used by the draw-out roller 122 and the driven roller 124 before the frame table 70, which has received the frame 64 from the frame carrying-out mechanism 68, is lowered from the lowering position (shown in Fig. 6A) to the lifting position (shown in Fig. 6B). Then, the frame table 70 is positioned at the lifting position to such an extent that the belt 96 can be pressed against the frame 64 by the pressing roller 132 of the pressure connecting part 110, and the frame 64 is brought into contact with the pressing roller 132 with the belt 96 interposed.

[0045] Then, the pressing roller 132 is rolled in the Y-axis direction while the adhesive surface of the tape 96 is pressed against the frame 64 by the pressing roller 132. Thus, the press-bonding of the tape 96 pulled out from the roller tape 96R by the tape pulling-out part 108 to the frame 64 can be performed.

[0046] The tape 96 may be a thermocompression bonding film that does not have an adhesive surface coated with an adhesive or the like. The thermocompression bonding film is a film made of a thermoplastic synthetic resin (for example, a polyolefin-based resin) that softens or melts to exert an adhesive force when heated to a temperature near the melting point. When the tape 96 is the thermocompression bonding film, a heating unit and a temperature sensor (both not shown) are incorporated into the pressing roller 132, and the temperature of an outer peripheral surface of the pressing roller 132 is adjusted.

[0047] Further, after the temperature of the outer peripheral surface of the pressing roller 132 is adjusted to a temperature at which the tape 96 softens or melts, the pressing roller 132 is rolled in the Y-axis direction while the tape 96 is pressed against the frame 64 by the pressing roller 132. Accordingly, thermocompression bonding of the tape 96 to the frame 64 can be performed.

[0048] After the tape 96 is press-connected to the frame 64, the tape attachment unit 98 lowers the Z-axis movable component 136 of the cutting part 112 through the Z-axis feed mechanism to press the cutter 144 against the tape 96 on the frame 64 and hold the frame 64 down from above the tape 96 through the hold-down roller 146. Thereafter, the tape attachment unit 98 rotates the arm piece 140 through the motor 138 and causes the cutter 144 and the hold-down roller 146 to move to trace a circle along the frame 64. This allows the tape 96 projecting toward the outer periphery of the frame 64 to be cut along the frame 64.

[0049] Furthermore, since the frame 64 is held down by the hold-down roller 146 from above the tape 96, deviation of the position of the frame 64 and the tape 96 when cutting the tape 96 is prevented. Then, after the frame table 70 is lowered, the used tape 96, in which the circular opening part 120 corresponding to the part adhered to the frame 64 is formed, is received by the tape receiving part 106.

[0050] As in Fig. 5, the belt-attached frame conveying mechanism 100 includes a Y-axis guide component 148 fixed to a suitable bracket (not shown) and extending in the Y-axis direction, a Y-axis movable component 150 movably supported in the Y-axis direction by the Y-axis guide component 148, a Y-axis feed means (not shown) that moves the Y-axis movable component 150 in the Y-axis direction, a Z-axis movable component 152 movably supported in the Z-axis direction by the Y-axis movable component 150, and a Z-axis feed means (not shown) that moves the Z-axis movable component 152 in the Z-axis direction.

[0051] The Y-axis feed mechanism of the belt-attached frame conveying mechanism 100 may include a ball screw coupled to the Y-axis movable component 150 and extending in the Y-axis direction, and a motor that rotates this ball screw. The Z-axis feed mechanism may include a ball screw coupled to the Z-axis movable component 152 and extending in the Z-axis direction, and a motor that rotates this ball screw.

[0052] The Z-axis movable component 152 of the belt-attached frame conveying mechanism 100 includes a support portion 154 that holds the belt-attached frame 64'. The support portion 154 of the illustrated embodiment includes a rectangular support plate 156 and a plurality of suction pads 158 disposed on a lower surface of the support plate 156. Each suction pad 158 is connected to a suction source (not shown).

[0053] The tape-attached frame conveying mechanism 100 sucks and holds an upper surface of the tape-attached frame 64' supported by the frame table 70 in the state where the holding surface of the tape 96 is directed downward through the respective suction pads 158 of the holding part 154, and moves the Y-axis movable component 150 and the Z-axis movable component 152. Accordingly, the tape-attached frame conveying mechanism 100 conveys the tape-attached frame 64' sucked and held by the holding part 154 from the frame table 70 to the wafer table 12, positions the opening part 64a of the frame 64 on the rear surface 4b of the wafer 4 supported by the wafer table 12, and places the tape-attached frame 64' on the wafer table 12.

[0054] The tape pressure connection unit 102 will be described with reference to Fig. 7 to Fig. 9. As described in Fig. As shown in Figure 7, the tape pressure bonding unit 102 includes an upper chamber 160 disposed above the wafer table 12, a lower chamber 162 in which the wafer table 12 is housed, and a lifting mechanism 164 that moves the upper chamber 160 up and down and creates a closed state in which the upper chamber 160 is brought into contact with the lower chamber 162, and an open state in which the upper chamber 160 is separated from the lower chamber 162. The tape pressure bonding unit 102 further includes a vacuum part 166 that places the upper chamber 160 and the lower chamber 162 in a vacuum state when closed, and an atmosphere opening part 168 that opens the upper chamber 160 and the lower chamber 162 to the atmosphere.

[0055] As in Fig. 7, the upper chamber 160 of the illustrated embodiment includes a circular upper plate 170 and a circular cylindrical sidewall 172 depending from a peripheral edge of the upper plate 170. Attached to the upper surface of the upper plate 170 is the lifting mechanism 164, which may be configured from a suitable actuator such as an air cylinder.

[0056] As in Fig. As shown in Fig. 7, a gas supply port 170a for supplying inert gas (N2 or the like) into the interior of the upper chamber 160 is provided in the upper surface of the upper plate 170. A gas supply source 173 is connected to the gas supply port 170a via a flow path 171, and a valve 175 that opens and closes the flow path 171 is arranged on the flow path 171. Further, the upper chamber 160 sprays the inert gas N2 or the like supplied from the gas supply source 173 to the rear surface 4b of the wafer 4 supported by the wafer stage 12 to inhibit oxidation of the rear surface 4b of the wafer 4.

[0057] In a space defined by a lower surface of the upper plate 170 and an inner peripheral surface of the side wall 172, a pressing roller 174 for pressing the belt 96 of the frame 64' with the belt attached against the rear surface 4b of the wafer 4 carried by the wafer table 12, a support piece 176 rotatably supporting the pressing roller 174, and a Y-axis feed mechanism 178 moving the support piece 176 in the Y-axis direction are arranged.

[0058] The Y-axis feed mechanism 178 includes a ball screw 180 coupled to the support piece 176 and extending in the Y-axis direction, and a motor 182 that rotates the ball screw 180. Furthermore, the Y-axis feed mechanism 178 converts a rotational motion of the motor 182 into a linear motion through the ball screw 180 and transmits the linear motion to the support piece 176 to move the support piece 176 along a pair of guide rails 184 extending in the Y-axis direction.

[0059] As in Fig. As shown in Figure 7, the lower chamber 162 has a circular cylindrical side wall 186. An upper portion of the side wall 186 is open, and a lower portion of the side wall 186 is closed. A connecting opening 188 is formed in the side wall 186. The vacuum portion 166, which may be configured by a suitable vacuum pump, is connected to the connecting opening 188 via a flow path 190. The part 168 for opening to the atmosphere, which may be configured by a suitable valve that can open the flow path 190 to the atmosphere, is arranged on the flow path 190.

[0060] When the tape 96 of the tape-attached frame 64' is positioned on the rear surface 4b of the wafer 4 supported by the wafer table 12, the tape pressure-connecting unit 102 closes the valve 175 to stop the spraying of inert gas, lowers the upper chamber 160 through the lifting mechanism 164, and brings a lower end of the side wall 172 of the upper chamber 160 into contact with an upper end of the side wall 186 of the lower chamber 162 to close the upper chamber 160 and the lower chamber 162. In addition, the tape pressure-connecting unit 102 brings the pressing roller 174 into contact with the tape-attached frame 64'.

[0061] Thereafter, the strip pressure bonding unit 102 operates the vacuum pump forming the vacuum part 166 in a state where the valve forming the atmosphere opening part 168 is closed to place the interior of the upper chamber 160 and the lower chamber 162 in a vacuum state. Thereafter, as shown in Fig. 8 and Fig. 9, the tape pressure bonding unit 102 presses the pressing roller 174 in the Y-axis direction by the Y-axis feed mechanism 178 to thereby perform pressure bonding of the tape 96 to the rear surface 4b of the wafer 4 and produce a frame unit U.

[0062] When the tape 96 is press-bonded to the rear surface 4b of the wafer 4 by the press roller 174, a slight gap is formed between the wafer 4 and the tape 96 at the origin of the annular reinforcing part 24. However, since the press-bonding of the wafer 4 and the tape 96 is performed in the state where the interior of the upper chamber 160 and the lower chamber 162 is placed in the vacuum state, the pressure of the slight gap between the wafer 4 and the tape 96 is lower than the atmospheric pressure. Therefore, when the opening part 168 is opened to the atmosphere after the tape 96 is press-bonded, the tape 96 is pressed against the wafer 4 by the atmospheric pressure. As a result, the gap between the wafer 4 and the tape 96 at the origin of the reinforcing part 24 disappears and the tape 96 comes into close contact with the rear surface 4b of the wafer 4 along the origin of the reinforcing part 24.

[0063] When the tape 96 is a thermocompression bonding film, the thermocompression bonding of the tape 96 to the back surface 4b of the wafer 4 can be performed by rolling the pressing roller 174 in the Y-axis direction after the wafer 4 is heated by the heating unit of the wafer table 12 to a temperature at which the tape 96 softens or melts.

[0064] As in Fig. 1 and Fig. 10, the processing apparatus 2 further includes a frame unit removal mechanism 192 that removes the frame unit U from the wafer table 12, in which the tape 96 of the tape-attached frame 64' and the rear surface 4b of the wafer 4 are pressure-bonded by the tape pressure-bonding unit 102, and temporarily places the frame unit U on a temporary placement table 204, and a reinforcement member removal unit 194 that cuts and removes the annular reinforcement member 24 from the wafer 4 of the frame unit U placed on the temporary placement table 204. The processing apparatus 2 also includes a ringless unit removal mechanism 196 (see Fig. 1) which carries away from the reinforcing member removing unit 194 the ringless unit resulting from the removal of the annular reinforcing member 24, and a frame cassette table 200 on which a frame cassette 198 is placed which accommodates the ringless unit carried out by the ringless unit carrying out mechanism 196.

[0065] As in Fig. 10, the frame unit carrying-out mechanism 192 of the illustrated embodiment includes a frame unit holding part 202 including a wafer holding part 202a holding the wafer 4 and a frame holding part 202b holding the frame 64, and a conveying part 206 conveying the frame unit holding part 202 to the transition placement table 204.

[0066] The wafer holding part 202a of the frame unit holding part 202 includes a circular holding plate 208 and a circular suction piece 210 attached to a lower surface of the holding plate 208. A plurality of suction holes (not shown) are formed in a lower surface of the suction piece 210, and each suction hole is connected to a suction source (not shown). The frame holding part 202b includes a plurality of (four in the illustrated embodiment) protruding pieces 212 projecting outward in the radial direction from a peripheral edge of the holding plate 208 of the wafer holding part 202a, with spaces arranged therebetween in the circumferential direction, and suction pads 214 attached to lower surfaces of the protruding pieces 212. Each suction pad 214 is connected to the suction source (not shown).

[0067] The conveying part 206 includes an X-axis guide component 216 fixed to a corresponding bracket (not shown) and extending in the X-axis direction, an X-axis movable component 218 movably supported by the X-axis guide component 216 in the X-axis direction, and an X-axis feed mechanism (not shown) that moves the X-axis movable component 218 in the X-axis direction.The conveying part 206 further includes a Z-axis movable component 220 movably supported in the Z-axis direction by the X-axis movable component 218, a Z-axis feed mechanism (not shown) that moves the Z-axis movable component 220 in the Z-axis direction, a Y-axis movable component 222 movably supported in the Y-axis direction by the Z-axis movable component 220, and a Y-axis feed mechanism (not shown) that moves the Y-axis movable component 222 in the Y-axis direction. The holding plate 208 of the wafer holding part 202a is coupled to the tip of the Y-axis movable component 222. Each of the X-axis, Y-axis, and Z-axis feed mechanisms of the conveyor portion 206 may include a ball screw and a motor that rotates the ball screw.

[0068] It is preferable that the frame unit carrying-out mechanism 192 includes a two-dimensional moving mechanism that two-dimensionally moves the frame unit holding part 202 in the horizontal direction, and an imaging part 224 that images the outer periphery of the wafer 4 of the frame unit U held by the frame unit holding part 202. In the illustrated embodiment, the frame unit holding part 202 moves two-dimensionally in the horizontal direction on the XY plane by the X-axis feed mechanism and the Y-axis feed mechanism of the carrying part 206, and the two-dimensional moving mechanism is configured by the carrying part 206. Further, the imaging part 224 of the illustrated embodiment is arranged between the wafer table 12 and the transition placement table 204, and the outer periphery of the frame unit U held by the frame unit holding part 202 is imaged from the lower side of the wafer 4.

[0069] The frame unit carrying-out mechanism 192 operates the carrying part 206 in a state where the wafer 4 is sucked and held from the rear surface 4b side (belt 96 side) by the suction piece 210 of the wafer holding part 202a, and the frame 64 is sucked and held by the suction pads 214 of the frame holding part 202b. Accordingly, the frame unit carrying-out mechanism 192 carries the frame unit U held by the frame unit holding part 202 away from the wafer table 12.

[0070] Furthermore, the frame unit carrying-out mechanism 192 of the illustrated embodiment measures the coordinates of at least three points on the outer circumference of the wafer 4 by operating the carrying part 206, which constitutes the two-dimensional movement mechanism, and imaging by the imaging part 224 at at least three locations on the outer circumference of the wafer 4 of the frame unit U held by the frame unit holding part 202, and obtains the center coordinates of the wafer 4 based on the measured coordinates of the three points. Then, the frame unit carrying-out mechanism 192 causes the center of the wafer 4 to coincide with the center of the temporary placement table 204 and temporarily places the frame unit U on the temporary placement table 204.

[0071] As in Fig. 10, the transition placement table 204 is arranged at a distance from the wafer table 12 in the X-axis direction. The transition placement table 204 of the illustrated embodiment includes an annular support part 226 that supports the outer peripheral excess portion 20 of the wafer 4 of the frame unit U and causes the part on the inside to be non-contact relative to the outer peripheral excess portion 20, and a frame support part 228 that is arranged around an outer periphery of the annular support part 226 and supports the frame 64.

[0072] The part located on the inner side in the radial direction relative to the annular support part 226 is a circular recess 230 that is hollow downwards. It is preferable that the frame support part 228 of the temporary placement table 204 includes a heater (not shown), and the belt 96 of the frame unit U temporarily placed on the temporary placement table 204 is softened by heating the belt 96 by the heater, and the belt 96 is brought into closer contact with the origin of the annular reinforcement part 24 by atmospheric pressure.

[0073] The machining apparatus 2 of the illustrated embodiment includes a transition placement table conveying part 232 that conveys the transition placement table 204 in the Y-axis direction. The transition placement table conveying part 232 includes a Y-axis guide component 234 extending in the Y-axis direction, a Y-axis movable component 236 movably supported by the Y-axis guide component 234 in the Y-axis direction, and a Y-axis feed mechanism 238 that moves the Y-axis movable component 236 in the Y-axis direction. The transition placement table 204 is attached to the upper part of the Y-axis movable component 236. The Y-axis feed mechanism 238 includes a ball screw 240 coupled to the Y-axis movable component 236 and extending in the Y-axis direction, and a motor 242 that rotates the ball screw 240.Further, the transition placement table conveying part 232 converts a rotational movement of the motor 242 into a linear movement through the ball screw 240 and transmits the linear movement to the Y-axis movable component 236 to convey the transition placement table 204 together with the Y-axis movable component 236 in the Y-axis direction.

[0074] As in Fig. 1 and Fig. 10, the reinforcing member removing unit 194 includes a laser beam irradiation unit 244 that irradiates the origin of the annular reinforcing member 24 formed on the outer circumference of the wafer 4 with a laser beam to form a cutting groove, a first lifting table 246 (see Fig. 1) which holds and lifts the frame unit U temporarily placed on the temporary placement table 204 and moves in the X-axis direction to position the frame unit U to the laser beam irradiation unit 244, and a separating part 248 which separates the annular reinforcing part 24 from the cutting groove.

[0075] As in Fig. As shown in FIG. 10, the laser beam irradiation unit 244 includes a casing 250 disposed adjacent to the transition placement table 204 in the X-axis direction, a laser oscillator (not shown) housed in the casing 250 and generating a laser beam, and a light collector 252 that focuses the laser beam generated by the laser oscillator and irradiates the laser beam onto the origin of the annular reinforcing member 24 formed on the outer periphery of the wafer 4. The laser beam irradiation unit 244 further includes a suction nozzle 254 that sucks debris generated when the wafer 4 is irradiated with the laser beam, and a suction source (not shown) connected to the suction nozzle 254.

[0076] The light collector 252 extends upward from an upper surface of the housing 250, with an inclination toward the side of the suction nozzle 254. This reduces the falling of dirt particles generated during laser beam irradiation onto the light collector 252. Furthermore, the suction nozzle 254 extends upward from the upper surface of the housing 250, with an inclination toward the side of the light collector 252.

[0077] As in Fig. As shown in Figure 11, the laser beam irradiation unit 244 irradiates the origin of the annular reinforcing member 24 formed on the outer periphery of the wafer 4 with a laser beam LB while rotating the frame unit U supported by the first elevating table 246, to form an annular cutting groove 256 along the origin of the reinforcing member 24 by ablation processing. Furthermore, the laser beam irradiation unit 244 sucks dirt particles generated due to the ablation processing with the suction nozzle 254.

[0078] As in Fig. 1, the first lifting table 246 is arranged above the transition placement table 204 movable in the X-axis direction and movable in the Z-axis direction. Referring to Fig. 12, the first lifting table 246 includes an X-axis guide component 258 attached to a suitable bracket (not shown) and extending in the X-axis direction, an X-axis movable component 260 movably supported in the X-axis direction by the X-axis guide component 258, an X-axis feed mechanism (not shown) that moves the X-axis movable component 260 in the X-axis direction, a Z-axis movable component 262 movably supported in the Z-axis direction by the X-axis movable component 260, and a Z-axis feed mechanism (not shown) that moves the Z-axis movable component 262 in the Z-axis direction. Each of the X-axis and Z-axis feed mechanisms of the first lift table 246 may include a ball screw and a motor that rotates the ball screw.

[0079] A support shaft 264 extending downward is rotatably supported by a lower surface of the tip of the Z-axis movable component. A motor 266 is mounted on the upper surface of the tip of the Z-axis movable component 262, rotating the support shaft 264 around an axis extending in the Z-axis direction. A circular suction piece 268 is attached to the lower end of the support shaft 264. In a lower surface of the suction piece 268, a plurality of suction holes (not shown) are formed at intervals in the circumferential direction on a circumference corresponding to the size of the frame 64. Each suction hole is connected to a suction source.

[0080] The first lifting table 246 sucks, through the suction piece 268, the part of the frame 64 of the frame unit U where the belt 96 has been heated by the heater of the frame support part 228 of the transition placement table 204, and the belt 96 is in close contact with the origin of the annular reinforcement part 24. Then, the first lifting table 246 moves the Z-axis movable component 262 and the X-axis movable component 260 to lift the frame unit U sucked and held by the suction piece 268, and move the frame unit U in the X-axis direction, positioning it toward the laser beam irradiation unit 244. If the frame 64 is formed of a material having magnetism, an electromagnet (not shown) may be attached to the lower surface of the suction piece 268, and the suction piece 268 may suck the frame 64 by a magnetic force to be attached thereto.

[0081] Further, when the wafer 4 is irradiated with the laser beam LB by the laser beam irradiation unit 244, the first lifting table 246 actuates the motor 266 to rotate the frame unit U sucked and held by the suction piece 268. Furthermore, the first lifting table 246 moves the frame unit U, in which the cutting groove 256 is formed at the origin of the reinforcement part 24, in the X-axis direction and the Z-axis direction, and temporarily places it on the temporary placement table 204.

[0082] As in Fig. 1, the separation part 248 is arranged at a distance from the first lifting table 246 in the Y-axis direction in the movable range of the transition placement table 204 in the Y-axis direction. Referring to Fig. 13A, Fig. 13B and Fig. 14, the separation part 248 has ultraviolet irradiation parts 270 (see Fig. 13A), which irradiate the tape 96 corresponding to the cutting groove 256 with ultraviolet light to reduce the adhesive force of the tape 96, and a second lifting table 272 (see Fig. 13A) that sucks and holds the inside of the wafer 4 in such a way that the annular reinforcing part 24 is exposed to the outer circumference. The separating part 248 further comprises a separator 274 (see Fig. 13A), which causes attachments 402, each having a wedge, to act on the outer circumference of the annular reinforcing part 24 and separates the annular reinforcing part 24, and a disposal part 276 (see Fig. 14) through which the separated annular reinforcing part 24 is disposed of.

[0083] As in Fig. 13A, the separation portion 248 of the illustrated embodiment includes a Z-axis guide component 278 attached to a suitable support (not shown) and extending in the Z-axis direction, a Z-axis movable component 280 movably supported in the Z-axis direction by the Z-axis guide component 278, and a lifting mechanism (not shown) that moves the Z-axis movable component 280 in the Z-axis direction. The lifting mechanism could include a ball screw coupled to the Z-axis movable component 280 and extending in the Z-axis direction, and a motor that rotates this ball screw.

[0084] A support piece 282 is supported by a lower surface of the tip of the Z-axis movable component 280, and the second lifting table 272 is rotatably supported by the lower surface of the tip of the Z-axis movable component 280. A motor 284 is attached to an upper surface of the tip of the Z-axis movable component 280, which rotates the second lifting table 272. A pair of the above-described ultraviolet irradiation parts 270 are attached to the support piece 282 at a distance in the Y-axis direction in the illustrated embodiment.

[0085] The second lifting table 272 includes a support shaft 286 extending downward from the lower surface of the tip of the Z-axis movable component 280, and a circular table head 287 detachably attached to a lower end of the support shaft 286. A plurality of suction holes (not shown) are formed in the lower surface of the table head 287, and each suction hole is connected to a suction source.

[0086] The stage head 287 has an outer diameter corresponding to the inner diameter of the reinforcement part 24 of the wafer 4. Specifically, the diameter of the stage head 287 is slightly smaller than that of the device region 18 of the wafer 4. Further, the stage head 287 is attachably and detachably mounted on the support shaft 286 and can be replaced according to the diameter of the wafer 4. The support shaft 286, to which the stage head 287 is attached, is connected to the lifting mechanism of the separation part 248 via the Z-axis movable component 280. As above, the second lifting table 272 includes two or more types of stage heads 287 having an outer diameter corresponding to the inner diameter of the reinforcement part 24 of the wafer 4, and the stage head 287 is attachably and detachably mounted to the lifting mechanism of the separation part 248.

[0087] Furthermore, the above-described separator 274 is attached to the support piece 282. The separator 274 includes a pair of movable pieces 288 movably disposed on a lower surface of the support piece 282 at a pitch in the longitudinal direction of the support piece 282, a pair of feed mechanisms 290 that move the pair of movable pieces 288, a pair of support plates 400 supported by the respective movable pieces 288 in such a manner as to be capable of moving up and down, and a pair of Z-axis feed mechanisms 294 that move the pair of support plates 400 up and down in the Z-axis direction. Each of the pair of Z-axis feed mechanisms 294 that move up and down can be configured from a suitable actuator such as an air cylinder or an electric cylinder.

[0088] The description is made with reference to Fig. 13A and Fig. 13B. Attached to an upper surface of each support plate 400 are the attachments 402 with the wedges, frame support members 404 that support the frame 64, and an ionization device 406 that dissipates static electricity from the frame unit U.

[0089] The bosses 402 have an inverted truncated cone shape in which the diameter gradually decreases from the upper side to the lower side, and the wedge is configured by an upper surface 402a of the boss 402 and a side surface 402b of the boss 402. A pair of bosses 402 are arranged on the upper surface of each support plate 400 at a distance from each other and are supported by the support plate 400 for rotation about an axis line extending in the Z-axis direction.

[0090] A pair of frame support members 404 are disposed adjacent to the bosses 402 on the upper surface of each support plate 400. The frame support members 404 include a housing 404a attached to the support plate 400 and a ball 404b rotatably supported by the housing 404a. In the frame support members 404, the frame 64 is supported by the respective balls 404b.

[0091] The ionization device 406 is arranged adjacent to the attachments 402. The ionization device 406 removes static electricity from the frame unit U by blowing ionized air toward the frame unit U.

[0092] The separating part 248 of the illustrated embodiment has a detector (not shown) that detects whether or not the type of the table head 287 input to a control unit (not shown) that controls an operation of the machining device 2 corresponds to the type of the table head 287 actually mounted in the machining device 2.

[0093] The control unit is configured of a computer including a central processing unit (CPU) that executes arithmetic processing according to a control program, a read-only memory (ROM) that stores the control program, etc., and a read-write random access memory (RAM) that stores a calculation result, etc. Processing conditions such as the diameter of the wafer 4, the width of the reinforcement part 24, and the outer diameter of the table head 287 are input into the control unit by an operator.

[0094] The detector of the illustrated embodiment includes the attachments 402 of the separator 274 and the feed mechanisms 290, which cause the attachments 402 to approach and move away from the table head 287 by actuating the movable pieces 288. Furthermore, in the detector, before the start of processing of the wafer 4, the movable pieces 288 are actuated by the feed mechanisms 290, and, as shown in Fig. 15, detects whether the outer diameter of the table head 287, obtained by bringing the attachments 402 of the separator 274 into contact with an outer periphery of the table head 287, corresponds to the outer diameter of the table head 287 input to the control unit. If the detector determines that the two do not match, an error message is output (for example, a mismatch display on an operation panel (not shown)).

[0095] Even if the diameter of the wafer 4 is the same, for example, 200 mm, the width of the annular reinforcement member 24 is different in some cases, for example, 3 mm, 5 mm, etc. Therefore, the stage head 287 corresponding to the device region 18 of the wafer 4 must be mounted in the processing apparatus 2. If the type of the stage head 287 input to the control unit does not correspond to the type of the stage head 287 actually mounted, it becomes impossible to remove the annular reinforcement member 24 from the wafer 4.

[0096] In this regard, the processing apparatus 2 of the illustrated embodiment is provided with a detector that detects whether or not the type of the stage head 287 input to the control unit matches the type of the stage head 287 actually mounted in the processing apparatus 2. Thus, before starting to process the wafer 4, it can be checked whether the correct stage head 287 corresponding to the wafer 4 is mounted, and the annular reinforcing member 24 can be properly removed from the wafer 4 at the time of processing the wafer 4.

[0097] With reference to Fig. 14, the disposal part 276 comprises a belt conveyor 300 which conveys the severed annular reinforcement part 24, and a dust box 302 in which the annular reinforcement part 24 conveyed by the belt conveyor 300 is accommodated. The belt conveyor 300 is moved by a suitable actuator (not shown) to a collection position (a position shown in Fig. 14 by solid lines) at which the belt conveyor 300 extends substantially horizontally, and at a standby position (a position shown in Fig. 14 by two-dot chain lines) at which the belt conveyor 300 extends substantially vertically.

[0098] On the side surface of the dust box 302, on the near side in the X-axis direction, Fig. 14, a door 304 is provided, to which a handle 304a is attached. A crushing device (not shown) is mounted inside the dust box 302, which crushes the collected annular reinforcement member 24. The dust box 302 is configured in such a manner that broken scrap of the annular reinforcement member 24 accommodated in the dust box 302 can be removed by grasping the handle 304a and opening the door 304.

[0099] When the temporary placement table 204, on which the frame unit U in which the cutting groove 256 is formed at the root of the reinforcement part 24 is temporarily placed, is positioned below the separation part 248 by the temporary placement table conveying part 232, sucks, as in Fig. 16, the separating part 248 engages and holds the inside of the wafer 4 by the second lifting table 272, with the annular reinforcing part 24 exposed to the outer periphery.

[0100] Thereafter, the movable pieces 288 are moved by the feed mechanisms 290 and the support plates 400 by the Z-axis feed mechanisms 294, and, as shown in Fig. As shown in Figure 17, the caps 402 with the wedges are caused to act on the outer periphery of the annular reinforcing member 24. Specifically, the wedges of the caps 402 are positioned between the band 96 and the reinforcing member 24. Further, a lower surface of the frame 64 is brought into contact with the balls 404b of the frame support members 404, and the frame 64 is supported by the balls 404b.

[0101] Next, ultraviolet light irradiation is performed by the pair of ultraviolet irradiation parts 270 to reduce the adhesive force of the tape 96 adhering to the annular reinforcing part 24. In addition, the frame unit U, together with the second lifting table 272, is rotated relative to the separating device 274 by the motor 284. As a result, the tape 96, in which the adhesive force has been reduced, and the reinforcing part 24 are detached by the wedges of the attachments 402. Thus, as shown in Fig. 18, the annular reinforcement member 24 may be separated from the frame unit U. The separated reinforcement member 24 is conveyed by the belt conveyor 300 to the dust box 302 and collected. Upon separation of the reinforcement member 24, the separating device 274 may be rotated relative to the frame unit U.

[0102] Furthermore, when the reinforcement member 24 is separated, ionized air is blown from the ionization device 406 toward the frame unit U. Thereby, even if static electricity is generated by the contact of the attachments 402 with the belt 96 and the reinforcement member 24, the static electricity is removed by the ionized air blown from the ionization device 406. This prevents the belt 96 and the reinforcement member 24 from being attracted to each other due to static electricity, and the reinforcement member 24 is securely separated from the frame unit U.

[0103] When the reinforcement part 24 is separated, in conjunction with the relative rotation of the frame unit U and the separator 274, the caps 402 acting on the frame unit U and the balls 404b in contact with the lower surface of the frame 64 rotate. Thus, the relative rotation of the frame unit U and the separator 274 is carried out smoothly.

[0104] As in Fig. 1, the ringless unit discharge mechanism 196 is disposed adjacent to the reinforcement member removal unit 194. Referring to Fig. 19 and Fig. 20, the ringless unit removal mechanism 196 in the illustrated embodiment includes a reversing mechanism 308 (see Fig. 19), which has a frame holding part 306 facing the ringless unit carried by the second lifting table 272 and carries the frame 64, moves to the frame cassette table 200 and turns the frame holding part 306, a ringless unit supporting part 310 (see Fig. 20) which supports the ringless unit which is reversed by the reversing mechanism 308 and in which the front surface 4a of the wafer 4 is directed upwards, and a pressing part 312 (see Fig. 20) which causes the ringless unit carried by the ringless unit carrying member 310 to enter and be accommodated in the frame cassette 198 placed on the frame cassette table 200.

[0105] As in Fig. 19, the reversing mechanism 308 includes a Y-axis guide component 314 extending in the Y-axis direction, a Y-axis movable component 316 movably supported in the Y-axis direction by the Y-axis guide component 314, a Y-axis feed mechanism (not shown) that moves the Y-axis movable component 316 in the Y-axis direction, an arm 318 movably supported in the Z-axis direction by the Y-axis movable component 316, and a Z-axis feed mechanism (not shown) that moves the arm 318 in the Z-axis direction. Each of the Y-axis and Z-axis feed mechanisms of the reversing mechanism 308 could include a ball screw and a motor that rotates the ball screw.

[0106] The frame holding part 306 described above is supported by the arm 318 in such a manner that it can be vertically inverted. In addition, a motor 320 is attached to the arm 318 to vertically invert the frame holding part 306. The frame holding part 306 of the illustrated embodiment includes a holding plate 324 rotatably supported by the arm 318 via a pair of rotary shafts 322, and a plurality of suction pads 326 attached to a single surface of the holding plate 324. Each suction pad 326 is connected to a suction source (not shown). Further, a rotary shaft 322 is coupled to the motor 320.

[0107] In a state where the suction pads 326 are directed upward, the reversing mechanism 308 sucks and holds the lower surface of the frame 64 of a ringless unit U' supported by the second lifting table 272 through the suction pads 326, and picks up the ringless unit U' from the second lifting table 272. Further, the reversing mechanism 308 reverses the frame holding part 306 by the motor 320 to orient the front surface 4a of the wafer 4 upward, and then moves the ringless unit U' held by the frame holding part 306 to the frame cassette table 200 by moving the Y-axis movable component 316.

[0108] As in Fig. 20, the ringless unit support portion 310 of the illustrated embodiment includes a pair of support plates 328 movably supported in the X-axis direction by a suitable bracket (not shown), and a distance adjustment mechanism (not shown) that adjusts the distance between the pair of support plates 328 in the X-axis direction. The distance adjustment mechanism may be configured from a suitable actuator such as an air cylinder or an electric cylinder.

[0109] A heater (not shown) is attached to the pair of support plates 328 supporting the ringless unit U'. In a state where the distance between the pair of support plates 328 is reduced, the pair of support plates 328 heats the belt 96 of the ringless unit U' by the heater, thereby eliminating slack and wrinkles of the belt 96 caused by the removal of the reinforcing member 24.

[0110] The description is made with reference to Fig. 20. The pressing part 312 of the illustrated embodiment includes a Y-axis guide component 330 extending in the Y-axis direction, a Y-axis movable component 332 movably supported by the Y-axis guide component 330 in the Y-axis direction, and a Y-axis feed mechanism (not shown) that moves the Y-axis movable component 332 in the Y-axis direction. The Y-axis movable component 332 includes a base part 334 supported by the Y-axis guide component 330, a support column 336 extending upward from an upper surface of the base part 334, and a pressing part 338 attached to an upper end of the support column 336.The Y-axis feed mechanism of the pressing part 312 may include a ball screw coupled to the Y-axis movable component 332 and extending in the Y-axis direction, and a motor that rotates this ball screw.

[0111] As in Fig. 21, the ringless unit support part 310 widens the distance between the pair of support plates 328 by the distance adjustment mechanism before receiving the ringless unit U', and then receives the ringless unit U' held by the suction pads 326. Then, when the ringless unit support part 310 has received the ringless unit U', the pressing part 312 moves the Y-axis movable component 332 in the Y-axis direction by the Y-axis feed mechanism and causes the ringless unit U' supported by the ringless unit support part 310 to enter and be received in the frame cassette 198 placed on the frame cassette table 200 by the pressing part 338.

[0112] In the Fig. 1 and Fig. 21, a plurality of ringless units U' are accommodated at intervals in the up-down direction in a state in which the front surfaces 4a of the wafers 4 are directed upward. As shown in Fig. 20 and Fig. As shown in Figure 21, the frame cassette table 200 includes a placement portion 340 on which the frame cassette 198 is placed, and a lifting portion 342 that raises and lowers the placement portion 340 and positions it at a freely selected height. The lifting portion 342 may include a ball screw coupled to the placement portion 340 and extending in the Z-axis direction, and a motor that rotates this ball screw.

[0113] Next, a description will be given regarding a processing method in which, using the processing apparatus 2 described above, the division band 96 is adhered to the rear surface 4b of the wafer 4, the annular reinforcing part 24 is formed in a projecting shape at a part of the rear surface 4b corresponding to the outer peripheral excess portion 20 to join the wafer 4 to the frame 64, and the annular reinforcing part 24 is cut to be removed from the wafer 4.

[0114] In the illustrated embodiment, first, as in Fig. 1 and Fig. 3, a wafer cassette placing step is performed in which the wafer cassette 6 in which a plurality of wafers 4 are accommodated is placed on the wafer cassette table 8. In the wafer cassette 6, a plurality of wafers 4 are accommodated at intervals in the up-down direction in a state where the front surfaces 4a are directed upward.

[0115] Furthermore, as in Fig. 1 and Fig. 5, a frame accommodating step is performed in which a plurality of annular frames 64 are accommodated, in which the opening part 64a for receiving the wafer 4 is formed in the frame accommodating unit 66. The frame accommodating step may be performed before the wafer cassette placing step, or it may be performed after the wafer cassette placing step.

[0116] In the frame accommodation step, after the lifting plate 74 of the frame accommodation unit 66 is lowered to an arbitrarily selected position, the handle 76a is grasped and the door 76 is opened, and the plurality of frames 64 are stacked on the upper surface of the lifting plate 74 to be accommodated. Further, the height of the lifting plate 74 is appropriately adjusted, and the frame 64 at the uppermost level is positioned at a position from which this frame 64 can be carried out by the frame carrying-out mechanism 68.

[0117] After the wafer cassette placing step and the frame accommodating step are performed, a wafer carrying out step is performed in which the wafer 4 is carried out from the wafer cassette 6 placed on the wafer cassette table 8.

[0118] Referring to Fig. 3, in the wafer carrying-out step, first, the Y-axis feed mechanism 34 of the wafer carrying-out mechanism 10 is actuated, and the Y-axis movable component 32 is positioned near the wafer cassette table 8. Thereafter, the carrying arm 42 is driven, and the hand 44, with the gas discharge ports 46 facing upward, is positioned toward the rear surface 4b (lower side) of the wafer 4 in the wafer cassette 6. When the hand 44 is positioned toward the rear surface 4b of the wafer 4, a gap is provided between the rear surface 4b of the wafer 4 and the hand 44, and each guide pin 48 is positioned outward in the radial direction.

[0119] Next, inert gas such as N2 or the like is discharged from the gas discharge ports 46 of the hand 44 to create a negative pressure on a single surface side of the hand 44 by the Bernoulli effect, and the wafer 4 is non-contact sucked and carried from the rear surface 4b side by the hand 44. After that, each guide pin 48 is moved inward in the radial direction, and a horizontal movement of the wafer 4 sucked and carried by the hand 44 is restricted by the respective guide pins 48. Then, the Y-axis movable component 32 and the conveying arm 42 of the wafer conveying mechanism 10 are moved, and the wafer 4 sucked and carried by the hand 44 is conveyed out of the wafer cassette 6.Since the wafer carrying-out mechanism 10 of the illustrated embodiment sprays the inert gas N2 or the like onto the rear surface 4b of the wafer 4 when the wafer 4 is carried out, oxidation of the rear surface 4b of the wafer 4 can be inhibited.

[0120] It is advantageous to perform a notch detection step in which the position of the notch 26 of the wafer 4 is detected after the wafer removal step has been performed. In the notch detection step, as shown in Fig. 4, the outer periphery of the wafer 4 sucked and carried by the hand 44 is positioned between the light-emitting element 52 and the light-receiving element 54 of the notch detection unit 50. Next, by rotating the wafer 4 by the drive source through the guide pin 48, the position of the notch 26 of the wafer 4 is detected. This makes it possible to adjust the orientation of the wafer 4 to a freely selected orientation.

[0121] After the notch detection step is performed, a wafer carrying step of carrying the front surface 4a side of the wafer 4 by the wafer carrying-out mechanism 10 through the wafer table 12 is performed.

[0122] Referring to Fig. 3, in the wafer carrying step, first, the hand 44 of the wafer carrying-out mechanism 10 is turned upside down to direct the front surface 4a of the wafer 4 downward. Thereafter, the Y-axis movable component 32 and the carrying arm 42 of the wafer carrying-out mechanism 10 are moved, and the outer peripheral excess portion 20 of the front surface 4a of the wafer 4, which is sucked and carried by the hand 44, is brought into contact with the annular supporting part 56 of the wafer table 12. At this time, the component portion 18 of the front surface 4a of the wafer 4 is disposed in the recess 62 of the wafer table 12. Consequently, the components 14 do not come into contact with the wafer table 12, and damage to the components 14 is prevented.

[0123] Next, the outer peripheral excess portion 20 of the front surface 4a of the wafer 4 is sucked and held by operating the suction source of the wafer table 12 and generating a suction force for each suction hole 60. After that, the wafer 4 is released from being supported under suction by the hand 44, and the hand 44 is separated from the wafer table 12. In this way, the wafer 4 is transferred from the wafer carrying mechanism 10 to the wafer table 12. Since the wafer 4 transferred to the wafer table 12 is sucked and held by each suction hole 60, the position of the wafer 4 does not deviate.

[0124] After the wafer 4 has been transferred to the wafer stage 12, heating of the wafer 4 is started by the heating unit of the wafer stage 12 to improve the efficiency of pressure-bonding the back surface 4b of the wafer 4 to the tape 96 having adhesive property in a bonding step to be described later. The temperature of heating the wafer 4 by the heating unit of the wafer stage 12 may be approximately 30°C to 50°C. However, if the tape 96 is a thermocompression bonding film, the wafer 4 is heated to a temperature at which the thermocompression bonding film softens or melts (for example, approximately 120°C).

[0125] Furthermore, along with the start of heating of the wafer 4, inert gas is sprayed onto the rear surface 4b of the wafer 4 from the upper chamber 160, which is arranged above the wafer table 12. This can reduce oxidation of the rear surface 4b of the heated wafer 4. The spraying of the inert gas from the upper chamber 160 continues until the belt 96 of the frame 64' with the belt attached is positioned above the wafer 4.

[0126] Further, after the wafer cassette placing step and the frame accommodating step are performed, a frame accommodating step of carrying out the frame 64 from the frame accommodating unit 66 is performed simultaneously with the wafer carrying out step and the wafer carrying step.

[0127] Referring to Fig. 5, in the frame-carrying-out step, first, the X-axis movable component 84 and the Z-axis movable component 86 of the frame-carrying-out mechanism 68 are moved, and the suction pads 92 of the holding part 88 are brought into contact with an upper surface of the frame 64 at the top level, which is housed in the frame housing unit 66. Next, the frame 64 at the top level is sucked and held by the suction pads 92 by actuating the suction source of the frame-carrying-out mechanism 68 and generating a suction force for the suction pads 92. Then, the X-axis movable component 84 and the Z-axis movable component 86 of the frame carrying-out mechanism 68 are moved, and the frame 64 sucked and held at the uppermost level by the suction pads 92 of the holding part 88 is carried out from the frame housing unit 66.

[0128] After the frame carrying out step is performed, a frame carrying step of carrying the frame 64 carried out by the frame carrying out mechanism 68 by the frame table 70 is performed.

[0129] The description is made with reference to Fig. 5. In the frame supporting step, first, the X-axis movable component 84 and the Z-axis movable component 86 of the frame carrying-out mechanism 68 are moved, and the frame 64, which is sucked and held by the suction pads 92, is brought into contact with an upper surface of the frame table 70. At this time, the frame table 70 is positioned in advance at the lowering position (in Fig. 5 (position shown by solid lines). Thereafter, the suction force of the suction pads 92 of the frame-carrying-out mechanism 68 is deactivated to place the frame 64 on the frame table 70. Then, the X-axis movable component 84 and the Z-axis movable component 86 of the frame-carrying-out mechanism 68 are moved, and the holding part 88 is separated from a position above the frame table 70.

[0130] After the frame supporting step is performed, a tape adhering step of adhering the tape 96 to the frame 64 is performed.

[0131] With reference to Fig. 6A and Fig. 6B, in the tape adhesion step first, before the frame table 70 is lowered from the lowering position (shown in Fig. 6A) to the lifting position (shown in Fig. 6B), allowing the belt 96 to be attached to the frame 64, the belt 96 is pulled out from the roller belt 96R, and the belt 96 from which the discharge paper 116 has been separated is positioned above the frame table 70. The adhesive surface of the belt 96 arranged above the frame table 70 faces downward.

[0132] Next, the frame table 70 is raised so that the tape 96 can be pressed against the frame 64 from the upper side by the pressing roller 132 of the pressure-bonding part 110 of the tape adhesion unit 98. Then, the pressing roller 132 is rolled in the Y-axis direction while the adhesion surface of the tape 96 is pressed against the frame 64 by the pressing roller 132. Accordingly, the tape 96 pulled out from the roller tape 96R by the tape extraction part 108 can be pressure-bonded to the frame 64.

[0133] When the tape 96 is a thermocompression bonding film, the thermocompression bonding of the tape 96 to the frame 64 can be performed by rolling the pressing roller 132 in the Y-axis direction while pressing the tape 96 against the frame 64 by the pressing roller 132 after adjusting the temperature of the outer peripheral surface of the pressing roller 132 to a temperature at which the tape 96 softens or melts.

[0134] Thereafter, the cutter 144 and the hold-down roller 146 of the cutting part 112 of the tape adhering unit 98 are lowered to press the cutter 144 against the tape 96 on the frame 64 and to adhere the frame 64 by the hold-down roller 146 from above the tape 96. Next, the arm piece 140 is rotated by the motor 138, and the cutter 144 and the hold-down roller 146 are moved to draw a circle along the frame 64. Accordingly, the tape 96 protruding toward the outer periphery of the frame 64 can be cut along the frame 64.

[0135] Furthermore, since the frame 64 is held down by the hold-down roller 146 from above the belt 96, deviation in the position of the frame 64 and the belt 96 is prevented when the belt 96 is cut. The used belt 96, in which the circular opening part 120 is formed, is received by the belt receiving part 106.

[0136] After the tape adhering step is performed, a tape-attached frame conveying step is performed in which the frame 64 to which the tape 96 is adhered is conveyed to the wafer table 12, and the opening part 64a of the frame 64 is positioned on the rear surface 4b of the wafer 4 carried by the wafer table 12, and the tape-attached frame 64' is positioned on the wafer table 12.

[0137] In the belt-attached frame conveying step, first, the frame table 70 is moved from the lifting position to the lowering position. Thereafter, the Y-axis movable component 150 and the Z-axis movable component 152 of the belt-attached frame conveying mechanism 100 (see Fig. 5) and the respective suction pads 158 of the holding part 154 of the tape-attached frame conveying mechanism 100 are brought into contact with the upper surface of the tape-attached frame 64' (see Fig. 7) which is supported by the frame table 70 in the state in which the adhesive surface of the belt 96 is directed downward.

[0138] Next, the upper surface of the tape-attached frame 64' is sucked and held by the suction pads 158 by actuating the suction source of the tape-attached frame conveying mechanism 100 and generating a suction force for the suction pads 158. Thereafter, the Y-axis movable component 150 and the Z-axis movable component 152 of the tape-attached frame conveying mechanism 100 are moved, and the tape-attached frame 64' sucked and held by the suction pads 158 is conveyed away from the frame table 70.

[0139] Next, the tape-attached frame 64' sucked and held by the suction pads 158 of the tape-attached frame conveying mechanism 100 is conveyed to the wafer table 12. Then, as shown in Fig. 7, the opening portion 64a of the frame 64 is positioned on the rear surface 4b of the wafer 4 supported by the wafer table 12, and the tape-attached frame 64' is brought into contact with the frame support portion 58 of the wafer table 12. At this time, the adhesive surface of the tape 96 of the tape-attached frame 64' faces downward, and the rear surface 4b of the wafer 4 faces upward and faces the adhesive surface of the tape 96.

[0140] When the belt 96 of the belt-attached frame 64' is positioned on the rear surface 4b of the wafer 4 supported by the wafer table 12, the valve 175 is closed to stop the spraying of the inert gas from the upper chamber 160. Thereafter, the suction force of the suction pads 158 of the belt-attached frame conveying mechanism 100 is deactivated to place the belt-attached frame 64' on the frame support part 58 of the wafer table 12. Then, the Y-axis movable component 150 and the Z-axis movable component 152 of the belt-attached frame conveying mechanism 100 are moved, and the holding part 154 is separated from the upper side of the wafer table 12.

[0141] After the tape-attached frame conveying step is performed, the tape pressure-bonding step of performing bonding of the tape 96 of the tape-attached frame 64' to the back surface 4b of the wafer 4 under pressure is performed.

[0142] With reference to Fig. 7 to Fig. 9, in the tape pressure-bonding step, first, the upper chamber 160 is lowered by the lifting mechanism 164 of the tape pressure-bonding unit 102, and a lower end of the side wall 172 of the upper chamber 160 is brought into contact with the upper end of the side wall 186 of the lower chamber 162. Accordingly, the upper chamber 160 and the lower chamber 162 are placed in the closed state. In addition, the pressing roller 174 is brought into contact with the frame 64' with the tape attached. Consequently, as shown in Fig. 8, an upper end of the annular reinforcing part 24 of the wafer 4 is adhered to the adhesive surface of the tape 96 of the tape-attached frame 64'.

[0143] Next, the vacuum part 166 of the tape pressure bonding unit 102 is operated in a state where the opening part 168 to the atmosphere is closed, and the interior of the upper chamber 160 and the lower chamber 162 is placed in a vacuum state. Thereafter, as shown in Fig. 8 and Fig. 9, pressure-bonding of the tape 96 to the rear surface 4b of the wafer 4 is performed by rolling the pressure roller 174 of the tape pressure-bonding unit 102 in the Y-axis direction. Consequently, the frame unit U in which the rear surface 4b of the wafer 4 and the tape 96 are pressure-bonded can be produced.

[0144] Further, when the tape 96 is a thermocompression bonding film, the thermocompression bonding of the tape 96 to the back surface 4b of the wafer 4 can be performed by rolling the pressing roller 174 in the Y-axis direction after the wafer 4 is heated by the heating unit of the wafer table 12 to a temperature at which the tape 96 softens or melts.

[0145] Next, the opening portion 168 is opened to the atmosphere, and the tape 96 is brought into close contact with the back surface 4b of the wafer 4 along the origin of the annular reinforcing portion 24 by the atmospheric pressure. Then, the upper chamber 160 is lifted by the lifting mechanism 164.

[0146] Since the interiors of the upper chamber 160 and the lower chamber 162 are placed in a vacuum state, the suction force for the wafer 4 by the wafer table 12 is lost. However, when the upper chamber 160 and the lower chamber 162 are placed in the closed state, the upper end of the annular reinforcement part 24 of the wafer 4 adheres to the adhesive surface of the tape 96 of the tape-attached frame 64'. Thus, the position of the wafer 4 does not deviate in the tape pressure-bonding step.

[0147] After the tape pressure-bonding step is performed, a frame unit carrying-out step of carrying out the frame unit U in which the tape 96 of the tape-attached frame 64' and the back surface 4b of the wafer 4 are pressure-bonded from the wafer table 12 is performed.

[0148] Referring to Fig. 5, in the frame unit carrying-out step, first, the carrying part 206 of the frame unit carrying-out mechanism 192 is actuated, and the lower surface of the suction piece 210 of the wafer holding part 202a of the frame unit holding part 202 is brought into contact with the belt 96 on the rear surface 4b side of the wafer 4. In addition, the suction pads 214 of the frame holding part 202b are brought into contact with the frame 64.

[0149] Next, suction force is generated by the suction piece 210 of the wafer holding part 202a and the suction pads 214 of the frame holding part 202b, and the wafer 4 is sucked and held by the suction piece 210 of the wafer holding part 202a from the rear surface 4b side (the belt 96 side). In addition, the frame 64 is sucked and held by the suction pads 214 of the frame holding part 202b. Then, the wafer 4 is released from being held under suction by the wafer table 12. Then, the conveying part 206 is actuated, and the frame unit U held by the frame unit holding part 202 is conveyed away from the wafer table 12.

[0150] After the frame unit carrying out step is performed, a temporary placement step is performed in which the center of the wafer 4 is made to coincide with the center of the temporary placement table 204 and the frame unit U is temporarily placed on the temporary placement table 204.

[0151] Referring to Fig. 10, in the transition placement step, first, the frame unit U held by the frame unit holding part 202 is positioned above the imaging part 224. Thereafter, the conveying part 206, which configures the two-dimensional moving mechanism of the frame unit carrying-out mechanism 192, is actuated, and at least three locations on the outer circumference of the wafer 4 of the frame unit U held by the frame unit holding part 202 are imaged by the imaging part 224. Accordingly, the coordinates of at least three points on the outer circumference of the wafer 4 are measured. Next, the center coordinates of the wafer 4 are obtained based on the measured coordinates of the three points.

[0152] Thereafter, the conveying part 206 is actuated, and the center of the wafer 4 is positioned toward the center of the annular support part 226 of the transition placement table 204, and the outer peripheral excess portion 20 of the front surface 4a of the wafer 4 is brought into contact with an upper surface of the annular support part 226 of the transition placement table 204. In addition, the lower surface of the frame 64 is brought into contact with an upper surface of the frame support part 228 of the transition placement table 204. At this time, the front surface 4a of the wafer 4 is directed downward. However, since the component portion 18 is disposed in the recess 230 of the transition placement table 204, the components 14 do not come into contact with the transition placement table 204, and damage to the components 14 is prevented.

[0153] Next, the wafer 4 is released from the suction holding of the wafer holding part 202a, and the frame 64 is released from the suction holding of the frame holding part 202b, to transfer the frame unit U from the frame unit carrying-out mechanism 192 to the temporary placement table 204. Thereafter, the heater of the frame support part 228 is actuated to heat the belt 96 of the frame unit U temporarily placed on the temporary placement table 204. This softens the belt 96 and brings it into close contact with the origin of the annular reinforcement part 24 of the wafer 4.

[0154] After the transition placement step is performed, a reinforcing member removing step is performed in which the annular reinforcing member 24 is cut off and removed from the wafer 4 of the frame unit U carried out by the frame unit carrying out mechanism 192.

[0155] Referring to Fig. 1, Fig. 10 and Fig. 12, in the reinforcement member removal step, first, the X-axis movable component 260 and the Z-axis movable component 262 of the first lifting table 246 of the reinforcement member removal unit 194 are moved, and the lower surface of the suction piece 268 is brought into contact with the upper surface of the frame 64 of the frame unit U temporarily placed on the temporary placement table 204. Next, a suction force is generated for each suction hole of the suction piece 268 of the first lifting table 246, and the part of the frame 64 of the frame unit U is sucked and held.

[0156] Thereafter, the X-axis movable component 260 and the Z-axis movable component 262 of the first lifting table 246 are actuated and, as shown in Fig. As shown in Fig. 11, the frame unit U sucked and held by the suction piece 268 is positioned above the laser beam irradiation unit 244. Next, the focal point of the laser beam LB is positioned at the origin of the annular reinforcing part 24 of the wafer 4 of the frame unit U.

[0157] Next, the origin of the annular reinforcement portion 24 of the wafer 4 is irradiated with the laser beam LB while the suction piece 268 and the frame unit U are rotated by the motor 266 of the first elevating table 246. This can perform ablation processing for the origin of the annular reinforcement portion 24 of the wafer 4 to form the annular cutting groove 256. Further, when the wafer 4 is irradiated with the laser beam LB, the suction source of the laser beam irradiation unit 244 is actuated to generate suction force for the suction nozzle 254, and the debris generated due to the ablation processing is sucked by the suction nozzle 254.

[0158] Next, the X-axis movable component 260 and the Z-axis movable component 262 of the first elevating table 246 are moved, and the outer peripheral excess portion 20 of the front surface 4a of the wafer 4 of the frame unit U sucked and held by the suction piece 268 is brought into contact with the upper surface of the annular support member 226 of the transitional placement table 204. In addition, the lower surface of the frame 64 is brought into contact with the upper surface of the frame support member 228 of the transitional placement table 204. Thereafter, the suction force of the suction piece 268 of the first elevating table 246 is deactivated to transfer the frame unit U from the first elevating table 246 to the transitional placement table 204.

[0159] Next, the transition placement table 204 having received the frame unit U is positioned by the transition placement table conveying part 232 under the separation part 248 of the reinforcement part removing unit 194 (see Fig. 10). At this time, the belt conveyor 300 of the disposal part 276 is positioned in the standby position. Thereafter, the second lifting table 272 of the separation part 248 is lowered, and a lower surface of the second lifting table 272 is brought into contact with the belt 96 of the rear surface 4b part of the wafer 4. Next, a suction force is generated on the lower surface of the second lifting table 272, and, as shown in Fig. 16, the wafer 4 of the frame unit U is sucked and held by the table head 287 of the second lifting table 272 in a state where the annular reinforcing part 24 is exposed to the outer periphery.

[0160] Thereafter, the second lifting table 272, which sucks and holds the wafer 4 of the frame unit U, is lifted to separate the frame unit U from the transition placement table 204. In addition, the transition placement table 204 is shifted to the lower side of the first lifting table 246. Next, the movable pieces 288 are moved by the feed mechanisms 290, and the support plates 400 are moved by the Z-axis feed mechanisms 294. Accordingly, as shown in Fig. 17, the projections 402 having the wedges are caused to engage the outer periphery of the annular reinforcement member 24, and the wedges of the projections 402 are positioned between the belt 96 and the reinforcement member 24. In addition, the frame 64 is supported by the balls 404b of the frame support members 404. Further, the belt conveyor 300 of the disposal member 276 is positioned from the standby position to the collection position.

[0161] Thereafter, ultraviolet light irradiation is performed by the pair of ultraviolet irradiation parts 270 to reduce the adhesive force of the tape 96 adhering to the annular reinforcing part 24. In addition, the frame unit U, together with the second lifting table 272, is rotated relative to the separating device 274 by the motor 284. In addition, ionized air is blown from the ionizing device 406 toward the frame unit U. Thereby, the annular reinforcing part 24 can be separated from the frame unit U, as shown in Fig. 18. In addition, static electricity generated during separation of the reinforcement member 24 does not remain on the frame unit U. The reinforcement member 24 dropped from the frame unit U is conveyed by the belt conveyor 300 to the dust box 302 and collected there. When separating the reinforcement member 24, the separating device 274 may be rotated relative to the frame unit U.

[0162] After the reinforcement member removing step is performed, a ringless unit carrying out step is performed in which the ring-shaped unit U' resulting from the removal of the ring-shaped reinforcement member 24 from the reinforcement member removing unit 194 is carried out.

[0163] In the ringless unit removal step, first, the belt conveyor 300 of the disposal part 276 of the reinforcement part removal unit 194 is moved from the collection position to the standby position. Next, the frame holding part 306 of the reversing mechanism 308 (see Fig. 19) of the ringless unit discharge mechanism 196 is positioned under the ringless unit U' sucked and held by the second lifting table 272.

[0164] Thereafter, the arm 318 is lifted in a state where the suction pads 326 of the frame holding part 306 are directed upward, and the suction pads 326 of the frame holding part 306 are brought into contact with the lower surface side of the frame 64 of the ringless unit U' in a state where the ringless unit U' is supported by the second lifting table 272 and the front surface 4a of the wafer 4 is directed downward.

[0165] Next, suction force is generated for the suction pads 326 of the frame holding part 306, and the frame 64 of the ringless unit U' is sucked and held by the suction pads 326. Thereafter, the holding of the ringless unit U' under suction by the second lifting table 272 is released. Accordingly, the ringless unit U' is transferred from the second lifting table 272 of the reinforcement member removing unit 194 to the frame holding part 306 of the ringless unit carrying-out mechanism 196.

[0166] After the ringless unit carrying out step is performed, an accommodating step of the ringless unit U' carried out by the ringless unit carrying out mechanism 196 is performed.

[0167] In the ringless unit accommodation step, first, the reversing mechanism 308 of the ringless unit discharge mechanism 196 is turned upside down, and the ringless unit U' sucked and held by the frame holding part 306 is turned upside down. Thus, the ringless unit U' is arranged below the frame holding part 306, and the front surface 4a of the wafer 4 is directed upward.

[0168] Next, the Y-axis movable component 316 and the arm 318 of the reversing mechanism 308 are moved, and the ringless unit U' is brought into contact with the upper surfaces of the pair of support plates 328 of the ringless unit support member 310. At this time, the distance between the pair of support plates 328 is reduced by the distance adjustment mechanism, and the pair of support plates 328 are in close contact with each other.

[0169] Thereafter, the holding of the ringless unit U' under suction by the frame holding part 306 is released to place the ringless unit U' on the pair of support plates 328. Next, slack and wrinkles of the belt 96 caused by the removal of the reinforcing member 24 are eliminated by operating the heater attached to each support plate 328 and heating the belt 96 of the ringless unit U'. Then, the ringless unit U' is sucked and held and lifted again by the frame holding part 306.

[0170] Next, after the distance between the pair of support plates 328 is increased by the distance adjustment mechanism, the ringless unit U' is placed on the upper surfaces of the support plates 328. Then, as shown in Fig.21, the ringless unit U' supported by the ringless unit support member 310 is pressed by the pressing member 338 of the pressing member 312, and the ringless unit U' is caused to enter the frame cassette 198 placed on the frame cassette table 200 and is housed therein.

[0171] The configuration of the illustrated embodiment is as described above. In the processing apparatus 2 of the illustrated embodiment, labor is easy to adhere the dividing band 96 to the part of the rear surface 4b of the wafer 4 where the annular reinforcing portion 24 is formed in a protruding shape on the rear surface 4b corresponding to the outer peripheral excess portion 20 to integrate the wafer 4 with the frame 64. In addition, it is easy to cut off the annular reinforcing portion 24 and remove it from the wafer 4, and productivity becomes favorable.

[0172] Furthermore, in the processing apparatus 2 of the illustrated embodiment, the inert gas N2 or the like is sprayed onto the back surface 4b of the wafer 4 when the wafer 4 is carried out by the wafer carrying-out mechanism 10. Therefore, oxidation of the back surface (for example, the back surface coated with a metal foil made of copper or the like) of the wafer 4 can be inhibited.

Claims

[1] A processing apparatus (2) which removes an annular reinforcing part (24) having a protruding shape from a wafer (4), the annular reinforcing part (24) being formed in the protruding shape on a part of a rear surface (4b) of the wafer (4), the part of the rear surface (4b) corresponding to an outer peripheral excess area (20), the processing apparatus (2) comprising: a wafer cassette table (8) on which a wafer cassette (6) in which a plurality of wafers (4) are accommodated is placed; a wafer removal mechanism (10) that removes the wafer (4) from the wafer cassette (6) placed on the wafer cassette table (8); a wafer table (12) supporting one side of a front surface (4a) of the wafer (4) carried out by the wafer carrying-out mechanism (10); a frame accommodating unit (66) accommodating a plurality of annular frames (64), each having an opening portion (64a) formed therein for accommodating the wafer (4); a frame removal mechanism (68) that removes the frame (64) from the frame housing unit (66); a frame table (70) supporting the frame (64) fed out by the frame feeding out mechanism (68); a tape adhering unit (98) disposed above the frame table (70) and adhering a tape (96) to the frame (64); a tape-attached frame (64') conveying mechanism (100) that conveys the frame (64') to which the tape (96) is adhered to the wafer table (12), positions the opening part (64a) of the frame (64) on the rear surface (4b) of the wafer (4) carried by the wafer table (12), and places a tape-attached frame (64') on the wafer table (12); a tape pressure bonding unit (102) that performs pressure bonding of the tape (96) of the tape-attached frame (64') to the rear surface (4b) of the wafer (4); a frame unit carrying-out mechanism (192) that carries a frame unit (U) in which the tape (96) of the tape-attached frame (64') and the rear surface (4b) of the wafer (4) are pressure-bonded by the tape pressure-bonding unit (102) away from the wafer table (12) and temporarily places the frame unit (U) on a temporary placement table (204); a reinforcing member removing unit (194) that cuts and removes the annular reinforcing member (24) from the wafer (4) of the frame unit (U) placed on the transition placement table (204); a ringless unit removal mechanism (196) for removing a ringless unit resulting from the removal of the annular reinforcing member (24) from the reinforcing member removal unit (194); and a frame cassette table (200) on which a frame cassette (198) is placed, which accommodates the ringless unit fed out by the ringless unit feeding out mechanism (196), wherein the wafer removal mechanism (10) has a Bernoulli chuck mechanism (44) which discharges gas to the rear surface (4b) of the wafer (4) and generates a negative pressure, and the gas is an inert gas, and the wafer carrying-out mechanism (10) discharges the inert gas from the Bernoulli chuck mechanism (44) to inhibit oxidation of the back surface (4b) of the wafer (4) when the wafer (4) is carried out. [2] Processing device (2) according to claim 1, wherein the tape pressure bonding unit (102) has an upper chamber (160) arranged above the wafer table (12), a lower chamber (162) in which the wafer table (12) is housed, a lifting mechanism (164) that raises and lowers the upper chamber (160) and creates a closed state in which the upper chamber (160) is brought into contact with the lower chamber (162) and an open state in which the upper chamber (160) is separated from the lower chamber (162), a vacuum part (166) that puts the upper chamber (160) and the lower chamber (162) into a vacuum state in the closed state, and an atmosphere opening part (168) that opens the upper chamber (160) and the lower chamber (162) to the atmosphere, the upper chamber (160) sprays inert gas onto the rear surface (4b) of the wafer (4) carried by the wafer table (12) to inhibit oxidation of the rear surface (4b) of the wafer (4), and in a state in which the tape (96) of the tape-attached frame (64') is positioned on the rear surface (4b) of the wafer (4), the lifting mechanism (164) is operated to maintain the closed state, the spraying of the inert gas is stopped and a vacuum state is created, and pressure-bonding the tape (96) of the tape-attached frame (64') to the rear surface (4b) of the wafer (4) is carried out by a pressing roller arranged in the upper chamber (160). [3] Processing apparatus (2) according to claim 1 or 2, wherein the wafer table (12) has a heating unit.

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