Wireless power transmission system

Abstract

Integrated wireless power transmission device comprising a laminated substrate (300) comprising a plurality of layers, a first circuit (100) comprising a first transformer winding (110a) and a second transformer winding (110b) connected in series between a first input node (IN1) and a second input node (IN2), a second circuit (200) galvanically isolated from the first circuit (100) and comprising a third transformer winding (210a) and a fourth transformer winding (210b) connected in series between a first output node (OUT1) and a second output node (OUT2), and a plurality of first contact pads (310) and a plurality of second contact pads (312) formed on a lower surface of the laminated substrate (300).The first transformer winding (110a) is formed on a first layer of the laminated substrate (300), the third transformer winding (210a) is formed on the first layer of the laminated substrate (300), the fourth transformer winding (210b) is formed vertically above the first transformer winding (110a) on a second layer of the laminated substrate (300), the second transformer winding (110b) is formed vertically above the third transformer winding (210a) on the second layer of the laminated substrate (300), the first contact pads (310) of the majority of first contact pads (310) are electrically coupled to the first circuit (100), and the second contact pads (312) of the majority of second contact pads (312) are electrically coupled to the second circuit (200).

Description

TECHNICAL AREA

[0001] The present disclosure relates generally to a wireless power transmission system. BACKGROUND

[0002] Wireless power transfer systems, such as wireless charging systems, offer a convenient and safe way to transfer energy from a power source to a load. In a wireless power transfer system, energy is transferred via an isolation transformer, eliminating the need for a wired connection between the power source and the load.

[0003] A wireless power transmission system can include a transmitter coil and a first driver chip on an input side and a receiver coil and a second driver chip on an output side. The transmitter coil can receive power from a power source. A load can be connected to the receiver coil. During operation of the wireless power transmission system, the input and output sides are connected at different electrical potentials. Galvanic isolation between components connected at different electrical potentials is critical. Implementing appropriate measures to meet galvanic isolation requirements can be costly and / or can significantly increase the size of a wireless power transmission system.

[0004] There is a need for a wireless power transmission system that meets all requirements regarding galvanic isolation, is compact, and can be manufactured easily and at low cost. SUMMARY

[0005] Integrated wireless power transmission device comprising a laminated substrate comprising a plurality of layers, a first circuit comprising a first transformer winding and a second transformer winding connected in series between a first input node and a second input node, a second circuit galvanically isolated from the first circuit comprising a third transformer winding and a fourth transformer winding connected in series between a first output node and a second output node, and a plurality of first contact pads and a plurality of second contact pads formed on a lower surface of the laminated substrate, wherein the first transformer winding is formed on a first layer of the laminated substrate.The third transformer winding is formed laterally spaced from the first transformer winding on the first layer of the laminated substrate; the fourth transformer winding is formed vertically above the first transformer winding on a second layer of the laminated substrate; the second transformer winding is formed vertically above the third transformer winding on the second layer of the laminated substrate; the first contact pads of the majority of first contact pads are electrically coupled to the first circuit; and the second contact pads of the majority of second contact pads are electrically coupled to the second circuit.

[0006] An electrical device comprises the integrated wireless power transfer device, a first circuit arrangement comprising a first circuit element, wherein the first circuit arrangement is electrically coupled to one or more of the plurality of first contact pads, a second circuit arrangement comprising a second circuit element, wherein the second circuit arrangement is electrically coupled to one or more of the plurality of second contact pads, wherein the first circuit arrangement is galvanically isolated from the second circuit arrangement, and the integrated wireless power transfer device is configured to transfer power from the first circuit arrangement to the second circuit arrangement to power the second circuit element.

[0007] The invention can be better understood with reference to the following drawings and description. The components in the figures are not necessarily to scale; instead, the emphasis is placed on illustrating the principles of the invention. Furthermore, in the figures, the same reference numerals denote corresponding parts in the different views. BRIEF DESCRIPTION OF THE DRAWINGS Fig. Figure 1 schematically illustrates elements of a conventional wireless power transmission device in a circuit diagram. Fig. Figure 2 schematically illustrates in a circuit diagram elements of an integrated wireless power transmission device according to embodiments of the disclosure. Fig. Figure 3 schematically illustrates in a cross-sectional view transformer windings of an integrated wireless power transmission device according to embodiments of the disclosure. Fig. Figure 4 schematically illustrates in a cross-sectional view an integrated wireless power transmission device according to embodiments of the disclosure. Fig. Figure 5 schematically illustrates in a top view an integrated wireless power transmission device according to embodiments of the disclosure. Fig. Figure 6 schematically illustrates in another cross-sectional view an integrated wireless power transmission device according to embodiments of the disclosure. Fig. Figure 7 schematically illustrates in a cross-sectional view an integrated wireless power transmission device according to further embodiments of the disclosure. Fig. Figure 8 schematically illustrates in a top view an integrated wireless power transmission device according to further embodiments of the disclosure. Fig. Figure 9 schematically illustrates in another cross-sectional view an integrated wireless power transmission device according to further embodiments of the disclosure. Fig. Figure 10 schematically illustrates in a top view an integrated wireless power transmission device according to further embodiments of the disclosure. Fig. Figure 11 schematically illustrates in another cross-sectional view an integrated wireless power transmission device according to further embodiments of the disclosure. Fig. Figure 12 schematically illustrates in a cross-sectional view an integrated wireless power transmission device according to embodiments of the disclosure. Fig. 13, including the Fig. 13A- Fig. 13C, schematically illustrated in cross-sectional views of wireless power transmission devices integrated according to further embodiments of the disclosure. Fig. Figure 14 schematically illustrates in a cross-sectional view an electrical device according to embodiments of the disclosure. Fig. 15, including the Fig. 15A and Fig. 15B, schematically illustrated in plan views transformer windings of an integrated wireless power transmission device according to further embodiments of the disclosure. DETAILED DESCRIPTION

[0008] Wireless power transfer systems, such as wireless charging systems, offer a convenient and safe way to transfer energy from a power source to a load. In a wireless power transfer system, energy is transferred via an isolation transformer, so no galvanic connection is required between the power source and the load. With reference to Fig. Figure 1 schematically illustrates a wireless power transmission system. The wireless power transmission system includes a first transformer coil 110 and a first control component 114 on a first side 100, and a second transformer coil 210 and a second control component 214 on a second side 200. The first transformer coil 110 can receive power from a power source 112. A load 212 can be connected to the second transformer coil 210. During operation of the wireless power transmission system, the first side 100 and the second side 200 are connected at different electrical potentials.In other words, the first circuit 100 can be configured to operate in a first voltage range, and the second circuit 200 can be configured to operate in a second voltage range that differs from the first. Galvanic isolation between components connected at different electrical potentials or voltage ranges is critical. Implementing appropriate measures to meet galvanic isolation requirements can be costly and / or can significantly increase the size of a wireless power transmission system.

[0009] With reference to Fig. 2 and Fig. Figure 3 is an integrated wireless power transmission device according to embodiments of the disclosure, schematically illustrated. In particular, it illustrates Fig. 2 In a block diagram, schematically depict elements of an integrated wireless power transmission device according to embodiments of the disclosure. Fig. Figure 3 schematically illustrates in a cross-sectional view a laminated substrate 300 with transformer windings formed therein of an integrated wireless power transmission device according to embodiments of the disclosure. In the integrated wireless power transmission device, the first circuit 100 comprises a first transformer winding 110a and a second transformer winding 110b instead of a single transformer coil 110. Likewise, the second circuit 220 comprises a third transformer winding 210a and a fourth transformer winding 210b instead of a single transformer coil 210.In particular, the integrated wireless power transmission device comprises a first circuit 100, which includes a first transformer winding 110a and a second transformer winding 110b connected in series between a first input node IN1 and a second input node IN2, and a second circuit 200, which is galvanically isolated from the first circuit 100 and includes a third transformer winding 210a and a fourth transformer winding 210b connected in series between a first output node OUT1 and a second output node OUT2. Similar to the above. Fig. As described above, the first transformer winding 110a and the second transformer winding 110b can receive power from a power source 112. A load 212 can be connected to the third transformer winding 210a and the fourth transformer winding 210b.

[0010] In the wireless power transmission device, exemplified in Fig. As illustrated in Figure 2, power can be transferred from the first circuit (100) to the second circuit (200). However, this is only one example. It is also generally possible for a wireless power transfer device to be bidirectional. That is, in a first mode, the wireless power transfer device can be configured to transfer power from the first circuit (100) to the second circuit (200). Furthermore, in a second mode, the wireless power transfer device can be configured to transfer power from the second circuit (200) to the first circuit (100). That is, the wireless power transfer device, with its components and the connections between the components, as shown in Figure 2, can be configured to transmit power from the first circuit (100) to the second circuit (200). Fig. Figure 2 illustrates only one of several possible examples. The wireless power transmission device may include more components than those shown in Figure 2. Fig. 2 are illustrated. Furthermore, the different components can generally be connected to each other in any suitable way that allows power to be transferred from the first circuit 100 to the second circuit 200 and / or vice versa.

[0011] With reference to Fig. 3 The integrated wireless power transmission device further comprises a laminated substrate 300, which includes a plurality of layers and a plurality of first contact pads 310 and a plurality of second contact pads 312 formed on a lower surface of the laminated substrate 300. The first transformer winding 110a is formed on a first layer of the laminated substrate 300, the third transformer winding 210a is formed laterally spaced from the first transformer winding 110a on the first layer of the laminated substrate 300, the fourth transformer winding 210b is formed vertically above the first transformer winding 110a on a second layer of the laminated substrate 300, and the second transformer winding 110b is formed vertically above the third transformer winding 210a on the second layer of the laminated substrate 300.The first contact pads 310 of the majority of first contact pads 310 are electrically coupled to the first circuit 100, and the second contact pads 312 of the majority of second contact pads 312 are electrically coupled to the second circuit 200. The specific arrangement of the different transformer windings 110a, 110b, 210a, 210b in the laminated substrate 300 makes it possible to implement the integrated wireless power transmission device in a very compact manner and at comparatively low cost, while fully meeting all requirements regarding galvanic isolation. This is described in more detail below.

[0012] The first and second layers of the laminated substrate 300 can be directly adjacent. However, it is also possible for one or more additional layers of the laminated substrate 300 to be arranged between the first and second layers. Furthermore, a surface of the first layer can form the bottom surface of the laminated substrate 300. Alternatively, one or more additional layers of the laminated substrate 300 can be arranged between the first layer and the bottom surface of the laminated substrate 300.

[0013] As shown in the cross-sectional view of Fig. As can be seen in Figure 3, the first transformer winding 110a and the fourth transformer winding 210b can be arranged closer to a first lateral side of the laminated substrate 300 than to a second lateral side opposite the first lateral side, and the third transformer winding 210a and the second transformer winding 110b can be arranged closer to the second lateral side of the laminated substrate 300 than to the first lateral side. For example, the majority of first contact pads 310 can be arranged partially beneath the first transformer winding 110a, and the second majority of contact pads 312 can be arranged partially beneath the third transformer winding 210a. That is, the majority of first contact pads 310 can be arranged partially beneath the transformer winding to which they are electrically connected.Similarly, the majority of second contact pads 312 can be partially located beneath the transformer winding to which they are electrically connected. However, the contact pads of the first and second majority of contact pads 310, 312 need not necessarily be partially located beneath the respective transformer windings 110a, 210a. Some or all of the contact pads can be located laterally spaced from the respective transformer windings 110a, 210a. It can be said, however, that the majority of first contact pads 310 can be located closer to the first transformer winding 110a than to the third transformer winding 210a, and the majority of second contact pads 312 can be located closer to the third transformer winding 210a than to the first transformer winding 110a.Since the majority of first contact pads 310 and the first transformer winding 110a are coupled at the same electrical potential, and similarly the majority of second contact pads 312 and the third transformer winding 210a are coupled at the same electrical potential, the first layer, as well as any (optional) additional layers of the laminated substrate 300 located beneath the first transformer winding 110a and the third transformer winding 210a (between the first and third transformer windings 110a, 210a and the underside of the laminated substrate 300), can be implemented as a comparatively thin layer(s). This is because only functional insulation is required between components coupled at the same electrical potential.

[0014] Galvanic isolation between the majority of first contact pads 310 and the third transformer winding 210a results from a sufficiently large lateral distance between the elements concerned. This applies similarly to the majority of second contact pads 312 and the first transformer winding 110a. Furthermore, the majority of first contact pads 310 are sufficiently galvanically isolated from the fourth transformer winding 210b, and the majority of second contact pads 312 are sufficiently galvanically isolated from the second transformer winding 110b by means of the different layers of the laminated substrate 300 arranged between them (i.e., the first and second layers of the laminated substrate 300, as well as any optional further layers of the laminated substrate 300).The specific arrangement of the different components in the laminated substrate 300, in particular the diagonal arrangement of the first and second transformer windings 110a, 110b, or of the third and fourth transformer windings 210a, 210b, ensures sufficient galvanic isolation between components of the first circuit 100 and components of the second circuit.

[0015] With further reference to Fig. 3. The following can apply. The laminated substrate 300 can essentially be divided into a first section S1 and a second section S2, arranged side by side in a lateral direction. The first transformer winding 110a, the fourth transformer winding 210b, and the plurality of first contact pads 310 can be arranged in the first section S1, and the third transformer winding 210a, the second transformer winding 110b, and the plurality of second contact pads 312 can be arranged in the second section S2. A third section S3 can be arranged between the first section S1 and the second section S2, with no conductive structures other than simple conductor tracks required to electrically couple elements arranged in the first section S1 with elements arranged in the second section S2 being arranged in the third section S3.In this way, galvanic isolation can be ensured between elements located in the first section S1 and elements located in the second section S2.

[0016] As mentioned above, the first circuit 100 can be configured to wirelessly transmit power to the second circuit 200 and / or to wirelessly receive power from the second circuit 200. Accordingly, the first circuit 100 can further comprise a first control component 114 configured to control the power transmission from the first circuit 100 to the second circuit 200. Alternatively or additionally, the first control component 114 can be configured to control the power reception. The second circuit 200 can further comprise a second control component 214 configured to control the power reception, which is arranged on or integrated into the laminated substrate 300. Alternatively or additionally, the second control component 214 can be configured to control the power transmission from the second circuit 200 to the first circuit 100.A first control component 114 and a second control component 214 are shown in the exemplary circuit diagram of . Fig. 2 schematically illustrated.

[0017] The first control component 114 and the second control component 214 can be arranged on or integrated into the laminated substrate 300. With reference to Fig. 4. At least a third layer of the laminated substrate 300 can be arranged between the second layer with the second and fourth transformer windings 110b, 210b formed thereon and an upper surface of the laminated substrate 300 opposite the lower surface. The second control component 214 is arranged on the upper surface of the laminated substrate 300, and the first control component 114 is arranged on the upper surface of the laminated substrate 300. The second control component 214 is located in the Fig. In the illustrated example 4, the first control component 114 is located closer to the first lateral side of the laminated substrate 300 than to the second lateral side. Similarly, the first control component 114, which is part of the first circuit 100, is located closer to the second transformer winding 110b, which is also part of the first circuit 100, than to the second transformer winding 110b, which is part of the second circuit 200. Likewise, the second control component 214, which is part of the second circuit 200, is located closer to the fourth transformer winding 210b, which is also part of the second circuit 200, than to the second transformer winding 110b, which is part of the first circuit 100.In this way, sufficient galvanic isolation between the first circuit 100 and the second circuit 200 can be ensured, even if any layers of the laminated substrate 300 arranged vertically above the second layer are comparatively thin.

[0018] With further reference to Fig. 4 and furthermore with reference to Fig. 5 and Fig. 6. The second control component 214 can be arranged at least partially vertically above the fourth transformer winding 210b, and / or the first control component 114 can be arranged at least partially vertically above the second transformer winding 110b. In this way, the integrated wireless power transmission device can be implemented in a compact and space-saving manner, while still providing sufficient galvanic isolation between the first circuit 100 and the second circuit 200. Fig. Figure 5 schematically illustrates in a top view an integrated wireless power transmission device in which the second control component 214 is arranged partially vertically above the fourth transformer winding 210b, and the first control component 114 is arranged at least partially vertically above the second transformer winding 110b. Fig. Figure 6 schematically illustrates the integrated wireless power transmission device of Fig. 5 in another cross-sectional view (along the section plane A-A', as in Fig. 5). The arrangements that are in Fig. 4, Fig. 5 and Fig. The illustrations shown in 6 are only examples.

[0019] According to alternative embodiments, it is also possible that the first control component 114 is arranged closer to the first lateral side of the laminated substrate 300 than to the second lateral side, and the second control component 214 is arranged closer to the second lateral side of the laminated substrate 300 than to the first lateral side. This is shown schematically in Fig. 7, Fig. 8 and Fig. Figure 9 illustrates this. In this case, the first control component 114, which is part of the first circuit 100, is located closer to the fourth transformer winding 210b, which is part of the second circuit 200, than to the second transformer winding 110b, which is part of the first circuit 100. Similarly, the second control component 214, which is part of the second circuit 200, is located closer to the second transformer winding 110b, which is part of the first circuit 100, than to the fourth transformer winding 210b, which is part of the second circuit 200. Therefore, to ensure sufficient galvanic isolation between the first circuit 100 and the second circuit 200, the first control component 114 in this example can be spaced laterally from the fourth transformer winding 210b such that a lateral distance d1 between the first control component 114 and the fourth transformer winding 210b is greater than zero (see Figure 9). Fig. 8 and Fig. 9) Additionally or alternatively, the second control component 214 can be spaced laterally from the second transformer winding 110b such that a lateral distance d2 between the second control component 214 and the second transformer winding 110b is greater than zero (see Fig. 8) The lateral distances d1, d2 can generally be set large enough to ensure dielectric isolation between the first control component 114 and the fourth transformer winding 210b, and between the second control component 214 and the second transformer winding 110b, respectively. In some cases, a short lateral distance d1, d2 may be sufficient, while in other cases a comparatively large lateral distance d1, d2 may be required to reliably ensure dielectric isolation.

[0020] In the exemplary arrangements shown in Fig. 4, Fig. 5, Fig. 6, Fig. 7, Fig. 8 to Fig. As illustrated in Figure 9, the first control component 114 and the second control component 214 are both arranged on the laminated substrate 300 (i.e., on an upper surface of the laminated substrate 300 opposite the lower surface). However, it is also generally possible for at least one of the first control component 114 and the second control component 214 to be integrated into the laminated substrate 300. In the arrangement shown schematically in Figure 9, the first control component 114 and the second control component 214 are arranged as follows: Fig. 10 and Fig. As illustrated in Figure 11, the first control component 114 and the second control component 214 are both integrated into the laminated substrate 300. For example, and as shown in the cross-sectional view of Fig. As schematically illustrated in Figure 11, the first control component 114 and / or the second control component 214 can be arranged on the first layer of the laminated substrate 300 (the same layer on which the first transformer winding 110a and the third transformer winding 210a are formed).

[0021] In the Fig. 10 and Fig. In the illustrated example 11, the first control component 114 is located closer to the first lateral side than to the second lateral side, and the second control component 214 is located closer to the second lateral side than to the first lateral side. Thus, the first control component 114, which is part of the first circuit 100, is located in the same plane as the first transformer winding 110a and the third transformer winding 210a, and is located closer to the first transformer winding 110a, which is part of the first circuit 100, than to the third transformer winding 210a, which is part of the second circuit 200.The second control component 214, which is part of the second circuit 200, is also located in the same plane as the first transformer winding 110a and the third transformer winding 210a, and is closer to the third transformer winding 210a, which is part of the second circuit 200, than to the first transformer winding 110a, which is part of the first circuit 100. Therefore, the lateral distance d1 between the first control component 114 and the first transformer winding 110a and the lateral distance d2 between the second control component 214 and the third transformer winding 210a can be comparatively small.

[0022] The electrical connections between the various elements of the integrated wireless power transmission device can be implemented by means of conductive traces (e.g., metallic layers) on different layers of the laminated substrate 300. Conductive traces arranged on different layers of the laminated substrate 300 can, for example, be electrically coupled to each other by means of so-called vias. Fig. 5, Fig. 8 and Fig. 10. Conductive traces formed on the first layer of the laminated substrate 300 are indicated by dashed lines, while conductive traces formed on the second layer of the laminated substrate 300 are indicated by solid lines. Vias between conductive traces located on different layers are indicated by circles. In the top views of Fig. 5, Fig. 8 and Fig. In Figure 10, only the second transformer winding 110b and the fourth transformer winding 210b, which are arranged on the second layer of the laminated substrate 300, are visible. The first transformer winding 110a, which is arranged on the first layer, is covered by the fourth transformer winding 210b, and the third transformer winding 210a, which is arranged on the first layer, is covered by the second transformer winding 110b.

[0023] According to some examples, the first transformer winding 110a can be wound clockwise and the second transformer winding 110b can be wound counterclockwise. Alternatively, the first transformer winding 110a can be wound counterclockwise and the second transformer winding 110b can be wound clockwise. This applies similarly to the third transformer winding 210a and the fourth transformer winding 210b. In particular, the third transformer winding 210a can be wound clockwise and the fourth transformer winding 210b can be wound counterclockwise, or the third transformer winding 210a can be wound counterclockwise and the fourth transformer winding 210b can be wound clockwise. If two transformer windings belonging to the same circuit 100, 200 are wound clockwise and counterclockwise, respectively, the windings can be wound clockwise and counterclockwise.If the windings are wound counterclockwise, this leads to magnetic fields that cancel each other out at a defined distance from the respective transformer windings.

[0024] With reference to Fig. 12. The integrated wireless power transmission device can further comprise a molding compound 400 that covers an upper surface of the laminated substrate 300 relative to the lower surface. In this way, the upper surface of the laminated substrate 300 and all components arranged on it (e.g., the first control component 114 and / or the second control component 214) can be protected from environmental influences and mechanical damage. The integrated wireless power transmission device can thus be handled safely and integrated into an electrical device, which is described in more detail below.

[0025] With reference to Fig. 13A The integrated wireless power transmission device can further comprise a first magnetic core 402, which comprises one or more layers of magnetic material and extends vertically through the laminated substrate 300 and through a central region of the fourth transformer winding 210b and a central region of the first transformer winding 110a. Alternatively or additionally, the integrated wireless power transmission device can further comprise a second magnetic core 404, which comprises one or more layers of magnetic material and extends vertically through the laminated substrate 300 and through a central region of the second transformer winding 110b and a central region of the third transformer winding 210a. The first and second magnetic cores 402, 404 can be configured to guide the respective magnetic fields.The first and second magnetic cores 402, 404, for example, can comprise or consist of a ferromagnetic metal, such as iron, or ferrimagnetic compounds, such as ferrites. The use of a magnetic core can increase the strength of the magnetic field in an electromagnetic coil by a factor of several hundred compared to an implementation without the core. Fig. In Figure 13A, the transformer windings 110a, 110b, 210a, 210b are represented by circles extending around a central region and around the respective magnetic cores 402, 404 located in the central regions. This only indicates a very general arrangement of the transformer windings in the laminated substrate 300. Different windings of a transformer winding can be arranged in the same plane, as shown in Figure 13A. Fig. 13A is illustrated schematically, as well as, for example, in different levels.

[0026] Both the first magnetic core 402 and the second magnetic core 404 can extend through all or only a subset of the layers of the laminated substrate 300. In the Fig. In the example illustrated in Figure 13A, the first magnetic core 402 and the second magnetic core 404 extend only through a subset of the layers of the laminated substrate 300. That is, in the Fig. In the illustrated example 13A, the first magnetic core 402 and the second magnetic core 404 are not visible on the top and bottom surfaces of the laminated substrate 300. However, it is also possible for the first magnetic core 402 and the second magnetic core 404 to extend through the entire stack of layers forming the laminated substrate 300, so that they are visible on the top and bottom surfaces of the laminated substrate 300. A first and second magnetic core 402, 404 can generally be implemented in any suitable way.

[0027] With reference to Fig. 13B and Fig. In 13C it is also possible that a magnetic core 402, 404 is used instead of or in addition to the one shown in Fig. Figure 13A illustrates extending vertically through the laminated substrate 300 and through a central area of ​​the respective transformer windings, and horizontally between the respective transformer windings (see Fig. 13B), above and / or below the respective transformer windings (see Fig. 13C). That is to say, in general, an integrated wireless power transmission device may comprise a first magnetic core 402 comprising at least one of the following: one or more layers of magnetic material arranged between the fourth transformer winding 210b and the first transformer winding 110a, one or more layers of magnetic material arranged between the first transformer winding 110a and the lower surface of the laminated substrate 300, and / or one or more layers of magnetic material arranged between the fourth transformer winding 210b and an upper surface of the laminated substrate 300 opposite the lower surface.Likewise, the integrated wireless power transmission device can comprise a second magnetic core 404 comprising at least one of the following: one or more layers of magnetic material arranged between the second transformer winding 110b and the third transformer winding 210a, one or more layers of magnetic material arranged between the third transformer winding 210a and the lower surface of the laminated substrate 300, and / or one or more layers of magnetic material arranged between the second transformer winding 110b and the upper surface of the laminated substrate 300.

[0028] The different designs that are in Fig. 13A, Fig. 13B and Fig. The concepts illustrated in 13C can generally be combined in a suitable manner. Fig. 13B and Fig. Figure 13C illustrates the first magnetic core 402 with dimensions in the horizontal direction x that essentially correspond to the dimensions of the respective transformer windings 110a and 210b in the same direction. Likewise, the second magnetic core 404 is illustrated with dimensions in the horizontal direction x that essentially correspond to the dimensions of the respective transformer windings 110b and 210a. However, this is only an example. The magnetic cores 402 and 404 in the horizontal direction x can generally have dimensions that differ from the dimensions of the respective transformer windings in the same direction. The magnetic material forming the first magnetic core 402 and the second magnetic core 404 can be applied to or formed within one or more layers of the laminated substrate 300.By appropriately choosing the general shape and size of a magnetic core 402, 404, the field distribution can be adjusted or influenced in a desired way.

[0029] With reference to Fig. Figure 14 schematically illustrates an electrical device according to embodiments of the disclosure. The electrical device comprises an integrated wireless power transmission device according to one of the various embodiments described herein. The electrical device further comprises a first circuit arrangement 502, which includes a first circuit element 602, wherein the first circuit arrangement 502 is electrically coupled to one or more of the plurality of first contact pads 310, and a second circuit arrangement 602, which includes a second circuit element 604, wherein the second circuit arrangement 602 is electrically coupled to one or more of the plurality of second contact pads 312.The first circuit arrangement 502 is galvanically isolated from the second circuit arrangement 602, and the integrated wireless power transfer device is configured to transfer power from the first circuit arrangement 502 to the second circuit arrangement 602 to power the second circuit element 604 (or vice versa).

[0030] According to some embodiments, and as schematically shown in Fig. As illustrated in Figure 14, the first circuit arrangement 502 can include a second laminated substrate, and the second circuit arrangement 504 can include a third laminated substrate that is separate from and distinct from the second laminated substrate. In this example, the integrated wireless power transfer device can be mechanically and electrically coupled to one or more contact elements (e.g., contact pads) provided on a surface of the second laminated substrate, and the integrated wireless power transfer device can be mechanically and electrically coupled to one or more contact elements (e.g., contact pads) provided on a surface of the third laminated substrate (contact elements not specifically provided in Fig. 14 are illustrated).

[0031] For example, one or more contact pads of the plurality of first contact pads 310 can be mechanically and electrically coupled (directly or indirectly via intervening connecting elements, such as pins or bond wires) to one or more of the contact elements provided on the surface of the second laminated substrate, and one or more contact pads of the plurality of second contact pads 312 can be mechanically and electrically coupled (directly or indirectly via intervening connecting elements, such as pins or bond wires) to one or more of the contact elements provided on the surface of the third laminated substrate.According to some embodiments, the integrated wireless power transmission device can be mechanically coupled to one or more contact elements provided on a surface of the second laminated substrate by means of an adhesive bond, a soldered connection, a welded connection, or a clamped connection. Likewise, the integrated wireless power transmission device can be mechanically coupled to one or more contact elements provided on a surface of the third laminated substrate by means of an adhesive bond, a soldered connection, a welded connection, or a clamped connection.

[0032] An electrical device comprising a first circuit arrangement 502, comprising a second laminated substrate, and a second circuit arrangement 504, comprising a third laminated substrate that is separate from and distinct from the second laminated substrate, is, however, only one example. According to further examples (not specifically illustrated), it is alternatively possible that the first circuit arrangement 502 is arranged on and / or integrated into a first section of a fourth laminated substrate, and the second circuit arrangement 504 is arranged on and / or integrated into a second section of the fourth laminated substrate. The first section and the second section of the fourth laminated substrate can be arranged side by side in a lateral direction.A third section of the fourth laminated substrate can be arranged between the first and second sections, with no electrically conductive elements or structures located in the third section. This ensures galvanic isolation between components electrically coupled at different potentials, even if the first circuit arrangement 502 and the second circuit arrangement 504 are located on or integrated into the same laminated substrate. In this case, the integrated wireless power transmission device can be mechanically and electrically coupled to one or more contact elements provided on a surface of the fourth laminated substrate.In particular, one or more contact pads of the plurality of first contact pads 310 can be mechanically and electrically coupled to one or more first contact elements of the contact elements provided on the surface of the fourth laminated substrate, and one or more contact pads of the plurality of second contact pads 311 can be mechanically and electrically coupled to one or more second contact elements of the contact elements provided on the surface of the fourth laminated substrate.

[0033] Similar to the above regarding Fig. As described in paragraph 14, the integrated wireless power transmission device can be mechanically coupled to one or more first contact elements provided on a surface of the fourth laminated substrate by means of an adhesive bond, a soldered connection, a welded connection, a diffusion bonded connection or a clamped connection, and the integrated wireless power transmission device can be mechanically coupled to one or more second contact elements provided on a surface of the fourth laminated substrate by means of an adhesive bond, a soldered connection, a welded connection or a clamped connection.

[0034] Regardless of whether the integrated wireless power transmission device is electrically and mechanically coupled to two separate laminated substrates (i.e., second and third laminated substrate) or to a single laminated substrate (i.e., fourth laminated substrate), the first circuit element 602 may be or comprise a controller, and the second circuit element 604 may be or comprise a controllable transistor device.

[0035] In the embodiments described in Fig. 3, Fig. 4, Fig. 5, Fig. 6, Fig. 7, Fig. 8, Fig. 9, Fig. 10, Fig. 11, Fig. 12, Fig. 13 to Fig. As illustrated in Figure 14, the majority of first contact pads 310 are arranged laterally spaced apart from one another along a first lateral side of the laminated substrate 300, and the majority of second contact pads 312 are arranged laterally spaced apart from one another along a second lateral side of the laminated substrate 300, the second lateral side being opposite the first lateral side. However, this is only an example. The majority of first contact pads 310 and the majority of second contact pads 312 can generally be arranged along the same or along a different lateral side of the laminated substrate 300. With reference to Fig. In 15A, for example, the majority of first contact pads 310 are arranged along a first lateral side of the laminated substrate 300, and the majority of second contact pads 312 are arranged along a second lateral side of the laminated substrate 300. In this example, however, the second lateral side extends perpendicular to the first lateral side. Fig.Figure 15B schematically illustrates an arrangement in which the majority of first contact pads 310 and the majority of second contact pads 312 extend along the same lateral side of the laminated substrate 300. However, as described above, the majority of first contact pads 310 may be located closer to the first transformer winding 111a than to the third transformer winding, and the majority of second contact pads 312 may be located closer to the third transformer winding 210a than to the first transformer winding 110a to ensure adequate galvanic isolation.In further embodiments (not specifically illustrated), the contact pads forming the majority of first contact pads 310 can be distributed along more than one lateral side of the laminated substrate 300, and / or the contact pads forming the majority of second contact pads 312 can be distributed along more than one lateral side of the laminated substrate 300.

[0036] A laminated substrate 300 is generally formed from a non-conductive material that provides mechanical support and electrical insulation for all components and conductive traces arranged on or integrated within it. Laminated substrates may comprise or consist of a rigid material such as glass-fiber-reinforced epoxy laminate, bismaleimide triazine (BT), resin, or imide-based polymers. The laminated substrate 300 may include a core element used in a lamination process to add further layers. The core element itself may comprise or consist of a laminated element. All other suitable materials are also possible. Multilayer substrates generally comprise two or more different layers.A laminated substrate 300, comprising contact pads arranged on its lower surface and forming terminals for contacting external connectors, can be referred to as a Land Grid Array (LGA) substrate. The integrated wireless power transmission device can be provided in the form of an LGA package. In other implementations, the wireless power transmission device can be provided as a Pin Grid Array (PGA) package or a Ball Grid Array (BGA) package, with terminals provided in the form of pins or balls that connect to the provided contact pads.

[0037] If the integrated wireless power transmission device comprises a first control component 114 and / or a second control component 214 arranged on the upper surface of the laminated substrate 300, the respective control component(s) 114, 214 can be electrically coupled to the respective structures of the integrated wireless power transmission device by means of a so-called flip-chip arrangement. That is, contact pads of the respective control component(s) 114, 214 can be directly attached to respective contact pads provided on the upper surface of the laminated substrate 300. Alternatively, it is also possible for the respective control component(s) 114, 214 to be electrically coupled to respective contact pads provided on the upper surface of the laminated substrate 300 by means of bond wires.

[0038] In conventional wireless power transmission devices, components belonging to one voltage range are often located relatively close to components belonging to another voltage range. In such wireless power transmission devices, appropriate measures must be taken to provide sufficient galvanic isolation between the different voltage ranges. For example, one or more layers of a multilayer substrate with a defined minimum thickness must be implemented if the lateral distance between the components in question is too small. Alternatively, the lateral distance between the components in question must be increased. Such measures often result in an increased size (laterally and / or vertically) of the respective substrate.The integrated wireless power transmission device according to the various embodiments described herein can be implemented in a compact manner due to the lateral separation of components arranged in the same layer of the laminated substrate 300 and belonging to different voltage ranges. The integrated wireless power transmission device according to the embodiments described herein meets all requirements regarding functional isolation and enhanced isolation. Enhanced isolation of operating voltages up to 10.3 kV in the integrated wireless power transmission device is generally only required in one lateral direction, i.e.,between the first transformer winding 110a and the third transformer winding 210a, which are arranged on the first layer, and between the fourth transformer winding 210b and the second transformer winding 110b, which are arranged on the second layer of the laminated substrate 300. This enhanced insulation can be easily achieved by arranging the respective components, which belong to different voltage ranges, at a defined lateral distance from each other.

[0039] The present revelation can further be illustrated by the following examples.

[0040] An integrated wireless power transmission device according to a first example comprises a laminated substrate 300 comprising a plurality of layers, a first circuit 100 comprising a first transformer winding 110a and a second transformer winding 110b connected in series between a first input node IN1 and a second input node IN2, a second circuit 200 galvanically isolated from the first circuit 100 and comprising a third transformer winding 210a and a fourth transformer winding 210b connected in series between a first output node OUT1 and a second output node OUT2, and a plurality of first contact pads 310 and a plurality of second contact pads 312 formed on a lower surface of the laminated substrate 300, wherein the first transformer winding 110a is formed on a first layer of the laminated substrate 300.the third transformer winding 210a is formed laterally spaced from the first transformer winding 110a on the first layer of the laminated substrate 300, the fourth transformer winding 210b is formed vertically above the first transformer winding 110a on a second layer of the laminated substrate 300, the second transformer winding 110b is formed vertically above the third transformer winding 210a on the second layer of the laminated substrate 300, the first contact pads 310 of the majority of first contact pads 310 are electrically coupled to the first circuit 100, and the second contact pads 312 of the majority of second contact pads 312 are electrically coupled to the second circuit 200.

[0041] According to a second example based on the first example, the first circuit 100 can be configured to wirelessly transmit power to the second circuit 200 and / or to wirelessly receive power from the second circuit 200.

[0042] According to a third example based on the second example, the first circuit 100 may further comprise a first control component 114 arranged on or integrated into the laminated substrate 300, and the second circuit 200 may further comprise a second control component 214 arranged on or integrated into the laminated substrate 300, wherein the first control component 114 and the second control component 214 are configured to control the power transfer between the first circuit 100 and the second circuit 200.

[0043] According to a fourth example, based on one of the first to third examples, the first contact pads 310 of the plurality of first contact pads 310 can be arranged laterally spaced apart from each other along a lateral side of the laminated substrate 300, and the second contact pads 312 of the plurality of second contact pads 312 can be arranged laterally spaced apart from each other along the same or a different lateral side of the laminated substrate 300 as the plurality of first contact pads 310.

[0044] According to a fifth example based on the fourth example, the laminated substrate 300 can comprise a first lateral side and a second lateral side opposite the first lateral side, wherein the first transformer winding 110a and the fourth transformer winding 210b are located closer to the first lateral side of the laminated substrate 300 than to the second lateral side, and the third transformer winding 210a and the second transformer winding 110b are located closer to the second lateral side of the laminated substrate 300 than to the first lateral side.

[0045] According to a sixth example, based on the fourth or fifth example, the integrated wireless power transmission device may further comprise a molding compound 400 covering an upper surface of the laminated substrate 300 opposite the lower surface.

[0046] According to a seventh example, based on one of the fourth to sixth examples, at least a third layer of the laminated substrate 300 can be arranged between the second layer with the second and fourth transformer windings 110b, 210b formed thereon and an upper surface of the laminated substrate 300 opposite the lower surface, wherein the second control component 214 is arranged on the upper surface of the laminated substrate 300, and the first control component 114 is arranged on the upper surface of the laminated substrate 300.

[0047] According to an eighth example based on the seventh example, the laminated substrate 300 can comprise a first lateral side and a second lateral side opposite the first lateral side, wherein the second control component 214 is located closer to the first lateral side of the laminated substrate 300 than to the second lateral side, and the first control component 114 is located closer to the second lateral side of the laminated substrate 300 than to the first lateral side.

[0048] According to a ninth example based on the eighth example, the second control component 214 can be arranged at least partially vertically above the fourth transformer winding 210b, and / or the first control component 114 can be arranged at least partially vertically above the second transformer winding 110b.

[0049] According to a tenth example based on the seventh example, the first control component 114 can be located closer to the first lateral side of the laminated substrate 300 than to the second lateral side, and the second control component 214 can be located closer to the second lateral side of the laminated substrate 300 than to the first lateral side.

[0050] According to an eleventh example based on the tenth example, the first control component 114 can be spaced laterally from the fourth transformer winding 210b such that a lateral distance d1 between the first control component 114 and the fourth transformer winding 210b is greater than zero, and / or the second control component 214 can be spaced laterally from the second transformer winding 110b such that a lateral distance d2 between the second control component 214 and the second transformer winding 110b is greater than zero.

[0051] According to a twelfth example, based on one of the preceding examples, the first transformer winding 110a may be wound clockwise and the second transformer winding 110b may be wound counterclockwise, or the first transformer winding 110a may be wound counterclockwise and the second transformer winding 110b may be wound clockwise, and the third transformer winding 210a may be wound clockwise and the fourth transformer winding 210b may be wound counterclockwise, or the third transformer winding 210a may be wound counterclockwise and the fourth transformer winding 210b may be wound clockwise.

[0052] According to a thirteenth example based on one of the preceding examples, the integrated wireless power transmission device may further comprise a first magnetic core 402 comprising at least one of the following: one or more layers of magnetic material extending vertically through the laminated substrate 300 and through a central region of the fourth transformer winding 210b and a central region of the first transformer winding 110a, and / or a second magnetic core 404 comprising at least one of the following: one or more layers of magnetic material extending vertically through the laminated substrate 300 and through a central region of the second transformer winding 110b and a central region of the third transformer winding 210a.

[0053] According to a fourteenth example based on one of the preceding examples, the integrated wireless power transmission device may further comprise a first magnetic core 402 comprising at least one of the following: one or more layers of magnetic material arranged between the fourth transformer winding 210b and the first transformer winding 110a, one or more layers of magnetic material arranged between the first transformer winding 110a and the lower surface of the laminated substrate 300, and / or one or more layers of magnetic material arranged between the fourth transformer winding 210b and an upper surface of the laminated substrate 300 opposite the lower surface, and / or a second magnetic core 404 comprising at least one of the following: one or more layers of magnetic material,which are arranged between the second transformer winding 110b and the third transformer winding 210a, one or more layers of magnetic material arranged between the third transformer winding 210a and the lower surface of the laminated substrate 300, and / or one or more layers of magnetic material arranged between the second transformer winding 110b and the upper surface of the laminated substrate 300.

[0054] According to a fifteenth example based on one of the preceding examples, the first circuit 100 can be set up to operate in a first voltage range, and the second circuit 200 is set up to operate in a second voltage range that differs from the first voltage range.

[0055] According to a sixteenth example, an electrical device comprises the integrated wireless power transfer device according to one of the preceding examples, a first circuit arrangement 502 comprising a first circuit element 602, wherein the first circuit arrangement 502 is electrically coupled to one or more of the plurality of first contact pads 310, a second circuit arrangement 602 comprising a second circuit element 604, wherein the second circuit arrangement 602 is electrically coupled to one or more of the plurality of second contact pads 312, wherein the first circuit arrangement 502 is galvanically isolated from the second circuit arrangement 602, and the integrated wireless power transfer device is configured to transfer power from the first circuit arrangement 502 to the second circuit arrangement 602 to power the second circuit element 604.

[0056] According to a seventeenth example based on the sixteenth example, the first circuit arrangement 502 may include a second laminated substrate, and the second circuit arrangement 504 may include a third laminated substrate that is separate and different from the second laminated substrate.

[0057] According to an eighteenth example based on the seventeenth example, the integrated wireless power transmission device can be mechanically and electrically coupled to one or more contact elements provided on a surface of the second laminated substrate, and the integrated wireless power transmission device can be mechanically and electrically coupled to one or more contact elements provided on a surface of the third laminated substrate.

[0058] According to a nineteenth example based on the eighteenth examples, one or more contact pads of the plurality of first contact pads 310 can be mechanically and electrically coupled to one or more of the contact elements provided on the surface of the second laminated substrate, and one or more contact pads of the plurality of second contact pads 312 can be mechanically and electrically coupled to one or more of the contact elements provided on the surface of the third laminated substrate.

[0059] According to a twentieth example based on the eighteenth or nineteenth example, the integrated wireless power transmission device can be mechanically coupled to one or more contact elements provided on a surface of the second laminated substrate by means of an adhesive bond, a soldered connection, a welded connection or a clamped connection, and the integrated wireless power transmission device can be mechanically coupled to one or more contact elements provided on a surface of the third laminated substrate by means of an adhesive bond, a soldered connection, a welded connection or a clamped connection.

[0060] According to a twenty-first example based on the sixteenth example, the first circuit arrangement 502 can be arranged on and / or integrated into a first section of a fourth laminated substrate, and the second circuit arrangement 504 can be arranged on and / or integrated into a second section of the fourth laminated substrate.

[0061] According to a twenty-second example based on the twenty-first example, the integrated wireless power transmission device can be mechanically and electrically coupled to one or more contact elements provided on a surface of the fourth laminated substrate.

[0062] According to a twenty-third example based on the twenty-second example, one or more contact pads of the plurality of first contact pads 310 can be mechanically and electrically coupled to one or more first contact elements of the contact elements provided on the surface of the fourth laminated substrate, and one or more contact pads of the plurality of second contact pads 311 can be mechanically and electrically coupled to one or more second contact elements of the contact elements provided on the surface of the fourth laminated substrate.

[0063] According to a twenty-fourth example based on the twenty-second or the twenty-third example, the integrated wireless power transmission device can be mechanically coupled to one or more first contact elements provided on a surface of the fourth laminated substrate by means of an adhesive bond, a soldered connection, a welded connection or a clamped connection, and the integrated wireless power transmission device can be mechanically coupled to one or more second contact elements provided on a surface of the fourth laminated substrate by means of an adhesive bond, a soldered connection, a welded connection or a clamped connection.

[0064] According to a twenty-fifth example based on any of the sixteenth to twenty-fourth examples, the first circuit element 602 may be or comprise a controller, and the second circuit element 604 may be or comprise a controllable transistor device.

Claims

[1] Integrated wireless power transmission device comprising: a laminated substrate (300) comprising a plurality of layers; a first circuit (100) comprising a first transformer winding (110a) and a second transformer winding (110b) connected in series between a first input node (IN1) and a second input node (IN2); a second circuit (200) which is galvanically isolated from the first circuit (100) and comprises a third transformer winding (210a) and a fourth transformer winding (210b) which are connected in series between a first output node (OUT1) and a second output node (OUT2); and a plurality of first contact pads (310) and a plurality of second contact pads (312) formed on a lower surface of the laminated substrate (300), wherein the first transformer winding (110a) is formed on a first layer of the laminated substrate (300), the third transformer winding (210a) is formed laterally spaced from the first transformer winding (110a) on the first layer of the laminated substrate (300), the fourth transformer winding (210b) is formed vertically above the first transformer winding (110a) on a second layer of the laminated substrate (300), the second transformer winding (110b) is formed vertically above the third transformer winding (210a) on the second layer of the laminated substrate (300), the first contact pads (310) of the majority of first contact pads (310) are electrically coupled to the first circuit (100), and the second contact pads (312) of the majority of second contact pads (312) are electrically coupled to the second circuit (200). [2] Integrated wireless power transmission device according to claim 1, wherein the first circuit (100) is configured to wirelessly transmit power to the second circuit (200) and / or to wirelessly receive power from the second circuit (200). [3] Integrated wireless power transmission device according to claim 2, wherein the first circuit (100) further comprises a first control component (114) which is arranged on or integrated into the laminated substrate (300), and the second circuit (200) further comprises a second control component (214) which is arranged on or integrated into the laminated substrate (300), wherein the first control component (114) and the second control component (214) are set up to control the power transfer between the first circuit (100) and the second circuit (200). [4] Integrated wireless power transmission device according to any one of claims 1 to 3, wherein the first contact pads (310) of the majority of first contact pads (310) are arranged laterally spaced apart from each other along a lateral side of the laminated substrate (300), and the second contact pads (312) of the majority of second contact pads (312) are arranged laterally spaced apart from each other along the same or along a different lateral side of the laminated substrate (300) as the majority of first contact pads (310). [5] Integrated wireless power transmission device according to claim 4, wherein the laminated substrate (300) comprises a first lateral side and a second lateral side opposite the first lateral side, and wherein the first transformer winding (110a) and the fourth transformer winding (210b) are arranged closer to the first lateral side of the laminated substrate (300) than to the second lateral side; and the third transformer winding (210a) and the second transformer winding (110b) are located closer to the second lateral side of the laminated substrate (300) than to the first lateral side. [6] Integrated wireless power transmission device according to claim 4 or 5, further comprising a molding compound (400) covering an upper surface of the laminated substrate (300) opposite the lower surface. [7] Integrated wireless power transmission device according to any one of claims 4 to 6, wherein at least a third layer of the laminated substrate (300) is arranged between the second layer with the second and fourth transformer windings (110b, 210b) formed thereon and an upper surface of the laminated substrate (300) opposite the lower surface; the second control component (214) is arranged on the upper surface of the laminated substrate (300); and the first control component (114) is arranged on the upper surface of the laminated substrate (300). [8] Integrated wireless power transmission device according to claim 7, wherein the laminated substrate (300) comprises a first lateral side and a second lateral side opposite the first lateral side, and wherein the second control component (214) is located closer to the first lateral side of the laminated substrate (300) than to the second lateral side; and the first control component (114) is located closer to the second lateral side of the laminated substrate (300) than to the first lateral side. [9] Integrated wireless power transmission device according to claim 8, wherein the second control component (214) is arranged at least partially vertically above the fourth transformer winding (210b), and / or the first control component (114) is arranged at least partially vertically above the second transformer winding (110b). [10] Integrated wireless power transmission device according to claim 7, wherein the first control component (114) is located closer to the first lateral side of the laminated substrate (300) than to the second lateral side; and the second control component (214) is located closer to the second lateral side of the laminated substrate (300) than to the first lateral side. [11] Integrated wireless power transmission device according to claim 10, wherein the first control component (114) is spaced laterally from the fourth transformer winding (210b) such that a lateral distance (d1) between the first control component (114) and the fourth transformer winding (210b) is greater than zero; and / or the second control component (214) is spaced laterally from the second transformer winding (110b) such that a lateral distance (d2) between the second control component (214) and the second transformer winding (110b) is greater than zero. [12] Integrated wireless power transmission device according to any of the preceding claims, wherein the first transformer winding (110a) is wound clockwise and the second transformer winding (110b) is wound counterclockwise, or the first transformer winding (110a) is wound counterclockwise and the second transformer winding (110b) is wound clockwise, and the third transformer winding (210a) is wound clockwise and the fourth transformer winding (210b) is wound counterclockwise, or the third transformer winding (210a) is wound counterclockwise and the fourth transformer winding (210b) is wound clockwise. [13] Integrated wireless power transmission device according to any of the preceding claims, further comprising a first magnetic core (402) comprising one or more layers of magnetic material extending vertically through the laminated substrate (300) and through a central region of the fourth transformer winding (210b) and a central region of the first transformer winding (110a), and / or a second magnetic core (404) comprising one or more layers of magnetic material and extending vertically through the laminated substrate (300) and through a central area of ​​the second transformer winding (110b) and a central area of ​​the third transformer winding (210a). [14] Integrated wireless power transmission device according to any of the preceding claims, further comprising a first magnetic core (402) comprising at least one of the following: one or more layers of magnetic material arranged between the fourth transformer winding (210b) and the first transformer winding (110a), one or more layers of magnetic material arranged between the first transformer winding (110a) and the lower surface of the laminated substrate (300), and / or one or more layers of magnetic material arranged between the fourth transformer winding (210b) and an upper surface of the laminated substrate (300) opposite the lower surface, and / or a second magnetic core (404) comprising at least one of the following: one or more layers of magnetic material arranged between the second transformer winding (110b) and the third transformer winding (210a), one or more layers of magnetic material arranged between the third transformer winding (210a) and the lower surface of the laminated substrate (300), and / or one or more layers of magnetic material arranged between the second transformer winding (110b) and the upper surface of the laminated substrate (300). [15] Integrated wireless power transmission device according to one of the preceding claims, wherein the first circuit (100) is configured to operate in a first voltage range and the second circuit (200) is configured to operate in a second voltage range which differs from the first voltage range. [16] Electrical device comprising: the integrated wireless power transmission device according to any one of claims 1 to 15; a first circuit arrangement (502) comprising a first circuit element (602), wherein the first circuit arrangement (502) is electrically coupled to one or more of the plurality of first contact pads (310); a second circuit arrangement (602) comprising a second circuit element (604), wherein the second circuit arrangement (602) is electrically coupled to one or more of the plurality of second contact pads (312), wherein the first circuit arrangement (502) is galvanically isolated from the second circuit arrangement (602), and The integrated wireless power transfer device is configured to transfer power from the first circuit arrangement (502) to the second circuit arrangement (602) to operate the second circuit element (604). [17] Electrical device according to claim 16, wherein the first circuit arrangement (502) comprises a second laminated substrate, and the second circuit arrangement (504) comprises a third laminated substrate which is separate from and distinct from the second laminated substrate. [18] Electrical device according to claim 17, wherein the integrated wireless power transmission device is mechanically and electrically coupled to one or more contact elements provided on a surface of the second laminated substrate; and The integrated wireless power transmission device is mechanically and electrically coupled to one or more contact elements provided on a surface of the third laminated substrate. [19] Electrical device according to claim 18, wherein one or more contact pads of the plurality of first contact pads (310) are mechanically and electrically coupled to one or more of the contact elements provided on the surface of the second laminated substrate, and one or more contact pads of the plurality of second contact pads (312) are mechanically and electrically coupled to one or more of the contact elements provided on the surface of the third laminated substrate. [20] Electrical device according to claim 18 or 19, wherein the integrated wireless power transmission device is mechanically coupled to one or more contact elements provided on a surface of the second laminated substrate by means of an adhesive bond, a soldered connection, a welded connection or a clamped connection; and The integrated wireless power transmission device is mechanically coupled to one or more contact elements provided on a surface of the third laminated substrate by means of an adhesive bond, a soldered bond, a welded bond or a clamped bond. [21] Electrical device according to claim 16, wherein the first circuit arrangement (502) is arranged on and / or integrated into a first section of a fourth laminated substrate, and the second circuit arrangement (504) is arranged on and / or integrated into a second section of the fourth laminated substrate. [22] Electrical device according to claim 21, wherein the integrated wireless power transmission device is mechanically and electrically coupled to one or more contact elements provided on a surface of the fourth laminated substrate. [23] Electrical device according to claim 22, wherein one or more contact pads of the plurality of first contact pads (310) are mechanically and electrically coupled to one or more first contact elements of the contact elements provided on the surface of the fourth laminated substrate, and one or more contact pads of the plurality of second contact pads (311) are mechanically and electrically coupled to one or more second contact elements of the contact elements provided on the surface of the fourth laminated substrate. [24] Electrical device according to claim 22 or 23, wherein the integrated wireless power transmission device is mechanically coupled to one or more first contact elements provided on a surface of the fourth laminated substrate by means of an adhesive bond, a soldered connection, a welded connection or a clamped connection; and The integrated wireless power transmission device is mechanically coupled to one or more second contact elements provided on a surface of the fourth laminated substrate by means of an adhesive bond, a soldered bond, a welded bond or a clamped bond. [25] Electrical device according to any one of claims 16 to 24, wherein the first circuit element (602) is or comprises a control, and the second circuit element (604) is or comprises a controllable transistor device.

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