Multisensor module and electronics module

Abstract

A multisensor module is provided for use in an electronic module, comprising: an AC busbar with a constriction at a predetermined position; a sensor board arranged on one side of the AC busbar, wherein a current sensor is arranged on one side of the sensor board facing away from the AC busbar; and at least one first temperature sensor and at least one second temperature sensor, both arranged at predetermined positions, are positioned on one side of the sensor board facing the AC busbar. Furthermore, the multisensor module has an electrically insulating casing that surrounds and secures predetermined sections of the AC busbar and sensor board, encompassing the current sensor but not the temperature sensors.The sensor board is furthermore shaped and positioned on the AC power rail in such a way that the current sensor is positioned above the narrowing of the AC power rail.

Description

[0001] The present invention relates to the field of electromobility, in particular to electronic modules for an electric drive.

[0002] The use of electronic modules, such as power electronic modules, in motor vehicles has increased significantly in recent decades. This is due, on the one hand, to the need to improve fuel efficiency and vehicle performance, and on the other hand, to advances in semiconductor technology. The main component of such an electronic module, also known as a power electronic module, is a DC / AC inverter, which supplies electrical machines such as electric motors or generators with multiphase alternating current (AC). In this process, direct current generated by a DC energy source, such as a battery or accumulator, is converted into multiphase alternating current.For this purpose, inverters comprise a variety of electronic components used to implement bridge circuits (such as half-bridges), for example, semiconductor power switches, also known as power semiconductors. A DC / DC converter may also be present in the power electronics. The electronic module is in signal communication with an electronic control unit, also known as an ECU (electronic control unit). The control unit is connected to, or part of, the vehicle's control units and receives control signals and / or information based on, for example, driving behavior or signals from other control units. A bidirectional signal exchange takes place via the control unit, meaning that information is transmitted from the electronic module and / or the vehicle's control units to the control unit, and the control unit then controls the electronic module, particularly the inverter.

[0003] While existing electronic modules are modular in that inverter bridge circuits can be added to increase performance or omitted, there is still a need for optimization in various areas, such as saving space, improving measurement accuracy and vibration resistance, or simplifying assembly.

[0004] DE 10 2023 205 407 A1 shows a base plate and a single-phase module of an inverter, an inverter and power electronics.

[0005] The invention is therefore based on the objective of providing an improved electronic module.

[0006] This task is solved by the features of independent claims. Advantageous embodiments are the subject of dependent claims.

[0007] A multisensor module is provided for use in an electronic module, comprising: an AC busbar with a constriction at a predetermined position; a sensor board arranged on one side of the AC busbar, wherein a current sensor is arranged on one side of the sensor board facing away from the AC busbar; and at least one first temperature sensor and at least one second temperature sensor, both arranged at predetermined positions, are positioned on one side of the sensor board facing the AC busbar. Furthermore, the multisensor module has an electrically insulating casing that surrounds and secures predetermined sections of the AC busbar and sensor board, encompassing the current sensor but not the temperature sensors.The sensor board is furthermore shaped and positioned on the AC power rail in such a way that the current sensor is positioned above the narrowing of the AC power rail.

[0008] In one embodiment, the temperature sensors are arranged on the sensor board in such a way that, after mounting on the remaining components of the electronic module, they are positioned above a predetermined semiconductor package or above a base plate.

[0009] Furthermore, an electronic module comprising an inverter is provided, comprising a base plate and semiconductor packages arranged thereon in the form of at least one high-side module and a low-side module opposite the high-side module, wherein the semiconductor packages are arranged such that their AC terminals face each other, a DC negative busbar and a DC positive busbar arranged thereon on the base plate, wherein external terminals of the DC busbars protrude on a first side of the electronic module, and the semiconductor packages are electrically contacted with DC terminals of the DC busbars via their respective electrical terminals, and wherein at least the DC positive busbar is provided with electrical insulation in areas outside its terminals, and a multisensor module arranged such that it is arranged on a partial area of ​​the electrical insulation of the DC positive busbar.that the external connection of the AC power rail protrudes on one of the second sides of the electronics module opposite the first side, and the AC tap is contactable with the AC terminals of the semiconductor packages, and the first temperature sensor is positioned above a specified semiconductor package and the second temperature sensor is positioned above the base plate.

[0010] In one version, the multisensor module is attached to the electrical insulation of the DC positive busbar by hot crimping or clamping connections.

[0011] In one version, the electronic module also has a control board that is located above the multisensor module and is connected to it via a flexible cable for signal transmission.

[0012] In one embodiment, the electrical insulation of the DC-Plus busbar is formed in two parts in such a way that it encloses predetermined areas of the DC-Plus busbar.

[0013] In one embodiment, the electrical insulation of the DC-plus busbar or the electrical insulation of the DC-plus busbar and the DC-plus busbar provide a feedthrough in areas where a temperature sensor is provided on the sensor board, such that the temperature sensor looks directly at a predetermined semiconductor package or at the base plate.

[0014] In one embodiment, the electrical insulation is formed in such a way that it extends from the semiconductor package or base plate to the temperature sensor.

[0015] Furthermore, an electric drive for a vehicle is provided, comprising a three-phase electric motor and an accumulator, as well as an electronic module connected to both.

[0016] Furthermore, a vehicle is provided, featuring an electric drive which is designed as an electric axle drive.

[0017] Further features and advantages of the invention will become apparent from the following description of exemplary embodiments of the invention and from the figures, which illustrate details of the invention. The individual features can be implemented individually or in any combination in a variant of the invention.

[0018] Preferred embodiments of the invention are explained in more detail below with reference to the accompanying figures. Fig. Figure 1 shows an electronic module according to a state-of-the-art design. Fig. Figure 2 shows an electronic module according to an embodiment of the present invention. Fig. Figure 3 shows a sectional view along line AA of the in Fig. 2 electronic modules shown. Fig. 4 shows a top view of the in Fig. 2 electronic modules shown. Fig. Figure 5 shows a view of an electronic module with a control board attached to it according to an embodiment of the present invention. Fig. Figure 6 shows a top view of a multisensor module according to one embodiment of the present invention. Fig. Figure 7 shows a bottom view of the in Fig. 6 multisensor modules shown. Fig. Figure 8 shows a top view of a sensor board according to an embodiment of the present invention. Fig. 9 shows a bottom view of the in Fig. 8 sensor boards shown.

[0019] In the following figure descriptions, identical elements or functions are marked with the same reference symbols.

[0020] As mentioned at the beginning, one aim of the invention is to provide an improved electronic module.

[0021] Currently known electronic modules used in the field of electromobility are constructed as single-phase or three-phase modules. In a three-phase module, they have a single base plate common to all three phases, on which semiconductor packages are arranged. In a single-phase module, only one phase is provided per electronic module; thus, a single base plate with semiconductor packages for one phase is provided. The invention described below can be applied to electronic modules formed by three single-phase modules as well as to electronic modules formed by one three-phase module.

[0022] The base plate 2 of an electronic module 100 serves as a carrier plate and is made of a sufficiently stable material with good thermal conductivity, such as copper, so that adequate heat dissipation and fixation of the semiconductor packages 4, e.g., by sintering, are ensured. It is therefore not a printed circuit board and has no current-carrying or signal-carrying traces. It can be made of an electrically conductive material and thus also provide ground potential (GND). Alternatively, it can consist of a non-electrically conductive material, in which case ground potential (GND) can also be provided by a screw.

[0023] The semiconductor packages 4 are typically arranged opposite each other, so that two of them form a half-bridge, with one semiconductor package 4 serving as the high-side module 4_HS (i.e., the high-side switch) and the other as the low-side module 4_LS (i.e., the low-side switch). Each switch has power semiconductors, e.g., MOSFETs, IGBTs, etc., connected in parallel. However, high-side switches and low-side switches can also be provided within a single semiconductor package 4. One or more half-bridges can be provided per phase.

[0024] Above the half-bridges, DC busbars DC+ and DC-, as well as an AC busbar AC, are stacked and electrically contacted with the associated power connections of the half-bridges.

[0025] A semiconductor package 4 is defined as an encapsulated power semiconductor (chip) including (unencapsulated) connection pins for electrical or signal contacting. A high-side module 4_HS has the signal pins (gate and / or Kelvin source) on the side of its AC tap, while the low-side module 4_LS has the signal pins (gate and / or Kelvin source) on the side of its DC negative tap.

[0026] In the Fig. In the electronic module 100 shown in Figure 1, which is known from the prior art, the semiconductor packages 4 are arranged opposite each other with a central AC connection. Furthermore, the DC negative busbar DC- extends across the entire surface of all semiconductor packages 4 between the DC positive busbar DC+ (located on the side of the base plate 2) and the AC busbar AC. The DC negative busbar DC- is surrounded by electrical insulation 60 made of an electrically insulating material in areas not used for electrical contact, in particular by overmolding (molding) it. The AC busbar AC is located above and attached to the electrical insulation 60. On one side (in the area of ​​the AC taps of the semiconductor packages 4), it has an AC tap 19; on the other side, it projects outside the base plate 2 to be electrically contacted, for example, by an electric motor.

[0027] The DC-minus and DC-plus connections of the DC power rails DC- and DC+, which are not contacted with a semiconductor package 4, protrude externally (i.e., towards the accumulator) on the same side of the electronic module 100, while the AC connection of the AC power rail AC, which is not contacted with an AC connection of a semiconductor package 4, protrudes externally (i.e., towards the electric motor) on the other side of the electronic module 100.

[0028] Several semiconductor packages 4 are arranged on the base plate 2. The semiconductor packages 4 serving as high-side modules 4_HS are located on the side where the DC power rails DC- and DC+ protrude externally (outside) from the base plate 2. The semiconductor packages 4 serving as low-side modules 4_LS are located on the side where the AC power rail AC protrudes externally (outside) from the base plate 2. Thus, the signal pins 40 and 41 of the semiconductor packages 4 are located in the area of ​​the AC tap 19 and on a section of the AC power rail AC where the AC power rail narrows. A current sensor 14 for measuring the AC current (alternating current) flowing through the AC power rail is located on this narrowing.

[0029] Furthermore, a sensor board (PCB) 3, designed as an insert board, is arranged and attached above the AC busbar AC and the electrical insulation 60 of the DC negative busbar DC-. It serves to collect sensor signals and transmit them within the electronic module 100. For this purpose, it is designed, for example, as a single-layer, double-layer, or multi-layer printed circuit board, e.g., as an FR4 printed circuit board. The sensor signals are transmitted to a central sensor signal transfer area for transmission outside the electronic module 100. This transfer area can, for example, be formed as signal pins 30, as shown in Fig. Figure 1 indicates this. The sensor board (PCB) 3 carries the current sensor 14 on one side (facing a subsequently mounted control board 16) and at least one temperature sensor 130 on the opposite side (facing the semiconductor packages). The temperature sensor 130 is positioned above at least one of the semiconductor packages 4 to measure its temperature. The temperature sensor 130 is typically located above one of the high-side modules 4_HS, as this is where the highest temperature is likely to occur. The sensor board 3 is therefore essentially the same length as the base plate 2.

[0030] Due to its fixation to the AC busbar AC and the electrical insulation 60 of the DC negative busbar DC-, the sensor board (PCB) 3 has a structure at a transition area that enables mechanical decoupling between different areas of the sensor board 3. In particular, the structure is provided at a transition between the DC negative busbar DC- and the AC busbar AC. Advantageously, the structure is provided only in the area of ​​the DC negative busbar DC- (the electrical insulation 60). As shown in Fig. As can be seen in Figure 1, the sensor board 3 also has a constriction in the area of ​​the narrowing of the AC busbar AC, on which the current sensor 14 is located. This allows the signal pins 41 of the low-side modules 4_LS to be routed above the sensor board 3. Consequently, the outer section of the AC busbar AC, where the electrical contact to the outside (to the electric motor) takes place, becomes very short. Furthermore, meeting the requirements for clearance and creepage distances is not easily achieved, as space is limited and extending the AC busbar AC, and thus the electronic module 100, is undesirable.

[0031] As in Fig. As can be seen in Figure 1, no temperature sensor is provided on sensor board 3 to measure the temperature of base plate 2. A separate unit is used for this purpose, consisting of a carrier 141 with an associated circuit board on which a temperature sensor (not shown) is arranged to measure the temperature of base plate 2. The carrier is later mechanically connected to control board 16, and the circuit board is later connected to control board 16 via a signal path.

[0032] Disadvantages of the in Fig. In the embodiment shown in Figure 1, the sensor board 3 is attached to two elements of the electronic module 100: the AC busbar and the electrical insulation 60 of the DC negative busbar. Despite the existing mechanical decoupling structure, stresses due to tolerances can arise, which can negatively affect the sensors in particular. Dynamic tolerances caused by temperature fluctuations and vibrations alter the air gap, potentially impacting the sensor's measurement accuracy. Another disadvantage is that the temperature sensor used to measure the temperature of the base plate 2 is not integrated on the sensor board 3. Furthermore, the design makes it difficult to meet increased requirements for air and creepage distances.

[0033] For these reasons, an improved electronic module 100 is proposed, as described below.

[0034] The proposed electronic module 100 also has at least one base plate 2 (depending on whether a single-phase or a three-phase module is used) on which semiconductor packages 4 are arranged. Here too, the semiconductor packages 4 are arranged opposite each other, so that two of them form a half-bridge, with one semiconductor package 4 serving as a high-side module 4_HS, i.e., as a high-side switch, and the other as a low-side module 4_LS, i.e., as a low-side switch. As in the Fig. In the embodiment shown, the semiconductor packages 4 are arranged so that their AC connections point towards each other (i.e., a central tap is created) and can be contacted at the AC tap 19 of the AC busbar.

[0035] Unlike in the Fig. In the embodiment shown in Figure 1, the DC-positive busbar DC+ is routed across all half-bridges between the DC-negative busbar DC- (located on side 2 of the base plate) and the AC busbar AC, in all embodiments described below. As in the Fig. In the embodiment shown, the DC-negative and DC-positive terminals, which are not connected to a semiconductor package 4, protrude externally (i.e., to the battery) on the same side of the electronic module 100, while the AC terminal, which is not connected to a semiconductor package 4, protrudes externally (i.e., to the electric motor) on the other side of the electronic module 100. Due to the reversal of the order of the DC busbars DC+ and DC-, the semiconductor packages 4 are now also arranged in a different order in order to be connectable to the common AC tap 19. In the embodiment shown in Fig. In the version shown in Figure 1, the high-side modules 4_HS are arranged on the side of the electronic module 100 where the external DC connections protrude, and the low-side modules 4_LS are arranged on the side where the external AC connection protrudes. In embodiments of the invention, the arrangement is reversed, so that the low-side modules 4_LS are arranged on the side of the electronic module 100 where the external DC connections protrude, and the high-side modules 4_HS are arranged on the side where the external AC connection protrudes.

[0036] Thus, signal pins 40 and 41 are positioned at different locations on the electronics module 100, as can be seen from a comparison between Fig. 1 and Fig. As can be seen in Figure 2. In particular, signal pins 40 and 41 are no longer located in the area of ​​the narrowing of the AC busbar. This space can now be used differently, as described below.

[0037] Furthermore, unlike the one in Fig. In the embodiment shown, a multisensor module 1 is provided, consisting of the AC busbar AC and a sensor board 3 arranged on it, on which the sensors required for temperature and current measurement are arranged, as shown in Fig. 6 and Fig. 7 indicated. On one side of the sensor board 3, which faces away from the AC busbar after being connected, a current sensor 14 is arranged, which, after being connected to the AC busbar, is positioned above a constriction of the AC busbar, as shown in Fig. 8 indicated. No insulation from the AC busbar is necessary, as the sensor board 3 serves as insulation. On the opposite side of the sensor board 3, at least one temperature sensor 130 is provided for measuring the temperature of a semiconductor package 4, preferably a high-side module 4_HS, as well as (at least) one temperature sensor 131 for measuring the temperature of the base plate 2, as shown in Fig. Figure 9 indicates. The temperature sensors 130 and 131 are positioned such that, after the electronic module 100 is fully assembled (i.e., after the multisensor module 1 is mounted on the remaining components), they are located above a semiconductor package 4 and above the base plate 2, respectively. For positioning above the base plate 2, the sensor board 3 advantageously has a protruding tab to allow the temperature sensor 131 to be positioned directly above the base plate 2 (i.e., without any components in between).

[0038] Furthermore, a casing 12 is part of the multisensor module 1, which surrounds predefined sections of the AC busbar AC and the sensor board 3 in such a way that the current measurement sensor (current sensor 14) is enclosed by the casing 12 and the AC busbar AC and the sensor board 3 are fixed to each other. The temperature sensors 130, 131, however, are not enclosed by the casing 12, nor are the external connection and the AC tap of the AC busbar AC. The casing 12 ensures that the sensors 14, 130, 131 are not affected by vibrations resulting from tolerances in the fixing of the sensor board 3 to other components after the multisensor module 1 is mounted on the remaining components of the electronic module 100. The casing 12 can be, as shown in Fig. As indicated in Figure 7, the sensor board 3 may also be provided next to the temperature sensors 130 and 131, serving here as a stabilizer for the sensor board 3. The casing is preferably manufactured by overmolding or by means of a molding process.

[0039] As already mentioned, sensor board 3 and AC power rail AC are connected to each other in a predetermined orientation, which depends on the mounting situation on the electronic module 100. It is important that, after the electronic module 100 is fully assembled, the temperature sensors 130 and 131 are each positioned above the component to be monitored (i.e., base plate 2 or semiconductor package 4).

[0040] The mechanical fastening of the multisensor module 1 when mounted to the other components of the electronic module 100 can be carried out in a variety of ways, e.g. it can be hot-stitched or attached to the electrical insulation 50 of the DC+ busbar by means of a clamp connection. In the Fig. In the embodiments shown in Figures 2 to 4, each depicting a fully assembled electronic module 100 (side view, section, top view), the fixing points 51 are shown as examples, representing hot stapling. The multisensor module 1 is attached to the electrical insulation 50 of the DC+ busbar such that the external connection of the AC busbar projects outside the electronic module 100 and the opposite AC tap 19 can be connected to the AC terminals of the semiconductor packages 4.

[0041] As mentioned previously, one or more temperature sensors 130 are provided to monitor the temperature of one or more of the semiconductor packages 4, in particular high-side modules 4_HS, to prevent them from overheating. The following describes how the temperature sensors 130 can be arranged.

[0042] As in the Fig. In the sectional view shown in Figure 3, a metal pin 18 is attached to the top side (the side not attached to the base plate 2) of at least one of the semiconductor packages 4, preferably a high-side module 4_HS, by means of a gap filler 17 (a thermal paste) and is thereby thermally and mechanically coupled to the associated semiconductor package 4. The metal pin 18 is advantageously designed as a press-fit element and protrudes through an opening in the DC+ power rail and its electrical insulation 50 to be thermally coupled to a temperature sensor 130 arranged on the sensor board 3, which in turn is attached to the metal pin 18 (also referred to as a metal pin) via a gap filler 17. The metal pin 18 is advantageously arranged on the semiconductor package 4 such that it is located as precisely as possible above the power semiconductors contained therein.The electrical insulation 50 of the DC-Plus busbar DC+ is designed accordingly to allow the metal pin 41 to pass through while simultaneously providing electrical insulation, as shown in . Fig. 3 to see.

[0043] The temperature sensor 130 is attached to sensor board 3, and the multisensor module 1 is configured such that the temperature sensor 130 can be contacted with the associated metal pin 18. It is then positioned between metal pin 18 and sensor board 3. Advantageously, the temperature sensor 130 is positioned precisely above (and especially centered on) metal pin 18 to ensure optimal heat transfer.

[0044] In addition to the temperature sensor(s) 130 for measuring the temperature of one or more semiconductor packages 4, at least one temperature sensor 131 is provided on the sensor board 3 for measuring the temperature of the base plate 2. Advantageously, the connection is made in the same way as for the temperature sensor 130 used to measure the temperature of the semiconductor packages 4, i.e., via a metal pin 18 which is inserted into and passes through the electrical insulation 50 and is attached at one end to the base plate 2 by a gap filler 17 and at the opposite end to a temperature sensor 131 arranged on the sensor board 3, also by a gap filler 17. Advantageously, for electrical insulation, the electrical insulation 50 of the DC+ busbar is designed such that it also encloses the metal pin 18, which is arranged on the base plate 2 and is in contact with the temperature sensor 131.The electrical insulation 50 thus forms a tunnel between temperature sensor 130, 131 and the surface of the base plate 2 or the semiconductor package 4. A gap filler 17 serves as a gap filler (to bridge unevenness) and for thermal coupling between the semiconductor package and the temperature sensor 130 or 131.

[0045] In an alternative embodiment, no fixed connection is provided between temperature sensor 130 or 131 and the semiconductor package or base plate 2. In this embodiment, the temperature sensor 130 or 131 measures without contact via the feedthrough in the electrical insulation 50 and the DC+ busbar (or only the electrical insulation 50 in the case of temperature sensor 131), in which the metal pin 18 was inserted in the previously described embodiment. Due to the tunnel-like design of the electrical insulation 50, the temperature sensor 130 or 131 thus looks directly at the base plate 2 or the semiconductor package 4.

[0046] In both embodiments, the electrical insulation 50 advantageously extends from the semiconductor package 4 or the base plate 2 to the current sensor 14, as in Fig. 3 to see.

[0047] Sensor board 3 has a shape (outer contour) that allows both temperature sensor 130 and temperature sensor 131 to be positioned so that they can measure the temperature of semiconductor package 4 and base plate 2, respectively. As shown in Fig. As shown in Figures 8 (top view) and 9 (bottom view), the sensor board 3 has a protrusion (nose) in one area, on which a temperature sensor 131 is provided. This sensor is intended for measuring the temperature of the base plate 2 and therefore must protrude outside the DC+ / DC- busbars. The sensor board 3 is arranged and / or the base plate 2 has a corresponding shape to allow a direct connection between the base plate 2 and the temperature sensor 131. Advantageously, in the area above the base plate 2 where the temperature sensor 131 is provided, the electrical insulation 50 of the DC+ busbar is also provided with a corresponding feedthrough (as with the temperature sensor 130 above the semiconductor packages 4), as already mentioned.

[0048] The electrical insulation 50 of the DC+ busbar can be formed as a sheath (overmolding, mold) or as a two-part insulation, as shown in Fig. Figure 3 shows the DC+ busbar. In this case, it has a lower part 502 and an upper part 501, which accommodate the DC+ busbar (without the outer contact areas, which must remain free) between them and are then connected together, e.g., welded. Thus, the DC+ busbar is enclosed by the electrical insulation 50.

[0049] The sensor board 3 is designed to receive and collect sensor signals from the temperature sensors 130, 131 and the current sensor 14 and to transmit them via transfer interfaces to outside the electronics module 100, e.g. to a control board 16 which is connected to an external processing unit.

[0050] In contrast to the one in Fig. In the embodiment shown in Figure 1, in which signal pins 30 are provided which are complex to assemble due to the narrow soldering area, a transfer element in the form of a flexible cable 15 is provided according to the invention. This cable is connected to the sensor board 3 at one end and to the control board 16 at another end, for example by soldering. The flexible cable 15 is in Fig. 2, Fig. 4 and Fig. Figure 5 shows the sensor board 3 is shaped in such a way that the flexible cable 15 can be connected to it, preferably at an edge area.

[0051] The electronic module 100 comprises an inverter (DC / AC inverter) essentially consisting of semiconductor packages 4 and the associated busbars (DC / AC), preferably with three phases. The electronic module 100 is operatively connected to a DC power source on its DC input side and to an electric motor on its AC output side. For example, it is configured as a single-phase module 1, thus forming one phase of an inverter arrangement, so that three single-phase modules 1 are provided to realize a three-phase inverter arrangement. However, it can also be configured as a three-phase or multi-phase module, in which all phases are arranged on a base plate 2, depending on the application. The inverter converts incoming direct current from a power source such as a battery into alternating current usable by the electric motor in order to drive the electric motor. The electric motor is, in particular, an electric axle drive.It is advantageous for a vehicle, e.g. a car or a commercial vehicle, to have at least one such drive system.

[0052] The novel multisensor module 1 simplifies the assembly of the electronic module 100, as fewer components need to be mounted individually. Furthermore, all temperature and current sensors 14, 130, and 131 can now be positioned in a single module (on the sensor board 3), thus reducing the number of components required for assembly. The multisensor module 1 secures the sensor board 3, with sensors 14, 130, and 131, to the AC busbar by means of the casing 12. This reduces or (ideally) eliminates the (mechanical) stress on sensors 14, 130, and 131, resulting in improved measurement accuracy. Since the current sensor 14 is directly fixed to the AC busbar AC by means of the casing 12 (mold material), there is no tolerance effect and there is no (or only to a tolerated extent) thermal or mechanical influence on the measuring system. Reference symbol list 100 electronic module (power module) 1 multi-sensor module 2 Base plate 3 Sensor board 30 signal pins 4 semiconductor package 4_HS High-Side Module (Semiconductor Packages) 40 signal pins high-side module 4_LS Low-Side Module (Semiconductor Packages) 41 signal pins, low-side module DC DC negative busbar DC+ DC-Plus busbar 50 electrical insulation DC-Plus busbar 51 fixation points between 50 and 1 501 upper part formed as cover electrical insulation 502 lower part formed as cover electrical insulation 60 Electrical insulation DC negative busbar (overmolding) 12 Sheathing / fixing of 1 130 temperature sensor high-side module 131 Temperature sensor base plate 14 Current sensor 141 Carrier with circuit board with temperature sensor from the 2 15 Transfer element sensor signals to external 16 Control board 17 Gap fillers 18 metal pins AC AC busbar 19 AC tap

Claims

[1] Multisensor module (1) for use in an electronic module (100), wherein the multisensor module (1) comprises: - an AC busbar (AC) with a constriction provided at a predetermined position, - a sensor board (3) arranged on one side of the AC busbar (AC), wherein a current sensor (14) is arranged on one side of the sensor board (3) facing away from the AC busbar (AC), and at least one first temperature sensor (130) and at least one second temperature sensor (131) arranged at a predetermined position are positioned on one side of the sensor board (3) facing the AC busbar (AC), - an electrically insulating sheath (12) which surrounds and fixes together predetermined sub-areas of the AC busbar (AC) and sensor board (3), comprising the current sensor (14) but not the temperature sensors (130, 131), wherein the sensor board (3) is shaped and positioned on the AC busbar (AC) such that the current sensor (14) is positioned above the constriction of the AC busbar (AC). [2] Multisensor module (1) according to claim 1, wherein the temperature sensors (130, 131) are arranged on the sensor board (3) such that, after mounting on remaining components of the electronic module (100), they are positioned above a predetermined semiconductor package (4) or above a base plate (2). [3] Electronic module (100), comprising: - an inverter comprising a base plate (2) and semiconductor packages (4) arranged thereon in the form of at least one high-side module (4_HS) and a low-side module (4_LS) opposite the high-side module (4_HS), wherein the semiconductor packages (4) are arranged such that their AC terminals point towards each other, - a DC-negative busbar (DC-) arranged on the base plate (2) and a DC-positive busbar (DC+) arranged thereon, wherein external terminals of the DC busbars (DC-, DC+) protrude on a first side of the electronic module (100), and the semiconductor packages (4) are electrically contacted with their respective electrical terminals with DC terminals of the DC busbars (DC-, DC+), and wherein at least the DC-positive busbar (DC+) is provided with electrical insulation (50) in areas outside its terminals, - a multisensor module (1) according to claim 1 or 2, which is arranged on a partial area of ​​the electrical insulation (50) of the DC-plus busbar (DC+) such that the external connection of the AC busbar (AC) protrudes on a second side of the electronic module (100) opposite the first side, and the AC tap (19) can be contacted with the AC terminals of the semiconductor packages (4), and the first temperature sensor (130) is positioned above a predetermined semiconductor package (4) and the second temperature sensor (131) is positioned above the base plate (2). [4] Electronic module (100) according to claim 3, wherein the multisensor module (1) is attached to the electrical insulation (50) of the DC-plus busbar (DC+) by hot crimping or clamping connections. [5] Electronic module (100) according to claim 3 or 4, further comprising a control board (16) which is arranged above the multisensor module (1) and is connected to it via a flexible cable (15) for signal transmission. [6] Electronic module (100) according to one of claims 3 to 5, wherein the electrical insulation (50) of the DC-plus busbar (DC+) is formed in two parts such that it encloses predetermined areas of the DC-plus busbar (DC+). [7] Electronic module (100) according to one of claims 3 to 6, wherein the electrical insulation (50) of the DC-plus busbar (DC+) or the electrical insulation (50) of the DC-plus busbar (DC+) and the DC-plus busbar (DC+) provide a passage in areas where a temperature sensor (130, 131) is provided on the sensor board (3) such that the temperature sensor (130, 131) is directed directly onto a predetermined semiconductor package (4) or onto the base plate (2). [8] Electronic module (100) according to claim 7, wherein the electrical insulation (50) is formed such that it extends from the semiconductor package (4) or the base plate (2) to the temperature sensor (130, 131). [9] Electric drive of a vehicle comprising a three-phase electric motor and an accumulator, and an electronic module (100) connected to both according to one of claims 3 to 8. [10] Vehicle comprising an electric drive according to claim 9, which is formed as an electric axle drive.

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