Method for producing a semiconductor device and micromirror arrangement

Abstract

The invention relates to a method for producing a semiconductor component, in particular with microstructures. First, a semiconductor chip (99) is produced with four side surfaces (104a, 104b, 104c, 104d) of the semiconductor chip (99) arranged perpendicular to a main extension plane of the semiconductor chip (99). The semiconductor chip (99) has an outer frame structure (105) that surrounds two adjacent ones of the four side surfaces (104a, 104b, 104c, 104d) of the semiconductor chip (99). The semiconductor chip (99) is connected to the outer frame structure (105) by means of at least three first springs (102a, 102b, 102c). Furthermore, the semiconductor chip (99) is moved to a next process step by means of a tool that engages the outer frame structure (105) of the semiconductor chip (99). Furthermore, the outer frame structure (105) and the three first springs (102a, 102b, 102c) are removed from the semiconductor chip (99).

Description

The invention relates to a method for producing a semiconductor component. The invention further relates to a micromirror arrangement.Prior ArtFrom document DE 102 46 053 A1 a method for separating a substrate wafer into a number of substrate chips is described. In this case, the substrate wafer is firstly temporarily connected to a carrier wafer and the substrate chips are subsequently singulated. A narrow pedestal is provided between the substrate chip and the carrier wafer. The narrow pedestal serves to hold the chips in a defined position until they are finally separated, wherein no great forces are necessary for later separating the separated chips.Proceeding from this, it is an object of the present invention to develop a method for producing a semiconductor component having a stable and at the same time easily detachable connection between semiconductor chip and handling frame.Disclosure of the InventionTo achieve the object, a method for manufacturing a semiconductor device according to claim 1 is proposed. A micromirror arrangement according to Claim 15 is also proposed.In the method for producing a semiconductor component, in particular having microstructures, firstly a semiconductor chip having four side faces of the semiconductor chip arranged perpendicular to a main extension plane of the semiconductor chip is produced. The produced semiconductor chip further comprises an outer frame structure surrounding two adjacent ones of the four side surfaces of the semiconductor chip. The outer frame structure is in particular L-shaped and therefore only partially surrounds the semiconductor chip. The produced semiconductor chip is connected to the outer frame structure by means of at least three first springs. Furthermore, the semiconductor chip is moved to a next process step by means of a tool engaging on the outer frame structure of the semiconductor chip. The gripping tool is in particular a vacuum gripper. Further, the outer frame structure and the three first springs are removed from the semiconductor chip. The connection of the semiconductor chip to the outer frame structure as a handling surface results in a detachable and yet stable connection. Preferably, the semiconductor chip is moved by means of the tool engaging the outer frame structure of the semiconductor chip as a result of a pick-and-place process.The at least three first springs are preferably designed as spiral tube springs, in particular as spiral Bourdon tubes. This results in a pneumatically detachable mechanical connection between the semiconductor chip and the outer frame structure.The semiconductor chip with the outer frame structure and the at least three first springs is preferably patterned out of a wafer, in particular by means of an etching process. Preferably, a MEMS production process is used for this purpose. Preferably, the wafer is a silicon wafer. Preferably, a plurality of semiconductor chips are produced from the wafer. Preferably, at least four further second springs, in particular helical tube springs, are structured out of the, in particular revolving, wafer in such a way that the semiconductor chip is connected to the outer frame structure and the three first springs by means of the four second springs to the wafer in a respective third position, in particular fastening position, of the second springs. Preferably, two of the second springs connect two, in particular free, side faces of the semiconductor chip and the two further second springs connect the two side faces of the outer frame structure to the wafer. Two of the second springs therefore each engage on an, in particular free, side face of the semiconductor chip and the two further second springs engage on the outer frame structure. Subsequently, the tool, in particular the vacuum gripper, engages the outer frame structure for moving the semiconductor chip to the next process step and the semiconductor chip is separated from the wafer with the outer frame structure in a fourth position, in particular a separation position, of the four second springs, respectively.Preferably, in a further method step, the semiconductor chip is treated in such a way that its outer side, in particular surface, is formed to be sensitive to mechanical loading. Furthermore, a coating, in particular a light-reflecting coating, is applied to the outer side of the semiconductor chip, which is formed to be sensitive to mechanical loading. The outer frame structure projects upwards in this connection, so that the sensitive outer side formed is not damaged when the tool is engaged.Preferably, the outer frame structure is connected to the semiconductor chip only by means of the at least three first springs. Additional means for securing the outer frame to the semiconductor chip are accordingly not necessary.Preferably, the at least three first springs are structured out of the wafer such that a fixed end of each of the three first springs is connected to the outer frame structure. The fixed end of the first springs is accordingly located on the outer frame structure and does not require any space on the sensitive surface of the semiconductor chip.Preferably, at least in a first position, in particular a fastening position, of the three first springs, a free end of each of the three first springs is arranged in a respective first cutout of the semiconductor chip assigned to the respective first spring. This means that recesses are provided for the free ends of the first springs in the semiconductor chip, in which recesses the springs are fastened in the respective first position. The recesses are preferably arranged in a plane which is different from the sensitive surface of the semiconductor chip. The free ends of the three first springs are preferably structured out of the wafer in such a way that they have a structure at the free end which, in cooperation with the respective assigned first cutout, serve for connection, in particular coupling, to the semiconductor chip. In particular, the structure of the free ends of the first springs is a hook-shaped structure. Preferably, the first recesses for coupling to the respective free end also have a hook-shaped structure at the end. In contrast, the outer frame structure and the three springs are preferably separated from the semiconductor chip in a second position, in particular a separating position, of the three springs. Here, the first springs are arranged in the second position in a second recess of the outer frame structure assigned to the respective spring. The first spring correspondingly moves from the first position in the first recess to the second position in the second recess and in the second position are arranged only on the outer frame structure. Thus, separating the outer frame can be performed without damaging the sensitive surface of the semiconductor chip. The first springs are preferably structured out of the wafer in such a way that in each case two first springs, which are arranged on a same side face of the semiconductor chip, have mutually oppositely directed turns of the spirals of the springs. Thus, a firm connection of the outer frame to the semiconductor chip is made possible.Preferably, the pressure within the first and / or second springs, in particular the spiral tube springs, is controlled via an air inlet at the fixed end of the respective first or second springs in such a way that in the first position of the first springs and / or the third position of the second springs, the ambient air pressure corresponds to the air pressure within the spiral tube springs. Further, the pressure is controlled such that in the second position of the first springs and / or the fourth position of the second spring, the air pressure within the spiral tube springs is less than the ambient air pressure. This results in a pneumatic control possibility for the different positions of the springs. Preferably, the semiconductor chip and the encircling frame are structured out of the wafer in such a way that the air inlets for the first springs are arranged on a first side of the wafer, in particular an upper side of the outer frame structure, and the air inlets for the second springs are arranged on a second side of the wafer opposite the first side of the wafer, in particular a lower side of the wafer. The tool, in particular the vacuum gripper, in this connection controls the pressure within the first springs when gripping the outer frame structure. In particular, the tool generates a negative pressure within the first springs during gripping. Thus, the tool can perform two functions equally.Preferably, the semiconductor chip is moved to a substrate by means of the tool and subsequently connected to the substrate. Temporally after the removal of the generated outer frame structure and the three first springs from the semiconductor chip, a further semiconductor chip is arranged on the substrate by means of the tool. In particular, the further semiconductor chip is arranged by means of the tool directly next to the semiconductor chip. The further semiconductor chip is in particular the same semiconductor chip. The two semiconductor chips are correspondingly embodied in particular in the same way.The present invention further relates to a micromirror arrangement which has been produced by means of the method described above. This arrangement has a number of individual mirror elements which can be actuated independently of one another and are arranged as a field, in particular an array, and can each be moved via an actuator system, in particular actuator electrodes. The individual mirror elements each have a reflection surface.DESCRIPTION OF THE DRAWINGSFIG. 1 shows a method for producing a semiconductor component in the form of a flow diagram.FIGS. 2a to 2d schematically show the individual method steps for producing a semiconductor component. FIG. 3 ashows a first spring in a first position, in particular a fastening position. FIG. 3 bshows the first spring in a second position, in particular a disconnection position. FIG. 4 shows two first springs in a first position and opposing turns of the spirals.FIG. 1 shows, in the form of a flow diagram, a method for producing a semiconductor component, in particular having microstructures. In this case, in a method step 30, a semiconductor chip having four side faces of the semiconductor chip arranged perpendicular to a main extension plane of the semiconductor chip is produced. The produced semiconductor chip further comprises an outer frame structure surrounding two adjacent ones of the four side surfaces of the semiconductor chip. The outer frame structure is in particular L-shaped and therefore only partially surrounds the semiconductor chip. The produced semiconductor chip is connected to the outer frame structure by means of at least three first springs. Furthermore, in a method step 40, the semiconductor chips are moved to a next process step by means of a tool engaging on the outer frame structure of the semiconductor chip, in particular a vacuum gripper. In a subsequent method step 70, the outer frame structure and the three first springs are removed from the semiconductor chip.Optionally, in a method step 10, the semiconductor chip with the outer frame structure and the at least three first springs is patterned out of a wafer, in particular by means of an etching process.In an optional method step 20, at least four further second springs, in particular helical tube springs, are structured out of the, in particular revolving, wafer in such a way that the semiconductor chip is connected to the outer frame structure and the three first springs by means of the four second springs to the wafer in a respective third position, in particular fastening position, of the second springs. Two of the second springs connect two side surfaces of the semiconductor chip and the two further second springs connect the two side surfaces of the outer frame structure to the wafer. In a subsequent method step 50, the tool, in particular the vacuum gripper, engages the outer frame structure for moving the semiconductor chip to the next process step. The semiconductor chip with the outer frame structure is separated from the wafer in a fourth position, in particular a separation position, of the four second springs.Optionally, in a method step 60, the outer frame structure and the three springs are separated from the semiconductor chip in a second position, in particular a separation position, of the three springs. The three first springs are arranged in the second position in a second recess of the outer frame structure assigned to the respective spring.FIG. 2 ashows schematically in a section along the main extension plane of the semiconductor chip 99 the produced semiconductor chip 99 with four side surfaces 104 ato 104 darranged perpendicular to the main extension plane. The produced semiconductor chip 99 further comprises an outer frame structure 105 surrounding two adjacent ones of the four side surfaces 104 aand 104 dof the semiconductor chip 99. The outer frame structure 105 is formed in an L-shaped manner in this embodiment and only partially surrounds the semiconductor chip 99 therewith. The produced semiconductor chip 99 is connected to the outer frame structure 1055 by three first springs 102 ato 102 c. The three first springs 102 ato 102 care designed here as spiral tube springs, in particular as spiral Bourdon tubes. In this embodiment of the semiconductor component, the semiconductor chip 99 is divided into rectangular, adjacent subareas 103 aand 103 b. In FIG. 2 a, in a first position, in particular a fastening position, of the three first springs 102 ato 102 c, a free end 107 aof each of the three first springs 102 ato 102 cis arranged in a respective first cutout 108 aof the semiconductor chip 99 assigned to the respective first spring 102 ato 102 c. The outer frame structure is connected to the semiconductor chip 99 merely by means of the three first springs 102 ato 102 c.Furthermore, eight further second springs 100 ato 100 hare structured out of the revolving wafer 101 in such a way that the semiconductor chip 99 having the outer frame structure 105 and the three first springs 102 ato 102 cis connected to the wafer 101 by means of the eight second springs 100 ato 100 hin each case in a third position, in particular a fastening position, of the second springs 100 ato 100 h. The second springs 100 ato 100 hare also designed as spiral tube springs in this case. The wafer 101 is formed as a silicon wafer.FIG. 2 bshows the eight second springs 100 ato 100 hin each case in a fourth position, in particular a disconnection position. In this fourth position, the free ends 98 aof the second springs 100 ato 100 hare arranged in a third cutout 99 aof the wafer 101 assigned to the respective second spring 100 ato 100 h. Thus, in a method step 110, the semiconductor chip 99 connected to the outer frame structure 105 by means of the three first springs 102 ato 102 cmay be removed from the wafer 101, in particular vertically, and may be moved to a substrate 109 by means of a tool not shown here for the sake of simplicity.FIG. 2 cshows the semiconductor chip 99 connected to the substrate 109. the free ends 107 aof the three first springs 102 ato 102 care arranged in a second position, in particular a separation position, of the three springs in this embodiment. In this second position, the free end 107 ais arranged in a second recess 112 aof the outer frame structure 105 assigned to the respective first spring 102 ato 102 c, so that the outer frame structure can be separated from the semiconductor chip 99 in the method step 111 shown by means of the tool not shown here. In a further method step 115 in FIG. 2 d, further semiconductor chips 114 identical to the semiconductor chip 99 are arranged and fastened on the substrate 109 directly next to the semiconductor chip 99 by means of the tool and further outer frame structures 116 for engaging the tool. In this case, a micromirror arrangement 117 is thus produced having a number of individual mirror elements which can be actuated independently of one another and are arranged as an array. These individual mirror elements can each be moved via an actuator system, in particular actuator electrodes, which is not shown here, and each have a reflection surface.FIG. 3 ashows, by way of example, in a plan view, a spiral tube spring as a first spring 121 in a first position, in particular a fastening position, in which a free end 125 of the first spring 121 is arranged in a first recess 123 of the semiconductor chip 122 assigned to the first spring 121. The first spring 121 is structured out of the wafer in such a way that a fixed end 124 of the first spring 121 is connected to the outer frame structure 120. The free end 125 of the first spring 121 is structured out of the wafer in such a way that it has a hook-shaped structure at the free end 125, which structure, in cooperation with the associated first cutout 123, serves for connection, in particular coupling, to the semiconductor chip 122. For this purpose, the first cutout 123 likewise has a hook-shaped structure at the end 126. The pressure within the first spring 121 is controlled here via an air inlet, not shown here, at the fixed end 124 of the first spring 121 in such a way that, in the first position of the first spring 121, the ambient air pressure corresponds to the air pressure within the spiral tube spring as the first spring 121.In contrast, FIG. 3 bshows the first spring in a second position, in particular a disconnection position, in which the free end 125 is arranged in a second recess 128 of the outer frame structure 120. In this second position of the first spring 121, the outer frame structure 120 is separated from the semiconductor chip 122. The pressure within the first spring 121 is controlled via the air inlet at the fixed end 124 of the first spring 121 in such a way that, in the second position shown, the air pressure within the spiral tube spring as the first spring 121 is less than the ambient air pressure. The first spring 121 is accordingly moved pneumatically from the first to the second position and vice versa. For this purpose, the semiconductor chip 122 and the encircling frame 120 are structured, in particular, out of the wafer in such a way that the air inlet for the first spring 124 is arranged on a first side of the wafer, in particular an upper side of the outer frame structure, and the air inlets for the second spring, not illustrated here, are arranged on a second side of the wafer, in particular an underside of the wafer, which is opposite the first side of the wafer. The tool, in particular the vacuum gripper, not shown here, controls the pressure within the first spring 121 in particular when gripping the outer frame structure 120 or generates a negative pressure within the first spring 121 when gripping.FIG. 4 shows two first springs 132 and 133 in a first position for connecting the outer frame structure 130 to the semiconductor chip 131. Both first springs 132 and 133 are arranged on the same side surface of the semiconductor chip 131. In the first position, the free ends 138 and 139 of the first springs 132 and 133 are arranged in the first recess 136 and 137 of the semiconductor chip 131 assigned to the respective first spring 132 and 133. In the embodiment shown, the first springs 132 and 133 are structured out of the wafer in such a way that the two first springs 132 and 133 have mutually opposite turns of the spirals of the spiral tube springs as first springs 132 and 133. Thus, a firm connection of the outer frame 130 to the semiconductor chip 131 is enabled.References included in the specificationThis list of documents cited by the applicant has been produced in an automated manner and is only included for the better information of the reader. The list is not part of the German patent application or utility model application. The DPMA does not take any adhesion for any faults or omissions.Patent Literature citedDE 102 46 053 A1

[0002]

Claims

Method for producing a semiconductor component, in particular having microstructures, the method having the following method steps: - producing (30) a semiconductor chip (99, 114, 122, 131) having four side faces (104a, 104b, 104c, 104d) of the semiconductor chip (99, 114, 122, 131) arranged perpendicular to a main plane of extent of the semiconductor chip (99, 114, 122, 131), and having an outer frame structure (105, 116, 120, 130), in particular an L-shaped outer frame structure, of the semiconductor chip (99, 114, 122, 131), which outer frame structure surrounds two adjacent ones of the four side faces (104a, 104b, 104c, 104d) and is connected to the semiconductor chip (99, 114, 122, 131) by means of at least three first springs (102a, 102b, 102c, 121, 132, 133), 131), and - moving (40) the semiconductor chip (99, 114, 122, 131) to a next process step by means of a tool engaging the outer frame structure (105, 116, 120, 130) of the semiconductor chip (99, 114, 122, 131), in particular a vacuum gripper, and - removing (70, 111) the outer frame structure (105, 116, 120, 130) and the three first springs (102a, 102b, 102c, 121, 132, 133) from the semiconductor chip (99, 114, 122, 131).Method according to Claim 1, characterized in that the at least three first springs (102a, 102b, 102c, 121, 132, 133) are designed as helical tube springs, in particular as helical Bourdon tubes.Method according to one of Claims 1 or 2, characterized in that the semiconductor chip (99, 114, 122, 131) with the outer frame structure (105, 116, 120, 130) and the at least three first springs (102a, 102b, 102c, 121, 132, 133) is patterned out of a wafer (101), in particular by means of an etching process.Method according to Claim 3, characterized in that the wafer (101) is designed as a silicon wafer.Method according to either of Claims 3 and 4, characterized in that at least four further second springs (100a, 100b, 100c, 100d, 100e, 100f, 100g, 100h), in particular helical tube springs, are structured out of the, in particular revolving, wafer (101) in such a way that the semiconductor chip (99, 114, 122, 131) is connected to the outer frame structure (105, 116, 120, 130) and to the three first springs (102a, 102b, 102c, 121, 132, 133) by means of the four second springs (100a, 100b, 100c, 100d, 100e, 100f, 100g, 100h) to the wafer (101) in a respective third position, in particular fastening position, of the second springs (100a, 100b, 100c, 100d, 100e, 100f, 100g, 100h).Method according to claim 5, characterized in that two of the second springs (100a, 100b, 100c, 100d, 100e, 100f, 100g, 100h) connect two side surfaces (104a, 104b, 104c, 104d) of the semiconductor chip (99, 114, 122, 131) and the two further second springs (100a, 100b, 100c, 100d, 100e, 100f, 100g, 100h) connect the two side surfaces (104a, 104b, 104c, 104d) of the outer frame structure (105, 116, 120, 130) to the wafer (101), wherein subsequently the tool, in particular the vacuum gripper, engages the outer frame structure (105, 116, 120, 130) for moving the semiconductor chip (99, 114, 122, 131) to the next process step and the semiconductor chip (99, 114, 122, 131), 131) having the outer frame structure (105, 116, 120, 130) in a fourth position, in particular a disconnection position, of the four second springs (100a, 100b, 100c, 100d, 100e, 100f, 100g, 100h) is disconnected from the wafer (101).Method according to one of claims 1 to 6, characterized in that the outer frame structure (105, 116, 120, 130) is connected to the semiconductor chip (99, 114, 122, 131) only by means of the at least three first springs (102a, 102b, 102c, 121, 132, 133).Method according to one of Claims 1 to 7, characterized in that the at least three first springs (102a, 102b, 102c, 121, 132, 133) are structured out of the wafer (101) in such a way that a fixed end (124) of each of the three first springs (102a, 102b, 102c, 121, 132, 133) is connected to the outer frame structure (105, 116, 120, 130) in each case.Method according to one of Claims 1 to 8, characterized in that, at least in a first position, in particular a fastening position, of the three first springs (102a, 102b, 102c, 121, 132, 133), a free end (107a, 125, 138, 139) of each of the three first springs (102a, 102b, 102c, 121, 132, 133) is arranged in a respective first cutout (108a, 126, 136, 137) of the semiconductor chip (99, 114, 122, 131) assigned to the respective first spring (102a, 102b, 102c, 121, 132, 133).Method according to claim 9, characterised in that the free ends (102a, 102b, 102c, 121, 132, 133) of the three first springs (102a, 102b, 102c, 121, 132, 133) are structured out of the wafer (101) in such a way that they have a structure, in particular a hook-shaped structure, at the free end (107a, 125, 138, 139), which structure, in cooperation with the respective associated first recess (108a, 126, 136, 137), serve for connection, in particular coupling, to the semiconductor chip (99, 114, 122, 131).Method according to one of Claims 1 to 10, characterized in that the outer frame structure (105, 116, 120, 130) and the three first springs (102a, 102b, 102c, 121, 132, 133) are separated from the semiconductor chip (99, 114, 122, 131) in a second position, in particular a separating position, of the three first springs (102a, 102b, 102c, 121, 132, 133), wherein the three first springs (102a, 102b, 102c, 121, 132, 133) are arranged in a second recess (112a, 128) of the outer frame structure (105, 116, 120, 130) assigned to the respective first spring (102a, 102b, 102c, 121, 132, 133).Method according to one of claims 1 to 11, characterised in that the pressure within the first (102a, 102b, 102c, 121, 132, 133) and / or second springs (100a, 100b, 100c, 100d, 100e, 100f, 100g, 100h), in particular the spiral tube springs, is controlled via an air inlet at the fixed end (124) of the respective first (102a, 102b, 102c, 121, 132, 133) or second springs (100a, 100b, 100c, 100d, 100e, 100f, 100g, 100h) in such a way that in the first position of the first springs (102a, 102b, 102c, 121, 132, 133) and / or the third position of the second springs (100a, 100b, 100c, 100d, 100e, 100f, 100g, 100h) the ambient air pressure corresponds to the air pressure inside the helical springs, and in the second position of the first springs (102a, 102b, 102c, 121, 132, 133) and / or the fourth position of the second spring (100a, 100b, 100c, 100d, 100e, 100f, 100g, 100h) the air pressure inside the helical springs is less than the ambient air pressure.Method according to claim 12, characterised in that the semiconductor chip (99, 114, 122, 131) and the outer frame structure (105, 116, 120, 130) are structured out of the wafer (101) in such a way that the air inlets for the first springs (102a, 102b, 102c, 121, 132, 133) are arranged on a first side of the wafer (101), in particular an upper side of the outer frame structure (105, 116, 120, 130), and the air inlets for the second springs (100a, 100b, 100c, 100d, 100e, 100f, 100g, 100h) are arranged on a second side of the wafer (101) opposite the first side of the wafer (101), in particular an underside of the wafer (101), and the tool, in particular the vacuum grippers, is arranged when gripping the outer frame structure (105, 116, 120, 130) controls the pressure within the first springs ( 102 a, 102 b, 102 c, 121, 132, 133), in particular generates a negative pressure within the first springs ( 102 a, 102 b, 102 c, 121, 132, 133).Method according to one of Claims 1 to 13, characterized in that the semiconductor chip (99, 114, 122, 131) is moved by means of the tool to a substrate (109) and is subsequently connected to the substrate (109), and, temporally after the removal (70, 111) of the outer frame structure (105, 116, 120, 130) produced and of the three first springs (102a, 102b, 102c, 121, 132, 133) from the semiconductor chip (99, 114, 122, 131), a further semiconductor chip (99, 114, 122, 131), which is in particular the same as the semiconductor chip (99, 114, 122, 131), is arranged by means of the tool on the substrate (109).Micromirror arrangement (117), produced by means of a method according to one of Claims 1 to 14, having a number of individual mirror elements which can be actuated independently of one another and are arranged as a field, in particular an array, and can each be moved via an actuator system, in particular actuator electrodes, and the individual mirror elements each have a reflection surface.

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