OPTICAL SYSTEM, ARRANGEMENT AND LITHOGRAPHING FACILITY

Abstract

An optical system (100) for a lithography system (1), comprising at least one optical element (202), at least one actuator / sensor device (202) associated with at least one optical element (202), an interface device (206) which is optically connected (208) to the at least one actuator / sensor device (202) for data transmission and which can be electrically and / or optically connected to a control device (300), wherein the interface device (206) comprises a first microcomponent (212) with a first processor element (214) and an integrated first optical interface element (216), and comprising at least one actuator / sensor device (204), a second micro component (218) with a second processor element (220) and an integrated second optical interface element (222) which is optically connected to the first optical interface element (216).

Description

[0001] The present invention relates to an optical system for a lithography system and an arrangement and a lithography system with such an optical system.

[0002] Microlithography is used to manufacture microstructured components, such as integrated circuits. The microlithography process is carried out using a lithography system, which includes an illumination system and a projection system. The image of a mask (reticule) illuminated by the illumination system is projected by the projection system onto a substrate, such as a silicon wafer, coated with a photosensitive layer (photoresist) and positioned in the image plane of the projection system. This transfers the mask structure onto the photosensitive coating of the substrate.

[0003] Driven by the pursuit of ever smaller structures in the fabrication of integrated circuits, EUV lithography systems are currently being developed that use light with a wavelength in the range of 0.1 nm to 30 nm, particularly 13.5 nm. Since most materials absorb light of this wavelength, such EUV lithography systems must use reflective optics, i.e., mirrors, instead of the refracting optics, i.e., lenses, used previously.

[0004] In the optical system of a lithography machine, a variety of actuator / sensor units with sensors and / or actuators are installed. An actuator / sensor unit is, for example, suitable for moving an associated optical element, such as a mirror, and / or for detecting a parameter (e.g., a position, a temperature) of the associated optical element.

[0005] To control the actuator / sensor devices and evaluate the data recorded by the actuator / sensor devices, the actuator / sensor devices of the optical system are connected to an external control device.

[0006] Against this background, one object of the present invention is to provide an improved optical system for a lithography system.

[0007] Based on a first aspect, an optical system for a lithography system is proposed. The optical system features: at least one optical element, at least one actuator / sensor device assigned to at least one optical element, an interface device which is optically connected to the at least one actuator / sensor device for data transmission and which can be electrically and / or optically connected to a control device, wherein the interface device comprises a first microcomponent with a first processor element and an integrated first optical interface element, and which includes at least one actuator / sensor device comprising a second microcomponent with a second processor element and an integrated second optical interface element, which is optically connected to the first optical interface element.

[0008] By transmitting data between at least one actuator / sensor device and the interface device via an optical transmission path (e.g., fiber optic cable) and using optical interfaces, larger amounts of data can be transmitted than with electrical transmission. In particular, a higher data transmission rate (e.g., bit rate, i.e., bits per second) can be provided. Furthermore, the bandwidth for data exchange can be significantly increased.

[0009] Furthermore, the use of the first and second microcomponents, in which the corresponding processor element is integrated with the corresponding optical interface element, saves installation space. Lithography systems, in particular, place extremely high demands on optical and physical components, which, among other things, define and limit the available installation space. The interface unit and the at least one actuator / sensor unit, which accordingly comprise the first and second microcomponents, are, for example, arranged in a limited area of ​​the optical system. The interface unit and the at least one actuator / sensor unit are, for example, located behind the associated optical element, where only limited space is available for the actuator / sensor unit(s) and their data transmission connection. The interface unit and the at least one actuator / sensor unit can, for example, be...It can also be arranged in a vacuum atmosphere and / or a protective atmosphere with limited space. If a multiple actuator / sensor device is used for an optical element (e.g., a micromirror arrangement with a large number of individual mirrors), then saving installation space is of particular importance.

[0010] The susceptibility to interference (e.g., dielectric losses or reflections, crosstalk) known to occur with electrical transmission paths between a processor and an electrical transceiver (e.g., via differential conductor pairs on a circuit board) can be avoided by the corresponding optical interface element integrated with the corresponding processor element. This is because, in the first and second microcomponents, the corresponding processor element and the corresponding optical interface element are integrated in such a way that the electrical transmission path between the respective processor element and the corresponding optical interface element is very short. For example, the distance between the corresponding processor element and the corresponding optical interface element in the first and second microcomponents is 100 µm or less.This high integration density not only increases the data transmission rate but also reduces heat generation from the first and second microcomponents. This reduction in heat generation necessitates less cooling for the interface unit (comprising the first microcomponent) and the at least one actuator / sensor unit (comprising the second microcomponent).

[0011] The lithography system (projection exposure system) can be an EUV lithography system. EUV stands for "Extreme Ultraviolet" and refers to a wavelength of the working light between 0.1 nm and 30 nm, particularly 13.5 nm. The lithography system can also be a DUV lithography system. DUV stands for "Deep Ultraviolet" and refers to a wavelength of the working light between 30 nm and 250 nm. The lithography system comprises an illumination system and a projection system. Specifically, the lithography system projects the image of a mask (reticule) illuminated by the illumination system onto a substrate, such as a silicon wafer, coated with a photosensitive layer (photoresist) and positioned in the image plane of the projection system, in order to transfer the mask structure onto the photosensitive coating of the substrate.

[0012] The optical system is preferably a lighting system of the lithography system. However, the optical system can also be a projection system of the lithography system.

[0013] The at least one optical element is specifically designed to guide radiation within the optical system. This at least one optical element is, for example, a mirror (e.g., an adaptive mirror) or a lens of the lithography system. By way of example only, the at least one optical element optionally comprises a micromirror array with a plurality of micromirror units (e.g., 100 or more, 500 or more, and / or 900 or more), each containing a plurality (e.g., 100 or more, 300 or more, and / or 600 or more) of micromirrors.

[0014] The at least one actuator / sensor assembly comprises, for example, an actuator for actuating an associated optical element, a sensor for acquiring data (e.g., position, temperature) of an associated optical element and / or its environment, and / or an actuator and sensor assembly for actuating and acquiring data of the associated optical element. The sensor is, for example, a position sensor. The actuator is preferably an electrostrictive actuator or a piezoelectric actuator, for example, a PMN actuator (PMN; lead magnesium niobate) or a PZT actuator (PZT; lead zirconate titanate). The actuator is specifically configured to actuate an optical element of the optical system.

[0015] The interface device is optically connected to at least one actuator / sensor device for data transmission, e.g., by means of one or more optical fibers. An optical fiber can also be referred to as an optical fiber (e.g., fiber optic cable) and is, for example, designed as a fiber optic cable (e.g., fiber optic cable).

[0016] The interface device can be connected to the control device electrically and / or optically. For example, an electrical cable is provided which is electrically connected to the interface device and can be electrically connected to the control device. Alternatively, an optical fiber can be provided which is optically connected to the interface device and can be optically connected to the control device. The control device is specifically designed to provide control signals for the at least one actuator / sensor device and to evaluate data received from the at least one actuator / sensor device.

[0017] The control device is, in particular, an external control device located outside the optical system (e.g., also outside a vacuum atmosphere and / or protective atmosphere of the optical system). The external control device is, for example, located in a gray area or a cleanroom of the lithography system.

[0018] The data between the at least one actuator / sensor device and the external control device is therefore transmitted via an optical transmission path (between the at least one actuator / sensor device and the interface device) and an electrical and / or optical transmission path (between the interface device and the external control device). The interface device thus represents an interface between an optical transmission path and an electrical and / or optical transmission path.

[0019] The interface device comprises the first microcomponent with the first optical interface element. Furthermore, the at least one actuator / sensor device comprises the second microcomponent with the second optical interface element. The first and second optical interface elements of the first and second microcomponents, respectively, are each configured to convert incoming electrical signals into outgoing optical signals and vice versa. The first and second optical interface elements each include, for example, an optical input and output and an electrical input and output. The first and second optical interface elements are, for example, each bidirectional optical interface elements. The first and second optical interface elements each include, for example, one or more photonic integrated circuits (PICs). In addition, the first and second processor elements of the first and second microcomponents each include, for example, a processor, a processor, and a processor.The second microcomponent could be, for example, a microprocessor, an application-specific integrated circuit (ASIC), a field-programmable gate array (FPGA), or the like.

[0020] The first and second microcomponents can also be referred to as the first and second electronic (more precisely, optoelectronic) units, respectively. Both the first and second microcomponents are specifically designed as hardware. In particular, each of the first and second microcomponents is a single, integrated component. In other words, the first processor element and the first optical interface element are integrated within the first microcomponent in such a way that the entire first microcomponent can be mechanically and electrically connected to another unit (e.g., a printed circuit board). The first processor element and the first optical interface element can also be described as two first integrated (e.g., horizontally or vertically stacked) chiplets. The features described in this paragraph also apply to the second processor element and the second optical interface element of the second microcomponent.

[0021] The interface device can also include multiple units of the first microcomponent. Likewise, the at least one actuator / sensor device can also include multiple units of the second microcomponent.

[0022] The optical system can also have several actuator / sensor devices. In this case, the interface device is optically connected directly or indirectly to each of the multiple actuator / sensor devices using one or more optical fibers.

[0023] If, for example, the optical element has a micromirror arrangement with several micromirror units, each with several micromirrors, then, for example, a separate actuator / sensor device can be provided for each micromirror unit (or for each individual mirror).

[0024] According to one embodiment, the at least one optical element is at least partially arranged in a vacuum atmosphere, and the first and second microcomponents are arranged in an area under atmospheric pressure.

[0025] The area at atmospheric pressure is separated from the vacuum atmosphere by a vacuum-tight seal. This area at atmospheric pressure contains, for example, an air mixture or a nitrogen atmosphere.

[0026] Consequently, the first and second microcomponents are not located in a vacuum atmosphere but in the area under atmospheric pressure. This prevents outgassing from the first and second microcomponents from affecting the vacuum atmosphere and / or the optical element, which is at least partially located in a vacuum atmosphere.

[0027] The fact that the at least one optical element is at least partially located in a vacuum atmosphere means, for example, that at least one optically active surface of the optical element is located in the vacuum atmosphere. The at least one optical element can also be located completely in the vacuum atmosphere.

[0028] Furthermore, for example, not only are the first and second microcomponents arranged in the area under atmospheric pressure, but the interface device (including the first microcomponent) and the at least one actuator / sensor device (including the second microcomponent) can also each be arranged as a whole in the area under atmospheric pressure.

[0029] For example, the first and second microcomponents are arranged together in a common area at atmospheric pressure. Alternatively, the first and second microcomponents can each be arranged in their own separate area at atmospheric pressure.

[0030] According to a further embodiment, the optical system comprises a vacuum housing located under a vacuum atmosphere and at least one protective housing located at least partially within the vacuum housing and under atmospheric pressure. Furthermore, the at least one optical element is located at least partially within the vacuum atmosphere of the vacuum housing, and the first and second microcomponents are located within the at least one protective housing.

[0031] The vacuum housing and / or a vacuum pump for evacuating the vacuum housing is / are designed, for example, such that a pressure of 1 hPa to 10 hPa is maintained inside the vacuum housing.-3 hPa, 10 -3 up to 10 -8 hPa or 10 -8 up to 10 -11 hPa prevails (vacuum atmosphere).

[0032] The protective housing is, in particular, a vacuum-tight enclosure. It serves to protect the vacuum atmosphere and / or the at least one optical element from outgassing by the microcomponents. The protective housing is designed such that its interior is at atmospheric pressure and is sealed against the vacuum atmosphere of the enclosure. Atmospheric pressure is the pressure of the ambient air at or near the Earth's surface. For example, atmospheric pressure has a value of 1013.25 hPa.

[0033] Furthermore, for example, not only are the first and second microcomponents arranged inside the protective housing, but the interface device and the at least one actuator / sensor device can each be arranged as a whole inside the protective housing.

[0034] According to a further embodiment, the optical system has an electrical and / or optical vacuum feedthrough connecting the protective housing through the vacuum housing to an outer space of the vacuum housing for the purpose of carrying out at least one electrical and / or optical connection connected to the interface device.

[0035] This allows an electrical or optical connection to be established between the interface device located in the protective housing and the control device located outside the vacuum housing.

[0036] An electrical vacuum feedthrough is known, for example, from documents US 4 982 055 A1, US 6 305 975 B1 and WO 14 076 303 A1.

[0037] According to another embodiment, the optical system has a first circuit board on which the first microcomponent is arranged, and / or a second circuit board on which the second microcomponent is arranged.

[0038] According to a further embodiment, the optical system comprises a first printed circuit board on which the first microcomponent is arranged, and / or a second printed circuit board on which the second microcomponent is arranged. Furthermore, the first and / or second printed circuit board is / are each formed from a composite material that has an internal cavity. In addition, the cavity of the first and / or second printed circuit board forms a first or second vacuum-tight protective housing, respectively, with the first and / or second microcomponent being / being arranged within the first or second vacuum-tight protective housing.

[0039] By forming the first / second vacuum-tight protective housing within the first / second circuit board, the first or second microcomponent can be housed in the vacuum enclosure of the optical system without being affected by the surrounding vacuum. The composite material of the first / second circuit board forms this vacuum-tight protective housing, which completely surrounds the first or second microcomponent.

[0040] In this embodiment, the first and second microcomponents are isolated from the vacuum by integrating them into the respective printed circuit board (PCB). Since the vacuum-tight protective housing is formed by the PCB's composite material, no additional dedicated housing for the first and second microcomponents is advantageously required. Furthermore, installation space is saved because the protective housing is integrated into the PCB's composite material. This results in an ultra-compact unit suitable for confined spaces.

[0041] The inner cavity is, in particular, a closed cavity that is completely surrounded by the composite material.

[0042] According to a further embodiment are the first processor element and the first optical interface element arranged on a common first substrate of the first microbreathing part, and / or The second processor element and the second optical interface element are arranged on a common second substrate of the second microbreathing part.

[0043] The first microprocessor component is thus a single component comprising the first substrate. For example, the first processor element and / or the first optical interface element are each electrically (and mechanically) connected to the common first substrate. The first microprocessor component can therefore be mechanically and electrically connected as a whole to another unit (e.g., another substrate or a printed circuit board). In particular, the first substrate is configured to be mechanically and electrically connected to another unit (e.g., another substrate or a printed circuit board). The first substrate, for example, has electrical contacts, such as vias, for electrical connection to another unit (e.g., another substrate or a printed circuit board).The features described in this paragraph also apply to the second microbreathing element, the second processor element, the second optical interface element, and the common second substrate.

[0044] Optionally, the first and / or second microcomponent can each have an electronics housing in which the corresponding processor element and the corresponding optical interface element are at least partially arranged / accommodated.

[0045] In one variant, the common first / second substrate can be arranged on a printed circuit board and electrically connected to it. In a second variant, the common first / second substrate can also be an interposer unit arranged on a further substrate (component substrate / packing substrate) and electrically connected to it, with the further substrate (component substrate / packing substrate) being arranged on a printed circuit board and electrically connected to it.

[0046] According to a further embodiment The first processor element and the first optical interface element are arranged on a first intermediate unit of the first microcomponent and are electrically connected to each other within the first intermediate unit, and / or The second processor element and the second optical interface element are arranged on a second intermediate unit of the second microcomponent and are electrically connected to each other within the second intermediate unit.

[0047] The first / second processor element and the first / second optical interface element therefore represent two chiplets, each arranged on the interposer unit, electrically connected to the interposer unit, and electrically connected to each other within the interposer unit. This allows the electrical signals provided by the first / second optical interface element to be transmitted to the first / second processor element, or vice versa, over very short transmission paths.

[0048] This means that the first processor element and the first optical interface element together form a first interposer-based stack of multiple microchips / chiplets. Similarly, the second processor element and the second optical interface element together form a second interposer-based stack of multiple microchips / chiplets.

[0049] In this context, "arranged on an intermediate unit" means that the first / second processor element and the first / second optical interface element are arranged side-by-side (horizontal stacking) or one above the other (vertical stacking) on ​​the respective intermediate unit. In a side-by-side arrangement, the first / second processor element and the first / second optical interface element are located on the same surface / side of the respective intermediate unit. In a stacked arrangement, the first / second processor element and the first / second optical interface element are located on opposite surfaces / sides of the respective intermediate unit, such that the intermediate unit is positioned between the first / second processor element and the first / second optical interface element.

[0050] According to another embodiment, the first and second optical interface elements are optically connected to each other by means of one or more optical waveguides.

[0051] According to another embodiment, one or more optical waveguides have a polymer-based optical waveguide.

[0052] A polymer-based optical waveguide (PWG) exhibits greater flexibility than, for example, a glass fiber. The polymer-based optical waveguide can, for instance, consist of a film. For example, a polymer-based optical waveguide does not have a round / circular cross-section, but rather a rectangular cross-section, the first side of which is many times larger (e.g., by a factor of 10 or more and / or a factor of 100 or more) than the second side of the rectangle.

[0053] One material used in polymer-based optical waveguides is, for example, polynorbornene and / or polynorbornene rubber (PNR).

[0054] According to another embodiment, the optical system has several of the actuator / sensor devices, wherein the interface device is optically connected to each of the several actuator / sensor devices by means of a respective optical waveguide.

[0055] In this setup, the multiple actuator / sensor devices are optically connected to the interface device in a hierarchical structure. For example, there is one (e.g., a single) optical transmission path between the interface device and each of the multiple actuator / sensor devices.

[0056] For example, the interface device is directly optically connected to each of the multiple actuator / sensor devices using a respective optical fiber.

[0057] Because optical data transmission takes place between the first and second microcomponents, each of which is designed as a single component (e.g., interposer-based stacked chiplets), a high bandwidth can be provided for data exchange. This allows for the implementation of diverse network topologies for optical data transmission, such as in the following embodiments.

[0058] According to a further embodiment, the optical system comprises several actuator / sensor devices and a relay device. The relay device includes a third microcomponent with a third processor element and an integrated third optical interface element. Furthermore, the interface device is optically connected to the relay device via an optical fiber, and the relay device is optically connected to each of the several actuator / sensor devices via a separate optical fiber.

[0059] Here too, the multiple actuator / sensor devices are optically connected to the interface device via the forwarding device in a hierarchical network topology.

[0060] For example, the interface device is directly optically connected to the forwarding device via a fiber optic cable. Furthermore, the forwarding device is directly optically connected to each of the multiple actuator / sensor devices via a separate fiber optic cable.

[0061] The third microcomponent with the third processor element and the third optical interface element integrated therein can have the same features as described above for the first and second microcomponents.

[0062] According to a further embodiment, the optical system comprises several actuator / sensor devices and at least one relay device with a third microcomponent, which includes a third processor element and an integrated third optical interface element. Furthermore, the interface device, the at least one relay device, and the several actuator / sensor devices are optically interconnected by means of multiple optical waveguides such that there are at least two independent optical transmission paths between the interface device and each of the several actuator / sensor devices.

[0063] In this embodiment, the multiple actuator / sensor devices are optically connected to the interface device via at least one relay device in a redundant network topology (e.g., a net-like and / or ring-like network topology). This prevents the failure of the entire system due to the malfunction of a single component (single point of failure, SPOF), e.g., a single optical fiber.

[0064] According to a second aspect, an arrangement for a lithography system is proposed. The arrangement comprises an optical system as described above and a control device located in a gray area or a cleanroom. Furthermore, the interface device of the optical system and the control device are connected by means of an electrical and / or optical line for data transmission.

[0065] According to a third aspect, a lithography system with an optical system and / or arrangement as described above is proposed.

[0066] The term "one" here is not necessarily to be understood as restricting the number to exactly one element. Rather, it can also refer to multiple elements, such as two, three, or more. Similarly, every other counter used here should not be interpreted as restricting the number to the exact number stated. Instead, numerical deviations, both higher and lower, are possible unless otherwise specified.

[0067] Other possible implementations of the invention also include combinations of features or embodiments described previously or subsequently with regard to the exemplary embodiments, even if not explicitly mentioned. In such cases, the person skilled in the art will also add individual aspects as improvements or additions to the respective basic form of the invention.

[0068] Further advantageous embodiments and aspects of the invention are the subject of the dependent claims and the exemplary embodiments of the invention described below. The invention will be explained in more detail below with reference to preferred embodiments and the accompanying figures. Fig. Figure 1 shows a schematic meridional section of a projection exposure system for EUV projection lithography according to one embodiment; Fig. Figure 2 shows an optical system of the projection exposure system. Fig. 1 according to a first embodiment; Fig. Figure 3 shows a microcomponent of the optical system arranged on a circuit board. Fig. 2 according to one embodiment; Fig. Figure 4 shows a microcomponent of the optical system arranged on a circuit board. Fig. 2 according to a further embodiment; Fig. Figure 5 shows an optical system of the projection exposure system. Fig. 1 according to a second embodiment; Fig. Figure 6 shows an optical system of the projection exposure system. Fig. 1 according to a third embodiment; and Fig. Figure 7 shows an optical system of the projection exposure system. Fig. 1 according to a fourth embodiment.

[0069] In the figures, identical or functionally equivalent elements have been labelled with the same reference symbols, unless otherwise indicated. Furthermore, it should be noted that the representations in the figures are not necessarily to scale.

[0070] Fig. Figure 1 shows an embodiment of a projection exposure system 1 (lithography system), in particular an EUV lithography system. One embodiment of the illumination system 2 of the projection exposure system 1 has, in addition to a light or radiation source 3, an illumination optic 4 for illuminating an object field 5 in an object plane 6. In an alternative embodiment, the light source 3 can also be provided as a separate module from the rest of the illumination system 2. In this case, the illumination system 2 does not include the light source 3.

[0071] A reticule 7 arranged in the object field 5 is exposed. The reticule 7 is held by a reticule holder 8. The reticule holder 8 can be moved, particularly in a scanning direction, via a reticule displacement drive 9.

[0072] In the Fig. Figure 1 shows a Cartesian coordinate system with an x-direction x, a y-direction y, and a z-direction z. The x-direction x runs perpendicular to the plane of the drawing. The y-direction y runs horizontally, and the z-direction z runs vertically. The scan direction runs in the Fig. 1 along the y-direction y. The z-direction z runs perpendicular to the object plane 6.

[0073] The projection exposure system 1 comprises a projection optic 10. The projection optic 10 serves to image the object field 5 onto an image field 11 in an image plane 12. The image plane 12 is parallel to the object plane 6. Alternatively, an angle other than 0° between the object plane 6 and the image plane 12 is also possible.

[0074] A structure on the reticulum 7 is imaged onto a photosensitive layer of a wafer 13 located in the image plane 12 within the image field 11. The wafer 13 is held by a wafer holder 14. The wafer holder 14 can be moved, particularly along the y-direction y, via a wafer transfer drive 15. The movement of the reticulum 7 via the reticulum transfer drive 9 and of the wafer 13 via the wafer transfer drive 15 can be synchronized.

[0075] Light source 3 is an EUV radiation source. Light source 3 emits, in particular, EUV radiation 16, which is also referred to below as useful radiation, illumination radiation, or illumination light. The useful radiation 16 has a wavelength in the range between 5 nm and 30 nm. Light source 3 can be a plasma source, for example, an LPP source (Laser Produced Plasma) or a DPP source (Gas Discharged Produced Plasma). It can also be a synchrotron-based radiation source. Light source 3 can be a free-electron laser (FEL).

[0076] The illumination radiation 16 emanating from the light source 3 is focused by a collector 17. The collector 17 can be a collector with one or more ellipsoidal and / or hyperboloid reflective surfaces. The at least one reflective surface of the collector 17 can be illuminated by the illumination radiation 16 at grazing incidence (GI), i.e., with angles of incidence greater than 45°, or at normal incidence (NI), i.e., with angles of incidence less than 45°. The collector 17 can be structured and / or coated to optimize its reflectivity for the useful radiation and to suppress stray light.

[0077] After the collector 17, the illumination radiation 16 propagates through an intermediate focus in an intermediate focal plane 18. The intermediate focal plane 18 can represent a separation between a radiation source module, comprising the light source 3 and the collector 17, and the illumination optics 4.

[0078] The illumination optics 4 comprise a deflecting mirror 19 and, downstream in the beam path, a first faceted mirror 20. The deflecting mirror 19 can be a planar deflecting mirror or, alternatively, a mirror with an effect that influences the beam shape beyond the mere deflection effect. Alternatively or additionally, the deflecting mirror 19 can be designed as a spectral filter that separates a useful wavelength of the illumination radiation 16 from stray light of a different wavelength. If the first faceted mirror 20 is arranged in a plane of the illumination optics 4 that is optically conjugate to the object plane 6 as the field plane, it is also referred to as a field faceted mirror. The first faceted mirror 20 comprises a plurality of individual first facets 21, which can also be referred to as field facets. Of these first facets 21, the following are in the Fig. 1 only some examples are shown.

[0079] The first facets 21 can be designed as macroscopic facets, in particular as rectangular facets or as facets with an arcuate or semicircular border contour. The first facets 21 can be designed as planar facets or alternatively as convexly or concavely curved facets.

[0080] As is known, for example, from DE 10 2008 009 600 A1, the first facets 21 can themselves each be composed of a plurality of individual mirrors, in particular a plurality of micromirrors. The first facet mirror 20 can in particular be designed as a microelectromechanical system (MEMS system). For details, reference is made to DE 10 2008 009 600 A1.

[0081] Between the collector 17 and the deflecting mirror 19, the illumination radiation 16 runs horizontally, i.e. along the y-direction y.

[0082] In the beam path of the illumination optics 4, a second faceted mirror 22 is arranged downstream of the first faceted mirror 20. If the second faceted mirror 22 is arranged in a pupil plane of the illumination optics 4, it is also referred to as a pupil faceted mirror. The second faceted mirror 22 can also be arranged at a distance from a pupil plane of the illumination optics 4. In this case, the combination of the first faceted mirror 20 and the second faceted mirror 22 is also referred to as a specular reflector. Specular reflectors are known from US 2006 / 0132747 A1, EP 1 614 008 B1, and US 6,573,978.

[0083] The second facet mirror 22 comprises a plurality of second facets 23. In the case of a pupil facet mirror, the second facets 23 are also referred to as pupil facets.

[0084] The second facets 23 can also be macroscopic facets, which may, for example, have round, rectangular, or hexagonal edges, or alternatively, facets composed of micromirrors. Reference is also made to DE 10 2008 009 600 A1 in this regard.

[0085] The second facets 23 can have planar or alternatively convex or concave curved reflective surfaces.

[0086] The illumination optics 4 thus form a double-faceted system. This basic principle is also known as a honeycomb condenser (English: Fly's Eye Integrator).

[0087] It can be advantageous not to arrange the second faceted mirror 22 exactly in a plane that is optically conjugate to a pupil plane of the projection optics 10. In particular, the second faceted mirror 22 can be arranged tilted relative to a pupil plane of the projection optics 10, as described, for example, in DE 10 2017 220 586 A1.

[0088] With the aid of the second faceted mirror 22, the individual first facets 21 are imaged into the object field 5. The second faceted mirror 22 is the last beam-shaping, or indeed the last, mirror for the illumination radiation 16 in the beam path before the object field 5.

[0089] In another embodiment of the illumination optics 4, not shown, a transmission optic can be arranged in the beam path between the second facet mirror 22 and the object field 5, which contributes in particular to imaging the first facets 21 into the object field 5. The transmission optic can have exactly one mirror, or alternatively two or more mirrors, arranged one behind the other in the beam path of the illumination optics 4. The transmission optic can, in particular, comprise one or two mirrors for normal incidence (NI mirrors) and / or one or two mirrors for grazing incidence (GI mirrors).

[0090] The lighting optics 4, in the version shown in the Fig. Figure 1 shows exactly three mirrors after the collector 17, namely the deflecting mirror 19, the first faceted mirror 20 and the second faceted mirror 22.

[0091] In a further embodiment of the lighting optics 4, the deflecting mirror 19 can also be omitted, so that the lighting optics 4 after the collector 17 can then have exactly two mirrors, namely the first faceted mirror 20 and the second faceted mirror 22.

[0092] The mapping of the first facets 21 by means of the second facets 23 or with the second facets 23 and a transmission optic into the object plane 6 is regularly only an approximate mapping.

[0093] The projection optics 10 comprise a plurality of mirrors Mi, which are numbered according to their arrangement in the beam path of the projection exposure system 1.

[0094] In the Fig. In the example shown, the projection optics 10 comprise six mirrors M1 to M6. Alternatives with four, eight, ten, twelve, or any other number of mirrors Mi are also possible. The projection optics 10 is a doubly obscured optic. The penultimate mirror M5 and the last mirror M6 each have an aperture for the illumination radiation 16. The projection optics 10 has an image-side numerical aperture that is greater than 0.5 and can also be greater than 0.6, for example, 0.7 or 0.75.

[0095] The reflective surfaces of the mirrors Mi can be designed as freeform surfaces without an axis of rotational symmetry. Alternatively, the reflective surfaces of the mirrors Mi can be designed as aspherical surfaces with exactly one axis of rotational symmetry of the reflective surface shape. The mirrors Mi, like the mirrors of the illumination optics 4, can have highly reflective coatings for the illumination radiation 16. These coatings can be designed as multilayer coatings, in particular with alternating layers of molybdenum and silicon.

[0096] The projection optics 10 has a large object-image offset in the y-direction y between a y-coordinate of a center of the object field 5 and a y-coordinate of the center of the image field 11. This object-image offset in the y-direction y can be approximately as large as a z-distance between the object plane 6 and the image plane 12.

[0097] The projection optics 10 can be anamorphic. In particular, they have different magnifications Bx, By in the x and y directions x, y. The two magnifications βx, βy of the projection optics 10 are preferably (βx, βy) = (+ / - 0.25, + / - 0.125). A positive magnification β indicates a projection without image inversion. A negative magnification β indicates a projection with image inversion.

[0098] The projection optics 10 thus lead to a reduction in the x-direction x, that is, in the direction perpendicular to the scan direction, in a ratio of 4:1.

[0099] The projection optics 10 lead to a reduction of 8:1 in the y-direction y, that is, in the scan direction.

[0100] Other magnification ratios are also possible. Magnification ratios with the same sign and absolute value in the x and y directions (x, y), for example with absolute values ​​of 0.125 or 0.25, are also possible.

[0101] The number of intermediate image planes in the x and y directions x, y in the beam path between the object field 5 and the image field 11 can be the same or, depending on the design of the projection optics 10, different. Examples of projection optics with different numbers of such intermediate images in the x and y directions x, y are known from US 2018 / 0074303 A1.

[0102] Each of the second facets 23 is assigned to exactly one of the first facets 21 to form an illumination channel for illuminating the object field 5. This can result, in particular, in illumination according to Köhler's principle. The far field is divided into a multitude of object fields 5 with the help of the first facets 21. The first facets 21 generate a plurality of images of the intermediate focus on the second facets 23 assigned to each of them.

[0103] The first facets 21 are each superimposed on a corresponding second facet 23 to illuminate the object field 5 on the reticle 7. The illumination of the object field 5 is particularly homogeneous. It preferably exhibits a uniformity error of less than 2%. Field uniformity can be achieved by superimposing different illumination channels.

[0104] The illumination of the entrance pupil of the projection optics 10 can be geometrically defined by arranging the second facets 23. By selecting the illumination channels, in particular the subset of the second facets 23 that carry light, the intensity distribution in the entrance pupil of the projection optics 10 can be adjusted. This intensity distribution is also referred to as the illumination setting or illumination pupil filling.

[0105] Another preferred pupil uniformity in the area of ​​defined illuminated sections of an illumination pupil of the illumination optics 4 can be achieved by a redistribution of the illumination channels.

[0106] Further aspects and details of the illumination of the object field 5 and, in particular, the entrance pupil of the projection optics 10 are described below.

[0107] The projection optics 10 can, in particular, have a homocentric entrance pupil. This can be accessible. It can also be inaccessible.

[0108] The entrance pupil of the projection optics 10 cannot be precisely illuminated by the second faceted mirror 22. When the projection optics 10 image the center of the second faceted mirror 22 telecentrically onto the wafer 13, the aperture rays often do not intersect at a single point. However, a surface can be found where the pairwise determined separation of the aperture rays is minimized. This surface represents the entrance pupil or a surface conjugate to it in real space. In particular, this surface exhibits a finite curvature.

[0109] The projection optics 10 may have different entrance pupil positions for the tangential and sagittal beam paths. In this case, an imaging element, in particular an optical component of the transmission optics, should be provided between the second faceted mirror 22 and the reticle 7. This optical element can accommodate the different positions of the tangential and sagittal entrance pupils.

[0110] During the Fig. In the arrangement of the components of the illumination optics 4 shown in Figure 1, the second faceted mirror 22 is arranged in a plane conjugate to the entrance pupil of the projection optics 10. The first faceted mirror 20 is arranged tilted relative to the object plane 6. The first faceted mirror 20 is arranged tilted relative to an arrangement plane defined by the deflecting mirror 19. The first faceted mirror 20 is arranged tilted relative to an arrangement plane defined by the second faceted mirror 22.

[0111] Fig. Figure 2 shows an arrangement 100 of the projection exposure system 1. Fig. 1 according to one embodiment. The arrangement 100 comprises an optical system 200 of the projection exposure system 1 according to a first embodiment. The arrangement 100 also comprises a control device 300 of the projection exposure system 1.

[0112] The optical system 200 comprises at least one optical element 202. The optical system 200 further comprises at least one actuator / sensor device 204 assigned to the at least one optical element 202. The assignment of the at least one actuator / sensor device 204 to the at least one optical element 202 is indicated by the reference numeral Z. The at least one actuator / sensor device 204 can be used to actuate the at least one optical element 202 and / or to acquire data related to the at least one optical element 202.

[0113] The optical system 200 also includes an interface device 206, which is optically connected (e.g., via fiber optic cable 208) to at least one actuator / sensor device 204 for data transmission. The interface device 206 can be electrically and / or optically connected to the control device 300. Fig. Figure 2 shows the interface device 206 of the optical system 200 electrically connected to the control device 300 (electrical connection 210). Although the connection 210 is described here as an electrical connection, it may also be configured as an optical connection in other examples.

[0114] As in Fig. As can be seen in Figure 2, the interface device 206 has a first microcomponent 212. The first microcomponent 212 comprises a first processor element 214 and a first optical interface element 216 integrated with the first processor element 214. Fig. 3) The first optical interface element 216 is configured to receive optical signals from the at least one actuator-sensor device 204. The first optical interface element 216 converts the received optical signals into electrical signals and transmits the electrical signals to the first processor element 214. The electrical signals are then transmitted by the first processor element 214 via the electrical connection 210 to the control device 300 for evaluation. The first optical interface element 216 is also configured to receive electrical signals from the first processor element 214 (transmitted by the control device 300), to convert the received electrical signals into optical signals, and to send the optical signals to the at least one actuator-sensor device 204.

[0115] As in Fig. As shown in Figure 2, the at least one actuator-sensor assembly 204 also includes a second microcomponent 218. The second microcomponent 218 comprises a second processor element 220 and a second optical interface element 222 integrated with the second processor element 220. Fig. 3) The second optical interface element 222 is configured to receive optical signals from the interface device 206 (in particular from the first optical interface element 216). The second optical interface element 222 converts the received optical signals into electrical signals and transmits the electrical signals to the second processor element 220. The second optical interface element 222 is also configured to receive electrical signals from the second processor element 220, to convert the received electrical signals into optical signals, and to transmit the optical signals to the interface device 206 (in particular to the first optical interface element 216).

[0116] In Fig. Figure 3 shows the first and second microcomponents 212 and 218 in detail according to one embodiment. The first and second microcomponents 212 and 218 can be designed in a similar and / or identical manner. Therefore, in Fig. 3 only one microcomponent 212, 218 is shown, wherein the features shown can be applied to each of the first and second microcomponent 212, 218.

[0117] The optical system 200, for example, has a first circuit board 224 and a second circuit board 226. The first microcomponent 212 is arranged on the first circuit board 224. Furthermore, the second microcomponent 218 is arranged on the second circuit board 226.

[0118] The first microcomponent 212 optionally has a first substrate 228 (first component substrate) that is attached to the first printed circuit board 224 and electrically contacted. The second microcomponent 218 optionally has a second substrate 230 (second component substrate) that is attached to the second printed circuit board 226 and electrically contacted. For example, each of the first and second substrates 228, 230 has multiple vias 232, each of which is electrically connected to traces (not shown) of the first and second printed circuit boards 224, 226, respectively, by means of electrical contacts 234 (e.g., solder joints). Fig. Figure 3 shows only some of the vias 232, and one of them is labeled with a reference symbol. Furthermore, in Fig. 3 only some of the electrical contacts 234 are shown and one of them is marked with a reference symbol.

[0119] As in Fig. As shown in Figure 3, the first microcomponent 212 also has a first intermediate unit 236 (first interposer unit) on which the first processor element 214 and the first optical interface element 216 are arranged. Furthermore, the second microcomponent 218 has a second intermediate unit 238 (second interposer unit) on which the second processor element 220 and the second optical interface element 222 are arranged. A distance D between the corresponding processor element 214, 216 and the corresponding optical interface element 220, 222 in the first and second microcomponent 212, 218 is, for example, 100 µm or less.

[0120] The first processor element 214 and the first optical interface element 216 are each electrically connected to the first intermediate unit 236 (electrical contacts 240, e.g., micro-solder joints, e.g., with a diameter of 40 µm). The same applies accordingly to the second processor element 220, the second optical interface element 222, and the second intermediate unit 238. For example, the first / second intermediate unit 236, 238 has several further vias 242 that are electrically connected to the electrical contacts 240. Fig. Figure 3 shows only some of the further vias 242, and one of them is labelled with a reference symbol. Furthermore, in Fig. 3 only some of the electrical contacts 240 are shown and one of them is marked with a reference symbol.

[0121] Furthermore, the first processor element 214 and the first optical interface element 216 are electrically connected within the first intermediate unit 236 (see electrical connection / via 244 in Fig. 3) The same applies accordingly to the second processor element 220, the second optical interface element 222 and the second intermediate unit 238.

[0122] If, in addition to the first / second intermediate unit 236, 238, a component substrate 228, 230 is provided (as in Fig. 3 (shown with dashed lines), then the first / second intermediate unit 236, 238 is arranged on the component substrate 228, 230 and electrically connected to it (electrical contacts 246 in Fig. 3) However, if no component substrate 228, 230 is provided (not shown), then the first / second intermediate unit 236, 238 is arranged directly on the first / second circuit board 224, 226 and electrically connected to it.

[0123] By designing the first and second components 212, 218 as interposer-based chiplet technology, the first and second optical interface elements 216, 222 can be provided in a particularly space-saving manner and with a high data transmission rate and bandwidth.

[0124] In the example of Fig. 2 The optical system 200 has a vacuum housing 248 in which a vacuum atmosphere V prevails. Furthermore, in the example of Fig. 2 the at least one optical element 202 is arranged at least partially within the vacuum atmosphere V of the vacuum housing 248. In the example of Fig. 2 In particular, an optically active surface 250 of the at least one optical element 202 is arranged in the vacuum atmosphere V of the vacuum housing 248.

[0125] The interface device 206 and the at least one actuator / sensor device 204 can also be arranged within the vacuum atmosphere V of the vacuum housing 248 (not shown). Optionally, however, the optical system 200 can also have at least one protective housing 252, which is at least partially arranged within the vacuum housing 248, as shown in Fig. Figure 2 is shown with dashed lines. The protective housing 252 is, in particular, vacuum-tight. Within the protective housing 252 (area 254), an atmospheric pressure A prevails.

[0126] For example, the first and second microcomponents 212 and 218 are arranged in the area 254, which is under atmospheric pressure A. In the area 254, the microcomponents 212 and 218 are located. Fig. In the example shown in Figure 2, the interface device as a whole (including the first micro-component 212) and the at least one actuator / sensor device 204 as a whole (including the second micro-component 218) are arranged in the area 254 which is under atmospheric pressure A.

[0127] If, as in Fig. If, as shown in Figure 2, the protective housing 252 is provided under atmospheric pressure A, then an electrical and / or optical vacuum feedthrough 256 can also be used. In the following, the vacuum feedthrough 256 is described by way of example as an electrical vacuum feedthrough 256, although in other examples it may also be an optical vacuum feedthrough 256. The electrical vacuum feedthrough 256, in particular, passes through the vacuum housing 248 and connects an external space R of the vacuum housing 248 (e.g., a cleanroom R) with the internal space 254 of the protective housing 252. The electrical vacuum feedthrough 256 is configured to carry at least one electrical connection 210, which is electrically connected to the interface device 206 and electrically connectable to the control device 300.

[0128] The protective housing 252, which is at atmospheric pressure A, allows the electronics, in particular the first and second microcomponents 212, 218, to be separated from the vacuum atmosphere V. This prevents outgassing from the electronics from disturbing the vacuum atmosphere V.

[0129] Instead of the in Fig. The optional protective housing 252 shown can also be a cavity 258 formed within a printed circuit board 224', 226' ( Fig. 4) separate the first and second microcomponent 212, 218 from the vacuum atmosphere V as described in DE 10 2022 207 555 A1.

[0130] As in Fig. As shown in Figure 4, the first and / or second circuit board 224', 226' can each be formed from a composite material 260. The composite material 260 has an inner cavity 258 that is completely surrounded by the composite material 260. The cavity 258 of the first and / or second circuit board 224', 226' forms a first or second vacuum-tight protective housing 262, respectively. The first microcomponent 212 is arranged in the vacuum-tight protective housing 262 of the first circuit board 224'. The second microcomponent 218 is also arranged in the vacuum-tight protective housing 262 of the second circuit board 226'.

[0131] The first / second circuit board 224', 226' has a number N (with in particular N ≥ 5) of layers 264, 266, 268 forming the composite material 260, comprising two outer layers 264 and N-2 inner layers 266, 268 arranged between the two outer layers 264.

[0132] Without loss of generality, N = 13 in Fig. 4. The N-2 inner layers 266, 268, therefore the 11 inner layers in Fig. 4, are formed by an alternating sequence of metal layers 266 and insulating layers 268. In this case, Fig. 4 an inner layer without hatching a metal layer 266 and an inner layer with hatching an insulator layer 268.

[0133] For the sake of clarity, only one metal layer 266 and one insulating layer 268 are each provided with a reference numeral.

[0134] The metal layers 266 are, for example, made of copper. The insulating layers 268 are, for example, made of a glass fiber substrate and / or an epoxy resin. The two outer layers 264 (in Fig. 4 the top layer as well as the bottom layer) are designed, for example, as an insulating layer, preferably as a rigid plastic film.

[0135] The outer layers 264 can also be designed as a lacquer or as a metal layer suitable for heat spreading. In particular, for the latter example, the side faces of the first / second circuit board 224', 226' can also be provided with a metal layer suitable for heat spreading (not shown in Fig. 4).

[0136] As in the Fig. As shown in Figures 5 to 7, the optical system 400, 500, 600 can also have several actuator / sensor devices 404, 504, 604, with different topologies possible for the design of the optical transmission paths.

[0137] Fig. Figure 5 shows an optical system 400 according to a second embodiment with several actuator / sensor units 404 (three are shown by way of example, without limitation), which are assigned to an optical element 202 (assignment Z). Each of the actuator / sensor units 404 has a second microcomponent 418 with a second processor element 420 and a second optical interface element 422 – similar to the second microcomponent 418 in Figure 5. Fig. 2, Fig. 3. Furthermore, the interface device 206 is optically connected to each of the several actuator / sensor devices 404 by means of a respective optical fiber 408a, 408b, 408c.

[0138] Fig. Figure 6 shows an optical system 500 according to a third embodiment with several actuator / sensor devices 504 (three are shown by way of example without limitation), which are assigned to an optical element 202 (assignment as in Fig. 5) Each of the actuator / sensor devices 504 has a second microcomponent 518 with a second processor element 520 and a second optical interface element 522 - similar to the second microcomponent 218 in Fig. 2, Fig. 3. The optical system 500 also includes a relay device 524. The relay device 524 comprises a third microcomponent 526 with a third processor element 528 and an integrated third optical interface element 530 – similar to the first and / or second microcomponent 212, 218 in Fig. 2, Fig. 3.

[0139] The interface device 206 is optically connected to the forwarding device 524 by means of an optical fiber 508a. Furthermore, each of the several actuator / sensor devices 504 is optically connected to the forwarding device 524 by means of a respective optical fiber 508b, 508c, 508d.

[0140] Fig. Figure 7 shows an optical system 600 according to a fourth embodiment with several actuator / sensor devices 604 (three are shown by way of example, without limitation), which are assigned to an optical element 202 (assignment as in Fig. 5).

[0141] Each of the actuator / sensor devices 604 has a second microcomponent 618 with a second processor element 620 and a second optical interface element 622 - similar to the second microcomponent 218 in Fig. 2, Fig. 3. The optical system 600 also includes at least one forwarding device 624, 624'. In the example of Fig. Figure 7 shows two forwarding devices 624, 624' as examples. The forwarding device 624 comprises a third microcomponent 626 with a third processor element 628 and an integrated third optical interface element 630 – similar to the first and / or second microcomponent 212, 218 in Figure 7. Fig. 2, Fig. 3. Furthermore, the forwarding device 624' comprises a fourth microcomponent 626' with a fourth processor element 628' and an integrated fourth optical interface element 630' - similar to the first and / or second microcomponent 212, 218 in Fig. 2, Fig. 3.

[0142] In the embodiment of Fig. 7 are the interface device 206, which optically connects at least one forwarding device 624, 624' (e.g. the two forwarding devices 624, 624') and the multiple actuator / sensor devices 604 using multiple optical fibers 608a to 608h such that there are at least two independent optical transmission paths W1, W2 between the interface device 206 and each of the multiple actuator / sensor devices 604.

[0143] In the example of Fig. In particular, the interface device 206 is optically connected to the forwarding device 624 by means of an optical fiber 608a. The interface device 206 is also optically connected to the forwarding device 624' by means of an optical fiber 608e. Furthermore, similar to that in Fig. 6 - Each of the multiple actuator / sensor devices 604 is optically connected to the relay device 624 by means of a respective optical fiber 608b, 608c, 608d. Additionally, for example, one of the actuator / sensor devices 604 is optically connected to the relay device 624' by means of an optical fiber 608f. Although not shown, more than one of the actuator / sensor devices 604 can also be optically connected to the relay device 624' by means of a respective optical fiber. Furthermore, for example, one of the actuator / sensor devices 604 is optically connected to another of the actuator / sensor devices 604 by means of an optical fiber 608g. The next of the actuator / sensor units 604 is then, for example, optically connected to yet another actuator / sensor unit 604 by means of an optical fiber 608h. Although in Fig. Not shown in Figure 7, but all of the actuator / sensor units 604 can also be optically connected to several and / or all of the other actuator / sensor units 604 by means of a respective optical fiber.

[0144] This means that, for example, the in Fig. 7. The uppermost actuator / sensor unit 604 is connected via a first optical transmission path W1 (608e+608f), a second optical transmission path W2 (608a+608d), a third optical transmission path (without reference numeral, 608a+608c+608g), and a fourth optical transmission path (without reference numeral, 608a+608b+608h+608g). The first optical transmission path W1 is independent of the second to fourth optical transmission paths (e.g., the second optical transmission path W2), because the first optical transmission path W1 does not share a common optical fiber 608a to 608h with the second to fourth optical transmission paths (e.g., the second optical transmission path W2). The other actuator / sensor units 604 in Fig. 7 are each connected via at least two independent optical transmission paths, as shown in Fig. 7 can be seen.

[0145] The advantage of this network-like and partially ring-like topology of the optical transmission paths is that it provides redundant optical transmission paths W1, W2 in the event that one of the transmission paths, e.g., one of the optical fibers 608a to 608h, fails. This prevents the failure of the entire system 600 due to the malfunction of a single component (single point of failure).

[0146] The optical system 200, 400, 500, 600 can, for example, also be used in a DUV lithography system.

[0147] Although the present invention has been described using exemplary embodiments, it can be modified in many ways. REFERENCE MARK LIST 1 Projection exposure system 2 Lighting system 3 light source 4 Lighting optics 5 object field 6 Object level 7 reticles 8 label holders 9 Reticle displacement drive 10 Projection optics 11 Image field 12 Image plane 13 wafers 14 wafer holders 15 wafer transfer drive 16 Lighting radiation 17 Collector 18 Intermediate focus plane 19 deflecting mirrors 20 first faceted mirror 21 first facet 22 second faceted mirror 23 second facet 100 arrangement 200 System 202 Element 204 Actuator / Sensor Setup 206 Interface setup 208 optical fibers 210 connection 212 Microcomponent 214 Processor element 216 Interface element 218 Microcomponent 220 processor element 222 Interface element 224, 224' circuit board 226, 226' circuit board 228 Substrat 230 substrate 232 Via 234 Contact 236 Intermediate Unit 238 Intermediate Unit 240 Contact 242 Via 244 connection 246 Contact 248 vacuum housings 250 area 252 protective housings 254 area 256 Vacuum feedthrough 258 cavity 260 composite materials 262 Protective housings 264 layers 266 Metal layer 268 Insulator layer 300 control device 400 System 404 Actuator / Sensor Setup 408a-408c optical fibers 418 Microcomponent 420 processor element 422 Interface element 500 System 504 Actuator / Sensor Setup 508a-508d optical fibers 518 Microcomponent 520 processor element 522 Interface element 524 Forwarding device 526 Microcomponent 528 Processor element 530 Interface element 600 System 604 Actuator / Sensor Setup 608a-608h optical fibers 618 Microcomponent 620 processor element 622 Interface element 624, 624' Forwarding device 626, 626' Microcomponent 628, 628' Processor element 630, 630' Interface element A print D distance M1-M6 mirrors R Outdoor area V Vacuum atmosphere W1 transmission path W2 transmission path Z assignment QUOTES INCLUDED IN THE DESCRIPTION

[0000] This list of documents cited by the applicant was automatically generated and is included solely for the reader's convenience. The list is not part of the German patent or utility model application. The DPMA accepts no liability for any errors or omissions. Cited patent literature

[0000] US 4 982 055 A1

[0036] US 6 305 975 B1

[0036] WO 14 076 303 A1

[0036] DE 10 2008 009 600 A1 [0080, 0084] US 2006 / 0132747 A1

[0082] EP 1 614 008 B1

[0082] US 6,573,978

[0082] DE 10 2017 220 586 A1

[0087] US 2018 / 0074303 A1

[0101] DE 10 2022 207 555 A1

[0129]

Claims

[1] Optical system (200) for a lithography system (1), comprising at least one optical element (202), at least one actuator / sensor device (204) associated with at least one optical element (202), an interface device (206) which is optically connected to the at least one actuator / sensor device (204) for data transmission and can be electrically and / or optically connected to a control device (300), wherein the interface device (206) comprises a first microcomponent (212) with a first processor element (214) and an integrated first optical interface element (216), and comprising at least one actuator / sensor device (204), a second micro component (218) with a second processor element (220) and an integrated second optical interface element (222) which is optically connected to the first optical interface element (216). [2] Optical system according to claim 1, wherein the at least one optical element (202) is arranged at least partially in a vacuum atmosphere (V), and the first and second microcomponent (212, 218) are arranged in a region (254) under atmospheric pressure (A). [3] Optical system according to claim 1 or 2, comprising a vacuum housing (248) located under a vacuum atmosphere (V), and at least one protective housing (252) arranged at least partially inside the vacuum housing (248) and located under atmospheric pressure (A), wherein the at least one optical element (202) is arranged at least partially within the vacuum atmosphere (V) of the vacuum housing (248), and the first and second microcomponent (212, 218) are arranged within the at least one protective housing (252). [4] Optical system according to claim 3, comprising an electrical and / or optical vacuum feedthrough (256) connecting the protective housing (252) through the vacuum housing (248) to an outer space (R) of the vacuum housing (248) for the passage of at least one electrical and / or optical connection (210) connected to the interface device (206). [5] Optical system according to any one of claims 1 to 4, comprising a first printed circuit board (224) on which the first micro-component (212) is arranged, and / or a second printed circuit board (226) on which the second micro-component (218) is arranged. [6] Optical system according to claim 3, comprising a first printed circuit board (224') on which the first micro-component (212) is arranged, and / or a second printed circuit board (226') on which the second micro-component (218) is arranged, wherein the first and / or second circuit board (224', 226') is / are each made of a composite material (260) which has an inner cavity (258), the cavity (258) of the first and / or second circuit board (224', 226') forms a first or second vacuum-tight protective housing (262), respectively, and the first and / or second microcomponent (212, 218) is / are arranged accordingly in the first or the second vacuum-tight protective housing (262). [7] Optical system according to any one of claims 1 to 6, wherein the first processor element (214) and the first optical interface element (216) are arranged on a common first substrate (236) of the first microbreathing part (212), and / or the second processor element (220) and the second optical interface element (222) are arranged on a common second substrate (238) of the second microbreathing part (218). [8] Optical system according to any one of claims 1 to 7, wherein the first processor element (214) and the first optical interface element (216) are arranged on a first intermediate unit (236) of the first microcomponent (212) and are electrically connected to each other (244) within the first intermediate unit (236), and / or the second processor element (220) and the second optical interface element (222) are arranged on a second intermediate unit (238) of the second microcomponent (218) and are electrically connected to each other within the second intermediate unit (238). [9] Optical system according to any one of claims 1 to 8, wherein the first and second optical interface element (216, 222) are optically connected to each other by means of one or more optical waveguides (208). [10] Optical system according to claim 9, wherein one or more optical waveguides (208) comprise a polymer-based optical waveguide. [11] Optical system according to any one of claims 1 to 10, comprising several of the actuator / sensor devices (404), wherein the interface device (206) is optically connected to each of the several actuator / sensor devices (404) by means of a respective optical waveguide (408a-408c). [12] Optical system according to any one of claims 1 to 10, comprising several of the actuator / sensor devices (504) and a relay device (524), wherein the relay device (524) comprises a third microcomponent (526) with a third processor element (528) and a third optical interface element (530) integrated therein, the interface device (206) is optically connected to the relay device (524) by means of an optical waveguide (508a), and the relay device (524) is optically connected to each of the several actuator / sensor devices (504) by means of a respective optical waveguide (508b-508d). [13] Optical system according to any one of claims 1 to 10, comprising several of the actuator / sensor devices (604) and at least one relay device (624, 624') with a third microcomponent (626, 626') comprising a third processor element (628, 628') and a third optical interface element (630, 630') integrated therein, wherein the interface device (206), the at least one relay device (624, 624') and the several actuator / sensor devices (604) are optically connected to each other by means of several optical waveguides (608a-608h) such that there are at least two independent optical transmission paths (W1, W2) between the interface device (206) and each of the several actuator / sensor devices (604). [14] Arrangement (100) for a lithography system (1), comprising an optical system (200) according to any one of claims 1 to 13, and a control device (300) arranged in a grey room or in a cleanroom (R), wherein the interface device (206) of the optical system (200) and the control device (300) are connected by means of an electrical and / or optical line (210) for data transmission. [15] Lithography system (1) with an optical system (200) according to any one of claims 1 to 13, and / or an arrangement (100) according to claim 14.

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