LIQUID COOLING HEAT DISPENSING DEVICES

Abstract

An integrated liquid cooling heat dissipation device comprises a liquid cooling radiator (100) with a first and a second liquid reservoir (20) and a heat dissipation pipe assembly (30), a liquid cooling head (200), and a liquid pump (300). The first liquid reservoir (10) forms an upper reservoir body part (111) and a lower reservoir body part (112), which is combined with the heat dissipation pipe assembly (30) such that the liquid collection space in the first liquid reservoir (10) is modified below the first liquid reservoir (10), thereby reducing the height of the upper reservoir body part (111).The upper container body part (111) and the second liquid container (20) protrude from the front and rear of the heat dissipation tube set (30) and form a fan installation space (40) at the front and rear of the liquid cooling radiator (100), so that the fan (400) can supply air to the heat dissipation tube set (30) and the lower container body part (112) simultaneously to dissipate the heat.

Description

BACKGROUND OF THE INVENTION(a) Field of the Invention

[0001] The present invention relates to the technology of liquid cooling heat dissipation devices, and more particularly to a liquid cooling heat dissipation device that can reduce the height and increase the internal working fluid capacity of the liquid cooling radiator. (b) Description of the prior art

[0002] The known liquid cooling heat dissipation devices used in computers and servers are typically separate liquid cooling heat dissipation devices, which have separate liquid cooling radiators, liquid cooling heads, and liquid pumps, and are connected between the individual units by a large number of liquid pipes. The liquid cooler, or rather, the liquid cooling radiators, and the liquid cooling head of the separate liquid cooling heat dissipation device are separated, the structure is not compact enough, installation is inconvenient, and the cooling fluid flows slowly. For this reason, the inventor has already proposed an integrated liquid cooling heat dissipation device (Taiwan Patent Publication No. I765680) to overcome the shortcomings of the conventional separate liquid cooling heat dissipation device.

[0003] However, when the integrated liquid cooling heat dissipation device is installed, the liquid cooling head at the bottom of the liquid cooling radiator must be fixed to the surface of the processor chip, so that the liquid cooling radiator stands upright on the processor chip, which easily leads to the problem of insufficient space in the computer case. Therefore, the main problem of the present invention is how to reduce the height and volume of the integrated liquid cooling heat dissipation device while simultaneously increasing the capacity of the internal working fluid. In addition, the interior of the liquid collection box at one end of the liquid cooling radiator of the conventional integrated liquid cooling heat dissipation device is divided into a cold fluid chamber and a hot fluid chamber.When the liquid flowing through the liquid cooling head absorbs heat and becomes a hot liquid and flows into the hot liquid chamber, it conducts heat through the metal partition to the cold liquid in the adjacent cold liquid chamber, which causes the cold liquid to flow into the liquid cooling head to be abnormally heated first, thereby affecting the cooling effect after flowing into the liquid cooling head. OVERVIEW OF THE INVENTION

[0004] A primary purpose of the present invention is to provide an integrated liquid cooling heat dissipation device comprising a liquid cooling radiator having a first liquid tank, a second liquid tank, and a heat dissipation tube set connecting the first liquid tank and the second liquid tank at both ends, a liquid cooling head set at the bottom of the second liquid tank, and a liquid pump in the first liquid tank. The first liquid tank forms an upper tank body portion and a lower tank body portion projecting downward from the lower end of the upper tank body portion.The lower end of the lower tank body part is combined with the upper end of the heat dissipation pipe set, so that the liquid collection space in the first liquid tank below the first liquid tank is changed, thereby reducing the height of the upper tank body part, making it easier to install the integrated liquid cooling heat dissipation device in the computer case.

[0005] Another object of the present invention is to provide a liquid cooling heat dissipation device in which the front and rear ends of the upper tank body and the second liquid tank protrude from the front and rear of the heat dissipation tube set, which can increase the capacity of the working fluid and form a concave fan installation space at the front and rear of the liquid cooling radiator, so that a fan can be installed in each fan installation space to supply air to the heat dissipation tube set and the lower tank body part and simultaneously dissipate heat.

[0006] Another object of the present invention is to provide a liquid-cooling heat dissipation device in which the second liquid reservoir of the liquid-cooling radiator is separated into a cold liquid chamber and a hot liquid chamber by an air-heat insulation space. Due to the low thermal conductivity of the air in the air-heat insulation space, the hot working fluid in the hot liquid chamber cannot transfer heat to the cold working fluid in the cold liquid chamber. BRIEF DESCRIPTION OF THE DRAWINGS Fig. Figure 1 is a three-dimensional schematic representation of the integrated liquid cooling heat dissipation device of the present invention. Fig. Figure 2 is a schematic representation of the front view of the integrated liquid cooling heat dissipation device of the present invention. Fig. Figure 3 is a schematic exploded view of the integrated liquid cooling heat dissipation device of the present invention. Fig. 4 is a schematic exploded view of the first liquid container and heat dissipation tube set of the present invention. Fig. 5 is a schematic exploded view of the first liquid containers of the present invention. Fig. 6 is a schematic exploded view of the second liquid container and heat dissipation tube set of the present invention. Fig. 7 is a schematic exploded view of the second liquid container of the present invention. Fig. Figure 8 is a schematic representation of the front view of the integrated liquid cooling heat dissipation device of the present invention. Fig. 9 is a schematic cross-sectional side view of the integrated liquid cooling heat dissipation device of the present invention. Fig. 10 is a schematic diagram of adding fans to the integrated liquid cooling heat dissipation device of the present invention. Fig. 11 is an exploded view of the fans installed in the integrated liquid cooling heat dissipation device of the present invention. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0007] According to Fig. 1 and Fig. 2, the present invention is an integrated liquid cooling heat dissipation device which, in its preferred embodiment, comprises a liquid cooling radiator 100, a liquid cooling head 200, and a liquid pump 300. The liquid cooling radiator 100 comprises a first liquid reservoir 10, a second liquid reservoir 20, and a heat dissipation tube set 30. The first liquid reservoir 10 and the second liquid reservoir 20 are housings made of heat-dissipating metal (e.g., an aluminum alloy) and serve to introduce working fluid (water or other cooling fluids) into the first liquid reservoir 10 and the second liquid reservoir 20. The heat dissipation tube set 30 consists of a plurality of first tubes 31 and a plurality of second tubes 32 arranged in parallel at intervals, as well as a plurality of cooling fins 33.The first tubes 31 and the second tubes 32 are flat metal tubes, both ends of which are connected and communicate with the first liquid tank 10 and the second liquid tank 20, respectively. The cooling fins 33 are arranged outside the first tubes 31 and the second tubes 32, respectively. One side of the liquid cooling head 200 is connected outside the bottom wall of the second liquid tank 20, and the other side of the liquid cooling head 200 is used for attachment to a processor chip (not shown). The liquid pump 300 is inserted into the first liquid tank 10 to drive the working fluid in the liquid cooler to circulate sequentially between the first liquid tank 10, the first tubes 31, the second liquid tank 20, the liquid cooling head 200, the second tubes 32, and the first liquid tank 10.

[0008] With reference to Fig. 3, Fig. 4 and Fig. 5, the first liquid container 10 above the liquid cooling radiator 100 is preferably designed with a first container body 11, a first container lid 12, and a first partition wall 13. The first container body 11 is formed integrally from a rectangular upper container body part 111 and a lower container body part 112. The upper container body part 111 has a thickness L1 and a width W1 that is greater than that of the lower container body part 112. The upper end of the upper container body part 111 is recessed to form a first upper chamber 113. The lower container body part 112 projects downward from the lower end of the upper container body part 111, so that the upper container body part 111 and the lower container body part 112 of the first container body 11 form a T-shaped container body in side view (as in Fig. 9). At the same time, the bottom surface of the first upper chamber 113 forms a first lower chamber 114 which is recessed into the lower container body part, so that the first upper chamber 113 and the first lower chamber 114 form a T-shaped chamber in the internal view (as shown in Fig. 9). The lower wall of the lower container body 112 is provided with a plurality of first tube sockets 115 connected to the first lower chamber 114, so that the upper ends of the first tubes 31 and the second tubes 32 of the heat dissipation tube set 30 are respectively inserted into the first tube sockets 115 (as shown in Fig. 8). The first tank lid 12 covers the upper end of the upper tank body part 111 to close the first upper chamber 113. The first partition wall 13 is arranged transversely in the first upper chamber 113 and the first lower chamber 114 to divide the first upper chamber 113 and the first lower chamber 114 into a liquid inlet chamber 116 and a liquid outlet chamber 117, such that the upper ends of the first tubes 31 are connected to the liquid outlet chamber 117, and the upper ends of the second tubes 32 are connected to the liquid inlet chamber 116. The above-mentioned liquid pump 300 is combined with the first tank lid 12 and arranged in the liquid inlet chamber 116.

[0009] The preferred embodiment of the second liquid container 20 below the liquid cooler 100 has a second container body 21 and a second container lid 22 (see Fig. 6, Fig. 7 and Fig. 8). The upper end of the second container body 21 is recessed to form a second chamber 23. The second chamber 23 is divided into a cold liquid chamber 24 and a hot liquid chamber 25. The bottom wall of the second container body 21 is connected to the above-mentioned liquid cooling head 200. The cold liquid chamber 24 and the hot liquid chamber 25 are each connected to the liquid cooling head 200. The second container lid 22 covers the upper end of the second container body 21 to close the second chamber 23. The upper wall of the second container lid 22 is provided with a plurality of second pipe sockets 26, which are connected to the cold liquid chamber 24 and the hot liquid chamber 25. The lower ends of the above-mentioned first pipes 31 and the second pipes 32 are respectively inserted into the second pipe sockets 26 (as shown in Fig. 8), so that the lower ends of the first tubes 31 are connected to the cold liquid chamber 24 and the lower ends of the second tubes 32 are connected to the hot liquid chamber 25.

[0010] By structurally designing the upper tank body part 111 and the lower tank body part 112 of the first liquid tank 10, the present invention enables the implementation of the first liquid tank 10 with a structure in which the upper tank body part 111 has a lower height and the lower tank body part 112 protrudes downward from the bottom of the upper tank body part 111, so that only the upper tank body part 111 with a lower height remains on the heat dissipation tube set 30 (and the fans described below) in the space in which the lower tank body part 112 extends downward to the heat dissipation tube set 30. Therefore, the height volume of the liquid cooling radiator 100 can be reduced, allowing it to be installed and used in a smaller computer case. As shown in Fig. 9, the front and rear ends of the upper tank body part 111 of the first liquid tank 10 and the front and rear ends of the second liquid tank 20 protrude from the front and rear sides of the heat dissipation pipe set 30, respectively, so that the liquid cooling radiator 100 can accommodate more working fluid (water, etc.) without increasing the height of the liquid cooling radiator 100, and a concave fan installation space 40 can be formed at the front and rear sides of the liquid cooling radiator 100 for accommodating a fan 400 (as shown in Fig. 10 and Fig. 11 shown).

[0011] Again referring to Fig. 4, Fig. 5 and Fig. 8, the inner surface of the first container lid 12 of the above-mentioned first liquid container 10 has a liquid pump seat 121 that protrudes into the first container body 11. The liquid pump seat 121 is cylindrical. On the outer side of the first container lid 12, there is a recess with a liquid pump cavity 122 that extends to the liquid pump seat 121. In this way, the liquid pump 300 is loaded from the outer side of the first container lid 12 into the liquid pump cavity 122. The end face of the liquid pump seat 121 is provided with a liquid inlet port 123 that is connected to the liquid pump cavity 122 and the liquid inlet chamber 116.One side of the liquid pumping seat 121 is provided with a protrusion 124, and the protrusion 124 is also provided with a liquid outlet port 125 connecting the liquid pumping cavity 122 and the liquid outlet chamber 117. The above-mentioned first partition wall 13 is designed as a T-shaped plate, and its upper edge is provided with a gap 131 corresponding to the contour of the protrusion 124. The gap 131 is in close contact with the peripheral surface of the protrusion 124, and the other edges of the first partition wall 13 are in close contact with the inner walls of the first upper chamber 113 and the first lower chamber 114.When the liquid pump 300 is in operation, the working fluid of the liquid inlet chamber 116 can be sucked from the liquid inlet port 123 and then transported from the liquid outlet port 125 to the liquid outlet chamber 117, so that the working fluid continuously circulates in the liquid cooling radiator 100, and the circulating working fluid flow flows through the liquid cooling head 200 to cool the processor chip, and then dissipates the heat through the heat dissipation pipe set 30.

[0012] Again referring to Fig. 4, Fig. 5 and Fig. 8, in order to increase the structural strength of the first liquid container 10, the bottom wall of the upper container body part 111 of the first container body 11 is provided with a plurality of first ribs 118 projecting into the first upper chamber 113, and the upper wall of the first container lid 12 is provided with a plurality of second ribs 126 projecting into the first upper chamber 113. Furthermore, the upper wall of the first container lid 12 is provided with a liquid injection port 127 connected to the first upper chamber 113, and a detachable sealing member 128 (e.g., a sealing screw, etc.) is combined with the liquid injection port 127.

[0013] Referring to Fig. 7 and Fig. 8, in the present invention, an air heat insulation space 27 is provided in the second chamber 23 of the second container body 21 to prevent heat transfer of the hot working fluid flowing into the hot fluid chamber 25 of the second container body 21 through the liquid cooling head 200 into the adjacent cold fluid chamber 24. The air heat insulation space 27 consists of a hot fluid partition wall 271 and a cold fluid partition wall 272, which are arranged in the second chamber 23 and separated by a distance. The second chamber 23 is divided into the cold fluid chamber 24 and the hot fluid chamber 25 by the air heat insulation space 27. The lower casing wall of the cold fluid chamber 24 is provided with a cold fluid inlet 241 through which the cold working fluid flows from the cold fluid chamber 24 to the liquid cooling head 200.The lower housing wall of the hot liquid chamber 25 is provided with a hot liquid outlet 251 for returning the hot working liquid from the liquid cooling head 200 to the hot liquid chamber 25. The second container body 21 is preferably designed as a quadrangular pyramid with a wider upper end and a narrower lower end, and the second chamber 23 is a conical chamber corresponding to the quadrangular pyramid.

[0014] With further reference to Fig. 10 and Fig.11, the preferred embodiment of the liquid-cooling radiator 100 of the present invention further includes two fan mounts 50. The two fan mounts 50 are combined on both sides of the heat dissipation tube set 30, so that one or two fans 400 can be placed in the fan installation space 40 at the front and rear of the liquid-cooling radiator 100, and the fans 400 can be respectively mounted in the two fan mounts 50. When the fans 400 run to discharge air, they can blow not only toward the heat dissipation tube set 30 but also toward the lower tank body part 112 projecting downward toward the heat dissipation tube set 30, thus improving the heat dissipation efficiency of the present invention.

[0015] Although a specific embodiment of the invention has been described in detail for illustrative purposes, various changes and improvements may be made without departing from the spirit and scope of the invention. Accordingly, the invention is not to be limited except by the appended claims.

Claims

[1] An integrated liquid cooling heat dissipation device comprising a liquid cooling radiator (100), a liquid cooling head (200), and a liquid pump (300), wherein the liquid cooling radiator (100) comprises a first liquid tank (10), a second liquid tank (20), and a heat dissipation tube set (30), wherein the heat dissipation tube set (30) comprises a plurality of first tubes (31), a plurality of second tubes (32), and a plurality of cooling fins (33), wherein the first tubes (31) and the second tubes (32) are flat metal tubes, the respective two opposite ends of which are connected to the first liquid tank (10) and the second liquid tank (20), respectively, wherein the cooling fins (33) are arranged outside the first tubes (31) and the second tubes (32), respectively,wherein the liquid cooling head (200) is connected to a side outside a bottom wall of the second liquid container (20), wherein the liquid pump (300) is arranged in the first liquid container (10), wherein:, the first liquid container (10) comprises a first container body (11), a first container lid (12) and a first partition wall (13), wherein the first container body (11) is formed integrally into an upper container body part (111) and a lower container body part (112), wherein the upper container body part (111) has a thickness (L1) and a width (W1) that are greater than those of the lower container body part (112), wherein an upper end of the upper container body part (111) is recessed into a first upper chamber (113), wherein the lower container body part (112) projects downward beyond a lower end of the upper container body part (111), wherein the first upper chamber (113) has a bottom surface that forms a first lower chamber (114) and is recessed into the lower container body part (112), wherein the lower container body part (112) has a bottom wall that is provided with a plurality of first pipe connections (115), which are connected to the first lower chamber (114), wherein the first container lid (12) covers the upper end of the upper container body part (111), wherein the first partition wall (13) is inserted into the first upper chamber (113) and the first lower chamber (114) to divide the first upper chamber (113) and the first lower chamber (114) into a liquid inlet chamber (116) and a liquid outlet chamber (117); the second liquid container (20) comprises a second container body (21) and a second container lid (22), wherein an upper end of the second container body (21) is inserted into a second chamber (23), wherein the second chamber (23) is divided into a cold liquid chamber (24) and a hot liquid chamber (25) is divided, wherein the cold liquid chamber (24) and the hot liquid chamber (25) are each connected to the liquid cooling head (200), wherein the second container lid (22) covers the upper end of the second container body (21), wherein an upper wall of the second container lid (22) is provided with a plurality of second pipe connections (26) which are connected to the cold liquid chamber (24) and the hot liquid chamber (25), the first tubes (31) and the second tubes (32) are inserted with their respective upper ends into the first tube receptacles (115) and with their respective opposite lower ends into the second tube receptacles (26); the upper tank body part (111) of the first liquid tank (10) and the second liquid tank (20) each have a front and a rear end which protrude from the opposite front and rear sides of the heat dissipation pipe set (30), respectively, so that a concave fan installation space (40) is formed at the front and rear sides of the liquid cooling radiator (100). [2] The integrated liquid cooling heat dissipation device according to claim 1, wherein the upper tank body part (111) and the lower tank body part (112) of the first tank body (11) form a T-shaped tank body in the side view; the first upper chamber (113) and the first lower chamber (114) form a T-shaped chamber in the side view part. [3] The integrated liquid cooling heat dissipation device according to claim 2, wherein the first tank lid (12) has a liquid pump seat (121) located on an inner surface thereof and protruding into the first tank body (11); wherein an outer wall of the first tank lid (12) is recessed with a liquid pump cavity (122) extending to the liquid pump seat (121), and wherein the liquid pump (300) is loaded into the liquid pump cavity (122) from the outside of the first tank lid (12). [4] The integrated liquid cooling heat dissipation device according to claim 3, wherein the liquid pump seat (121) comprises a liquid inlet hole (123) located on one of its end surfaces and connected to the liquid pump cavity (122) and the liquid inlet chamber (116), and a projection (124) located on one of its side walls and connected to the liquid pump cavity (122) and the liquid outlet chamber (117), the projection (124) being provided with a liquid outlet hole (125) connecting the liquid pump cavity (122) and the liquid outlet chamber (117); the first partition wall (13) being provided with a gap (131) conforming to the contour of the projection (124) and closely connected to the surrounding surface of the projection (124). [5] The integrated liquid cooling heat dissipation device according to claim 4, wherein the upper container body part (111) comprises at least one first rib (118) located on a bottom wall thereof and protruding into the first upper chamber (113); the first housing cover (12) comprises at least one second rib (126) located on an upper wall thereof and protruding into the first upper chamber (113). [6] The integrated liquid cooling heat dissipation device according to any one of claims 1 to 5, wherein the first container lid (12) comprises a liquid injection hole (127) located on an upper wall thereof and connected to the first upper chamber (113), and a sealing member (128) detachably inserted into the liquid injection hole (127). [7] The integrated liquid cooling heat dissipation device according to any one of claims 1 to 6, wherein the second container body (21) has an air heat insulation space (27) arranged in the second chamber (23), the air heat insulation space (27) consisting of a hot liquid partition wall (271) and a cold liquid partition wall (272) arranged in the second chamber (23) and separated by a distance, the air heat insulation space (27) dividing the second chamber (23) into the cold liquid chamber (24) and the hot liquid chamber (25), the cold liquid chamber (24) having a lower housing wall provided with a cold liquid inlet (241) for flowing a working liquid from the cold liquid chamber (24) to the liquid cooling head (200), the hot liquid chamber (25) having a lower housing wall is provided with a hot liquid outlet (251),so that the working fluid can flow from the liquid cooling head (200) back to the hot fluid chamber (25). [8] The integrated liquid cooling heat dissipation device according to claim 7, wherein the second container body (21) is a quadrangular pyramid having a wider upper end and a narrower lower end in a front side thereof; the second chamber (23) is a conical chamber corresponding to the quadrangular pyramid. [9] The integrated liquid cooling heat dissipation device according to any one of claims 1 to 8, further comprising two fan mounts (50) respectively combined on two opposite sides of the heat dissipation tube sets (30). [10] The integrated liquid cooling heat dissipation device according to claim 9, further comprising at least one fan (400) arranged in the fan installation space (40) and fixed to the two fan brackets (50).

Images