MAGNETIC SENSOR DEVICE

Abstract

A magnetic sensor device (1) includes a carrier substrate (2) and a sensor substrate (10) attached to the carrier substrate (2). The sensor substrate (10) includes a first surface (10B) facing the carrier substrate (2) and a second surface (10A) located on a side opposite the first surface (10B), which is provided with a functional film (20) enclosing a plurality of magnetic detection elements. A perforated portion (11) is formed in the first surface (10B). A contour (O11) of the perforated portion (11) encloses at least one corner (C1, C2, C3...).) includes a first corner (C1) that overlaps at least one of the plurality of magnetic detection elements (E) in a top view in a plane normal direction (Z) from the second surface (10A) to the first surface (10B), and the first corner (C1) has a radius of curvature of 5 µm or more.

Description

Cross-references to related applications

[0001] This application claims priority to Japanese Patent Application No. 2023-100072, filed on June 19, 2023, the entire contents of which are incorporated herein by reference. background

[0002] The present disclosure relates to a magnetic sensor device.

[0003] There is a magnetic sensor device in which a sensor chip provided with a magnetic detection element on a sensor substrate is bonded to a support substrate with an adhesive. For example, Patent Publication JP-A-2023-10557 discloses a magnetic sensor device in which a first chip and a second chip, each including a magnetic sensor for generating a detection signal, and a carrier including an application-specific integrated circuit (ASIC) for processing the detection signal, are separately prepared, and the first chip and the second chip are bonded to the carrier with an adhesive.Although patent publication JP-A-2010-205893 does not relate to a magnetic sensor device, it discloses that in a semiconductor device in which a semiconductor element is fixed to a support via an adhesive layer, a recessed portion is formed on a back surface of the semiconductor element facing a support substrate.

[0004] The present disclosure has been made in view of these circumstances, and its object is to provide a magnetic sensor device that can properly attach a sensor substrate to a support substrate and has stable output characteristics. Summary

[0005] A magnetic sensor device according to one aspect of the present disclosure includes a support substrate and a sensor substrate attached to the support substrate. The sensor substrate includes a first surface facing the support substrate and a second surface located on a side opposite the first surface and provided with a functional film including a plurality of magnetic detection elements. A hole portion is formed in the first surface. A contour of the hole portion includes at least one corner. The at least one corner includes a first corner that overlaps at least one of the plurality of magnetic detection elements when viewed in a plan view in a plane-normal direction from the second surface to the first surface. The first corner has a radius of curvature of 5 μm or more.

[0006] According to the present disclosure, it is possible to provide a magnetic sensor device that can properly attach a sensor substrate to a support substrate and has stable output characteristics. Brief description of the drawings

[0007] The accompanying drawings are provided to provide a further understanding of the disclosure and are incorporated in and constitute a part of this specification. The drawings illustrate embodiments and, together with the description, serve to explain the principles of the technology. Fig. 1 is a perspective view showing a magnetic sensor device according to an embodiment; Fig. 2 is a cross-sectional view schematically showing an example of an internal structure of the Fig. 1 shows the magnetic sensor device; Fig. 3A to 3G are perspective views showing a manufacturing process of the Fig. 1; Fig. 4A and Fig. 4B are diagrams showing an example of the magnetic sensor device configured as an angle sensor; Fig. 5 is a plan view showing an example of the magnetic sensor device configured as a magnetic compass; Fig. 6 is a diagram showing an example of the magnetic sensor device used as part of a current sensor; Fig. 7 is a diagram showing a circuit configuration of the Fig. 6 shows the current sensor; Fig. 8 is a perspective view showing an example of the magnetic sensor device used as part of an autofocus mechanism and an optical image stabilization mechanism of a camera module; Fig. 9 is a cross-sectional view showing an internal structure of the Fig. 8 shows the camera module; Fig. 10A is a plan view of a simulation model in which a quadrangular hole part is formed, viewed in a plane normal direction; Fig. 10B is a plan view of a simulation model in which a quadrangular hole part with rounded (R) corners is formed, viewed in the plane normal direction; Fig. 10C is a plan view of a simulation model in which a circular hole part is formed, viewed in the plane normal direction; Fig. 10D is a plan view of a simulation model further including a wiring layer, viewed in the plane normal direction; Fig. 10E is a plan view of a simulation model with an inclined inner surface, viewed in the plane normal direction; Fig. 11 is a cross-sectional view of the simulation model taken along an XY plane orthogonal to the plane normal direction; Fig. 12 and Fig. 13 are diagrams showing simulated angular errors at each of the Fig. 10A and Fig. 11 shown position; Fig. Figure 14 is a diagram showing simulated angular errors at each of the Fig. 10A, Fig. 10B and Fig. 10C; Fig. 15 is a diagram showing the angular errors obtained by simulating the model containing the Fig. 10D shown wiring layer, at each in the Fig. 10A, Fig. 10B and Fig. 10C shown position; Fig. 16 is a diagram showing simulated angular errors at each Fig. 10E; Fig. 17 to 19 are plan views showing first to third examples in which magnetic detection elements are arranged to overlap a first corner having a radius of curvature of 5 µm or more. Fig. 20 is a plan view showing a fourth example in which the magnetic detection elements are arranged on the inner side of a contour of the wiring layer. Fig. 21 is a cross-sectional view showing a fifth example in which the magnetic detection elements are arranged so as not to overlap the inclined inner surface. Detailed description

[0008] For example, Patent Publication JP-A-2023-10557 discloses a magnetic sensor device in which a first chip and a second chip, each including a magnetic sensor for generating a detection signal, and a carrier including an application-specific integrated circuit (ASIC) for processing the detection signal are prepared separately, and the first chip and the second chip are bonded to the carrier with an adhesive.

[0009] In such a magnetic sensor device, it is advantageous to apply the adhesive so that it protrudes slightly from the bonding surface of a sensor substrate. If the amount of adhesive applied is insufficient, there is a risk of the adhesive peeling off easily from a location where no adhesive is applied, and its bonding strength may decrease. If too much adhesive is applied, there is a risk that the adhesive protruding from the sensor substrate will adhere to an electrode on a surface of the ASIC or the like, and the bonding reliability may decrease.

[0010] When a bottomed hole or a through-hole is formed in the adhesive surface of the sensor substrate, the amount of adhesive protruding beyond a sensor chip does not change easily due to surface tension, even if the application amount changes slightly. As an adhesive layer becomes thicker, its bonding strength also improves. Although it does not relate to a magnetic sensor device, Patent Publication JP-A-2010-205893 discloses that, in a semiconductor device in which a semiconductor element is mounted on a support via an adhesive layer, a recessed portion is formed on a back surface of the semiconductor element facing a support substrate.

[0011] However, unlike the semiconductor device described in patent publication JP-A-2010-205893, a magnetic sensor device includes a magnetic detection element formed of a magnetic material. When an external force is applied to a magnetic material, its response to a magnetic field fluctuates due to the inverse magnetostriction effect. In particular, although a tunnel magnetoresistive element has excellent output characteristics with a high MR ratio, its output characteristics are likely to fluctuate due to an external force.In addition, when a bottomed hole or a through-hole is formed in a sensor substrate, a thickness of the sensor substrate changes locally, so that there is a risk that thermal deformation when the sensor substrate expands or contracts due to a temperature change becomes uneven and a thermal stress may be applied to the magnetic detection element.

[0012] The present disclosure has been made in view of these circumstances, and its object is to provide a magnetic sensor device that can adequately attach a sensor substrate to a support substrate and has stable output characteristics.

[0013] A preferred embodiment will be described with reference to the accompanying drawings. Moreover, in each figure, the elements with the same reference numerals have the same or similar configurations. A magnetic sensor device 1 according to an embodiment of the present disclosure includes a hole portion 11 formed in a sensor substrate 10, and, as shown in FIGS. Fig. 17 to 24, in a plan view in a plane normal direction Z, each of a plurality of magnetic detection elements E is arranged so as not to overlap corners C1, C2, C3... of a contour O11 of the hole part 11. The contour O11 of the hole part 11 may be a polygon, such as a quadrilateral, including a plurality of corners C1, C2, C3..., or may be a circle not including the corners C1, C2, C3... The corners C1, C2, C3... may be reformulated, for example, as vertices C1, C2, C3... whose curvatures have the maximum value. The contour O11 of the hole part 11 may be a combination of a drop-shaped vertex C1 and a curved line. For circular arcs with constant curvatures, each lying between two straight lines, such as an angle R, the corners C1, C2, C3... can be the centers of the circular arcs (see Fig. 10B).

[0014] The magnetic sensor device 1 according to the embodiment of the present disclosure includes a support substrate 2 and the sensor substrate 10, which is attached to the support substrate 2 with an adhesive AD. The sensor substrate 10 has a first surface 10B facing the support substrate 2 and a second surface 10A located on a side opposite the first surface 10B and is provided with a functional film 20 enclosing the plurality of magnetic detection elements E. The adhesive AD is filled in the hole part 11 formed in a bottomed hole recessed from the first surface 10B toward the second surface 10A or in a through-hole extending from the first surface 10B to the second surface 10A. The contour O11 of the hole part 11 has at least one vertex C1, C2, C3, etc.whose curvature has the maximum value, and each of the plurality of magnetic detection elements E is arranged so as not to overlap any of the at least one vertex C1, C2, C3... in a plan view in the plane normal direction Z from the second surface 10A to the first surface 10B. In the magnetic sensor device 1 according to another embodiment of the present disclosure, the contour O11 of the hole part 11 is a circle that does not include the vertices C1, C2, C3... whose curvatures have the maximum value. The magnetic sensor device 1 of the present disclosure has the same or corresponding technical features in that the magnetic detection elements E are arranged so as not to overlap the vertices C1, C2, C3... whose curvatures have the maximum value, regardless of whether the contour O11 of the hole part 11 is polygonal or circular.Each configuration is described below with reference to the . Fig. 1 to 25 are described in detail.

[0015] Fig. 1 is a perspective view showing a magnetic sensor device 1 according to an embodiment. As illustrated, the magnetic sensor device 1 may include a support substrate 2, a sensor chip 3, a wiring layer 4, a sealing resin 5, electrodes 6, and the like. A magnetic sensor device 1 may include a plurality of sensor chips 3.

[0016] In the following, some embodiments and modification examples of the technology will be described in detail with reference to the accompanying drawings. It should be noted that the following description is directed to illustrative examples of the disclosure and should not be construed as limiting the technology. Factors including, but not limited to, numerical values, shapes, materials, components, positions of the components, and the manner in which the components are connected to each other are only illustrative and should not be construed as limiting the technology. Furthermore, elements in the following embodiments that are not recited in any of the most generally worded independent claims of the disclosure are optional and can be provided as needed. The drawings are schematic and not to be considered to scale.Like elements are designated by the same reference numerals to avoid redundant descriptions. As in . Fig. 1, the support substrate 2 may be formed in the shape of a flat plate having an upper surface 2A and a lower surface 2B on a side opposite to the upper surface 2A. In the following description, a thickness direction of the support substrate 2 is referred to as a plane normal direction Z or a vertical direction Z, a direction from the lower surface 2B to the upper surface 2A is referred to as upward, and a direction from the upper surface 2A to the lower surface 2B is referred to as downward. The upper surface 2A may extend parallel to an XY plane orthogonal to the plane normal direction Z.

[0017] Fig. 2 is a cross-sectional view schematically showing an example of an internal structure of the Fig. 1. As illustrated, the support substrate 2 is an application-specific integrated circuit (ASIC), and electrodes 2E electrically connected to the wiring layer 4 are provided on the upper surface 2A. The support substrate 2 is not limited to an ASIC and may be a silicon substrate or a sapphire substrate. It may be a relay substrate (interposer) on which only wiring is formed without integrated circuits.

[0018] The sensor chip 3 is fixed with the adhesive AD on the upper surface 2A of the carrier substrate 2. As in Fig. As shown in Figure 2, the sensor chip 3 includes the sensor substrate 10, at least one magnetic detection element array 30 that generates a detection signal, the functional film 20 surrounding the magnetic detection element array 30, and the like. The functional film 20 may be an inorganic film formed mainly of silicon dioxide (SiO2), or it may be a laminated film composed of an inorganic film formed mainly of silicon dioxide and an inorganic film formed mainly of aluminum oxide (Al2O3).

[0019] The sensor substrate 10 may be, for example, a silicon substrate. It may be arranged between the upper surface 2A of the support substrate 2 and the functional film 20. The sensor substrate 10 has a first surface (lower surface) 10B facing the support substrate 2 and a second surface 10A on the opposite side to the first surface 10B. The functional film 20 enclosing the magnetic detection element array 30 is provided on the second surface 10A. The hole portion 11 is formed in the first surface 10B of the sensor substrate 10 and may be filled with the adhesive AD. The hole portion 11 may be a bottomed hole recessed from the first surface 10B toward the second surface 10A of the sensor substrate 10, or a through-hole extending from the first surface 10B to the second surface 10A.

[0020] Each of the arrays of magnetic detection elements 30 may be configured from a plurality of magnetic detection elements E (shown in Fig. 17) connected in a daisy chain and arranged in a matrix. An example of a magnetic detection element E can be a tunnel magnetoresistance (TMR) element. The magnetic detection element E is not limited to a TMR element, but can also be a giant magnetoresistance (GMR) element, an anisotropic magnetoresistance (AMR) element, a Hall effect element, or another type of magnetic detection element. A TMR element is particularly suitable for the magnetic detection element E because, compared to other types of MR elements, it has a small connection area, which allows the sensor chip 3 to be made smaller, and it has a high MR ratio, which can increase the performance of the sensor chip 3.

[0021] The magnetic detection element array 30 may be disposed on the upper surface 2A side of the support substrate 2 and formed in a first layer L1 on the upper surface 2A of the support substrate 2. The wiring layer 4 may be disposed on the upper surface 2A of the support substrate 2 and formed in a second layer L2 different from the first layer L1. The second layer L2 is located at a position farther away from the support substrate 2 than the first layer L1.

[0022] The wiring layer 4 may extend parallel along the upper surface 2A of the support substrate 2 and electrically connect the electrodes 2E of the support substrate 2 to the electrodes 3E provided on an upper surface 3A of the sensor chip 3 via a plurality of vias 40 extending in the plane-normal direction Z. The wiring layer 4 may be arranged to partially overlap the sensor substrate 10 in the plane-normal direction Z.

[0023] The sealing resin 5 may be disposed on the upper surface 2A of the support substrate 2 and may cover the sensor chip 3 and the wiring layer 4. The sealing resin 5 may be configured by forming a plurality of resin layers 51, 52, 53 (shown in Fig. 3A to 3G) extending parallel along the upper surface 2A of the support substrate 2. The wiring layer 4 may be, for example, a copper coating applied to upper surfaces of the resin layers 51 and 52. The electrodes 6 are, for example, solder balls or copper pillars and may be electrically connected to the wiring layer 4 and protrude from the sealing resin 5.

[0024] Fig. 3A to 3G are perspective views showing a manufacturing process for the Fig. 1 illustrate the magnetic sensor device 1 shown in FIG. Fig. 3A, the sensor chip 3 is bonded with the adhesive AD (shown in Fig. 2) is attached to the upper surface 2A of the support substrate 2. In this case, if the adhesive AD is insufficiently applied, the adhesive is easily peeled off from a position where no adhesive is applied, and if the adhesive AD is excessively applied, the adhesive protruding beyond the sensor chip 3 adheres to the electrodes 2E on the upper surface 2A of the support substrate 2. For this reason, the adhesive AD is applied, for example, so that it slightly protrudes beyond a bottom surface of the sensor chip 3.

[0025] As in Fig. 3B, the resin layer (first resin layer) 51 may be formed to cover the sensor chip 3 and the upper surface 2A of the support substrate 2, or there may be through holes 40P for the vias 40 (in Fig. 2) at positions of electrodes 2E and 3E (in Fig. 10A to 10G). As shown in Fig. As shown in Figure 3C, a seed layer may be formed by sputtering or the like, and the vias 40 and the first wiring layer 41 may be formed by plating. Fig. The methods shown in Figure 3C can be subtractive or additive methods.

[0026] As in Fig. 3D, the resin layer (second resin layer) 52 may be formed to cover the vias 40, the first wiring layer 41, and the resin layer 51, and the through holes 40P for the vias 40 may be open. As shown in Fig. 3E, the vias 40 and the second wiring layer 42 may be formed by a method similar to that shown in Fig. 3C. As in Fig. 3F, the resin layer (third resin layer) 53 may be formed to cover the vias 40, the second wiring layer 42, and the resin layer 52, or through holes 6P may be opened for the electrodes 6. As shown in Fig. 3G, the electrodes 6 can be formed by filling the through-holes 6P with solder or the like. According to the Fig. 3A to 3G, the method shown in Fig. 1 can be obtained by electrically connecting the separately manufactured carrier substrate 2 to the sensor chip 3.

[0027] Fig. 4A and Fig. 4B are diagrams showing an example of the magnetic sensor device 1 configured as an angle sensor that generates a detection value corresponding to an angle of a detection target. As illustrated, the magnetic sensor device 1 may be configured as an angle sensor that detects an angle of a rotatable magnet 300 with a cylinder's central axis O as the rotation axis. In the illustrated example, the X-direction, the Y-direction, and the Z-direction may be orthogonal to each other, and the central axis O may be parallel to the Z-direction.

[0028] The magnetic sensor device 1 can detect a first component oriented in a direction parallel to the X direction of a magnetic field component MF, which is a magnetic field generated by the magnet 300 and applied to the magnetic sensor device 1, and generate a first detection signal representing an intensity of the first component, or can detect a second component oriented in a direction parallel to the Y direction of the magnetic field generated by the magnet 300 and generate a second detection signal representing an intensity of the second component. A processor (not shown) can calculate the angle θ that the magnetic field generated by the magnet 300 forms with respect to a reference direction DR by calculating an arctangent of a ratio of the first detection signal to the second detection signal.

[0029] Fig. Fig. 5 is a diagram showing an example of the magnetic sensor device 1 configured as a magnetic compass that generates a detection value corresponding to an earth magnetism angle. As shown in Fig. 5, the magnetic sensor device 1 may include three sensor chips 3 (first to third sensor chips 3X, 3Y and 3Z) and may be configured such that the first to third sensor chips 3X, 3Y and 3Z each detect components in three mutually orthogonal directions of an external magnetic field.

[0030] Fig. 6 is a diagram showing an example of the magnetic sensor device 1 used as part of a current sensor 400 that generates a detection value corresponding to a current value of a detection target. In the illustrated example, the current sensor 400 may be configured to detect a value of an electric current Itg flowing through a busbar 410. The electric current Itg generates a magnetic field MF around the busbar 410. The current sensor 400 may be disposed near the busbar 410 at a location where the magnetic field MF is present.

[0031] Fig. 7 is a diagram showing a circuit configuration of the Fig. 6. In the illustrated example, the current sensor 400 can be configured as a magnetically balanced current sensor. The current sensor 400 includes a coil 420 in addition to the magnetic sensor device 1. The coil 420 is a coil for generating a second magnetic field MF2 that cancels a first magnetic field MF1 of the magnetic field MF. The magnetic sensor device 1 can detect a residual magnetic field between the first magnetic field MF1 and the second magnetic field MF2 and generate a magnetic field detection value S depending on the strength of the magnetic field.

[0032] The current sensor 400 may further include a feedback circuit 430, a current detector 440, and the like. The feedback circuit 430 may cause a feedback current to flow through the coil 420 based on the magnetic field detection value S to generate the second magnetic field MF2. The current detector 440 may detect a value of the feedback current flowing through the coil 420. The current detector 440 may, for example, be a resistor inserted into a current path of the feedback current. In this case, a potential difference across the resistor may correspond to a detected value of the feedback current. Since the detected value of the feedback current is proportional to a value of the electric current Itg of the busbar 410, the value of the electric current Itg can be detected based on the detected value of the feedback current.

[0033] The magnetic sensor device 1 of the present disclosure can be incorporated into an electronic device such as an information device and used as a magnetic compass that detects geomagnetism, as part of an autofocus mechanism or an optical image stabilization mechanism of a camera module, as an angle sensor that detects an angle formed by a magnetic field generated by a magnet with respect to a reference direction, or as part of a current sensor that detects a value of an electric current flowing through a busbar. According to these aspects, the magnetic sensor device 1 can be used for various purposes.

[0034] Fig. 8 is a perspective view showing an example of the magnetic sensor device 1 used as part of an autofocus mechanism and an optical image stabilization mechanism of a camera module 200. Fig. 9 is a cross-sectional view showing an internal structure of the Fig. 8. The autofocus mechanism and optical image stabilization mechanism of the camera module 200 may include a drive device 230 that moves a lens 220. The drive device 230 may be controlled based on position information of the lens 220 detected by a plurality of magnetic sensor devices 1.

[0035] In particular, the autofocus mechanism can detect a state in which an object is in focus using an image sensor, autofocus sensor, or the like, and move a lens in the Z direction relative to the image sensor. The optical image stabilization mechanism can detect camera shake using a gyro sensor or the like and move the lens in the U direction and / or V direction relative to the image sensor.

[0036] The camera module 200, which is Fig. 8 may include an image sensor 210, such as CMOS, a lens 220 aligned with the image sensor 210, a first support member 241 movable in the U-direction and V-direction with respect to the image sensor 210, a second support member 242 movable in the Z-direction with respect to the first support member 241, a plurality of elastically deformable wires 244 supporting the first support member 241 and the second support member 242, a drive device 230 moving the first support member 241 and the second support member 242, and a housing 250 accommodating them, and the like.

[0037] In addition to the drive device 230 and the plurality of magnetic sensor devices 1, the autofocus mechanism and the optical image stabilization mechanism of the camera module 200 may include a processor that controls the drive device 230, an autofocus sensor that detects a state where an object is in focus, a gyro sensor that detects camera shake, and the like. A processor, an autofocus sensor, a gyro sensor, and the like (not shown) may be arranged outside the housing.

[0038] The lens 220 can be mounted in the second holding element 242, which has a cylindrical shape. The second holding element 242 can be housed in the first box-shaped holding element 241 for each lens 220. At least one second magnet 243 can be attached to the second holding element 242 so that at least one magnetic sensor device 1 can detect position information of the second holding element 242.

[0039] The drive device 230 may include a plurality of first coils 231, a plurality of second coils 232, a plurality of first magnets 233, and the like. The plurality of first coils 231 may be fixed to the housing 250. The plurality of second coils 232 may be fixed to the second support member 242. The plurality of first magnets 233 may be fixed to the first support member 241. Each of the plurality of first coils 231 may face the corresponding first magnet 233. Each of the plurality of second coils 232 may face the corresponding first magnet 233.

[0040] In the case of the autofocus mechanism, when an electric current flows through any second coil 232 in response to a command from the processor, the second holding member 242 attached to the second coil 232 can be moved in the Z direction due to the interaction between the magnetic field generated by the first magnet 233 and the magnetic field generated by the second coil 232. At least one magnetic sensor device 1 generates a detection signal based on a composite magnetic field in which a magnetic field generated by at least one second magnet 243 attached to the second holding member 242 and a magnetic field generated by the first magnet 233 attached to the first holding member 241 are combined, and sends the detection signal to the processor.The processor can detect the position information of the lens 220 in the Z direction from the detection signal and control the drive device 230 so that the object is in focus.

[0041] In the case of the optical image stabilization mechanism, the first support member 241 attached to the first magnet 233 can be moved in the U-direction and / or V-direction due to the interaction between the magnetic field generated by the first magnet 233 and the magnetic field generated by the first coil 231 when an electric current flows through any one of the first coils 231 in response to a command from the processor. Each of the plurality of magnetic sensor devices 1 can generate a detection signal based on a position of the corresponding first magnet 233 and send it to the processor. The processor can detect the position information of the lens 220 in the U-direction and V-direction from the detection signal and control the drive device 230 to correct camera shake.

[0042] Hereinafter, the magnetic sensor device 1 of the present disclosure will be described with reference to Fig. 10A to 25 described in detail. Fig. 10A is a plan view of a simulation model in which a hole part 11 whose contour O11 is quadrangular is formed in the first surface 10B of the sensor substrate 10, viewed in the plane normal direction Z, and shows positions P and Q drawn on the upper surface 3A of the sensor chip 3.

[0043] As in Fig. 10A, the plotting is performed with the position immediately above the corner C1 of the hole part 11 of a square of 280 µm in the X-axis and Y-axis directions as P=0, and the positions 10 µm away from it in both the X-axis and Y-axis directions as P=1, 2, 3, ..., and 14. For example, P=14 is located at the position 140 µm away from P=0 in both the X-axis and Y-axis directions. Similarly, the plotting is performed with the position immediately above the corner C1 as Q=0, and the positions 10 µm away from it in the X-axis direction as Q=1, 2, 3, ..., and 14, respectively.

[0044] Fig. 10B is a plan view of a simulation model in which a hole portion 11, whose contour O11 is a quadrilateral with rounded (R) corners, is formed in the first surface 10B of the sensor substrate 10, viewed in the plane normal direction Z, and shows the position P drawn on the upper surface 3A of the sensor chip 3. As shown in Fig. 10B, the drawing is carried out with the position immediately above the corner C1 of the hole part 11 of a square of 340 µm in the X-axis and Y-axis directions, which has rounded (R) corners with a diameter of 200 µm, as P=0 and the positions 10 µm away therefrom in both the X-axis and Y-axis directions as P=1, 2, 3, ... and 14.

[0045] Fig. 10C is a plan view of a simulation model in which a circular hole portion 11 is formed in the first surface 10B of the sensor substrate 10, viewed in the plane normal direction Z, and shows the position P drawn on the upper surface 3A of the sensor chip 3. As shown in Fig. 10C, the drawing is carried out with the position immediately above the contour O11 of the circular hole part 11 with a diameter of 400 µm as P=0 and the positions 10 µm away from it in both the X-axis and Y-axis directions as P=1, 2, 3, ... and 14.

[0046] Fig. 10D is a top view of a simulation model in which the Fig. 10A also includes a wiring layer 4 of 100 µm square in the X-axis and Y-axis directions, viewed in the plane normal direction Z. The wiring layer 4 is arranged so that its center is at position P=0. In the simulation results of Fig. 15, which are described below, include the Fig. 10B and Fig. 10C shown models similar to Fig. 10D also includes the wiring layer 4 of a square of 100 µm in X-axis and Y-axis directions, which is arranged so that the position P=0 becomes its center.

[0047] Fig. 10E is a plan view of a simulation model having an inner surface 11C inclined with respect to the plane normal direction Z, viewed in the plane normal direction Z, and showing the position P drawn on the upper surface 3A of the sensor chip 3. As shown in Fig. 10E, the simulation model is a hole part 11 of a square of 400 µm in X-axis and Y-axis directions, and a depth D of the deepest center thereof, which is in Fig. 11, which will be described below, is 15 µm, there is no bottom surface 10D, and instead, an inner surface 11C thereof is formed as an inclined surface or in a step shape. In this simulation model, the Fig. 10D is added near the corner C1 of the hole part 11, and the drawing is made with the position immediately below the center of the wiring layer 4 as P=0 and the positions 10 µm away therefrom in both the X-axis and Y-axis directions as P=1, 2, 3, ... and 14.

[0048] Fig. 11 is a cross-sectional view of the simulation model taken along an XY plane orthogonal to the plane normal direction Z. Furthermore, the contour O11 of the hole part 11 is a contour of a bottom surface 11D of the hole part 11 and is defined by a boundary between the bottom surface 11D and the inner surface 11C. A rounded (R) corner may be provided at the boundary between the bottom surface 11D and the inner surface 11C. In this case, when the bottom surface 11D is flat and the depth D from the first surface 10B to the bottom surface 11D is substantially constant, the position where the depth D begins to gradually decrease is the boundary between the bottom surface 11D and the inner surface 11C.

[0049] In the simulation results of Fig. 12 to 16, which will be described below, a thickness T of the sensor substrate 10 from the first surface 10B to the second surface 10A is 15 µm, and a film thickness of the functional film 20 is also 15 µm. In the simulation results of Fig. 15, which will be described below, the distance from the upper surface 3A of the sensor chip 3 to a lower surface of the wiring layer 4 is 5 µm.

[0050] Fig. 12 is a diagram showing simulated angular errors at each Fig. 11 shown depth D at the Fig. 10A, and the simulation results of the angular errors are plotted on the vertical axis in a case where the Fig. 10A is changed to 15 patterns from 0 to 14 on the horizontal axis, the depth D from the first surface 10B of the sensor substrate 10 to the bottom surface 11D of the Fig. 11 is changed to 4 patterns of 0 µm, 5 µm, 7.5 µm and 15 µm and a predetermined stress value is applied to the magnetic sensor device 1.

[0051] If the depth D is less than 15 µm, the hole portion 11 is formed as a bottomed hole recessed from the first surface 10B toward the second surface 10A of the sensor substrate 10. If the depth D is 15 µm, the hole portion 11 is formed as a through-hole extending from the first surface to the second surface. Even if the hole portion 11 is a through-hole, the magnetic detection elements E are fixed by the functional film 20 surrounding the magnetic detection elements E.

[0052] As in Fig. As shown in Figure 12, in the model where the corner C1 is not rounded, the angular error increases as a position in the simulation results approaches P=0. When the magnetic detection elements E are located immediately above the corner C1, they are likely to be affected by thermal stress on the sensor substrate 10. When the corner C1 is not rounded, each of the magnetic detection elements E is arranged at intervals of, for example, 10 μm or more from each of the corners C1 to C4 in an in-plane direction perpendicular to the plane normal direction Z. In addition, the angular error increases as the depth D of the hole portion 11 becomes larger. For example, the depth D of the hole portion 11 is less than or equal to half the thickness T of the sensor substrate 10, which is 30 μm.

[0053] Fig. 13 is a diagram showing simulated angular errors at each Fig. 11 shown depth D at the Fig. 10A, and the simulation results of the angular errors are plotted on the vertical axis in a case where the Fig. 10A shown position Q is changed to 14 patterns from 1 to 14 on the horizontal axis, the depth D of the Fig. 11 is changed to 4 patterns of 0 µm, 5 µm, 7.5 µm and 15 µm and a predetermined stress value is applied to the magnetic sensor device 1.

[0054] As in Fig. As shown in Figure 13, for the model where the corner C1 is not rounded, the angular error increases as a position in the simulation results approaches Q=0 (the same value as the value in Fig. 12). If the magnetic detection elements E are located immediately above the corner C1, they are likely to be affected by the thermal stress of the sensor substrate 10. If the corner C1 is not rounded, regardless of whether the position P moves away from the contour O11 of the hole part 11 or Q moves along the contour O11 of the hole part 11, the general tendency is that the angular error increases the closer a position is to the corner C1.

[0055] Fig. Figure 14 shows the simulated angular errors in a case where the depth D of the hole part 11 is set to 15 µm, which in Fig. 10A, Fig. 10B and Fig. 10C are changed to 15 patterns from 0 to 14 and a predetermined load value is applied to the magnetic sensor device 1.

[0056] As in Fig. As shown in Figure 14, the angular error increases in the order of the model in which the contour O11 of the hole part 11 is a quadrilateral with rounded corners, a circular model, and a quadrilateral model. In all models, the angular error tends to increase as a position is closer to P=0, but in the model in which the contour O11 of the hole part 11 is a quadrilateral with rounded corners, the angular error is equal to or less than one-seventh of the angular error in the model in which the contour O11 of the hole part 11 is a quadrilateral without a rounded corner, even if the position is immediately above the corner C1.

[0057] Fig. Figure 15 shows the simulated angular errors in a case where the depth D of the hole part 11 is set to 15 µm, which in Fig. 10D shown wiring layer 4 is added, which in Fig. 10A, Fig. 10B and Fig. 10C are changed to 15 patterns from 0 to 14 and a predetermined load value is applied to the magnetic sensor device 1.

[0058] Comparing the simulation results of the Fig. 14 and Fig. 15 with each other, regardless of whether the contour O11 of the hole part 11 is a quadrilateral, a rounded (R) quadrilateral, or a circle, it can be seen that the model with the wiring layer 4 at positions P=0 to 3 on the inner side of the contour O4 of the wiring layer 4 tends to have a smaller angular error than the model without the wiring layer 4. This means that they are expected to be less likely to be affected by the thermal stress of the sensor substrate 10. However, in the quadrilateral model, the model with the wiring layer 4 at positions P=4 to 6 near the contour O4 of the wiring layer 4 has a larger angular error than the model without the wiring layer 4.

[0059] Fig. 16 shows the simulated angular errors in a case where the Fig. 10E shown position P is changed to 15 patterns from 0 to 14 and a predetermined load value is applied to the magnetic sensor device 1. Comparing the simulation results of the Fig. 15 and Fig. 16, the angular errors in both the model in which the inner surface 11C is inclined with respect to the plane normal direction Z and the model in which the inner surface 11C is formed in a step shape are larger than the angular error of the model in which the inner surface 11C is not inclined. That is, there is a tendency that they are likely to be influenced by the thermal stress of the sensor substrate 10.

[0060] A suitable example of the present disclosure will be described with reference to the Fig. 17 to 25. As described above with reference to the Fig. 12 and Fig. 13, the magnetic detection elements E are likely to be affected by the thermal stress of the sensor substrate 10 immediately above the non-rounded corner, resulting in a large angular error. Fig. 17 to 20 are plan views showing first to fourth examples in which corners overlapping the magnetic detection elements E are rounded. As described with reference to Fig. As described in Figure 14, by forming a rounded corner, it is possible to reduce the angular error even if the position is immediately above the corner.

[0061] In the Fig. In the first to fourth examples shown in Figures 17 to 20, the contour O11 is quadrangular and includes a first corner that overlaps at least one of the plurality of magnetic detection elements E in a plan view. A radius of curvature of the first corner is formed to be 5 µm or more. In the example shown in Fig. In the first example shown in Figure 17, corners C2 and C3 are rounded with a radius of curvature of 5 µm or more. Corners C2 and C3 are examples of the first corner.

[0062] While the positions overlapping corners C2 and C3 with a curvature radius of 5 µm or more are slightly more likely to be affected by thermal stress than the positions that do not overlap any of the corners C1 to C4, they have a sufficiently small influence of thermal stress compared to the positions overlapping corners C1 and C4 with a curvature radius of less than 5 µm. According to the first example, it is possible to provide the magnetic sensor device 1 having stable output characteristics. In addition, since the magnetic detection elements E can be arranged to overlap corners C2 and C3 with a curvature radius of 5 µm or more, according to the first example, there are fewer restrictions on the arrangement of the magnetic detection elements E than when all corners C1 to C4 of the hole part 11 must be avoided. The degree of freedom in design is excellent.

[0063] In the first example, the plurality of magnetic detection elements E include at least a first magnetic detection element E1 arranged so as to overlap the contour O11 in a plan view, and the plurality of second magnetic detection elements E2 arranged so as not to overlap the contour O11 in a plan view. A part of the plurality of second magnetic detection elements E2 are arranged on the inside of the contour O11 in a plan view, and the rest of the plurality of second magnetic detection elements E2 are arranged on the outside of the contour O11 in a plan view. In other words, in the Fig. In the first example shown in Figure 17, the magnetic detection elements E are arranged across the inside and outside of the contour O11.

[0064] In the second and third examples, which are shown in the Fig. 18 and Fig. 19, all of the majority of corners C1 to C4 are rounded with a radius of curvature of 5 µm or more. In the second, in Fig. In the example shown in Figure 18, all second magnetic detection elements E2 are arranged on the inside of the contour O11 in plan view. In the third, in Fig. In the example shown in Fig. 19, all the second magnetic detection elements E2 are arranged on the outer side of the contour O11 in plan view. According to the second and third examples, since all of the plurality of corners C1 to C4 are rounded with a radius of curvature of 5 μm or more, the influence of thermal stress is small even when the magnetic detection elements E are arranged at one of the corners C to C4. It is possible to provide the magnetic sensor device 1 with stable output characteristics. Since the magnetic detection elements E can be arranged to overlap the corners C1 to C4, there are fewer restrictions on the arrangement of the magnetic detection elements E than in the case where the corners C1 to C4 must be avoided.

[0065] As in the Fig. In the third example shown in Figure 19, the hole part 11 can be arranged across a plurality of bridge circuits. In the Fig. In the examples shown in Figures 17 to 20, the magnetic sensor device 1 includes first to fourth magnetic detection element arrays 31, 32, 33, and 34, and a first bridge circuit is configured by two parallel circuits. In the third, in Fig. 19, the magnetic sensor device 1 further includes fifth to eighth magnetic detection element arrays 35, 36, 37, and 38, and a second bridge circuit is configured by two parallel circuits.

[0066] The first magnetic detection element array 31 and the second magnetic detection element array 32 may be connected in series with each other with an output port A therebetween to form one parallel circuit of the first bridge circuit, and the third magnetic detection element array 33 and the fourth magnetic detection element array 34 may be connected in series with each other with an output port B therebetween to form the other parallel circuit of the first bridge circuit.Likewise, the fifth magnetic detection element array 35 and the sixth magnetic detection element array 36 may be connected in series with the output port A therebetween to form one parallel circuit of the second bridge circuit, and the seventh magnetic detection element array 37 and the eighth magnetic detection element array 38 may be connected in series with the output port B therebetween to form the other parallel circuit of the second bridge circuit. The output ports A and B may be connected to a galvanometer or the like.

[0067] Fig. Fig. 20 is a plan view showing the fourth example in which the wiring layer 4 is connected to the Fig. 17, so that the magnetic detection elements E can be arranged on the inside of the contour O4 of the wiring layer 4. In the fourth example, similar to the first example, the corners C2 and C3 with a radius of curvature of 5 μm or more are rounded. The corners C2 and C3 are examples of the first corner. According to the fourth example of the present disclosure, since the magnetic detection elements E can be arranged to overlap the corners C2 and C3 with a radius of curvature of 5 μm or more, it is possible to provide the magnetic sensor device 1 having stable output characteristics. There are fewer restrictions on the arrangement of the magnetic detection elements E compared to the case where all corners C1 to C4 of the hole part 11 must be avoided, and the degree of freedom in design is excellent. As described with reference to Fig. 15, the addition of the wiring layer 4 reduces the angular error on the inside of the contour O4 of the wiring layer 4. In the fourth example, it is expected that the influence of the thermal stress will be even smaller than in the first example.

[0068] Fig. 21 is a cross-sectional view showing a fifth example in which the magnetic detection elements can be arranged so as not to overlap the inclined inner surface. As described with reference to Fig.As described in Figure 16, when the inner surface 11C is inclined with respect to the plane normal direction Z, the position overlapping the inner surface 11C in a plan view tends to be affected by the thermal stress of the sensor substrate 10. In the ninth example, since each of the plurality of magnetic detection elements E cannot overlap the inclined inner surface 11C, the magnetic detection elements E are less likely to be affected by the thermal stress from the sensor substrate 10.

[0069] According to the magnetic sensor device 1 of the present disclosure configured as above, the hole portion 11 is formed in the sensor substrate 10, so that even if the application amount of the adhesive AD changes, the amount of the adhesive AD protruding from the first surface 10B of the sensor substrate 10 is less likely to change compared to the case where the hole portion 11 is not formed. The adhesive layer becomes thicker, and the adhesive strength also improves. Accordingly, the sensor substrate 10 can be adhered and fixed to the support substrate 2.In a plan view, when the corners of the contour O11 of the hole part 11 have a small radius of curvature, the positions overlapping the corners are likely to be affected by the thermal stress, and therefore the magnetic detection elements E are arranged to overlap only the first corner (for example, the corners C2 and C3) with a radius of curvature of 5 µm or more.While the positions overlapping the corners C2 and C3 with a curvature radius of 5 µm or more are slightly more likely to be affected by the thermal stress than the positions not overlapping the corners C1 to C4, they have a sufficiently small influence of the thermal stress compared to the positions overlapping the corners C1 and C4 with a curvature radius of less than 5 µm, and therefore it is possible to provide the magnetic sensor device 1 in which output characteristics of the magnetic detection element arrays 30 are stable.

[0070] The contour O11 may be a polygon in which all of the plurality of corners C1 to C4 are rounded with a radius of curvature of 5 µm or more. If the sensor substrate 10 can be fixed to the support substrate 2 with the adhesive AD and the hole portion 11 can be filled with the adhesive AD, the sensor substrate 10 can be appropriately fixed to the support substrate 2 with the adhesive AD.

[0071] The plurality of magnetic detection elements E may include at least a first magnetic detection element E1 arranged so as to overlap the contour O11 in a plan view, and the plurality of second magnetic detection elements E2 arranged so as not to overlap the contour O11 in a plan view, wherein a part of the plurality of second magnetic detection elements E2 may be arranged on the inside of the contour O11 in a plan view and the rest of the plurality of second magnetic detection elements E2 may be arranged on the outside of the contour O11 in a plan view.The plurality of magnetic detection elements E may further include at least one second magnetic detection element E2 arranged so as not to overlap the contour O11 in a plan view, and all of the at least one second magnetic detection element E2 may be arranged on the inside of the contour O11 in a plan view. All of the at least one second magnetic detection element E may be arranged on the outside of the contour O11 in a plan view.

[0072] According to these aspects, the first magnetic detection element E1, which can overlap the contour O11, and the second magnetic detection elements E2, which cannot overlap the contour O11, can be mixed. The second magnetic detection elements E2 can be arranged across the inside and outside of the contour O11, the second magnetic detection elements E2 can be arranged only on the inside of the contour O11, or the second magnetic detection elements E2 can be arranged only on the outside of the contour O11. The arrangement of the magnetic detection elements E is only slightly restricted, and the degree of freedom in design is excellent.

[0073] Each of the plurality of magnetic detection elements E may be arranged on the inner side of the contour O4 of the wiring layer 4 in a plan view. When the magnetic detection elements E are arranged on the inner side of the contour O4 of the wiring layer 4, the magnetic detection elements E are less likely to be affected by thermal stress than when the wiring layer 4 is not present.

[0074] The hole portion 11 may be a bottomed hole recessed from the upper surface (first surface) 10B toward the lower surface (second surface) 10A, and the depth D of the bottomed hole may be less than or equal to half the thickness T of the sensor substrate 10 in the plane normal direction. As the hole portion 11 may become deeper, a thickness difference of the sensor substrate between the thickness at the hole portion 11 and the thickness at other parts may increase, and when the sensor substrate 10 expands or contracts due to a temperature change, the magnetic detection elements E are likely to be affected by the thermal stress. According to this aspect, since the thickness difference may be less than or equal to half the thickness T, the influence of the thermal stress is unlikely to become excessive.

[0075] The above-described embodiments are intended to facilitate understanding of the present invention and are not to be construed as limiting the present invention. Each of the elements included in the embodiments, as well as their arrangements, materials, states, shapes, sizes, and the like, are not limited to those shown and can be modified as needed. Furthermore, it is possible to partially replace or combine the structures shown in the various embodiments. QUOTES CONTAINED IN THE DESCRIPTION

[0000] This list of documents submitted by the applicant was generated automatically and is included solely for the convenience of the reader. This list is not part of the German patent or utility model application. The DPMA assumes no liability for any errors or omissions. Cited patent literature

[0000] JP 2023-100072

[0001] JP-A-2023-10557 [0003, 0008] JP-A-2010-205893 [0003, 0010, 0011]

Claims

[1] A magnetic sensor device (1) comprising: a carrier substrate (2) and a sensor substrate (10) attached to the carrier substrate, wherein the sensor substrate includes a first surface (10B) facing the support substrate and a second surface (10A) located on a side opposite the first surface and provided with a functional film (20) including a plurality of magnetic detection elements (E), a hole part (11) is formed in the first surface, a contour (011) of the hole part includes at least one corner (C1, C2, C3...) and the at least one corner includes a first corner (C1) that overlaps at least one of the plurality of magnetic detection elements in a plan view in a plane normal direction (Z) from the second surface to the first surface, and the first corner has a radius of curvature of 5 µm or more. [2] The magnetic sensor device according to claim 1, wherein the sensor substrate is attached to the carrier substrate using an adhesive (AD) and the hole part is filled with the adhesive. [3] The magnetic sensor device according to claim 1, wherein at least one corner is a plurality of corners and the contour is a polygon in which all of the majority of corners are rounded with a radius of curvature of 5 µm or more (R). [4] The magnetic sensor device according to claim 1, wherein the plurality of magnetic detection elements includes at least a first magnetic detection element (E1) arranged so as to overlap the contour in plan view, and a plurality of second magnetic detection elements (E2) arranged so as not to overlap the contour in plan view, and some of the plurality of second magnetic detection elements are arranged on an inner side of the contour in plan view and the rest of the plurality of second magnetic detection elements are arranged on an outer side of the contour in plan view. [5] The magnetic sensor device according to claim 1, wherein the plurality of magnetic detection elements includes at least one first magnetic detection element (E1) arranged so as to overlap the contour in plan view, and at least one second magnetic detection element (E2) arranged so as not to overlap the contour in plan view, and all of the at least one second magnetic detection element are arranged on an inner side of the contour in plan view. [6] The magnetic sensor device according to claim 1, wherein the plurality of magnetic detection elements includes at least one first magnetic detection element (E1) arranged so as to overlap the contour in plan view, and at least one second magnetic detection element (E2) arranged so as not to overlap the contour in plan view, and all of the at least one second magnetic detection element are arranged on an outer side of the contour in plan view. [7] The magnetic sensor device according to claim 1, wherein the hole part is a hole with a bottom which is recessed from the first surface to the second surface, and a depth of the hole with bottom is equal to or less than half a thickness of the sensor substrate in the plane normal direction. [8] The magnetic sensor device according to claim 1. further comprising a wiring layer (4) provided in a layer which is further away from the support substrate in the plane normal direction than the functional film, wherein each of the plurality of magnetic detection elements is arranged on an inner side of the contour of the wiring layer in plan view. [9] The magnetic sensor device according to claim 1, wherein the hole part includes an inner surface which is inclined with respect to the plane normal direction, and each of the plurality of magnetic detection elements is arranged so as not to overlap the inner surface in plan view. [10] An angle sensor comprising the magnetic sensor device according to claim 1. [11] A magnetic compass comprising the magnetic sensor device according to claim 1. [12] A current sensor (400) comprising the magnetic sensor device according to claim 1. [13] A camera module (200) having an autofocus mechanism and / or an optical image stabilization mechanism with the magnetic sensor device according to claim 1.

Images