Housing with a carrier that has a component receiving volume on one side and a repelling structure on the other side

Abstract

One housing (100), comprising: • a carrier (102) that is at least partially electrically conductive and is designed to limit a receiving volume (104) therein; • an electronic component (106) mounted on the carrier (102) and at least partially housed in the receiving volume (104); and • a repulsive structure (112) configured to repel an electrically conductive connecting medium (129) and arranged on a portion of a surface of the support (102) facing away from the receiving volume (104). • a wettable coating (108) configured to be wettable by an electrically conductive connecting medium (127, 128, 129) and arranged at least on a part of a heat dissipation surface (110) of the support (102) facing away from the receiving volume (104).

Description

Background Technical field

[0001] Different embodiments generally relate to a housing, an electronic device, and a manufacturing process. Description of the state of the art

[0002] A conventional package may contain a semiconductor device mounted on a support, such as a conductor frame structure, may be electrically connected by a bond wire extending from the semiconductor device to the support, and may be shaped using a molding compound as an encapsulation medium.

[0003] However, there are also non-encapsulated packages, such as a DirectFET. ® -Housing in which a semiconductor chip is housed in a receiving volume of a carrier.

[0004] Both publication DE 102016115722 A1 and publication WO 2017162671 A1 show examples of a housing in which a semiconductor chip is housed in a receiving volume of a carrier.

[0005] Achieving a suitable combination of electrical reliability and thermal performance can still be a challenge. Summary

[0006] There may be a need for an enclosure with high electrical reliability and high thermal performance.

[0007] According to an exemplary embodiment, a housing is provided comprising: an at least partially electrically conductive support configured to delimit a receiving volume therein; an electronic component mounted on the support and at least partially housed in the receiving volume; a repellent structure configured to repel an electrically conductive connecting medium and arranged on a portion of a surface (in particular an outer surface) of the support facing away from the receiving volume; and a wettable coating configured to be wettable by an electrically conductive connecting medium and arranged at least on a portion of a heat dissipation surface of the support facing away from the receiving volume.

[0008] According to another exemplary embodiment, an electronic device is provided which has a housing with the features mentioned above and a mounting structure that is mounted with the housing.

[0009] According to yet another exemplary embodiment, a method for manufacturing a housing is provided, the method comprising: providing an at least partially electrically conductive support configured to delimit a receiving volume therein; mounting an electronic component on the support and housing it at least partially within the receiving volume; forming a repellent structure configured to repel an electrically conductive connecting medium; arranging the repellent structure on a portion of a surface of the support facing away from the receiving volume; and forming a wettable coating configured to be wettable by an electrically conductive connecting medium and arranged at least on a portion of a heat dissipation surface of the support facing away from the receiving volume.

[0010] According to an exemplary embodiment, a housing is equipped with a carrier that is at least partially electrically conductive. This carrier can be configured to delimit a preferably flat inner surface, which is surrounded by walls to define a receiving volume in which an electronic component can be arranged and mounted. Advantageously, a repellent structure (for example, a solder mask) can be provided on an outer surface section of the carrier, opposite the inner receiving volume, to repel an electrically conductive connecting medium (such as a solder).This allows a mounting structure (such as a heat sink) to be attached to the outer surface section opposite the receiving volume without the risk of electrically conductive connecting fluid, used to attach the mounting structure to the substrate, flowing from the substrate's outer surface to its inner surface and towards the electronic component, as this can be reliably prevented by the repelling structure. Avoiding unwanted flow of electrically conductive connecting fluid into undesired areas of the enclosure can lead to proper electrical reliability.The ability to create a highly thermally conductive connection between a heat sink and the main heat source (the housed electronic component) via the electrically conductive connection medium and the back of the at least partially electrically conductive substrate can ensure high thermal performance. In short, the described configuration allows a heat sink to be soldered to the back of the component mounting substrate without the risk of unwanted solder flow along a potentially wettable outer surface of the substrate towards the mounting volume. Description of further exemplary embodiments

[0011] Further exemplary embodiments of the housing, the electronic device and the method are explained below.

[0012] In the context of the present application, the term "housing" can, in particular, refer to an arrangement that may include one or more enclosed electronic components. A partially or fully electrically conductive support may also form part of the housing. The components of the housing may be unencapsulated or may be at least partially encapsulated by an encapsulating means. Optionally, one or more electrically conductive connecting elements (such as metal pillars, bumps, bond wires, and / or clips) may be implemented in a housing, for example, for electrical coupling and / or mechanical support of the electronic component.

[0013] In the context of the present application, the term "support" can, in particular, refer to a support structure (which may be at least partially electrically conductive) that serves as a mechanical support within a housing and that may also contribute to the electrical connection between one or more electronic components and the periphery of the housing. In other words, the support can fulfill a mechanical support function and / or an electrical connection function. A support may comprise or consist of a single part, several parts connected via an encapsulation or other housing components, or a subarrangement of supports. If the support forms part of a conductor frame, it may be or comprise a die pad.For example, the support can be designed as an electrically conductive plate, made particularly of a metal such as copper, aluminum, or the like, which can be curved to define the receiving volume for the electronic component. A recessed section of the support can form the receiving volume, while an opposing, protruding section of the support can define a heat dissipation surface for mounting a heat sink.

[0014] In the context of the present application, the term "support formed for delimiting a receiving volume" can, in particular, refer to a support that may be bent, for example, bent three-dimensionally to define a recess, cavity, or other type of free volume therein, which makes it possible to mount an electronic component on the support and in the receiving volume. For example, such a support for delimiting a receiving volume may be formed by bending a metal plate. For example, the bending may be of such a type that a can-shaped support for delimiting a receiving volume can be obtained.

[0015] In the context of the present application, the term "electronic component" may include, in particular, a semiconductor chip (especially a power semiconductor chip), an active electronic device (such as a transistor), a passive electronic device (such as a capacitor, inductor, or resistor), a sensor (such as a microphone, light sensor, temperature sensor, or gas sensor), an actuator (for example, a loudspeaker), and a microelectromechanical system (MEMS). In other embodiments, however, the electronic component may also be of a different type, such as a mechatronic element, in particular a mechanical switch, etc. In particular, the electronic component may be a semiconductor chip comprising at least one integrated circuit element (such as a diode or a transistor in a surface section thereof).The electronic component can be a bare die or it can already be packaged or encapsulated. Semiconductor chips implemented according to exemplary embodiments can be formed, for example, using silicon technology, gallium nitride technology, silicon carbide technology, etc.

[0016] In the context of the present application, the term “repulsive structure configured to repel an electrically conductive joining medium” can, in particular, refer to a physical structure made of a material and arranged at a position where the flow of an electrically conductive joining medium (such as solder, a sintered material, or an electrically conductive adhesive) along the repulsive structure is strongly inhibited or even deactivated. For example, the repulsive structure may be made of a material that has repulsive or non-wetting properties for the electrically conductive joining medium. For example, the repulsive structure may be a solder mask if the electrically conductive joining medium is a solder.

[0017] For example, the non-wetting properties of the repellent structure can be at least more pronounced than those of the surrounding housing material. It may be desirable for the repellent structure to be annularly closed in order to contain the electrically conductive connecting medium within an area defined by the fence-like, annularly closed repellent structure. However, in other embodiments, it may also be possible to configure the repellent structure not as a ring, but as one or more individual physical structures that act as a mechanical and chemical barrier for the electrically conductive connecting medium.

[0018] In the context of the present application, the term "electrically conductive connecting medium" can, in particular, refer to a material capable of conducting electric current, preferably also capable of conducting heat, and which additionally possesses properties for connecting the substrate to an electronic component and / or to a mounting structure, such as a heat sink and / or a mounting plate (such as a printed circuit board, PCB). Examples of the electrically conductive connecting medium are a solder, a sintering paste, and / or an electrically conductive adhesive (for example, an adhesive containing metal particles). The connecting medium can be a material that can be configured to connect, preferably mechanically and electrically, different components to one another.Such a bonding medium can be fluid during processing and can be made solid (especially permanently) by hardening, curing, or similar processes. Examples of bonding media include solder, adhesives, assembly adhesives, or even sinterable or semi-sinterable materials.

[0019] In the context of the present application, the term "electronic device" may, in particular, refer to a device with electronic functionality and which may comprise a housing with one or more electronic components and a support, as well as one or more exposed electrically conductive structures (such as pads, terminals, wires, etc.). The electronic device may have a mounting base that supports the housing and / or may have a heat sink mounted on the housing, i.e., at least one mounting structure.

[0020] In the context of the present application, the term "mounting structure" can, in particular, refer to a structure that is electrically and / or mechanically and / or thermally coupled to the enclosure. For example, such a mounting structure may include a mounting base (which may be, for example, a printed circuit board (PCB)). The enclosure may be surface-mounted on the mounting base. Additionally or alternatively, the mounting structure may include a heat sink attached to the enclosure to dissipate heat generated by the enclosure, for example, primarily by the enclosure's at least one electronic component during operation.

[0021] In the context of the present application, the term "main surface" of a body can, in particular, refer to the largest surface of one of the largest surfaces of the body. For example, a body (such as a beam or an electronic component) may have two opposing main surfaces that are separated by body material in a thickness direction and connected to each other by a circumferential edge.

[0022] In one embodiment, the housing has a wettable coating (in particular a solderable coating) configured to be wettable by an electrically conductive connecting medium and arranged at least on a portion of a heat dissipation surface (in particular an outer heat dissipation surface, which may be planar) of the support facing away from the receiving volume. In other words, the wettable coating can be formed at least on a surface section of the support opposite the concave side of the support containing the receiving volume. In particular, the wettable coating can be formed on the heat dissipation surface, which may be an upper outer planar surface of the support. Advantageously, this can enable a soldered connection to be made between the heat dissipation surface and a heat sink, since the solder can properly wet the wettable coating.Advantageously, the repulsive structure can prevent a flowable, electrically conductive compound from flowing away from the heat dissipation surface, for example to an underside of the carrier.

[0023] In the context of the present application, the term "wettable coating" (such as a wettability layer) can, in particular, refer to a film or sheet with a surface property that promotes wetting by an electrically conductive compounding medium (such as solder or adhesive) applied to it (for example, one that is flowable during processing). Specifically, wetting can refer to the ability of an electrically conductive compounding medium to maintain contact with a solid surface of the wettable coating, resulting in particular from intermolecular interactions when the two are brought together. The degree of wetting can be referred to as wettability and can be determined by a balance of forces between adhesion and cohesion.

[0024] In one embodiment, the wettable coating also covers at least a portion of a substrate surface facing away from the heat dissipation surface and defining the receiving volume. Thus, a wettable coating can also be present on a concave surface of the substrate. Advantageously, this can enable a soldered connection to be made between the surface of the wettable coating on the substrate within the receiving volume and the electronic component to be mounted on the wettable substrate within the receiving volume.

[0025] In one embodiment, the wettable coating covers the entire outer surface of the substrate. This allows the wettable coating to be formed on the entire substrate surface using a single, common manufacturing process, such as plating, without the need for selective plating or structuring of the wettable coating. Thanks to the repellency of the wettable coating, a surface-covering wettable coating allows solder flow only in permitted areas, as the repellency acts as a mechanical and / or chemical barrier to such solder flow.

[0026] In one embodiment, the wettable coating is configured to wet a solder-like, electrically conductive connecting medium. Alternatively, the wettable coating can be configured to wet an electrically conductive adhesive or a sintered material.

[0027] In one embodiment, the wettable coating is a plating layer. A plating layer can be a layer that is at least partially formed by plating, for example, by depositing a metal onto a surface (for example, by electroless plating or sputtering). It is possible to perform the plating directly on the substrate, such as a conductor frame or a clip.

[0028] In one embodiment, the wettable coating has silver or consists of silver. Silver can have excellent wetting properties, allowing a solder to be distributed homogeneously over a silver surface. Advantageously, silver plating can provide better wetting than other materials (such as copper).

[0029] In one embodiment, the wettable coating comprises silver and / or nickel. In particular, the coating can be a double layer, having a nickel layer on the underside of the substrate and a silver layer on top of the nickel layer. Nickel is solderable, hard, and color-retaining. Silver is also solderable, reduces the risk of copper migration, can prevent nickel from oxidizing, and exhibits excellent wetting properties. In short, a wettable coating comprising silver and nickel can form an excellent solderable film.

[0030] In another embodiment, the wettable coating comprises one of the group consisting of or comprising palladium, gold, titanium, nickel and NiP.

[0031] Although the materials of the wettable coating mentioned in the preceding paragraphs may be preferred choices, the wettable coating can be formed from any material with an affinity for an implemented electrically conductive connecting medium (in particular a solder).

[0032] In one embodiment, the repelling structure is formed at least on at least a portion of each of two opposing rails of the carrier. If it is formed at least partially on the rails, unwanted bleed-out, creeping, or flow of a fluid, electrically conductive compound from the top to the bottom of the carrier across the rails can be reliably prevented.

[0033] In one embodiment, the repelling structure has a closed, annular form. According to such a preferred embodiment, the repelling structure can form a circumferentially closed ring that prevents unintentional leaching, creeping, or flowing of a free-flowing, electrically conductive compound from the spatial area bounded by the annular structure or ring. Complete circumferential protection against unwanted spreading of a free-flowing, electrically conductive compound can thus be ensured.

[0034] In one embodiment, the repelling structure includes a solder mask. A solder mask can be a strip, band, or layer of an ink, polymer, paste, laminate, lacquer, or any other dielectric material applied to a surface to prevent solder bleeding or the formation of solder bridges. A solder mask can also serve to prevent oxidation. For example, a solder mask can be based on an epoxy resin. The repelling structure can also be designed as an epoxy mask.

[0035] In one embodiment, the repelling structure is arranged on the wettable coating. If the repelling structure is formed directly on the wettable coating, a flowable, electrically conductive compound (for example, molten solder) flowing along the path of a wettable coating can be directly stopped by the chemical and mechanical barrier in the form of the repelling structure.

[0036] In one embodiment, the repelling structure is arranged on an outer surface of a transition section between a (preferably planar) outer heat-dissipating surface of the support and an inner surface of the support that defines the receiving volume. In such a preferred configuration, the entire area of ​​the (preferably flat) outer heat-dissipating surface adjacent to the transition section (preferably a chamfered, stepped, or vertical edge section of the support) can remain available for heat dissipation, for example, for brazing a heat sink onto it. Furthermore, when arranged on the transition section, the repelling structure can be spatially recessed and thus adequately protected from damage.

[0037] In one embodiment, the transition section of the support is curved and / or stepped. For example, the transition section can have a plurality of steps and / or a plurality of curved sections and can also have one or more horizontal platforms. This curved and / or stepped configuration of the transition section allows its interior to laterally define the receiving volume, while its exterior can serve as a support surface for the repelling structure.

[0038] In one embodiment, the repulsive structure is arranged on a platform (which may be a horizontal platform), in particular on an upper platform (preferably on a topmost platform), of the transition section, which is recessed downwards with respect to the heat dissipation surface (see, for example, Fig. 2) According to such a preferred embodiment, the entire heat dissipation surface remains available for heat dissipation purposes, while the repelling structure can nevertheless be formed very close to the upper main surface of the support in order to reliably prevent or limit the flow of a flowable, electrically conductive joining medium from this area. In other words, solder flow can be spatially confined to the heat dissipation surface, and the flow of molten solder to the lower part of the transition area can also be prevented by the repelling structure.

[0039] In one embodiment, the repulsive structure extends from the upper (or topmost) platform to and including (in particular partially or completely) a lower (or bottommost) platform of the transition section (see, for example, Fig. 4) Such a spatially extended configuration of the repulsive structure, and its corresponding complex shape extending between different platforms and thus different height levels of the transition section, creates a complicated and elongated flow path that makes it almost impossible for a flowable, electrically conductive connecting medium to pass through this complex mechanical and chemical barrier. Furthermore, the barrier can also be complex enough to prevent or at least inhibit unwanted creep of moisture or similar substances along the transition section.

[0040] In one embodiment, the repulsive structure is arranged on a planar region of the heat dissipation surface (see, for example, Fig. 6) For example, the repulsive structure can form a ring extending along the upper outer surface of the support. Such a configuration allows for particularly simple fabrication of the repulsive structure on an easily accessible planar surface area. To maximize the heat dissipation surface of the support, the repulsive structure can then be formed along an outer circumference of the planar heat dissipation surface.

[0041] In one embodiment, the electronic component has at least one connection to the carrier on a main surface on which the electronic component is mounted on the carrier. It is also possible that a plurality of connections to the carrier are provided.

[0042] In one embodiment, the electronic component has at least one exposed connection facing away from the support, for example, a plurality of exposed connections. For example, the exposed connections can be arranged next to each other.

[0043] It is also possible that the electronic component has connections on both of its opposite main surfaces. For example, the electronic component could be a semiconductor die that experiences a vertical current flow between connections on both of its opposite main surfaces during operation.

[0044] In one embodiment, the carrier is can-shaped and / or has two opposing rails (see, for example, Fig. 8 and Fig. 9) Based on such a carrier, a DirectFET package can be created. ® -type are manufactured.

[0045] In one embodiment, the support has a ladder frame structure, a clip and / or a curved metal plate.

[0046] In the context of the present application, the term "conductor frame structure" can, in particular, refer to a sheet-like metal structure that may be bent, stamped, and / or textured to form conductor frame structures as mounting sections for mounting chips. In one embodiment, the conductor frame can be a metal plate (made, in particular, of copper or a copper-containing alloy) that may be bent and / or textured. Forming the support as a conductor frame structure is a cost-effective and mechanically and electrically very advantageous configuration that combines a low-resistance connection of chips with robust support capability of the conductor frame structure.Furthermore, a conductor frame structure can contribute to the thermal conductivity of the housing and dissipate heat generated during chip operation due to the high thermal conductivity of the metallic (especially copper) material of the conductor frame structure. In the context of the present application, the term "clip" can, in particular, refer to a three-dimensionally curved connecting element comprising an electrically conductive material, such as copper, and being an integral body with sections to be connected to chip terminals and / or a mounting base.

[0047] In one embodiment, the housing is configured as a discrete enclosure. In particular, the enclosure can contain a single electronic component. In another embodiment, however, the enclosure can contain a plurality of electronic components mounted on the same substrate. Thus, the enclosure can also contain a plurality of semiconductor components mounted within the receiving volume. Therefore, the enclosure can contain one or more semiconductor components (for example, at least one passive component, such as a capacitor, and at least one active component).

[0048] In one embodiment, the housing is configured as a non-encapsulated housing. Thus, the housing can be free of an encapsulating material. Alternatively, the housing can include an encapsulating material, such as a molding compound.

[0049] In one embodiment, the package is configured as a power package. For example, the package is configured as a semiconductor power package. For example, an exemplary embodiment of the package could be an intelligent power module (IPM). Another exemplary embodiment of the package is a dual inline package (DIP). For example, such a DIP could have multiple leads on the can-shaped carrier. For example, the can could be placed over and insulated from the leads of the DIP.

[0050] In one embodiment, the electronic component is a power semiconductor chip. Thus, the semiconductor component (such as a semiconductor chip) can be used for power applications (for example, in the automotive sector) and can, for example, include at least one integrated insulated-gate bipolar transistor (IGBT) and / or at least one transistor of another type (such as a MOSFET, a JFET, etc.) and / or at least one integrated diode. Such integrated circuit elements can, for example, be manufactured using silicon technology or be based on wide-bandgap semiconductors (such as silicon carbide or gallium nitride). A semiconductor power chip can include one or more field-effect transistors, diodes, inverter circuits, half-bridges, full-bridges, drivers, logic circuits, other components, etc.

[0051] In one embodiment, the electronic component features a monolithically integrated transistor, in particular a field-effect transistor. Other transistors are possible, for example a bipolar transistor.

[0052] In one embodiment, the electronic device has an electrically conductive connecting medium that electrically connects the housing to the mounting structure. For example, the electrically conductive connecting medium comprises solder, a sintered material, and / or an electrically conductive adhesive.

[0053] In one embodiment, the electrically conductive connecting medium comprises a solder. In the context of the present application, the term "solder" can refer to a solderable material that can be soldered to create an electrically conductive solder joint between different components. For example, such a solder structure can be a film or layer of solder, or it can be a solder bump. For instance, it is possible to use a solder paste containing lead-based or bismuth-based solder materials. It is also possible to use a solder structure containing tin.

[0054] In one embodiment, the electrically conductive joining medium comprises an assembly adhesive, for example, an electrically conductive adhesive. It is also possible for such an assembly adhesive to be a die-fixing paste. The assembly adhesive can also be any resin-based assembly adhesive, including semi-sintered and sintered materials. With regard to hybrid and semi-sintered materials, a suitable paste can be a partial adhesive and partial sintered paste, for example, a silver-filled adhesive. Thus, an assembly adhesive can be resin-based, while pure sintered products can be solvent-based. They can be handled using the same or similar methods as other die-fixing adhesives. Therefore, any resin-based die-fixing or assembly material can be used as the joining medium.For example, the assembly adhesive can be epoxy-based or based on acrylic, silicone, bismaleimide (BMI) and / or hybrid materials.

[0055] In one embodiment, the mounting structure includes a heat sink mounted on a heat-dissipating surface of the support. In the context of the present application, the term "heat sink" can, in particular, refer to a highly thermally conductive body that may be thermally coupled to the exposed support of the housing in order to dissipate heat generated by the electronic component(s) during operation of the housing. For example, the heat sink may be made of a material having a thermal conductivity of at least 10 W / mK, in particular at least 50 W / mK, even up to 400 W / mK or even higher. For example, the heat sink may be made of an electrically conductive material such as copper, an alloy of copper and / or aluminum, or it may also be a ceramic material. The heat sink may be thermally coupled to the support directly or indirectly, for example by a solder.For example, the heat sink can consist of a thermally conductive body (such as a metal plate) with numerous cooling fins extending from it. Additionally or alternatively, liquid and / or gas cooling can also be achieved through a heat sink. Thermal coupling of the housing to a heat sink can ensure efficient cooling.

[0056] In one embodiment, the mounting structure includes a mounting base, for example, a laminate board, on which the carrier and / or the electronic component is / are mounted. For example, the mounting base can be a printed circuit board (PCB), an insulated metal substrate (IMS), a direct copper bond (DCB) substrate, or an active metal bond (AMB) substrate. Alternatively, another type of laminate carrier can be implemented as the mounting base instead of a printed circuit board.

[0057] For example, the housing can be positioned between a mounting base and a heat sink. Rails of the carrier can be soldered to the mounting base. It is also possible for an exposed main surface of the electronic component, mounted within the carrier's receiving volume, to be soldered to a mounting base. Thus, the mounting base can form the bottom body of the electronic device. A heat sink can be soldered to the upper main surface of the carrier, facing away from the receiving volume, and can therefore form the top body of the electronic device.

[0058] In one embodiment, the method involves forming the repulsive structure by printing, for example, inkjet printing or 3D printing, optionally followed by curing. In this way, the repulsive structure can be produced simply and precisely. Furthermore, using inkjet printing, it may also be possible to increase the thickness of the coating by applying multiple layers.

[0059] A semiconductor substrate, particularly a silicon substrate, can be used as the substrate or wafer that forms the basis of the semiconductor component(s). Alternatively, a silicon oxide or another insulator substrate can be provided. It is also possible to implement a germanium substrate or a III-V semiconductor material. For example, exemplary embodiments can be implemented using GaN or SiC technology.

[0060] The above and other tasks, features and advantages will become apparent from the following description and the attached claims in conjunction with the attached drawings, in which identical parts or elements are designated by the same reference numerals. Brief description of the drawings

[0061] The accompanying drawings, which are included to provide a further understanding of exemplary embodiments and form part of the description, illustrate exemplary embodiments.

[0062] The drawings show: Fig. 1 A cross-sectional view of an electronic device with a housing according to an exemplary embodiment. Fig. 2 a cross-sectional view of the housing of the electronic device according to Fig. 1. Fig. 3 a top view of the housing according to Fig. 2. Fig. 4 a cross-sectional view of a housing according to a further exemplary embodiment. Fig. 5 a top view of the housing according to Fig. 4. Fig. 6 a cross-sectional view of a housing according to a further exemplary embodiment. Fig. 7 a top view of the housing according to Fig. 6. Fig. 8 a three-dimensional top view of a support with a recessed receiving volume of a housing according to a further exemplary embodiment. Fig. 9 a three-dimensional underside view of the carrier with the receiving volume of the housing according to Fig. 8. Fig. 10 a flowchart of a method for manufacturing a housing according to an exemplary embodiment. Detailed description

[0063] The representation in the drawing is schematic and not to scale.

[0064] Before exemplary embodiments are described in more detail with reference to the figures, some general considerations are summarized on the basis of which exemplary embodiments were developed.

[0065] A DirectFET ® The package can have a can-shaped metallic substrate that supports at least one surface-mounted electronic component, such as one or more power MOSFET devices. Solderable contacts on the surface of the silicon chip can be provided for connecting the gate and source to a printed circuit board (PCB). A copper clip attached to the back of the chip can provide the drain connection.

[0066] A conventional DirectFET ®The package can be provided with a silver coating only on its underside or inner surface to facilitate silver-epoxy adhesion. For example, a Ni / Ag coating can be applied to the inner surface of the substrate. This can promote proper mounting of the electronic component onto the substrate. However, silver is kept away from the top surface of the substrate to prevent tarnishing and excessive potential for silver migration.

[0067] According to an exemplary embodiment, a housing (which may be of a non-encapsulated type) can have a (for example, metallic) carrier that has a receiving volume on its front or underside for receiving an electronic component (for example, a semiconductor chip). Advantageously, a (for example, annular) repellent structure can be provided as a barrier for repelling an electrically conductive connecting medium and can be formed on an outer surface section of the back of the carrier facing away from the receiving volume. Preferably, the repellent structure for repelling an electrically conductive connecting medium can be a solder mask for repelling solder.Consequently, an electrically conductive joining medium (such as solder), which might be used to connect a heat sink or other mounting structure on the back of the substrate, can be reliably prevented from wetting a front surface section of the substrate where the electronic component can be mounted. As a result, good electrical reliability can be achieved, since the repelling structure helps to keep the electrically conductive joining medium only in the targeted areas. At the same time, proper heat dissipation can be ensured by allowing a heat sink to be soldered to the back of the at least partially metallic substrate. This can lead to excellent package performance.For example, the described housing can advantageously allow a heat sink to be soldered to the rear of the carrier, while reliably preventing unintentional solder flow to the front with the electronic component mounted in the receiving volume.

[0068] According to an exemplary embodiment, a repellent structure configured as a solder mask can be applied to a wettable coating to form a silver backside enclosure with protection against solder bleed. For example, such a solder mask can enable a solder joint of a heat sink, which may be connected on the backside of the substrate, facing away from the mounting side of the electronic component. Advantageously, it may be possible, in particular, to implement a silver-backed DirectFET. ®-Type housing with a repellent structure that serves as a solder keep-out zone to allow soldering (for example, of a heat sink) to the back of a can-shaped carrier.

[0069] To promote the transfer of heat through the top surface of a DirectFET ®A heat sink can be added to the package. Using a non-electrically conductive TIM (thermal interface material) for this is a conventional option, although thermal coupling may be limited by the low thermal conductivity of the TIM. Soldering the heat sink to the can-shaped substrate top, however, can provide significantly better thermal conductivity and may therefore be highly preferred. With conventional approaches, however, this can lead to unwanted wetting of unintended surface areas of the substrate (for example, those facing the mounted electronic component) with solder, resulting in undefined or non-reproducible configurations that can cause electrical reliability issues.

[0070] According to an exemplary embodiment, a repelling structure, such as a solder mask, can be formed, for example, on the outer edge of the substrate, preferably directly on a wettable coating. This can reliably prevent a soldering medium—or more generally, an electrically conductive connecting medium—from wetting the substrate surface where it is not desired. Furthermore, this can prevent an electrically conductive connecting medium, such as soldering, from penetrating under the can-shaped substrate and flowing where it is not desired. Thus, the electrical reliability of the housing can be improved by providing the described repelling structure.

[0071] Simultaneously, this can offer the possibility of soldering a heat sink to the back of the substrate, as the repelling structure can prevent the solder from flowing into unwanted areas. This, in turn, can lead to a significantly improved thermal performance of the package due to the creation of a highly efficient heat flow path from the electronic component, through the substrate and the heat sink, to the surrounding environment of the electronic device. More efficient heat transfer allows the package to operate at a lower temperature, improving efficiency, and may require less energy for cooling. This can also contribute to a reduction in carbon dioxide emissions. With improved cooling, it can also enable increased operating currents, as the Joule heating from the device can be dissipated more effectively by the enhanced cooling made possible by exemplary embodiments.

[0072] In a preferred embodiment, the entire can-shaped support can be coated with nickel (Ni) and silver (Ag), which can be applied, for example, by plating. Although silver, and in particular a silver-nickel combination, may be preferred, other materials such as gold can also be used. This allows a heat sink to be soldered to the back of the can-shaped support itself to improve the overall heat capacity, while simultaneously enabling the mounting of an electronic component on the front of the support by soldering. To prevent solder from wetting the edges of the can-shaped support and beneath it, a repellent structure, such as a solder mask, can be provided, which in a preferred embodiment can be neatly integrated into the first bottom surface of the can.For example, the repelling structure, which can advantageously be implemented as a solder mask, can be output or printed. Thus, a key aspect of an exemplary embodiment may consist of coating the entire can with silver to enable sintering, silver-epoxy bonding, or soldering of a heat sink to the top of the can.

[0073] Therefore, to prevent unwanted sections of the substrate from being wetted by electrically conductive joining medium (especially solder), it can be very advantageous to provide a repellent structure, such as a solder mask, preferably at the edge of the can-shaped substrate. This solder mask can prevent solder from wetting above and below the substrate. The aforementioned positioning of the solder mask can ensure that it does not interfere with the appearance of the housing or the positioning of any optional laser marking. For example, the repellent structure of the solder mask type can be applied in a conductor frame form using a printing or inkjet process. This can contribute to an efficient, high-throughput manufacturing process on an industrial scale. Consequently, it may be possible to solder a heat sink to the top of the can-shaped substrate.To support this, it can be advantageous to add silver to the back of the housing with a solder mask on it.

[0074] Thus, an exemplary embodiment provides a package (such as a discrete package, for example, a field-effect transistor (FET) package) with a metal can-shaped carrier for the package. A silver coating (preferably a NiAg coating, which may be a double layer consisting of a bottom nickel layer and a top silver layer) on the rear of the package (which may correspond to the top of the can-shaped carrier) can advantageously be combined with a solder mask in the form of a solder resist-type repelling structure. Advantageously, attachment of a heat sink to the rear of the package can be enabled using an electrically conductive bonding medium, such as a silver-filled epoxy, a sinner, or a solder.

[0075] In a preferred embodiment, the repellent structure forming a solder stop zone can be produced by adding a solder mask to prevent overflow of solder material on the underside of the electronic component (in particular a die), thereby preventing tarnishing and excess silver migration.

[0076] Advantageously, a repelling solder mask-type structure in the form of a ring can be added, surrounding the first bottom surface of the can-shaped carrier, thereby maintaining the planarity of the structure. Advantageously, reducing (especially minimizing) the solder mask area can increase (especially maximizing) the cooling capacity of the enclosure. Furthermore, dual-sided cooling can be enabled with such an enclosure configuration.

[0077] Advantageously, a solder mask can be injection-molded to form a repelling structure to cover drain edges while preventing solder from migrating upwards to drain rails. In one embodiment, it may also be possible to injection-mold a solder mask-type repelling structure to cover only the back side of the substrate.

[0078] In short, a solder mask-type repellency structure can inhibit the migration of electrically conductive compound, such as solder, from the top of the substrate, down its sidewalls, and toward the electronic component. In other words, the repellency structure prevents parasitic creep of solder—or any other electrically conductive compound—into unwanted areas by providing a stopper—specifically a solder stopper—on the back of the substrate, which might be implemented as a conductor frame structure or a clip, for example. Simultaneously, the repellency structure can allow for the creation of a solder joint on the back of the substrate with a heat sink to improve thermal reliability.

[0079] Fig. Figure 1 illustrates a cross-sectional view of an electronic device 124 with a housing 100 according to an exemplary embodiment.

[0080] The illustrated electronic device 124 has the housing 100 and a mounting structure 126, which is composed of two separate components that are mounted on the top and bottom of the housing 100, respectively.

[0081] In particular, the upper component of the mounting structure 126 is designed here as a heat sink 130, which is mounted on a heat dissipation surface 110 of the housing 100. The heat sink 130 is configured for the efficient dissipation of heat from the top of the housing 100. In the embodiment shown, the heat sink 130 has a highly thermally conductive plate 150, which is thermally coupled to the top of the housing 100. A plurality of cooling fins 152 extend parallel to one another from the highly thermally conductive plate 150 and are integrally formed with it. The heat sink 130 can be made of a highly thermally conductive material such as copper, aluminum, or a ceramic. Other embodiments of the heat sink 130 are possible, for example, a water-cooling heat sink, a fan heat sink, a heat sink incorporating heat pipes, etc.

[0082] On one underside of the electronic device 124, another component of the mounting structure 126 is provided, which is designed as a mounting base 132, for example a laminated panel such as a printed circuit board (PCB) or an interposer. A carrier 102 and an electronic component 106 of the housing 100, which are described in more detail below, are mechanically and electrically mounted on the mounting base 132.

[0083] As shown, an electrically conductive connecting medium 128 electrically and mechanically connects the carrier 102 and the electronic component 106 of the housing 100. Furthermore, another electrically conductive connecting medium 127 electrically and mechanically connects the mounting base 132 of the mounting structure 126 to the carrier 102 and the electronic component 106. Specifically, the electrically conductive connecting medium 127 connects exposed pads 154 (such as copper pads) of the PCB-like mounting base 132 to exposed terminals 122, 123 on a lower main surface of the electronic component 106 of the housing 100 and connects further exposed pads 154 to the carrier 102. Similarly, another electrically conductive connecting medium 129 electrically and mechanically connects the carrier 102 of the housing 100 to the heat sink 130 of the mounting structure 126.In the illustrated embodiment, the electrically conductive joining medium 128 comprises, for example, a silver-filled epoxy or hybrid sintering paste or a diffusion solder joint. For example, the electrically conductive joining medium 129 can be a solder such as a SAC(Sn / Ag / Cu) alloy. For example, the electrically conductive joining medium 127 can be a different or the same solder. More generally, the electrically conductive joining medium 127, 128, 129 can be different or the same. For example, the electrically conductive joining medium 127 and / or 128 and / or 129 can be a solder, a sintering material (such as a sintering paste), and / or an electrically conductive adhesive (for example, an epoxy-based adhesive containing metal particles).The aforementioned connections, established by the electrically conductive connection media 127, 128, 129, ensure the mechanical integrity of the electronic device 124 as a whole. The lower connections, established by the electrically conductive connection medium 127, enable electrical signal transmission between the mounting base 132 and components of the housing 100, in particular the electronic component 106 and the support 102. The upper connection, established by the electrically conductive connection medium 129, creates a highly efficient thermal path from the electronic component 106 (which may be the main heat source during operation of the electronic device 124) through the support 102, through the heat sink 130, and from there to the surrounding environment of the electronic device 124.The intermediate electrically conductive connecting medium 128 can connect the electronic component 106 and the carrier 102, for example, to implement a die fastening.

[0084] Thus, the electrically conductive connecting media 127, 128, 129 can include the die-to-mount base material (reference numeral 127), the die fixing material (reference numeral 128), and the heat sink fixing material (reference numeral 129). Specifically, the die fixing material can be a silver-filled epoxy or hybrid sintered material or sintered material; the die-to-board fixing material can be a solder; and the heat sink fixing material can be a solder, for example, of a different or similar alloy. The heat sink fixing material can also be a sintered paste, etc.

[0085] In particular, a wettable coating 108 coats the entire outer surface of the carrier 102. By coating the entire outer surface of the carrier 102 with the wettable coating 108, the wettable coating 108 promotes a reliable solder joint through the electrically conductive connecting medium 128 in a receiving volume 104 between the electronic component 106 and the carrier 102, and on the underside of the carrier 102 with the mounting base 132. On the top side of the carrier 102, the wettable coating 108 promotes a reliable solder joint through the electrically conductive connecting medium 129 with respect to the heat sink 130. The coating 108 provides a surface that enables a reliable solder joint between the heat sink 130 and the carrier 102, while also providing a surface that enables a reliable die-fixing connection between the electronic component 106 and the carrier 102.The coating 108 can also enable a reliable soldered connection to be formed between the carrier 102 and the mounting base 132 (such as a substrate).

[0086] Advantageously, the wettable coating 108 is configured to wet an electrically conductive (for example, solder-like) joining medium 127, 128, 129. In particular, the coating 108 provides a wettable surface for soldering and a reliable surface for the adhesion of die fixing materials. As shown in Detail 160, the wettable coating 108 can be configured as a double layer comprising a first metal layer 156 and a second metal layer 158 on top of the first metal layer 156. For example, the first metal layer 156 can be a nickel layer. For example, the second metal layer 158 can be a silver layer. The outer surface of the wettable coating 108 can be configured to promote wetting by the electrically conductive joining medium 127, 128, 129, especially if it is configured as solder (for example, having tin).Thus, the wettable coating 108 ensures proper coating by the electrically conductive connecting medium 127, 128, 129 and therefore a very reliable connection between the various components of the electronic device 124, which is effected by the electrically conductive connecting medium 127, 128, 129.

[0087] The following section describes the construction of the housing 100 in more detail: In the embodiment of Fig. 1. The housing 100 has an electrically conductive support 102 configured to define a receiving volume 104 or cavity therein. For example, the support 102 can be a metal plate (made, for example, of copper, a copper alloy, aluminum, an aluminum alloy, or an aluminum-copper alloy) that is bent three-dimensionally to define the receiving volume 104 or the cavity for receiving an electronic component 106. The support 102 can be can-shaped with a central planar plate section surrounded by at least two opposing side walls, preferably four side walls, arranged along all four surrounding sides of the receiving volume 104. Fig. The carrier 102 is can-shaped and has two opposing rails 134, 136 (which can be called drain rails) extending laterally and downwards, defining a transition section 114. This transition section 114 can equip the carrier 102 with a spacer to, for example, slightly space the underside of the electronic component 106 from the mounting base 132 before a solder joint is made between them. For example, the carrier 102 can have a thickness D in the range of 100 µm to 500 µm, for example 250 µm. For example, the carrier 102 can be configured as a conductor frame structure (which can, for example, be separated as a can section from a conductor frame) or as a clip.

[0088] As already mentioned, the electronic component 106 is mounted on the carrier 102 and housed in the receiving volume 104. In the embodiment shown, the housing 100 contains only a single electronic component 106 and is a discrete housing. Although not shown, a housing 100 can also contain a plurality of electronic components 106 housed in the receiving volume 104. Thus, the housing 100 can also be a multi-chip housing. Fig. 1. The electronic component 106 can be a semiconductor chip manufactured, for example, using silicon or silicon carbide technology. The electronic component 106 can be a power semiconductor chip. For example, the electronic component 106 can be a metal-oxide-semiconductor field-effect transistor (MOSFET) chip. Alternatively, the electronic component 106 can be an insulated-gate bipolar transistor (IGBT) chip. As shown, the electronic component 106 has a plurality of exposed electrically conductive terminals 122, 123 on its underside and a terminal 120 connected to the substrate on its top side. For example, terminal 122 can be a gate terminal, terminals 123 can be source terminals, and terminal 120 can be a drain terminal of the field-effect transistor-type electronic component 106.Any other larger or smaller number of connections on the top and / or bottom of the electronic component 106 is possible in other embodiments. In the embodiment of . Fig. The lower terminals 122 and 123 are soldered to the mounting base 132, whereas the upper terminal 120 can be connected to the carrier 102. For example, the die mounting can be silver-filled epoxy, hybrid sintering paste, sintering paste, or diffusion soldering. In a DirectFET® application, the die mounting can be silver-filled epoxy. However, since the carrier 102 is also soldered to the mounting base 132, the upper terminal 120 is also electrically connected to the mounting base 132 via the carrier 102.

[0089] As already mentioned, the wettable coating 108, which covers the entire outer surface of the carrier 102, is very advantageous for ensuring efficient coating of the surface of the carrier 102 with electrically conductive compounding medium 127, 128, 129, preferably solder. In particular, the wettable coating 108 on the top side of the carrier 102 facing the heat sink 130 can be of the greatest advantage, as this makes it possible to connect the heat sink 132 to the carrier 102 by means of a highly thermally conductive and mechanically reliable solder joint. One consequence of this is excellent thermal performance of the housing 100. However, the excellent wettability of the wettable coating 108 can also lead to a pronounced tendency of the free-flowing, electrically conductive compounding medium 129 to flow into undesirable areas of the outer surface of the carrier 102.Without taking further measures, it is possible, in particular, for a flowable, electrically conductive connecting medium 129 (such as molten solder) to flow from the top to the bottom of the carrier 102. This can pose a risk of forming undesired electrically conductive paths and can unintentionally lead to a non-reproducible external appearance of the housing 100.

[0090] To suppress or even eliminate such undesirable phenomena, it has proven highly advantageous to provide a repellent structure 112 on a selected portion of the outer surface of the wettable coating 108 on the substrate 102. This repellent structure 112 is configured, in particular made of a specific material, and located in such areas of the wettable coating 108 as to be able to efficiently repel electrically conductive compounding medium 129. Specifically, the repellent structure 112 can prevent a flowable, electrically conductive compounding medium 129, which flows along the wettable coating 108, from passing through it, thus acting as a mechanical and chemical barrier to the flowable, electrically conductive compounding medium 129.For this purpose, the repelling structure 112 is arranged on a surface section of the carrier 102 facing away from the receiving volume 104. The repelling structure 112 can be a circumferentially closed ring surrounding the entire electrically conductive connecting medium 129, which is formed on the upper heat dissipation surface 110 and carries the heat sink 130. Since the receiving volume 104 is formed on a bottom side of the carrier 102, the repelling structure 112 is arranged on the top side of the carrier 102, opposite the bottom side. Preferably, the repelling structure 112 has a solder mask. As shown in . Fig. As shown in Figure 1, the repulsive structure 112 can be arranged directly on the wettable coating 108. For example, the repulsive structure 112 can be configured as a closed or ring-shaped structure. In one embodiment, the repulsive structure 112 can be formed by printing (for example, three-dimensional printing or inkjet printing).

[0091] Advantageously, the repulsive structure 112 of Fig. 1 arranged on an outer surface of a transition section 114 between the upper heat dissipation surface 110 of the support 102, where the support 102 is connected to the heat sink 130, and a lower surface of the support 102, which delimits the receiving volume 104. As in Fig. As shown in Figure 1, the transition section 114 of the support 102 can be formed by curved and stepped sections. Advantageously, the repelling structure 112 is arranged on an upper platform 116 of the transition section 114, which is recessed downwards with respect to the heat dissipation surface 110. This has advantages: First, arranging the repelling structure 112 on the transition section 114 does not reduce the area of ​​the heat dissipation surface 110 available for heat dissipation, in particular for mounting a heat sink 130 on it. This can ensure excellent thermal performance of the housing 100. Second, arranging the repelling structure 112 on the transition section 114 can prevent solder flowing downwards from the heat dissipation surface 110 along the transition section 114 from reaching the underside of the support 102 and, in particular, the receiving volume 104.As a result, the underside of the carrier 102 remains reliably free of creeping solder due to the described arrangement of the repelling structure 112. Thus, configuring the repelling structure 112 as an underside on the transition section 114 can maximize the upper cooling area of ​​the carrier 102 and can prevent solder creep from the top to the underside of the carrier 102.

[0092] In the embodiment of Fig. 1 A NiAg double layer is also applied as a wettable coating 108 to the top of the can-shaped support 102 to enable the heat sink 130 to be fixed by the electrically conductive connecting medium 129, which may be a solder, silver-filled epoxy or a sinter.

[0093] In addition to the wettable coating 108 made of NiAg, it can also be very advantageous to add a repellent structure 112 of the solder mask type to prevent solder material from flowing over from the underside of the electronic component 108 into the underside of the carrier 102.

[0094] Thus, in the embodiment of Fig. 1. A Ni / Ag coating is present on the outside of the can-shaped support 102 and on the inside of the can-shaped support 102. The additional solder mask, which forms the repellent structure 112, can prevent solder from being wetted downwards towards the inside of the can.

[0095] Fig. Figure 2 illustrates a cross-sectional view of the housing 100 of the electronic device 124 according to Fig. 1. Fig. Figure 3 illustrates a top view of the housing 100 according to Fig. 2.

[0096] As in Fig. As shown in Figure 3, the repelling structure 112 has a closed annular structure. By providing the repelling structure 112 as a circumferentially closed ring, the bleed-out of an electrically conductive connecting medium 129 (such as molten solder) along the entire circumference of the support 102 can be reliably prevented. This is particularly advantageous when the entire surface of the support 102 is coated with the wettable coating 108, as this can promote the flow of solder in any direction.

[0097] More precisely, according to Fig. 2 and Fig. 3 The repellent structure 112 (which is specifically designed as a solder mask) is provided as a ring surrounding the first underside of the transition section 114 of the can-shaped support 102. This combines reliable protection against solder bleed with a large area of ​​the heat dissipation surface 110 that is not limited by the repellent structure 112.

[0098] The repelling structure 112 of the solder mask type can be formed by inkjet printing and curing on the wettable coating 108. The can-shaped carrier 102 can be in the form of a conductor frame. By keeping the solder mask area sufficiently small and away from the heat dissipation surface 110, it is possible to increase the cooling capacity of the housing 100.

[0099] By arranging the repulsive structure 112 of the solder mask type on the lower part of the transition section 114, the planarity of the heat dissipation surface 110 is also maintained, which is fully usable for heat dissipation purposes, for example for connecting a heat sink 130 to it by soldering.

[0100] As from Fig. 2. The terminals on the lower main surface of the electronic component 106 can be covered with solder balls or solder bumps that form the electrically conductive interconnecting medium 127 on the underside of the electronic component 106. Between adjacent structures of the electrically conductive interconnecting medium 127, the underside of the electronic component 106 can be equipped with a structured, electrically insulating passivation layer 162. For example, the passivation layer 162 can be referred to as a chip-level solder mask.

[0101] Fig. 4 a cross-sectional view of a housing 100 according to a further exemplary embodiment. Fig. 5 a top view of the housing 100 according to Fig. 4.

[0102] The embodiment according to Fig. 4 and Fig. 5 differs from the embodiment of Fig. 2 and Fig. 3 in particular by the fact that according to Fig. 4 and Fig. 5 the repulsive structure 112 extends from the upper platform 116 of the transition section 114 to and including a lower platform 118 of the transition section 114. As in Fig. As shown in Figure 5, the repulsive structure 112 can be formed on the entire upper surface of both opposing rails 134, 136 of the support 102.

[0103] As in Fig. 4 and Fig. As shown in Figure 5, the repelling structure 112 can be injection molded of the solder mask type to also cover the drain edges, thus preventing solder from migrating upwards towards the drain rails 134, 136. The embodiment of Fig. 4 and Fig. 5 provides very reliable protection against solder bleed without affecting the area of ​​the heat dissipation surface 110. Thus, there is no reduction in the cooling surface capacity and no reduction in the planarity of the housing 100 with the embodiment of Fig. 4 and Fig. 5 occur. Apart from that, the embodiment of Fig. 4 and Fig. 5 to an increased and more complex moisture path, so that the repellent structure 112 can also protect the housing 100 from moisture creep.

[0104] Fig. 6 a cross-sectional view of a housing 100 according to a further exemplary embodiment. Fig. 7 a top view of the housing 100 according to Fig. 6.

[0105] The embodiment according to Fig. 6 and Fig. 7 differs from the embodiment of Fig. 2 and Fig. 3 in particular by the fact that according to Fig. 6 and Fig. 7 the repulsive structure 112 is arranged on an upper outer planar region of the heat dissipation surface 110 of the support 102. In other words, the repulsive structure 112 can be of Fig. 6 and Fig. 7 be formed on the same vertical plane as the heat dissipation surface 110.

[0106] Thus, the repulsive structure 112 can be injection molded using a solder mask type, covering only the back side of the carrier 102 and the wettable coating 108 on it. This can lead to a very simple application process for forming the repulsive structure 112.

[0107] Fig. Figure 8 illustrates a three-dimensional top view of a support 102 with a receiving volume 104 of a housing 100 according to a further exemplary embodiment. Fig. Figure 9 illustrates a three-dimensional underside view of the carrier 102 with recessed receiving volume 104 of the housing 100 according to Fig. 8. Fig. 8 and Fig. Figure 9 does not show an electronic component, but only the carrier 102.

[0108] Thus, the in Fig. 8 and Fig. The metallic supports 102 shown in Figure 9 provide a central can area 164 with a cavity-type receiving volume 104, which is surrounded by four stepped, beveled, or vertical side walls 166. Rod-shaped rails 134, 136 extend laterally outwards from two opposite side walls 166.

[0109] Fig. Figure 10 illustrates a flowchart 200 of a method for manufacturing a housing 100 according to an exemplary embodiment. The reference numerals used in the following description of the manufacturing method refer to the embodiments of Fig. 1 and Fig. 9.

[0110] Referring to a block 202, the method comprises: providing a carrier 102 that is at least partially electrically conductive and is designed to limit a receiving volume 104 therein.

[0111] Referring to block 204, the method involves: mounting an electronic component 106 on the carrier 102 and housing it at least partially in the receiving volume 104.

[0112] Referring to block 206, the method comprises: forming a repulsive structure 112 configured to repel an electrically conductive connecting medium 127, 128, 129.

[0113] Referring to a block 208, the method comprises: arranging the repulsive structure 112 on a part of a surface of the support 102 that faces away from the receiving volume 104.

[0114] In inkjet printing, the forming and arranging processes can be the same (for example, the material can be dispensed where it is blasted). However, in dip coating or spray coating, additional processes such as drying, exposure / development / firing can be performed to structure the solder mask. In this sense, steps 206 and 208 can be combined into one for inkjet printing.

[0115] It should be noted that the term "having" does not exclude other elements or features, and "a" or "a" does not exclude a plurality. Elements described in connection with different embodiments may also be combined. It should also be noted that reference numerals are not to be interpreted as limiting the scope of protection of the claims. Furthermore, the scope of protection of the present application is not to be limited to the specific embodiments of the process, machine, manufacture, composition, means, methods, and steps described in the description. Accordingly, the appended claims are intended to include such processes, machines, manufacture, compositions, means, methods, or steps within their scope of protection.

Claims

[1] A housing (100), comprising: • a carrier (102) that is at least partially electrically conductive and is designed to limit a receiving volume (104) therein; • an electronic component (106) mounted on the carrier (102) and at least partially housed in the receiving volume (104); and • a repulsive structure (112) configured to repel an electrically conductive connecting medium (129) and arranged on a portion of a surface of the support (102) facing away from the receiving volume (104). • a wettable coating (108) configured to be wettable by an electrically conductive connecting medium (127, 128, 129) and arranged at least on a part of a heat dissipation surface (110) of the support (102) facing away from the receiving volume (104). [2] The housing (100) according to claim 1, wherein the wettable coating (108) also coats at least a part of a surface of the carrier (102) which is facing away from the heat dissipation surface (110) and limits the receiving volume (104). [3] The housing (100) according to claim 1 or 2, wherein the wettable coating (108) coats an entire outer surface of the carrier (102). [4] The housing (100) according to any one of claims 1 to 3, wherein the wettable coating (108) is configured to wet a solder-like electrically conductive connecting medium (127, 128, 129). [5] The housing (100) according to any one of claims 1 to 4, wherein the wettable coating (108) comprises silver and / or nickel. [6] The housing (100) according to any one of claims 1 to 5, wherein the repulsive structure (112) is formed at least on at least one part of each of two opposing rails (134, 136) of the support (102). [7] The housing (100) according to any one of claims 1 to 6, wherein the repulsive structure (112) has a closed ring-shaped structure. [8] The housing (100) according to any one of claims 1 to 7, wherein the repulsive structure (112) comprises a solder mask. [9] The housing (100) according to any one of claims 1 to 8, wherein the repellent structure (112) is arranged on the wettable coating (108). [10] The housing (100) according to any one of claims 1 to 9, wherein the repulsive structure (112) is arranged on an outer surface of a transition section (114) between an, preferably planar, outer heat dissipation surface (110) of the support (102) and an inner surface of the support (102) that limits the receiving volume (104). [11] The housing (100) according to claim 10, wherein the transition section (114) of the support (102) is curved and / or stepped. [12] The housing (100) according to claim 10 or 11, wherein the repelling structure (112) is arranged on a platform, in particular on an upper platform (116), of the transition section (114) which is recessed downwards with respect to the heat dissipation surface (110). [13] The housing (100) according to claim 12, wherein the repulsive structure (112) extends from the upper platform (116) to and including a lower platform (118) of the transition section (114). [14] The housing (100) according to any one of claims 1 to 13, wherein the repulsive structure (112) is arranged on a planar region of the heat dissipation surface (110). [15] The housing (100) according to any one of claims 1 to 14, which has at least one of the following features: the electronic component (106) has at least one connection (120) connected to the carrier on a main surface on which the electronic component (106) is mounted on the carrier (102); The electronic component (106) has at least one exposed connection (122, 123) facing away from the carrier (102), for example a plurality of exposed connections (122, 123); the carrier (102) is can-shaped; the support (102) has two opposing rails (134, 136); the support (102) has a ladder frame structure, a clip and / or a curved metal plate; the housing (100) is configured as a discrete housing; The enclosure (100) is configured as a non-encapsulated enclosure; The enclosure (100) is configured as a power enclosure; the electronic component (106) is a power semiconductor chip; The electronic component (106) has a monolithically integrated transistor, in particular a field-effect transistor. [16] Electronic device (124) comprising: • a housing (100) according to any one of claims 1 to 15; and • a mounting structure (126) that is mounted to the housing (100). [17] The electronic device (124) according to claim 16, which has at least one of the following features: comprising an electrically conductive connecting medium (127, 129) that electrically connects the housing (100) to the mounting structure (126), wherein, for example, the electrically conductive connecting medium (127, 129) comprises a solder, a sintered material and / or an electrically conductive adhesive; wherein the mounting structure (126) has a heat sink (130) which is mounted on a heat dissipation surface (110) of the support (102); wherein the mounting structure (126) has a mounting base (132), for example a laminate panel, on which the carrier (102) and / or the electronic component (106) is / are mounted. [18] A method for manufacturing a housing (100), wherein the method comprises: • Providing a carrier (102) that is at least partially electrically conductive and is designed to limit a receiving volume (104) therein; • Mounting an electronic component (106) on the carrier (102) and housing it at least partially within the receiving volume (104); • Forming a repulsive structure (112) configured to repel an electrically conductive connecting medium (129); and • Arranging the repulsive structure (112) on a part of a surface of the support (102) that faces away from the receiving volume (104). • Forming a wettable coating (108) configured to be wettable by an electrically conductive connecting medium (127, 128, 129) and arranged at least on a part of a heat dissipation surface (110) of the support (102) facing away from the receiving volume (104). [19] The method according to claim 18, wherein the method comprises forming the repulsive structure (112) by printing, for example inkjet printing or three-dimensional printing, optionally followed by curing.

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