Device for swiveling an optical component into a beam path of a semiconductor technology system and semiconductor technology system
The device addresses contamination and positioning issues in semiconductor technology by using solid-state pivot joints for precise, contamination-free rotation of optical components, ensuring high accuracy and cleanliness in EUV systems.
Patent Information
- Application Number
- DE102024121334
- Authority / Receiving Office
- DE · DE
- Patent Type
- Patents
- Current Assignee / Owner
- Filing Date
- 2024-07-26
- Publication Date
- 2026-01-15
- Estimated Expiration
- 2044-07-26
AI Technical Summary
Existing Bertrand modules in semiconductor technology systems suffer from friction-based actuators and kinematics that fail to meet high accuracy and cleanliness requirements, leading to contamination and insufficient positioning, especially in EUV semiconductor technology.
A device with a cantilever arm and solid-state pivot joints enables high-accuracy rotation of optical components like Bertrand modules, eliminating friction and reducing contamination risk through a compact design and elastic joints with no hysteresis or stick-slip effects.
The device achieves precise, contamination-free rotation of optical components with a large angle of rotation, maintaining positional accuracy and reducing the risk of contamination in sensitive semiconductor environments.
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Abstract
Description
[0001] The invention relates to a device for pivoting an optical component into a beam path of a semiconductor technology system and a semiconductor technology system, in particular a mask inspection system.
[0002] Semiconductor technology encompasses various processes for the fabrication of microstructured components, such as integrated circuits or LCDs (Liquid Crystal Displays). These processes include the fabrication and qualification of photolithographic masks, also known as photomasks or simply masks, the fabrication of substrates, particularly wafers, and the qualification of these substrates.
[0003] In the central process known as lithography or microlithography, the mask is illuminated by a lighting unit in a projection exposure system. The light passing through or reflected from the mask is projected by a projection lens onto a substrate (e.g., a wafer) coated with a photosensitive layer (photoresist) and positioned in the image plane of the projection lens. This transfers the structural elements of the mask onto the photosensitive coating of the substrate. The structure thus transferred to the substrate is then formed in an electrically conductive material in a further process step. A microstructured device typically comprises between 20 and 50 such layers, which interact to form a three-dimensional component. The process described above is therefore repeated several times.A single defect in just one layer during manufacturing can lead to the failure of the entire electrical component. Therefore, masks and wafers are inspected for potential defects using mask and wafer inspection systems, respectively. In the case of masks, certain defects can be repaired in a subsequent step.
[0004] The mask or wafer inspection systems use microscopes specially trained for this application, which may also include a so-called Bertrand module.
[0005] A Bertrand module, named after GB Amici and E. Bertrand, is a switchable lens system located between the objective lens (also known as the imaging optics) and the image plane. It incorporates a Bertrand element, either a lens or a mirror. In semiconductor technology, the Bertrand module is used to check the pupil illumination of the imaging optics. For this purpose, the Bertrand lens, or in the case of EUV semiconductor technology, the Bertrand mirror, is inserted or swung into the microscope's beam path, projecting the pupil plane of the imaging optics onto a sensor, such as a camera. This allows the position and illumination of the pupil plane of the imaging optics to be checked and, if necessary, corrected.
[0006] Devices for pivoting optical components into optical systems are known from the prior art. For example, German utility model DE 19 50 399 U discloses a pivoting device for a Bertrand lens, in which the Bertrand lens is aligned by means of a pivotable arm and fixed in place by means of a magnet. A lens that can be pivoted in via a cantilever arm is also known from Austrian patent AT 223 390 B.
[0007] Furthermore, German patent applications DE 103 16 590 A1 and DE 10 2022 209 878 A1 disclose systems for semiconductor technology in which devices for storing optical components with solid-state hinges are used.
[0008] The Bertrand modules known from the prior art have the disadvantage that they are operated with friction-based actuators and / or kinematics, which means they can no longer meet the very high requirements of EUV semiconductor technology systems operating in a vacuum. Further disadvantages include insufficient positioning accuracy when the lens or mirror is pivoted and / or the fact that the kinematics necessary for positioning accuracy result in a Bertrand module that is too large for the available installation space.
[0009] The object of the present invention is to provide a device which eliminates the disadvantages of the prior art explained above.
[0010] This problem is solved by a device having the features of independent claim 1. The dependent claims relate to advantageous further developments and variants of the invention.
[0011] An inventive device for pivoting an optical component into a beam path of a semiconductor technology system comprises a cantilever arm and the optical component arranged on the cantilever arm. The device further comprises at least one pivot joint by which the cantilever arm is pivotably mounted within the device. The device is characterized in that at least one pivot joint is designed as a solid-state joint. The solid-state joint enables the optical module, which can be designed, for example, as a Bertrand module, to be pivoted over a large angle of rotation with comparatively high accuracy and a small footprint. Furthermore, an elastically designed solid-state joint exhibits no hysteresis and no stick-slip effects, thereby achieving very high accuracy and reproducibility.
[0012] Unlike a pivot joint, a solid joint achieves rotational movement through the deformation, usually bending, of a typically elastic part of the joint. Film hinges are a typical example of a solid joint. Unlike typical pivot joints, solid joints do not involve sliding surfaces against each other, thus eliminating the need for lubrication and preventing particle abrasion caused by joint operation.
[0013] In particular, the rotation angle of the pivot joint during swiveling can be at least 27°, preferably at least 28°, and especially preferably at least 30°. The comparatively large rotation angle is due to the fact that, because of the high cleanliness requirements for protecting the optical elements in semiconductor technology systems, especially for EUV semiconductor technology, all components that could be contaminated by friction, outgassing of materials used (e.g., from kinematics and / or actuators), or other sources of contamination must be kept as far away as possible from the optical elements of the semiconductor technology systems. In particular, such components must not be arranged within an area designated as a mini-environment directly surrounding the optical elements.At the same time, no component of the device in a parked position of the optical module, which is only swung into the beam path for measurement purposes, may restrict the beam path relevant for measuring the substrates, such as masks or wafers.
[0014] In a further embodiment of the invention, the solid body joint can have at least two elastic sub-areas.
[0015] In particular, the at least two elastic sections can be connected via rigid connecting elements, resulting in a folded leaf spring whose individual elastic sections combine to form a total length. This can, to a first approximation, correspond to a conventional leaf spring with a corresponding total length. If several elastic sections are connected to each other with rigid connecting elements designed as deflections, where the deflections have an angle of 180°, the leaf spring can assume a meandering shape. Alternatively, any other conceivable folding of the leaf spring with the same total length can exhibit a comparable elastic effect. The folding of the leaf spring has the advantage that a comparatively large angle of rotation can be achieved in a relatively compact installation space.
[0016] Furthermore, the total length of the elastic sub-areas can be at least 450 mm, preferably at least 460 mm and particularly preferably at least 480 mm.
[0017] In a further embodiment of the invention, the center of gravity of the boom arm of the device can be located on the axis of rotation of the at least one pivot joint, which advantageously eliminates the need to consider any displacement of the position of the optical module due to gravity when positioning the arm.
[0018] In particular, the boom arm can have interchangeable counterweights to shift its center of gravity, especially towards the axis of rotation of the swivel joint, after the device has been mounted. The boom arm can thus be adjusted so that the position relevant for the operation of the optical module on the z-axis parallel to the axis of rotation is maintained during rotation.
[0019] In a further embodiment of the invention, the device can include a fixing device for the boom arm in a measuring position. The fixing device can, on the one hand, stiffen the tilting stiffness of the axis of rotation of the at least one torsion spring in the direction of the longitudinal extension of the boom arm. On the other hand, it can also stiffen other degrees of freedom, in particular the translational degrees of freedom, in which the solid-state joint is comparatively flexible due to its design. Furthermore, the fixing device can ensure that the optical module is maintained in a predetermined position.
[0020] The fixing device can, for example, comprise a magnet, in particular an electromagnet. The magnet is positioned in an area where the boom arm is in a predefined measuring position. In the case of the electromagnet, it can be activated after the boom arm has been positioned and fix the boom arm in this position. The magnet must exert a predefined force, depending on the additional stiffening of the system required. In addition to amplifying the magnetic field generated by the magnet, the distance between the magnet and the boom arm can also be reduced to increase the magnetic force. This distance can be less than 1 mm, preferably less than 0.5 mm, and particularly preferably less than 0.2 mm.
[0021] Furthermore, the boom arm can have an anchor plate for fixing the boom arm to the magnet. The anchor plate is advantageously made of a magnetizable material, allowing the boom arm, which due to its weight is usually made of a non-magnetic material, particularly aluminum, to be fixed in place by the magnet.
[0022] Alternatively, other embodiments for the fixing device are conceivable, such as a mechanical clamping device with an adjustable stop against which the boom arm can be pressed and thus clamped, for example by an actuator.
[0023] In a further embodiment of the invention, the device can have an actuator for deflecting the boom arm, which can be designed to pivot the boom arm from a parking position to a measuring position and back.
[0024] Furthermore, a force transmission element of the actuator with the swivel joint can be designed such that the actuator can only transmit tensile forces to the boom arm. The actuator can thus pull the boom arm from the measuring position to a parked position, whereby at least one swivel joint is pre-tensioned. When the boom arm is swung back into position, the restoring force of the swivel joint acts, so that no force is exerted on the boom arm by the actuator. This has the advantage that, during the positioning of the boom arm, which, as explained above, is defined by the fixation, there is no overdetermination due to a rigid force transmission element of the actuator. The force transmission element, which is flexible in the compressive direction, advantageously reduces the force acting on the boom arm by the actuator in the measuring position to a value irrelevant for positioning.
[0025] In a further embodiment of the invention, the at least one pivot joint can be arranged in a measuring position of the boom arm such that it exhibits no or virtually no deflection from its force-free zero deflection. The zero deflection is the deflection in which the leaf spring of the joint is stress-free, meaning no energy is stored in the spring in the form of a preload. Due to the stress-free leaf spring, no parasitic force can be exerted on the boom arm by the pivot joint. This has the advantage that deformations caused by parasitic forces do not affect the positioning of the boom arm, and that potential deformation of the optical module and the optical element held therein can be avoided. In combination with the connection of the actuator to the arm described above, the boom arm is held almost force-free in the measuring position, at least in its predetermined direction of rotation.
[0026] In a further embodiment of the invention, the device can comprise two mirror-image pivot joints with a common axis of rotation. The mirror-image design is necessary because a pivot joint rotated by 180° would result in one pivot joint being preloaded by the angle of rotation while the other is not. The resulting opposing restoring forces of the pivot joints would cancel each other out, and the restoring force for pivoting the boom arm, as described above, and in particular the nearly stress-free state of the pivot joints in the measuring position, would no longer be achieved.
[0027] In particular, the distance between the two mirror-image swivel joints can be at least 43 mm, preferably at least 45 mm, and especially preferably at least 50 mm.
[0028] An invention-based system for semiconductor technology comprises a device according to one of the embodiments described above.
[0029] In particular, the system can be configured as a mask inspection system, a mask repair system, a microscope, a projection exposure system, or a wafer inspection system.
[0030] Exemplary embodiments and variants of the invention are explained in more detail below with reference to the drawing. The drawing shows Fig. 1 a schematic representation of a Bertrand module according to the invention, Fig. 2 a detail of the invention, Fig. 3a,b another detail of the invention, Fig. 4a,b a further detail of the invention, and Fig. 5 a schematic representation of a mask inspection system known from the prior art.
[0031] Fig. Figure 1 shows a schematic representation of a Bertrand module 1, which has a housing 2 with a box 3 and a cantilever arm 5.1, 5.2 projecting from the box 3. Reference numeral 5.1 represents the cantilever arm in a measuring position and reference numeral 5.2 represents the cantilever arm in a parked position, which is shown in the Fig. 1 is shown with a dashed line. Box 3 is connected to a link 4 with which the housing 2 can be, for example, in a mask inspection system 31, as shown in the Fig. Section 5 explains in detail how it can be arranged. Reference numbers 6.1 and 6.2 denote the longitudinal axes of the extension arm 5.1 and 5.2.
[0032] The boom arm 5.1, 5.2 is mounted in the housing 2 and is designed to rotate about a pivot axis 7. The rotation of the boom arm 5.1, 5.2 allows it to be moved from the parked position to the measuring position, which is located in the Fig. The rotation angle α, by which the boom arm 5.1, 5.2 can be pivoted from the measuring position to the park position and vice versa, is shown in the diagram. Fig. 1. In the embodiment shown, the rotation angle is in a range of 20° to 30°, whereby smaller and especially larger rotation angles α can also be realized.
[0033] At the free end of the boom arm. 5.1, 5.2 is in the in the Fig. In the embodiment shown in Figure 1, an optical element designed as a Bertrand mirror 8 is arranged, which is held by a mirror holder 9 connected to the boom arm 5.1, 5.2. The optical element is directed into the beam path 43, 44 of the mask inspection system 31 ( Fig. 5) The pivoted Bertrand mirror 8 causes the pupil of the imaging optic 39 of the mask inspection system 31 to be imaged onto a sensor, such as a camera 32. This allows the pupil illumination to be checked and adjusted if necessary.
[0034] The boom arm 5.1 is connected via a [unclear] in the Fig. 1 non-visible power transmission element 15 ( Fig. 4) with an actuator 23 that is also not visible ( Fig. 4) connected, which moves the boom arm 5.1 from the measuring position to the position in the Fig. 1. The parking position of the boom arm 5.2 is shown in dashed lines.
[0035] The housing 2 of the device 1, and thus all components of the device 1 that could potentially contribute to contamination of the optical elements, are almost completely enclosed from the environment by the box 3 and arranged at a sufficient distance by the comparatively long boom arm 5.1, 5.2, so that the risk of contamination of the optical elements of the imaging optics 39 ( Fig. 5) is reduced to a non-critical level.
[0036] Fig. Figure 2 shows a section of the device 1, designed as a Bertrand module, in which the boom arm 5.1 is shown in the measuring position. The Fig. Box 3 shown is in the Fig. 2 is not shown, so that a bearing 16 of the boom arm 5.1 is clearly visible. The bearing 16 comprises two torsion springs 10.1, 10.2, which define the axis of rotation 7 of the boom arm 5.1. In the illustration of the Fig. In Figure 2, only the torsion spring 10.1 is visible; the second torsion spring 10.2 is hidden by other components.
[0037] The torsion springs 10.1, 10.2 each have two spring shells 17.11, 17.12, 17.21, 17.22, which each correspond to one end of the torsion springs 10.1, 10.2, wherein in the illustration of the Fig. 1 only the spring shell 17.11 is visible. Folded leaf springs 19.1, 19.2 are arranged between the spring shells, which are in the Fig. 3a will be explained in detail, whereby in the Fig. 2 only the leaf spring 19.1 of the torsion spring 10.1 can be seen.
[0038] The torsion springs 10.1, 10.2 are arranged in the device 1 such that they are pre-tensioned in the parked position of the measuring arm 5.2, while they have no or virtually no pre-tension in the measuring position of the boom arm 5.1. The restoring force of the torsion springs 10.1, 10.2 can therefore cause the boom arm 5.1, 5.2 to rotate from the parked position to the measuring position.
[0039] The torsion springs 10.1, 10.2 are connected on one side to a spring shell 17.11, 17.21 with connection 4 and on the other side to the spring shell 17.12, 17.22 with the cantilever arm 5.1. Both connections are in the Fig. In the embodiment shown in Figure 2, the connection is achieved by a clamping connection 11.1, 11.2, 13.1, 13.2. The outer diameters of the spring shells 17.11, 17.12, 17.21, 17.22 are clamped in clamping jaws 12.11, 12.12, 12.21, 12.22, 14.1, 14.2 of the clamping connections 11.1, 11.2, 13.1, 13.2. The spring shells 17.11, 17.21 located furthest from the longitudinal axis 6.1 of the cantilever arm 5.1 are connected to the connection 4, and the spring shells 17.12, 17.22 located closer to the longitudinal axis 6.1 of the cantilever arm 5.1 are connected to the cantilever arm 5.1. The torsion springs 10.1, 10.2 and their connection to the boom arm 5 are described in detail in the Fig. 3a and the Fig. 3b explained.
[0040] During assembly, springs 10.1 and 10.2 are pre-tensioned such that a minimal residual restoring force remains when the boom arm 5.1 reaches the measuring position. This is necessary to ensure that the measuring position is always reached, despite tolerances varying from device to device, due to the energy stored in the torsion springs 10.1 and 10.2. This minimal residual pre-tension is achieved by deflecting springs 10.1 and 10.2 by 1° relative to the direction of the longitudinal axis 6.1 of the boom arm. During the assembly of the device 1, the spring shells 17.12, 17.22 (not visible) of the torsion springs 10.1, 10.2, which are directed towards the arm 5.1, are first positioned via positioning bores 18.11, 18.21 arranged in clamping jaws 14.1, 14.2 of the cantilever arm 5.1 with corresponding bores 18.12, 18.22 ( Fig. 3a) The spring shells 17.12, 17.22 are aligned and clamped in this position. The pivot joint 10.1 is now connected to the boom arm 5.1 at a 1° angle relative to the direction of the longitudinal axis 6.1 of the boom arm 5.1.
[0041] During the subsequent assembly of the spring shells 17.11, 17.21 facing away from arm 5.1 with the connection 4, these are pulled onto corresponding surfaces on the connection 4 via a flattening on the outer diameter of the spring shells 17.11, 17.21 when clamped with the clamping device 11.1, 11.2, thereby eliminating any deflection of the spring shells 17.11, 17.21 relative to the longitudinal axis 6.1 of the cantilever arm 5.1.
[0042] The spring shells 17.11, 17.21, 17.12, 17.22 are therefore mounted rotated by 1° relative to each other, so that in the measuring position of the boom arm 5.1 they are still deflected by 1°, or in other words, the boom arm 5.1 without a stop or a stop in the Fig. 4b, the fixing device 25, which is explained in more detail below, would be deflected by 1° beyond the desired measuring position.
[0043] Fig. Figure 3a shows a torsion spring 10.1 with a spring shell 17.11 and a spring shell 17.12, which are connected to each other via a leaf spring 19.1 formed from several elastic sections 19.11. The torsion spring 10.1 is connected via the spring shell 17.11, as shown in the Fig. 2 explained, with connection 4 ( Fig. 2) jammed and clamped via the spring shell 17.12 with the boom arm 5.
[0044] The leaf spring 19.1 is designed in a meandering shape in the embodiments shown in the figures; in other words, the individual elastic sections 19.11 alternate with connecting elements of the leaf spring 19.1 designed as rigid deflections 20.1, 20.2, wherein in the Fig. 3a For the sake of clarity, only an elastic section 19.11 is designated with a reference numeral. By rotating the spring shells 17.11, 17.12 relative to each other, the deflections 20.1, 20.2 of the leaf spring 19.1 move towards each other on one side and away from each other on the other, so that the leaf spring 19.1 has a fan shape in the deflected state. The distance between the deflections 20.1, 20.2 is chosen such that, during a rotational deflection of the leaf spring 19.1, they extend over the previously defined angular range, which is specified in the Fig. In the embodiment described in section 3a, the maximum angle of rotation is 30°, and the spring does not touch, which would be equivalent to a coil spring locking up. In all other degrees of freedom, the torsion spring 10.1 is stiffer compared to its torsional stiffness about the axis of rotation 7, with the degree of freedom perpendicular to the longitudinal orientation of the leaf spring 19.1 being comparatively soft due to compression or stretching of the individual leaf spring sections 19.11. To prevent plastic deformation of the leaf spring 19.1, compression is limited by contact between the leaf spring sections 19.11 or the deflections 20.1, comparable to the locking up of a coil spring, and stretching is limited by the spring shells 17.11, 17.21 surrounding the leaf springs 19.1. The further degrees of rotational freedom about the axes perpendicular to the axis of rotation 7 are provided by clamping the spaced-apart spring shells 17.11, 17.12, 17.21, 17.22 are locked, which do not allow rotation due to the fixed clamping. In addition, the stiffness of the leaf spring 19.1 across its width or height is many times higher compared to its thickness.
[0045] Fig. Figure 3b shows a further detail of the invention, illustrating the clamping 13.1, 13.2 of the torsion springs 10.1, 10.2 on the boom arm 5. The torsion springs 10.1, 10.2 are positioned as mirror images of each other, whereby both torsion springs 10.1, 10.2 are pre-tensioned in the parked position, i.e., they have a restoring force, and in the measuring position they have almost no restoring force, as explained above.
[0046] The center of gravity 21 of the boom arm 5 is designed such that it lies on the common axis of rotation 7 of the rotary joints 10.1, 10.2. This has the advantage that the contribution to the tilting of the boom arm 5 due to gravity is very small or can even be zero. To compensate for manufacturing tolerances, which can lead to a displacement of the center of gravity 21 of the boom arm 5, the following are incorporated in the Fig. 3b on the left side, balancing masses 22 are arranged, which are used to align the center of gravity 21 with the axis of rotation 7 of the rotary joints 10.1, 10.2.
[0047] Fig. Figure 4a shows a further detail of the invention, wherein the boom arm 5.1 is shown in the measuring position with the actuator 23 used to deflect the boom arm 5.1 from the measuring position to a park position. The actuator 23 is connected to the boom arm 5.1 via a force transmission element 15, the force transmission element 15 being able to transmit only a tensile force to the boom arm 5.1. The actuator 23 thus pulls the boom arm 5.1 against the spring stiffness of the torsion springs 10.1, 10.2 from the measuring position to the park position of the boom arm 5.1. During the reverse movement from the park position to the measuring position, the actuator 23 is moved, whereby the boom arm 5.1 is moved by the restoring force present in the torsion springs 10.1, 10.2. The force transmission element 15 allows the actuator 23 to exert no force or only a negligible force on the boom arm 5.1 when moving into the measuring position and especially when reaching the measuring position.In the measuring position, the boom arm 5.1 is therefore almost free of parasitic forces, both from the actuator 23 and from the torsion springs 10.1, 10.1.
[0048] The actuator 23 is connected via a line 24 to a control unit (not shown). The actuator 23 may have a sensor (not shown) for determining the travel distance, with which the position of the boom arm 5.1, 5.2 can be determined.
[0049] Fig. Figure 4b shows a further detail of the invention, showing a section of the boom arm 5 with the bearing 16 and a fixing device 25 for fixing the boom arm 5.1 in its measuring position.
[0050] The fixing device 25 has in the Fig. In the embodiment shown in Figure 4b, an electromagnet 26 is mounted, which pulls the cantilever arm 5.1 against the fixing device 25 when the measuring position is reached. Due to the non-magnetic aluminum used for the cantilever arm 5.1, a magnetizable armature plate 27 is embedded in the cantilever arm 5.1 in the area of the electromagnet 26. The distance between the electromagnet 26 and the armature plate 27 is only a few tenths of a millimeter, so that the movement of the mirror 8 ( Fig. 1) the movement of the boom arm 5.1 can be neglected. Alternatively, the device 1 can be adjusted so that the position of the mirror 8 corresponds to the previously defined position when the electromagnet 26 is switched on. Fixing the boom arm 5.1 via the fixing device 25 results in a higher stiffness of the bearing 16 in all six degrees of freedom, which advantageously reduces excitation of the boom arm 5.1 by parasitic mechanical vibrations, for example from other components of the overall system or from the environment, during the measurement. The positioning of the boom arm 5.1, 5.2 in the measuring position or parking position can be controlled, as explained above, either by a sensor attached to the actuator 23 (not shown) to control the travel of the actuator 23 or by an external sensor (not shown) that detects the rotational position of the boom arm 5.1.Alternatively, the measuring position of the boom arm 5.1 can also be defined by an adjustable mechanical stop or a light barrier, which is set such that when the light barrier is triggered, the boom arm 5.1 is in the previously defined rotational position and is fixed in this position by the fixing device 25.
[0051] Fig. Figure 5 shows a schematic representation of a mask inspection system 31 for measuring an object 38, which may, for example, be configured as a photomask. The mask inspection system 31 comprises two light sources 34, 35, with a first light source 34 being configured for measuring the object 38 in reflection and a second light source 35 for measuring the object 38 in transmitted light. The object 38 is arranged on a stage 37, which can position the object 38 laterally and vertically in the sub-nanometer range. The positional accuracy can be in a range of less than 100 nm, particularly below 20 nm. In transmitted light measurement, the measuring light 44 from the illumination unit 47, which comprises the light source 35 and an illumination optic configured as a condenser 36, passes through the condenser 36, which generates a desired light distribution on the object 38.The pupil plane of the illumination optics 36 is designated by reference numeral 46 in the figure. The measuring light 44 passes through the object 38, which is subsequently imaged by an imaging optics 39 and a tube 41. The tube 41 magnifies the image of the object 38 and projects it onto a recording device 32 designed as a CCD camera. The semi-transparent mirror 40, arranged between the imaging optics 39 and the tube 41, is used for measurement in reflection and has no influence on measurement in transmitted light.
[0052] In a measurement by reflection, the measuring light 43 emitted by the light source 34 is reflected by the semi-transparent mirror 40 and then strikes the imaging optics 39. These focus the measuring light 43 onto the object 38, from which it is reflected. The measuring light 43 passes through the imaging optics 39 a second time and projects an image of the object 38 onto the tube 41 via the semi-transparent mirror 40. The tube 41 magnifies the image of the object 38 and projects it onto the recording device 32.
[0053] For checking and / or adjusting the imaging optics 39, an additional optical module 1, which may be, for example, a Fresnel zone plate (mirror 8 - ), can optionally be placed between the receiving device 32 and the tube 41. Fig. 1) The trained, so-called Bertrand optics are swung into the beam path of the mask inspection system 31, whereby the components in the Fig. 1, Fig. 2, Fig. 3 to Fig. The device 1 described in section 4 can be used. This results in the image no longer being projected onto the receiving device 32, but rather onto the pupil 45 of the imaging optics 39. The pupil 45 encompasses the influences of all optical components involved in the imaging, in particular the condenser 36 and / or the imaging optics 39, so that by adjusting the optical components 36, 39, in particular the imaging optics 39, and / or other components acting on the pupil illumination, such as the illumination unit 47, a predetermined pupil illumination in the pupil 45 can be set.
[0054] In cases where object 38 is configured as a photomask, it can have an aspect ratio between 1:1 and 1:3, preferably between 1:1 and 1:2, and particularly preferably between 1:1 or 1:2. The photomask can be substantially rectangular. The photomask can preferably be 5 to 7 inches long and wide, and particularly preferably 6 inches long and wide. Alternatively, the photomask can be 5 to 7 inches long and 10 to 14 inches wide, and preferably 6 inches long and 12 inches wide. Reference symbol list 1 Bertrand module 2 cases 3 Box 4 Connection of mask inspection system 5, 5.1, 5.2 Boom arm 6,6.1,6.2 Longitudinal axis boom arm 7 Rotary axis cantilever arm 8 mirrors 9 Mirror bracket 10.1, 10.2 Torsion spring 11.1, 11.2 Clamping of torsion spring connection 12.11, 12.12, 12.21, 12.22 Clamping jaw / Mounting connection 13.1, 13.2 Clamping of torsion spring cantilever arm 14.1, 14.2 Clamping jaw cantilever arm 15 Power transmission element actuator boom arm 16 Storage 17.11, 17.12, 17.21, 17.22 Spring bowls 18.11, 18.12, 18.21, 18.22 Positioning bore spring shell cantilever arm 19.1, 19.2, 19.11 Leaf spring, sub-areas of leaf spring 20.1, 20.2 Deflection leaf spring 21 Focus on the boom arm 22 counterweights, center of gravity, boom arm 23 Actuator 24 lines 25 Fixing device 26 Electromagnet 27 Anchor plate 31 Mask inspection system 32 Recording device 34 Light source incident light measurement 35 Light source transmission measurement 36 Lighting optics 37 Object table 38 objects 39 Imaging optics 40 mirrors 41 Tube 42 Control 43 Measuring light incident light measurement 44 Measuring light transmitted light measurement 45 Check 46 Pupil level 47 lighting units α Swivel angle cantilever arm
Claims
[1] Device (1) for pivoting an optical component (8) into a beam path of a system (31) for semiconductor technology, comprising - a cantilever arm (5,5.1,5.2) and the optical component (8) arranged on the cantilever arm, - at least one pivot joint (10.1,10.2) via which the boom arm (5,5.1,5.2) is pivotably mounted in the device (1), characterized by , that at least one pivot joint is designed as a solid body joint (10.1,10.2). [2] Device (1) according to claim 1, characterized by , that the rotation angle (α) of the pivot joint (10.1,10.2) when pivoting is at least 27°, preferably at least 28°, particularly preferably at least 30°. [3] Device (1) according to one of claims 1 or 2, characterized by , that the solid body joint (10.1,10.2) has at least two elastic sub-areas (19.11). [4] Device (1) according to claim 3, characterized by, that the at least two elastic sub-areas (19.11) are connected via rigid connecting elements (20.1,20.2). [5] Device (1) according to one of claims 3 or 4, characterized by , that the sum of the elastic sub-areas (19.11) is at least 450 mm, preferably at least 460 mm and particularly preferably at least 480 mm. [6] Device (1) according to any one of the preceding claims, characterized by , that the center of gravity (21) of the boom arm (5,5.1,5.2) of the device (1) lies on the axis of rotation (7) of the at least one pivot joint (10.1,10.2). [7] Device (1) according to any one of the preceding claims, characterized by , that the boom arm (5,5.1,5.2) has interchangeable counterweights (22) for shifting the center of gravity (21) of the boom arm (5,5.1,5.2) after the assembly of the device (1). [8] Device (1) according to any one of the preceding claims, characterized by, that the device (1) has a fixing device (25) of the boom arm (5,5.1,5.2) in a measuring position (5.2) of the boom arm (5). [9] Device (1) according to claim 8, characterized by , that the fixing device (25) comprises a magnet, in particular an electromagnet. [10] Device (1) according to claim 9, characterized by , that the boom arm (5,5.1,5.2) has an anchor plate (27) for fixing the boom arm (5,5.1,5.2) with the magnet. [11] Device (1) according to any one of the preceding claims, characterized by , that the device (1) has an actuator (23) for deflecting the boom arm (5,5.1,5.2). [12] Device (1) according to claim 11, characterized by , that a force transmission element (15) of the actuator (23) with the rotary joint (10.1,10.2) is designed such that only tensile forces can be transmitted from the actuator (23) to the boom arm (5,5.1,5.2). [13] Device (1) according to any one of the preceding claims, characterized by , that the at least one pivot joint (10.1,10.2) is arranged in a measuring position of the boom arm (5.1) such that it has no or almost no deflection from its force-free zero deflection. [14] Device (1) according to any one of the preceding claims, characterized by , that the device (1) comprises two mirror-image rotary joints (10.1,10.2) with a common axis of rotation (7). [15] Device (1) according to claim 14, characterized by , that the distance between the two mirror-image rotary joints (10.1,10.2) is at least 43 mm, preferably at least 45 mm, particularly preferably at least 50 mm. [16] Device (1) according to any one of the preceding claims, characterized by , that the optical component (8) is designed as a Bertrand element, in particular as a Bertrand mirror. [17] Device (1) according to any one of the preceding claims 1 to 15, characterized by , that the optical component (8) includes an EUV mirror. [18] System (31) for semiconductor technology comprising a device (1) according to any one of claims 1 to 17. [19] Plant (31) according to claim 18, characterized by , that the system is designed as a mask inspection system (31), as a mask repair system, as a microscope, as a projection exposure system or as a wafer inspection system.
Citation Information
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