Method for manufacturing a chip card inlay, chip card inlay and chip card

Abstract

Method for manufacturing a chip card inlay, comprising the method: • Inserting an antenna wire into a surface of a support, wherein the antenna wire comprises metal having an insulating coating (1010); • after insertion, crimping of the antenna wire so that a portion of the metal of the antenna wire is stripped (1020); and • Soldering the stripped portion of the metal of the antenna wire to a metallic contact area of ​​a chip card module inserted into an opening of the carrier (1030).

Description

[0001] The invention relates to a method for producing a chip card inlay, a chip card inlay and a chip card.

[0002] Thin chip card inlays are advantageous for the production of thin documents with electronic contactless function (CL), for example ID cards in ID1 format or passports with a thin data page.

[0003] Previous solutions on the market typically use so-called secure elements (chips designed to provide security-relevant functions such as cryptographic functions) in molded modules, i.e. modules housed using a molding material, with a resistance-welded copper wire antenna.

[0004] Due to their thickness, the molded modules can lead to stress cracks in a card body (e.g. polycarbonate) of the chip card and require expensive countermeasures, e.g. the use of so-called "crack prevention" films, which are designed to prevent or mitigate stress cracks.

[0005] In addition, the thickness of the Secure Element module also determines a minimum overall thickness of the chip card inlay, which is typically more than 200 µm.

[0006] Other solutions use thin flip-chip secure elements on a printed (e.g., silver) antenna. Such solutions are more technically sophisticated and not widely used.

[0007] DE 10 2012 004 485 A1 discloses a method for exposing a contacting device of an electrical component in a data carrier body for a portable data carrier, wherein a recess is mechanically formed in the data carrier body in the region of the contacting device to be exposed, characterized in that the contacting device is exposed in the recess by means of a laser in such a way that the surface of the contacting device is roughened.

[0008] DD 2 95 499 A5 discloses a method for producing wiring carriers with wires, in which the contact points to which the components are contacted by means of solder or conductive adhesive are formed by the wires without intermediate elements, characterized in that the following method steps are carried out: pressing the wires at the contact points to be formed into an auxiliary layer lying on an auxiliary carrier, wherein the wires are deformed at the contact points to be formed, but otherwise largely lie on the auxiliary layer; applying, preferably gluing, a carrier plate, which is preferably made of metal, to the laid wires; curing the adhesive layer; lifting the composite of auxiliary layer, wires and plate from the auxiliary carrier; completely or partially removing the auxiliary layer; and stripping the exposed wire points mechanically or by means of a laser.

[0009] DE 102 34 751 A1 discloses a method for producing an injection-molded chip card with a chip card body and an antenna coil for contactless data transmission embedded in the chip card body, comprising at least one conductor track and contact surfaces connected thereto, in which the antenna coil is applied on one side to the flat side of a carrier film, the carrier film element is inserted into the cavity of an injection molding tool having the size of the chip card such that the antenna coil applied thereto is located on the side facing the interior of the cavity, the cavity is subsequently filled with a liquefied plastic material, after completion of the injection molding process, a recess for a chip module is introduced into the chip card body, the contact surfaces of the antenna coil located inside the chip card body adjacent to the recess are exposed, a chip module is inserted into the recess,and the exposed contact surfaces are electrically connected to corresponding end surfaces on the chip module, characterized in that after the antenna coil has been applied to the carrier film element, the latter is partially severed by means of slits adjacent to the contact surfaces in such a way that individual tabs with contact surfaces arranged thereon are formed in the carrier film element, and that immediately after the injection molding process, the tabs formed in the carrier film element are pressed into the not yet cured plastic material.

[0010] A method for producing a chip card inlay according to claim 1, a chip card inlay according to claim 11, and a chip card according to claim 15 are provided. Further embodiments are described in the dependent claims.

[0011] In various embodiments, a very thin (“ultra-thin”) chip card inlay with an antenna and mounted secure element for chip card and ID applications and a method for its production are provided.

[0012] The chip card inlay can have a maximum thickness of approximately 180 µm, for example approximately 175 µm.

[0013] In the chip card inlay according to various embodiments, a very thin secure element module, which is designed for assembly in FCOS technology (“IC module”) and is mounted in an opening (e.g., a through-opening) of the inlay using a soldering process, as well as a special design of the antenna wires to be contacted can be used.

[0014] The method for producing a chip card inlay according to various embodiments comprises applying an antenna wire to a carrier, wherein the antenna wire comprises metal having an insulating coating. The method further comprises crimping the antenna wire so that a portion of the metal of the antenna wire is stripped, and soldering the stripped portion of the metal of the antenna wire to a metallic contact region of a chip card module that is inserted into an opening in the carrier.

[0015] Embodiments of the invention are illustrated in the figures and are explained in more detail below.

[0016] It shows Fig. 1A to 1D illustrate a method for manufacturing a chip card inlay according to various embodiments; Fig. 2 various schematic views of a chip card inlay according to various embodiments; Fig. 3A and Fig. 3B Alternatives according to various embodiments to the Fig. 1C and Fig. 1D illustrates processes of the method for producing a chip card inlay according to various embodiments; Fig. 4 various schematic views of a chip card inlay according to various embodiments; Fig. 5 an illustration of a squeezing process of the method for producing a chip card inlay according to various embodiments; Fig. 6 is an illustration of various configurations of the crimped portions of metal of the antenna wire according to various embodiments; Fig. 7 illustrations of the chip card module according to various embodiments; Fig. 8 shows a matrix arrangement of a plurality of chip card inlays according to various embodiments during production of the chip card inlay; Fig. 9 a schematic cross-sectional view of a chip card according to various embodiments; and Fig. 10 a flowchart of a method for producing a chip card inlay according to various embodiments.

[0017] In the following detailed description, reference is made to the accompanying drawings, which form a part hereof, and in which is shown by way of illustration specific embodiments in which the invention may be practiced. In this regard, directional terminology such as "top," "bottom," "front," "back," "fore," "rear," etc., will be used with reference to the orientation of the described figure(s). Since components of embodiments can be positioned in a number of different orientations, the directional terminology is for purposes of illustration and is in no way limiting. It is to be understood that other embodiments may be utilized and structural or logical changes may be made without departing from the scope of the present invention.It is understood that the features of the various exemplary embodiments described herein may be combined with one another unless specifically stated otherwise. The following detailed description is therefore not to be construed in a limiting sense, and the scope of the present invention is defined by the appended claims.

[0018] Throughout this description, the terms "connected," "attached," and "coupled" are used to describe both a direct and an indirect connection, a direct or indirect connection, and a direct or indirect coupling. In the figures, identical or similar elements are provided with identical reference numerals where appropriate.

[0019] The production of a chip card inlay takes place in several process steps.

[0020] Fig. 1A to 1D illustrate a method for manufacturing a chip card inlay 100 according to various embodiments. Each of the Fig. 1A to 1D shows a schematic perspective view of the chip card inlay 100 (in Fig. 1D) or parts thereof (in Fig. 1A to 1C), each with a partial magnification.

[0021] The method for producing the chip card inlay 100 may include providing a carrier 104 with an opening 108. This is exemplified in Fig. 1A.

[0022] The carrier 104 can, for example, be similar or identical to a carrier known from the prior art for a chip card inlay with a laid antenna. The carrier 104 can, for example, comprise or be formed from a polymer, such as PVC, polycarbonate (PC), or PET-G.

[0023] The carrier 104 may have a thickness D Tin a range of about 140 µm to about 160 µm, for example about 150 µm.

[0024] The opening 108 may be a through-hole and may be suitably sized and positioned to receive a smart card module.

[0025] The opening 108 can, for example, be punched into the carrier 104.

[0026] The method for producing the chip card inlay 100 comprises inserting an antenna wire 106 (short: wire) into a surface of the carrier 104. This is exemplified in Fig. 1B.

[0027] The antenna wire comprises metal with an insulating coating. During installation, typically using an ultrasonic sonotrode process, the antenna wire 106 is typically embedded to approximately 75% of its cross-section.

[0028] In various embodiments, a copper antenna wire 106 having a diameter of approximately 80 µm to approximately 120 µm is used, which has a thin coating of insulating varnish.

[0029] This varnish is provided to prevent a crossing of the antenna wire 106 which is necessary for the design of the installed antenna wire 106 (see, for example, the point marked with the arrow in the partial enlargement in Fig. 1B) without allowing a short circuit. Other types of antenna wires with an insulating coating can be used as needed.

[0030] The antenna wire 106 is laid in such a way that the two antenna ends span the previously created opening 108. This is shown in the exemplary illustration of the Fig. 1B, especially in the partial magnification.

[0031] After laying the antenna wire 106, the insulating varnish is still on the wire, so that a soldering process is not possible in this state.

[0032] The method further comprises, following the laying, crimping the antenna wire 106 so that a partial region 106T of the metal of the antenna wire 106 is stripped. In other words, the crimping removes the insulating coating in the partial region 106T (or typically in at least two partial regions 106T, namely one near each antenna end, wherein in various embodiments the one partial region 106T per antenna end can additionally be divided into several partial regions, see Fig. 6, Example 4). One result of the squeezing is shown in Fig. 1C. Additional embodiments are shown in Fig. 6 shown.

[0033] In the exemplary figures, the crimped portions 106T are illustrated with smooth surfaces. In various embodiments, one or both metal surfaces created by crimping can be roughened or provided with a structure, which can further promote the bursting of the insulating layer and increase the adhesion to the solder to be applied.

[0034] The portion 106T may be disposed in the opening 108, and the squeezing may occur in the opening 108.

[0035] In various embodiments, squeezing can be performed using a squeezing device 550, for example, a stamping tool. The squeezing device 550 can be made up of two parts. In the case of a stamping tool, the two parts are typically referred to as a stamping die and a stamping plate, but generally, the squeezing process requires that the partial region 106T can be arranged between the two parts 550A, 550B of the squeezing device 550 and that a force can be applied in the vertical direction (i.e., perpendicular to the antenna plane). Whether one of the two parts 550A, 550B of the squeezing device 550 (and which of them) is held stationary and the other part is moved, or whether both parts 550A, 550B are moved, can be selected depending on the desired positioning of the squeezing partial region 106T.A relative size of the two parts 550A, 550B can also be selected depending on the desired result, as long as at least one of the parts 550A, 550B has a crush surface that is small enough to be movable into the opening 108.

[0036] The section(s) 106T can be shaped during crimping. For example, in the section(s) 106T, the wire can be flattened and widened starting from the original wire diameter. This is shown, for example, in Fig. 6 illustrates.

[0037] The antenna wire 106 (or the metal of the antenna wire 106 - since the insulating layer is typically a varnish, it contributes at most insignificantly to the diameter of the antenna wire) can have a thickness of the partial region 106T reduced to about 30% to about 60% of its original diameter.

[0038] During the crimping process (e.g., the stamping process), the insulating varnish bursts, so that the metal (e.g., copper) of the antenna wire 106 is at least partially exposed and can be used for a soldering process.

[0039] In various embodiments, the exposure of the copper can be supported by a defined surface of the embossing tool (roughness, profile) and / or by additional measures (ultrasound during embossing, subsequent flame-off / ablation of the insulating varnish).

[0040] The stamping die (e.g., part 550A of the crimping device 550) can have radii at the edges of the functional surface to achieve a smooth transition from the 106T portion to be crimped / stamped to the normal wire diameter. Furthermore, the stamping die can have a defined surface (roughness, profile), for example, a sawtooth-like profile, peaks, cavities, etc., for example, with a roughness in a range of Rz = 0.1 µm (polished) to Rz = 10 µm.

[0041] The size of the stamping area can be based on the desired soldering area. In the example shown in Fig. 5, the embossing plate (part 550B of the crimping device 550) is larger than the embossing die (part 550A of the crimping device 550). For example, a single embossing area (the crimped portion 106T) or several small embossing areas can be provided per antenna wire 106 (or per end).

[0042] In the example shown Fig. 1C and Fig. 1D and Fig. 2, the crimping was carried out in such a way that a surface of the antenna wire 106 facing away from the carrier 104, even in the crimped partial area 106T, still lies essentially in one plane. This is also the case in the exemplary embodiments of Fig. 6 is the case.

[0043] In the example shown Fig. 3A and Fig. 3B and Fig. 4, during the crimping process, the partial region 106T of the antenna wire 106 was additionally displaced vertically, namely from the antenna side of the chip card inlay 100 (also referred to as the front side) toward the opposite side of the chip card inlay 100 (also referred to as the back side). This process is also referred to as "downset."

[0044] In various embodiments, the method further comprises soldering the stripped portion 106T of the metal of the antenna wire 106 to a metallic contact region 440 of a chip card module 112 that is inserted into the opening 108 of the carrier 104.

[0045] The contact area 440 may have two contact area surfaces 440, one for each end of the antenna wire 106.

[0046] The contact area 440 can be connected to a rear contact 440R by a via 770.

[0047] The soldering process is in Fig. 1D and Fig. 3B illustrates, and Fig. 7 shows exemplary details of the chip card module 112.

[0048] The thin chip card module 112 may include a thin polyimide substrate with double-sided metallization and through-holes 770 (PTH).

[0049] The chip side can be designed such that the chip 102 is mounted as a flip chip in a (e.g., central) area, with LA / LB contacts 774 of the flip chip 102 contacting respective contact surfaces 776 (also referred to as land pads) for the chip 102.

[0050] An electrically conductive connection of the contact surfaces 776 to the (e.g. external) metallic contact regions 440 (the LA / LB terminals) is established by means of through-contacts 772, which connect the contact surfaces 776 to metal reinforcement surfaces on the back of the chip card module 112, and through-contacts 770, which connect a front and a back of the contact regions 440, so that the module region on the chip side between the (internal) contact surfaces 442 and the (external) contact regions 440 remains metal-free.

[0051] This is advantageous for the later soldering assembly, since no solder 110 can flow towards the flip chip 102.

[0052] The total thickness of the chip card module 112 is typically between approximately 100 µm and approximately 150 µm (e.g., approximately 120 µm). A chip card module 112 that is as small as possible (especially short) is desirable in order to minimize the material defect in the card construction created by the opening 108.

[0053] In various embodiments, the chip card module 112 is guided into the opening 108 with the chip side facing the wire, and the metallic contact areas 440 (which, for example, correspond to terminals LA / LB as known from the prior art) are soldered to the crimped portions 106T of the antenna wire 106. For the sake of simplicity, the front and rear sides of the metallic contact areas 440, which are connected through a chip card module substrate by means of a via 770, are provided with the same reference numerals in the figures.

[0054] Due to this arrangement, the chip 102 lies in the cavity, ie on the one hand it is protected and on the other hand a construction as thin as possible is made possible.

[0055] In the event that the crimped portion 106T of the antenna wire 106 extends on the antenna side (the front side) over the opening 108, the chip card module 112 is accordingly inserted into the opening 108 such that the chip side of the chip card module 112 and the antenna side of the carrier 104 point in the same direction.

[0056] In the case (during “downset”) that the crimped portion 106T of the antenna wire 106 extends over the opening 108 on the side opposite the antenna side (the back), the chip card module 112 is accordingly inserted into the opening 108 such that the chip side of the chip card module 112 and the back of the carrier 104 point in the same direction.

[0057] Fig. 8 shows a matrix arrangement 800 of a plurality of chip card inlays 100 according to various embodiments during production of the chip card inlay 100, which illustrates that the method for producing the chip card inlay 100 enables joint production and subsequent separation of the chip card inlays 100.

[0058] Fig. 9 shows a schematic cross-sectional view of a chip card 900 according to various embodiments.

[0059] The chip card 900 has a chip card body 990, 992 (e.g., as top and bottom sides) and a chip card inlay 100 according to various embodiments.

[0060] The chip card inlay 100 can be embedded in the chip card body 990, 992, for example laminated.

[0061] The production of the chip card 900 using the chip card inlay 100 can essentially be carried out as known from the prior art, although additional protective measures customary in the prior art to protect against breakage of the chip card body 990, 992 can be dispensed with.

[0062] It should be understood that the chip card 900 does not only refer to a chip card in ID1 format, but can generally refer to thin / flat chip devices such as pages of an identification document (e.g. passport) or the like.

[0063] Accordingly, the chip card body 990, 992 may comprise, for example, paper or other suitable materials in addition to the materials commonly used in chip card production, such as polymers (e.g., polycarbonate).

[0064] Fig. 10 shows a flowchart 1000 of a method for producing a chip card inlay.

[0065] The method comprises inserting an antenna wire into a surface of a carrier, the antenna wire comprising metal having an insulating coating (1010). The method further comprises crimping the antenna wire so that a portion of the metal of the antenna wire is stripped (1020), and soldering the stripped portion of the metal of the antenna wire to a metallic contact region of a chip card module inserted into an opening in the carrier (1030).

[0066] Some examples of implementation are summarized below.

[0067] Embodiment 1 is a method for producing a chip card inlay. The method comprises inserting an antenna wire into a surface of a carrier, wherein the antenna wire comprises metal having an insulating coating, for example, a lacquer. The method further comprises crimping the antenna wire so that a portion of the metal of the antenna wire is stripped, and soldering the stripped portion of the metal of the antenna wire to a metallic contact region of a chip card module that is inserted into an opening in the carrier.

[0068] Embodiment 2 is a method according to embodiment 1, which further comprises cleaning the stripped portion of the metal before soldering.

[0069] Embodiment 3 is a method according to embodiment 1 or 2, wherein the thickness of the stripped portion of the metal of the antenna wire is reduced during squeezing.

[0070] Embodiment 4 is a method according to one of the embodiments 1 to 3, wherein several partial regions of the metal of the antenna wire are stripped during squeezing.

[0071] Embodiment 5 is a method according to any one of embodiments 1 to 4, wherein the opening is a through opening.

[0072] Embodiment 6 is a method according to one of embodiments 1 to 5, which further comprises inserting the chip card module into the opening.

[0073] Embodiment 7 is a method according to embodiment 6, wherein the chip card module is inserted into the opening from a side of the carrier opposite the antenna side.

[0074] Embodiment 8 is a method according to any one of embodiments 1 to 6, wherein the partial region is displaced vertically during the crimping of the wire.

[0075] Embodiment 9 is a method according to embodiment 8, wherein the chip card module is inserted into the opening from the antenna side of the carrier.

[0076] Embodiment 10 is a method according to one of the embodiments 1 to 9, wherein during the squeezing, a structuring or roughening of the stripped portion of the metal to be soldered takes place.

[0077] Embodiment 11 is a method according to any one of embodiments 1 to 10, wherein in the crimped portion, a thickness of the antenna wire is 30%-60% of the thickness of the antenna wire in the non-crimped portions.

[0078] Embodiment 12 is a method according to one of the embodiments 1 to 11, wherein inside the opening the antenna wire runs on the same side of the chip card inlay as outside the opening.

[0079] Embodiment 13 is a method according to any one of embodiments 1 to 11, wherein within the opening the antenna wire runs on a side of the chip card inlay that is opposite the side of the chip card inlay on which the antenna wire is arranged.

[0080] Embodiment 14 is a method according to any one of embodiments 1 to 13, wherein a thickness of the chip card inlay is less than 180 µm.

[0081] Embodiment 15 is a chip card inlay. The chip card inlay comprises a carrier with an opening, an antenna wire arranged in a surface of the carrier, wherein the antenna wire comprises metal having an insulating coating, and wherein a portion of the metal of the antenna wire is stripped by crimping, and a chip card module with a metallic contact region. The chip card module is arranged in the opening of the carrier, wherein the stripped portion of the metal of the antenna wire is soldered to the metallic contact region of the chip card module.

[0082] Embodiment 16 is a chip card inlay according to embodiment 15, wherein in the crimped partial area a thickness of the antenna wire is 30%-60% of the thickness of the antenna wire in the non-clamped areas.

[0083] Embodiment 17 is a chip card inlay according to embodiment 15 or 16, wherein the opening is a through opening.

[0084] Embodiment 18 is a chip card inlay according to embodiments 15 to 17, wherein inside the opening the antenna wire runs on the same side of the chip card inlay as outside the opening.

[0085] Embodiment 19 is a chip card inlay according to embodiments 15 to 17, wherein within the opening the antenna wire runs on a side of the chip card inlay that is opposite the side of the chip card inlay on which the antenna wire is arranged.

[0086] Embodiment 20 is a chip card inlay according to embodiments 15 to 19, wherein a thickness of the chip card inlay is less than 180 µm.

[0087] Embodiment 21 is a chip card inlay according to embodiments 15 to 20, wherein the stripped portion of the metal was free of residues and contamination before soldering.

[0088] Embodiment 22 is a chip card inlay according to embodiments 15 to 21, wherein the thickness of the stripped, crimped portion of the metal is smaller than the thickness of the remaining antenna wire.

[0089] Embodiment 23 is a chip card inlay according to one of the embodiments 15 to 22, wherein the partial region has a plurality of separate, stripped partial regions of the metal of the antenna wire.

[0090] Embodiment 24 is a chip card inlay according to one of the embodiments 15 to 23, wherein the chip card module is inserted into the opening from a side of the carrier opposite the antenna side.

[0091] Embodiment 25 is a chip card inlay according to one of the embodiments 15 to 24, wherein the partial region of the wire is vertically offset from an original position after laying.

[0092] Embodiment 26 is a chip card inlay according to embodiment 25, wherein the chip card module is inserted into the opening from the antenna side of the carrier.

[0093] Embodiment 27 is a chip card inlay according to one of the embodiments 15 to 26, wherein the stripped portion of the metal to be soldered has a roughened or structured surface.

[0094] Embodiment 28 is a chip card. The chip card comprises a chip card inlay according to one of embodiments 15 to 27 and a chip card body, wherein the chip card inlay is embedded in the chip card body.

[0095] Further advantageous embodiments of the device result from the description of the method and vice versa.

Claims

[1] A method for producing a chip card inlay, the method comprising: • Introducing an antenna wire into a surface of a carrier, the antenna wire comprising metal having an insulating coating (1010); • after insertion, squeezing the antenna wire so that a portion of the metal of the antenna wire is stripped (1020); and • Soldering the stripped portion of the metal of the antenna wire to a metallic contact area of ​​a chip card module that is inserted into an opening in the carrier (1030). [2] The method of claim 1, further comprising: Cleaning the stripped portion of the metal before soldering. [3] A method according to claim 1 or 2, wherein the thickness of the stripped portion of the metal of the antenna wire is reduced during the squeezing. [4] Method according to one of claims 1 to 3, wherein during the crimping process several partial regions of the metal of the antenna wire are stripped. [5] A method according to any one of claims 1 to 4, wherein the opening is a through opening. [6] Method according to one of claims 1 to 5, further comprising: Insert the chip card module into the opening. [7] Method according to claim 6, wherein the chip card module is inserted into the opening from a side of the carrier opposite the antenna side. [8] Method according to one of claims 1 to 6, wherein during the crimping of the wire the partial region is displaced vertically. [9] Method according to claim 8, wherein the chip card module is inserted into the opening from the antenna side of the carrier. [10] Method according to claim 8, wherein during the squeezing, a structuring or roughening of the stripped portion of the metal to be soldered takes place. [11] Chip card inlay (100), comprising: • a carrier (104) with an opening (108); • an antenna wire (106) arranged in a surface of the carrier (104), wherein the antenna wire (106) comprises metal having an insulating coating, and wherein a portion (106T) of the metal of the antenna wire (106) is stripped by means of crimping after being arranged in the surface of the carrier; and • a chip card module (112) with a metallic contact region (440), wherein the chip card module (112) is arranged in the opening (108) of the carrier (104), wherein the stripped partial region (106T) of the metal of the antenna wire (106) is soldered to the metallic contact region (440) of the chip card module (112). [12] Chip card inlay (100) according to claim 11, wherein in the crimped portion (106T) a thickness of the antenna wire (106) is 30%-60% of the thickness of the antenna wire (106) in the non-crimped portions. [13] Chip card inlay (100) according to claim 11 or 12, wherein the opening (108) is a through opening. [14] Chip card inlay (100) according to one of claims 11 to 13, wherein inside the opening (108) the antenna wire (106) runs on the same side of the chip card inlay (100) as outside the opening (108). [15] Chip card inlay (100) according to one of claims 11 to 13, wherein within the opening (108) the antenna wire (106) runs on a side of the chip card inlay (100) which is opposite the side of the chip card inlay (100) on which the antenna wire (106) is arranged. [16] Chip card inlay (100) according to one of claims 11 to 15, wherein a thickness of the chip card inlay (100) is less than 180 µm. [17] Chip card (900), comprising: • a chip card inlay (100) according to one of claims 11 to 16; and • a chip card body (990, 992), wherein the chip card inlay (100) is embedded in the chip card body (990, 992).

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