Method for manufacturing an assembly with cooling structure arrangement and assembly

Abstract

The invention relates to a method for manufacturing an assembly 1, wherein the assembly 1 has a component arrangement 2 with at least one component 3, a cooling structure arrangement 8, a plastic housing 5 and a cover arrangement 10, wherein the cooling structure arrangement 8 is applied to the component arrangement 2 in a primary forming manner in order to form a subassembly, wherein the plastic housing 5 with an open fluid space 11 is applied to the subassembly in a primary forming manner, wherein the cooling structure arrangement 8 is arranged in the fluid space 11, wherein the open fluid space 11 is closed with the cover arrangement 10.

Description

State of the art

[0001] Electronic components generate heat during operation, which can impair their functionality. To cool electronic components in circuits, it is common practice to place coolers on the components and secure them, for example, with mechanical clamps, to ensure heat dissipation from the component.

[0002] Document DE 10 2021 209 482 A1 takes a different approach. This discloses an electronic module with at least one power semiconductor that is electrically connected to a contacting arrangement, and with at least one cooling element for at least indirectly cooling the at least one power semiconductor, wherein the at least one cooling element is designed as a cooling element produced in an additive manufacturing process, and that the at least one cooling element is arranged between the at least one power semiconductor and the contacting arrangement and electrically connects the at least one power semiconductor to the contacting arrangement. Disclosure of the invention

[0003] The subject matter of the invention is a method for manufacturing an assembly with a cooling structure arrangement having the features of claim 1. A further subject matter of the invention relates to an assembly having the features of claim 9. Preferred or advantageous embodiments of the invention emerge from the subclaims, the following description and the attached figures.

[0004] The subject of the invention is therefore a method for manufacturing an assembly. The assembly, in its most general form, is any assembly, particularly an electrical and / or electronic assembly.

[0005] The assembly comprises a component arrangement, wherein the component arrangement comprises at least one component. The component is embodied, in particular, as an electronic and / or electrical component. In particular, the at least one component is embodied as a component that generates heat during operation. In particular, the heat is generated, for example, as waste heat through the conversion of electrical power in the component.

[0006] The assembly comprises a cooling structure arrangement, wherein the cooling structure arrangement is applied to a cooling side of the component assembly by primary forming. The cooling structure arrangement is thus not applied to the cooling side as a finished component, but rather is created from a formless starting mass on the component assembly. In particular, the primary forming application results in a material-to-material connection between the component assembly and the cooling structure arrangement.

[0007] Particularly preferably, the cooling structure arrangement is made of metal, so that the base material of the cooling structure arrangement, as a metallic base material, has very good thermal conductivity. In particular, the thermal conductivity of the metallic base material is lambda > 10 W / (m× K).

[0008] The component arrangement with the molded cooling structure arrangement forms a subassembly.

[0009] A plastic housing is applied to the subassembly by primary forming. The plastic housing is typically created from a formless starting material. In particular, the primary forming application results in a material-to-material and / or form-fitting connection between the subassembly and the plastic housing. In particular, the subassembly, specifically the component assembly, can be positively trapped in the plastic housing, making it impossible to remove without destructive means.

[0010] The plastic housing forms an open fluid chamber, with the cooling structure arrangement being arranged in the fluid chamber or at least extending into it. The fluid chamber is fluidically closed and / or sealed on one side by the component arrangement.

[0011] The assembly comprises a cover assembly, which is placed on the open fluid chamber and, in particular, seals it. The seal is preferably designed to form a fluid chamber, in particular a fluid channel, through which a cooling fluid can flow or through which it flows during operation. Optionally, the cover assembly comprises interfaces for coupling to a cooling circuit. In particular, the interfaces comprise a fluid inlet and a fluid outlet.

[0012] The process enables a highly flexible and production-friendly implementation of heat dissipation from the component assembly, particularly from the component itself. The primary forming of the cooling structure assembly allows it to be flexibly adapted to the current needs of the series or even the component of the component assembly. The primary forming of the plastic housing allows the subassembly to be reliably accommodated, particularly in a sealed manner, so that the cooling structure assembly is accessible to the cooling fluid in the fluid chamber, which is initially open and subsequently closed with the cover assembly.

[0013] It is preferred that the plastic housing accommodates the component arrangement in a sealing manner. This ensures that the fluid space is sealed in the direction of the component arrangement. In particular, the component arrangement has a cooling side or wet side, which are in contact with the cooling fluid during operation on the side of the cooling structure arrangement. The other side of the component arrangement is preferably designed as a dry side, which can be additionally cooled, in particular by convection, for example via ambient air. In particular, the at least one component is arranged on the dry side. Due to the sealing accommodation of the component arrangement, a separate seal can be dispensed with. In addition, this type of sealing is process-reliable and therefore suitable for production.On the one hand, the cooling structure arrangement applied during the molding process guarantees optimal heat dissipation, and on the other hand, the arrangement of the component on the dry side means that no insulation problems can occur with regard to the electrical insulation from the cooling fluid.

[0014] In a preferred implementation of the invention, the component arrangement comprises a circuit board, wherein the at least one component is mounted on the circuit board. In particular, a conductive coating or printing is applied to the dry side of the circuit board for contacting the at least one component. In a preferred embodiment, the circuit board is sealingly molded into the plastic housing. It is particularly preferred that the circuit board is circumferentially molded into a groove of the plastic housing, so that the circuit board forms a first sealing partner and the plastic housing forms a second sealing partner in order to seal the fluid space on the side of the component arrangement.

[0015] The circuit board preferably has a ceramic core, which provides particularly good thermal conductivity, so that the heat path between the at least one component via the circuit board to the cooling structure arrangement and thus into the fluid space has the lowest possible thermal conductivity. For example, the circuit board is designed as an AMB circuit board.

[0016] In a preferred implementation of the method, the plastic housing is applied by injection molding. In particular, a tool for injection molding is used, wherein the tool has a punch or a tool section that forms the fluid space during injection molding and simultaneously protects the cooling structure arrangement from the plastic so that it can be brought into contact with the cooling fluid in the fluid space. In particular, the subassembly is overmolded to form the plastic housing.

[0017] In a preferred embodiment of the invention, the cooling structure arrangement is applied by an additive 3D printing process and / or by selective laser sintering and / or SLM. A powder, especially a metal powder, can be used as the starting material.

[0018] It is particularly preferred that the cover assembly be joined to the plastic housing with a material bond. This joining can be carried out in particular with a material bond, e.g., by ultrasonic welding, laser welding, gluing, etc. In this way, the fluid chamber can be reliably sealed.

[0019] The manufacturing processes commonly used to date offer the possibility of taking into account the usual expected behavior of the final joined assemblies (cooler and unit to be cooled), but have two key weaknesses: all of the turbulators commonly used to date only allow for a very limited geometry that enables turbulence in all three spatial dimensions. The primary orientation of the turbulence is restricted to two dimensions. They always have the same geometry and are tied to the semi-finished tools required for production. Since the cooler units are manufactured independently of the assemblies to be cooled, the cooler units are not individually tailored to the assemblies to be cooled and their production-related fluctuations. In addition, small series cannot usually be reproduced cost-effectively, since a cooler unit specially adapted to a small series is not feasible.However, these disadvantages are also overcome with the primary forming production of the cooling structure arrangement.

[0020] In particular, some or all of the following advantages can be achieved: The cooling structure arrangement can be individually adapted to each component arrangement to be cooled. The implementation enables turbulence to be generated in all three spatial dimensions. The implementation is capable of reacting to fluctuations in the upstream process (during the production of the cooling arrangement to be cooled) and optimally adapting the required cooling performance to these fluctuations. This allows for a broader specification in the upstream processes. The implementation can be used cost-effectively for both small and large series. The cooling performance significantly exceeds the current state of the art. Initial direct comparisons show a performance improvement of >20%. The costs are significantly lower compared to separately manufactured components.Both the effective costs for the cooler structure arrangement itself, as well as the costs for the pre-processes and the resulting error costs of the entire final assembly.

[0021] In a preferred embodiment of the invention, the component arrangement is designed to form a spatially resolved heat output distribution during operation, particularly during normal operation and / or controlled operation. In particular, a two-dimensional distribution of heat sources of the component arrangement is formed. In contrast, during operation, the cooling fluid forms a cooling output distribution in the fluid space, wherein the cooling output distribution is coordinated with the heat output distribution.

[0022] During tuning, it can be provided that an increase in the cooling power distribution, in particular a local maximum, is provided in a region of the component arrangement in which the at least one component is arranged. In contrast, a decrease, in particular a local minimum, of the cooling power distribution can be assigned in a region of the component arrangement in which the region is designed without components.

[0023] The cooling structure arrangement preferably has a height distribution. During the tuning, it can be provided that a greater height of the cooling structure arrangement, in particular a local maximum, is provided in a region of the component arrangement in which the at least one component is arranged. In contrast, in a region of the component arrangement in which the component region is freely formed, a reduction, in particular a local minimum, can be assigned to the cooling structure arrangement.

[0024] Particularly preferably, the cooling structure arrangement comprises a component-by-component variation of the cooling structures. In particular, the cooling structure arrangement comprises spaced-apart partial surfaces, each of which is individually and / or selectively assigned to a component. Thus, the cooling structure arrangement is applied only where it is needed for heat dissipation.

[0025] In a preferred embodiment of the invention, the cover arrangement has flow guiding regions, wherein the flow guiding regions extend into the fluid space. The flow structure in the fluid space is thus determined by an interaction between the cooling structure arrangement and the flow guiding regions of the cover arrangement. In particular, the flow guiding regions in the cover arrangement are irregularly distributed. Thus, it is possible to control the flow in the fluid space not only by the cooling structure arrangement, but also additionally by flow guiding regions of the cover arrangement. In particular, a function distribution takes place, wherein the heat dissipation, in particular by the component-resolved variation of the cooling structures, and the flow guidance of the cooling fluid is implemented through the flow guiding regions of the cover arrangement. In this way, the size of the cooling structure arrangement can be kept to a minimum and manufacturing costs can be saved.

[0026] In a preferred development of the invention, the component arrangement is measured in a preliminary step, in particular electrically characterized, in order to determine the heat output distribution during operation. This can be done by directly measuring the heat output distribution, e.g. using a thermal imaging camera, or alternatively it can be done indirectly by measuring the components and estimating the heat output distribution. On the basis of the heat output distribution, the cooling structure arrangement and, optionally, additionally, the cover arrangement with flow guidance regions are modeled with a matching cooling output distribution and subsequently applied or manufactured to the component arrangement by primary molding. Optionally, the cooling structure arrangement and, optionally, additionally, the cover arrangement are adapted to a design of a component arrangement so that all component arrangements of this design receive the same cooling structure arrangement and, optionally, additionally, the same cover arrangement.Alternatively, each component arrangement is individually adapted so that each component arrangement receives an individually modeled cooling structure arrangement and optionally an individually modeled cover arrangement.

[0027] Spatially resolved, adaptable structuring for performance-optimized cooling: The primary forming process, particularly 3D printing, only takes place after the electrical characterization of the component or component arrangement to be cooled. This makes it possible to adjust the required cooling performance with positional precision (e.g., chip-resolved) and thus maximize the cost-performance ratio. Furthermore, this approach enables a larger capture range or broader specification limits in the pre-process, as fluctuations in the pre-process can be better compensated for by optimized cooling structures. This enables reduced defect costs throughout the entire process chain. Fluctuations in the processing of the power semiconductors to be cooled can, for example, be in the range of up to + / -30% with regard to the so-called Rdson (conductance resistance in the "on" state of the semiconductor).Typical "part-to-part" variations within a power module in which several such power semiconductors are installed are therefore in the range of + / - 5%. This Rdson is a measure of the energy dissipation and thus of the required local cooling performance during operation. Similar fluctuations also exist for the other parameters of the power semiconductors. The cooling system outlined here is able to compensate for these production-related fluctuations in the pre-processes by locally adapting the cooler geometries to the previously performed module characterization. Conventional cooler systems, which are manufactured in advance independently of the individual module characterization, are not capable of this. For example, the geometry of the individual cooling structure (the unit cell, e.g. the pin) can be adapted, or the local density of the pins (spacing between the turbulence structures such as pins) can be varied.This allows the pressure drop to be adjusted locally. The pressure drop in the cooling system is also a key parameter for adjusting the cooling performance. Tuning the effective cross-section for the flow of the cooling medium is possible with this process.

[0028] In a preferred embodiment of the invention, the component is designed as a high-power switching element, in particular as a power semiconductor, for example, a MOSFET or IGBT. The assembly is preferably designed as an inverter and / or voltage converter assembly for an electric drive of an electric and / or hybrid vehicle.

[0029] A further object of the invention is formed by an assembly as described above.

[0030] In particular, a process is being developed to produce a cooling channel as a fluid chamber with integrated power modules as components. Potential advantages include: - Significant reduction of process steps and thus low process costs - Reduction of thermal stresses in the power module through the use of plastic material - Sealing against cooling medium in the injection molding process by overmolding the power modules - No use of additional tools such as lasers, soldering materials, etc. - Sustainable use of materials through needs-based use - Flexible design of the channel's internal structure through individually adapted cover

[0031] Further features, effects, and advantages of the invention will become apparent from the following description of a preferred embodiment of the invention and the accompanying figures. These show: Fig. 1 a schematic cross-sectional view of an assembly as an embodiment of the invention; Fig. 2 a schematic three-dimensional representation of an assembly as a further embodiment of the invention; Fig. 3 a schematic cross-sectional view of an assembly as a further embodiment of the invention; Fig. 4 shows the embodiment of the assembly of the preceding figures in a tool as an embodiment of a method according to the invention; Fig. 5 a flow chart describing the process of Fig. 4.

[0032] The Fig. 1 shows a schematic cross-sectional view of an assembly 1 as an exemplary embodiment of the invention. The assembly 1 is designed as an electrical and / or electronic assembly 1. In particular, the assembly 1 is designed as an inverter assembly and / or as a voltage converter assembly of power electronics for an electric drive of a vehicle, or as a charger converter, DC / DC converter, or other power electronics. In this embodiment, it is known that waste heat is generated during operation, which must be actively dissipated via a cooling fluid.

[0033] The assembly 1 comprises a component arrangement 2 with at least one component 3 and a circuit board 4, wherein the at least one component 3 is arranged on the circuit board 4. The component 3 is designed in particular as a high-performance switching element, such as a MOSFET, IGBT or the like for fast switching.

[0034] The circuit board 4 is designed as a ceramic printed circuit board having a ceramic core, wherein an electrically conductive and application-specifically structured contact layer, for example made of copper, is applied to the side of the circuit board facing the component 3. On the opposite side, a metallic coating, printing, or the like can be formed as a connecting layer, which can also be made of copper. The assembly 1 has a cooling structure arrangement 8, wherein the cooling structure arrangement 8 has a plurality of individual structures 9. The cooling structure arrangement 8 is applied in a primary forming manner to the component arrangement 2 and in particular to the connecting layer. For example, this can be applied using an additive 3D printing process or via selective laser sintering or selective laser melting (SLM).The cooling structure arrangement 8 and / or the cooling structures 9 are made of a metallic raw material, so that they have / have high thermal conductivity. The component arrangement 2 and the cooling structure arrangement 8 form a subassembly.

[0035] The assembly 1 has a plastic housing 5, wherein the subassembly, the component arrangement 2 and in particular the circuit board 4 are molded into the plastic housing 5. For this purpose, the plastic housing 5 has a circumferential groove 6, wherein the circuit board 4 is arranged in the groove 6. The plastic housing 5 forms a fluid chamber 11, wherein the fluid chamber 11 is closed off in a fluid-tight manner on the one hand by the component arrangement 2 and in particular by the circuit board 4. The fluid chamber 5 has circumferential walls 7, wherein the walls 7 are higher than the cooling structure arrangement 8 and / or the cooling structure arrangement 8 is arranged countersunk in the fluid chamber.

[0036] The fluid chamber 11 is formed in the plastic housing 5 as an open fluid chamber 11. The assembly 1 has a cover arrangement 10, wherein the cover arrangement 10 closes the open fluid chamber 11, wherein the cooling structure arrangement 8 and / or the cooling structures 9 is / are arranged in the fluid chamber 11. For example, the cover arrangement 10 is arranged in a sealing manner on the plastic housing 5 via a material-to-material connection, such as gluing or ultrasonic welding. The cover arrangement 10 can have interfaces in the form of a fluid inlet 13 and a fluid outlet 14, so that a cooling fluid can flow through the fluid chamber 11 as a cooling channel.

[0037] As from the Fig. 1, the fluid chamber 11 and thus the cooling fluid are arranged only on one cooling side 15 (in particular the wet side) of the component arrangement 2 and in particular of the circuit board 4. The other side of the component arrangement 2 and in particular of the circuit board 4 is designed as a dry side 16, which is insulated from the cooling fluid and / or is arranged in a particularly dry ambient atmosphere. In particular, the at least one component 3 is arranged on the dry side 16 of the component arrangement 2 and / or of the circuit board 4.

[0038] Because the cooling structure arrangement 8 is applied by primary shaping, it can be structured as desired. It is structured in a component-by-component manner, so that areas of the component arrangement 2 with components 3 that act as heat sources are cooled more effectively than areas of the component arrangement 2 on which no components are arranged. In particular, the cooling power distribution of the cooling structure arrangement 8 is adapted to the heat power distribution of the component arrangement 2. For example, the areal density of the structural elements 9 is higher in the area of ​​a component 3 than in a component-free area. The shape, in particular the height of the cooling structures 9, can also be individually adapted to the distribution of the components 3.

[0039] The Fig. Figure 2 shows a schematic, three-dimensional representation of an assembly 1, wherein the cover assembly 10 has not yet been joined. In the cover assembly 10, the fluid inlet 13 and the fluid outlet 14 are formed as through-openings. Flow guide regions 17 are arranged between the fluid inlet 13 and the fluid outlet 14, which in this embodiment are formed as simple, straight webs. In alternative designs, these can be implemented in a more complex and irregular manner. The flow guide regions 17 serve to control the fluid flow of the cooling fluid in the fluid chamber 11 and to direct it as required for the application.

[0040] As can be seen from the top view of the cooling side 15 of the component arrangement 2, the individual structures 9 of the cooling structure arrangement 8 are arranged in partial areas 18 a, b, c, d, e, f, g in such a way that they each correspond to a component 3 which is arranged on the dry side.

[0041] It is possible for the structural elements 9 to be designed as simple pins or columns, so that their distribution can control 2D turbulence in a plane parallel to the circuit board 4. Alternatively, it is possible for them to be designed as pins or columns with a thickness variation in the height direction and / or Z direction perpendicular to the circuit board 4. Variations in the XY plane can then be implemented through the distribution, and a variable density in the Z direction can be achieved. In particular, it is possible to control 3D turbulence. This corresponds to "complexity-for-free" since the shape and distribution of the structural elements 9 can be arbitrarily adjusted during the primary forming application within the scope of a production-oriented implementation.

[0042] The cooling performance of the cooling structure arrangement 8 is determined, among other things, by the design of the so-called turbulence geometry. While laminar flow of the coolant in the cooler leads to poor cooling performance, suitable turbulence can significantly influence the cooling performance. Turbulence occurs in all three spatial dimensions and is caused by the geometry of the cooling structure arrangement 8 in the respective dimension. The use of metallic 3D printing enables additional degrees of geometric freedom compared to the usual manufacturing processes for standard cooling systems without influencing the manufacturing costs (known under the keyword "complexity-for-free"). While conventional manufacturing processes only allow undercuts in the Z-axis under high demands, 3D printing makes it possible to create these without additional costs or process times.This consequently enables a cooler geometry that exhibits optimized turbulence in all three dimensions. The steepest thermal gradient is inherently expected in the Z-axis. Due to the "complexity-for-free" approach in 3D printing, the cooling structure arrangement 8 thus enables optimization of the cooling path in all three dimensions, including in particular the Z-direction, and thus along the steepest thermal gradient, something other processes can only achieve at significantly increased costs.

[0043] Use of the component assembly 2 to be cooled as an integral part of the cooling circuit to optimize cost per performance, volume, and weight: A conventional cooler assembly is replaced by the 3D-printed cooling structure assembly 8, which is individually optimized for the component assembly 2 to be cooled. This print is applied directly to the so-called power substrate as circuit board 4, so that this / this becomes an integral part of the cooler structure assembly 8, which in turn reduces the thermal path to the heat source embodied as component 3. This inherently improves the cooling performance by 20% compared to conventional cooling systems, and reduces volume and weight. Overall, the cost per performance can thus be improved.

[0044] Any (electronic) components 3 that require active cooling elements due to their high power density, such as power modules for use in electric vehicles, half and full bridges in other devices (e.g., power tools), or even processors, ASICs, or µCs with high power densities, can be used. The units to be cooled, as component assemblies 2, only require a metallic interface suitable for primary forming deposition, in particular for hybrid 3D printing. Primary forming deposition, in particular hybrid, metallic 3D printing, is already possible on sub-µm-thick metallizations of semiconductor chips or sub-µm-thick interconnect layers 7. The provision of such necessary metallization is therefore not a limiting factor.

[0045] Due to the selective allocation, the cooling structure arrangement 8 can be made very small, so that manufacturing costs can be saved.

[0046] This creates an optimized combination between the printed cooling structure arrangement 8 and a cooling channel of the cover arrangement 10 in order to reduce costs and increase performance. The cooling structure arrangement 10 is printed directly onto the substrate in the form of the circuit board 4 of the power electronics, in the form of the component arrangement 2, and is inserted into the plastic housing 5 with the fluid chamber 11 through which the cooling medium flows. In principle, the manufacturing costs would be very high because the process times for applying the cooling structure arrangement 10 are correspondingly long. However, in practice, it is often the case that the largest part of the cooling structure only serves the purpose of controlling the cooling medium in such a way that the areas in which heat is generated are well supplied with air. This means that the areas where the actual heat is generated are significantly smaller. Cooling structures are only applied where the heat is generated. Due to the hybrid structure, this meansFor the primary forming application to a substrate, the cooling paths are very small, resulting in very low heat spreads. To "fill" the remaining structures (for flow optimization), these are integrated into the cooling channel of the cover assembly 10 as flow guide regions 17. The cover assembly 10 can, for example, be made of a plastic in which structures are incorporated as flow guide regions 17 (. Fig. 2) are manufactured in the injection molding process.

[0047] The Fig. 3 shows a further embodiment of the assembly 1, wherein several components 3 are provided. In the illustrated embodiment, the components 3 are arranged on different component assemblies 2. Alternatively, they are positioned on a common circuit board 4. In this configuration, each component 3 can be assigned one of the partial surfaces 18a-g on structural elements 9 of the cooling structure arrangement 8. Furthermore, the fluid inlet 13 and the fluid outlet 14 can be seen on the assembly 1.

[0048] The Fig. 4 shows a schematic representation of a method for manufacturing the assembly 1. To manufacture the plastic housing 5, the subassembly, comprising the component arrangement 2 and the cooling structure arrangement 8, is placed in a tool 19. The tool 19 has a tool section 20, for example a punch, which recesses the fluid chamber 11 before plastic is injected. The plastic housing 5 is produced by injection molding and, during the molding process, is molded directly onto the component arrangement 2 and, in particular, onto the circuit board 4, so that the groove 6 is created, the plastic of the plastic housing 5 being in material contact with the circuit board 4, so that a fluid-tight seal of the fluid chamber 11 is created in the direction of the component arrangement 2 and / or in the direction of the component 3.

[0049] In the Fig.5 shows a flow chart for describing an embodiment of the method for manufacturing the assembly 1.

[0050] In a step 100, the cooling structure arrangement 8 is applied to the component arrangement 2 in a primary forming process in order to form the subassembly.

[0051] In a step 200, the plastic housing 5 is applied to the subassembly by primary molding, e.g. by injection molding, whereby the open fluid space 11 is formed and whereby the connection between the plastic housing 5 and the component arrangement 2 forms a seal for the fluid space 11.

[0052] In a step 300, the cover assembly 10 is applied to the plastic housing 5 so that the fluid chamber 11 is closed.

[0053] Optionally, in a preliminary step 40, the component arrangement 2 can be measured so that a heat output distribution during operation can be estimated. On the basis of the estimated heat output distribution during operation, in a step 80 the cooling structure arrangement 8 and / or the cover arrangement 10, in particular the cooling conducting regions 17, can be modeled such that a cooling output distribution resulting therefrom during operation is adapted to the estimated heat output distribution. In particular, the modeling is carried out such that the function of heat dissipation is assigned to the cooling structure arrangement 8 and the function of cooling fluid guidance is assigned to the cover arrangement 10, in particular the flow conducting regions 17. The modeled cooling structure arrangement 8 and / or the modeled cover arrangement 10 is used in the subsequent steps for the primary manufacturing of the cooling structure arrangement 8 and / or the cover arrangement 10. QUOTES CONTAINED IN THE DESCRIPTION

[0000] This list of documents submitted by the applicant was generated automatically and is included solely for the convenience of the reader. This list is not part of the German patent or utility model application. The DPMA assumes no liability for any errors or omissions. Cited patent literature

[0000] DE 10 2021 209 482 A1

[0002]

Claims

[1] Method for manufacturing an assembly (1), wherein the assembly (1) comprises a component arrangement (2) with at least one component (3), a cooling structure arrangement (8), a plastic housing (5) and a cover arrangement (10), wherein the cooling structure arrangement (8) is applied to the component arrangement (2) in a primary forming manner in order to form a subassembly, wherein the plastic housing (5) with an open fluid space (11) is applied or attached to the subassembly in a primary forming manner, wherein the cooling structure arrangement (8) is arranged in the fluid space (11), wherein the open fluid space (11) is closed with the cover arrangement (10). [2] Method according to claim 1, characterized by that the plastic housing (5) seals off the component arrangement (2). [3] Method according to claim 2, characterized bythat the component arrangement (2) has a circuit board (4), wherein the at least one component (3) is applied to the circuit board (4) and wherein the circuit board (4) is sealingly molded into the plastic housing (5). [4] Method according to one of the preceding claims, characterized by that the plastic housing (5) is applied by injection molding. [5] Method according to one of the preceding claims, characterized by that the cooling structure arrangement (8) is applied by an additive 3D printing process and / or selective laser sintering. [6] Method according to one of the preceding claims, characterized by that the cover arrangement (10) is applied to the plastic housing (5) in a material-to-material manner. [7] Method according to one of the preceding claims, characterized bythat the cover arrangement (10) has flow guiding regions (17), wherein the flow guiding regions (17) protrude into the fluid space (11) and / or project from the cover arrangement (10). [8] Method according to one of the preceding claims, characterized by that in a preliminary step the component arrangement (2) is measured to determine a heat output distribution and subsequently the shape of the cooling structure arrangement (8) and / or the flow guide regions (17) is determined on the basis of the heat output distribution. [9] Assembly (1) with a subassembly, wherein the subassembly has a component arrangement (2) with at least one component (3) and a cooling structure arrangement (8), wherein the cooling structure arrangement (8) is applied to the component arrangement (2) in a primary forming manner, with a plastic housing (5), wherein the plastic housing is mounted or attached to the subassembly in a primary manner, wherein the plastic housing (5) forms an open fluid space (11), wherein the cooling structure arrangement (8) is arranged in the fluid space (11), with a cover arrangement (10), wherein the cover arrangement (10) closes the fluid space (11). [10] Assembly (1) according to claim 9, characterized by that the at least one component (3) is designed as a high-performance switching element and / or the assembly is designed as an inverter assembly for an electric drive of a vehicle.

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