Cooling device for an electronic component

Abstract

Cooling device for an electronic component (2), comprising at least a first cooling unit (3) which is in direct contact with the electronic component (2) and which is provided for heat distribution, and at least a second cooling unit (4) which is in direct contact with the first cooling unit (3) and which is provided for heat dissipation, wherein the second cooling unit (4) has a lower stiffness than the first cooling unit (3) in order to compensate for tolerances, wherein the second cooling unit (4) comprises a plurality of tubes (6), in particular silicone-based.

Description

[0001] The invention relates to a cooling device for an electronic component. Furthermore, the invention relates to a cooling system. The invention also relates to a control unit for a vehicle and to a corresponding vehicle.

[0002] Cooling devices for electronic components are known from the prior art. To cool high-performance electronic components installed in a small space, very rigid materials are typically used. However, these can lead to unacceptable compressive stresses on the pressure-sensitive electronic components during the manufacturing process and / or operation.

[0003] DE 10 2010 001 958 A1 discloses an electronic control unit. DE 601 10 180 T2 discloses a thermally conductive polymer film. DE 100 33 848 A1 discloses an electrical device. DE 10 2018 205 243 A1 discloses an electronic module for power control and a method for manufacturing an electronic module for power control.

[0004] A cooling device for an electronic component is proposed. The cooling device comprises at least a first cooling unit, which is in direct contact with the electronic component and is designed to distribute heat. The cooling device also comprises at least a second cooling unit, which is in direct contact with the first cooling unit and is designed to dissipate heat. The second cooling unit has a lower stiffness than the first cooling unit to compensate for tolerances.

[0005] The cooling device is preferably designed to cool the electronic component. In particular, the cooling device is designed to dissipate waste heat from the electronic component. Preferably, the cooling device is intended for use in a vehicle. "Designed" is understood to mean, in particular, specially programmed, specially equipped, and / or specially designed. The phrase "designed" means, in particular, that an object performs a function in at least one operating state.

[0006] The electronic component can preferably be designed as a microprocessor, such as a central processing unit (CPU) or a graphics processing unit (GPU). Alternatively, the electronic component could be designed as an integrated circuit, such as an FPGA (Field Programmable Gate Array) or an ASIC (Application-Specific Integrated Circuit), or as another electronic component that would be suitable for a person skilled in the art. In particular, the electronic component can be intended to control at least semi-autonomous driving functions of a vehicle. The electronic component generates heat during operation, which must be dissipated to enable continuous operation of the electronic component.

[0007] The first cooling unit is preferably coupled to the electronic component via heat transfer technology. In particular, the first cooling unit is designed to absorb and distribute waste heat emitted by the electronic component. Specifically, the first cooling unit acts as a heat spreader. Preferably, the first cooling unit has a larger surface area than the electronic component. In particular, the surface area of ​​the first cooling unit, especially along a principal plane of extension of the first cooling unit, is larger than a contact area with the electronic component. A "principal plane of extension" of an object is understood to be, in particular, a plane that is parallel to a largest side face of the smallest imaginary cuboid that just completely encloses the object, and in particular passes through the center of the cuboid.Preferably, the first cooling unit is designed to distribute the heat absorbed by the electronic component in directions parallel to the main plane of extension, particularly to provide the widest possible cross-section for heat conduction. Preferably, the first cooling unit is also designed to conduct the heat, particularly along directions perpendicular to the main plane of extension, especially to the second cooling unit.

[0008] The second cooling unit is preferably coupled to the first cooling unit via heat transfer technology. In particular, the first cooling unit is in contact with the second cooling unit on a contact side of the first cooling unit that faces away from another contact side of the first cooling unit, with which the first cooling unit is in contact with the electronic component. Preferably, the contact sides of the first cooling unit extend parallel to the main plane of extension of the first cooling unit. The second cooling unit is preferably designed to absorb and dissipate the heat transferred by the first cooling unit. In particular, the second cooling unit can dissipate the heat to a heat sink. Preferably, the second cooling unit is in contact with the heat sink on a side facing away from the first cooling unit.The heat sink can be designed, in particular, as a metal housing, especially an aluminum housing, in which the electronic component and the cooling device are arranged. The metal housing can, in particular, be the housing of a control unit.

[0009] The second cooling unit preferably has a lower hardness than the first cooling unit. In particular, the first cooling unit has a higher stiffness and / or hardness than the second cooling unit to enable particularly good thermal coupling with the electronic component and particularly good heat conduction. The second cooling unit has a lower stiffness and / or hardness than the first cooling unit to compensate for tolerances, especially gap tolerances. In particular, the second cooling unit is compressible. In particular, the second cooling unit is particularly soft over a compression range of at least 10%, preferably at least 45%, and most preferably at least 80%, and is particularly softer than the first cooling unit.

[0010] The inventive design of the cooling device advantageously compensates for tolerances while simultaneously providing efficient and effective cooling of an electronic component. In particular, high pressure forces on the electronic component can be avoided. Advantageously, the use of liquid or sticky materials and the risk of material melting are eliminated. Advantageously, a precisely reproducible cooling device can be provided.

[0011] Furthermore, it is proposed that the second cooling unit has a lower thermal conductivity and a larger surface area than the first cooling unit. In particular, due to its lower stiffness and / or hardness, the second cooling unit has a lower thermal conductivity than the first. The second cooling unit has a thermal conductivity of at least 4 W / mK, preferably at least 5 W / mK, and most preferably at least 6 W / mK. The first cooling unit has a thermal conductivity of at least 15 W / mK, preferably at least 20 W / mK, and most preferably at least 25 W / mK. Preferably, the second cooling unit, due to its larger surface area, enables efficient heat dissipation despite its lower thermal conductivity. Advantageously, this allows for an optimal combination of tolerance compensation and cooling performance.

[0012] Furthermore, it is proposed that the first cooling unit be configured as an elastomer mat, particularly silicone-based, as a graphite foil, as a graphene foil, as a thermal pad, or as an aluminum plate, particularly one coupled to a phase-change material. Preferably, the elastomer mat is made of a silicone material. Preferably, the elastomer mat has a filling of a material other than an elastomer, particularly silicone. The aluminum plate is preferably coupled to the electronic component via a phase-change material, particularly by means of heat transfer. A phase-change material is, in particular, a material that changes its phase at a specific phase-transition temperature.Preferably, the thermal conductivity of the phase-change material in one phase, particularly in the phase reached by exceeding the phase-change temperature, is higher than in another phase, particularly in a phase where the phase-change material is below the phase-change temperature. Preferably, the phase-change material is in a solid phase below the phase-change temperature. Preferably, the phase-change material transitions to a liquid phase at the phase-change temperature, for example, a temperature between 50°C and 70°C. In particular, the phase-change material in the liquid phase can conform to a contour of the electronic component and / or the aluminum plate. Advantageously, this enables efficient thermal coupling with the electronic component and ensures a permanent preload force.

[0013] Furthermore, it is proposed that the first cooling unit incorporates a carbon fiber filling. Specifically, the elastomer mat is filled with carbon fibers. This can advantageously enable efficient heat distribution.

[0014] According to the invention, it is proposed that the second cooling unit comprises a plurality of tubes, in particular silicone-based tubes. The tubes are preferably made of a silicone material. The tubes enable, in particular, the compressibility and the large surface area of ​​the second cooling unit. In particular, the tubes are compressible in directions perpendicular to their longitudinal axes. The tubes are preferably arranged side by side in a layer, in particular along a direction perpendicular to the longitudinal axes of the tubes. It is particularly conceivable that the second cooling unit comprises several layers of tubes. Preferably, the tubes are connected to one another, for example, by bonding. Advantageously, effective tolerance compensation can be achieved and a permanent preload force can be ensured.

[0015] Furthermore, it is proposed that the tubes have a graphite sheath. Specifically, the graphite sheath is glued onto the tubes. Alternatively, it is conceivable that the graphite sheath is formed by coating the tubes with graphite. This can advantageously enable efficient heat dissipation.

[0016] Furthermore, it is proposed that the tubes be oriented such that their longitudinal axes run parallel to a principal extension plane of the first cooling unit. In particular, the longitudinal axes of the tubes run parallel to a principal extension plane of the second cooling unit. Advantageously, this allows for flexibility in the direction of the electronic component.

[0017] Furthermore, a cooling system is proposed. The cooling system comprises at least one cooling device according to the invention. The cooling system comprises at least one electronic component. Advantageously, a particularly durable cooling system can be provided.

[0018] Furthermore, a control unit for a vehicle is proposed. The control unit comprises at least one cooling system according to the invention. The control unit, in particular the electronic component, can be designed to process sensor data, control at least semi-autonomous driving functions of the vehicle, or the like. The control unit is designed, in particular, as an electronic control unit (ECU). In particular, the control unit can be designed as a central control unit, as a zonal control unit, or the like. In particular, the control unit can comprise several cooling systems. Advantageously, a particularly powerful and durable control unit can be provided.

[0019] Furthermore, a vehicle is proposed. The vehicle comprises at least one cooling device, at least one cooling system, or at least one control unit according to the invention. The vehicle can, in particular, be designed as an automated vehicle. An "automated vehicle" is understood to mean, in particular, a vehicle with one of the automation levels 1 to 5 of standard SAE J3016. In particular, the automated vehicle has technical equipment required for these automation levels. The technical equipment includes, in particular, environmental sensors, such as radar sensors, lidar sensors, cameras, and / or acoustic sensors, the control unit, or the like. Preferably, the vehicle is designed as a land vehicle.The vehicle can be configured, in particular, as a passenger car, preferably a passenger transport vehicle, as a truck, as a construction vehicle, as an agricultural vehicle, or as any other vehicle that a specialist would deem appropriate. Alternatively, the vehicle can also be configured as an aircraft, for example, as a drone, an airplane, a helicopter, a vertical take-off and landing aircraft, or the like, or as a watercraft, in particular as a ship, a boat, or the like. In particular, the vehicle can include multiple cooling devices, cooling systems, and / or control units. Advantageously, a particularly low-maintenance and roadworthy vehicle can be provided.

[0020] The invention is illustrated by an exemplary embodiment in the following figures. They show: Fig. 1 a vehicle according to the invention in a schematic representation, Fig. 2 a partial sectional view of a control unit according to the invention of the vehicle according to the invention Fig. 1 in a schematic representation and Fig. 3 a sectional view of a cooling system according to the invention of the control unit according to the invention Fig. 2 in a schematic representation.

[0021] Fig. Figure 1 shows a vehicle 12 in a schematic representation. The vehicle 12 is exemplary as a land vehicle, in particular as a passenger car. The vehicle 12 includes at least one control unit 11. The control unit 11 is designed as an electronic control unit.

[0022] Fig. Figure 2 shows a partial sectional view of the control unit 11 of the vehicle 12. Fig. 1 in a schematic representation. The control unit 11 comprises at least one cooling system 10. The cooling system 10 comprises at least one cooling device 1 (cf. Fig. 3) For clarity, the cooling device 1 is shown in Fig. 2 not shown. The cooling system 10 comprises at least one electronic component 2. The electronic component 2 is, by way of example, configured as a microprocessor, in particular as a graphics processor. The control unit 11, in particular the electronic component 2, can be designed to process sensor data, to control at least semi-autonomous driving functions of the vehicle 12, or the like. In the present embodiment, the control unit 11 includes, by way of example, a further electronic component 2', which will not be discussed further for the sake of simplicity. The following description with regard to the electronic component 2 and the cooling device 1 also applies analogously to the further electronic component 2' and a further cooling device associated with the further electronic component 2' (not shown here).

[0023] Fig. Figure 3 shows a sectional view of the cooling system 10 of the control unit 11. Fig. Figure 2 is shown in a schematic representation. The cooling device 1 comprises at least one first cooling unit 3, which is in direct contact with the electronic component 2 and is designed for heat distribution. The cooling device 1 comprises at least one second cooling unit 4, which is in direct contact with the first cooling unit 3 and is designed for heat dissipation. The second cooling unit 4 has a lower stiffness than the first cooling unit 3 in order to compensate for tolerances. The cooling device 1 is designed to cool the electronic component 2. The cooling device 1 is designed to dissipate waste heat from the electronic component 2.

[0024] The first cooling unit 3 is coupled to the electronic component 2 via a heat transfer system. The first cooling unit 3 is designed to absorb and distribute waste heat emitted by the electronic component 2. The first cooling unit 3 acts as a heat spreader. The first cooling unit 3 has a larger surface area than the electronic component 2. The surface area of ​​the first cooling unit 3, particularly along a principal extension plane 9 of the first cooling unit 3, is larger than a contact area 13 with the electronic component 2. The first cooling unit 3 is designed to distribute the heat absorbed by the electronic component 2 in directions parallel to the principal extension plane 9, in particular to provide the widest possible cross-section for heat conduction. The first cooling unit 3 is designed to conduct the heat, particularly along directions perpendicular to the principal extension plane 9, especially to the second cooling unit 4.

[0025] The second cooling unit 4 is coupled to the first cooling unit 3 via heat transfer. The first cooling unit 3 is in contact with the second cooling unit 4 on a contact side 14 of the first cooling unit 3, which faces away from another contact side 15 of the first cooling unit 3, the latter of which is in contact with the electronic component 2. The contact sides 14 and 15 of the first cooling unit 3 extend parallel to the main extension plane 9 of the first cooling unit 3. The second cooling unit 4 is designed to absorb and dissipate the heat transferred by the first cooling unit 3. The second cooling unit 4 can transfer the heat to a heat sink 16. The second cooling unit 4 is in contact with the heat sink 16 on a side facing away from the first cooling unit 3. The heat sink 16 is designed as a metal housing, in particular an aluminum housing, in which the electronic component 2 and the cooling device 1 are arranged.In the present embodiment, the heat sink 16 is formed by example by a housing of the control unit 11.

[0026] The second cooling unit 4 has a lower hardness than the first cooling unit 3. The first cooling unit 3 has a higher stiffness and / or hardness than the second cooling unit 4 to enable particularly good thermal coupling with the electronic component 2 and particularly good heat conduction. The second cooling unit 4 has a lower stiffness and / or hardness than the first cooling unit 3 to compensate for tolerances, especially gap tolerances. The second cooling unit 4 is compressible. The second cooling unit 4 has lower thermal conductivity and a larger surface area than the first cooling unit 3.

[0027] The first cooling unit 3 is configured as an elastomer mat, particularly silicone-based, as a graphite foil, as a graphene foil, as a thermal pad, or as an aluminum plate, particularly one coupled to a phase-change material. In the present embodiment, the first cooling unit 3 is configured as an elastomer mat based on silicone. The first cooling unit 3 has a filling of carbon fibers 5. The elastomer mat is filled with carbon fibers 5. The carbon fibers 5 are shown only schematically, and not to scale. For clarity, only one of the carbon fibers 5 is labeled with a reference numeral.

[0028] The second cooling unit 4 comprises a plurality of tubes 6, in particular silicone-based tubes. For clarity, only one of the tubes 6 is labelled. The tubes 6 enable the compressibility and large surface area of ​​the second cooling unit 4. The tubes 6 are compressible in directions perpendicular to their longitudinal axes 8. The tubes 6 are arranged side by side in a layer, in particular along a direction perpendicular to the longitudinal axes 8 of the tubes 6.

[0029] The tubes 6 have a graphite sheath 7. The graphite sheath 7 is glued onto the tubes 7. The tubes 6 are oriented such that the longitudinal axes 8 of the tubes 6 run parallel to the main extension plane 9 of the first cooling unit 3. Reference sign 1 cooling device 2 Electronic component 3 cooling units 4 cooling units 5 Carbon fiber 6 tubes 7 Graphite casing 8 Longitudinal axis 9 Main extent level 10 Cooling system 11 Control unit 12 vehicles 13 Contact area 14 Contact page 15 Contact page 16 heat sinks

Claims

[1] Cooling device for an electronic component (2), comprising at least a first cooling unit (3) which is in direct contact with the electronic component (2) and which is provided for heat distribution, and at least a second cooling unit (4) which is in direct contact with the first cooling unit (3) and which is provided for heat dissipation, wherein the second cooling unit (4) has a lower stiffness than the first cooling unit (3) in order to compensate for tolerances, wherein the second cooling unit (4) comprises a plurality of tubes (6), in particular silicone-based. [2] Cooling device according to claim 1, wherein the second cooling unit (4) has a lower thermal conductivity and a larger surface area than the first cooling unit (3). [3] Cooling device according to claim 1 or 2, wherein the first cooling unit (3) is designed as an elastomer mat, in particular silicone-based, as a graphite foil, as a graphene foil, as a thermal pad or as an aluminum plate, in particular coupled with a phase change material. [4] Cooling device according to one of the preceding claims, wherein the first cooling unit (3) comprises a filling of carbon fibers (5). [5] Cooling device according to one of the preceding claims, wherein the tubes (6) have a graphite sheath (7). [6] Cooling device according to one of the preceding claims, wherein the tubes (6) are aligned such that longitudinal axes (8) of the tubes (6) run parallel to a principal extension plane (9) of the first cooling unit (3). [7] Cooling system comprising at least one cooling device (1) according to one of the preceding claims and at least one electronic component (2). [8] Control unit for a vehicle (12) comprising at least one cooling system (10) according to claim 7. [9] Vehicle comprising at least one cooling device (1) according to any one of claims 1 to 6, at least one cooling system (10) according to claim 7 or at least one control unit (11) according to claim 8.

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