Method for producing an edge covering layer and device

DE102024202073A1Pending Publication Date: 2025-09-11ROBERT BOSCH GMBH
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Patent Information

Application Number
DE102024202073
Authority / Receiving Office
DE · DE
Patent Type
Applications
Current Assignee / Owner
Filing Date
2024-03-06
Publication Date
2025-09-11

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Abstract

Method (100) for producing an edge covering layer that is arranged in regions on a substrate that has a silicon layer with a Si(111) surface and a substrate core, wherein the substrate core is surrounded by at least one enveloping layer, comprising the steps of producing (110) an amorphous covering layer that envelops the substrate, wherein a surface of the covering layer suppresses crystalline growth of epitaxial AlxGa1-xN layers with long-range order and the covering layer represents a diffusion barrier for gallium in high-temperature processes, applying (120) a photoresist to the covering layer, producing (130) an etching mask by exposing the photoresist, and producing (140) an edge covering layer of the silicon layer by etching the covering layer in regions, in particular wet-chemically, wherein at least one lateral surface of the silicon layer is covered by the edge covering layer.
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Citation Information

Patent Citations

  • Substrates for group III nitride epitaxy

    DE102019116743A1

  • Wafer edge protection for crack-free material growth

    WO2017171755A1