Solder nozzle compensation unit, solder nozzle changing system, soldering system, process

The soldering nozzle handling system addresses the inefficiencies of manual and inflexible automated systems by using a compensation unit and drive mechanisms for precise and flexible automated nozzle handling, ensuring reliable and efficient nozzle replacement.

DE102023125672B4Active Publication Date: 2025-07-31ERSA GMBH & CO KG
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Patent Information

Application Number
DE102023125672
Authority / Receiving Office
DE · DE
Patent Type
Patents
Current Assignee / Owner
Filing Date
2023-09-21
Publication Date
2025-07-31
Estimated Expiration
2043-09-21

AI Technical Summary

Technical Problem

Existing soldering nozzle handling systems require manual replacement, which is time-consuming and requires special protective measures due to the liquid solder, and existing automated systems need precise alignment, making them inflexible and inefficient.

Method used

A handling system with a soldering nozzle compensation unit that compensates for axial, angular, and radial offsets, combined with a soldering nozzle changing system featuring a pivot drive, linear drive, and magazine drive, allowing for flexible and precise handling of nozzles with modular construction and compensation modules.

Benefits of technology

Enables reliable, efficient, and automated handling of soldering nozzles with greater tolerance, allowing for quick and precise replacement without the need for manual intervention and precise alignment, enhancing system flexibility and safety.

✦ Generated by Eureka AI based on patent content.

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Abstract

Handling system (390) for handling soldering nozzles (12) with a soldering nozzle compensation unit (400) extending along a linear axis (30), the soldering nozzle compensation unit (400) comprising: - a first coupling section (402) for arranging on a handling device (38) and a second coupling section (404) for arranging on a nozzle gripper (22), - a first compensation module (406) for compensating for an axial offset and / or an angular offset with respect to the linear axis (30), and - a second compensation module (412) for compensating for a radial offset with respect to the linear axis (30).
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Claims

[1] Handling system (390) for handling soldering nozzles (12) with a soldering nozzle compensation unit (400) extending along a linear axis (30), the soldering nozzle compensation unit (400) comprising: - a first coupling section (402) for arranging on a handling device (38) and a second coupling section (404) for arranging on a nozzle gripper (22), - a first compensation module (406) for compensating an axial offset and / or an angular offset with respect to the linear axis (30), and - a second compensation module (412) for compensating a radial offset with respect to the linear axis (30). [2] Handling system (390) according to claim 1, wherein the first compensation module (406) comprises a first base part (408) and a first compensation part (410), wherein the first compensation part (410) is arranged to be movable relative to the first base part (408) from a first base position along at least one first compensation direction into a first compensation position. [3] Handling system (390) according to claim 2, wherein the first compensating part (410) is mounted in the first base part (408) by means of a joint bearing (418), in particular a pendulum bearing. [4] Handling system (390) according to claim 2 or 3, wherein the first compensation module (406) has first spring means (422) for returning the first compensation part (406) from the first compensation position to the first home position. [5] Handling system (390) according to one of claims 2 to 4, wherein the first spring means (422) comprise compression springs (424), wherein in particular the compression springs (424) are arranged along a circular line running perpendicular to the linear axis (30). [6] Handling system (390) according to one of claims 2 to 5, wherein the first coupling section (402) forms the first base part (408) of the first compensation module (406). [7] Handling system (390) according to one of the preceding claims, wherein the second compensation module (412) has a second base part (414) and a second compensation part (416), wherein the second compensation part (416) is arranged to be movable relative to the second base part (414) from a second base position along at least one second compensation direction into a second compensation position, and wherein in particular the second compensation module (412), in particular the second base part (414) and / or the second compensation part (416), is mounted in a floating manner. [8] Handling system (390) according to claim 7, wherein the second compensation module (412) has a return drive for returning the second compensation part from the second compensation position to the second home position. [9] Handling system (390) according to one of claims 7 or 8, wherein the second coupling section forms the second compensating part of the second compensating module. [10] Handling system (390) according to one of the preceding claims, further comprising a nozzle gripper arranged on the soldering nozzle compensation unit with a gripping receptacle extending along the linear axis for gripping a soldering nozzle. [11] Soldering nozzle changing system (10) for changing soldering nozzles (12) on a soldering system (14), in particular on a selective soldering system, the soldering nozzle changing system (10) comprising: - a nozzle magazine (20) with magazine locations (62) for providing soldering nozzles (12), - a handling system (390) according to one of claims 1 to 9, - a nozzle gripper (22) arranged on the handling system (390) with a gripping receptacle (68) extending along a nozzle axis (67) for gripping a soldering nozzle (12), - a pivoting drive (24) for pivoting the nozzle gripper (22) about a pivot axis (26) between a receiving position for receiving the soldering nozzle (12) from the nozzle magazine (20) and a transfer position for transferring the soldering nozzle (12) to a soldering pot (16) of the soldering system (14), - a linear drive (28) for displacing the handling system (390) and the nozzle gripper (22) along a linear axis (30) between a receiving position assigned to the nozzle magazine (20) and a transfer position assigned to the soldering pot (16), and - a magazine drive (32) for rotating the nozzle magazine (20) about a magazine axis (34) so that at least one of the magazine locations (62) can be rotated into a storage location. [12] Soldering system with a soldering pot with a nozzle holder for receiving a soldering nozzle, wherein the nozzle holder has a centering mandrel for centering the soldering nozzle when it is placed on it, and with a handling system (390) according to one of claims 1 to 10 or a soldering nozzle changing system according to claim 11. [13] A method for handling a soldering nozzle by means of a handling system (390) according to any one of claims 1 to 10, comprising the following steps: a) moving the handling system (390) to the nozzle magazine or to a soldering pot, in particular according to claim 11; b) gripping the soldering nozzle by means of the handling system (390), wherein at least one compensating part of the soldering nozzle compensating unit is displaced into a compensating position and fixed there, c) method of the handling system (390); d) returning at least one compensating part to a basic position; e) Transferring the soldering nozzle to the soldering pot or to the nozzle magazine. [14] Method according to claim 13, wherein, when the soldering nozzle is transferred to the soldering pot or to the nozzle magazine, a centering mandrel arranged on the soldering pot or on the nozzle magazine centers the soldering nozzle and displaces at least one compensating part of the soldering nozzle compensating unit into the compensating position.

Citation Information

Patent Citations

  • soldering machine

    DE102016121160A1

  • Method for operating a soldering system

    DE102017114801A1

  • Selective soldering system for selective wave soldering of printed circuit boards with gripping unit for changing soldering nozzles

    DE102020124111A1

  • Soldering system and use

    US20220016724A1