Electronic circuit and method for producing an electronic circuit

Abstract

An electronic circuit (100) comprises a first printed circuit board (105), a second printed circuit board (110), and a connecting device (115). The first printed circuit board (105) has an outer side (118) and an inner side (120) opposite the outer side (118). The first printed circuit board (105) has at least one first conductor track (130) and / or at least one through-opening (190). The second printed circuit board (110) has an outer side (122) and an inner side (128) opposite the outer side (122). The second printed circuit board (110) has a second conductor track (135), wherein the inner side (128) of the second printed circuit board (110) faces the inner side (120) of the first printed circuit board (105). The connecting device (115) is arranged in a space (125) between the first printed circuit board (105) and the second printed circuit board (110).The connecting device (115) is designed to be removable and forms at least one connecting element (165) with a base (175) and an arc element (165) adjacent to the base (175). An underside of the base (174) is arranged on the inner side (128) of the second printed circuit board (110) of the electronic circuit (100). The arc element (165) is led at least partially through the through-opening (190) of the first printed circuit board (105) of the electronic circuit (100). Alternatively, an upper side of the arc element (165) is contacted on the inner side (120) of the first printed circuit board (105).

Description

[0001] The present invention relates to an electronic circuit and to a method for manufacturing an electronic circuit.

[0002] Parasitic stray inductances can occur in power electronics.

[0003] The document DE 10 2015 215 084 A1 discloses a seal for vias.

[0004] The document DE 10 2016 205 169 A1 discloses a method for producing a circuit (electronics), system and electrical connectors therefor.

[0005] The document DE 10 2016 218 788 A1 discloses a printed circuit board connection.

[0006] The document EP 1544954 A2 discloses various variants of a contact spring for an antenna amplifier.

[0007] The document US 2009 / 0190319 A1 discloses a three-dimensional module.

[0008] The document JP 2010-206 505 A discloses a piezoelectric device and a method for its manufacture.

[0009] Against this background, the present invention provides an improved electronic circuit and an improved method for manufacturing an electronic circuit according to the main claims. Advantageous embodiments emerge from the subclaims and the following description.

[0010] The advantages achievable with the approach presented here are, in particular, that an electronic circuit is created that can reduce stray inductance, in particular parasitic stray inductance.

[0011] An electronic circuit has a first circuit board, a second circuit board, and a connecting device. The first circuit board has an outer side and an inner side opposite the outer side. The first circuit board has a first conductor track and / or at least one through-opening. The second circuit board has an outer side and an inner side opposite the outer side. The second circuit board has a second conductor track, wherein the inner side of the second circuit board faces the inner side of the first circuit board. The connecting device is arranged in a space between the first circuit board and the second circuit board. The connecting device is detachable and forms at least one connecting element with a base and an arc element adjacent to the base. An underside of the base is arranged on the inner side of the second circuit board of the electronic circuit.The arc element is at least partially guided through the through-opening of the first printed circuit board of the electronic circuit.

[0012] The circuit boards can be manufactured cost-effectively and in large quantities. The connecting device can also be referred to as a board-to-board connector and, due to its shape, can reduce the height in the gap such that stray inductance can be reduced. The first circuit board and the second circuit board can, for example, be designed to be separable so that they can be separated without great effort. The connecting device can therefore be removable. A removable connecting device can significantly simplify assembly and disassembly. In addition, maintenance and repairs can be simplified. Adjustments to the populated components, for example of gate resistors, can also be made easier. The base can be soldered to the second circuit board, and the curved element can be soldered to the first circuit board.Alternatively, the top side of the arc element can be clamped to the inside of the first circuit board. The electronic circuit can enable a small overall size of the assembly through better space utilization. Furthermore, the electronic circuit can enable a small overall size of the assembly through a higher current carrying capacity of the connecting device, thus reducing the size of the connecting device.

[0013] The approach presented here can also be referred to as optimized, low-parasitic layouts using an interconnect device, which can also be referred to as pitch-optimized, detachable board-to-board connectors, and can also include concepts for this detachable interconnect device.

[0014] The approach presented here of an optimized, low-parasitic layout through the use of a pitch-optimized interconnect device can also be used for other substrate combinations, such as DBC (direct bonded copper), a connection technology that enables a close electrical / thermal connection via copper, and / or AMB (active metal brazed), a connection technology or a form of brazing in which metal and ceramic can be joined without metallization, and not only for PCBs in combination with IMS or other printed circuit boards.

[0015] The connecting device may comprise a metallic material. The metallic material may, in particular, be formed as an electrically conductive sheet. The metallic material may, for example, be copper sheet with or without a coating.

[0016] According to the invention, the connecting element is omega-shaped. The connecting element can be easily bent into the desired shape.

[0017] The connecting element can be molded in one piece. This allows the connecting element to be manufactured quickly and cost-effectively.

[0018] The connecting element can form at least one mechanical stop, in particular on an outer edge of the connecting element. For example, the first circuit board can rest on the stop. The stop can thus define the height between the circuit boards.

[0019] The connecting element can form a plurality of sections, in particular, wherein the sections can be pin-shaped or the connecting element can be comb-shaped. The distance between the sections can be identical. The sections can be designed, for example, as stops for the first circuit board, on which the first circuit board can rest. The sections can thus define the height between the circuit boards. The sections can better enable a good clamp connection or press connection because tolerances can be better compensated, thus increasing the contact area.

[0020] The connecting device can form a further connecting element with a further base and a further curved element adjacent to the further base. A further underside of the further base can be arranged on the inside of the second printed circuit board of the electronic circuit. The further curved element can be led at least partially through the through-opening or a further through-opening of the first printed circuit board of the electronic circuit. Alternatively, a further upper side of the further curved element can be contacted on the inside of the first printed circuit board. The further connecting element and the connecting element can be shaped identically and / or manufactured cost-effectively in large quantities.

[0021] A method for producing an embodiment of an electronic circuit mentioned herein comprises a providing step and an arranging step. In the providing step, the first circuit board, the second circuit board, and the connecting device are provided. In the arranging step, the connecting device is arranged between the circuit boards. The base of the connecting element is arranged on the second circuit board, wherein the curved element of the connecting element is at least partially guided through a through-opening of the first circuit board in order to produce the electronic circuit. The connecting element is formed in an omega shape. In the arranging step, the base can be arranged on the second circuit board using a surface-mounted technology method. The circuit boards can, for example, be designed to be separable so that they can be separated without great effort.This allows the connector to be removable. A removable connector can significantly simplify assembly and disassembly. Maintenance and repairs can also be simplified. Adjustments to the assembled components, such as gate resistors, can also be made easier.

[0022] The approach presented here further provides a device designed to perform, control, or implement the steps of a variant of a method presented here in corresponding devices. This embodiment of the invention in the form of a device also allows the problem underlying the invention to be solved quickly and efficiently.

[0023] A device can be an electrical device that processes electrical signals, for example, sensor signals, and outputs control signals depending on them. The device can have one or more suitable interfaces, which can be implemented in hardware and / or software. In a hardware implementation, the interfaces can, for example, be part of an integrated circuit in which functions of the device are implemented. The interfaces can also be separate integrated circuits or consist at least partially of discrete components. In a software implementation, the interfaces can be software modules that are present, for example, on a microcontroller alongside other software modules.

[0024] Also advantageous is a computer program product with program code that can be stored on a machine-readable medium such as a semiconductor memory, a hard disk memory or an optical memory and is used to carry out the method according to one of the embodiments described above when the program is executed on a computer or device.

[0025] The invention is explained in more detail by way of example with reference to the accompanying drawings. They show: Fig. 1 shows an illustration of an embodiment of an electronic circuit; Fig. 2 shows a representation of a stray inductance to explain an embodiment of an electronic circuit; Fig. 3 is a diagram of a connecting device for explaining an embodiment of an electronic circuit; Fig. 4 shows a diagram of a connecting device for explaining an embodiment of an electronic circuit; Fig. 5 is a diagram of a connecting device for explaining an embodiment of an electronic circuit; Fig. 6 is a diagram of a connecting device for explaining an embodiment of an electronic circuit; Fig. 7 is a diagram of a connecting device for explaining an embodiment of an electronic circuit; Fig. 8 is a diagram of a connecting device for explaining an embodiment of an electronic circuit; Fig. 9 is a diagram of a connecting device for explaining an embodiment of an electronic circuit; Fig. 10 is a diagram of an embodiment of an electronic circuit; Fig. 11 is a representation of an embodiment of an electronic circuit; Fig. 12 is a diagram of a connecting device for explaining an embodiment of an electronic circuit; Fig. 13 is a diagram of a connecting device for explaining an embodiment of an electronic circuit; Fig. 14 is a diagram of a connecting device for explaining an embodiment of an electronic circuit; Fig. 15 is a diagram of a connecting device for explaining an embodiment of an electronic circuit; Fig. 16 is a diagram of a connecting device for explaining an embodiment of an electronic circuit; Fig. 17 shows an illustration of an embodiment of an electronic circuit; Fig. 18 is a diagram showing a connecting device for explaining an electronic circuit; Fig. 19 is a diagram of a connecting device for explaining an electronic circuit; Fig. 20 is a diagram showing a connecting device for explaining an electronic circuit; Fig. 21 is a diagram showing a connecting device for explaining an electronic circuit; Fig. 22 is a diagram showing a connecting device for explaining an electronic circuit; Fig. 23 a representation of an electronic circuit; Fig. 24 is a flowchart of an embodiment of a method for manufacturing an electronic circuit; Fig. 25 is a block diagram of an embodiment of a control device for manufacturing an electronic circuit; Fig. 26 is a circuit diagram of an embodiment of an electronic circuit; and Fig. 27 a representation of an embodiment of an electronic circuit.

[0026] In the following description of preferred embodiments of the present invention, the same or similar reference numerals are used for the elements shown in the various figures and having a similar effect, whereby a repeated description of these elements is omitted.

[0027] Fig. 1 shows an illustration of an embodiment of an electronic circuit 100. More specifically, a longitudinal section through the electronic circuit 100 is shown.

[0028] The electronic circuit 100 comprises a first circuit board 105, a second circuit board 110 and a connecting device 115.

[0029] The first circuit board 105 has an outer side 118 and an inner side 120 opposite the outer side 118.

[0030] The second circuit board 110 has an outer side 122 and an inner side 128 opposite the outer side 122. The inner side 128 of the second circuit board 110 faces the inner side 120 of the first circuit board 105, with a gap 125 formed between the first circuit board 105 and the second circuit board 110. The connecting device 115, which has a small height h, is arranged in the gap 125. cc the electronic circuit 100.

[0031] The first circuit board 105, which may be referred to as a PCB, for example, has a first conductive trace 130, and the second circuit board 110, which may be referred to as an IMS, for example, has a second conductive trace 135. According to one embodiment, the second conductive trace 135 is arranged on the inner side 128 of the second circuit board 110, and the first conductive trace 130 is arranged on the inner side 120 of the first circuit board 105.

[0032] For example, a component 138 is arranged in the gap 125 between the circuit boards 105, 110. This component is designed, for example, as a snubber, which can also be referred to as a Csnubb. The component 138 is electrically contacted to the second conductor track 135.

[0033] According to a further embodiment, a further component 140 is arranged in the intermediate space 125. The further component 140 has, for example, a greater height than the component 138. The further component 140 is embodied, merely by way of example, as a transistor, more precisely as a semiconductor transistor and / or a high-side transistor, which can also be referred to as an HS transistor, wherein the further component 140 is electrically contacted with the second conductor track 135. A thermally conductive material 155, for example, is arranged between the further component 140 and the second conductor track 135.

[0034] According to a further embodiment, a third component 150 is arranged in the gap 125 between the first circuit board 105 and the second circuit board 110. The third component 150 is designed, merely by way of example, as a transistor and has an identical height to the further component 140. The third component 150 is designed, for example, as a low-side transistor and can be referred to, for example, as an LS transistor. A further thermally conductive material 160 is arranged, for example, between the third component 150 and the second conductor track 135.

[0035] The third component 150 is arranged, for example, adjacent to the further component 140, wherein the further component 140 is arranged merely by way of example between the component 138 and the third component 150.

[0036] According to one embodiment, the connecting device 115 forms two connecting elements 165, 168 with floors 175, 178 and arch elements 185, 188.

[0037] The connecting element 165 is arranged, for example, adjacent to the component 138 in the intermediate space 125, wherein the curved element 185 is pin-shaped and extends at least partially through a through-opening 190 of the first circuit board 105. An underside of the base 175 is arranged on the inner side 128 of the second circuit board 110 of the electronic circuit 100, merely by way of example on the second conductor track 135. For example, the base 175 is soldered to the second circuit board 110. The curved element 185 is, for example, soldered from above and / or electrically contacted or contactable to the first circuit board 105.

[0038] The further connecting element 168 is, for example, shaped identically to the connecting element 165, wherein the further connecting element 168 is arranged adjacent to the third component 150 in the intermediate space 125. The further base 178 of the further connecting element 168 is contacted to the second circuit board 110, and the further curved element 188 of the further connecting element 168 is at least partially guided through a further through-opening 195 of the first circuit board 105. The connecting elements 165, 168 are shaped identically merely by way of example.

[0039] The connecting device 115 is shown and illustrated in more detail in the following figures.

[0040] In an operational state of the electronic circuit 100, a current path 198 runs through the circuit boards 105, 110, which is shown only as an example by means of arrows. More precisely, the current path 198 runs through the conductor tracks 135, 135 and, according to the embodiment shown here, in a counterclockwise direction. The current path 198 runs through the connecting element 165 and through the further connecting element 168.

[0041] By arranging the connecting device 115 in the electronic circuit 100, the height h cc in the space 125, whereby the low height h cc leads to an advantageous geometry of the current path 198, which enables a low stray inductance.

[0042] In other words, when designing power electronics for fast-switching applications, such as a gallium nitride transistor, the correct layout design is a crucial aspect to consider. Fig. 1, parasitic stray inductances are reduced or prevented, whereby the switching behavior of the fast-switching power electronics remains unaffected.

[0043] Fig. Figure 1 shows a structure of a vertical commutation loop with bottom-cooled components 140, 150, which can also be referred to as transistors, with the connecting device 115, which can also be referred to as a board-to-board connector, and with the use of the first circuit board 105, which can also be referred to as a PCB, and the second circuit board 110, which can also be referred to as an IMS, i.e., an insulated metal substrate. Therefore, the height hcc The design is limited by the height of the tallest component, here the connecting device 115, which can also be referred to as a signal board-to-board connector, which is soldered to the second circuit board 110, and the minimum Lcc of the design is fixed. Dynamic switching tests of such designs show a slight influence of the stray inductance, which is also referred to as the fixed L cc can be described, on the switching behavior of the power electronics, which enormously improves their fast switching capability.

[0044] The connecting device 115 is optimized for a low-noise layout with a vertical commutation loop. The height h ccis advantageous for the design, and the distance between the two circuit boards 105, 110 can be less than three millimeters, less than two millimeters, and / or less than one millimeter to reduce the height hcc, which is required for a low-parasitic layout. The current carrying capacity is relatively high compared to the space requirement, thus also providing a high current density, which leads to significantly smaller and / or shorter plug-in distances. With the connecting device 115 presented here, it is possible to reduce the height h cc between the two circuit boards 105, 110 with a sufficiently precise tolerance when using the connecting device 115 as a spacer element. The connecting device 115, for example, is designed to be sufficiently small and thus meets the requirements for high-current applications.

[0045] The connecting device 115 is mounted, for example, using SMT (surface-mounted technology) on the second circuit board 110, which can also be referred to as an IMS board, or non-conductive connectors are mounted through the second circuit board 110, since otherwise the top and bottom of the second circuit board 110 would be electrically connected, which is to be avoided. The connecting device 115 sits self-positioning on the solder pad and does not float away during soldering.

[0046] The first circuit board 105 and the second circuit board 110 are designed to be separable, for example, so that they can be separated without great effort, and the connecting device 115, which can also be referred to as a connector, is therefore removable. A removable connecting device 115 significantly simplifies assembly and disassembly. Maintenance and repairs are also simplified. Adjustments to the mounted components, such as the gate resistors, during development are simplified.

[0047] Fig. 1 shows the novel solution of an optimized, low-parasitic layout using a distance-optimized connecting device 115. Thus, the first circuit board 105 can be arranged closer to the second circuit board 110, thereby optimizing the parasitic layout and improving the following aspects of the design: By reducing the height h cc, the parasitic stray inductance Lcc is significantly reduced. The reduced Lcc reduces parasitic influences on the fast switching behavior of the power electronics. By increasing the capable switching speeds, the switching losses of the power electronics are reduced and the efficiency of the electrical system is improved.

[0048] In addition, the current carrying capacity of the connecting device 115 is relatively high compared to the required space, resulting in significantly smaller or shorter connectors. This allows for better layout options and further improves the design. Furthermore, the height h cc between the two circuit boards 105, 110 with a sufficiently precise tolerance by using the spacer elements 165, 168 as connecting elements.

[0049] Fig. Figure 2 shows a representation of a stray inductance to explain an embodiment of an electronic circuit. It shows an optimized distance 200 of the connecting device, with the distance being merely 1.4 millimeters and a stray inductance of -6.4 nH. The distance 200 corresponds, for example, to the Fig. 1 shown height.

[0050] The improvements in drain-source voltage oscillations during turn-off are shown. By reducing the distance 200 between the two printed circuit boards, which can also be referred to as circuit boards, the stray inductance is reduced by more than half. While the distance was previously only 3.6 millimeters for an old signal board to the board terminals, the distance 200 is reduced in Fig. 2 to just 1.4 millimeters.

[0051] Fig. 3 shows a diagram of a connecting device 115 for explaining an embodiment of an electronic circuit. The connecting device 115 is similar to or corresponds to the connecting device of Fig. 1, except that the connecting device 115 has a different shape. The connecting device 115 can also be referred to as an Ω-bent-sheet connector.

[0052] The connecting device 115 forms the connecting element 165 with the base 175 and the curved element 185. The connecting element 165 is, by way of example only, at least partially parabolic or omega-shaped and designed to be inserted into the space of the electronic circuit, as is shown by way of example only in Fig. 6 is shown and described in more detail.

[0053] Fig. 4 shows a diagram of a connecting device 115 for explaining an embodiment of an electronic circuit. The connecting device 115 is similar to or corresponds to the connecting device of Fig. 3, except that the connecting device 115 is shown in frontal view.

[0054] Fig. 5 shows a diagram of a connecting device 115 for explaining an embodiment of an electronic circuit. The connecting device 115 is similar to or corresponds to the connecting device of Fig. 3 and / or Fig. 4, except that the connecting device 115 is shown in side view.

[0055] Fig. 6 shows a diagram of a connecting device 115 for explaining an embodiment of an electronic circuit. The connecting device 115 is similar to or corresponds to the connecting device of one of the previously described Fig. 3 to 5.

[0056] The connecting device 115 forms the connecting element 165 with the base 175 and the curved element 185. The connecting element 165 is, for example, formed in one piece, wherein the connecting element 165 forms at least one mechanical stop 600.

[0057] According to one embodiment, the connecting element 165 forms the mechanical stop 600 on an outer edge of the arch element 185. A further mechanical stop 605 is formed, for example, on another outer edge of the arch element 185.

[0058] In other words, the connecting device 115 can also be referred to as an Ω-spacer bent-sheet connector (Ω-D-BSC) and has mechanical stops 600, 605 on the outer edges, on which, for example, the first circuit board rests, and thus defines the distance or height between the circuit boards.

[0059] Fig. Figure 7 shows a diagram of a connecting device 115 for explaining an embodiment of an electronic circuit. The connecting device 115 is similar to or corresponds to the connecting device of Fig. 6, except that a section of the connecting device 115 is shown in side view. The mechanical stop 600 is thus clearly visible.

[0060] Fig. Figure 8 shows a diagram of a connecting device 115 for explaining an embodiment of an electronic circuit. The connecting device 115 is similar to or corresponds to the connecting device of one of the previously described Fig. 3 to 7, except that the connecting device 115 forms a plurality of sections 800.

[0061] The sections 800 are shaped, for example, in such a way that they form the connecting element 165 in a comb-like manner. The sections 800 are, for example, identically shaped and formed along the curved element 185. The sections 800 serve, for example, as stops for a printed circuit board.

[0062] In other words, the connecting device 115 can also be referred to as an Ω-spacer bent-pin-sheet connector (Ω-D-BPSC). The curved element 185, which can also be referred to as the contact side for the circuit board, is divided, for example, into individual pins or shorter sections 800 to increase the design options of the circuit board. This also enables mechanical stops between the sections 800 on which the circuit board rests, thus defining the distance or height between the circuit boards. Individual sections 800 also have the advantage that the clamp connection or press connection functions better because tolerances can be better compensated, thereby increasing the contact area.

[0063] Fig. Figure 9 shows a diagram of a connecting device 115 for explaining an embodiment of an electronic circuit. The connecting device 115 is similar to or corresponds to the connecting device of Fig. 8, except that a section of the connecting device 115 is shown in side view.

[0064] The sections 800 extend, for example, through the arched element 185 and terminate above the base 175. The first circuit board rests, for example, on the sections 800.

[0065] Fig. 10 shows an illustration of an embodiment of an electronic circuit 100. The electronic circuit 100 is similar or corresponds to the electronic circuit of Fig. 1, except that the connecting device 115 of the connecting device consists of one of the Fig. 3 to 9 resembles or corresponds.

[0066] The connecting device 115 forms the connecting element 165 and the further connecting element 168. The connecting elements 165, 168 are shaped similarly merely by way of example, more precisely, they are at least partially parabolic or omega-shaped.

[0067] The base 175 of the connecting element 165 is, for example, in contact with the second conductor track 135 of the second circuit board 110. The curved element 185 of the connecting element 165 protrudes at least partially through the through-opening 190 of the first circuit board 105. The connecting element 165 is arranged adjacent to the component 138.

[0068] The further connecting element 168 is arranged adjacent to the third component 150, wherein the further base 178 of the further connecting element 168 is in contact with the second conductor track 135 of the second circuit board 110. The further curved element 188 of the further connecting element 168 is at least partially guided out of the further through-opening 195 of the first circuit board 105.

[0069] The height h cc is correspondingly reduced due to the shape of the connecting elements 165, 168. The through openings 190, 195, for example, are electrically insulated.

[0070] In an operational state, the current path 198 runs, for example, counterclockwise through the conductor tracks 130, 135 and through the connecting elements 185, 188. More precisely, the current path runs through the spaces that the arc elements 185, 188 have due to their parabolic and / or omega-shaped shape.

[0071] In other words, the Fig. 3 to Fig. 10 the connecting device 115, which can also be referred to as Ω-Bent-Sheet-Connector (Ω-BSC, Ω-D-BSC) for a description of the connecting device 115, which can also be referred to as a distance-optimized board-to-board connection concept.

[0072] The connecting device 115 is made, for example, from an electrically conductive sheet, for example copper sheet with or without a coating, and is bent, for example, into the desired Ω shape. The connecting device 115 is soldered on one side, i.e., with the base 175, 178 flat onto the second circuit board 110, for example, together with the other components 138, 140, 150 using a vapor phase soldering process, and on the other side, i.e., the arc elements 185, 188 can be inserted through the through-openings 190, 195, which can also be referred to as elongated holes, see also Fig. 7, in the first circuit board 105 are contacted and clamped, i.e. pressed in or soldered from above.

[0073] Fig. 11 shows an illustration of an embodiment of an electronic circuit 100. The electronic circuit 100 is similar or corresponds to the electronic circuit of Fig. 10, except that a top view of the first circuit board 105 is shown. More specifically, for example, the through-openings 190, 195 are shown, through which the curved elements of the connecting device can be passed.

[0074] Fig. 12 shows a diagram of a connecting device 115 for explaining an embodiment of an electronic circuit. The connecting device 115 is similar to or corresponds to the connecting device from one of the previously described figures, except that the connecting device 115 has a different shape.

[0075] The connecting device 115 forms the connecting element 165 with the base 175 and the curved element 185. The connecting element 165 is omega-shaped.

[0076] Fig. 13 shows a diagram of a connecting device 115 for explaining an embodiment of an electronic circuit. The connecting device 115 is similar to or corresponds to the connecting device of Fig. 12, except that the connecting device 115 is shown in front view.

[0077] Fig. Figure 14 shows a diagram of a connecting device 115 for explaining an embodiment of an electronic circuit. The connecting device 115 is similar to or corresponds to the connecting device of Fig. 11 and / or Fig. 12, except that the connecting device 115 is shown in rear view.

[0078] Fig. 15 shows a diagram of a connecting device 115 for explaining an embodiment of an electronic circuit. The connecting device 115 is similar to or corresponds to the connecting device of one of the Fig. 12 to 14, except that the connecting element 165 forms a plurality of sections 800.

[0079] The connecting device 115 is similar or corresponds, for example, to the connecting device of Fig. 10, except that the connecting element 165 is omega-shaped.

[0080] The curved element 185, which can also be referred to as the contact side for the circuit board, is divided into individual, shorter sections 800 to increase the design options of the circuit board. Individual sections 800 also have the advantage that contacting by pressure on an electrically conductive outer layer of the circuit board works better because tolerances are better compensated, thus increasing the contact area.

[0081] Fig. Figure 16 shows a diagram of a connecting device 115 for explaining an embodiment of an electronic circuit. The connecting device 115 is similar to or corresponds to the connecting device of Fig. 15, except that a section of the connecting device 115 is shown in side view.

[0082] Fig. 17 shows an illustration of an embodiment of an electronic circuit 100. The electronic circuit 100 is similar or corresponds to the electronic circuit of Fig. 10, except that the connecting device 115 is arranged differently. The connecting device 115 is similar to or corresponds to the connecting device of one of the Fig. 12 to 16.

[0083] The connecting elements 165, 168 are arranged in the intermediate space 125 of the electronic circuit 100 such that a surface of the curved elements 185, 188 contacts the inner side 120 of the first circuit board 105. The first circuit board 105, for example, has no through-holes.

[0084] In an operational state, the current path 198 runs, for example, counterclockwise through the conductor tracks 130, 135 and through the connecting elements 185, 188. More precisely, the current path runs through the spaces that the arc elements 185, 188 have due to their omega-shaped configuration.

[0085] The connecting device 115 is made, for example, from an electrically conductive sheet, for example, copper sheet with or without a coating, and is bent, for example, into the desired Ω shape. The connecting device 115 is soldered flat on one side, i.e., with the base 175, 178, onto the second circuit board 110, for example, together with the other components 138, 140, 150 using a vapor-phase soldering process. On the other side, i.e., the arc elements 185, 188, are contacted by pressure with the inner side 120, which can also be referred to as the electrically conductive outer layer, of the first circuit board 105. Such a connection can be removed particularly easily because no solder is melted.

[0086] Fig. Figure 18 shows a diagram of a connecting device 115 for illustrating an electronic circuit. The connecting device 115 is similar to or corresponds to the connecting device from one of the previously described figures, with the exception that the connecting element 165 is at least partially C-shaped. The connecting device 115 can also be referred to as a C-bent pin sheet connector (C-BSC).

[0087] Fig. Figure 19 shows a diagram of a connecting device 115 for explaining an electronic circuit. The connecting device 115 is similar to or corresponds to the connecting device of Fig. 18, except that the connecting device 115 is shown in frontal view.

[0088] Fig. Figure 20 shows a diagram of a connecting device 115 for explaining an electronic circuit. The connecting device 115 is similar to or corresponds to the connecting device of Fig. 18 and / or Fig. 19, except that the connecting device 115 is shown in rear view.

[0089] Fig. Figure 21 shows a diagram of a connecting device 115 for explaining an electronic circuit. The connecting device 115 is similar to or corresponds to the connecting device of one of the Fig. 18 to 20, except that the connecting element 165 forms a plurality of sections 800.

[0090] The connecting device 115 is similar or corresponds, for example, to the connecting device of Fig. 10 and / or Fig. 16, except that the connecting element 165 is at least partially C-shaped.

[0091] The connecting device 115 can also be referred to as a C-bent pin sheet connector (C-BPSC). The curved element 185, which can also be referred to as the contact side for the circuit board, is divided into individual, shorter sections 800 to increase the design options of the circuit board. Individual sections 800 also have the advantage that contacting by pressure on an electrically conductive outer layer of the circuit board works better because tolerances are better compensated, thus increasing the contact area.

[0092] Fig. Figure 22 shows a diagram of a connecting device 115 for an electronic circuit. The connecting device 115 is similar to or corresponds to the connecting device of Fig. 22, except that a section of the connecting device 115 is shown in side view.

[0093] Fig. 23 shows a representation of an electronic circuit 100. The electronic circuit 100 is similar or corresponds to the electronic circuit of Fig. 15, except that the connecting device 115 is designed differently. The connecting device 115 is similar to or corresponds to the connecting device 115 of one of the Fig. 18 to 22.

[0094] The connecting elements 165, 168 are arranged in the intermediate space 125 of the electronic circuit 100 such that a surface of the curved elements 185, 188 contacts the inner side 120 of the first circuit board 105. The first circuit board 105, for example, has no through-holes.

[0095] In an operational state, the current path 198 runs, for example, counterclockwise through the conductor tracks 130, 135 and through the connecting elements 185, 188. More precisely, the current path 198 runs, for example, through the arc elements 185, 188.

[0096] In other words, the Fig. 18 to Fig. 23 the connecting device 115, which can also be referred to as C-bent sheet connector (C-BSC, C-BPSC) for a description of the connecting device 115.

[0097] The connecting device 115 is made, for example, from an electrically conductive sheet, for example, copper sheet with or without a coating, and is bent, for example, into the desired C-shape. The connecting device 115 is soldered flat on one side, i.e., with the base 175, 178, onto the second circuit board 110, for example, together with the other components 138, 140, 150 using a vapor-phase soldering process. On the other side, i.e., the curved elements 185, 188, are contacted by pressure with the inner side 120, which can also be referred to as the electrically conductive outer layer, of the first circuit board 105. Such a connection can be removed particularly easily because no solder is melted.

[0098] Fig. Figure 24 shows a flowchart of an embodiment of a method 2400 for manufacturing an electronic circuit. The electronic circuit is similar to or corresponds to the electronic circuit from one of the figures described above.

[0099] The method 2400 comprises a provision step 2405 and an arrangement step 2410. In provision step 2405, the first circuit board, the second circuit board, and the connecting device are provided. In arrangement step 2410, the connecting device is arranged between the circuit boards. The bottom of the connecting element is arranged on the second circuit board, with the curved element of the connecting element being at least partially guided through a through-opening of the first circuit board to produce the electronic circuit. Alternatively, a top side of the curved element is contacted to the inside of the first circuit board.

[0100] Fig. 25 shows a block diagram of an embodiment of a control device 2500 for producing an electronic circuit. The control device 2500 is designed to implement the method of Fig. 24 or a similar process.

[0101] For this purpose, the control device 2500 has a provision unit 2505 and a placement unit 2510. The provision unit 2505 is designed to provide the first circuit board, the second circuit board, and the connecting device. The placement unit 2510 is designed to arrange the connecting device between the circuit boards. The bottom of the connecting element is arranged on the second circuit board, wherein the curved element of the connecting element is at least partially guided through a through-opening of the first circuit board in order to produce the electronic circuit. Alternatively, an upper side of the curved element is contacted on the inside of the first circuit board.

[0102] Fig. 26 shows a circuit diagram of an embodiment of an electronic circuit 100. The electronic design of the electronic circuit 100 is similar to or corresponds to one of the figures described above.

[0103] The electronic circuit 100 has a first supply voltage terminal 2602 and a second supply voltage terminal 2604, wherein a capacitor 2606 is connected between the supply voltage terminals 2602, 2604.

[0104] The electronic circuit 100 comprises, for example, a bridge circuit unit 2600, which comprises a first half-bridge 2605 and a second half-bridge 2610. The first half-bridge 2610 comprises a first switch 2615 and a second switch 2620, wherein the switches 2615, 2620 are connected to one another via a tapping point 2625. The first switch 2615 represents a high-side switch, and the second switch 2620 represents a low-side switch; the switches 2615, 2620 are embodied as transistors.

[0105] The first switch 2615 represents the additional component 140, the second switch 2620 represents the third component 150. The electronic circuit 100 comprises, for example, a first comparator 2630 and a second comparator 2635. The first comparator 2630 is connected, for example, to the first switch 2615, with a first inductance 2640 connected between the first switch 2615 and the first comparator 2630. The second comparator 2635 is connected, for example, to the second switch 2620, with a second inductance 2645 connected between the second switch 2620 and the second comparator 2635.

[0106] The second switch 2620, together with the second inductance 2645 and the second comparator 2635, forms, for example, a gate loop 2650, which can also be referred to as a gate loop.

[0107] The second half-bridge 2610 has the component 138, wherein the component 138 represents a series circuit of a capacitor 2655 and a resistor 2660.

[0108] For example, a third inductance 2665, which can also be referred to as leakage inductance and / or Lcc, is connected between the first half-bridge 2605 and the second half-bridge 2610. In an operational state, the current path 198 runs as shown, for example, in Fig. 1, by the bridge circuit unit 2600 and forms a commutation loop 2670.

[0109] In other words, Fig. 23 are the most common parasitic stray inductances. In fast switching applications, the stray inductance Lcc of the 2670 commutation loop has the greatest influence on the switching behavior and can be reduced by a correct layout, as shown, for example, in the Fig. 1 is shown and described.

[0110] Fig. Figure 27 shows an illustration of an embodiment of an electronic circuit 100. The electronic circuit 100 is similar or corresponds to the electronic circuit from one of the figures described above. In other words, Fig. 27 a minimalist vertical commutation loop and its geometric parameters.

[0111] Shown is the current path 198, which runs along the first circuit board 105 and the second circuit board 110. All four parameters lcc, hcc, i.e., the height hcc, wcc, and tcc, have a direct influence on the total leakage inductance Lcc. The height hcc, which can also be referred to as the distance hcc, between the current paths 198 of the vertical commutation loop is significantly reduced to also reduce the corresponding leakage inductance Lcc.

[0112] For example, the parameter Icc represents the length of the electronic circuit 100, hcc represents the height of the electronic circuit 100, wcc the width and tcc the thickness.

[0113] The exemplary embodiments described and shown in the figures are selected only as examples. Different exemplary embodiments can be combined with each other in their entirety or with regard to individual features. Furthermore, one exemplary embodiment can be supplemented by features of another exemplary embodiment.

[0114] Furthermore, method steps according to the invention can be repeated and carried out in a different order than that described.

[0115] If an embodiment comprises an “and / or” link between a first feature and a second feature, this can be read such that the embodiment according to one embodiment has both the first feature and the second feature and according to another embodiment has either only the first feature or only the second feature. Reference symbol 100 electronic circuit 105 first circuit board 110 second circuit board 115 Connecting device 118 Outside of the first circuit board 120 Inside of the first circuit board 122 Outside of the second circuit board 125 space 128 Inside of the second circuit board 130 first conductor track 135 second conductor track 138 component 140 additional components 150 third component 155 Thermal conductive material 160 additional thermal conductive material 165 connecting element 168 additional connecting element 175 Bottom of the connecting element 178 further base of the further connecting element 185 Arch element of the connecting element 188 further arch element of the further connecting element 190 Through hole of the first circuit board 195 further through hole of the first circuit board 198 Power path 200 distance 600 mechanical stop 605 additional mechanical stop 800 Section 1600 gap 2400 Method for producing an electronic circuit 2405 Deployment step 2410 Arranging step 2500 Control device for producing an electronic circuit 2505 Unit for provision 2510 Unit for arranging 2600 bridge circuit unit 2602 first supply voltage connection 2604 second supply voltage connection 2605 first half bridge 2606 Capacitor 2610 second half bridge 2615 first switch 2620 second switch 2625 tapping point 2630 first comparator 2635 second comparator 2640 first inductance 2645 second inductance 2650 gate loop 2655 capacitor 2660 resistance 2665 third inductance 2670 Commutation loop Lcc leakage inductance lcc length wcc width hcc height tcc thickness

Claims

[1] Electronic circuit (100) having the following features: a first circuit board (105) having an outer side (118) and an inner side (120) opposite the outer side (118), wherein the first circuit board (105) has at least one first conductor track (130) and wherein the first circuit board (105) has at least one through-opening (190); a second circuit board (110) having an outer side (122) and an inner side (128) opposite the outer side (122), wherein the second circuit board (110) has a second conductor track (135), wherein the inner side (128) of the second circuit board (110) faces the inner side (120) of the first circuit board (105); and a connecting device (115) arranged in an intermediate space (125) between the first circuit board (105) and the second circuit board (110), wherein the connecting device (115) is designed to be removable and forms at least one connecting element (165) with a base (175) and an arc element (185) adjacent to the base (175), wherein an underside of the base (175) is arranged on the inside (128) of the second circuit board (110) of the electronic circuit (100), wherein the arc element (185) is at least partially led through the through-opening (190) of the first circuit board (105) of the electronic circuit (100), characterized by , that the connecting element (165) is omega-shaped. [2] Electronic circuit (100) according to claim 1, wherein the connecting device (115) comprises a metallic material, in particular wherein the metallic material is formed as an electrically conductive sheet. [3] Electronic circuit (100) according to one of the preceding claims, wherein the connecting element (165) is formed in one piece. [4] Electronic circuit (100) according to one of the preceding claims, wherein the connecting element (165) forms at least one mechanical stop (600), in particular on an outer edge of the connecting element (165). [5] Electronic circuit (100) according to one of the preceding claims, wherein the connecting element (165) forms a plurality of sections (800), in particular wherein the sections (800) are pin-shaped or form the connecting element (165) comb-like. [6] Electronic circuit (100) according to one of the preceding claims, wherein the connecting device (115) forms a further connecting element (168) with a further base (178) and a further arc element (188) adjacent to the further base (178), wherein a further underside of the further base (178) is arranged on the inner side (128) of the second printed circuit board (110) of the electronic circuit (100), wherein the further arc element (188) is at least partially led through from the through-opening (190) or a further through-opening (195) of the first printed circuit board (105) of the electronic circuit (100) or wherein a further upper side of the further arc element (188) is contacted on the inner side (120) of the first printed circuit board (105). [7] A method (2400) for manufacturing an electronic circuit (100) according to any one of claims 1 to 6, wherein the method (2400) comprises the following steps: Providing (2405) the first circuit board (105), the second circuit board (110) and the connecting device (115); and Arranging (2410) the connecting device (115) between the printed circuit boards (105, 110), wherein the base (175) of the connecting element (165) is arranged on the second printed circuit board (110), wherein the curved element (185) of the connecting element (165) is at least partially guided through a through-opening (190) of the first printed circuit board (105) in order to produce the electronic circuit (100), wherein the curved element (185) is at least partially guided through the through-opening (190) of the first printed circuit board (105) of the electronic circuit (100), characterized by , that the connecting element (165) is formed in an omega shape. [8] Control device (2500) which is designed to carry out and / or control the steps of the method (2400) according to claim 7 in corresponding units (2505, 2510). [9] Computer program product with program code for carrying out the method (2400) according to claim 7, when the computer program product is executed on a control device (2500). [10] A machine-readable storage medium on which the computer program product according to claim 9 is stored.

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