Power electronics module and assembly method

Abstract

A power electronics module is proposed, comprising a first printed circuit board with a top layer of electrically conductive material, a middle layer of electrically non-conductive material, and a bottom layer of electrically conductive material, and a second printed circuit board with a top layer of electrically conductive material, a middle layer of electrically non-conductive material, and a bottom layer of electrically conductive material, and a high-side strand with at least one power semiconductor configured as a high-side switch and a low-side strand with at least one power semiconductor configured as a low-side switch, wherein the first printed circuit board is arranged opposite the second printed circuit board such that the top layers face each other, and wherein the top layer of the first printed circuit board serves as an AC phase connection, and wherein the top layer of the second printed circuit board is structured such thatthat it serves as the DC negative and DC positive terminals, and the power semiconductors formed as high-side switches and the power semiconductors formed as low-side switches are arranged such that their AC terminals point towards and are thus contacted with the top layer of the first circuit board, and the DC terminals of the power semiconductors point towards and are thus contacted with the top layer of the second circuit board.

Description

[0001] The present invention relates to the field of electromobility, in particular electronic modules.

[0002] The use of electronic modules, such as power electronics modules, in motor vehicles has increased significantly in recent decades. This is due on the one hand to the need to improve fuel economy and vehicle performance, and on the other hand to advances in semiconductor technology. In order to provide the energy, a large number of electronic components are required. These components can be used to create bridge circuits (e.g. half-bridges), for example semiconductor power switches, which are also known as power semiconductors. Power semiconductors can be installed in complete power electronics modules (also known as power modules) or as discrete components. Power electronics modules have a circuit board with power semiconductors arranged on it, which are electrically contacted with one another on the circuit board for power and control purposes.

[0003] The switching power semiconductors of the electronic modules must be actively cooled to dissipate switching and conduction losses. For easy connection, the power semiconductors are arranged in a 2D plane, with the phase tap (AC) located centrally between the power semiconductors. This arrangement allows for easy manufacturing in a single plane, but results in a suboptimal commutation cell.

[0004] To increase the cooling performance, concepts have already been developed in which cooling is also established via the top side of the power semiconductors 3.1, 3.2 by means of a heat sink 5, 6, as in Fig. 1. The usual 2D layout is retained in the chip arrangement, and a thermal connection of the top-side structure of the power semiconductors 3.1, 3.2 is provided, thereby achieving improved cooling. For this purpose (in the case of MOSFETs), a load connection must be established between the source S of the high-side power semiconductor 3.1 and the drain D of the low-side power semiconductor 3.2. This can be achieved via wire bonds, as shown in Fig. 1 with the curved lines. However, this design requires space on the power semiconductor 3.1 serving as the high-side (which limits the thermal conduction connection upwards) and the part of the circuit board, usually formed as a DBC circuit board 1, that serves as the AC phase (AC tap). Alternatively, the load path can be partially routed in the upper DBC circuit board 2, but this requires additional components to implement the connection to the lower DBC circuit board 1. An example of such double-sided cooled electronic modules can be found in US 10,211,133 B2.

[0005] In addition to optimizing the heat path, optimizing the electrical properties within a power electronics module is also of great importance. However, the well-known approach of double-sided cooled electronic modules does not reflect electrical optimization.

[0006] The invention is therefore based on the object of providing a power electronics module by means of which improved cooling, in particular double-sided cooling, of the power semiconductors and electrical optimization can be achieved.

[0007] This problem is solved by the features of the independent claims. Advantageous embodiments are the subject of the dependent claims.

[0008] A power electronics module is proposed, comprising a first circuit board with an uppermost layer of electrically conductive material, a middle layer of electrically non-conductive material and a lowermost layer of electrically conductive material, and a second circuit board with an uppermost layer of electrically conductive material, a middle layer of electrically non-conductive material and a lowermost layer of electrically conductive material, and a high-side branch with at least one power semiconductor formed as a high-side switch and a low-side branch with at least one power semiconductor formed as a low-side switch, wherein the first circuit board is arranged opposite the second circuit board such that the uppermost layers face each other, and wherein the uppermost layer of the first circuit board serves as an AC phase connection, and wherein the uppermost layer of the second circuit board is structured such thatthat it serves as a DC minus and a DC plus connection, and the power semiconductors formed as high-side switches and the power semiconductors formed as low-side switches are arranged such that their AC connections point to the topmost layer of the first circuit board and are contacted therewith, and DC connections of the power semiconductors point to the topmost layer of the second circuit board and are contacted therewith.

[0009] In one embodiment, one spacer element is provided for each power semiconductor, and wherein the spacer elements of the power semiconductors formed as high-side switches are arranged between the uppermost layer of the first circuit board and the power semiconductor and are electrically and thermally contacted with the first circuit board and the power semiconductor, and wherein the spacer elements of the power semiconductors formed as low-side switches are arranged between the uppermost layer of the second circuit board and the power semiconductor and are electrically and thermally contacted with the first circuit board and the power semiconductor, or wherein the spacer elements of the power semiconductors formed as low-side switches are arranged between the uppermost layer of the first circuit board and the power semiconductor and are electrically and thermally contacted with the second circuit board and the power semiconductor.

[0010] In one embodiment, the power electronics module further comprises at least one signal / control rail per power semiconductor, wherein at least one signal / control connection is provided on the side of each power semiconductor to be contacted with one of the DC connections, which is contacted with the associated signal / control rail by means of connecting elements.

[0011] In one embodiment, the top layer of the second circuit board is structured such that a first partial area thereof serves as a contact area for an AC rail to be contacted therewith, and wherein an AC spacer is provided on the contact area and arranged such that it serves as an AC connecting element to the top layer of the first circuit board.

[0012] In one embodiment, the top layer of the second circuit board is structured such that a second portion thereof serves as a signal / control terminal, and wherein a spacer is provided on the signal / control terminal and arranged such that it serves as a connecting element to a signal / control terminal on the top layer of the first circuit board.

[0013] In one version, the top layer of the first circuit board is laid over the entire surface of the power semiconductors.

[0014] In one version, a heat sink is arranged at the bottom layer of each circuit board and is thus thermally coupled.

[0015] In one embodiment, the circuit board is a DBC circuit board or an AMB circuit board or an IMS circuit board.

[0016] Furthermore, an assembly method for the power electronics module is provided, wherein in a first step the power semiconductors are applied to the associated printed circuit board, and in a further, third step connections of the load connections and the signal / control connections to associated rails are made by means of one or two lead frames, and in a fourth step the printed circuit boards are combined by the two upper layers of the printed circuit boards with the power semiconductors arranged thereon being applied to one another and connected at intended areas.

[0017] In one embodiment, the power electronics module is surrounded by a potting compound in a fifth step and the lead frame(s) are removed in a sixth step so that only the rails and contact elements connected to the signal / control connections protrude from the potting compound.

[0018] In one embodiment, in a second step provided between the first and third steps or after the third step, spacer elements are applied to the power semiconductors and / or to the top layer of the printed circuit boards.

[0019] Furthermore, an electric drive of a vehicle is provided, comprising a power electronics component which has at least the described power electronics module.

[0020] Further features and advantages of the invention will become apparent from the following description of exemplary embodiments of the invention, with reference to the figures of the drawing, which illustrate details of the invention, and from the claims. The individual features can be implemented individually or in combination in a variant of the invention.

[0021] Preferred embodiments of the invention are explained in more detail below with reference to the accompanying drawings. Fig. 1 shows a sectional view of a basic structure of a power electronics module with double-sided cooling according to the prior art. Fig. 2 shows a sectional view of a basic structure of a power electronics module with double-sided cooling according to an embodiment of the present invention. Fig. 3 shows a sectional view of a basic structure of a power electronics module with double-sided cooling according to an alternative embodiment of the present invention. Fig. 4 shows a view of a basic structure of a power electronics module with double-sided cooling according to an embodiment of the present invention. Fig. 5 shows a view of a basic structure of an upper circuit board with leadframe according to an embodiment of the present invention. Fig. 6 shows a view of a basic structure of an upper circuit board without a leadframe according to an embodiment of the present invention. Fig. 7 shows a view of a basic structure of a lower circuit board with leadframe according to an embodiment of the present invention. Fig. 8 shows a view of a basic structure of a lower circuit board without a leadframe according to an embodiment of the present invention. Fig. 9 shows a view of a basic structure of a power electronics module with double-sided cooling with leadframe according to an embodiment of the present invention. Fig. 10 shows a view of a basic structure of an upper circuit board according to another embodiment of the present invention. Fig. 11 shows a view of a basic structure of a lower circuit board without leadframe and with (AC / DC / signal / control) rails according to the further embodiment of the present invention. Fig. 12 shows a view of a basic structure of a lower circuit board with leadframe according to the further embodiment of the present invention. Fig. 13 shows a view of a basic structure of a power electronics module with double-sided cooling with leadframe according to the further embodiment of the present invention. Fig. 14 shows a view of a basic structure of a power electronics module with double-sided cooling without leadframe according to the further embodiment of the present invention. Fig. 15 shows a process flow for manufacturing a power electronics module with double-sided cooling according to an embodiment of the present invention.

[0022] In the following descriptions of the figures, the same elements or functions are provided with the same reference symbols.

[0023] According to the invention, a double-sided cooling system for power electronics modules 100 for use in power electronics components, e.g., inverters (DC / AC inverters), in the automotive sector is provided, in which the electrical commutation is improved, the thermal connection is optimized, and a simple structure of the power electronics module 100 is provided.

[0024] A power electronics module 100 typically provides one phase (with AC phase tap) of an inverter. To create a three-phase inverter, three of the described power electronics modules 100 are interconnected. Various methods are known for this, which will not be described further here. Since similar power electronics modules 100 are typically interconnected, the description is limited to a single power electronics module 100.

[0025] A based on the Fig. The double-sided cooled power electronics module 100 described below (see Figures 2 et seq.) has two circuit boards 1, 2 having at least three layers, wherein an uppermost layer 10, 20 is made of electrically conductive material, a middle layer 11, 21 is made of electrically non-conductive material, e.g., ceramic, and a lowermost layer 12, 22 is made of electrically conductive material. One such circuit board is, for example, a DBC circuit board. DBC stands for direct bonded copper, although the abbreviation DCB (direct copper bonded) can also be used. However, an AMB (Active Metal Brazing) or an IMS (Insulated Metal Substrate) circuit board can also be used, as long as it has at least the three layers described.

[0026] According to the invention, the top layer 10 of the first circuit board 1 serves as the AC contact (AC). The top layer 20 of the second circuit board 2 serves as the DC phase contact (DC- and DC+). Furthermore, after final assembly, the two circuit boards 1, 2 face each other with their two top layers 10, 20, i.e., the two top layers 10, 20 face each other.

[0027] Furthermore, the power electronics module 100 has at least one half-bridge, i.e. at least one power semiconductor 3.1 arranged in a high-side branch and formed as a high-side switch, hereinafter referred to as high-side switch 3.1 for short, and one power semiconductor 3.2 arranged in a low-side branch and formed as a low-side switch, hereinafter referred to as low-side switch 3.2 for short.

[0028] The low-side branch, i.e., the low-side switch(es) 3.2, are arranged on the top layer 10 of the first circuit board 1 such that their AC phase contact (in the case of MOSFETs, the drain D; in the case of IGBTs, the collector corresponding to the drain) is electrically connected to the top layer 10. Thus, their DC contact (in the case of MOSFETs, the source; in the case of IGBTs, the emitter corresponding to the source) points toward the top layer 20 of the second circuit board 2.

[0029] In a preferred embodiment, a spacer element 4 is arranged on the DC contact (here S) of the low-side switch 3.2 and is electrically and thermally contacted both with the DC contact (here S) and with the uppermost layer 20 of the second printed circuit board 2.

[0030] In an alternative version (in Fig. 3), in the low-side phase, the DC contact (in the case of MOSFETs, the source S, in the case of IGBTs, the emitter corresponding to the source) is directly (fully contacted) with the uppermost layer 20 of the second circuit board 2, and the spacer element 4 is arranged over its entire surface on the AC phase contact (in the case of MOSFETs, the drain D, in the case of IGBTs, the collector corresponding to the drain) and is contacted with the uppermost layer 10 of the first circuit board 1. This design is less advantageous because it is more difficult to manufacture to provide contact for the signal / control terminals 7 described below.

[0031] The high-side branch, i.e. the high-side switch(es) 3.1, are arranged on the uppermost layer 20 of the second printed circuit board 2 such that their DC contact (in the case of MOSFETs the drain D, in the case of IGBTs the collector corresponding to the drain) is electrically contacted with the uppermost layer 20. Thus, their AC phase contact (in the case of MOSFETs the source S, in the case of IGBTs the emitter corresponding to the source) points towards the uppermost layer 10 of the first printed circuit board 1. In one embodiment, a spacer element 4 is arranged on the AC phase contact of the high-side switch 3.1 (here S) and is electrically and thermally contacted both with the AC phase contact (here S) and with the uppermost layer 10 of the first printed circuit board 1.

[0032] In the embodiments shown, the low-side strand is arranged on the first circuit board 1 before final assembly and the high-side strand is arranged on the second circuit board 2 before final assembly.

[0033] The spacers 4 of both strands (high-side and low-side) are made of an electrically and thermally conductive material such as copper. High-side switches 3.1 and low-side switches 3.2 generally have the same external dimensions, and the spacers 4 advantageously have the same height, so that the two circuit boards 1 and 2 can be connected to each other with as little tolerance as possible. Tolerance compensation can also be achieved when joining the two circuit boards 1 and 2, e.g., by applying solder.

[0034] Signal / control terminals 7 are provided on the AC phase contact side of each power semiconductor 3.1, 3.2, so that the entire surface of the power semiconductor 3.1, 3.2 is not occupied by the AC phase contact (load connection for AC). Therefore, the spacer elements 4 are formed such that they do not occupy the entire surface of the respective power semiconductor 3.1, 3.2, but leave an area free where signal / control terminals 7, rather than load terminals, are provided. These signal / control terminals 7 can be a gate terminal or a Kelvin source terminal. Thus, at least in the height of the spacer elements 4, there is space for contacting the signal / control terminals 7 using contact elements such as wire bonds. A cooling element (not shown) can also be provided on this free space as an intermediate element, enabling additional heat dissipation (heat spreading).

[0035] Depending on the design and assembly method, the signal / control connections 7 can be provided as part of the printed circuit board 1, 2 or as external connections, as described below with reference to the assembly or manufacturing method.

[0036] The printed circuit boards 1, 2 act not only as electrical contact, but also as thermal conductors to dissipate heat to a heat sink 5, 6 arranged on the bottom layer 12, 22 and thus to cool the power semiconductors 3.1 and 3.2.

[0037] According to the invention, the low-side switch 3.2 is rotated 180 degrees relative to the high-side switch 3.1 (mirrored horizontally), so that the AC terminals of both power semiconductors 3.1 and 3.2 point in the same direction, i.e., toward the top layer 10 of the first circuit board 1, and are thus electrically and thermally contacted (depending on the design, also via spacers 4). Furthermore, the DC terminals of both power semiconductors 3.1 and 3.2 point in the same direction, i.e., toward the top layer 20 of the second circuit board 2, and are thus electrically and thermally contacted (depending on the design, also via spacers 4). This arrangement enables an optimized commutation cell compared to the prior art through the three-dimensional arrangement of DC+, AC phase, and DC-. Furthermore, the design enables optimized double-sided cooling of all power semiconductors 3.1, 3.2, since the connecting spacer elements 4 enable not only the power flow but also a thermal flow to the second circuit board 2.

[0038] The direct (full-surface) connection of the drain D (in the case of MOSFETs) of the individual power semiconductors 3.1 and 3.2 with the uppermost layer 10, 20 of the respective printed circuit board 1, 2 leads to a simplified production of the power electronics module 100 compared to the prior art, since, among other things, wire bonds or connecting elements can be saved.

[0039] As already indicated, depending on the assembly or manufacturing process, the signal / control terminals 7, as well as the load terminals (DC and AC), can be arranged slightly differently, as described below. The sequence of the assembly or manufacturing process according to a design is shown in Fig. 15 is shown schematically.

[0040] In a first embodiment of the assembly or manufacturing method, a power electronics module 100 results, as shown in Fig. 4. For this purpose, in a first step S1, the power semiconductors 3.1 and 3.2 are applied to the corresponding printed circuit boards 1, 2 (lowside on the first printed circuit board 1 and highside on the second printed circuit board 2). Advantageously, the power semiconductors 3.1 and 3.2 are sintered on (not soldered). Thus, the DC contacts of the high-side switches 3.1 (drain D in the case of MOSFETs) are applied to the top layer 20 of the printed circuit board 2, and the AC phase contacts of the low-side switches 3.2 (drain D in the case of MOSFETs) are applied to the top layer 10 of the printed circuit board 1, where they are thermally and electrically connected. The top layer 10 of the printed circuit board 1 remains completely intact and is therefore not structured, as in Fig. 5 and Fig. 6 can be clearly seen. The top layer 20 of the circuit board 2 is structured to electrically separate DC plus and DC minus, as shown in Fig. 7 and Fig. 8 is clearly visible.

[0041] In a second step S2, the spacer elements 4 are applied either to the power semiconductors 3.1 and 3.2 or to the circuit board 1, 2. Alternatively, the spacer elements 4 can also be applied after or during the third step S3, advantageously after the signal / control terminals 7 have been connected to the corresponding rails (signal / control rail 8) using connecting elements. The order depends on the connecting elements used.

[0042] In a third step S3, the connections of the DC and AC load terminals and the signal / control terminals 7 to the corresponding rails (DC rail DC-S, AC rail AC-S, signal / control rail 8) are established. This is done using so-called leadframes LF1, LF2. In the described assembly or manufacturing process of the first embodiment, two leadframes LF1, LF2 are required, resulting in two partial printed circuit boards 1, 2 with corresponding connections. As shown in Fig. 5, the first leadframe LF1 carries the AC rail AC-S and the signal / control rails 8 of the low-side switches 3.2, thus belonging to the first printed circuit board 1. In Fig. Figure 6 shows the first printed circuit board 1 with the AC rail AC-S and the signal / control rails 8 after removing the unnecessary sections of the leadframe LF1 to show the structure. As shown in Fig. As shown in Figure 7, the second leadframe LF2 carries the DC rails DC-S of DC-Plus (DC+) and DC-Minus (DC-) and the signal / control rails 8 of the high-side switches 3.1, thus belonging to the second circuit board 2. In Fig. Figure 8 shows the first circuit board 2 with the DC rails DC-S and the signal / control rails 8 after removing the unnecessary sections of the leadframe LF2 to show the structure.

[0043] In a fourth step S4, the two leadframes LF1, LF2 with the (populated) circuit boards 1, 2 connected thereto are then combined by applying the two upper layers 10, 20 of the circuit boards 1, 2 with the power semiconductors 3.1, 3.2 arranged thereon and the spacer elements 4 to one another and connecting them to one another at designated areas, e.g. by sintering. These areas are either the (free) sides of the spacer elements 4 opposite the power semiconductors 3.1, 3.2 (in the preferred embodiment, as shown in Fig. 2), or a (free) side of the spacer elements 4 opposite the power semiconductors 3.1 and the DC contacts of the power semiconductors 3.2 (in the preferred embodiment, as shown in Fig. 3). In Fig. Figure 9 shows an oblique view of the combined printed circuit boards 1, 2 with leadframes LF1, LF2. The power electronics module 100 resulting from the removal of the unnecessary parts of the leadframes LF1, LF2 (with the outwardly facing load rails DC-S, AC-S and signal / control rails 8) is shown in Fig. 4 shown in an oblique view.

[0044] In a fifth step S5, the power electronics module 100 is surrounded by a potting compound (not shown) to provide protection against environmental influences. This potting compound also serves to hold the signal / control rails 8 in position, since they would otherwise hang freely on the connections (e.g., wire bonds) after removal of the leadframes LF1, LF2. After potting, the leadframes LF1, LF2 are then removed in a final step S6. The potting compound surrounds the power electronics module 100 such that only parts of the load rails DC-S, AC-S and the signal / control rails 8 protrude outside the potting compound after removal of the leadframes LF1, LF2.

[0045] As in Fig. As can be clearly seen in Figure 4, there is a gap between the DC rails DC-S and the circuit board 1 and between the AC rail AC-S and the circuit board 2 after joining, so that no contact is created here.

[0046] In a second embodiment of the assembly or manufacturing method, a power electronics module 100 results, as shown in Fig. 14. For this purpose, the power semiconductors 3.1 and 3.2 are applied to the corresponding circuit board 1, 2, advantageously sintered, as in the first embodiment.

[0047] As in Fig. 10, the uppermost layer 10 of the upper circuit board 1 remains full-surface in the area of ​​the power semiconductors 3.1, 3.2, but is / will be structured at an edge area in order to provide islands 101 for the (electrical) contacting of the signal / control terminals 7 of the power semiconductors 3.2 arranged on the uppermost layer 10 of the first circuit board 1 with the signal / control rails 8 provided in a later step. Spacer elements 4 are also applied to the power semiconductors 3.1 and 3.2 or to the circuit board 1, 2, as in the first embodiment.

[0048] As in Fig. As can be clearly seen in Figure 11, the top layer 20 of the lower circuit board 2 is structured so that the load connections (DC and AC) and all signal / control connections 7 can be provided.

[0049] In this version, additional spacer elements 4 are applied to the top layer 20 of the lower circuit board 2, to which the AC phase tap AC (island area as part of the top layer 20, as in Fig. 11 clearly visible) and the signal / control connections 7 are located.

[0050] Alternatively, all spacer elements 4 of the two circuit boards 1, 2 can also be applied only after the signal / control connections 7 have been connected to the corresponding rails (signal / control rail 8). The order depends on the connecting elements used.

[0051] Due to the spacer elements 4 on the lower circuit board 2, only one leadframe LF1 is required in this assembly or manufacturing process, since all load rails (DC-S and AC-S), as well as all signal / control rails 8 are connected on the lower circuit board 2, as shown in Fig. 12 clearly visible. Fig. 12 shows the lower circuit board 2 with leadframe LF1 arranged on it, Fig. 11 shows the circuit board 2 with the leadframe LF1 removed, i.e. with load rails (DC-S and AC-S), as well as all signal / control rails 8, but without the upper circuit board 1. Fig. 13 shows the combined printed circuit boards 1, 2, which, as in all versions, point towards each other with their uppermost layers 10, 20 and the power semiconductors 3.1, 3.2 arranged thereon, with the leadframe LF1 still present. Fig. Figure 14 shows the combined printed circuit boards 1, 2 without the leadframe LF1. As with the previous version, the potting compound surrounding the power electronics module 100 is not shown here, so only parts of the DC-S, AC-S load rails, and the signal / control rails 8 protrude beyond the potting compound.

[0052] In order to provide contact between the AC busbars AC-S and the signal / control busbars 8 and the upper circuit board 1, in this embodiment, spacers 70 are arranged in the area of ​​the islands 201 (part of the uppermost layer 20) on the lower circuit board 2, on which the signal / control busbars 8 are placed. Furthermore, an AC spacer 9 is provided in the area of ​​the AC contact of the AC busbars AC-S (uppermost layer 20). These spacers 70, 9 are made of an electrically and thermally conductive material such as copper and serve to establish contact (in particular electrical) between components of the first and second circuit boards 1, 2. They therefore serve as connecting elements. Advantageously, the spacer elements 4 (of the power semiconductors 3.1 and 3.2) are made of the same material as the spacers 70, 9.

[0053] The spacers 70, 9 can be attached to the circuit boards 1, 2 in a separate process step, or together with other components, e.g. together with the spacer elements 4.

[0054] The additional spacers 70, 9 on the lower circuit board 2 (the topmost layer 20 thereof) make it possible to use only a single leadframe LF1. The spacers 70, 9 allow the AC phase AC and the signal / control contacts 7 of the circuit board 1 to be electrically (and thermally) contacted by joining the two circuit boards 1, 2 together, as shown in Fig. 13 and Fig. 14. As shown in Fig. As can be clearly seen in Figure 14, there is a gap between the DC rails DC-S and the circuit board 1 after joining, so that no contact is created here.

[0055] In all designs, the connections (electrical / thermal contacts) are created by sintering. This avoids the use of solders, which require different melting temperatures. However, it may be possible to use a solder for a final connection to compensate for tolerances. Alternatively, bonded connections can be created using technologies such as "Hook and Loop Welding."

[0056] In all versions, heat sinks 5, 6 are provided on the lowest layer 12, 22 of the printed circuit board 1, 2 in order to dissipate the waste heat to the outside of the power electronics module 100.

[0057] A power electronics module 100 within the scope of this invention serves to operate a motor vehicle powered by an electric motor (with accumulator). The motor vehicle is, in particular, a commercial vehicle such as a truck or a bus, or a passenger car. The power electronics module comprises a DC / AC inverter. It can also comprise or be a part of an AC / DC rectifier, a DC / DC converter, a transformer, and / or another electrical converter or a part of such a converter. In particular, the power electronics module 100 serves to supply current to an electric machine, for example, an electric motor and / or a generator. A DC / AC inverter preferably serves to generate a multi-phase alternating current from a direct current generated by means of a DC voltage from an energy source, such as a battery. List of reference symbols 100 power electronics module 1 first circuit board 10 top layer 101 Island / Contact Area 11 middle position 12 lowest layer 2 second circuit board 20 top layer 201 Island / Contact Area 21 middle position 22 lowest layer 3.1 High-side power semiconductors 3.2 Low-side power semiconductors S Source (Emitter) D Drain (collector) 4 spacer element 5, 6 heat sink 7 Signal / control connection (gate / Kelvin source connection) 70 spacers 8 Signal / control rail 9 AC spacers AC rail AC AC connection AC-S AC rail DC DC connection (DC minus or DC plus) DC-S DC rail LF1 Leadframe 1 LF2 Leadframe 2 QUOTES CONTAINED IN THE DESCRIPTION

[0000] This list of documents submitted by the applicant was generated automatically and is included solely for the convenience of the reader. This list is not part of the German patent or utility model application. The DPMA assumes no liability for any errors or omissions. Cited patent literature

[0000] US 10,211,133 B2

[0004]

Claims

[1] Power electronics module (100), comprising - a first printed circuit board (1) with an uppermost layer (10) made of electrically conductive material, a middle layer (11) made of electrically non-conductive material and a lowermost layer (12) made of electrically conductive material, and a second printed circuit board (2) with an uppermost layer (20) made of electrically conductive material, a middle layer (21) made of electrically non-conductive material and a lowermost layer (22) made of electrically conductive material, and - a high-side branch with at least one power semiconductor (3.1) formed as a high-side switch and a low-side branch with at least one power semiconductor (3.2) formed as a low-side switch, wherein - the first printed circuit board (1) is arranged opposite the second printed circuit board (2) in such a way that the uppermost layers (10, 20) face each other, and wherein the uppermost layer (10) of the first printed circuit board (1) serves as an AC phase connection (AC), and wherein the uppermost layer (20) of the second printed circuit board (2) is structured in such a way that it serves as a DC negative and a DC positive connection (DC), and - the power semiconductors (3.1) formed as high-side switches and the power semiconductors (3.2) formed as low-side switches are arranged such that their AC connections point to the uppermost layer (10) of the first printed circuit board (1) and are contacted therewith, and DC connections of the power semiconductors (3.1, 3.2) point to the uppermost layer (20) of the second printed circuit board (2) and are contacted therewith. [2] Power electronics module (100) according to claim 1, wherein one spacer element (4) is provided for each power semiconductor (3.1, 3.2), and wherein - the spacer elements (4) of the power semiconductors (3.1) formed as high-side switches are arranged between the uppermost layer (10) of the first printed circuit board (1) and the power semiconductor (3.1) and are electrically and thermally contacted with the first printed circuit board (1) and the power semiconductor (3.1), and wherein - the spacer elements (4) of the power semiconductors (3.2) formed as low-side switches are arranged between the uppermost layer (20) of the second circuit board (2) and the power semiconductor (3.2) and are electrically and thermally contacted with the first circuit board (1) and the power semiconductor (3.2), or wherein the spacer elements (4) of the power semiconductors (3.2) formed as low-side switches are arranged between the uppermost layer (10) of the first circuit board (1) and the power semiconductor (3.2) and are electrically and thermally contacted with the second circuit board (2) and the power semiconductor (3.2). [3] Power electronics module (100) according to one of the preceding claims, further comprising at least one signal / control rail (8) per power semiconductor (3.1, 3.2), wherein on the side of each power semiconductor (3.1, 3.2) to be contacted with one of the DC connections, at least one signal / control connection (7) is provided, which is contacted with the associated signal / control rail (8) by means of connecting elements. [4] Power electronics module (100) according to one of the preceding claims, wherein the uppermost layer (20) of the second printed circuit board (2) is structured such that a first partial area thereof serves as a contact area for an AC rail (AC-S) to be contacted therewith, and wherein an AC spacer (9) is provided on the contact area and arranged such that it serves as an AC connecting element to the uppermost layer (10) of the first printed circuit board (1). [5] Power electronics module (100) according to claim 4, wherein the uppermost layer (20) of the second circuit board (2) is structured such that a second partial area thereof serves as a signal / control connection (7), and wherein a spacer (70) is provided on the signal / control connection (7) and arranged such that it serves as a connecting element to a signal / control connection (7) on the uppermost layer (10) of the first circuit board (1). [6] Power electronics module (100) according to one of the preceding claims, wherein the uppermost layer (10) of the first printed circuit board (1) is guided over the entire surface of the power semiconductors (3.1, 3.2). [7] Power electronics module (100) according to one of the preceding claims, wherein a heat sink (5, 6) is arranged on the lowermost layer (12, 22) of each printed circuit board (1, 2) and is thermally coupled thereto. [8] Power electronics module (100) according to one of the preceding claims, wherein the circuit board (1, 2) is a DBC circuit board or an AMB circuit board or an IMS circuit board. [9] Assembly method for a power electronics module according to one of claims 1 to 8, wherein in - in a first step (S1) the power semiconductors (3.1, 3.2) are applied to the associated printed circuit board (1, 2), and - in a further, third step (S3), connections of the load terminals (DC, AC) and the signal / control terminals (7) to the associated rails (AC-S, DC-S, 8) are established by means of one or two lead frames (LF1, LF2), and - in a fourth step (S4) the printed circuit boards (1, 2) are combined with one another by applying the two upper layers (10, 20) of the printed circuit boards (1, 2) with the power semiconductors (3.1, 3.2) arranged thereon to one another and connecting them at intended areas. [10] Assembly method according to claim 9, wherein in a fifth step (S5) the power electronics module (100) is surrounded by a potting compound and in a sixth step (S6) the lead frame(s) (LF1, LF2) are removed so that only the rails (AC-S, DC-S, 8) and contact elements connected to the signal / control terminals (7) protrude from the potting compound. [11] Assembly method according to claim 9 or 10, wherein in a second step (S2) provided between the first and third step (S1, S3) or after the third step (S3) spacer elements (4) are applied to the power semiconductors (3.1, 3.2) and / or to the uppermost layer (10, 20) of the printed circuit boards (1, 2). [12] Electric drive of a vehicle, comprising a power electronics component which has at least one power electronics module (100) according to one of claims 1 to 8.

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