Sensor devices and associated manufacturing processes

Abstract

A sensor device includes a magnetic field sensor chip having a front side, a back side, and a side surface connecting the front side and the back side. The magnetic field sensor chip has a sensor element arranged on the front side, which is configured to detect a magnetic field component running parallel to the front side. Furthermore, the magnetic field sensor chip has a plurality of first contact pads arranged on the front side, wherein all of the first contact pads arranged on the front side are arranged at an edge of the magnetic field sensor chip lying between the front side and the side surface.

Description

Technical field

[0001] The present disclosure relates to sensor devices and methods for manufacturing such sensor devices. background

[0002] Magnetic field sensors can be used in a variety of technical applications, for example, in consumer products such as mobile phones. Such applications generally require small dimensions of the sensors used. Due to the ongoing miniaturization of electronic components, increasingly stringent requirements are being placed on the size and accuracy of magnetic field sensors. Manufacturers and developers of sensor devices are constantly striving to improve their products. It may be of particular interest to provide particularly small sensors that deliver high measurement accuracy despite their miniaturization. Brief description

[0003] Various aspects relate to a sensor device. The sensor device comprises a magnetic field sensor chip having a front side, a back side, and a side surface connecting the front side and the back side. The magnetic field sensor chip comprises a sensor element arranged on the front side, which is designed to detect a magnetic field component running parallel to the front side. The magnetic field sensor chip further comprises a plurality of first contact pads arranged on the front side, wherein all of the first contact pads arranged on the front side are arranged at an edge of the magnetic field sensor chip lying between the front side and the side surface.

[0004] Various aspects relate to a sensor device. The sensor device comprises a printed circuit board with a mounting surface and a magnetic field sensor chip in the form of a bare die with a front side, a back side, and a side surface connecting the front and back sides. The magnetic field sensor chip is mounted on the mounting surface of the printed circuit board, and the side surface of the magnetic field sensor chip faces the mounting surface. The magnetic field sensor chip comprises a sensor element arranged on the front side, which is designed to detect a magnetic field component running parallel to the front side of the magnetic field sensor chip and perpendicular to the mounting surface of the printed circuit board.

[0005] Various aspects relate to a method for manufacturing a sensor device. The method comprises forming a plurality of sensor elements on a front side of a semiconductor wafer, wherein the sensor elements are configured to detect a magnetic field component running parallel to the front side. The method further comprises forming a plurality of first contact pads on the front side of the semiconductor wafer. The method further comprises singulating the semiconductor wafer into a plurality of magnetic field sensor chips. Each magnetic field sensor chip comprises a sensor element arranged on a front side of the magnetic field sensor chip and a plurality of first contact pads arranged on the front side, wherein all of the first contact pads arranged on the front side are arranged at an edge of the magnetic field sensor chip lying between the front side and a side surface of the magnetic field sensor chip. Short description of the drawings

[0006] Devices and methods according to the disclosure are explained in more detail below with reference to drawings. Like reference numerals may designate like or similar components. The features of the various illustrated examples may be combined with one another, provided they are not mutually exclusive, and / or they may be selectively omitted unless described as absolutely necessary. Fig. 1 shows a perspective view of a sensor device 100 according to the disclosure. Fig. 2 shows a perspective view of a sensor device 200 according to the disclosure. Fig. 3 shows a side view of a sensor device 300 according to the disclosure. Fig. 4 shows a perspective view of a sensor device 400 according to the disclosure. Fig. 5 shows a perspective view of a sensor device 500 according to the disclosure. Fig. 6 contains the Fig. 6A and Fig. 6B, showing steps for manufacturing a sensor device 600 according to the disclosure. Fig. 7 contains the Fig. 7A to 7C, which show steps for manufacturing a sensor device 700 according to the disclosure. Fig. 8 contains the Fig. 8A to 8C, which show steps for manufacturing a sensor device 800 according to the disclosure. Fig. 9 shows a side view of a sensor device 900 according to the disclosure. Fig. 10 shows a flowchart of a method for manufacturing a sensor device according to the disclosure. Detailed description

[0007] The sensor device 100 of the Fig. 1 can have a magnetic field sensor chip 2 with a front side 4, a back side 6, and a side surface 8 connecting the front side 4 and the back side 6. The magnetic field sensor chip 2 can have a sensor element 10 arranged on the front side 4. The sensor element 10 can be designed to detect a magnetic field component running parallel to the front side 4. The magnetic field sensor chip 2 can further have a plurality of contact pads 12 arranged on the front side 4. All of the contact pads 12 arranged on the front side 4 can be arranged at an edge 14 of the magnetic field sensor chip 2 lying between the front side 4 and the side surface 8.

[0008] The magnetic field sensor chip 2 can contain or be made from any semiconductor material, for example, silicon. The magnetic field sensor chip 2 can, in particular, be a "bare die," which does not necessarily have to be arranged in a housing, but can be further processed and used without such a housing. In this description, the terms "die," "chip," "semiconductor die," and "semiconductor chip" can be used interchangeably.

[0009] In one example, the magnetic field sensor chip 2 may be a discrete semiconductor chip. A discrete semiconductor chip may correspond to a semiconductor component that is designed to perform an elementary electronic function and cannot be divided into separate, independently functional components. In other words, a discrete semiconductor chip may correspond to a semiconductor component that has only one basic function and not several complex functions, as may be the case, for example, with an integrated semiconductor circuit. In the present case, a basic function of the magnetic field sensor chip 2 can be seen in detecting the magnetic field present at the location of the sensor element 10 and outputting a measurement signal based thereon. In other examples, however, the magnetic field sensor chip 2 does not necessarily have to be a discrete semiconductor chip, i.e.The magnetic field sensor chip 2 can also be designed for additional functions.

[0010] The magnetic field sensor chip 2 can have one or more sensor elements 10 arranged on the front side. For the sake of simplicity, a single sensor element 10 is shown in the example shown. The sensor element 10 can be designed to detect a magnetic field present at the location of the sensor element 10. More precisely, the sensor element 10 can be designed to detect a magnetic field component running parallel to the front side 4. The magnetic field sensor chip 2 can therefore be an "in-plane" magnetic field sensor. In this context, the sensor element 10 can, for example, be sensitive in the x-direction, i.e., be designed to detect a magnetic field component in the x-direction. Optionally, the sensor element 10 (or further sensor elements) can also be sensitive with respect to other spatial directions.Measurement signals based on the detected magnetic field components can be output from the sensor device 100 to external components (not shown), for example via the contact pads 12.

[0011] In general, the magnetic field sensor chip 2 or its sensor element 10 does not have to be limited to a specific sensor technology. The sensor element 10 can, for example, be a Hall sensor element, a magnetoresistive sensor element, a vertical Hall sensor element, or a fluxgate sensor element. A magnetoresistive xMR sensor element can be an AMR (Anisotropic Magneto-Resistive) sensor element, a GMR (Giant Magneto-Resistive) sensor element, or a TMR (Tunnel Magneto-Resistive) sensor element. In the example shown, the sensor element 10 can, in particular, contain or correspond to a TMR (Tunnel Magneto-Resistive) sensor element, i.e., the magnetic field sensor chip 2 can correspond to a (in particular linear) TMR sensor chip.

[0012] The sensor element 10 can, for example, be implemented as a resistance bridge (not shown) with, for example, four resistors. The resistors can be, for example, TMR resistors, which can be arranged in the form of a bridge circuit, such as a Wheatstone bridge. The sensor element 10 can be integrated into a circuit of the magnetic field sensor chip 2. In some examples, such a circuit can additionally and optionally include signal amplification, analog-to-digital conversion, digital signal processing, and / or offset and temperature compensation. In addition to the components of the sensor element 10, components for signal amplification and / or analog-to-digital conversion can be considered part of the sensor element 10 or not.

[0013] The contact pads 12 can be designed to provide an electrical connection between external components (e.g. a circuit board) and electronic structures within the magnetic field sensor chip 2. In the example shown, the magnetic field sensor chip 2 can have four contact pads 12 arranged on its front side 4. However, this number is exemplary, not restrictive, and can differ in other examples. The contact pads 12 can be, for example, (in particular planar) solderable metal coatings, each of which can have a layer stack with one or more metal and / or metal alloy layers. In particular, such a metal stack can end with a solderable surface, i.e. the exposed surface of the contact pad 12 can be solderable. The solderable surface or the solderable layer stack can contain or comprise at least one of the following materials:They can be made of: NiSn, NiPAu, NiAu, NiPPdAu, NiMoP, AuSn, pure Sn, Cu (with surface protection), CuSn, or similar. The metal layers can be sputtered or electroplated.

[0014] The contact pads 12 with solderable metal coatings can be used in particular to solder the sensor device 100 onto a printed circuit board, as is exemplified in the Fig. 6A and Fig. 6B. In principle, the solderable metallizations can also be used when the sensor device 100 is attached to a printed circuit board via an adhesive, as shown by way of example in the Fig. 7A to 7C. In such a case, the contact pads 12 may in particular have a metal surface optimized for a reliable adhesive connection, such as AgPd.

[0015] All of the contact pads 12 arranged on the front side 4 of the magnetic field sensor chip 2 can be arranged at the edge 14. Due to such an arrangement of the contact pads 12, the magnetic field sensor chip 2 can be mounted on a printed circuit board in a favorable manner, as is exemplified in connection with the Fig. 4 and Fig. 5 is shown and described. In the example shown, the Fig. 1, the contact pads 12 can be arranged substantially linearly along the edge 14. In particular, no further contact pads are arranged at the other three edges of the front side 4 or in the center of the front side 4. In the illustrated case, the contact pads 12 can be arranged between the sensor element 10 and the edge 14. The sensor element 10 is thus not arranged at the edge 14, but can be spaced from it.

[0016] The magnetic field sensor chip 2 can optionally have one or more further contact pads arranged on its rear side 6, which in the Fig. 1 may not be recognizable due to the selected perspective. In one example, an arrangement of such second contact pads on the back 6 may be identical to an arrangement of the contact pads 12 on the front 4. Such an arrangement of contact pads on the front and back of a magnetic field sensor chip is shown by way of example in Fig. 5. Alternatively, the back side 6 of the magnetic field sensor chip 2 may not be structured and, for example, may be (in particular completely) metallized. An arrangement of a magnetic field sensor chip with a metallized back side on a printed circuit board is shown by way of example in Fig. 4 shown.

[0017] The sensor device 200 of the Fig. 2 may include some or all of the features of the sensor device 100 of the Fig. 1. In the example shown, the sensor element 10 can be arranged at the edge 14 and between the contact pads 12. In comparison to the example of the Fig. 1, by such an arrangement of the sensor element 10, a dimension of the magnetic field sensor chip 2 can be reduced in the x-direction and increased in the y-direction.

[0018] The sensor device 300 of the Fig. 3 may include some or all of the features of previously described sensor devices. The magnetic field sensor chip 2 may include contact pads 12 on both its front side 4 and its back side 6. Furthermore, the magnetic field sensor chip 2 may include solder caps 16 arranged on the contact pads 12. The solder caps 16 may optionally be arranged on a solderable surface of the respective contact pad 12. A solder cap 16 may contain or be made of at least one of the following materials: pure Sn, SnAg, SnAgCu, SnPb, In-based solders, or the like. The solder caps 16 may be manufactured, for example, by means of stencil printing, electroplating (both followed by a melting step), or a dipping process.

[0019] The sensor device 400 of the Fig. 4 may include some or all of the features of previously described sensor devices. The sensor device 400 may include a printed circuit board (or PCB or substrate) 18 having a mounting surface 20. The printed circuit board 18 may or may not be considered part of the sensor device 400. A magnetic field sensor chip 2 may be mounted on the mounting surface 20, wherein the side surface 8 of the magnetic field sensor chip 2 may face the mounting surface 20. A plurality of contact pads 12 may be arranged on the front side 4 of the magnetic field sensor chip 2 and electrically connected to the printed circuit board 18. In the example shown, the contact pads 12 may extend substantially the entire height of the front side 4 in the z-direction. In another example, the front side 4 may be higher than the contact pads 12, measured in the z-direction. In the illustrated case, the sensor elements 10 may be arranged between the contact pads 12.The back side 6 of the magnetic field sensor chip 2 can be covered (in particular completely) with a metallization 22.

[0020] The contact pads 12 can be connected to the mounting surface 20 via a solder material 24. More precisely, the contact pads 12 can be mechanically and electrically connected to electrical contacts 26 of the circuit board 18 via the solder material 24. Such a connection can be made possible, in particular, by arranging all of the contact pads 12 arranged on the front side 4 near the edge 14 of the magnetic field sensor chip 2. By arranging the contact pads 12 in this way, a distance between the mounting surface 20 and all of the contact pads 12 on the front side 4 can be reduced, and the connection can thus possibly be made possible in the first place. If, on the other hand, the contact pads 12 were spaced apart from the edge 14, a connection would not be possible or at least would be made more difficult.

[0021] In an analogous manner, the metallization 22 on the backside 6 of the magnetic field sensor chip 2 can be connected to the mounting surface 20 via a solder material 24. The metallization 22 can be mechanically and (optionally) electrically connected, for example, to a metal layer 28 of the circuit board 18 via the solder material 24. The metal layer 28 can, for example, be an electrical contact of the circuit board 18.

[0022] The contact pads 12 arranged on the front side 4 can, in principle, be sufficient to provide an electrical and mechanical connection between the magnetic field sensor chip 2 and the printed circuit board 18. However, a one-sided connection poses the risk of a "tombstone" effect during a soldering process, which can lead to a tilt or tilting of the magnetic field sensor chip 2. By providing an additional connection between the rear side 6 and the printed circuit board 18, the risk of a "tombstone" effect can be avoided or at least reduced.

[0023] As in connection with the example of Fig. 1, the magnetic field sensor chip 2 can be an in-plane magnetic field sensor, ie a sensor element 10 of the magnetic field sensor chip 2 can be designed to detect a magnetic field component running parallel to the front side 4. Since the magnetic field sensor chip 2 in the example of Fig. 4 is mounted with its side surface 8 on the mounting surface 20 of the printed circuit board 18, the front side 4 can run substantially perpendicular to the mounting surface 20. Thus, the sensor element 10 can be designed to detect a magnetic field component running perpendicular to the mounting surface 20. In other words, by mounting the magnetic field sensor chip 2 rotated by 90 degrees with its (intrinsic) in-plane functionality (or by its vertical orientation), the functionality of an out-of-plane magnetic field sensor can be provided.

[0024] By choosing a chip layout with a high aspect ratio, in the example of the Fig. 4, a particularly small height h of the magnetic field sensor chip 2 in the z-direction can be provided. The height h can be reduced to a smallest value of approximately 50 µm micrometers. The height h can thus, for example, be less than approximately 100 µm or less than approximately 90 µm or less than approximately 80 µm or less than approximately 70 µm or less than approximately 60 µm or less than approximately 55 µm. Minimum dimensions of the magnetic field sensor chip 2 in the x-direction and the y-direction can be approximately 50 µm and approximately 400 µm, respectively. A minimum footprint of the magnetic field sensor chip 2 can thus be approximately 50 µm × 400 µm.

[0025] Based on the above, sensor devices according to the disclosure can provide the functionality of an out-of-plane magnetic field sensor with a particularly low overall height. Out-of-plane magnetic field sensors can often be used in consumer products such as mobile phones. Such applications regularly require particularly small dimensions of the sensors used therein. The sensor devices described herein can thus be used in particular in said products.

[0026] Conventional sensor devices with out-of-plane functionality may have increased dimensions compared to the sensor devices according to the disclosure because they utilize an additional chip package and / or an additional magnetic flux concentrator to change a direction of the magnetic field component to be sensed. In contrast, the sensor devices according to the disclosure described herein require neither a magnetic flux concentrator nor an additional chip package to provide out-of-plane functionality.

[0027] The sensor device 500 of the Fig. 5 may have some or all of the features of previously described sensor devices. In addition to the contact pads 12 on the front side 4, the magnetic field sensor chip 2 may have a plurality of further contact pads 12 arranged on its rear side 6. In the example shown, an arrangement of these further contact pads 12 on the rear side 6 may be identical to an arrangement of the contact pads 12 on the front side 4. Such an arrangement of the contact pads 12 may achieve symmetrical melting and wetting behavior during a soldering process. The contact pads 12 of the magnetic field sensor chip 2 may be mechanically and electrically connected to electrical contacts 26 of the printed circuit board 18 via a solder material 24.

[0028] The Fig. 6A and Fig. 6B illustrate steps for manufacturing a sensor device 600 according to the disclosure. More specifically, a side view of a mounting of a magnetic field sensor chip 2 on a circuit board 18 is shown. In the example shown, the magnetic field sensor chip 2 may have contact pads 12 on both its front side 4 and its back side 6.

[0029] In a first step (not shown), a solder paste (or soft solder) 30 can be selectively applied to the mounting surface 20 of the circuit board 18, for example, by a printing process. The solder paste 30 can be deposited, in particular, on electrical contacts 26 of the circuit board 18.

[0030] In the Fig. 6A, the magnetic field sensor chip 2 can be arranged with its side surface 8 on the mounting surface 20 of the printed circuit board 18, for example, using a pick-and-place process. The contact pads 12 can be aligned with the selectively deposited solder paste 30. Due to their arrangement at the edge 14 of the magnetic field sensor chip 2, the contact pads 12 can contact the solder paste 30.

[0031] In the Fig. 6B, the solder paste 30 may transition to a molten state during a reflow process and, after cooling, form permanent solder connections 24 of the sensor device 600.

[0032] The Fig. 7A to 7C illustrate steps for manufacturing a sensor device 700 according to the disclosure. More specifically, a side view of a mounting of a magnetic field sensor chip 2 on a circuit board 18 is shown. In the example shown, the magnetic field sensor chip 2 may have contact pads 12 on both its front side 4 and its back side 6.

[0033] In the Fig. 7A, an adhesive 32 (particularly one that has not yet cured) can be selectively deposited on the circuit board 18, for example, by a printing process and / or a dispensing process. The adhesive 32 can be deposited, in particular, on electrical contacts 26 of the circuit board 18. Depending on the application, the adhesive 32 can be electrically conductive or not. An electrically conductive adhesive 32 can be, for example, a silver-filled epoxy.

[0034] In the Fig. 7B, the magnetic field sensor chip 2 can be arranged with its side surface 8 on the mounting surface 20 of the printed circuit board 18, for example, using a pick-and-place process. The contact pads 12 can be aligned with the selectively deposited adhesive 32. Due to their arrangement at the edge 14 of the magnetic field sensor chip 2, the contact pads 12 can contact the adhesive 32.

[0035] In the Fig. 7C, the adhesive 32 can harden in a curing process. The contact pads 12 arranged on the front side 4 and the back side 6 of the magnetic field sensor chip 2 can thus be permanently mechanically connected to the circuit board 18 via the cured adhesive 32. In the case of an electrically conductive adhesive 32, an electrical connection can also be provided.

[0036] The Fig. 8A to 8C illustrate steps for manufacturing a sensor device 800 according to the disclosure. More specifically, a side view of a mounting of a magnetic field sensor chip 2 on a circuit board 18 is shown. In the example shown, the magnetic field sensor chip 2 may have only four contact pads 12 on its front side.

[0037] In the Fig. 8A, an adhesive 32 (in particular one that has not yet cured) and a solder paste 30 can be selectively deposited on the circuit board 18. The solder paste 30 can be arranged, in particular, on electrical contacts 26 of the circuit board 18. As an alternative to the solder paste 30, an electrically conductive adhesive can be used in another example. The adhesive 32 can, in particular, be a non-electrically conductive adhesive in order to reduce the risk of short circuits.

[0038] In the Fig. 8B, the magnetic field sensor chip 2 can be arranged with its side surface 8 on the mounting surface 20 of the printed circuit board 18, for example, using a pick-and-place process. The contact pads 12 can be aligned with the selectively deposited solder paste 30. Furthermore, the side surface 8 of the magnetic field sensor chip 2 can be aligned with the adhesive 32.

[0039] In the Fig. 8C, the adhesive 32 can harden in a curing process and form permanent mechanical connections between the side surface 8 of the magnetic field sensor chip 2 and the circuit board 18. This can, in particular, avoid or at least reduce the risk of a "tombstone" effect. Furthermore, the solder paste 30 can transition to a molten state during a reflow process and, after cooling, form permanent solder connections 24 of the sensor device 800. If an electrically conductive adhesive is used as an alternative to the solder paste 30, Fig. 8C only a curing process is carried out, but no additional reflow process.

[0040] The sensor device 900 of the Fig. 9 may include some or all of the features of previously described sensor devices. In the example shown, sensor elements and contact pads arranged on the front side 4 of the magnetic field sensor chip 2 are not shown for the sake of simplicity. The magnetic field sensor chip 2 may have a metallization 34 that may extend at least partially over the back side 6 and the side surface 8, as well as the edge of the magnetic field sensor chip 2 located therebetween. The metallization 34 extending over the edge may increase the reliability of a soldering process performed.

[0041] The Fig. 10 shows a flowchart of a method for manufacturing sensor devices according to the disclosure. The method of Fig. 10 is described in a general form to qualitatively specify aspects of the present disclosure. The method may include further aspects. For example, the method may be expanded to include any of the aspects described herein in connection with other examples. In particular, the method may be used to manufacture the previously described sensor devices according to the disclosure.

[0042] In a step 36, a plurality of sensor elements can be formed on a front side of a semiconductor wafer. The sensor elements can be designed to detect a magnetic field component running parallel to the front side. In a further step 38, a plurality of first contact pads can be formed on the front side of the semiconductor wafer. In a further step 40, the semiconductor wafer can be singulated into a plurality of magnetic field sensor chips. Each magnetic field sensor chip can have a sensor element arranged on a front side of the magnetic field sensor chip and a plurality of first contact pads arranged on the front side. All of the first contact pads arranged on the front side can be arranged at an edge of the magnetic field sensor chip lying between the front side and a side surface of the magnetic field sensor chip.

[0043] For example, the process can be carried out by one or more of the Fig.The steps described in steps 6 to 8 can be expanded. For example, in a further step, the magnetic field sensor chip can be mounted on a mounting surface of a printed circuit board. In yet another step, the first contact pads can be electrically connected to the printed circuit board. Examples

[0044] Sensor devices according to the disclosure and associated manufacturing methods are described below using examples.

[0045] Example 1 is a sensor device comprising: a magnetic field sensor chip having a front side, a back side and a side surface connecting the front side and the back side, wherein the magnetic field sensor chip comprises: a sensor element arranged on the front side, which is designed to detect a magnetic field component running parallel to the front side, and a plurality of first contact pads arranged on the front side, wherein all of the first contact pads arranged on the front side are arranged at an edge of the magnetic field sensor chip lying between the front side and the side surface.

[0046] Example 2 is a sensor device according to Example 1, wherein the magnetic field sensor chip is a bare die.

[0047] Example 3 is a sensor device according to example 1 or 2, wherein the first contact pads are arranged linearly along the edge.

[0048] Example 4 is a sensor device according to any one of the preceding examples, wherein the sensor element is arranged at the edge and between the first contact pads.

[0049] Example 5 is a sensor device according to any one of Examples 1 to 3, wherein the first contact pads are arranged between the sensor element and the edge.

[0050] Example 6 is a sensor device according to any one of the preceding examples, wherein the magnetic field sensor chip comprises a plurality of second contact pads arranged on the back side.

[0051] Example 7 is a sensor device according to Example 6, wherein an arrangement of the second contact pads on the back side is identical to an arrangement of the first contact pads on the front side.

[0052] Example 8 is a sensor device according to any one of Examples 1 to 5, wherein the back side of the magnetic field sensor chip is metallized.

[0053] Example 9 is a sensor device according to any one of the preceding examples, wherein the sensor element is a magnetoresistive sensor element.

[0054] Example 10 is a sensor device according to any one of the preceding examples, further comprising: a circuit board, wherein: the magnetic field sensor chip is mounted on a mounting surface of the circuit board and the side surface of the magnetic field sensor chip faces the mounting surface, and the first contact pads are electrically connected to the circuit board.

[0055] Example 11 is a sensor device according to Example 10, wherein the sensor element is configured to detect a magnetic field component perpendicular to the mounting surface.

[0056] Example 12 is a sensor device according to example 10 or 11, wherein the first contact pads and the second contact pads are connected to the mounting surface via a solder material.

[0057] Example 13 is a sensor device according to example 10 or 11, wherein the first contact pads and the second contact pads are connected to the mounting surface via an electrically conductive adhesive.

[0058] Example 14 is a sensor device according to example 10 or 11, wherein the first contact pads are connected to the mounting surface via a solder material and the side surface of the magnetic field sensor chip is connected to the mounting surface via a non-electrically conductive adhesive.

[0059] Example 15 is a sensor device according to any one of the preceding examples, wherein the sensor device does not include a magnetic flux concentrator configured to change a direction of the magnetic field component detected by the sensor element.

[0060] Example 16 is a sensor device comprising: a printed circuit board having a mounting surface; and a magnetic field sensor chip in the form of a bare die having a front side, a back side, and a side surface connecting the front side and the back side, wherein the magnetic field sensor chip is mounted on the mounting surface of the printed circuit board and the side surface of the magnetic field sensor chip faces the mounting surface, wherein the magnetic field sensor chip comprises a sensor element arranged on the front side, which is configured to detect a magnetic field component running parallel to the front side of the magnetic field sensor chip and perpendicular to the mounting surface of the printed circuit board.

[0061] Example 17 is a sensor device according to Example 16, wherein the magnetic field sensor chip comprises a plurality of first contact pads arranged on the front side, wherein all of the first contact pads arranged on the front side are arranged at an edge of the magnetic field sensor chip lying between the front side and the side surface.

[0062] Example 18 is a method of manufacturing a sensor device, the method comprising: forming a plurality of sensor elements on a front side of a semiconductor wafer, the sensor elements being configured to detect a magnetic field component running parallel to the front side; forming a plurality of first contact pads on the front side of the semiconductor wafer; singulating the semiconductor wafer into a plurality of magnetic field sensor chips, each magnetic field sensor chip comprising: a sensor element arranged on a front side of the magnetic field sensor chip, and a plurality of first contact pads arranged on the front side, wherein all of the first contact pads arranged on the front side are arranged at an edge of the magnetic field sensor chip lying between the front side and a side surface of the magnetic field sensor chip.

[0063] Example 19 is a method according to Example 18, further comprising: mounting the magnetic field sensor chip on a mounting surface of a circuit board, wherein the side surface of the magnetic field sensor chip faces the mounting surface; and electrically connecting the first contact pads to the circuit board.

[0064] Although specific embodiments are shown and described herein, it will be apparent to one of ordinary skill in the art that a variety of alternative and / or equivalent implementations may be substituted for the specific embodiments shown and described without departing from the scope of the present disclosure. This application is intended to cover any adaptations or variations of the specific embodiments discussed herein. Therefore, this disclosure is intended to be limited only by the claims and their equivalents.

Claims

Sensor device, comprising: a magnetic field sensor chip (2) with a front side (4), a back side (6) and a side surface (8) connecting the front side (4) and the back side (6), wherein the magnetic field sensor chip (2) comprises: a sensor element (10) arranged on the front side (4), which is designed to detect a magnetic field component running parallel to the front side (4), and a plurality of first contact pads (12) arranged on the front side (4), wherein all of the first contact pads (12) arranged on the front side (4) are arranged at an edge (14) of the magnetic field sensor chip (2) lying between the front side (4) and the side surface (8). Sensor device according to claim 1, wherein the magnetic field sensor chip (2) is a bare die. Sensor device according to claim 1 or 2, wherein the first contact pads (12) are arranged linearly along the edge (14). Sensor device according to one of the preceding claims, wherein the sensor element (10) is arranged at the edge (14) and between the first contact pads (12). Sensor device according to one of claims 1 to 3, wherein the first contact pads (12) are arranged between the sensor element (10) and the edge (14). Sensor device according to one of the preceding claims, wherein the magnetic field sensor chip (2) comprises a plurality of second contact pads (12) arranged on the rear side (6). Sensor device according to claim 6, wherein an arrangement of the second contact pads (12) on the rear side (6) is identical to an arrangement of the first contact pads (12) on the front side (4). Sensor device according to one of claims 1 to 5, wherein the back side (6) of the magnetic field sensor chip (2) is metallized. Sensor device according to one of the preceding claims, wherein the sensor element (10) is a magnetoresistive sensor element. Sensor device according to one of the preceding claims, further comprising: a circuit board (18), wherein: the magnetic field sensor chip (2) is mounted on a mounting surface (20) of the circuit board (18) and the side surface (8) of the magnetic field sensor chip (2) faces the mounting surface (20), and the first contact pads (12) are electrically connected to the circuit board (18). Sensor device according to claim 10, wherein the sensor element (10) is designed to detect a magnetic field component running perpendicular to the mounting surface (20). Sensor device according to claim 10 or 11, wherein the first contact pads (12) and the second contact pads (12) are connected to the mounting surface (20) via a solder material (24). Sensor device according to claim 10 or 11, wherein the first contact pads (12) and the second contact pads (12) are connected to the mounting surface (20) via an electrically conductive adhesive (32). Sensor device according to claim 10 or 11, wherein the first contact pads (12) are connected to the mounting surface (20) via a solder material (24) and the side surface (8) of the magnetic field sensor chip (2) is connected to the mounting surface (20) via a non-electrically conductive adhesive (32). Sensor device according to one of the preceding claims, wherein the sensor device does not have a magnetic flux concentrator designed to change a direction of the magnetic field component detected by the sensor element (10). A sensor device comprising: a printed circuit board (18) with a mounting surface (20); and a magnetic field sensor chip (2) in the form of a bare die with a front side (4), a back side (6), and a side surface (8) connecting the front side (4) and the back side (6), wherein the magnetic field sensor chip (2) is mounted on the mounting surface (20) of the printed circuit board (18) and the side surface (8) of the magnetic field sensor chip (2) faces the mounting surface (20), wherein the magnetic field sensor chip (2) comprises a sensor element (10) arranged on the front side (4), which sensor element is designed to detect a magnetic field component running parallel to the front side (4) of the magnetic field sensor chip (2) and perpendicular to the mounting surface (20) of the printed circuit board (18). Sensor device according to claim 16, wherein the magnetic field sensor chip (2) comprises a plurality of first contact pads (12) arranged on the front side (4), wherein all of the first contact pads (12) arranged on the front side (4) are arranged at an edge (14) of the magnetic field sensor chip (2) lying between the front side (4) and the side surface (8). A method for producing a sensor device, the method comprising: forming a plurality of sensor elements (10) on a front side of a semiconductor wafer, wherein the sensor elements (10) are designed to detect a magnetic field component running parallel to the front side; forming a plurality of first contact pads (12) on the front side of the semiconductor wafer; singulating the semiconductor wafer into a plurality of magnetic field sensor chips (2), wherein each magnetic field sensor chip (2) comprises: a sensor element (10) arranged on a front side (4) of the magnetic field sensor chip (2), and a plurality of first contact pads (12) arranged on the front side (4), wherein all of the first contact pads (12) arranged on the front side (4) are arranged at an edge (14) of the magnetic field sensor chip (2) lying between the front side (4) and a side surface (8) of the magnetic field sensor chip (2). The method of claim 18, further comprising:mounting the magnetic field sensor chip (2) on a mounting surface (20) of a circuit board (18), wherein the side surface (8) of the magnetic field sensor chip (2) faces the mounting surface (20); andelectrically connecting the first contact pads (12) to the circuit board (18).

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