Method for operating an electromagnetic actuator, device for adjusting the spatial position and / or deformation of an element, computer program product, mechanical system, and lithography system

DE102024201528A1Inactive Publication Date: 2025-03-06CARL ZEISS SMT GMBH
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Patent Information

Application Number
DE102024201528
Authority / Receiving Office
DE · DE
Patent Type
Applications
Current Assignee / Owner
Filing Date
2024-02-20
Publication Date
2025-03-06
Estimated Expiration
Not applicable · inactive patent

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Abstract

The invention relates to a method for operating an electromagnetic actuator (3), wherein the actuator (3) is supplied both with a control signal (5) to exert a force and / or to achieve a deflection, and with a temperature control signal (6) decoupled from the control signal (5) for targeted heat generation.
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Description

[0001] The invention relates to a method for operating an electromagnetic actuator.

[0002] The invention further relates to a device for adjusting the spatial position and / or deformation of an element.

[0003] The invention also relates to a computer program product with program code means.

[0004] The invention further relates to a lithography system, in particular a projection exposure system for microlithography, comprising at least one optical element.

[0005] The use of Lorentz motors or Lorentz actuators in electromechanical components of EUV lithography systems is known from the prior art.

[0006] In this process, Lorentz actuators are used, in accordance with the state of the art, to generate forces required for positioning optical elements.

[0007] Due to the physical principles underlying the generation of force in Lorentz actuators, an electric current is required.

[0008] Electric current flows through electrical conductors, which in turn have an electrical resistance.

[0009] This results in power dissipation at the Lorentz actuators in the electromechanical devices known from the prior art in EUV lithography systems.

[0010] The heat dissipated through power dissipation is a parasitic effect that can lead to temperature-related, undesirable deformations of optical elements in close proximity to the Lorentz actuators.

[0011] German patent application DE 10 2015 211 474 A1 discloses an actuator device for an optical element for a lithography system, comprising a Lorentz actuator for providing a dynamic force and a reluctance actuator for providing a quasi-static force. The disclosed hybrid actuator exhibits low power consumption and a fast response time.

[0012] From DE 10 2015 217 119 A1 an electromagnetic drive is known with a stator, a stator holder and an actuating element movable by an electromagnetic interaction with the stator.

[0013] DE 10 2020 212 742 A1 discloses an adaptive optical element for microlithography with at least one manipulator for changing the shape of the optical surfaces of the optical element.

[0014] A disadvantage of the electromechanical devices known from the prior art in EUV lithography systems is that deformations of elements of lithography systems, in particular optical elements, can occur, which are caused by power dissipated as heat from actuators and which are difficult to correct.

[0015] The present invention is based on the objective of creating a method for operating an electromagnetic actuator which avoids the disadvantages of the prior art, in particular enabling a precise adjustment of a spatial position and / or a deformation of an element.

[0016] According to the invention, this problem is solved by a method having the features mentioned in claim 1.

[0017] The present invention further aims to create a device which avoids the disadvantages of the prior art, in particular enabling precise adjustment of a spatial position and / or deformation of an element.

[0018] According to the invention, this problem is solved by a device having the features mentioned in claim 10.

[0019] The present invention also aims to create a computer program product that avoids the disadvantages of the prior art, in particular enabling precise adjustment of a spatial position and / or deformation of an element.

[0020] According to the invention, this problem is solved by a computer program product with the features mentioned in claim 20.

[0021] Furthermore, the present invention is based on the objective of creating a mechanical system which avoids the disadvantages of the prior art, in particular enabling a precise adjustment of a spatial position and / or a deformation of an element.

[0022] According to the invention, this problem is solved by a mechanical system with the features mentioned in claim 21.

[0023] The present invention further aims to create a lithography system that avoids the disadvantages of the prior art, in particular enabling precise images.

[0024] According to the invention, this problem is solved by a lithography system with the features mentioned in claim 22.

[0025] In the inventive method for operating an electromagnetic actuator, the actuator is supplied with both a control signal to exert a force and / or to achieve a deflection, and with a temperature control signal decoupled from the control signal for targeted heat generation.

[0026] It may be provided that the control signal and the temperature control signal are decoupled in such a way that the application of a force and / or the achievement of a deflection can take place independently of the targeted heat generation and / or vice versa.

[0027] It may also be provided that the control signal and the temperature control signal are selected in such a way that the application of a force and / or the achievement of a deflection occurs in a certain ratio to the targeted heat generation or vice versa.

[0028] Furthermore, in the method according to the invention, the ratio can be freely predetermined and / or varied, whereby the application of a force and / or the achievement of a deflection can occur independently of the targeted heat generation and / or vice versa. The total heat generation and the force effect are only connected in that the total heat generation can always only be set to be equal to or greater than the heat generation caused by the force effect.

[0029] It may be provided that, by means of the method according to the invention, a spatial position and / or a deformation of an element, in particular an optical element of a lithography system, is set.

[0030] The method according to the invention can be designed such that deformation of the element is not avoided, but rather made deterministic and / or constant. This makes the deformation correctable and / or usable.

[0031] The method according to the invention avoids deformations of optical elements that change over time and which can occur when using electromechanical devices known from the prior art.

[0032] During the operation of an actuator, different levels of force generation are typically requested or drawn over time. Therefore, the required force profile over time is not constant.

[0033] Because the power dissipated as heat by the actuator is directly proportional to the force generated by the actuator, the dissipated power is not constant during actuator operation. Rather, the heat dissipation varies over time with the force generation.

[0034] The method according to the invention makes it possible to avoid and / or selectively achieve different deformations which depend on the position of an element, in particular an optical element, which in particular has a rigid body.

[0035] Due to mechanical stiffness, the position of an element comprising a rigid body, in particular an optical element, is proportional to the force generated or applied.

[0036] Preferably, the method according to the invention avoids the aforementioned variability of deformation. This variability can lead to optical effects that cannot be corrected in advance using methods known from the prior art, e.g., by appropriate pre-forming of the surface or by independent component analysis.

[0037] In the method according to the invention, the power dissipation within the actuator is decoupled from the force generation.

[0038] Within the scope of the invention, an actuator can also be understood as an actuator unit comprising several individual actuators that work together in a coordinated manner.

[0039] Furthermore, it may also be provided that the electromagnetic actuator has one, two or more current-carrying conductor coils.

[0040] Within the scope of the invention, spatial location is understood to mean the center of gravity and the orientation of the element in space.

[0041] A change in the position of an element, particularly an optical one, can also affect its deformation, and vice versa. This is especially true if the element is clamped on one side and deflected by the actuator on the other side. In this case, the deformation is accompanied by a change in its spatial position.

[0042] It may be provided that a low heat output of the actuator, which occurs, for example, during low power generation, is compensated for by an increased heat output, which is achieved by means of the temperature control signal.

[0043] In an advantageous further development of the method according to the invention, it can be provided that the total heat output of the actuator is kept constant.

[0044] Because both the power dissipation and the force generation are decoupled in the method according to the invention and can be adjusted independently for each electromagnetic actuator, in particular each coil of an electromagnetic actuator, it is possible to keep the thermal power of the actuator constant.

[0045] By keeping the total thermal output of the actuator constant for all possible positions or forces, especially of elements and mirrors, as well as for all types of use, it is also possible to keep the effect on the optical properties of optical elements constant.

[0046] This allows for a correction of the previously known influence or impairment of the optical properties through their predictability.

[0047] This in turn can be used to minimize optical defects, especially in an optical element, preferably a mirror.

[0048] Alternatively or additionally, a higher overall heat output of the actuator can also be achieved.

[0049] In an advantageous further development of the method according to the invention, it can be provided that an optical surface of an element, preferably mechanically coupled to the actuator, is selectively heated by means of the temperature control signal.

[0050] If the total heat output of the actuator is varied within the process, i.e., not kept constant but selectively adjusted, the optical surface of an optical element can be heated in a targeted manner.

[0051] Targeted heating can cause a targeted deformation of the optical surface.

[0052] Through the targeted deformation thus achieved, errors in the optical surface can be corrected.

[0053] In an advantageous further development of the method according to the invention, it can be provided that a Lorentz force and / or a reluctance force is used by the actuator to exert the force and / or to achieve the deflection.

[0054] In the prior art, electromagnetic actuators are defined in a broader sense as electro-magneto-mechanical energy converters that utilize electromagnetic field effects to generate force.

[0055] Two types of electromagnetic forces are particularly important here: Firstly, electrodynamic forces are used in electromagnetic actuators. These forces act on moving charges or current-carrying conductors in a magnetic field. Lorentz actuators essentially utilize the electrodynamic forces described above.

[0056] Secondly, magnetic reluctance forces can be used. These forces occur at interfaces with different magnetic permeabilities in a magnetic field, for example, at an iron-air boundary. Reluctance actuators essentially utilize the magnetic reluctance forces described above.

[0057] In an advantageous further development of the method according to the invention, it can be provided that the temperature control signal is designed as a modulation of the control signal.

[0058] It is advantageous to modulate currents, preferably sinusoidal, onto the control signal used for positioning. If these modulations, preferably sinusoidal, flow through the coil, the desired total heat output can be achieved.

[0059] It may be possible to adjust the desired total heat output by changing the amplitude of the temperature control signal.

[0060] In an advantageous further development of the method according to the invention, it can be provided that the temperature control signal is generated at such a frequency that an element mechanically coupled to the actuator cannot follow the temperature control signal.

[0061] It is advantageous if heat output is generated by means of the temperature control signal, whereby the coil currents based on the temperature control signal in the actuator lie in a dynamically insensitive frequency range.

[0062] For this purpose, it is advantageous to define a frequency range in which the forces of the actuator or actuator unit do not influence the positioning of an element coupled to the actuator.

[0063] In an advantageous further development of the method according to the invention, it can be provided that an eddy current is generated in an at least partially electrically conductive housing of the actuator by means of the temperature control signal.

[0064] It is advantageous if the housing of the actuator, in particular the housing of a coil of the actuator, has electrical conductivity.

[0065] Furthermore, it is advantageous if currents are conducted in the actuator, particularly in a coil or conductor coil of the actuator, such that eddy currents form in the housing. As a result, heat is generated in the housing, and the housing then serves as an inductive heating element.

[0066] It may be provided that the temperature control signal used for the induction of the eddy currents has a frequency which an element mechanically coupled to the actuator or a body mechanically coupled to the actuator cannot follow.

[0067] It is advantageous if the heat output of the housing is controlled in such a way that a constant total power dissipation or total heat transfer results as the sum of the heat outputs of the housing and the coil.

[0068] In an advantageous further development of the method according to the invention, it can be provided that the temperature control signal is formed with a frequency of 1 kHz to 100 kHz, preferably 5 kHz to 20 kHz and / or from 10 kHz to 300 kHz, preferably 25 kHz to 100 kHz.

[0069] The embodiments of the method according to the invention described above can be implemented particularly advantageously if the frequency of the temperature control signal is selected such that an element mechanically coupled to the actuator cannot follow the temperature control signal.

[0070] For this purpose, it is advantageous if a transfer function between force and position for the element or body mechanically coupled to the actuator, in particular an element of an EUV lithography system, exhibits high suppression for high frequencies.

[0071] For the embodiment of the method described above, in which the temperature control signal is designed as a modulation of the control signal, a frequency range upwards from 5 kHz to 20 kHz is advantageous.

[0072] However, the upper limit may depend on the availability of power electronics.

[0073] For the embodiment of the method described above, which is based on the induction of eddy currents, it is advantageous if the currents used have frequencies of 25 kHz to 100 kHz.

[0074] Such frequencies enable heat generation for typical elements of EUV lithography systems in conjunction with the filtering behavior of an optical system of the EUV lithography system without impairing the working quality of the EUV lithography system, since high-frequency forces do not lead to relevant mirror movements.

[0075] In an advantageous further development of the method according to the invention, it can be provided that at least two cooperating coils of the actuator are each supplied with a current strength such that a predefinable total force of the actuator results from the temperature control signal and the control signal.

[0076] For this purpose, a main coil of the actuator can have two coils which are arranged one behind the other, next to each other and / or intertwined.

[0077] It is advantageous if both coils are individually supplied with current in such a way that when both coils are used, they are controlled separately, with the force effects overlapping.

[0078] It may be intended that the individual currents have different directions and / or lead to opposing forces.

[0079] In particular, it may be provided that by applying the respective individual currents to the coils, a negligible net force or resultant force of the actuator is obtained.

[0080] In the embodiment of the method according to the invention described above, the actuator can also be described as having a double coil design.

[0081] To change the magnitude of the force, it can be provided that the currents supplied to the respective coils result in a constant heat output, but with the respective desired and required net forces.

[0082] In the embodiment of the method according to the invention described above, the control signal is given by the respective current intensities in the coils that lead to the desired net force or resultant force. The temperature control signal, on the other hand, is given by the currents in the two coils that lead to the desired total heat output. Thus, both the control signal and the temperature control signal are partially reflected in the respective currents flowing in the coils. However, before conversion into the currents flowing in the coils, the control signal and the temperature control signal can be selected independently of each other. A desired current intensity in the coils can then be determined, for example, by a mathematical calculation based on the control signal and the temperature control signal, which are preselected independently of each other.

[0083] The invention further relates to a device for adjusting a spatial position and / or deformation of an element with the features mentioned in claim 10.

[0084] The device according to the invention serves to adjust the spatial position and / or deformation of an element, in particular an optical element of a lithography system. The device according to the invention comprises at least one electromagnetic actuator and a control unit for controlling the actuator. According to the invention, the control unit is configured to supply the actuator with an electrical control signal and an electrical temperature control signal decoupled from the control signal.

[0085] The device according to the invention avoids the problem of uneven heat input into an element, in particular into an EUV mirror, by means of an actuator used to position the mirror.

[0086] The device according to the invention allows the total heat input through the actuator to be predictable and constant by means of a variable additional heat input.

[0087] The element can be - besides an optical element - any element of the lithography system whose deformation is to be avoided, for example a measuring reference.

[0088] In an advantageous further development of the device according to the invention, it can be provided that the actuator can be controlled by the control device in such a way that the actuator has a constant total heat output.

[0089] Constant heat output causes constant deformations, which can be corrected in advance.

[0090] In an advantageous further development of the device according to the invention, it can be provided that the actuator can be controlled by the control device in such a way that an optical surface of the element, preferably mechanically coupled to the actuator, can be selectively heated by means of the temperature control signal.

[0091] Varying the power dissipation or the total heat output is advantageous for selectively inducing deformations of the element's optical surface. These deformations can be used to correct specific defects in the optical surface.

[0092] The device may be designed to have two, three or more actuators.

[0093] In the case of three existing actuators, the device according to the invention results in a heating element with three degrees of freedom.

[0094] This heating element with three degrees of freedom can be used to correct errors or misalignment in certain mirrors of the EUV lithography system.

[0095] This allows a thermal actuator to be implemented in a simple way, advantageously without requiring additional volume or installation space.

[0096] It may be provided that the device is set up for operation in an open control chain or for open-loop operation.

[0097] The total physical power output of an actuator during operation consists of mechanical power and thermal power. If a force is generated and maintained without any movement, for example by an actuator plunger, the power consumed to generate the force is also dissipated as thermal power.

[0098] In a static situation, the actuator's total power is therefore dissipated as heat. The total power of the electromagnetic actuator is the product of the voltage applied to the actuator and the current supplied to the actuator. Thus, the device can be operated in a conveniently simple open control circuit, since the total power can be measured and / or controlled at any time via the applied voltage or the supplied current.

[0099] The total power of the electromechanical actuator is typically proportional to the square of the coil current, while the force is only proportional to the coil current.

[0100] It may be intended that the device is set up for operation in a closed control chain.

[0101] Particularly in a case of varying target temperatures in the element, a closed-loop control is advantageous.

[0102] At least one temperature sensor can be provided as part of the device.

[0103] In particular, at least one temperature sensor may be configured to transmit information to the control device about the temperature prevailing on the element and / or certain areas of the element.

[0104] This allows the overall heat output to be influenced in such a way that the desired temperature can be set or maintained in relevant areas of the element.

[0105] In an advantageous further development of the device according to the invention, it can be provided that the actuator is a Lorentz actuator and / or a reluctance actuator.

[0106] It may be provided that the actuator is designed to exert a maximum force of at least 1 N to 100 N, preferably at least 10 N to 15 N.

[0107] It may be intended that the desired total heat output is greater than the maximum heat dissipation that occurs when the actuator generates power.

[0108] With a given actuator design or type, power dissipation caused by the desired force generation cannot be further minimized. Therefore, it is advantageous if the total heat output, independent of the force generation, has values ​​greater than those inevitably expected during the desired force generation.

[0109] In the case of a desired constant total heat output, it is advantageous if the total heat output is set to the expected maximum of the unavoidable or parasitic heat output of the actuator.

[0110] In this case, instead of the maximum parasitic heat output expected for the actuator, the additional heat output from the temperature control signal can be reduced to zero.

[0111] In the event that the device is used as a thermal actuator, preferably to set deformation profiles on the element, it is advantageous if the total heat output is set higher than the expected maximum parasitic heat output of the at least one actuator or the several actuators.

[0112] In an advantageous further development of the device according to the invention, it can be provided that an at least partially electrically conductive housing is provided for the actuator and / or that an eddy current can be formed in the housing by the control device.

[0113] By providing a housing that is at least partially electrically conductive, thermal effects can also be achieved on the housing of the actuator, particularly through the temperature control signal.

[0114] If eddy currents are also formed in the housing, the housing serves as an inductive heating element.

[0115] It may be provided that the device is set up for inductive heating using eddy currents and / or remagnetization losses.

[0116] It can be provided, in particular, that the device, preferably the housing, comprises ferromagnetic materials. By means of a housing made of ferromagnetic materials, the remagnetization losses can be used particularly advantageously as a contribution to the heat generation for inductive heating.

[0117] In particular, the housing may be designed to generate suitable eddy currents and provide suitable heating power. It may also be designed to be made entirely or partially of iron and / or nickel and / or copper and / or brass and / or stainless steel.

[0118] It may be provided that the housing has a shape which is particularly advantageous for the formation of eddy currents.

[0119] It may be intended that the housing is only electrically conductive in certain areas.

[0120] In particular, it may be provided that the housing is cylindrical in shape, while only an area of ​​the cylindrical surface is electrically conductive, in particular made entirely or partially of the aforementioned materials.

[0121] Alternatively, the entire housing can be designed to be electrically conductive.

[0122] In an advantageous further development of the device according to the invention, it can be provided that the temperature control signal is a modulation of the control signal.

[0123] By implementing the temperature control signal as a modulation of the control signal, the actuator can be supplied with the temperature control signal in a simple way and without the need for further modifications to the respective actuator, in particular without the attachment of further electrical conductors.

[0124] It may be provided that the temperature control signal is a harmonic of the control signal.

[0125] In an advantageous further development of the device according to the invention, it can be provided that the temperature control signal has a frequency by which the element cannot be mechanically excited.

[0126] It is advantageous if, for both of the aforementioned embodiments of the device, namely the case of a conductive housing and the case of a modulated temperature control signal, the frequency is designed or selected as a function of a real dynamic behavior of the actuator and the element mechanically coupled to the actuator, in particular an optical element.

[0127] The embodiments of the device described above therefore depend on a transfer function between force and position of the element coupled to the actuator, in particular the optical element.

[0128] In an advantageous further development of the device according to the invention, it can be provided that the actuator has at least two cooperating coils.

[0129] It is advantageous if two, three or more cooperating coils are provided for the actuator.

[0130] This increases the flexibility of the actuator's usability.

[0131] It may be provided that one, several or all conductor tracks of at least one coil are arranged in such a way that the coil does not generate a force in a magnetic field of the coil.

[0132] In particular, it may be provided that a current direction is aligned parallel to a field direction of the magnetic field. Alternatively or additionally, it may be provided that the force of the coil in question is directed in a direction that is irrelevant for the force effect to be achieved.

[0133] This allows the coil to be used like a simple "heating spindle" without generating any significant force. This eliminates the need to adjust the control signal.

[0134] In an advantageous further development of the device according to the invention, it can be provided that the coils can each be supplied with a current strength by means of the control device via the temperature control signal and the control signal, such that a predefinable total force of the actuator results.

[0135] It may be provided that at least one calibration curve and / or at least one characteristic curve for the heat output and / or the force generation of the actuator formed from the at least two cooperating coils is recorded.

[0136] Based on the calibration curves, the appropriate current supply to the respective coils can be determined.

[0137] The actuator may be designed to have three or more coils. This increases the number of possible variations for achieving a specific force at a specific heat output.

[0138] In an advantageous embodiment of the device according to the invention, it can be provided that the coils are arranged one behind the other, and / or parallel to each other, and / or interwoven with each other.

[0139] The configurations described above enable a particularly simple and space-saving design of at least one actuator.

[0140] It may be provided that the coils have a shorter length when arranged one behind the other and / or a smaller diameter when arranged side by side.

[0141] This allows the required installation space in the actuator to be kept constant even for a larger number of coils.

[0142] In particular, it may be provided that the total heat output results as the sum of the currents through the coils, while the power generation results as the difference of the currents or the current applied to the respective coils.

[0143] This allows the two unknowns of the respective current control to be determined for each combination of required force and required heat output and the previously described determining equations.

[0144] This section discloses a device in a more general form, in which two counter-rotating actuators are provided or used. The difference in power output of the two actuators can determine or control a resultant force or net force, and thus a position. The sum of the actuator power outputs then determines or controls a heat input. The disclosed device is not limited to the use of electromagnetic actuators. Rather, many types of actuators, such as piezoelectric actuators, can be used. The features and advantages described in connection with the device according to the invention apply accordingly.

[0145] It may be provided that two groups of actuators are available for changing the position of the element, with each group comprising three individual actuators. This allows six degrees of freedom for changing or controlling the position and orientation of the element.

[0146] The invention further relates to a computer program product having the features mentioned in claim 20.

[0147] The computer program product according to the invention, including program code means, is designed to carry out the aforementioned method according to the invention, in particular when the program is executed on a control device of the aforementioned device according to the invention.

[0148] The invention further relates to a mechanical system with the features mentioned in claim 21.

[0149] The mechanical system according to the invention comprises at least one actuator and at least one element, wherein a spatial position and / or deformation of the element is adjustable by means of the method and / or the device according to the invention and / or using the computer program product according to the invention.

[0150] It may be intended that the element is an optical element of a lithography system, in particular an EUV projection exposure system.

[0151] It may be provided that at least one element is mechanically coupled to at least one actuator.

[0152] The mechanical system according to the invention can advantageously be configured to be usable in all operating states of an EUV lithography system and in all operating states of EUV optics. In particular, the mechanical system according to the invention can be configured to be usable during exposure phases in an EUV lithography system.

[0153] It can be advantageously provided that the actuator can be controlled by the control device in such a way that an optical surface of the element can be selectively heated by means of the temperature control signal.

[0154] The invention further relates to a lithography system with the features mentioned in claim 22.

[0155] The lithography system according to the invention, in particular a projection exposure system for microlithography, comprises at least one element, in particular an optical element. It is provided that the spatial position and / or deformation of the at least one element, in particular the at least one optical element, can be adjusted by means of the method according to the invention and / or by means of the device according to the invention and / or using the computer program product according to the invention.

[0156] The optical element can be, in particular, a mirror and / or a lens.

[0157] In an advantageous further development of the lithography system according to the invention, it can be provided that the lithography system is an EUV projection exposure system.

[0158] The lithography system according to the invention has the advantage that it reduces drift and / or deformation behavior of the elements incorporated into the lithography system, particularly the optical elements, caused by temperature fluctuations. This enables more precise imaging and thus improved production of semiconductor elements.

[0159] Advantageously, it may be provided that adjustments are made to the coils and the power electronics used to control the coils for use in an EUV projection exposure system, since EUV radiation and the vacuum prevailing in an EUV projection exposure system place special demands on the design.

[0160] Features described in connection with one of the subject matter of the invention, in particular the inventive method, the inventive device, the inventive computer program product, the inventive mechanical system, or the inventive lithography system, can also be advantageously implemented for the other subject matter of the invention. Likewise, advantages mentioned in connection with one of the subject matter of the invention can also be understood to relate to the other subject matter of the invention.

[0161] It should also be noted that terms such as "comprehensive," "exhibiting," or "with" do not exclude other characteristics or steps. Furthermore, terms such as "a" or "that," which indicate a singular number of steps or characteristics, do not exclude a plurality of characteristics or steps—and vice versa.

[0162] In a purist embodiment of the invention, however, it may also be provided that the features introduced in the invention with the terms "comprising," "comprising," or "with" are exhaustively listed. Accordingly, one or more lists of features within the scope of the invention may be considered complete, for example, for each claim. The invention may, for instance, consist exclusively of the features mentioned in claim 1.

[0163] It should be noted that designations such as "first" or "second" etc. are primarily used for the purpose of distinguishing between the respective device or process features and are not necessarily intended to indicate that features are mutually dependent or related to each other.

[0164] Exemplary embodiments of the invention are described in more detail below with reference to the drawing.

[0165] The figures each show preferred embodiments in which individual features of the present invention are combined with one another. Features of an embodiment can also be implemented independently of the other features of the same embodiment and can therefore be readily combined by a person skilled in the art to form further meaningful combinations and subcombinations with features of other embodiments.

[0166] In the figures, functionally identical elements are provided with the same reference symbols.

[0167] They show: Fig. 1 an EUV projection exposure system in meridional section; Fig. 2 a DUV projection exposure system; Fig. 3 a schematic representation of a possible embodiment of a device according to the invention; Fig. 4 a schematic representation of another possible embodiment of the device according to the invention; Fig. 5 a schematic representation of a possible course of a transfer function between an actuator and an element; Fig. 6 a schematic representation of another possible embodiment of the device according to the invention; Fig. 7 a schematic representation of another possible embodiment of the device according to the invention; Fig. 8 a schematic representation of another possible embodiment of the device according to the invention; and Fig. 9 a block diagram-like representation of another possible embodiment of a method according to the invention.

[0168] The following will first refer to Fig. 1. The essential components of an EUV projection exposure system 100 for microlithography are described as an example of a lithography system. The description of the basic structure of the EUV projection exposure system 100 and its components is not intended to be restrictive.

[0169] An illumination system 101 of the EUV projection exposure system 100 comprises, in addition to a radiation source 102, an illumination optic 103 for illuminating an object field 104 in an object plane 105. A reticule 106 arranged in the object field 104 is exposed. The reticule 106 is held by a reticule holder 107. The reticule holder 107 can be moved, particularly in a scanning direction, by means of a reticule displacement drive 108.

[0170] In Fig. Figure 1 shows a Cartesian xyz coordinate system for illustrative purposes. The x-direction runs perpendicular to the plane of the drawing. The y-direction runs horizontally, and the z-direction runs vertically. The scan direction runs in Fig. 1 along the y-direction. The z-direction runs perpendicular to the object plane 105.

[0171] The EUV projection exposure system 100 comprises a projection optic 109. The projection optic 109 serves to image the object field 104 onto an image field 110 in an image plane 111. The image plane 111 is parallel to the object plane 105. Alternatively, an angle other than 0° between the object plane 105 and the image plane 111 is also possible.

[0172] A structure on the reticulum 106 is imaged onto a photosensitive layer of a wafer 112 located in the image plane 111 within the image field 110. The wafer 112 is held by a wafer holder 113. The wafer holder 113 can be displaced, particularly along the y-direction, via a wafer transfer drive 114. The displacement of the reticulum 106 via the reticulum transfer drive 108 and of the wafer 112 via the wafer transfer drive 114 can be synchronized.

[0173] Radiation source 102 is an EUV radiation source. Specifically, radiation source 102 emits EUV radiation 115, which is also referred to as useful radiation or illumination radiation. The useful radiation 115 has a wavelength in the range between 5 nm and 30 nm. Radiation source 102 can be a plasma source, for example, an LPP source (laser-produced plasma) or a DPP source (gas-discharged produced plasma). It can also be a synchrotron-based radiation source. Radiation source 102 can be a free-electron laser (FEL).

[0174] The illumination radiation 115, emanating from the radiation source 102, is focused by a collector 116. The collector 116 can be a collector with one or more ellipsoidal and / or hyperboloid reflective surfaces. The at least one reflective surface of the collector 116 can be illuminated with the illumination radiation 115 at grazing incidence (GI), i.e., with angles of incidence greater than 45°, or at normal incidence (NI), i.e., with angles of incidence less than 45°. The collector 116 can be structured and / or coated, both to optimize its reflectivity for the useful radiation 115 and to suppress stray light.

[0175] After the collector 116, the illumination radiation 115 propagates through an intermediate focus in an intermediate focal plane 117. The intermediate focal plane 117 can represent a separation between a radiation source module, comprising the radiation source 102 and the collector 116, and the illumination optics 103.

[0176] The illumination optics 103 comprise a deflecting mirror 118 and, downstream in the beam path, a first faceted mirror 119. The deflecting mirror 118 can be a planar deflecting mirror or, alternatively, a mirror with an effect that influences the beam shape beyond the mere deflection effect. Alternatively or additionally, the deflecting mirror 118 can be designed as a spectral filter that separates a useful wavelength of the illumination radiation 115 from stray light of a different wavelength. If the first faceted mirror 119 is arranged in a plane of the illumination optics 103 that is optically conjugate to the object plane 105 as the field plane, it is also referred to as a field faceted mirror. The first faceted mirror 119 comprises a plurality of individual first facets 120, which are also referred to as field facets in the following. Of these facets 120, the following are in the Fig. 1 only some examples are shown.

[0177] The first facets 120 can be designed as macroscopic facets, in particular as rectangular facets or as facets with an arcuate or semicircular border contour. The first facets 120 can be designed as planar facets or alternatively as convexly or concavely curved facets.

[0178] As is known, for example, from DE 10 2008 009 600 A1, the first facets 120 can themselves each be composed of a plurality of individual mirrors, in particular a plurality of micromirrors. The first facet mirror 119 can in particular be designed as a microelectromechanical system (MEMS system). For details, reference is made to DE 10 2008 009 600 A1.

[0179] Between the collector 116 and the deflecting mirror 118, the illumination radiation 115 runs horizontally, i.e. along the y-direction.

[0180] In the beam path of the illumination optics 103, a second faceted mirror 121 is arranged downstream of the first faceted mirror 119. If the second faceted mirror 121 is arranged in a pupil plane of the illumination optics 103, it is also referred to as a pupil faceted mirror. The second faceted mirror 121 can also be arranged at a distance from a pupil plane of the illumination optics 103. In this case, the combination of the first faceted mirror 119 and the second faceted mirror 121 is also referred to as a specular reflector. Specular reflectors are known from US 2006 / 0132747 A1, EP 1 614 008 B1, and US 6,573,978.

[0181] The second facet mirror 121 comprises a plurality of second facets 122. In the case of a pupil facet mirror, the second facets 122 are also referred to as pupil facets.

[0182] The second facets 122 can also be macroscopic facets, which may, for example, have round, rectangular, or hexagonal edges, or alternatively, facets composed of micromirrors. Reference is also made to DE 10 2008 009 600 A1 in this regard.

[0183] The second facets 122 can have planar or alternatively convex or concave curved reflective surfaces.

[0184] The illumination optics 103 thus form a double-faceted system. This basic principle is also known as a fly's eye integrator.

[0185] It may be advantageous not to arrange the second faceted mirror 121 exactly in a plane which is optically conjugate to a pupil plane of the projection optics 109.

[0186] With the aid of the second faceted mirror 121, the individual first facets 120 are imaged into the object field 104. The second faceted mirror 121 is the last beam-shaping, or indeed the last, mirror for the illumination radiation 115 in the beam path before the object field 104.

[0187] In another embodiment of the illumination optics 103, not shown, a transmission optic can be arranged in the beam path between the second facet mirror 121 and the object field 104, which contributes in particular to imaging the first facets 120 into the object field 104. The transmission optic can have exactly one mirror, or alternatively two or more mirrors, arranged one behind the other in the beam path of the illumination optics 103. The transmission optic can, in particular, comprise one or two mirrors for normal incidence (NI mirrors, "normal incidence" mirrors) and / or one or two mirrors for grazing incidence (Gl mirrors, "grazing incidence" mirrors).

[0188] The lighting optic 103, in the version that is in the Fig. Figure 1 shows exactly three mirrors after the collector 116, namely the deflecting mirror 118, the field facet mirror 119 and the pupil facet mirror 121.

[0189] In a further embodiment of the lighting optics 103, the deflecting mirror 118 can also be omitted, so that the lighting optics 103 after the collector 116 can then have exactly two mirrors, namely the first faceted mirror 119 and the second faceted mirror 121.

[0190] The imaging of the first facets 120 by means of the second facets 122 or with the second facets 122 and a transmission optic into the object plane 105 is regularly only an approximate imaging.

[0191] The projection optics 109 comprise a plurality of mirrors Mi, which are numbered according to their arrangement in the beam path of the EUV projection exposure system 100.

[0192] In the Fig. In the example shown, the projection optics 109 comprises six mirrors M1 to M6. Alternatives with four, eight, ten, twelve, or any other number of mirrors Mi are also possible. The penultimate mirror M5 and the last mirror M6 each have an aperture for the illumination radiation 115. The projection optics 109 is a double-obscured optic. The projection optics 109 has an image-side numerical aperture that is greater than 0.5 and can also be greater than 0.6, for example, 0.7 or 0.75.

[0193] The reflective surfaces of the mirrors Mi can be designed as freeform surfaces without an axis of rotational symmetry. Alternatively, the reflective surfaces of the mirrors Mi can be designed as aspherical surfaces with exactly one axis of rotational symmetry of the reflective surface shape. The mirrors Mi, like the mirrors of the illumination optics 103, can have highly reflective coatings for the illumination radiation 115. These coatings can be designed as multilayer coatings, in particular with alternating layers of molybdenum and silicon.

[0194] The projection optics 109 has a large object-image offset in the y-direction between a y-coordinate of the center of the object field 104 and a y-coordinate of the center of the image field 110. This object-image offset in the y-direction can be approximately as large as a z-distance between the object plane 105 and the image plane 111.

[0195] The number of intermediate image planes in the x- and y-directions in the beam path between the object field 104 and the image field 110 can be the same or, depending on the design of the projection optics 109, can differ. Examples of projection optics with different numbers of such intermediate images in the x- and y-directions are known from US 2018 / 0074303 A1.

[0196] Each of the pupil facets 122 is assigned to exactly one of the field facets 120 to form an illumination channel for illuminating the object field 104. This can result, in particular, in illumination according to Köhler's principle. The far field is divided into a multitude of object fields 104 by means of the field facets 120. The field facets 120 generate a plurality of images of the intermediate focus on the pupil facets 122 assigned to each of them.

[0197] The field facets 120 are each superimposed on the reticulum 106 by an associated pupil facet 122 to illuminate the object field 104. The illumination of the object field 104 is particularly homogeneous. It preferably exhibits a uniformity error of less than 2%. Field uniformity can be achieved by superimposing different illumination channels.

[0198] The illumination of the entrance pupil of the projection optics 109 can be geometrically defined by the arrangement of the pupil facets. By selecting the illumination channels, in particular the subset of pupil facets that guide light, the intensity distribution in the entrance pupil of the projection optics 109 can be adjusted. This intensity distribution is also referred to as the illumination setting.

[0199] Another preferred pupil uniformity in the area of ​​defined illuminated sections of an illumination pupil of the illumination optics 103 can be achieved by a redistribution of the illumination channels.

[0200] Further aspects and details of the illumination of the object field 104 and, in particular, the entrance pupil of the projection optics 109 are described below.

[0201] The projection optic 109 can, in particular, have a homocentric entrance pupil. This may be accessible. It may also be inaccessible.

[0202] The entrance pupil of the projection optics 109 cannot always be illuminated exactly by the pupil facet mirror 121. When the projection optics 109 image the center of the pupil facet mirror 121 telecentrically onto the wafer 112, the aperture rays often do not intersect at a single point. However, a surface can be found where the pairwise determined separation of the aperture rays is minimized. This surface represents the entrance pupil or a surface conjugate to it in real space. In particular, this surface exhibits a finite curvature.

[0203] The projection optics 109 may have different entrance pupil positions for the tangential and sagittal beam paths. In this case, an imaging element, in particular an optical component of the transmission optics, should be provided between the second faceted mirror 121 and the reticle 106. This optical component will allow the different positions of the tangential and sagittal entrance pupils to be taken into account.

[0204] During the Fig. In the arrangement of the components of the illumination optics 103 shown in Figure 1, the pupil facet mirror 121 is arranged in a plane conjugate to the entrance pupil of the projection optics 109. The first field facet mirror 119 is arranged tilted relative to the object plane 105. The first facet mirror 119 is arranged tilted relative to an arrangement plane defined by the deflecting mirror 118.

[0205] The first faceted mirror 119 is arranged at an angle to an arrangement plane defined by the second faceted mirror 121.

[0206] In Fig. Figure 2 shows an exemplary DUV projection exposure system 200. The DUV projection exposure system 200 comprises an illumination system 201, a device called a reticule stage 202 for receiving and precisely positioning a reticule 203, by which the subsequent structures on a wafer 204 are determined, a wafer holder 205 for holding, moving and precisely positioning the wafer 204 and an imaging device, namely a projection optic 206, with several optical elements, in particular lenses 207, which are held in a lens housing 209 of the projection optic 206 via mounts 208.

[0207] Alternatively or in addition to the lenses 207 shown, various refractive, diffractive and / or reflective optical elements, including mirrors, prisms, end plates and the like, may be provided.

[0208] The basic operating principle of the DUV projection exposure system 200 provides that the structures introduced into the reticulum 203 are imaged onto the wafer 204.

[0209] The illumination system 201 provides a projection beam 210 in the form of electromagnetic radiation, which is required for imaging the reticulum 203 onto the wafer 204. A laser, a plasma source, or the like can be used as the source of this radiation. In the illumination system 201, the radiation is shaped by optical elements such that the projection beam 210, upon striking the reticulum 203, exhibits the desired properties with regard to diameter, polarization, wavefront shape, and the like.

[0210] Using the projection beam 210, an image of the reticulum 203 is generated and transferred, appropriately reduced in size, to the wafer 204 by the projection optics 206. The reticulum 203 and the wafer 204 can be moved synchronously, so that areas of the reticulum 203 are mapped onto corresponding areas of the wafer 204 practically continuously during a so-called scan process.

[0211] Optionally, the air gap between the last lens 207 and the wafer 204 can be replaced by a liquid medium with a refractive index greater than 1.0. This liquid medium could, for example, be highly purified water. Such a setup is also known as immersion lithography and offers increased photolithographic resolution.

[0212] The use of the invention is not limited to use in projection exposure systems 100, 200, and in particular not limited to systems with the described setup. The invention is suitable for any lithography or microlithography systems, but especially for projection exposure systems with the described setup. The invention is also suitable for EUV projection exposure systems, which have a lower image-side numerical aperture than those associated with Fig. The invention is particularly suitable for EUV projection exposure systems that have an image-side numerical aperture of 0.25 to 0.5, preferably 0.3 to 0.4, and most preferably 0.33. Furthermore, the invention and the following embodiments are not limited to a specific design.

[0213] The following figures represent the invention only as an example and in a highly schematic form.

[0214] Fig. Figure 3 shows a schematic representation of a possible embodiment of a device 1 for adjusting a spatial position and / or deformation of an element 2. The element 2 can in particular be one of the optical elements 116, 118, 119, 120, 121, 122, Mi, 207.

[0215] The device 1 comprises at least one electromagnetic actuator 3 and a control unit 4 for controlling the at least one actuator 3. The control unit 4 is for supplying the actuator 3 with a control signal 5 (see Fig. 4) and an electrical temperature control signal 6 decoupled from the control signal 5 (see Fig. 4) set up.

[0216] In the Fig. In the embodiment of device 1 shown in Figure 3, the actuator 3 can preferably be controlled by the control unit 4 in such a way that the actuator 3 has a constant total heat output.

[0217] Furthermore, in the Fig. In the embodiment of the device 1 shown in Figure 3, the actuator 3 can be controlled by the control unit 4 in such a way that an optical surface 7 of the element 2, which is preferably mechanically coupled to the actuator 3, can be selectively heated by means of the temperature control signal 6.

[0218] Furthermore, in the Fig. In the embodiment of device 1 shown in section 3, the actuator 3 is preferably a Lorentz actuator.

[0219] In an alternative or combined embodiment, at least one of the actuators 3 can also be designed as a reluctance actuator.

[0220] In the Fig. In the embodiment shown in Figure 3, two actuators 3 are provided. The actuators 3 each have a housing 8, a coil 9 and a plunger 10 and are mechanically coupled to the element 2.

[0221] In the Fig. In the embodiment shown in Figure 3, a dissipative heat input, which originates from the actuators 3 and heats the element 2, is symbolized by paths or arrows 11.

[0222] Fig. Section 3 further serves to disclose a mechanical system 15 comprising at least one actuator 3 and at least one element 2. The spatial position and / or deformation of the element 2 in the mechanical system 15 can be adjusted by means of a method described later, the device 1 described above, or a computer program product described later.

[0223] Fig. Figure 4 shows a schematic representation of a possible further embodiment of device 1.

[0224] At the in Fig. In the embodiment shown in Figure 4, a housing 8 that is at least partially electrically conductive is provided for the actuator 3.

[0225] Preferably, the control unit 4 (see Fig. 3) an eddy current can be formed in the housing 8.

[0226] Furthermore, in Fig. Figure 4 illustrates a situation in which the temperature control signal 6 is a, preferably sinusoidal, modulation of the control signal 5. Fig. The control signal 5 is shown as a carrier signal in dashed lines. The total input signal 56 supplied to the actuator 3 is the sum of the temperature control signal 6 and the control signal 5.

[0227] The high-frequency superposition of the input signal 56 generates in the Fig. In the embodiment shown in section 4, heat is introduced, but it has no effect on the position of element 2, in particular on the mirror position and / or the lens position.

[0228] Fig. Figure 5 shows a schematic representation of a possible course of a transfer function between a force generated at the actuator 3 and a position of the element 2.

[0229] A ratio of position to force is plotted on a vertical y-axis 12.

[0230] On a horizontal x-axis 13, a frequency of an excitation caused by the actuator 3 is plotted.

[0231] The transfer function is described by a curve 14.

[0232] It is evident that the transfer function exhibits strong suppression of high frequencies.

[0233] From the in Fig. The transfer function shown in Figure 5 shows that it is advantageous if the temperature control signal 5 preferably has a frequency by which the element 2 cannot be mechanically excited, for example to vibration.

[0234] Fig. Figure 6 shows a schematic representation of another possible embodiment of device 1.

[0235] In the Fig. 6 as well as in connection with the Fig. 7 and Fig. In the embodiment described in section 8 later, the actuator 3 has at least two cooperating coils 9.

[0236] Furthermore, in the Fig. 6, Fig. 7 and Fig. In the embodiments shown in Figure 8, the coils 9 can be supplied with a current by means of the control device 4 (not shown) via the temperature control signal 6 and the control signal 5, such that a predefinable total force of the actuator 3 results.

[0237] In the Fig. In the embodiment shown in Figure 6, the coils 9 are arranged one behind the other.

[0238] Fig. Figure 7 shows a schematic representation of another possible embodiment of device 1.

[0239] At the in Fig. In the embodiment shown in Figure 7, the coils 9 are arranged parallel to each other.

[0240] Fig. Figure 8 shows a schematic representation of another possible embodiment of device 1.

[0241] At the in Fig. In the embodiment shown in Figure 8, the coils 9 are interwoven around a common core.

[0242] Fig. Figure 9 shows a block diagram representation of a possible embodiment of a method for operating the electromagnetic actuator 3.

[0243] In a control block 20, the actuator 3 is supplied with the control signal 5 to exert a force or to achieve a deflection.

[0244] In a temperature control block 21, the actuator 3 is supplied with the temperature control signal 6, which is decoupled from the control signal 5, for targeted heat generation.

[0245] The control block 20 and the temperature control block 21 are preferably executed at the same time.

[0246] In a constant block 22, the total heat output of the actuator 3 is preferably kept constant. In a heating block 23, the optical surface 7 of the element 2, which is preferably mechanically coupled to the actuator 3, is preferably heated selectively by means of the temperature control signal 6.

[0247] The constant block 22 and the heating block 23 are preferably carried out at different times.

[0248] Within the control block 20, the actuator 3 preferably uses a Lorentz force and / or a reluctance force to exert the force and / or to achieve the deflection.

[0249] Within the control block 20 and / or the temperature control block 21, the temperature control signal 6 is preferably designed as a modulation of the control signal 5.

[0250] Furthermore, within the framework of the temperature control block 21, the temperature control signal 6 is preferably generated at such a frequency that the element 2 mechanically coupled to the actuator 3 cannot follow the force of the actuator 3 caused by the temperature control signal 6.

[0251] Alternatively or additionally, it can be provided within the framework of the temperature control block 21 that an eddy current is generated in the at least partially electrically conductive housing 8 of the actuator 3 by means of the temperature control signal 6.

[0252] Within the framework of the temperature control block 21, the temperature control signal 6 is furthermore preferably designed with a frequency of 1 kHz to 100 kHz, preferably 5 kHz to 20 kHz and / or from 10 kHz to 300 kHz, preferably 25 kHz to 100 kHz.

[0253] Furthermore, within the framework of the control block 20 and / or the temperature control block 21, it can be provided that at least two cooperating coils 9 of the actuator 3 are each supplied with a current strength such that a predefinable total force of the actuator 3 results.

[0254] Preferably the method is carried out in the Fig. The 9 chronological sequence is implemented.

[0255] A computer program product with program code tools is preferably intended to perform the function described in Fig. 9. The procedures described above can be carried out when the program is on the control unit 4 of the device 1, preferably in one of the embodiments which are related to the Fig. The steps described in sections 3 to 8 will be carried out.

[0256] The in the Fig. 1 and Fig. The lithography system described in Section 2, in particular the projection exposure system for microlithography, generally comprises at least one element 2, in particular an optical element 116, 118, 119, 120, 121, 122, Mi, 207. In the case described in the Fig. 1 and Fig. The lithography system shown in Figure 2 is a spatial position and / or deformation of the at least one element 2, in particular the at least one optical element 116, 118, 119, 120, 121, 122, Mi, 207, by means of the process associated with the Fig. 9 explained procedure and / or by means of the procedures related to the Fig. 3 to 8 described device 1 and / or using the computer program product described above. Alternatively or additionally, the device described in connection with Fig. 3. Mechanical system 15 is provided as part of the lithography system. Reference symbol list 1 Device 2 Element 3 electromagnetic actuator 4 Control unit 5 Control signal 6 Temperature control signal 56 Input signal 7 optical surface 8 cases 9 coil 10 pestles 11 Arrow 12 y-axis 13 x-axis 14 Curve 15 mechanical system 20 Control block 21 Temperature control block 22 Constant block 23 Warm-up block 100 EUV projection system 101 Lighting system 102 Radiation source 103 Lighting optics 104 object field 105 Object level 106 reticles 107 label holders 108 Reticle displacement drive 109 Projection optics 110 image field 111 Image plane 112 wafers 113 wafer holders 114 Wafer transfer drive 115 EUV / Useful / Illumination radiation 116 Collector 117 Intermediate focus plane 118 Deflection mirrors 119 first faceted mirror / field faceted mirror 120 first facets / field facets 121 Second faceted mirror / Pupil faceted mirror 122 second facets / pupil facets 200 DUV projection exposure system 201 Lighting system 202 reticulation days 203 reticles 204 wafers 205 wafer holders 206 Projection optics 207 lens Version 208 209 lens bodies 210 projection beam Mi Mirror QUOTES INCLUDED IN THE DESCRIPTION

[0000] This list of documents cited by the applicant was automatically generated and is included solely for the reader's convenience. The list is not part of the German patent or utility model application. The DPMA accepts no liability for any errors or omissions. Cited patent literature

[0000] DE 10 2015 211 474 A1

[0011] DE 10 2015 217 119 A1

[0012] DE 10 2020 212 742 A1

[0013] DE 10 2008 009 600 A1 [0178, 0182] US 2006 / 0132747 A1

[0180] EP 1 614 008 B1

[0180] US 6,573,978

[0180] US 2018 / 0074303 A1

[0195]

Claims

[1] Method for operating an electromagnetic actuator (3), wherein the actuator (3) is subjected to both a control signal (5) for exerting a force and / or for achieving a deflection, and a tempering signal (6) decoupled from the control signal (5) for targeted heat generation. [2] Method according to claim 1, characterized by that the total heat output of the actuator (3) is kept constant. [3] Method according to claim 1 or 2, characterized by that an optical surface (7) of an element (2), preferably mechanically coupled to the actuator (3), is specifically heated by means of the tempering signal (6). [4] Method according to one of claims 1 to 3, characterized by that the actuator (3) uses a Lorentz force and / or a reluctance force to exert the force and / or to achieve the deflection. [5] Method according to one of claims 1 to 4, characterized bythat the tempering signal (6) is formed as a modulation of the control signal (5). [6] Method according to one of claims 1 to 5, characterized by that the tempering signal (6) is generated with such a frequency that an element (2) mechanically coupled to the actuator (3) cannot follow the tempering signal (6). [7] Method according to one of claims 1 to 6, characterized by that by means of the tempering signal (6) an eddy current is generated in an at least partially electrically conductive housing (8) of the actuator (3). [8] Method according to one of claims 1 to 7, characterized by that the tempering signal (6) is formed with a frequency of 1 kHz to 100 kHz, preferably 5 kHz to 20 kHz and / or from 10 kHz to 300 kHz, preferably 25 kHz to 100 kHz. [9] Method according to one of claims 1 to 8, characterized bythat by the tempering signal (6) and the control signal (5) at least two cooperating coils (9) of the actuator (3) are each supplied with such a current intensity that a predeterminable total force of the actuator (3) results. [10] Device (1) for adjusting a spatial position and / or deformation of an element (2), in particular an optical element (116, 118, 119, 120, 121, 122, Mi, 207) of a lithography system, comprising - at least one electromagnetic actuator (3), and - a control device (4) for controlling the at least one actuator (3); characterized by that the control device (4) is designed to apply an electrical control signal (5) and an electrical tempering signal (6) decoupled from the control signal (5) to the actuator (3) [11] Device (1) according to claim 10, characterized bythat the actuator (3) can be controlled by the control device (4) such that the actuator (3) has a constant total heat output. [12] Device (1) according to claim 10 or 11, characterized by that the actuator (3) can be controlled by the control device (4) in such a way that an optical surface (7) of the element (2), which is preferably mechanically coupled to the actuator (3), can be heated in a targeted manner by means of the tempering signal (6). [13] Device (1) according to one of claims 10 to 12, characterized by that the actuator (3) is a Lorentz actuator and / or a reluctance actuator. [14] Device (1) according to one of claims 10 to 13, characterized by that an at least partially electrically conductive housing (8) is provided for the actuator (3) and / or an eddy current can be formed in the housing (8) by the control device (4). [15] Device (1) according to one of claims 10 to 14, characterized bythat the tempering signal (5) is a modulation of the control signal (5). [16] Device (1) according to one of claims 10 to 15, characterized by that the tempering signal (5) has a frequency by which the element (2) cannot be mechanically excited. [17] Device (1) according to one of claims 10 to 16, characterized by that the actuator (3) has at least two cooperating coils (9). [18] Device (1) according to claim 17, characterized by that the coils (9) can each be supplied with a current intensity such that a predeterminable total force of the actuator (3) is produced by means of the control device (4) by means of the tempering signal (6) and the control signal (5). [19] Device according to claim 17 or 18, characterized by that the coils (9) - are arranged one behind the other, and / or - are arranged parallel to each other, and / or - are intertwined. [20] Computer program product with program code means for carrying out a method according to one of claims 1 to 9 when the program is executed on a control device (4) of a device (1) according to one of claims 10 to 19. [21] Mechanical system (15) with at least one actuator (3) and at least one element (2), wherein a spatial position and / or deformation of the element (2) is adjustable by means of a method according to one of claims 1 to 9 and / or a device (1) according to one of claims 10 to 19 and / or using a computer program product according to claim 20. [22] Lithography system, in particular projection exposure system (100,200) for microlithography, comprising at least one element (2), in particular an optical element (116, 118, 119, 120, 121, 122, Mi, 207), characterized bythat a spatial position and / or deformation of the at least one element (2), in particular of the at least one optical element (116, 118, 119, 120, 121, 122, Mi, 207), is adjustable by means of a method according to one of claims 1 to 9 and / or by means of a device (1) according to one of claims 10 to 19 and / or using a computer program product according to claim 20 and / or a mechanical system (15) according to claim 21 is provided.

Citation Information

Patent Citations

  • Facet mirror e.g. field facet mirror, for use as bundle-guiding optical component in illumination optics of projection exposure apparatus, has single mirror tiltable by actuators, where object field sections are smaller than object field

    DE102008009600A1

  • actuator device FOR A LITHOGRAPHY PLANT AND LITHOGRAPHY PLANT

    DE102015211474A1

  • Electromagnetic drive with a stator and a stator holder

    DE102015217119A1

  • Adaptive optical element for microlithography

    DE102020212742A1

  • Optical element for a lighting system

    EP1614008B1