Method for manufacturing a chip card inlay, chip card inlay and chip card

Abstract

A method for manufacturing a chip card inlay is provided. The method comprises inserting an antenna wire into a surface of a carrier, wherein the antenna wire comprises metal having an insulating coating (1010). The method further comprises crimping the antenna wire so that a portion of the metal of the antenna wire is stripped (1020), and soldering the stripped portion of the metal of the antenna wire to a metallic contact area of ​​a chip card module inserted into an opening of the carrier (1030).

Description

The invention relates to a method for producing a chip card inlay, a chip card inlay and a chip card.Thin smart card inlays are advantageous for producing thin documents with an electronic contactless function (CL, contactless), for example identification in the ID1 format or passports with a thin data page.Solutions which have been widely used on the market to date typically use what are known as secure elements (chips which are designed to provide security-relevant functions such as, for example, cryptographic functions) in molded modules, i.e. modules which are packaged by means of a molding material, with resistance-welded copper wire antenna.Due to their thickness, the molded modules can lead to stress cracks in a (e.g. polycarbonate) card body of the chip card and require expensive countermeasures, e.g. the use of so-called "crack prevention" foils which are configured to prevent or mitigate stress cracks.In addition, the thickness of the secure element module also defines a minimum total thickness of the smart card inlay, which is typically more than 200 μm.Other solutions use thin flip chip secure elements on a printed (e.g., silver) antenna. Such solutions are more technically sophisticated and not widely used.In various embodiments, a very thin ("ultra thin") smart card inlay with an antenna and mounted secure element for smart card and ID applications and a method for its production are provided.The chip card inlay can have a thickness of at most approximately 180 μm, for example approximately 175 μm.In the smart card inlay according to various embodiments, a very thin secure element module, which is configured for mounting in FCOS technology ("IC module") and is mounted in an opening (e.g. a through opening) of the inlay with a soldering method, and a special embodiment of the antenna wires to be contacted, can be used.The method for producing a chip card inlay according to various embodiments comprises applying an antenna wire to a carrier, wherein the antenna wire comprises metal which has an insulating coating. The method further comprises squeezing the antenna wire, so that a partial region of the metal of the antenna wire is stripped, and soldering the stripped partial region of the metal of the antenna wire to a metallic contact region of a chip card module, which is introduced into an opening of the carrier.Exemplary embodiments of the invention are illustrated in the figures and are explained in more detail below.They show FIGS. 1A to 1D show an illustration of a method for producing a chip card inlay according to various embodiments; FIG. 2 shows different schematic views of a chip card inlay according to various embodiments; FIGS. 3A and 3B show alternatives according to various embodiments to the processes of the method for producing a chip card inlay according to various embodiments shown in FIGS. 1C and 1D ; FIG. 4 shows different schematic views of a chip card inlay according to various exemplary embodiments; FIG. 5 shows an illustration of a squeezing process of the method for producing a chip card inlay according to various embodiments; FIG. 6 shows an illustration of different configurations of the squeezed partial regions of metal of the antenna wire according to various exemplary embodiments; FIG. 7 illustrates the chip card module according to various embodiments; FIG. 8 shows a matrix arrangement of a plurality of chip card inlays according to various embodiments during production of the chip card inlay; FIG. 9 shows a schematic cross-sectional view of a chip card according to various embodiments; and FIG. 10 shows a flow diagram of a method for producing a chip card inlay according to various exemplary embodiments.In the following detailed description, reference is made to the accompanying drawings, which form a part hereof, and in which is shown by way of illustration specific embodiments in which the invention may be practiced. In this regard, directional terminology such as "top", "bottom", "front", "back", "front", "rear", etc. is used with reference to the orientation of the figure(s) described. Since components of embodiments may be positioned in a number of different orientations, the direction terminology is for the purpose of illustration and is in no way limiting. It is to be understood that other embodiments may be utilized and structural or logical changes may be made without departing from the scope of the present invention. It should be understood that the features of the various exemplary embodiments described herein may be combined with each other, unless specifically stated otherwise. The following detailed description is therefore not to be taken in a limiting sense, and the scope of the present invention is defined by the appended claims.In the context of this description, the terms "connected", "connected" and "coupled" are used to describe both a direct and an indirect connection, a direct or indirect connection and a direct or indirect coupling. In the figures, identical or similar elements are provided with identical reference numerals, as appropriate.A chip card inlay is produced in a plurality of process steps.FIGS. 1A to 1D illustrate a method for manufacturing a smart card inlay 100 according to various embodiments. Each of FIGS. 1A to 1D shows a schematic perspective illustration of the chip card inlay 100 (in FIG. 1D ) or of parts thereof (in FIGS. 1A to 1C ), in each case with a partial enlargement.The method for producing the smart card inlay 100 may comprise providing a carrier 104 with an opening 108. This is illustrated by way of example in FIG. 1A.The carrier 104 can be similar or identical, for example, to a carrier known from the prior art for a chip card inlay with a laid antenna. The carrier 104 can comprise or be formed from a polymer, for example PVC, polycarbonate (PC), PET-G.The carrier 104 may have a thickness D T in a range from about 140 μm to about 160 μm, for example about 150 μm.The opening 108 may be a through opening and may be suitably sized and positioned to receive a smart card module.The opening 108 may be stamped into the carrier 104, for example.The method for producing the chip card inlay 100 comprises introducing an antenna wire 106 (for short: wire) into a surface of the carrier 104. This is illustrated by way of example in FIG. 1B.The antenna wire comprises metal with an insulating coating. During installation, typically by means of an ultrasonic sonotrode method, the antenna wire 106 is typically embedded with its cross section to the extent of approximately 75%.In various embodiments, a copper antenna wire 106 having a diameter of about 80 μm to about 120 μm is used, which has a thin coating of insulating varnish.This paint is provided in order to allow a crossover of the antenna wire 106 necessary for the installed antenna wire 106 due to the design (see, for example, the location marked with the arrow in the partial enlargement in FIG. 1B ) without a short circuit. Other types of antenna jumpers provided with an insulating coating may be used as desired.The antenna wire 106 is laid so that the two antenna ends span the previously created opening 108. This can be seen in the exemplary illustration of FIG. 1B, in particular in the partial enlargement.After the antenna wire 106 has been laid, the insulating varnish is still located on the wire, so that a soldering process is not possible in this state.The method further comprises, subsequent to the laying, squeezing the antenna wire 106 so that a partial region 106T of the metal of the antenna wire 106 is stripped. In other words, the insulating coating in the sub-region 106T is removed by the squeezing (or typically in at least two sub-regions 106T, namely near each antenna end of one, wherein in various exemplary embodiments the one sub-region 106T per antenna end can additionally be divided into a plurality of sub-regions, see in this respect FIG. 6, example 4 ). A result of the squeezing is exemplarily shown in FIG. 1C. Additional embodiments are shown in FIG. 6.In the exemplary figures, the squeezed portions 106T are illustrated as having smooth surfaces. In various exemplary embodiments, one or both metal surfaces produced by means of the squeezing can be roughened or provided with a structuring, with the result that the burst-on of the insulating layer can additionally be promoted and adhesion to the solder agent to be applied can be increased.The portion 106T may be disposed in the opening 108, and the squeezing may occur in the opening 108.In various exemplary embodiments, the squeezing can be effected by means of a squeezing device 550, for example an embossing tool. The squeezing device 550 can be two-part. In the case of an embossing tool, the two parts are usually referred to as an embossing die and an embossing plate, but generally it is important for the squeezing process that the partial region 106T can be arranged between the two parts 550A, 550B of the squeezing device 550 and a force can be applied in the vertical direction (i.e. perpendicular to the antenna plane). Whether one of the two parts 550A, 550B of the squeezing device 550 (and which of them) is held stationary and the other part is moved, or whether both parts 550A, 550B are moved, can be selected depending on the desired positioning of the squeezed partial region 106T. A relative size of the two portions 550A, 550B is also selectable depending on the desired result, as long as at least one of the portions 550A, 550B has a crush surface small enough to be movable into the opening 108.The portion(s) 106T may be embossed during swaging. In / in the sub-region(s) 106T, the wire can / can be flattened and widened, for example, starting from the original wire diameter. This is illustrated by way of example in FIG. 6.The antenna wire 106 (or the metal of the antenna wire 106--as the insulating layer is typically a lacquer, contributes at most insignificantly to the diameter of the antenna wire) a thickness of the sub-region 106T can be reduced to about 30% to about 60% of its original diameter.During the squeezing process (e.g. the embossing process), the insulating varnish bursts, so that the metal (e.g. copper) of the antenna wire 106 is at least partially exposed and can be used for a soldering process.In various exemplary embodiments, the exposure of the copper can be supported by a defined surface of the stamping tool (roughness depth, profile) and / or by additional measures (ultrasound during stamping, subsequent flame / ablation of the insulating varnish).The die (e.g., portion 550A of the swaging apparatus 550) may have radii at the edges of the operative surface to obtain a smooth transition from the portion to be swaged / swaged 106T to the normal wire diameter. Furthermore, the embossing die can have a defined surface (roughness, profile), for example a saw-tooth-like profile, tips, cavities, etc., for example with a roughness in a range from Rz=0.1 μm (polished) to Rz=10 μm.The size of the embossed area can be oriented to the desired soldering area. In the embodiment of Fig. 5, the die (part 550B of the squeegee 550) is larger than the die (part 550A of the squeegee 550). For example, one single embossed region (the crimped partial region 106T) or a plurality of small embossed regions can / can be provided per antenna wire 106 (or per end).In the exemplary embodiment from FIGS. 1C and 1D and FIG. 2, the squeezing was carried out in such a way that a surface of the antenna wire 106 pointing away from the carrier 104 is still substantially in one plane overall, even in the squeezed partial region 106T. This is also the case in the exemplary embodiments from FIG. 6.In the exemplary embodiment from FIGS. 3A and 3B and 4, during the squeezing, the partial region 106T of the antenna wire 106 has additionally been vertically offset, namely from the antenna side of the chip card inlay 100 (which is also referred to as front side) in the direction of the opposite side of the chip card inlay 100 (which is also referred to as rear side). This process is also referred to as a "downset".In various embodiments, the method further comprises soldering the stripped partial region 106T of the metal of the antenna wire 106 to a metallic contact region 440 of a chip card module 112 which is introduced into the opening 108 of the carrier 104.The contact area 440 may include two contact area areas 440, one for each end of the antenna wire 106. The contact region 440 may each be connected to a rear side contact 440R by a via (via) 770.The process of soldering is illustrated in FIGS. 1D and 3B, and FIG. 7 shows example details of the smart card module 112.The thin smart card module 112 may include a thin polyimide substrate with two-sided metallization and vias 770 (PTH).The chip side may be configured such that the chip 102 is mounted as a flip chip in a (e.g. central) region, wherein LA / LB contacts 774 of the flip chip 102 contact respective contact pads 776 (also referred to as land pads) for the chip 102.An electrically conductive connection of the contact pads 776 to the (e.g. external) metallic contact areas 440 (the LA / LB terminals) is found with the aid of vias 772 connecting the contact pads 776 to metal reinforcing areas on the back side of the chip card module 112 and vias 770 connecting a front and a back side of the contact areas 440, so that the module area on the chip side between the (internal) contact areas 442 and the (external) contact areas 440 remains metal-free.This is advantageous for later solder mounting, since no solder 110 can flow in the direction of the flip chip 102.A total thickness of the smart card module 112 is typically between about 100 μm and about 150 μm (e.g., about 120 μm). A smart card module 112 that is as small as possible (in particular short) is desirable in order to keep the material defect in the card construction that is produced by the opening 108 as small as possible.In various embodiments, the smart card module 112 is guided into the opening 108 with the chip side facing the wire and the metallic contact regions 440 (e.g. corresponding to terminals LA / LB as known from the prior art) are soldered to the squeezed portions 106T of the antenna wire 106. In the figures, for simplicity, front and back sides of the metal contact regions 440 connected through a smart card module substrate by means of a via 770 are provided with the same reference sign.This arrangement allows the chip 102 to lie in the cavity, i.e. it is protected on the one hand and a construction which is as thin as possible is thus made possible on the other hand.Accordingly, in the case that the squeezed portion 106T of the antenna wire 106 on the antenna side (the front side) extends over the opening 108, the smart card module 112 is inserted into the opening 108 such that the chip side of the smart card module 112 and the antenna side of the carrier 104 face in the same direction.Accordingly, in the case (in the case of "downset") that the squeezed portion 106T of the antenna wire 106 extends above the opening 108 on the side (the rear side) opposite to the antenna side, the smart card module 112 is inserted into the opening 108 such that the chip side of the smart card module 112 and the rear side of the carrier 104 face in the same direction.FIG. 8 shows a matrix arrangement 800 of a plurality of chip card inlays 100 according to various exemplary embodiments during production of the chip card inlay 100, which illustrates that the method for producing the chip card inlay 100 enables joint production and subsequent singulation of the chip card inlays 100.FIG. 9 shows a schematic cross-sectional view of a chip card 900 according to various embodiments.The chip card 900 has a chip card body 990, 992 (e.g. as top side and bottom side), and a chip card inlay 100 according to various embodiments.The chip card inlay 100 can be embedded, for example laminated, in the chip card body 990, 992.The chip card 900 can be produced using the chip card inlay 100 substantially as known from the prior art, although it is possible to dispense with additional protective measures customary according to the prior art for protecting against breaking of the chip card body 990, 992.It is to be understood that the smart card 900 not only refers to a smart card in the ID1 format, but may generally refer to thin / planar chip devices such as pages of an identification document (e.g., passport) or the like.Accordingly, the chip card body 990, 992 may comprise, for example, paper or other suitable materials in addition to the materials customary in chip card production, such as polymers (e.g. polycarbonate).FIG. 10 shows a flow diagram 1000 of a method for producing a chip card inlay.The method includes inserting an antenna wire into a surface of a carrier, the antenna wire including metal having an insulating coating ( 1010). The method further comprises squeezing the antenna wire so that a partial region of the metal of the antenna wire is stripped ( 1020), and soldering the stripped partial region of the metal of the antenna wire to a metallic contact region of a chip card module introduced into an opening of the carrier ( 1030).Some exemplary embodiments are given in summary below.Embodiment 1 is a method for manufacturing a smart card inlay. The method comprises introducing an antenna wire into a surface of a carrier, wherein the antenna wire comprises metal which has an insulating coating, for example a lacquer. The method further comprises squeezing the antenna wire, so that a partial region of the metal of the antenna wire is stripped, and soldering the stripped partial region of the metal of the antenna wire to a metallic contact region of a chip card module, which is introduced into an opening of the carrier.Exemplary embodiment 2 is a method according to exemplary embodiment 1, which further comprises cleaning the stripped partial region of the metal before soldering.Exemplary embodiment 3 is a method according to exemplary embodiment 1 or 2, wherein the thickness of the stripped partial region of the metal of the antenna wire is reduced during the crimping.Exemplary embodiment 4 is a method according to one of exemplary embodiments 1 to 3, wherein a plurality of partial regions of the metal of the antenna wire are stripped during the crimping.Exemplary embodiment 5 is a method according to one of exemplary embodiments 1 to 4, wherein the opening is a through opening.Exemplary embodiment 6 is a method according to one of exemplary embodiments 1 to 5, which furthermore has an introduction of the chip card module into the opening.Exemplary embodiment 7 is a method according to exemplary embodiment 6, wherein the chip card module is introduced into the opening from a side of the carrier opposite the antenna side.Embodiment 8 is a method according to any one of Embodiments 1 to 6, wherein during the crimping of the wire, the portion is vertically displaced.Exemplary embodiment 9 is a method according to exemplary embodiment 8, wherein the chip card module is introduced into the opening from the antenna side of the carrier.Exemplary embodiment 10 is a method according to one of exemplary embodiments 1 to 9, wherein during the squeezing a structuring or roughening of the stripped partial region of the metal to be soldered takes place.Embodiment 11 is a method according to any one of Embodiments 1 to 10, wherein in the squeezed portion, a thickness of the antenna wire is 30%-60% of the thickness of the antenna wire in the unsqueeched portions.Exemplary embodiment 12 is a method according to one of exemplary embodiments 1 to 11, wherein the antenna wire runs within the opening on the same side of the chip card inlay as outside the opening.Exemplary embodiment 13 is a method according to one of exemplary embodiments 1 to 11, wherein the antenna wire runs within the opening on a side of the chip card inlay which is opposite the side of the chip card inlay on which the antenna wire is arranged.Exemplary embodiment 14 is a method according to one of exemplary embodiments 1 to 13, wherein a thickness of the chip card inlay is less than 180 μm.Exemplary embodiment 15 is a chip card inlay. The chip card inlay has a carrier with an opening, an antenna wire arranged in a surface of the carrier, wherein the antenna wire has metal which has an insulating coating, and wherein a partial region of the metal of the antenna wire is stripped by means of crimping, and a chip card module with a metallic contact region, wherein the chip card module is arranged in the opening of the carrier, wherein the stripped partial region of the metal of the antenna wire is soldered to the metallic contact region of the chip card module.Exemplary embodiment 16 is a chip card inlay according to exemplary embodiment 15, wherein a thickness of the antenna wire in the squeezed partial region is 30%-60% of the thickness of the antenna wire in the non-squeezed regions.Exemplary embodiment 17 is a chip card inlay according to exemplary embodiment 15 or 16, wherein the opening is a through-opening.Exemplary embodiment 18 is a chip card inlay according to exemplary embodiments 15 to 17, wherein the antenna wire runs within the opening on the same side of the chip card inlay as outside the opening.Exemplary embodiment 19 is a chip card inlay according to exemplary embodiments 15 to 17, wherein the antenna wire runs within the opening on a side of the chip card inlay which is opposite the side of the chip card inlay on which the antenna wire is arranged.Exemplary embodiment 20 is a chip card inlay according to exemplary embodiments 15 to 19, wherein a thickness of the chip card inlay is less than 180 μm.Exemplary embodiment 21 is a chip card inlay according to exemplary embodiments 15 to 20, wherein the stripped partial region of the metal was free from residues and contaminants before soldering.Exemplary embodiment 22 is a chip card inlay according to exemplary embodiments 15 to 21, wherein the thickness of the stripped crimped partial region of the metal is smaller than the thickness of the remaining antenna wire.Exemplary embodiment 23 is a chip card inlay according to one of exemplary embodiments 15 to 22, wherein the subregion has a plurality of insulated subregions of the metal of the antenna wire which are separate from one another.Exemplary embodiment 24 is a chip card inlay according to one of exemplary embodiments 15 to 23, wherein the chip card module is introduced into the opening from a side of the carrier opposite the antenna side.Exemplary embodiment 25 is a chip card inlay according to one of exemplary embodiments 15 to 24, wherein the subregion of the wire is vertically offset from an original position after laying.Exemplary embodiment 26 is a chip card inlay according to exemplary embodiment 25, wherein the chip card module is introduced into the opening from the antenna side of the carrier.Exemplary embodiment 27 is a chip card inlay according to one of exemplary embodiments 15 to 26, wherein the stripped partial region of the metal to be soldered has a roughened or structured surface.Embodiment 28 is a smart card. The chip card has a chip card inlay according to one of the exemplary embodiments 15 to 27 and a chip card body, wherein the chip card inlay is embedded in the chip card body.Further advantageous embodiments of the device are evident from the description of the method and vice versa.

Claims

A method for manufacturing a smart card inlay, the method comprising: • inserting an antenna wire into a surface of a carrier, wherein the antenna wire comprises metal having an insulating coating (1010); • squeezing the antenna wire so that a partial region of the metal of the antenna wire is stripped (1020); and • soldering the stripped partial region of the metal of the antenna wire to a metallic contact region of a smart card module inserted (1030) into an opening of the carrier.The method of claim 1, further comprising: cleaning the stripped portion of the metal prior to soldering.Method according to claim 1 or 2, wherein during the squeezing the thickness of the stripped partial region of the metal of the antenna wire is reduced.Method according to one of Claims 1 to 3, wherein a plurality of partial regions of the metal of the antenna wire are stripped during the crimping.The method of any one of claims 1 to 4, wherein the opening is a through opening.The method according to any one of claims 1 to 5, further comprising: inserting the smart card module into the opening.Method according to claim 6, wherein the chip card module is introduced into the opening from a side of the carrier opposite the antenna side.The method of any one of claims 1 to 6, wherein during the squeezing of the wire, the portion is vertically displaced.The method according to claim 8, wherein the smart card module is inserted into the opening from the antenna side of the carrier.Method according to claim 8, wherein during the squeezing a structuring or roughening of the stripped partial region of the metal to be soldered takes place.Smart card inlay (100), comprising: • a carrier (104) having an opening (108); • an antenna wire (106) arranged in a surface of the carrier (104), wherein the antenna wire (106) comprises metal which has an insulating coating, and wherein a partial region (106T) of the metal of the antenna wire (106) is stripped by means of crimping; and • a smart card module (112) having a metallic contact region (440), wherein the smart card module (112) is arranged in the opening (108) of the carrier (104), wherein the stripped partial region (106T) of the metal of the antenna wire (106) is soldered to the metallic contact region (440) of the smart card module (112).The smart card inlay (100) according to claim 11, wherein in the pinched portion (106T), a thickness of the antenna wire (106) is 30%-60% of the thickness of the antenna wire (106) in the unsqueeked portions.The smart card inlay (100) according to claim 11 or 12, wherein the opening (108) is a through opening.The smart card inlay (100) according to any one of claims 11 to 13, wherein within the opening (108) the antenna wire (106) runs on the same side of the smart card inlay (100) as outside the opening (108).The smart card inlay (100) according to any one of claims 11 to 13, wherein within the opening (108) the antenna wire (106) runs on a side of the smart card inlay (100) which is opposite the side of the smart card inlay (100) on which the antenna wire (106) is arranged.The smart card inlay (100) according to any one of claims 11 to 15, wherein a thickness of the smart card inlay (100) is less than 180 μm.A chip card (900) comprising: • a chip card inlay (100) according to any one of claims 11 to 16; and • a chip card body (990, 992), wherein the chip card inlay (100) is embedded in the chip card body (990, 992).

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