Device for cooling replaceable electronic assemblies of a motor vehicle and a method for removing at least one electronic assembly

Abstract

The invention relates to a device for cooling replaceable electronic assemblies (12) of a motor vehicle and a method for removing a replaceable electronic assembly, wherein the device (10) comprises several replaceable electronic assemblies (12), at least one cooler (18) arranged between at least two electronic assemblies (12) for cooling the two electronic assemblies (12), at least one holding device (16) that interacts with the cooler (18), and furthermore at least one locking element (14) which allows the cooler (18) to be displaceable relative to the holding device (16), wherein the locking element (14) is configured such that, in the locked state, the cooler (18) exerts a force on at least one of the electronic assemblies (12) to prevent removal, and that, in the unlocked state, the cooler (18) does not exert a force on at least one of the electronic assemblies (12).to allow the removal of at least one of the electronic assemblies (12).

Description

[0001] The invention relates to a device for cooling replaceable electronic components of a motor vehicle and to a method for removing at least one electronic component according to the preamble of the independent claims. State of the art

[0002] From EP 2114116 A1, a hybrid cooling system for a printed circuit board unit for a machine tool is known, comprising at least one heat sink which is designed such that it can absorb heat from surface-mounted power components on the printed circuit board unit, wherein the heat sink has a region for liquid cooling and a region for air cooling, so that it can dissipate heat to both a gaseous and a liquid cooling medium.

[0003] The invention is based on the object of providing lightweight yet robust systems of replaceable electronic assemblies, particularly in the automotive sector. This object is achieved by the features of the independent claims. Disclosure of the invention

[0004] The device according to the features of independent claim 1 has the advantage that particularly effective heat dissipation takes place due to the large heat transfer surfaces between the electronic assembly and the cooler. A rigid housing is unnecessary, further reducing the weight of the device. This is particularly advantageous in the automotive sector. When replacing an electronic assembly, the coolers can remain in the cooling circuit, eliminating the need to drain them or install leak-proof couplings. Furthermore, the device as a whole does not need to be disassembled when replacing individual electronic assemblies.

[0005] In a practical development, multiple coolers are provided, one of the coolers being designed to dissipate heat from one side, in particular the top side, of the electronic assembly, and the other cooler being designed to dissipate heat from another side, in particular the bottom side, of this electronic assembly. This allows for further improved cooling. Furthermore, greater layout freedom results because electronic assemblies requiring cooling can be arranged on both sides of the circuit board typically present in the electronic assembly and can be cooled from both sides.

[0006] In an expedient development, at least one holding element, in particular a spreading element and / or in particular a clamp, is provided, which can be arranged between two coolers. This holding element can further stabilize the device when the coolers are moved, thus allowing the replacement of an electronic module without completely dismantling the device. Particularly preferably, the holding element is designed to allow removal of the replaceable electronic module in the unlocked state.

[0007] In a practical development, the locking element is designed as a quick-release fastener. This allows for the use of proven locking mechanisms that are characterized by speed and ease of use.

[0008] In a practical development, the holding device is designed as a rod and / or rotatable device. This further simplifies the device while maintaining good stability and ease of use.

[0009] In a practical development, the cooler at least partially encloses the holding device. This makes it particularly easy to lock or unlock the cooler's movement.

[0010] In a practical development, the holding device has at least one coding or at least one cam, which interacts with a counterpart, in particular at least one recess, on the cooler or cooler plate. This allows for the targeted locking or unlocking of different coolers to be accomplished particularly easily with just one locking element and just one holding device.

[0011] In a practical refinement, the cooler, when locked, exerts a force on the electronic assembly perpendicular to the direction of removal. Due to the large surfaces of the cooler and electronic assembly, which engage for heat dissipation, the electronic assembly is securely fixed to prevent unwanted movement.

[0012] In a practical development, at least one heat-conducting element is arranged between the cooler and the replaceable electronic assembly. Flexible elements such as cushions or pads, or even foils, especially graphite foils, are particularly preferred. This further improves the heat transfer between the electronic assembly and the cooler.

[0013] In addition, a method for removing at least one electronic assembly from a motor vehicle is provided, characterized by the steps: a. Arranging a holding element to the side of the electronic assemblies so that it interacts with a cooler adjacent to the electronic assembly to be removed, b. Release of the locking element and / or actuation of the holding device, c. Move at least one cooler so that this cooler no longer exerts force on the electronic assembly to be removed, d. Removal of the electronic assembly to be removed.

[0014] This makes it particularly easy to replace an electronic module, for example to upgrade to the latest hardware of the electronic module.

[0015] Further useful developments arise from further dependent claims and from the description. Short description of the drawing

[0016] They show: Fig. 1 is a schematic view of a device consisting of several interchangeable electronic assemblies arranged between corresponding coolers, one in the locked state and the other in two different spread-out states, Fig. 2 a schematic view of a device according to Fig. 1 in the locked state and in two different clamped states and Fig. 3 a schematic view of a locked device, wherein the desired interchangeable electronic assembly is released by setting a specific angle of the connecting rods before opening the lock. Embodiment of the invention

[0017] The invention is illustrated schematically using several embodiments and is described in detail below with reference to the drawing.

[0018] Fig. Figure 1 schematically shows a view in the insertion direction of several directly interconnected, replaceable electronic assemblies 12 designed as plug-in units. The electronic assemblies 12 have a substantially rectangular shape. The electronic assembly 12 can comprise a housing, in particular a heat-conducting housing, which encloses electronic components to be cooled, which can be arranged on a circuit board or printed circuit board. The housing of the electronic assembly 12 is in heat-conducting contact with the electronic component(s) to be cooled.

[0019] At least one cooler 18 is arranged directly adjacent to the respective electronic assemblies 12. In the exemplary embodiment, the replaceable electronic assembly 12 is cooled from both sides by coolers 18 arranged in thermal contact with the electronic assembly 12. A heat-conducting element 22 can be arranged between the cooler 18 and the respective surface of the replaceable electronic assembly 12 for improved heat transfer between the electronic assembly 12 and the cooler 18. The heat-conducting element 22 can be, for example, a flexible heat-conducting component such as a cushion, a pad, a heat-conducting film, etc. The coolers 18 are plate-shaped or, in particular, rectangular. The coolers 18 extend along the entire surface, or top and bottom, of the replaceable electronic assembly 12.Coolers 18 and electronic assemblies 12 are stacked, so that a cooler 18 arranged between them cools both the underside of a replaceable electronic assembly 12 and the top side of an electronic assembly 12 arranged below it. Several coolers 18 and replaceable electronic assemblies 12 form a device 10.

[0020] The device 10 comprises at least one laterally arranged holding device 16. In the exemplary embodiment, at least two opposite laterally arranged holding devices 16 are provided at the respective corners of the cooler 18. The holding device 16 is rod-shaped in the exemplary embodiment. The holding device 16 is enclosed on the outer sides of the cooler 18 or cooler plates 18 by the cooler 18 or the respective cooler plate 18, so that in principle a relative movement of a cooler 18 with respect to the holding device 16 or rod is possible. However, the cooler 18 can be firmly fixed to the holding device 16 via locking elements 14. This state is shown in the left illustration of the Fig. 1. As a result, the coolers 18 exert corresponding forces on the interposed electronic assemblies 12, preventing them from being removed. Such forces can be applied, for example, by springs (not specifically shown) in conjunction with a lever system such as a quick-release fastener, etc. However, other variants of applying a clamping force, such as a screw connection or the like, are also conceivable.

[0021] In the embodiment according to Fig. 1, the locking elements 14 remain clamped. The expansion elements 24 push the stack apart at the correct location to remove a drawer or electronic assembly 12. The expansion element 24 allows the respective cooler 18 to be moved relative to the holding device 16, such as the rod. The expansion element 24 is used to set the desired distance between two coolers 18 so that this distance is sufficient for an electronic assembly 12 located between the coolers 18 to be removed.

[0022] The embodiment according to Fig. 2 differs essentially from that of the Fig. 1 in that clamps 26 are now provided as a holding element for setting a desired distance. These clamps 26 hold the cooler 18 and electronic assembly(s) 12 together where they are supposed to remain together, namely before the opening of the locking element 14 (as in the two right-hand illustrations of the Fig. 2). After opening the locking element 14, the stack opens only where the replacement is to be carried out. The clamps 26 hold together those coolers 18 and the electronic assemblies 12 enclosed by these coolers 18 that are not to be removed, in order to enable displacement to increase the distance between coolers 18, as indicated by the double arrow, surrounding an electronic component 12 to be removed. Where the clamps 26 are located, the cooler 18 and the inserts or electronic assemblies 12 remain clamped.

[0023] In Fig. 3 shows how, by setting a specific angle (rotation at a specific angle around the rotational axis of the holding device 16) of the holding devices 16 before opening the locking element 14, in particular a quick-release fastener, the corresponding level of the stack of replaceable electronic modules 12 is released. In the middle of the Fig. 3 shows the actuating means for locking the holding device 16 with the respective codings 32 or cams. To the right of these, the corresponding counterparts 28 of the coolers 18 are shown, which interact with the corresponding codings 32 or cams of the actuating means 30. The corresponding actuating means are moved into the desired position by a rotary movement 40. The coding 32 with the corresponding counterparts 28 is selected such that the desired coolers 18 can be controlled so that they are movable relative to one another in order to be able to remove the respective desired electronic modules 12.

[0024] The coolers 18 and the replaceable electronic assemblies 12 form a stack clamped from the outside. The cooling intermediate plates or coolers 18 remain as part of the housing, for example, in the vehicle, while the replaceable electronic assemblies 12 or inserts can be easily replaced individually and independently of one another without any work on the cooling system.

[0025] The device 10 stacks coolers 18 and electronic assemblies 12 on top of each other, thus utilizing the large surfaces on the cover or base of the electronic assembly 12 for heat transfer. Springs or other means compress the sandwich-like system, thus ensuring good thermal connection between the respective coolers 18 and the respective replaceable electronic assemblies 12, as well as good mechanical stability. A replacement mechanism (holding element such as expansion element 24, clamp 26) nevertheless allows individual electronic assemblies 12 to be replaced without having to disassemble the entire system. A mechanism is used that presses the coolers 18 together, but also allows individual removal for changing the replaceable electronic assemblies 12.

[0026] The device 10 comprising coolers 18 and replaceable electronic assemblies 12 is connected to one another by holding devices 16, particularly preferably by rods and springs. The replaceable electronic assemblies 12 are positioned between the coolers 18. The stacked electronic assemblies 12 and cooler 18 are pressed together using a locking element 14, for example, designed as a lever system. Springs and mechanical quick-release fasteners as possible locking elements 14 ensure appropriate contact pressure and locking. Flexible cushions, pads, or graphite foils, for example, can be used as the heat-conducting element 22 between the cooler 18 and the respective housing of the electronic assembly 12.

[0027] If individual electronic assemblies 12 are to be replaced, the sandwich-like device 10 must be opened at the correct location, the electronic assembly 12 removed, and any remaining portions of the heat-conducting element 22 removed. A new electronic assembly 12, including the heat-conducting element 22 if necessary, is then inserted. A mechanism is provided for this purpose, allowing the stack to be opened at the appropriate location. For this purpose, there are Fig. 1 and Fig. Two different designs. For example, the spreading element 24 can be provided, which opens the spring-loaded stack at the correct location. Alternatively, locking devices such as clamps 26, etc., can be provided, which hold the stack together only where it is intended to remain together. After opening the locking device 18, the stack opens only where it is to be exchanged. In the variant according to Fig. 1 with at least one expansion element 24, cooler 18 and replaceable electronic modules 12 are pressed together by springs. To replace the replaceable electronic module 12, the corresponding point is pushed apart with a spreading mechanism or expansion element 24 as shown in Fig. 1 shown.

[0028] In the embodiment according to Fig. 2 with corresponding locking devices, there are different variants. Either all electronic modules 12 that are not to be replaced are locked with corresponding clamps 26 as in Fig. 2 shown.

[0029] Alternatively, the angular position of the holding devices 16 in the corners can be adjusted by means of a corresponding rotary movement 40, which electronic assembly 12 is released, compare Fig.3. This is realized by a type of bayonet lock and corresponding counterparts 28 in the coolers 18 or cooling plates, which then, depending on the angle, unlock a corresponding level of the stack of electronic modules 12 by being able to be moved.

[0030] The individual coolers 18 are connected to each other by tubing that does not need to be disconnected but provides sufficient clearance for the cooling plates to move, particularly perpendicular to the insertion direction of the electronic assemblies 12. The electrical connection can be established via tolerance-compensating connectors on a rear circuit board (for example, perpendicular to the insertion direction of the replaceable electronic assemblies 12) or via a rear circuit board attached after clamping. Wiring between the replaceable electronic assemblies 12 is also conceivable.

[0031] The electronic assembly 12 can, for example, comprise one or more printed circuit boards or an electronic unit. The electronic assemblies 12, with associated electronic components, for example, enclosed in a housing, comprise, in particular, high-performance computer cores that perform particularly computationally intensive functions in the motor vehicle. These can include, for example, autonomous or semi-autonomous driving functions, infotainment, communication interfaces between different bus systems (Ethernet, CAN, LIN, etc.) or gateway functionalities, certain security applications for granting authorization, for example, to access the motor vehicle from outside, or other operations in the motor vehicle that require particularly high computing power.The electronic components are particularly preferably high-performance processors, multi-core processors, or highly integrated circuits (SoC, System-on-Chip), which are characterized by high power dissipation. However, other applications outside the automotive sector are also conceivable. The interchangeability of the electronic assemblies 12 also allows for later retrofitting with current hardware, as electronic assemblies 12 can be easily replaced. The replaceable electronic components of the respective electronic assembly 12 must be cooled by the cooler 18 to dissipate the power dissipation. The housing of the electronic assembly 12 must be designed such that it is thermally conductively connected to the electronic component to be cooled.

[0032] As can be seen from the figures, the arrangement does not require an additional housing enclosing all the electronic assemblies 12. This allows for a particularly compact and lightweight arrangement, as the otherwise conventional housing is eliminated. This is achieved by directly connecting the interchangeable electronic assemblies 12 via coolers 18, without mounting them in a separate housing. QUOTES CONTAINED IN THE DESCRIPTION

[0000] This list of documents submitted by the applicant was generated automatically and is included solely for the convenience of the reader. This list is not part of the German patent or utility model application. The DPMA assumes no liability for any errors or omissions. Cited patent literature

[0000] EP 2114116 A1

[0002]

Claims

[1] Device for cooling replaceable electronic assemblies (12) of a motor vehicle, comprising a plurality of replaceable electronic assemblies (12), at least one cooler (18) which is arranged between at least two electronic assemblies (12) for cooling the two electronic assemblies (12), comprising at least one holding device (16) which interacts with the cooler (18), further comprising at least one locking element (14) which enables the cooler (18) to be displaced relative to the holding device (16), wherein the locking element (14) is designed such that, in the locked state, the cooler (18) applies a force to at least one of the electronic assemblies (12) in order to prevent removal, and such that, in the unlocked state, the cooler (18) does not apply any force to at least one of the electronic assemblies (12) in order to enable removal of at least one of the electronic assemblies (12). [2] Device according to claim 1,characterized by that a plurality of coolers (18) are provided, wherein one of the coolers (18) is designed to dissipate heat from one side, in particular the top side, of the electronic assembly (12), and wherein the further cooler (18) is designed to dissipate heat from another side, in particular the bottom side, of this electronic assembly (12). [3] Device according to one of the preceding claims, characterized by that at least one holding element, in particular a spreading element (24) and / or in particular a clamp (26), is provided, which can be arranged between two coolers (18). [4] Device according to one of the preceding claims, characterized by that the holding element (24,26) is designed to enable removal of the replaceable electronic assembly (12). [5] Device according to one of the preceding claims, characterized bythat the holding element (24,26) is designed as a spreading element (24) in order to enable removal of the replaceable electronic assembly (12) spread open by the spreading element (24) when the locking element (14) is closed. [6] Device according to one of the preceding claims, characterized by in that the holding element (24, 26) is designed as a clamp (26) in order to continue to clamp at least one non-replaceable electronic assembly (12) when the locking element (14) is open, in order to only allow removal of at least one non-clamped replaceable electronic assembly (12) when the locking element (14) is open. [7] Device according to one of the preceding claims, characterized by that the locking element (14) is designed as a quick-release fastener. [8] Device according to one of the preceding claims, characterized by that the holding device (16) is rod-shaped and / or rotatable. [9] Device according to one of the preceding claims, characterized by that the cooler (18) at least partially encloses the holding device (16). [10] Device according to one of the preceding claims, characterized by that the holding device (16) has at least one coding (32) or at least one cam, which interacts with a counterpart (28), in particular at least one recess, on the cooler (18) or cooler plate. [11] Device according to one of the preceding claims, characterized by that the cooler (18) in the locked state exerts a force on the electronic assembly (12) transversely to the removal direction of the electronic assembly (12). [12] Device according to one of the following claims, characterized by that at least one heat-conducting element (22) is arranged between the cooler (18) and the replaceable electronic assembly (12). [13] Device according to one of the preceding claims, characterized bythat the cooler (18) is substantially plate-shaped and / or that the cooler (18) is designed as a flexible cooler (18) which expands with increasing internal pressure, particularly preferably as a cooling cushion. [14] Method for removing at least one electronic assembly (12) of a device (10) according to one of the preceding claims, characterized by the steps: a. Arranging a holding element (24, 26) laterally of the electronic assemblies (12) so that it interacts with a cooler (18) adjacent to the electronic assembly (12) to be removed, b. releasing the locking element (14) and / or actuating the holding device (16), c. Moving at least one cooler (18) so that this cooler (18) no longer exerts any force on the electronic assembly (12) to be removed, d. Removal of the electronic assembly to be removed (12).

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