watercraft

Abstract

Watercraft (1) comprising at least the following components: - a vehicle hull (2); - at least one power electronics component (3) arranged in the vehicle body (2); and - a heat sink (4) in heat-transferring contact with the power electronics component (3), the heat sink (4) projecting from the vehicle hull (2) into a body of water (5) surrounding the watercraft (1) during operation, wherein the heat sink (4) comprises a plurality of cooling fins (6), characterized in that the cooling fins (6) are drop-shaped in cross-section.

Description

[0001] The invention relates to a watercraft.

[0002] Modern watercraft have a multitude of power electronics components. These power electronics components require cooling. Various cooling methods for cooling power electronics components are known from industrial practice. For example, the power electronics component is cooled using a coolant or a coolant-carrying cooling plate, which can be recooled via a recooling device.

[0003] These cooling systems for power electronic components, which are known from industrial practice, are heavy due to the coolant and / or a high number of components, require a comparatively large installation space and cause efficiency losses.

[0004] US 2020 / 0 231 264 A1, for example, discloses an electrically powered water device comprising: a sports carrier; a propeller connected to the sports carrier for generating mechanical power to propel the sports carrier to move in one direction (21); a battery unit disposed in the sports carrier for releasing electrical power stored therein; an electronic speed control disposed in the sports carrier and electrically connected to the battery unit and the propeller for supplying electrical power from the battery unit to the propeller and controlling an amount of mechanical power generated by the propeller;and a first heat dissipation device coupled to the electronic speed control and comprising a plurality of first fins arranged parallel to each other such that any two adjacent ones of the first fins define therebetween a first heat dissipation groove that is in communication with a bottom of the sports carrier and extends in a direction corresponding to the direction of movement of the sports carrier.;

[0005] The object of the present invention is to overcome the disadvantages resulting from industrial practice and to provide a watercraft by means of which the power electronic components of the watercraft can be cooled with low weight, efficiently and in a space-saving manner.

[0006] Based on this, the present invention is based on the object of at least partially overcoming the disadvantages known from the prior art. The features of the invention are evident from the independent claims, for which advantageous embodiments are presented in the dependent claims.

[0007] The invention relates to a watercraft comprising at least the following components: - a vehicle hull; - at least one power electronics component arranged in the vehicle body; and - a heat sink in heat-transferring contact with the power electronics component, wherein the heat sink projects from the vehicle hull into water surrounding the watercraft during operation, wherein the heat sink comprises a plurality of cooling fins.

[0008] The watercraft is characterized by the fact that the cooling fins are drop-shaped in cross-section.

[0009] Unless explicitly stated otherwise, ordinal numbers used in the preceding and following descriptions serve only to clearly distinguish them and do not reflect the order or ranking of the designated components. An ordinal number greater than one does not necessarily imply that another such component must be present.

[0010] A watercraft is proposed which comprises at least a vehicle hull, a power electronics component, and a heat sink. The power electronics component is arranged in heat-transferring contact with the heat sink. The power electronics component is arranged in the vehicle hull. The heat sink protrudes from the vehicle hull into the water surrounding the watercraft during operation. For this purpose, the heat sink is arranged at a point on the watercraft which, during operation—i.e., when the watercraft is stationary or moving in the water—is at least partially below the water surface. A water contact section of the heat sink is arranged outside the vehicle hull. The heat sink thus protrudes outwards with the water contact section from a vehicle skin of the vehicle hull. The water contact section preferably protrudes from an underside of the watercraft.

[0011] For example, a cooling section of the heat sink protrudes inwards into the vehicle body, i.e. the cooling section protrudes through the vehicle skin of the vehicle body inwards into the vehicle body.

[0012] Preferably, the watercraft further comprises a propulsion unit, for example, a motor and / or a sail, and / or a steering device. For example, the propulsion unit comprises a propeller, which is pivotable, for example, by means of the steering device. Alternatively or additionally, the steering device comprises a rudder pivotably mounted on the hull.

[0013] Particularly preferably, the drive unit comprises an electric motor and an electrical energy storage unit, as well as a pulse-controlled inverter. The pulse-controlled inverter is a power electronics component that can be cooled by means of the heat sink.

[0014] The watercraft preferably comprises a plurality of power electronics components, one or more of which can be cooled by means of a single or multiple heat sinks. Alternatively or additionally, the power electronics component is part of a control device or forms a control device of the watercraft. The control device serves, for example, to control the drive unit, to control the steering, for navigation, and / or to control other components of the watercraft.

[0015] Compared to cooling systems known from industrial practice, the cooling system proposed here requires fewer components. For example, the watercraft is designed in such a way that no coolant is required to cool the at least one power electronics component. This enables particularly lightweight, low-component, and efficient cooling of the power components.

[0016] It is further proposed in an advantageous embodiment of the watercraft that the heat sink is made of a material with high thermal conductivity and high corrosion resistance, preferably the heat sink is a ceramic heat sink.

[0017] According to this embodiment, the heat sink has high thermal conductivity and high corrosion resistance. Preferably, the thermal conductivity of the heat sink is higher than the thermal conductivity of the vehicle body. Preferably, the corrosion resistance of the heat sink is so high that the heat sink can withstand several years, particularly preferably at least two years, at least five years, or at least ten years, of exposure to salt water without damage.

[0018] According to this embodiment, the heat sink is preferably a ceramic heat sink. For example, the ceramic heat sink comprises aluminum nitrides and / or aluminum oxides.

[0019] Such an embodiment enables particularly efficient and long-lasting cooling of the power electronics component.

[0020] It is further proposed in an advantageous embodiment of the watercraft that the power electronics component is in direct contact with the heat sink.

[0021] According to this embodiment, the power electronics component is in direct contact with the heat sink. For example, the power electronics component is integrated into the cooling section of the heat sink or arranged on a surface of the cooling section. For example, the power electronics component is glued to such a surface. For example, a thermally conductive paste is applied between the power electronics component and the heat sink. For example, the thermally conductive paste is embodied as an adhesive.

[0022] According to this embodiment, the cooling of the power electronics component is particularly easy and component-saving.

[0023] It is further proposed in an advantageous embodiment of the watercraft that the cooling body comprises a plurality of cooling fins, which are preferably arranged parallel to one another and parallel to a direction of travel of the watercraft.

[0024] According to this embodiment, the heat sink comprises a plurality of cooling fins. The cooling fins are, for example, plate-shaped, rod-shaped, or have a flow-optimized shape. The cooling fins are drop-shaped in cross-section. For example, the cooling fins extend from the rest of the heat sink away from the hull of the watercraft. The cooling fins are preferably arranged to generate low flow resistance. For this purpose, the cooling fins are preferably arranged parallel to one another and to a direction of travel of the watercraft. The direction of travel corresponds to the direction of travel when traveling straight ahead.

[0025] By means of the embodiment proposed here, a high heat dissipation from the power electronics component can be achieved with a simultaneous low flow resistance.

[0026] It is further proposed in an advantageous embodiment of the watercraft that the heat sink is sealed from the vehicle hull by means of a circumferential seal.

[0027] The heat sink is preferably a separate component from the vehicle body. For example, the heat sink is arranged in a recess in the vehicle body. For this purpose, the heat sink is attached to the vehicle body, for example, by means of a weld, screw, rivet, or adhesive. For this purpose, the heat sink comprises a flange, for example.

[0028] According to the embodiment proposed here, an additional seal is arranged between the heat sink and the vehicle body. For example, the seal is formed from a sealing compound that hardens after application, or is a rubber seal, copper seal, or a similar solid seal.

[0029] It is further proposed in an advantageous embodiment of the watercraft that the watercraft is a boat or ship, preferably a motor-driven one.

[0030] It is further proposed in an advantageous embodiment of the watercraft that the power electronics component is or comprises a component from the following list: - a pulse-controlled inverter (PWR); - a Printed Circuit Board (PCB); - a power semiconductor; - a semiconductor module; - a capacitor; and - a power rail.

[0031] The invention described above is explained in detail below against the relevant technical background with reference to the accompanying drawings, which show preferred embodiments. The invention is in no way limited by the purely schematic drawings, whereby it should be noted that the drawings are not to scale and are not suitable for defining proportions. It is shown in Fig. 1 a watercraft with power electronics components in a schematic side view; Fig. 2 a section of a vehicle hull from Fig. 1 in a sectional view; and Fig. 3 the section of the vehicle hull from Fig. 2 in a sectional view rotated by 90°.

[0032] In Fig. 1 shows a schematic side view of a watercraft 1 with power electronics components 3. This illustration is purely symbolic; in particular, the proportions shown deviate from reality for the sake of clarity. In the illustrated embodiment, the watercraft 1 is a boat and includes a vehicle hull 2, a drive unit 12 with an engine 14, and a propeller 15 that generates propulsion.

[0033] Water 5 flows around the vehicle hull 2 ​​or, in an operating state as shown, lies in the water 5. A heat sink 4 projects from the inside out into the water 5 through a vehicle skin of the vehicle hull 2. In the operating state, the heat sink 4 is arranged below the water surface 16. Preferably, the heat sink 4, as shown, is arranged on an underside of the watercraft 1. A water contact section 11 of the heat sink 4 is thus arranged outside the vehicle hull 2. The heat sink 4 thus projects outwards with the water contact section 11 from the underside of the vehicle skin of the vehicle hull 2.

[0034] When the watercraft 1 moves in the direction of travel 7, the surrounding water 5 flows in a relative movement opposite to the direction of travel 7 along the cooling body 4 or its cooling section 10.

[0035] Accordingly, the cooling capacity by convection increases with increasing speed of the vessel 1.

[0036] At least one, preferably several, power electronics components 3 are arranged on the heat sink 4. As shown, only one heat sink 4 is arranged in the vehicle hull 2. In alternative embodiments, the watercraft 1 comprises several heat sinks 4, each with at least one power electronics component 3. The section of the heat sink 4 arranged within the vehicle hull 2 ​​forms a cooling section 10, on which the power electronics components 3 are arranged.

[0037] With such a passive cooling system, which does not require an actively pumped cooling medium and does not cause long heat conduction paths, a reduction in components and thus a weight reduction in the watercraft 1 is possible. Furthermore, no flow losses occur due to the introduction of water 5 into the vehicle interior, and the cooling system can be implemented in a particularly space-saving manner.

[0038] In Fig. 2 is a section of a vehicle hull 2 ​​of the watercraft 1 according to Fig. 1 with power electronics component 3 in a sectional view. As shown, a heat sink 4 is embedded in a corresponding recess in the vehicle skin of the vehicle body 2 on the underside of the vehicle body 2. For example, the heat sink 4 is glued, welded, or riveted. Preferably, the heat sink 4 is sealed against the vehicle body 2 by means of an additional seal (not shown here).

[0039] The power electronics component 3 is shown as a printed circuit board 8 (PCB) with additional individual elements, for example, microprocessors 13, which are connected to one another via busbars 9. The printed circuit board 8 is in direct contact with the cooling section 10 of the heat sink 4; for example, it is glued to the heat sink 4 or the cooling section 10. The power electronics component 3 is arranged inside, i.e., in the vehicle body 2, on a surface of the heat sink 4, as shown on an upper side. It should be noted that the power electronics component 3 is shown significantly enlarged purely for the sake of clarity.

[0040] The (cold) water 5 flowing around the cooling plate during operation creates forced convection on the heat sink 4, allowing it to be cooled and thus serving as a heat sink for the power components (as a heat source). Thus, the power electronics component 3 can be cooled by passive convection. For example, the temperature of the power electronics component 3 can be passively controlled to a predetermined level based on the vehicle speed.

[0041] In Fig. 3 is a section of a vehicle hull 2 ​​of the watercraft 1 according to Fig. 2 in a sectional view rotated by 90° [ninety degrees]. The heat sink 4 comprises several cooling fins 6, which are parallel to each other and parallel to a direction of travel 7 (compare Fig. 1 and Fig.2) of the watercraft 1. Thus, flow channels are formed between the cooling fins 6 along the direction of travel 7 or the flow direction of the surrounding water 5. This increases the contact surface between the water 5 and the heat sink 4 and thus the possible cooling performance. The orientation of the cooling fins 6 minimizes flow resistance. For example, the cooling fins 6 are tapered at the ends along the direction of travel 7 to further reduce flow resistance.

[0042] The watercraft proposed here enables passive cooling of a power electronics component and thus a weight reduction in the watercraft.

Claims

[1] Watercraft (1) comprising at least the following components: - a vehicle hull (2); - at least one power electronics component (3) arranged in the vehicle body (2); and - a heat sink (4) in heat-transferring contact with the power electronics component (3), the heat sink (4) projecting from the vehicle hull (2) into a body of water (5) surrounding the watercraft (1) during operation, wherein the heat sink (4) comprises a plurality of cooling fins (6), characterized by , that the cooling fins (6) are drop-shaped in cross-section. [2] Watercraft (1) according to claim 1, wherein the heat sink (4) is made of a material with high thermal conductivity and high corrosion resistance. [3] Watercraft (1) according to claim 1 or claim 2, wherein the power electronics component (3) is in direct contact with the heat sink (4). [4] Watercraft (1) according to one of the preceding claims, wherein the cooling fins (6) are arranged parallel to one another and parallel to a direction of travel (7) of the watercraft (1). [5] Watercraft (1) according to one of the preceding claims, wherein the cooling body (4) is sealed off from the vehicle hull (2) by means of a circumferential seal. [6] Watercraft (1) according to one of the preceding claims, wherein the watercraft (1) is a boat or ship. [7] Vessel (1) according to one of the preceding claims, wherein the power electronics component (3) is or comprises a component from the following list: - a pulse-controlled inverter (PWR); - a printed circuit board (8) (PCB); - a power semiconductor; - a semiconductor module; - a capacitor; and - a busbar (9).

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