Gas treatment module, gas treatment process and process for treating an organic gas phase compound

DE102024122928A1Pending Publication Date: 2025-02-13GREENFILTEC PTE LTD
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Application Number
DE102024122928
Authority / Receiving Office
DE · DE
Patent Type
Applications
Current Assignee / Owner
Filing Date
2024-08-12
Publication Date
2025-02-13

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Abstract

A gas treatment module, a gas treatment process, and a process for treating an organic gas-phase compound are disclosed. The gas treatment module comprises a cavity, a gas supply unit, a light source, a photocatalyst, a liquid supply unit, a gas discharge unit, and a liquid discharge unit. The gas supply unit is connected to the interior of the cavity and can introduce a gas to be treated into the cavity, wherein the gas to be treated contains an organic gas-phase compound. The light source is arranged in the cavity and can provide a first light source. The photocatalyst is arranged in the cavity, and upon irradiation with the first light source, at least a portion of the organic gas-phase compound of the gas to be treated, which comes into contact with the photocatalyst, can generate an organic compound product through the action of the photocatalyst.The liquid supply unit is connected to the interior of the cavity and can provide a solvent that comes into contact with the surface of the photocatalyst and in which the organic compound product can be dissolved.
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Description

Field of the InventionThe present invention relates to a gas treatment module, a gas treatment method, and a method for treating an organic gas phase compound. More particularly, the present invention relates to a gas treatment module and method for removing airborne molecular contaminants (AMC) containing volatile organic compounds (VOC) in processes in the semiconductor industry and a method for treating an organic gas phase compound.Background ArtClean rooms are widely used in industrial manufacturing, e.g. in the semiconductor industry, to produce products in clean, contamination-free and isolated environments and thus further increase product yield.In order to meet the environmental requirements of a clean room, a fan and a filter system are generally installed at the air inlet of the clean room, so that the air stream driven by the fan flows through the filter screen of the filter system before it reaches the clean room in order to filter out dust and various organic and inorganic pollutants.One of the usual methods for removing volatile organic compounds (VOCs) such as benzene, acetone, isopropanol, ethyl acetate, dimethyl sulfoxide, ethanolamine, propylene glycol methyl ether, propylene glycol methyl ether acetate, etc. from airborne molecular contaminants (AMC) is adsorption with activated carbon materials. Meanwhile, activated carbon materials have a good physical adsorbing effect for alkanes, alkenes, ethers and benzenes in VOCs through their pores, but offer a poor physical adsorbing effect for alcohols, ketones, acids and esters in VOCs. Therefore, a photocatalytic reaction has been proposed. However, in the related art photocatalytic reaction treatment, the products accumulate on the surface of the photocatalyst, resulting in a decrease in the reaction speed, which in turn results in the total power not meeting the requirements.Disclosure of the InventionThe object of the present invention is to provide a gas treatment module which enables better treatment of organic gas phase compounds present in a gas mixture.It is a further object of the present invention to provide a gas treatment process which enables better treatment of organic gas phase compounds present in a gas mixture.Another object of the present invention is to provide a method for treating an organic gas phase compound, which can be used to better treat organic gas phase compounds.The gas treatment module of the present invention includes a cavity, a gas supply unit, a light source, a photocatalyst, a liquid supply unit, a gas discharge unit, and a liquid discharge unit. The gas supply unit is connected to the interior of the cavity and may introduce a gas to be treated into the cavity, the gas to be treated containing an organic gas phase compound. The light source is disposed in the cavity and may provide a first light. The photocatalyst is disposed in the cavity, and when irradiated with the first light, at least a part of the organic gas phase compound of the gas to be treated that contacts the photocatalyst can produce an organic compound product by the action of the photocatalyst. The liquid supply unit is connected to the inside of the cavity and may provide a solvent that comes into contact with the surface of the photocatalyst and in which the organic compound product can be dissolved, wherein the solubility of the organic compound product in the solvent is higher than the solubility of the organic gas phase compound in the solvent, or wherein the volatility of the organic compound product in the solvent is lower than the volatility of the organic gas phase compound in the solvent. The gas discharge unit is connected to the inside of the cavity and can discharge the gas to be treated that has come into contact with the photocatalyst and has been separated from the photocatalyst. The liquid discharge unit is connected to the inside of the cavity and can discharge the solvent containing the organic compound product separated from the photocatalyst.In an embodiment of the present invention, the light source comprises a continuous provision of UV light as the first light.In an embodiment of the present invention, the gas treatment module further comprises a filter unit through which the gas to be treated can be passed.In an embodiment of the present invention, the photocatalyst is located on one side of the filter unit, while the light source and the liquid supply unit are located on the outside of the filter unit and face the photocatalyst.In an embodiment of the present invention, the gas treatment module may be present in multiple, wherein the gas treatment modules are arranged in series.In an embodiment of the present invention, the gas to be treated may be passed through the solvent so that at least a part of the organic gas phase compound is converted into an organic liquid phase compound capable of producing the organic compound product by the action of the photocatalyst.In one embodiment of the present invention, the liquid supply unit supplies the solvent in a batch manner.In an embodiment of the present invention, the liquid supply unit continuously supplies the solvent.In one embodiment of the present invention, the solvent flows over the surface of the photocatalyst at a flow rate of 75.6 L / min·m 2 or more.In one embodiment of the present invention, the organic gas phase compound flows over the surface of the photocatalyst at a flow rate of 0.7 m / s or less.In an embodiment of the present invention, the liquid supply unit is configured to spray the solvent on the surface of the photocatalyst as in a shower head.In an embodiment of the present invention, the liquid supply unit is configured such that the solvent flows over the surface of the photocatalyst in a reciprocating dipping motion.In one embodiment of the present invention, the organic gas phase compound comprises one or more compounds selected from isopropanol, acetone and toluene.In one embodiment of the present invention, the organic gas phase compound does not include one or more compounds selected from polyhalogenated compounds, benzene ring compounds, polycyclic aromatic hydrocarbons, and long-chain alkanes.The gas treatment method of the present invention includes (S 1000) providing a gas to be treated containing an organic gas phase compound, (S 1200) contacting the gas to be treated with the surface of a photocatalyst such that at least a part of the organic gas phase compound generates an organic compound product by the action of the photocatalyst, (S 3000) providing a solvent, (S 4000) contacting the solvent with the photocatalyst to dissolve the organic compound product in the solvent, wherein the solubility of the organic compound product in the solvent is higher than the solubility of the organic gas phase compound in the solvent, or wherein the volatility of the organic compound product in the solvent is lower than the volatility of the organic gas phase compound in the solvent, (S5000), separating the gas to be treated, which has contacted the photocatalyst, and the solvent containing the organic compound product from the photocatalyst.In an embodiment of the present invention, step S 2000 comprises continuously providing UV light for irradiation of the photocatalyst to generate the organic compound product from the organic gas phase compound.In an embodiment of the present invention, step S2000 comprises allowing the organic gas phase compound to react with the photocatalyst several times to produce the organic compound product.In an embodiment of the present invention, the gas treatment method further includes (S 3200) passing the gas to be treated through the solvent so that at least a part of the organic gas phase compound is converted into an organic liquid phase compound, and (S 3400) generating the organic compound product from the organic liquid phase compound by the action of the photocatalyst.In an embodiment of the present invention, step S3400 includes allowing the liquid phase organic compound to react with the photocatalyst multiple times to produce the organic compound product.In an embodiment of the present invention, step S3000 comprises supplying the solvent in a batch manner.In an embodiment of the present invention, step S 3000 comprises continuously supplying the solvent.In one embodiment of the present invention, the solvent flows over the surface of the photocatalyst at a flow rate of 75.6 L / min·m 2 or more.In one embodiment of the present invention, the organic gas phase compound flows over the surface of the photocatalyst at a flow rate of 0.7 m / s or less.In an embodiment of the present invention, step S3000 comprises spraying the solvent onto the surface of the photocatalyst as in a shower head.In one embodiment of the present invention, step S3000 comprises flowing the solvent over the surface of the photocatalyst in a reciprocating dipping motion.In one embodiment of the present invention, the organic gas phase compound comprises one or more compounds selected from isopropanol, acetone and toluene.In one embodiment of the present invention, the organic gas phase compound does not include one or more compounds selected from polyhalogenated compounds, benzene ring compounds, polycyclic aromatic hydrocarbons, and long-chain alkanes.The method for treating an organic gas phase compound of the present invention comprises (A1000) providing an organic gas phase compound, (A2000) producing an organic compound product from the organic gas phase compound by the action of a photocatalyst, (A3000) providing a solvent, (A4000) bringing the solvent into contact with the surface of the photocatalyst to dissolve the organic compound product in the solvent, wherein the solubility of the organic compound product in the solvent is higher than the solubility of the organic gas phase compound in the solvent, or wherein the volatility of the organic compound product in the solvent is lower than the volatility of the organic gas phase compound in the solvent, (A5000) separating the solvent containing the organic compound product from the photocatalyst.In an embodiment of the present invention, step A2000 comprises continuously providing UV light for irradiating the photocatalyst to produce the organic compound product from the organic gas phase compound.In one embodiment of the present invention, step A2000 comprises allowing the organic gas phase compound to react with the photocatalyst several times to produce the organic compound product.In an embodiment of the present invention, the method for treating an organic gas phase compound further comprises (A3200) passing the organic gas phase compound through the solvent so that at least a part of the organic gas phase compound is converted into an organic liquid phase compound, and (A3400) generating the organic compound product from the organic liquid phase compound by the action of the photocatalyst.In one embodiment of the present invention, step A3400 includes allowing the liquid phase organic compound to react with the photocatalyst multiple times to produce the organic compound product.In an embodiment of the present invention, step A 1000 includes providing the organic gas phase compound together with the solvent.In one embodiment of the present invention, step A3000 comprises supplying the solvent in batch.In one embodiment of the present invention, step A3000 comprises continuously supplying the solvent.In one embodiment of the present invention, the solvent flows over the surface of the photocatalyst at a flow rate of 75.6 L / min·m 2 or more.In one embodiment of the present invention, the organic gas phase compound flows over the surface of the photocatalyst at a flow rate of 0.7 m / s or less.In one embodiment of the present invention, step A3000 comprises spraying the solvent onto the surface of the photocatalyst as in a shower head.In one embodiment of the present invention, step A3000 comprises flowing the solvent over the photocatalyst surface in a reciprocating dipping motion.In one embodiment of the present invention, the organic gas phase compound comprises one or more compounds selected from isopropanol, acetone and toluene.In one embodiment of the present invention, the organic gas phase compound does not include one or more compounds selected from polyhalogenated compounds, benzene ring compounds, polycyclic aromatic hydrocarbons, and long-chain alkanes.ILLUSTRATION OF THE FIGURESFIG. 1A shows a schematic illustration of an embodiment of a gas treatment module of the present invention. FIG. 1B is a schematic sectional view taken along the line AA' in FIG. 1A. FIG. 1C is a schematic diagram showing an embodiment of the gas treatment module of the present invention in which the liquid supply unit is provided with spray holes. FIG. 2A is a schematic diagram showing acetone removal effects with and without water washing. FIG. 2B is a schematic diagram showing the isopropanol, acetone, and toluene removal effects with a water wash. FIGS. 3A and 3B each show a schematic diagram for illustrating the removal results for acetone without water washing, with a circulating water washing, and with a continuous water washing. FIG. 3C is a schematic diagram showing the removal results of acetone by continuously rinsing the photocatalyst at different water flow rates. FIG. 4 shows a schematic flow diagram of an embodiment of a gas treatment method of the present invention. FIGS. 5 and 6 each show a schematic flow chart of another embodiment of the gas treatment method of the present invention. FIG. 7 is a schematic flow chart of an embodiment of a method for treating an organic gas phase compound of the present invention. FIGS. 8 and 9 each show a schematic flow chart of another embodiment of the method for treating an organic gas phase compound of the present invention.EmbodimentsIn the following, by means of specific specific specific exemplary embodiments, the embodiments of a connecting component disclosed within the scope of the present invention are described with reference to the drawings. It will be apparent to those skilled in the art that advantages and effects of the present invention can be derived from the disclosures in the present specification. However, the following disclosures do not limit the scope of the present invention. Those skilled in the art may practice the present invention in other, different embodiments based on various views and applications without departing from the principles of the spirit of the present invention. For the sake of clarity, the respective layer, the respective film, the respective front plate or the respective region is illustrated enlarged in terms of its / its thickness in the drawings. Throughout the specification, like components are denoted by like reference numerals. The arrangement or "connection" of a component, such as a layer, a film, a region or a substrate, is to be understood as being "on" another component or with another component, respectively, that the component can be arranged on the other component or can be connected to the other component directly or also via an intermediate component. By contrast, the "direct arrangement" or the "direct connection" of a component to another component or to another component means that no intermediate component is present. As used herein, the term "connection" may refer to a physical and / or electrical connection. In addition, the "electrical connection" or "coupling" of two components with a further component located therebetween can take place.It is understood that the terms "first", "second", "third", etc., optionally used to describe various components, components, regions, layers and / or sections are not to be interpreted as limiting. Rather, such terms merely serve to distinguish a component, a component, a region, a layer or a section from a / another component, component, region, layer or section. Therefore, the first component, component, region, layer or section to be discussed below can be referred to as a second / second / second component, component, region, layer or section without departing from the teachings of the present specification.Furthermore, any one of the antonyms such as "below" or "below" and "above" or "above" may be used in the present specification to describe the relationship between one component and another component, as can be seen in the figures. It should be understood that the use of anonymous devices aims at showing layers of a device other than the layers shown. Thus, for example, one revolution of a device in a drawing reveals that a component located on the "underside" of another component in the preceding description is now located on the "upper side" of the other component. Therefore, for example, the position indication "bottom" can mean both "bottom" and "top" depending on the specific orientation in the respective figure. Similarly, rotation of a device in a drawing would result in a component being located "below" another component in the previous description from now on "above" the other component. Therefore, for example, the position specification "below" can mean both "below" and "above".In the present specification, "about", "approximately" or "substantially" is used to describe the average values of the respective values and the specific values determined by those of ordinary skill in the art in their respective allowable deviation range, taking into account the measurement discussed in each case and the specific number of measurement-related errors (i.e., the limitation of the respective measurement system). For example, "about" may indicate one or more standard deviations or ±30%, ±20%, ±10%, ±5% of the respective value. Moreover, through the use of "about", "approximately", or "substantially", the present description would wish to indicate that relatively acceptable ranges of deviation or standard deviations may be selected instead of a single standard deviation depending on respective optical, etching, or other properties.According to the embodiment shown in FIG. 1A, the gas treatment module 900 of the present invention includes a cavity 100, a gas supply unit 210, a light source 300, a photocatalyst 400, a liquid supply unit 510, a gas discharge unit 220, and a liquid discharge unit 520. In one embodiment, cavity 100 is made of stainless steel. However, in other embodiments, the cavity 100 may be made of other alloys, metals, metal oxides, or non-metallic materials such as polymers, glass, and the like. The gas supply unit 210 is connected to the inside of the cavity 100, and can introduce a gas to be treated into the cavity 100. In particular, in an embodiment, the gas supply unit 210 may be an opening at a side of the cavity 100, or an interface to an external piping, etc., wherein the gas to be treated may be conveyed through the gas supply unit 210 by, e.g., a pump or a blower to be supplied to the cavity 100.The gas to be treated contains an organic gas phase compound. Volatile organic compounds (VOCs) are contained in the organic gas phase compound. In one embodiment, the organic gas phase compound comprises one or more compounds selected from isopropanol, acetone, and toluene. In other embodiments, the organic gas phase compound does not include one or more compounds selected from polyhalogenated compounds, benzene ring compounds, polycyclic aromatic hydrocarbons, and long-chain alkanes, for example, to avoid possible reduction in performance and the like.According to the embodiment shown in FIG. 1A, the light source 300 is arranged in the cavity 100 and can deliver a first light continuously or intermittently. The photocatalyst 400 is disposed in the cavity 100, and when irradiated with the first light, at least a part of the organic gas phase compound of the gas to be treated that contacts the photocatalyst 400 can produce an organic compound product by the action of the photocatalyst 400. More specifically, in an embodiment, the light source 300 is a lamp capable of emitting ultraviolet light having a wavelength of less than 400 nm, while the reaction module 900 further comprises a filter unit 410 through which the gas to be treated can flow, wherein the photocatalyst 400 is a titanium dioxide (TiO 2) disposed on a side of the filter unit 410 in the form of, for example, a ceramic honeycomb mesh at those locations capable of being directly or indirectly irradiated with light. The organic gas phase compound is acetone which, when it passes through the filter unit 410, can undergo a reaction represented by the following formula (1) and formula (2) by the action of the photocatalyst 400. In other words, in this embodiment, the organic compound product is formic acid (HCOOH). CH 3 COCH 3 →HCOOH + CH 3 CHO formula (1) CH 3 CHO →2HCOOH formula (2)However, in other embodiments, the light source 300 may be a light emitting device that emits a first light having different wavelengths, while the photocatalyst 400 is not limited to titanium dioxide, and the organic compound product may be acetic acid (acetic acid) or the like.FIG. 1B is a schematic sectional view taken along the line AA' in FIG. 1A. According to the embodiment shown in FIG. 1B, the liquid supply unit 510 is connected to the inside of the cavity 100, and may provide a solvent that comes into contact with the surface of the photocatalyst 400. The organic compound product may be dissolved in the solvent, such as water, wherein the solubility of the organic compound product in the solvent is higher than the solubility of the organic gas phase compound in the solvent, or wherein the volatility of the organic compound product in the solvent is lower than the volatility of the organic gas phase compound in the solvent. In one embodiment, the liquid supply unit 510 may be a pipe line leading into the cavity 100 from the outside, wherein the solvent may be transported into the cavity 100 by a pump or by gravity, for example, and comes into contact with the surface of the photocatalyst 400. The end of the pipeline located in the cavity 100 can furthermore be provided with spray holes 511 facing the photocatalyst 400 in order to spray the solvent onto the surface of the photocatalyst 400, as in the case of a shower head. In other embodiments, the end of the tubing in the cavity 100 may not be aligned with the photocatalyst 400, so that the solvent simply flows into and out of the cavity 100 and flows over the surface of the photocatalyst 400 in a reciprocating dipping motion. At this time, the liquid supply unit 510 may supply the solvent in a batch or continuous manner, i.e., may be operated so that the solvent intermittently or continuously flows over the surface of the photocatalyst 400.According to the embodiment shown in FIG. 1B, the gas discharge unit 220 is connected to the inside of the cavity 100, and can discharge the gas to be treated that has come into contact with the photocatalyst 400 and has been separated from the photocatalyst 400. In particular, in an embodiment, the gas discharge unit 220 may be an opening at a side of the cavity 100, or an interface to an external piping, etc., wherein the gas to be treated may be conveyed through the gas discharge unit 220 by, e.g., a pump or a blower to exit the cavity 100. The liquid discharge unit 520 is connected to the inside of the cavity 100, and can discharge the solvent containing the organic compound product separated from the photocatalyst 400. In one exemplary embodiment, the liquid removal unit 520 can be a pipeline leading from the outside into the cavity 100, wherein the solvent can be conveyed out of the cavity 100 by means of a pump or by gravity, for example.Moreover, in an embodiment, the aforementioned acetone as the organic gas phase compound may generate formic acid as the organic compound product by the action of the photocatalyst 400 and at least partially adhere to the surface of the photocatalyst 400. In general, formic acid may undergo a reaction according to the following formula (3) to decompose into carbon dioxide and water. 2HCOOH+O 2 →2CO 2+2 H 2 O formula (3)However, this reaction proceeds at a low speed and may be considered a rate-determining step (RDS). The photocatalyst 400 cannot react further with the organic gas phase compound acetone due to the adhesion of formic acid to its surface, resulting in a marked decrease in the reaction rate. In contrast, in the present invention, there is provided a solvent that contacts the surface of the photocatalyst 400, wherein the solubility of the organic compound product (formic acid) in the solvent (water) is higher than the solubility of the organic gas phase compound (acetone) in the solvent (water), or wherein the volatility of the organic compound product (formic acid) in the solvent (water) is lower than the volatility of the organic gas phase compound (acetone) in the solvent (water). Thus, the formic acid adhering to the surface of the photocatalyst 400 can be quickly carried away by the water, so that the photocatalyst 400 can further react with the acetone, thereby significantly improving the reaction speed. Here, the time in which the organic gas phase compound, e.g., acetone, is in contact with the photocatalyst is preferably longer than the time in which the organic gas phase compound reacts with the photocatalyst to produce an organic compound product, e.g., formic acid, but shorter than the time required for a complete reaction of the organic gas phase compound to final reactants, e.g., carbon dioxide and water. From another perspective, the present invention is not directed to accelerating the complete reaction of the organic gas phase compound, but rather to utilizing the difference of the organic gas phase compound and the organic compound product in solubility or volatility in the solvent and substantially rinsing the surface of the photocatalyst 400 with the solvent to remove the organic compound product adhered to the surface of the photocatalyst 400, so that the photocatalyst 400 can further react with the organic gas phase compound under the irradiation of UV light, thereby significantly increasing the reaction speed.In other embodiments, the gas to be treated may be passed through the solvent so that at least a portion of the organic gas phase compound is converted to a liquid phase organic compound that can produce the compound organic product by the action of the photocatalyst. Viewed from another perspective, the gas to be treated, which enters the cavity, may be subjected to water washing so that the organic gas phase compound present therein is at least partially dissolved in water to produce an organic liquid phase compound from which an organic compound product that can be carried away from the surface of the photocatalyst by water may also be produced by the action of the photocatalyst.In the embodiment shown in FIGS. 1A through 1C, the shapes, sizes, arrangements, and relative angles of the components in the gas treatment module 900 may be adjusted as desired, among others. On the other hand, the gas treatment module 900 may also be provided in plural, wherein the gas treatment modules are arranged in series to increase the treatment effect and / or the treatment capacity for organic gas phase compounds.First embodiment of the gas treatment module: A substrate consisting of cordierite, mullite, aluminum titanate, silicon carbide, zirconia, silicon nitride or the like having a length of 150 mm, a width of 150 mm, a thickness of 50 mm, a pore diameter of 4 mm is used, on the surface of which titanium dioxide is placed as photocatalyst, which is irradiated with a lamp emitting ultraviolet light having a wavelength of slightly less than 400 nm at an inclination angle of 30° and a lamp pitch of 150 mm, the pitch of the water sprinkler head being 50 mm. At a flow rate of the gas to be treated of 0.4 m 3 / min, the results of a treatment without water washing and a treatment in which water continuously passes through the photocatalyst at a flow rate of 75.6 L / min-m 2 are shown in the following Table 1 and FIG. 2A, from which it can be clearly seen that the average acetone removal amount and the average acetone removal efficiency were significantly better in continuous water washing than without water washing. This indicates that the gas treatment module of the present invention has a better effect in removing organic gas phase compounds from a gas mixture. Table 1 Table 1Average acetone feed concentration (μg / m 3)34,132,7Average acetone removal amount (μg / hr)4471964Average acetone removal efficiency (%)1041In the above-described first embodiment of the gas treatment module, at a flow rate of the gas to be treated of 0.4 m 3 / min, the removal results for isopropanol (isopropanol), acetone (acetone), and toluene (toluene) shown in FIG. 2B were obtained by continuously passing water through the photocatalyst at a flow rate of 75.6 l / min-m 2. It is clearly seen that the gas treatment module of the present invention has a good removal effect for the above-mentioned three substances.In the above-described first embodiment of the gas treatment module, at a flow rate of the gas to be treated of 0.4 m 3 / min, the removal results shown in FIGS. 3A and 3B for acetone without water washing, with a circulating water washing, and with a continuous water washing (continuous rinsing of the photocatalyst by showering at a water flow rate of 75.6 l / min-m 2) were obtained. It can clearly be seen that the continuous water washing led to better results.In the above-described first embodiment of the gas treatment module, at a flow rate of the gas to be treated of 0.4 m 3 / min, by continuously purging the photocatalyst at a water flow rate of 4.27 l / min-m 2, 50,7 l / min-m 2 and 75.6 l / min-m 2 respectively, the removal results for acetone shown in the following Table 2 and FIG. 3C were obtained. It can clearly be seen that a better effect was achieved at 75.6 l / min-m2. Table 2 Table 242,729,726,91050,728,322,12275,632,719,341In the above-described first embodiment of the gas treatment module, at a flow rate of the gas to be treated of 2.5 m / s, 1.5 m / s and 0.7 m / s, respectively, the acetone removal results shown in the following Table 3 were obtained by continuously passing water through the photocatalyst at a flow rate of 75.6 L / min-m 2. It can clearly be seen that a better effect was achieved at 0.7 m / s. Table 3 Table 32,534,526,922,01,532,719,341,00,734,110,270,1According to the flow chart of the embodiment shown in Fig. 4, the gas treatment method of the present invention comprises, for example, the following steps.Step S 1000: Providing a gas to be treated containing an organic gas phase compound. In one embodiment, this step comprises providing the gas to be treated together with a solvent. More specifically, the organic gas phase compound contains volatile organic compounds (VOC). In one embodiment, the organic gas phase compound comprises one or more compounds selected from isopropanol, acetone, and toluene. In other embodiments, the organic gas phase compound does not include one or more compounds selected from polyhalogenated compounds, benzene ring compounds, polycyclic aromatic hydrocarbons, and long-chain alkanes, for example, to avoid possible reduction in performance and the like.Step S 2000: bringing the gas to be treated into contact with the surface of a photocatalyst so that at least a part of the organic gas phase compound generates an organic compound product by the action of the photocatalyst. More specifically, in one embodiment, the gas to be treated is contacted with the surface of photocatalyst 400 shown in FIG. 1A, so that at least a part of the organic gas phase compound generates an organic compound product by the action of photocatalyst 400. In one embodiment, this step further comprises continuously providing UV light to irradiate the photocatalyst to produce the organic compound product from the organic gas phase compound. In another embodiment, this step further comprises allowing the organic gas phase compound to react with the photocatalyst multiple times to produce the organic compound product.Step S 3000: providing a solvent that contacts the photocatalyst to dissolve the organic compound product in the solvent, wherein the solubility of the organic compound product in the solvent is higher than the solubility of the organic gas phase compound in the solvent, or wherein the volatility of the organic compound product in the solvent is lower than the volatility of the organic gas phase compound in the solvent. More specifically, in one embodiment, the solvent is contacted with photocatalyst 400 as shown in FIG. 1A to dissolve the organic compound product in the solvent. This step may comprise supplying the solvent in a batch or continuous manner, i.e. the solvent flows intermittently or continuously over the surface of the photocatalyst 400. The solvent preferably flows over the surface of the photocatalyst at a flow rate of 75.6 L / min·m 2 or more. The organic gas phase compound preferably flows over the surface of the photocatalyst at a flow rate of 0.7 m / s or less. This step may comprise spraying the solvent onto the surface of the photocatalyst, such as a shower head, or flowing the solvent over the surface of the photocatalyst in a reciprocating dipping motion.Step S 4000: Separate the gas to be treated that has contacted the photocatalyst and the solvent containing the organic compound product from the photocatalyst. More specifically, in one embodiment, as illustrated in FIG. 1B, the treating gas that has contacted the photocatalyst 400 and the solvent containing the organic compound product are separated from the photocatalyst 400. In particular, the time in which the organic gas phase compound, e.g., acetone, is in contact with the photocatalyst should preferably be longer than the time in which the organic gas phase compound reacts with the photocatalyst to produce an organic compound product, e.g., formic acid, but shorter than the time required for a complete reaction of the organic gas phase compound to final reactants, e.g., carbon dioxide and water.In the prior art using a photocatalyst for decomposing an organic gas phase compound, the photocatalyst cannot react further with the organic gas phase compound due to adhesion of an organic compound product to its surface, resulting in a marked decrease in the reaction rate. In contrast, the present invention provides a solvent that contacts the surface of the photocatalyst, wherein the solubility of the organic compound product (e.g., formic acid) in the solvent (e.g., water) is higher than the solubility of the organic gas phase compound (e.g., acetone) in the solvent, or wherein the volatility of the organic compound product in the solvent is lower than the volatility of the organic gas phase compound in the solvent. Thus, the organic compound product adhering to the surface of the photocatalyst can be quickly carried away by the solvent, so that the photocatalyst can further react with the organic gas phase compound, thereby greatly improving the reaction speed. From another perspective, the present invention is not directed to accelerating the complete reaction of the organic gas phase compound, but rather to utilizing the difference of the organic gas phase compound and the organic compound product in solubility or volatility in the solvent and substantially rinsing the surface of the photocatalyst with the solvent to remove the organic compound product adhered to the surface of the photocatalyst, so that the photocatalyst can further react with the organic gas phase compound, thereby greatly increasing the reaction speed.According to the flow chart of the embodiment shown in FIG. 5, the gas treatment method of the present invention further comprises a step S1200 in which the gas to be treated is passed through a filter unit. More specifically, as shown in FIG. 1B, the gas to be treated is passed through the filter unit 410.According to the flowchart of the embodiment illustrated in FIG. 6, the gas treatment method of the present invention further includes a step S 1500 in which the gas to be treated is passed through the solvent so that at least a part of the organic gas phase compound is converted into an organic liquid phase compound, and a step S 2500 in which the organic liquid phase compound generates the organic compound product by the action of the photocatalyst. Viewed from another perspective, the gas to be treated, which enters the cavity, may be subjected to water washing so that the organic gas phase compound present therein is at least partially dissolved in water to produce an organic liquid phase compound from which an organic compound product that can be carried away from the surface of the photocatalyst by water may also be produced by the action of the photocatalyst. Step S 2500 includes allowing the liquid phase organic compound to react with the photocatalyst multiple times to produce the compound organic product.In the above-described gas treatment method, the gas to be treated may contain one or more organic gas phase compounds, i.e., one or more organic gas phase compounds may be treated simultaneously. In one embodiment, the same concepts may be applied to the treatment of simple organic gas phase compounds and mixtures thereof.According to the flow chart of the embodiment shown in Fig. 7, the method for treating an organic gas phase compound of the present invention comprises, for example, the following steps.Step A 1000: Providing an organic gas phase compound. In one embodiment, this step comprises providing the organic gas phase compound together with a solvent. More specifically, the organic gas phase compound contains volatile organic compounds (VOC). In one embodiment, the organic gas phase compound comprises one or more compounds selected from isopropanol, acetone, and toluene. In other embodiments, the organic gas phase compound does not include one or more compounds selected from polyhalogenated compounds, benzene ring compounds, polycyclic aromatic hydrocarbons, and long-chain alkanes, for example, to avoid possible reduction in performance and the like.Step A2000: Produce an organic compound product from the organic gas phase compound by the action of a photocatalyst. In one embodiment, this step comprises continuously providing UV light to irradiate the photocatalyst to produce the organic compound product from the organic gas phase compound. In another embodiment, this step comprises allowing the organic gas phase compound to react with the photocatalyst a plurality of times to produce the organic compound product.Step A3000: Providing a solvent that comes into contact with the surface of the photocatalyst to dissolve the organic compound product in the solvent, wherein the solubility of the organic compound product in the solvent is higher than the solubility of the organic gas phase compound in the solvent, or wherein the volatility of the organic compound product in the solvent is lower than the volatility of the organic gas phase compound in the solvent. The step A3000 comprises supplying the solvent in a batch or continuous manner. The solvent preferably flows over the surface of the photocatalyst at a flow rate of 75.6 L / min·m 2 or more. The organic gas phase compound preferably flows over the surface of the photocatalyst at a flow rate of 0.7 m / s or less. In one embodiment, this step includes spraying the solvent onto the surface of the photocatalyst as in a shower head. In another embodiment, this step comprises flowing the solvent over the surface of the photocatalyst in a reciprocating dipping motion.Step A 4000: Separate the solvent containing the organic compound product from the photocatalyst.According to the flowchart of the embodiment shown in FIG. 8, the method for treating an organic gas phase compound of the present invention further includes a step A1200 of passing the organic gas phase compound through a filter unit.According to the flowchart of the embodiment illustrated in FIG. 9, the method for treating an organic gas phase compound of the present invention further includes a step A1500 in which the organic gas phase compound is passed through the solvent so that at least a part of the organic gas phase compound is converted into an organic liquid phase compound, and a step A2500 in which the organic liquid phase compound generates the organic compound product by the action of the photocatalyst. Step A 2500 includes allowing the liquid phase organic compound to react with the photocatalyst multiple times to produce the compound organic product.Heretofore, preferred embodiments of the present invention have been schematically illustrated and described. However, all additions, modifications and substitutions which may be employed in the preferred embodiments of the present invention fall within the scope of the present invention as defined by the appended claims. It will be apparent to those of ordinary skill in the art that a number of changes in shape, structure, arrangement, scale, material, element, and component are possible within the scope of the present invention. The exemplary embodiments disclosed above therefore do not represent a limitation, but rather a description of the present invention. The scope of the present invention is defined by the appended claims and includes all legal equivalents of the features recited in the claims.List of reference characters100 Cavity 210 Gas supply unit 220 Gas discharge unit 300 Light source 400 Photocatalyst 410 Filter unit 510 Liquid supply unit 511 Spray hole 520 Liquid discharge unit 900 Gas treatment module

Claims

A gas treatment module comprising: a cavity; a gas supply unit connected to the interior of the cavity and capable of introducing a gas to be treated into the cavity, wherein the gas to be treated contains an organic gas phase compound; a light source disposed in the cavity and capable of supplying a first light; a photocatalyst disposed in the cavity, wherein, under irradiation with the first light, at least a part of the organic gas phase compound of the gas to be treated that contacts the photocatalyst can produce an organic compound product by the action of the photocatalyst; a liquid supply unit that is connected to the inside of the cavity and can provide a solvent that comes into contact with the surface of the photocatalyst and in which the organic compound product can be dissolved, wherein the solubility of the organic compound product in the solvent is higher than the solubility of the organic gas phase compound in the solvent, or wherein the volatility of the organic compound product in the solvent is lower than the volatility of the organic gas phase compound in the solvent; a gas discharge unit that is connected to the inside of the cavity and can discharge the gas to be treated that has come into contact with the photocatalyst and has been separated from the photocatalyst; a liquid discharge unit that is connected to the inside of the cavity and can discharge the solvent containing the organic compound product separated from the photocatalyst.The gas treatment module of claim 1, wherein the light source comprises a continuous provision of UV light as the first light.The gas treatment module of claim 1, further comprising a filter unit through which the gas to be treated can be passed.The gas treatment module according to claim 3, wherein the photocatalyst is located on a side of the filter unit, while the light source and the liquid supply unit are disposed on the outside of the filter unit and face the photocatalyst.The gas treatment module of claim 1, wherein the gas treatment module may be present in multiple, the gas treatment modules being arranged in series.The gas treatment module according to claim 1, wherein the gas to be treated can be passed through the solvent so that at least a part of the organic gas phase compound is converted into an organic liquid phase compound capable of producing the organic compound product by the action of the photocatalyst.The gas treatment module according to claim 1, wherein the liquid supply unit supplies the solvent in a batch manner.The gas treatment module according to claim 1, wherein the liquid supply unit continuously supplies the solvent.The gas treatment module of claim 8, wherein the solvent flows over the surface of the photocatalyst at a flow rate of 75.6 L / min·m 2 or more.The gas treatment module according to claim 1, wherein the organic gas phase compound flows over the surface of the photocatalyst at a flow rate of 0.7 m / s or less.The gas treatment module according to claim 1, wherein the liquid supply unit is configured to spray the solvent onto the surface of the photocatalyst as in a shower head.The gas treatment module according to claim 1, wherein the liquid supply unit is configured such that the solvent flows over the surface of the photocatalyst in a reciprocating dipping motion.The gas treatment module of claim 1, wherein the organic gas phase compound comprises one or more compounds selected from isopropanol, acetone, and toluene.The gas treatment module according to claim 1, wherein the organic gas phase compound does not comprise one or more compounds selected from polyhalogenated compounds, benzene ring compounds, polycyclic aromatic hydrocarbons, and long-chain alkanes.A gas treatment method comprising: - (S1000) providing a gas to be treated containing an organic gas phase compound; - (S2000) bringing the gas to be treated into contact with the surface of a photocatalyst such that at least a part of the organic gas phase compound generates an organic compound product by the action of the photocatalyst; - (S3000) providing a solvent; - (S4000) bringing the solvent into contact with the photocatalyst to dissolve the organic compound product in the solvent, wherein the solubility of the organic compound product in the solvent is higher than the solubility of the organic gas phase compound in the solvent, or wherein the volatility of the organic compound product in the solvent is lower than the volatility of the organic gas phase compound in the solvent; (S5000) separating the gas to be treated, which has contacted the photocatalyst, and the solvent containing the organic compound product from the photocatalyst.The gas treatment method according to claim 15, wherein the step S2000 comprises continuously providing UV light for irradiating the photocatalyst to produce the organic compound product from the organic gas phase compound.The gas treatment method according to claim 15, further comprising: (S1200) passing the gas to be treated through a filter unit.The gas treatment method according to claim 15, wherein the step S2000 comprises allowing the organic gas phase compound to react with the photocatalyst several times to produce the organic compound product.The gas treatment method according to claim 15, further comprising: (S3200) passing the gas to be treated through the solvent so that at least a part of the organic gas phase compound is converted into an organic liquid phase compound; and (S3400) generating the organic compound product from the organic liquid phase compound by the action of the photocatalyst.The gas treatment method according to claim 19, wherein the step S3400 comprises allowing the liquid phase organic compound to react with the photocatalyst multiple times to produce the organic compound product.The gas treatment method according to claim 15, wherein the step S3000 comprises supplying the solvent in a batch manner.The gas treatment method according to claim 15, wherein the step S3000 comprises continuously supplying the solvent.The gas treatment method according to claim 22, wherein the solvent flows over the surface of the photocatalyst at a flow rate of 75.6 L / min·m 2 or more.The gas treatment method according to claim 15, wherein the organic gas phase compound flows over the surface of the photocatalyst at a flow rate of 0.7 m / s or less.The gas treatment method according to claim 15, wherein the step S3000 comprises spraying the solvent on the surface of the photocatalyst as in a shower head.The gas treatment method of claim 15, wherein step S3000 comprises flowing the solvent over the surface of the photocatalyst in a reciprocating dipping motion.The gas treatment method according to claim 15, wherein the organic gas phase compound comprises one or more compounds selected from isopropanol, acetone and toluene.The gas treatment method according to claim 15, wherein the organic gas phase compound does not comprise one or more compounds selected from polyhalogenated compounds, benzene ring compounds, polycyclic aromatic hydrocarbons, and long-chain alkanes.A method for treating an organic gas phase compound, comprising: - (A1000) providing an organic gas phase compound; - (A2000) producing an organic compound product from the organic gas phase compound by the action of a photocatalyst; - (A3000) providing a solvent; - (A4000) contacting the solvent with the surface of the photocatalyst to dissolve the organic compound product in the solvent, wherein the solubility of the organic compound product in the solvent is higher than the solubility of the organic gas phase compound in the solvent, or wherein the volatility of the organic compound product in the solvent is lower than the volatility of the organic gas phase compound in the solvent; - (A5000) separating the solvent containing the organic compound product from the photocatalyst.The method for treating an organic gas phase compound according to claim 29, wherein the step A2000 comprises continuously providing UV light for irradiating the photocatalyst to produce the organic compound product from the organic gas phase compound.The method for treating an organic gas phase compound according to claim 29, wherein the step A2000 comprises allowing the organic gas phase compound to react with the photocatalyst several times to produce the organic compound product.The method for treating an organic gas phase compound according to claim 29, further comprising: (A3200) passing the organic gas phase compound through the solvent so that at least a part of the organic gas phase compound is converted into an organic liquid phase compound; and (A3400) producing the organic compound product from the organic liquid phase compound by the action of the photocatalyst.The gas treatment method according to claim 32, wherein the step A3400 comprises allowing the liquid phase organic compound to react with the photocatalyst multiple times to produce the organic compound product.The method for treating an organic gas phase compound according to claim 29, wherein the step A1000 comprises providing the organic gas phase compound together with the solvent.The method for treating an organic gas phase compound according to claim 29, wherein the step A3000 comprises supplying the solvent in a batch manner.The method for treating an organic gas phase compound according to claim 29, wherein the step A3000 comprises continuously supplying the solvent.The method for treating an organic gas phase compound according to claim 36, wherein the solvent flows over the surface of the photocatalyst at a flow rate of 75.6 L / min·m 2 or more.The method for treating an organic gas phase compound according to claim 29, wherein the organic gas phase compound flows over the surface of the photocatalyst at a flow rate of 0.7 m / s or less.The method for treating an organic gas phase compound according to claim 29, wherein the step A3000 comprises spraying the solvent on the surface of the photocatalyst as in a shower head.The method for treating an organic gas phase compound according to claim 29, wherein the step A3000 comprises flowing the solvent over the surface of the photocatalyst in a reciprocating dipping motion.The method for treating an organic gas phase compound according to claim 29, wherein the organic gas phase compound comprises one or more compounds selected from isopropanol, acetone and toluene.The method for treating an organic gas phase compound according to claim 29, wherein the organic gas phase compound does not comprise one or more compounds selected from polyhalogenated compounds, benzene ring compounds, polycyclic aromatic hydrocarbons, and long-chain alkanes.

Citation Information

Patent Citations

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