Flexible conductor structure

Abstract

The invention relates to a method for producing a particularly flexible conductor structure (1), comprising two non-conductively intersecting conductor tracks (10, 20). It is proposed to print components of the conductor tracks (10, 20) and insulating structures in the region of the intersection point onto two different carrier layers (301, 302). The carrier layers (301, 302) are then brought together with their printed sides (3010, 3020) aligned in such a way that the components of the conductor tracks and the insulating structures are combined to form two non-conductively intersecting conductor tracks (10, 20).

Description

The present invention relates to a method for producing a, in particular flexible, conductor structure having the features of claim 1 and to a flexible conductor structure having the features of claim 8, More specifically, the present invention relates to the design and production of conductor structures in which two conductor tracks are intended to cross one another in a non-conductive manner. Such conductor structures are used in a large number of electronic assemblies, antennas or sensors.Many topologies, in particular printed conductor structures, have crossover points at which conductor tracks must be crossed over without electrically short-circuiting the conductor paths. In certain electrical systems, such as planar NFC antennas, such crossing points are unavoidable.In integrated circuits (ICs), intersecting conductor tracks are usually designed such that one of the conductor paths is redirected to an adjacent metallization level in the region of the crossing point. The metallization planes spaced apart from one another by a dielectric carrier layer (substrate) are then electrically connected at points in the vertical direction by means of so-called vias. In this case, the carrier layer is first provided with corresponding holes, which are subsequently metallized in order to produce an electrical connection between the metallization levels. Such a production method, as is shown for example in DE 10 2004 005 300 A1, is complicated.However, in particular in the case of flexible conductor track structures (such as e.g. film antennas, NFC stickers, etc.), another bridging approach is more common. In this case, a first continuous conductor track is arranged or printed on a substrate and this is covered with a local insulation layer in the region of the crossover point. A second conductor track crossing the first conductor track is then arranged or printed on the substrate or the local insulation layer. An example of such a crossing is shown in CN 212034439 U. However, it is disadvantageous here that that portion of the second conductor track which is printed on the insulation layer frequently has a lower electrical conductivity than the other conductor portions. This is partly due to the fact that optimum adhesion cannot be established between the printed insulation layer and the conductor track section printed on this layer. In the application example of an (NFC) antenna, a reduced conductivity can lead to a deterioration in the quality factor of the antenna. The bridge locations are therefore usually chosen to be as short as possible, which represents a restriction in the circuit layouts or is not always possible in some applications because of the sharp size-such as the meter-length sensor loop used in conveyor belt installations for crack detection. An example of such a sensor loop is shown in U.S. Pat. No. 10150622 B1.There is clearly a need for an improved solution for the design and production of conductor structures in which two conductor tracks cross one another in a non-conductive manner.It is therefore an object of the present invention to provide an improved method for producing an in particular flexible conductor structure having two non-conductively crossing conductor tracks, which at least partially reduces the disadvantages of the prior art. At least, an alternative to existing solutions is to be provided.This object is achieved by a method having the features of claim 1 and a conductor structure having the features of claim 8. Preferred features are the subject of the dependent claims. Further advantages and features can be gathered from the general description and from the exemplary embodiments.The method according to the invention for producing an in particular flexible conductor structure, having two conductor tracks crossing one another in a non-conductive manner, in particular a conductor structure according to one of Claims 8 to 15, contains the following steps:arranging, in particular printing, a conductor track section of a first conductor track interrupted by an interruption on a first side of a first carrier layer,arranging, in particular printing, a second conductor track extending through the interruption of the conductor track section of the first conductor track on the first side of the carrier layer,arranging, in particular printing, a bridging section of the first conductor track on a first side of a second carrier layer, wherein the bridging section is suitable for bridging the interrupted conductor track section,arranging, in particular printing, an insulator on a first side of the bridging section facing away from the second carrier layer while leaving free two contact sections spaced apart from one another on the first side of the bridging section and / or arranging the insulator on a first side of the first conductor track facing away from the first carrier layer while leaving free two end sections of the interrupted conductor track section spaced apart from one another and facing the interruption.bringing the carrier layers together, in such a way that◯ the first side of the first carrier layer faces the first side of the second carrier layer,◯ the contact portions of the bridging portion each enter into an electrical connection with one of the end portions of the interrupted conductor track portion,◯ the insulator electrically isolates the bridging portion of the first conductive path and the second conductive path from each other.The invention is based on the concept of arranging the bridging section on a separate carrier layer and then joining this separate carrier layer in an aligned manner with the carrier layer on which the remaining conductor track sections are arranged, so that the bridging section bridges the interrupted conductor track section of the first conductor track and is simultaneously insulated from the second conductor section.This approach offers many advantages. On the one hand, the conductivity of the bridging section, which can be understood, for example, as a further conductor track section of the first conductor track, is not impaired, since the adhesion of the bridging section to the second carrier layer is optimized or can be optimized in the same way as the adhesion of the remaining conductor track sections to the first carrier layer. On the other hand, a particularly flat and robust conductor structure can be produced in a few additive steps, without subtractive processing such as, for example, drilling vias or perforating a film substrate. The conductor tracks are enclosed between the two carrier layers and are thus simultaneously insulated on both sides and / or protected against external influences, so that a further process step for producing a corresponding insulation or protective layer can be omitted. A further advantage is that the conductor structure can be produced in a simple manner in a high number of pieces in an automated manner due to its simple construction.Different materials are basically suitable for the first and the second carrier layer, provided they are not conductive and flexible. Preferably, the material of the carrier layer contains at least one polymer. Preferably, the material of the carrier layer is selected from the group consisting of polyamide (PA), e.g. PA6, PA6.6, PA11, PA12, PA6.10, PA6.12, and / or copolyamides and / or polyester (PES) and / or rayon and / or polyethylene terephthalate (PET) and / or polyethylene naphthalate (PEN) and / or polybutylene terephthalate (PBT) and / or polycarbonate (PC) and / or unsaturated polyester resin (UP) and / or poly(1,4-cyclohexanedimethylene terephthalate) (PCDT) and / or polyvinyl alcohol (PVAL) and / or polyoxibenzonaphthoate and / or polyvinyl acetal (PVA) and / or polyetheretherketone (PEEK) and / or polyethylene-2,6-naphthalate (PEN) and / or polyphenylene and / or polyphenylene oxide (PPO) and / or polyphenylene sulfide (PPS) and / or polyetheretherketone Polyphenylene ether and / or polybenzoxazole (PBO) and / or polyoxadiazole (POD) and / or polyetherimide (PEI) and / or m-aramid and / or p-aramid and / or cellulose and / or paper and / or basalt and / or ceramic and / or wool and / or cotton and / or polypropylene and / or polyethylene and / or melamine and / or modified viscose and / or highly crystalline polymer fibers and / or fluoropolymers, such as, for example. Fluorosilicone, polytetrafluoroethylene (PTFE) and perfluoroethylenepropylene (FEP), and / or fluoro copolymers and / or styrene-butadiene rubber (SBR) and / or ethylene-propylene-diene rubber (EPDM), and / or a thermoplastic elastomer such as TPV or TPU. Preferably, the material of the first carrier layer is identical to the material of the second carrier layer.The material of the first and / or of the second carrier layer is preferably a polyethylene terephthalate (PET), in particular a PET film. PET has good surface quality, good wettability of printing inks, enables good adhesion forces, is highly transparent, good moisture and oxygen barrier, is recyclable. Alternatively preferably, the material of the first and / or of the second carrier layer is a thermoplastic polyurethane (TPU), in particular a TPU film. TPU is particularly elastic, expandable, abrasion resistant and tear resistant compared to other substrates, resistant to oils and lubricants and is light in weight. Furthermore, TPU has good printability and can be bonded well to other polymeric materials (for example to low-melting intermediate films). Alternatively preferably, the material is a polycarbonate (PC), in particular a PC film. PC has high chemical resistance, good printability (i.e., allows good wetting and adhesion properties of printing inks), good temperature resistance, high elasticity, and has high impact resistance.In particular, the first or the second carrier layer has a layer thickness of 1 μm to 500 μm, preferably of 5 μm to 250 μm, particularly preferably of 50 μm to 150 μm. In this way, a particularly compact configuration of the conductor structure can be realized. At the same time, the weight of the conductor structure according to the invention can be kept low.The carrier layers are brought together or joined together with their sides carrying the respective conductor track sections by contacting, in particular wherein the carrier layers are fastened to one another. This can be done, for example, using rollers or rollers in a lamination process. The joining or joining of the carrier layers can furthermore be effected with the supply of heat and pressure. The rollers may be heated. The insulation layer can serve as an adhesion-promoting layer which is dried or cured by the supply of heat (and pressure) or radiation (UV, IR). The adhesion-promoting layer can reactively or chemically crosslink for improved mechanical properties and adhesion properties.For the conductor tracks or conductor track sections of the conductor structure (including the bridging section), fundamentally different inorganic materials (such as metals) and organic materials (such as conductive polymers, carbon, graphite, graphene, etc.) and combinations thereof are possible, provided they are conductive and can preferably be processed (e.g. as ink or paste) by means of printing methods. The thickness of the first and / or second conductor track is preferably 1 nm to 50 μm. In this way, a particularly compact configuration of the conductor structure can be realized. Particularly preferably, the thickness of the first and / or second conductor track is 500 nm to 50 μm, so that the conductor tracks can be produced reliably by means of proven printing methods. The thickness of a conductor track is understood here to mean the dimension of the conductor track measured transversely to the layer plane of the carrier layer. Preferably, the interrupted conductor track section of the first conductor track, the bridging section of the first conductor track and / or the second conductor track are printed on the respective carrier layer. Printing-also called 3D printing or additive method-is particularly well suited for the precise production of conductive structures and can be advantageously combined with the method according to the invention.In principle, different materials are suitable for the insulator provided they are not conductive (i.e. dielectric). Preferably, the material of the insulator contains at least one polymer. In particular, the material of the insulator can be processed by means of printing methods, as a result of which the insulator can be realized in a particularly thin, efficient and process-safe manner. The layer thickness of the insulator is preferably 100 nm to 800 μm, preferably 1 μm to 100 μm, particularly preferably 1 μm to 15 μm. The layer thickness of the insulation layer is preferably 100 nm to 800 μm, preferably 1 μm to 100 μm, particularly preferably 1 μm to 15 μm. Preferably, the insulator is printed on the first side of the bridging section and / or on the first side of the first conductor track. In particular, if the insulator is to be arranged on a printed structure, such as the interrupted conductor track section of the first conductor track, the bridging section of the first conductor track and / or the second conductor track, the respective printed structure or all printed structures is preferably cured by a curing process-which, depending on the selected material of the printed structures, can contain, for example, drying, reactive crosslinking, sintering and / or baking.In a preferred embodiment of the invention, the method has the following step:arranging, in particular printing, an insulation layer on the first side of the second carrier layer and / or on the first side of the first carrier layer, leaving free the end sections of the interrupted conductor track section.In this way, the first carrier layer is spaced apart from the second carrier layer, so that a conductor structure having a substantially constant thickness or height can be produced. Preferably, the insulation layer is printed on the first side of the second carrier layer and / or on the first side of the first carrier layer.In principle, different materials are suitable for the insulation layer, provided they are not conductive (i.e. dielectric). The material of the insulation layer preferably contains at least one polymer. Preferably, the material of the insulation layer is identical to the material of the insulator. In particular, the material of the insulation layer can be processed by means of printing methods, as a result of which the insulation layer can be realized in a particularly thin, efficient and process-safe manner. In this way, the insulator and the insulation layer can be produced in a common operation. The layer thickness of the insulation layer is preferably 100 nm to 800 μm, preferably 1 μm to 100 μm, particularly preferably 1 μm to 10 μm.In a further preferred embodiment of the invention, the interrupted conductor track section of the first conductor track and the second conductor track have substantially the same layer height. In this way, bridging of the second conductor track is simpler. In addition, a conductor structure having a substantially constant thickness or height can be produced.In a further preferred embodiment of the invention, the method has the following step:arranging, in particular printing, a conductive column structure in each case on a first side of each end section of the interrupted conductor track section facing away from the first carrier layer and / or on the contact sections of the bridging section.In this way, the electrical contacting of the bridging section with the interrupted conductor track section is facilitated. For example, the bridging portion and the interrupted conductor track portion can each be produced with a substantially constant layer thickness. Due to the insulator disposed between the second conductive path and the bridging portion, there is a gap in the vertical direction between the bridging portion and the interrupted conductive path portion, which can be bridged with the conductive pillar structures.For the conductive column structures, in principle, various inorganic materials (such as metals) and organic materials (such as conductive polymers, carbon, graphite, graphene, etc.) and combinations thereof are suitable, provided they are conductive and can preferably be processed (e.g. as ink or paste) by means of printing and / or dispensing methods. The thickness of the conductive column structures is preferably 1 nm to 150 μm, particularly preferably 5 μm to 75 μm. Preferably, the material used for the conductive column structures, in particular the ink or paste used for this purpose, does not contain any volatile constituents. The conductive column structure is preferably reactively cured or dried before the carrier layers are brought together and / or before the insulation layer and / or the insulator are applied to the first carrier layer.If the structure on which the conductive pillar structures are arranged, in particular printed, is produced by means of printing methods itself, the structure should be cured by a corresponding curing process (such as drying, sintering, baking) before arranging the pillar structure.In a further preferred embodiment of the invention, the insulator and / or the insulation layer is flowable or liquid during the joining or combining of the carrier layers and is cured after the joining of the carrier layers by a curing process-which, depending on the material of the insulator or of the insulation layer, can contain, for example, irradiation (e.g. with UV light), drying and / or heating. In this way, the material of the insulator and / or of the insulation layer can be distributed more uniformly during the joining of the carrier layers and flow, for example, into optionally present cavities or intermediate spaces, so that a robust composite structure is obtained. In individual cases, this can increase the clearance for the positioning of the flowable material, for example on the carrier layers, which simplifies the design and production of the conductor structure. Furthermore, the cured material of the insulator and / or of the insulation layer can contribute to the adhesion or fastening of individual constituents of the conductor structure or produce these. For example, the two carrier layers can be fastened to one another by the cured insulation layer.According to the above and below description, the object initially set forth is also achieved by a flexible conductor structure having the features of claim 8.The flexible conductor structure according to the invention has a first and a second carrier layer, wherein a first side of the first carrier layer faces a first side of the second carrier layer. The following is arranged between the carrier layers:two non-conductively crossing conductor tracks which are arranged on the first side of the first carrier layer, wherein a first conductor track has a conductor track section interrupted by an interruption, wherein a second conductor track extends through the interruption of the conductor track section of the first conductor track,a bridging section which is arranged on the first side of the second carrier layer, wherein two contact sections which are spaced apart from one another are arranged on a first side of the bridging section which is remote from the second carrier layer in such a way that they each form an electrical connection with an end section of the interrupted conductor track section which faces the interruption,an insulator electrically insulating the bridging portion and the second conductive path from each other.In a preferred embodiment of the conductor structure according to the invention, the latter has an insulation layer spacing the first carrier layer from the second carrier layer, in particular wherein the insulation layer fixes the first carrier layer and the second carrier layer to one another.In a further preferred configuration of the conductor structure according to the invention, the interrupted conductor track section of the first conductor track and the second conductor track have substantially the same layer height.In a further preferred configuration of the conductor structure according to the invention, a conductive column structure is arranged in each case between the contact sections of the bridging section and the end sections of the interrupted conductor track section.In a further preferred embodiment of the conductor structure according to the invention, the insulator and / or the insulation layer are printed and cured in particular by a curing process.In a further preferred configuration of the conductor structure according to the invention, the interrupted conductor track section of the first conductor track and / or the second conductor track are printed on the first carrier layer and cured in particular by a curing process; and / or the bridging section of the first conductor track is printed on the second carrier layer and cured in particular by a curing process.In a further preferred embodiment of the conductor structure according to the invention, the latter forms an antenna and / or a sensor or a part thereof. The present invention enables the simple production of extremely thin-film conductor structures which are electrically and mechanically protected by the two carrier layers and are particularly suitable for thin (NFC) antennas or sensor loop for crack detection in conveyor belts.It is expressly pointed out that the embodiments of the invention explained above can each be combined with one another individually or in any technically meaningful combination, in each case with the subject matter of the independent claims.Modifications and embodiments of the invention and further advantages and details of the invention can be gathered from the following description and the drawings. The schematic figures show: FIG. 1 shows a part of a conductor structure according to an embodiment of the invention in a plan view; FIG. 2 ashows the part of the conductor structure according to the embodiment from FIG. 1 without conductor tracks in a sectional view according to line A-A; FIG. 2 bshows the part of the conductor structure according to the embodiment from FIG. 1 in a sectional view according to line A-A; FIG. 2 cshows the part of the conductor structure from FIG. 2 b, with added pillar structures; FIG. 3 ashows a further part of the conductor structure according to the embodiment of the invention in a sectional view; FIG. 3 bshows the part of the conductor structure from FIG. 3 bwith added bridging section; FIG. 3 bshows the part of the conductor structure from FIG. 3 cwith added insulator and added insulation layer; and FIG. 4 shows a conductor structure according to the invention, obtained by joining or combining the parts from FIGS. 2 cand 3 c.Identically or similarly acting parts are provided with identical reference numerals, provided that they are used.Individual technical features of the exemplary embodiments described below can also be combined in combination with exemplary embodiments described above and the features of the independent claims and any further claims to form articles according to the invention.FIG. 1 shows a part of a conductor structure 1 with two non-conductively crossing conductor tracks 10, 20 according to an embodiment of the invention in a plan view. Printed onto a first side 3010 of a first carrier layer 301 are a conductor track section 101 of the first conductor track 10 interrupted by an interruption U and a second conductor track 20 extending through the interruption U of the conductor track section 101 of the first conductor track 10. The interrupted conductor track section 101 is to be electrically bypassed without the conductor tracks 10, 20 being short-circuited.FIGS. 2 ato 2 c show different production phases of the part of the conductor structure 1 from FIG. 1 in a sectional view according to line A-A. FIG. 2 ashows the first carrier layer 301 with its first side 3010 to be printed. The interrupted conductor track section 101 and the second conductor track 20 are printed on this first side 3010 at an identical layer height H 1, as can be seen in FIG. 2 b. Subsequently, the printed structures are cured by a curing process, such as drying, sintering and / or baking. The interrupted conductor track section 101 has on its first side 1010 facing away from the first carrier layer 301 two end sections 1011, 1012 facing the interruption U. A conductive column structure 103 is applied to each of these two end sections 1011, 1012, as can be seen in FIG. 2 c.Figures 3a to 3c show different stages of manufacturing a further part of the conductor structure 1 according to the embodiment of the invention. FIG. 3 ashows a second carrier layer 302 with its first side 3020 to be printed. A bridging section 102 of the first conductor track 10 is printed onto this first side 3020. The bridging section 102 is dimensioned and arranged on the second carrier layer 302 in such a way that the interrupted conductor track section 101 can bridge. In particular, the bridging section 102 can correspond to the interrupted conductor track section 101 with regard to its material, its width and / or its layer height. The printed bridging portion 102 is cured by a curing process such as drying, sintering, and / or baking. On its first side 1020 facing away from the second carrier layer 302, the bridging section 102 has two contact sections 1021, 1022 spaced apart from one another for the electrical connection to the end sections 1011, 1012 of the interrupted conductor track section 101 (cf. FIG. 2 b). In the present case, the electrical connection is to be produced indirectly via the column structures 103. An insulator 401 is printed onto the first side 1020 of the cured bridging section 102, leaving the two contact sections 1021, 1022 free, as shown in FIG. 3 c. The insulator 401 is intended to serve to electrically isolate the bridging section 102 from the second conductor track 20. Away from the bridging portion 102, an insulation layer 402 is further printed on the first side 3020 of the second carrier layer 302. The insulator 401 and the insulation layer 402 are preferably made of the same dielectric material and are applied in the same printing step.FIG. 4 shows a conductor structure 1 according to the invention, as is produced by the joining or joining of the first carrier layer 301 from FIG. 2 cand the second carrier layer 302 from FIG. 3 c. The carrier layers 301, 302 are oriented in such a way thatthe first side 3010 of the first carrier layer 301 faces the first side 3020 of the second carrier layer 302,the contact sections 1021, 1022 of the bridging section 102 each enter into an electrical connection with an end section 1011, 1012 of the interrupted conductor track section 101 (indirectly via the conductive column structures 103),the insulator 401 electrically isolates the bridging portion 102 of the first conductive path 10 and the second conductive path 20 from each other.The insulator 401 and the insulation layer 402 are in a flowable, for example in a viscous state, when the carrier layers 301, 302 are brought together. In this way, for example, the material of the insulator 401 can flow into the interspaces between the end sections 1011, 1012 of the interrupted conductor track section 101 and the second conductor track 20, and thus ensure a reliable electrical insulation of the intersecting conductor tracks 10, 20. Furthermore, the material of the insulation layer 402 can adhere to the first carrier layer 301 and the structures printed thereon, such that after curing of the insulation layer 402, the carrier layers 301, 302 together with the insulation layer 402 form a solid composite structure.With the present invention, conductor structures 1 can be produced in a few production steps, in which the conductor tracks 10, 20 are enclosed or "sandwiched" between the two carrier layers 301, 302 and are thus electrically insulated on both sides and / or protected against external influences.Although the method according to the invention can be used particularly advantageously in conjunction with printing technologies, other additive manufacturing methods, thin film and vacuum technologies, such as, for example, sputtering, evaporation (or vacuum technology, are also fundamentally possible. PVD, physical vapor deposition, chemical vapor deposition (engl. CVD) compatible with the invention described herein.In addition, it should be noted that "having" does not exclude other elements or steps and "a" or "an" does not exclude a plurality.The scope of the present invention is given by the claims and is not limited by the features explained in the description or shown in the figures.References included in the specificationThis list of documents cited by the applicant has been produced in an automated manner and is only included for the better information of the reader. The list is not part of the German patent application or utility model application. The DPMA does not take any adhesion for any faults or omissions.Patent Literature citedDE 10 2004 005 300 A1

[0003] CN 212034439 U

[0004] US 10150622 B1

[0004]

Claims

Method for producing a, in particular, flexible conductor structure (1) having two non-conductively crossing conductor tracks (10, 20), in particular a conductor structure (1) according to one of Claims 8 to 15, comprising the following steps - arranging a conductor track section (101) of a first conductor track (10) interrupted by an interruption (U) on a first side (3010) of a first carrier layer (301), - arranging a second conductor track (20) extending through the interruption (U) of the conductor track section (101) of the first conductor track (10) on the first side (3010) of the carrier layer (301), - arranging a bridging section (102) of the first conductor track (10) on a first side (3020) of a second carrier layer (302), wherein the bridging section (102) is suitable for bridging the interrupted conductor track section (101), arranging an insulator (401) on a first side (1020) of the bridging section (102) facing away from the second carrier layer (302), leaving free two contact sections (1021, 1022) spaced apart from one another on the first side (1020) of the bridging section (102), and / or arranging the insulator (401) on a first side (2010) of the first conductor track (10) facing away from the first carrier layer (301), leaving free two end sections (1011, 1012) of the interrupted conductor track section (101) spaced apart from one another, bringing the carrier layers (301, 302) together in such a way that ◯ the first side (3010) of the first carrier layer (301) faces the first side (3020) of the second carrier layer (302), ◯ the contact sections (1021, 1022) of the bridging section (102) each enter into an electrical connection with one of the end sections (1011, 1012) of the interrupted conductor track section (101), ◯ the insulator (401) electrically isolates the bridging section (102) of the first conductor track (10) and the second conductor track (20) from one another.Method according to claim 1, wherein the method comprises the step of: - arranging an insulation layer (402) on the first side (3020) of the second carrier layer (302) and / or on the first side (3010) of the first carrier layer (301), leaving free the end portions (1011, 1012) of the interrupted conductor track portion (101).Method according to Claim 1 or 2, wherein the interrupted conductor track section (101) of the first conductor track (10) and the second conductor track (20) have substantially the same layer height (H1).Method according to one of the preceding claims, wherein the method comprises the following step: - arranging a respective conductive column structure (103) on a first side (1010) of each end section (1011, 1012) of the interrupted conductor track section (101) facing away from the first carrier layer (301) and / or on the contact sections (1021, 1022) of the bridging section (102).Method according to one of the preceding claims, wherein the insulator (401) and / or the insulation layer (402) is flowable or liquid during the joining of the carrier layers (301, 302) and is cured by a curing process after the joining of the carrier layers (301, 302).Method according to one of the preceding claims, wherein the interrupted conductor track section (101) of the first conductor track (10), the bridging section (102) of the first conductor track (10) and / or the second conductor track (20) are printed on the respective carrier layer (301, 302).Method according to one of the preceding claims, wherein the bridging section (102) of the first conductor track (10), the interrupted conductor track section (101) of the first conductor track (10) and / or the second conductor track (20) is cured by a curing process before the arrangement of the insulator (401).Flexible conductor structure (1) having a first and a second carrier layer (301, 302), wherein a first side (3010) of the first carrier layer (301) faces a first side (3020) of the second carrier layer (302), between which there is arranged: - two non-conductively crossing conductor tracks (10, 20) arranged on the first side (3010) of the first carrier layer (301), wherein a first conductor track (10) has a conductor track section (101) interrupted by an interruption (U), wherein a second conductor track (20) extends through the interruption (U) of the conductor track section (101) of the first conductor track (10), - a bridging section (102) arranged on the first side (3020) of the second carrier layer (302), wherein two contact sections (1021, which are spaced apart from one another, 1022) on a first side (1020) of the bridging section (102) facing away from the second carrier layer (302) are arranged in such a way that they each enter into an electrical connection with an end section (1011, 1012) of the interrupted conductor track section (101) facing the interruption (U), an insulator (401) electrically insulating the bridging section (102) and the second conductor track (20) from one another.Flexible conductor structure (1) according to Claim 8, having an insulation layer (402) spacing the first carrier layer (301) from the second carrier layer (302), in particular wherein the insulation layer (402) fixes the first carrier layer (301) and the second carrier layer (302) to one another.Flexible conductor structure (1) according to Claim 8 or 9, wherein the interrupted conductor track section (101) of the first conductor track (10) and the second conductor track (20) have substantially the same layer height (H1).The flexible conductor structure (1) according to any one of claims 8 to 10, wherein a conductive pillar structure (103) is arranged between the contact portions (1021, 1022) of the bridging portion (102) and the end portions (1011, 1012) of the interrupted conductor track portion (101), respectively.Flexible conductor structure (1) according to one of Claims 8 to 11, wherein the insulator (401) and / or the insulation layer (402) are printed and cured in particular by a curing process.Flexible conductor structure (1) according to one of Claims 8 to 12, wherein the interrupted conductor track section (101) of the first conductor track (10) and / or the second conductor track (20) are printed on the first carrier layer (301) and in particular cured by a curing process; and / or wherein the bridging section (102) of the first conductor track (10) is printed on the second carrier layer (301) and in particular cured by a curing process.Flexible conductor structure (1) according to any of claims 8 to 13, forming an antenna (or a part thereof) and / or a sensor (or a part thereof).

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