TEMPERATURE CONTROL DEVICE FOR TEMPERING A POSITION-SENSITIVE COMPONENT OF A LITHOGRAPHING PLANT AND LITHOGRAPHING PLANT

Abstract

A temperature control device (200) for temperature control of a position-sensitive component (102) of a lithography system (1), comprising: a liquid line (208) for transporting a temperature control liquid (206), wherein the liquid line (208) has a line section (218), and a silencer device (216) for damping a pressure fluctuation of the temperature control fluid (206), wherein the silencer device (216) has a sound absorption element (222) arranged within the line section (218), which has a fluid-permeable absorber material (226).

Description

[0001] The present invention relates to a temperature control device for temperature control of a position-sensitive component of a lithography system and to a lithography system with such a temperature control device.

[0002] Microlithography is used to manufacture microstructured components, such as integrated circuits. The microlithography process is carried out using a lithography system, which includes an illumination system and a projection system. The image of a mask (reticule) illuminated by the illumination system is projected by the projection system onto a substrate, such as a silicon wafer, coated with a photosensitive layer (photoresist) and positioned in the image plane of the projection system. This transfers the mask structure onto the photosensitive coating of the substrate.

[0003] Driven by the pursuit of ever smaller structures in the fabrication of integrated circuits, EUV lithography systems are currently being developed that utilize light with wavelengths ranging from 0.1 nm to 30 nm, particularly 13.5 nm. Since most materials absorb light of this wavelength, such EUV lithography systems must employ reflective optics, i.e., mirrors, instead of the previously used refracting optics, i.e., lenses.

[0004] The demands on the accuracy and precision of the imaging properties of lithography systems are constantly increasing. From a dynamic perspective, it is therefore essential to minimize the influence of interference on the movement of various position-sensitive components of the lithography system.

[0005] For example, very precise positioning of optical components, especially mirrors, is required in the lithography system. Dynamic disturbances affecting optical components can be generated, for example, by the movement of other components of the lithography system or by acoustic disturbances. Acoustic disturbances can be transmitted as pressure fluctuations of a fluid (e.g., coolant) in the fluid lines of a temperature control device (e.g., a cooling device) of the lithography system to temperature-controlled (e.g., cooled), position-sensitive components of the lithography system. Pressure fluctuations of the fluid are generated, for example, by flow-induced vibrations (FIV). Pressure fluctuations of the fluid can also be generated by the transmission of mechanical vibrations from other mechanical components (e.g., support elements) to a fluid line (e.g., via fasteners) or by external acoustic excitation.Such pressure fluctuations of the liquid due to mechanical vibration excitation of the liquid line can also be present without a flow of the liquid.

[0006] With the increasing complexity of lithography systems, further dynamic disturbances within and outside the system are to be expected, making additional mechanisms for their suppression or compensation desirable and necessary. Conventional solutions for reducing disturbance excitation of mirrors in a lithography system due to flow-induced vibrations are known, for example, from WO 2021 013 441 A1.

[0007] Against this background, one object of the present invention is to provide an improved temperature control device for temperature control of a position-sensitive component of a lithography system.

[0008] Accordingly, a temperature control device for temperature-controlling a position-sensitive component of a lithography system is proposed. The temperature control device comprises a fluid line for transporting a temperature control fluid, wherein the fluid line includes a pipe section. Furthermore, the temperature control device includes a silencer device for damping pressure fluctuations in the temperature control fluid, wherein the silencer device comprises a sound absorption element arranged within the pipe section, which has a fluid-permeable absorber material.

[0009] The silencer system dampens pressure fluctuations in the temperature control fluid by absorbing sound energy using the sound absorption element. Specifically, the sound absorption element is designed such that an incoming pressure wave is redirected (e.g., multiple times) and / or at least partially reflected within it. This reduces the energy of the incoming pressure wave. For example, the energy of the incoming pressure wave is converted into heat through friction, and / or pressure fluctuations are superimposed through negative interference to form a lower-amplitude average. Consequently, the silencer system significantly reduces the propagation of pressure fluctuations through the temperature control fluid. This reduces and / or prevents acoustic interference with the position-sensitive component.

[0010] In this context, "damping of pressure fluctuations" of the temperature control fluid is generally understood to mean a reduction of pressure fluctuations. Specifically, "damping of pressure fluctuations" here refers not only to dissipation, i.e., the conversion of energy from a pressure fluctuation into motion or directly into heat, but also to at least partial suppression and / or cancellation of the pressure fluctuation through reflection and superposition of sound waves.

[0011] The position-sensitive component of the lithography system can be an optical or a mechanical component, such as a projection lens. In particular, the position-sensitive component is a part that must be held in a precise position with only small tolerances during operation of the lithography system.

[0012] The position-sensitive component of the lithography system is, for example, a mirror within the system, such as a mirror in the projection optics. The mirrors of a projection optic in an EUV lithography system are typically mounted on a support frame by means of actuators, allowing precise adjustment of the mirror's position, for example, in six degrees of freedom. These six degrees of freedom include, in particular, three translational degrees of freedom (e.g., in three mutually perpendicular spatial directions) and three rotational degrees of freedom (e.g., rotation about the three mutually perpendicular spatial directions).

[0013] The position-sensitive component of the lithography system can also be a support structure and / or frame structure that serves as a (e.g., optical) reference. The position-sensitive component can, for example, be a sensor frame of the lithography system, such as the projection optics of the lithography system. A sensor frame typically includes a sensor device for measuring the current position of one or more optical components of the lithography system relative to the sensor frame. The sensor frame is, for example, vibrationally decoupled from a support frame of the optical component(s). The sensor device comprises, for example, one or more sensors, such as interferometers and / or other measuring devices for detecting the position of the optical component(s). The optical component(s) may, for example, include reflector elements for reflecting light emitted by the sensors (e.g., laser light).For example, one or more sensors are used to detect the position of the optical component(s) in the six degrees of freedom.

[0014] The temperature control device can be used to influence the thermal condition of the position-sensitive component. Specifically, the temperature control device can be used to regulate the temperature of the position-sensitive component, meaning it can be cooled or heated. Accordingly, the temperature control device is, for example, a cooling device or a heating device. Furthermore, the temperature control fluid is, for example, a cooling fluid or a heating fluid.

[0015] In the following, the temperature control device is usually described as a cooling device. However, in other embodiments, the temperature control device can also be a heating device. Therefore, whenever the present application refers to a cooling device, cooling unit, cooling, coolant, cooling line, etc., it could just as easily mean a heating device, heating unit, heating, heating fluid, heating line, etc.

[0016] The cooling device, as an example of a temperature control device, serves in particular to prevent high temperatures and temperature fluctuations of the position-sensitive component.

[0017] In particular, mirrors in an EUV lithography system (as an example of position-sensitive components) heat up as a result of absorbing the high-energy EUV radiation. The resulting high temperatures and temperature fluctuations within the mirror, and the associated thermal deformations, can lead to wavefront aberrations and thus impair the mirror's imaging properties. To prevent thermally induced deformations, the mirrors in the lithography system can be actively cooled.

[0018] The cooling device, as an example of a temperature control device, can also be used (additionally or instead) to cool, for example, a sensor frame (as an example of a position-sensitive component). This prevents thermal crosstalk (e.g., heating of the sensor frame by heat radiation). Heat radiation is caused in particular by ambient light, such as scattered light, from the lithography system, which is absorbed by mirror surfaces or structural elements. Other heat sources can include actuators and heating heads. The cooling device creates a stable temperature environment for the sensor frame. This allows for more accurate position measurement of the mirror or mirrors using the sensor device held by the sensor frame.

[0019] The cooling device, as an example of a temperature control device, further comprises, for example, a cooling unit for cooling the coolant, one or more pumps for generating a required coolant flow rate, and one or more valves for controlling the coolant flow.

[0020] Cooling requires a specific coolant flow rate, which is achieved via a pump system. This results in dynamic disturbances, as each pump generates local pressure fluctuations. These are transmitted throughout the entire cooling circuit via coolant noise (water noise, longitudinal water noise wave). Furthermore, any change in cross-section, any bend in the fluid line, and any valve in the cooling circuit can represent a source of disturbance, causing local pressure fluctuations in the fluid. This type of dynamic disturbance is also known as flow-induced vibration (FIV).

[0021] In addition to FIV, pressure fluctuations of the fluid can also be generated by mechanical vibration excitation of the fluid line (e.g. by vibration of a support frame) or by external acoustic excitation.

[0022] The disturbance is transmitted to the cooled position-sensitive component via waterborne sound. This can cause the position of the position-sensitive component to deviate from a desired position. In particular, a pressure surge from the coolant acts on surfaces of the cooled position-sensitive component. The pressure surge is converted into a force at the surfaces on which it acts. This force causes the position of the position-sensitive component to deviate from a desired position. Generally speaking, any pressure disturbance, such as one or more pressure surges, a harmonic pressure signal, and / or harmonic pressure fluctuations in the coolant, can cause disturbances in the cooled position-sensitive component.

[0023] The proposed temperature control device, e.g., a cooling device, with its conduit section containing the sound absorption element, can dampen pressure fluctuations in the temperature control fluid, e.g., coolant, and thus reduce or prevent their transmission to the position-sensitive component. Consequently, the imaging performance of the lithography system can be improved. Furthermore, interference can be better compensated for, even in increasingly complex lithography systems with a growing number of sources of interference.

[0024] The lithography system is, for example, an EUV or a DUV lithography system. EUV stands for "extreme ultraviolet" and refers to a wavelength of the working light in the range of 0.1 nm to 30 nm, specifically 13.5 nm. DUV stands for "deep ultraviolet" and refers to a wavelength of the working light between 30 nm and 250 nm.

[0025] The EUV or DUV lithography system comprises an illumination system and a projection system. Specifically, the EUV or DUV lithography system projects the image of a mask (reticule) illuminated by the illumination system onto a substrate, such as a silicon wafer, coated with a photosensitive layer (photoresist) and positioned in the image plane of the projection system, in order to transfer the mask structure onto the photosensitive coating of the substrate.

[0026] The section of the fluid line (e.g., cooling line) includes, for example, a fluid pipe (e.g., a metal pipe and / or a stainless steel pipe) with an outer and an inner wall. The section of the fluid line (e.g., cooling line) may also include a fluid channel formed within a solid body (e.g., a support frame of the lithography system). The fluid channel may be formed, for example, by machining the solid body (e.g., by cutting, machining, milling, and / or forming). Alternatively, the fluid channel may be formed, for example, by primary forming the solid body (e.g., by casting and / or additive manufacturing).

[0027] The fluid line serves, for example, to transport the temperature control fluid to and / or from the position-sensitive component. The fluid line serves, for example, to transport the temperature control fluid from a temperature control unit (e.g., a cooling unit) of the temperature control device to the position-sensitive component and / or from the position-sensitive component (back) to the temperature control unit. The temperature control device can also have more than one fluid line.

[0028] The liquid line and / or the line section has / have, for example, a circular cross-section, an oval cross-section or a rectangular cross-section.

[0029] The section of the fluid line has, in particular, an interior space for holding the temperature control fluid. The sound absorption element is also located within this interior space.

[0030] The temperature control fluid (e.g., cooling fluid) is or comprises, for example, water or another suitable liquid.

[0031] The silencer device includes in particular the sound absorption element and may also include more than one sound absorption element.

[0032] The sound absorption element is attached, for example, within the pipe section and / or to an inner wall(s) of the pipe section. For instance, the sound absorption element is held in place within the pipe section between the inner walls by a positive fit and / or clamped (e.g., elastically). The sound absorption element can also be glued, welded (e.g., by spot welding), and / or screwed to an inner wall(s) of the pipe section. The sound absorption element can also be connected to the pipe section, for example, by means of a press fit.

[0033] The temperature control device can also have more than one silencer device.

[0034] The sound absorption element incorporates a liquid-permeable absorber material. Consequently, the temperature control fluid can penetrate the sound absorption element, allowing the energy of pressure fluctuations in the temperature control fluid to be at least partially absorbed within the sound absorption element.

[0035] According to one embodiment, the conductor section has a cross-sectional expansion. Furthermore, the sound absorption element is arranged in a region of this cross-sectional expansion.

[0036] The section of the liquid pipeline, for example, has a first section without the cross-sectional expansion, a second section with the cross-sectional expansion, and a third section without the cross-sectional expansion. The area of ​​the cross-sectional expansion is defined in particular by the second section.

[0037] In other embodiments, the sound absorption element can also be arranged in an area of ​​cross-sectional narrowing of the conduit section or in a conduit section without a change in cross-section.

[0038] According to another embodiment, the sound absorption element comprises a porous absorber material, a fibrous absorber material, an elastic absorber material and / or a particle-containing absorber material.

[0039] The material structure of a porous absorber material dampens the vibrational energy of the liquid molecules during an incoming pressure fluctuation, resulting in frictional effects. This converts at least some of the liquid's sound energy into heat energy. Furthermore, the incoming pressure fluctuation can be at least partially reflected by the porous material, leading to negative interference (i.e., at least partial cancellation) of the pressure fluctuation. Additionally, a porous absorber material exhibits, for example, an almost infinite number of impedance discontinuities with very small characteristic lengths. The characteristic length 1, based on the frequency f of the first harmonic wave and the speed of sound c, is given by the following equation: f = c / 2 · 1. According to this equation, a very small characteristic length 1 corresponds to a high frequency f.Thus, these reflections lead to very high frequencies f. The advantage is that the frequencies are therefore outside the sensitive and relevant range.

[0040] The porous absorber material may consist of, for example, an open-pore material, a porous solid, a porous foam (e.g., melamine foam, PUR foam), a porous plastic, a porous ceramic material (e.g., silicon carbide, porous silicon carbide ceramic material) and / or a porous metal.

[0041] The porous absorber material can also include a fibrous absorber material. This fibrous absorber material can, for example, consist of wool, glass wool, and / or rock wool.

[0042] An elastic absorber material can convert the energy of a pressure fluctuation into deformation energy and / or kinetic energy of the elastic material. Specifically, the elastic absorber material is compressed and / or expanded and / or set in motion by an incoming pressure wave.

[0043] The elastic material can, for example, also be a viscoelastic material. In the case of a viscoelastic material, which exhibits both elastic and viscous properties, the energy of the incoming pressure wave can be at least partially dampened by the viscous component. This allows the energy of the incoming pressure wave to be dissipated and the amplitude of the outgoing pressure wave to be reduced.

[0044] The elastic material may contain, for example, polyurethane (PUR), silicone, rubber, natural rubber, silicone rubber, fluororubber, perfluororubber, polynorbornene rubber, perfluoroalcyl vinyl ether, perfluoroalkoxy, polyvinyl chloride, one or more thermoplastic elastomers, a fluorothermoplastic such as tetrafluoroethylene, polytetrafluoroethylene, hexafluoropropylene and / or vinylidene fluoride, and / or another elastic material.

[0045] The particle-containing absorber material contains, for example, a large number of individual particles, such as spheres. The particle-containing medium can be, for example, sand, glass spheres (e.g., with a predetermined diameter), or the like.

[0046] According to another embodiment, the cross-sectional expansion of the conductor section has an expansion from a first cross-section to a second cross-section that is larger than the first cross-section, and a reduction from the second cross-section to a third cross-section that is smaller than the second cross-section.

[0047] This means that the section of the pipe has a local cross-sectional expansion.

[0048] The cross-sectional expansion causes an impedance jump in the temperature control fluid, which dampens pressure fluctuations of the temperature control fluid.

[0049] In the case of a sound absorption element that completely fills the cross-section of the pipe section, the increased cross-sectional area can also serve to keep the flow rate of the temperature control fluid essentially constant despite the sound absorption element increasing the resistance of the fluid. Furthermore, turbulence in the temperature control fluid can be reduced.

[0050] The third cross-section, for example, is the same size as the first cross-section.

[0051] According to another embodiment, the expansion from the first cross-section to the second cross-section is designed discontinuously or continuously, and / or the reduction from the second cross-section to the third cross-section is designed discontinuously or continuously.

[0052] If the transition from the first to the second cross-section is discontinuous, the cross-section of the pipe section can also be described as changing abruptly and / or in the form of a step (e.g., a 90° step) from the first to the second cross-section. For example, the pipe section might have an outer wall that undergoes a 90° angle change when transitioning from the first to the second cross-section. The same applies to the reduction in cross-section from the second to the third.

[0053] If the expansion from the first to the second cross-section is continuous, the pipe section includes, in particular, an additional intermediate subsection whose cross-section changes continuously (e.g., uniformly and / or with a uniform slope) from the first to the second cross-section. For example, the pipe section has an outer wall with a deformation at an angle greater than 90° (e.g., 100° or greater, 120° or greater, 140° or greater, and / or 160° or greater). The same applies to the reduction from the second to the third cross-section.

[0054] According to another embodiment, the cross-sectional expansion of the pipe section provides additional volume within the pipe section. Furthermore, the sound absorption element completely fills this additional volume.

[0055] For example, the pipe section has a length and, in the first and third subsections, a first cross-sectional area. Furthermore, the pipe section has a first internal volume to hold the temperature control fluid, where the first internal volume is the mathematical product of the length and the first cross-sectional area. The additional volume provided by the cross-sectional expansion also serves as an additional internal volume for holding the temperature control fluid.

[0056] According to another embodiment, the sound absorption element completely fills the conductor section when viewed in cross-section.

[0057] In embodiments where the conductor section has the cross-sectional expansion, the sound absorption element can completely fill the conductor section, e.g. in the area of ​​the cross-sectional expansion.

[0058] According to another embodiment, viewed in cross-section, the pipe section has a liquid chamber that is free of the sound absorption element and a sound absorption chamber in which the sound absorption element is arranged.

[0059] The sound absorption chamber thus houses the sound absorption element. Additionally, the sound absorption chamber is designed to hold the temperature control fluid within the fluid-permeable sound absorption element.

[0060] In embodiments in which the conduit section has the cross-sectional expansion, the conduit section, viewed in cross-section, can have said liquid chamber and said sound absorption chamber, particularly in the area of ​​the cross-sectional expansion.

[0061] In certain embodiments, the fluid chamber and the sound absorption chamber are arranged axially symmetrically to each other with respect to a central longitudinal axis of the conduit section. If disturbances, such as turbulence, occur in the temperature control fluid, these are generated (e.g., partially) symmetrically. This allows the resulting forces to (e.g., partially) compensate for each other.

[0062] Furthermore, the liquid chamber and / or the sound absorption chamber can also be designed to be aerodynamically efficient (e.g., with regard to their shape and / or arrangement) (e.g., by providing so-called disturbance geometries), so that the generation of turbulence in the flow can be reduced.

[0063] Alternatively, the liquid chamber and the sound absorption chamber can also be arranged non-symmetrically to each other with respect to the central longitudinal axis of the conduit section.

[0064] According to another embodiment, the sound absorption chamber is seen in the cross-section of the conduit section and is an external sound absorption chamber in relation to the liquid chamber.

[0065] Consequently, the temperature control fluid flows unimpeded through the inner fluid chamber, which is free of the sound absorption element. Furthermore, the temperature control fluid flows through the sound absorption element in the outer sound absorption chamber, thereby dampening pressure fluctuations in the temperature control fluid.

[0066] According to another embodiment, the sound absorption chamber is seen in the cross-section of the conduit section and is an internal sound absorption chamber in relation to the liquid chamber.

[0067] According to a further embodiment, the conduit section comprises a liquid chamber that is free of the sound absorption element and a sound absorption chamber in which the sound absorption element is arranged. Furthermore, the sound absorption device comprises at least one liquid-permeable separating element that tightly separates the sound absorption chamber from the liquid chamber with respect to the sound absorption element.

[0068] The separating element (e.g., a retaining element) is thus permeable to the temperature control fluid (liquid-permeable) but impermeable to the sound absorption element. This prevents the sound absorption element from entering the fluid chamber, which is free of the sound absorption element. In particular, this prevents the sound absorption element from being transported along with the temperature control fluid in the pipe section or fluid line. The separating element is especially advantageous in the case of a fibrous absorber material and a particle-containing absorber material.

[0069] The liquid chamber, which is free of the sound absorption element, and the sound absorption chamber can be corresponding chambers viewed in the cross-section of the pipe section (i.e., perpendicular to a longitudinal direction of the pipe section). However, the liquid chamber, which is free of the sound absorption element, and the sound absorption chamber can also be arranged side by side with respect to the longitudinal axis of the pipe section. Furthermore, more than one liquid chamber, which is free of the sound absorption element, and / or more than one sound absorption chamber can be provided – both with respect to the cross-section of the pipe section and with respect to the longitudinal direction of the pipe section.

[0070] The at least one separating element is arranged, in particular, within the pipe section. The at least one separating element is arranged, for example, parallel to a longitudinal direction of the pipe section and / or to a flow direction of the temperature control fluid within the pipe section. Alternatively, the at least one separating element can also be arranged, for example, transversely to the longitudinal direction of the pipe section and / or to the flow direction of the temperature control fluid.

[0071] According to another embodiment, the separating element has a grid.

[0072] The grid, for example, has a plurality of openings (e.g. holes, bores, slots or the like) to allow the temperature control fluid to pass through.

[0073] The separating element can be any type of suitable separating element (e.g. a membrane and / or separating layer) instead of a grid.

[0074] According to another embodiment, the silencer device is designed to dampen pressure fluctuations of the temperature control fluid in a frequency range of 1 Hz to 2 kHz, 1 Hz to 1 kHz, 1 Hz to 800 Hz, 1 Hz to 500 Hz, 1 Hz to 400 Hz, 1 Hz to 200 Hz, 1 Hz to 100 Hz and / or 50 Hz to 150 Hz.

[0075] For example, the absorber material is designed such that the silencer dampens pressure fluctuations at the specified frequencies. For example, the size of the additional volume provided by the cross-sectional expansion is chosen such that the silencer dampens pressure fluctuations at the specified frequencies.

[0076] According to another embodiment, the line section of the liquid line has a liquid pipe, or the line section of the liquid line has a liquid channel that is formed in a solid body of the lithography system.

[0077] The liquid tube is attached, for example, to a support element of the lithography system.

[0078] In the case of a fluid channel section designed within a solid body, the channel section can be integrated into existing mechanical components of the lithography system. This saves installation space within the lithography system. The solid body could be, for example, a mechanical component of the lithography system. It could be, for example, a support frame and / or a support structure of the lithography system. The fluid channel within the solid body could be formed by cutting, machining, and / or milling. For example, the fluid channel, particularly when viewed in cross-section, might be sealed on the outside of the solid body.

[0079] For example, the fluid line also has a supply section, which includes a fluid pipe and is fluidly connected to a first end of the cooling channel in the solid body, e.g., connected at the first end. For example, the fluid line also has a discharge section, which includes a fluid pipe and is fluidly connected to a second end of the cooling channel in the solid body, e.g., connected at the second end.

[0080] According to another aspect, a lithography system is proposed. The lithography system has a position-sensitive component and a temperature control device, as described above, for controlling the temperature of the position-sensitive component.

[0081] The temperature control device and / or the position-sensitive component is / are preferably part of the projection system of the projection exposure unit. However, the temperature control device and / or the position-sensitive component can / can also be part of a lighting system of the projection exposure unit.

[0082] The term "one" here is not necessarily to be understood as restricting the number to exactly one element. Rather, it can also refer to multiple elements, such as two, three, or more. Similarly, every other counter used here should not be interpreted as restricting the number to the exact number stated. Instead, numerical deviations, both higher and lower, are possible unless otherwise specified.

[0083] Other possible implementations of the invention also include combinations of features or embodiments described previously or subsequently with regard to the exemplary embodiments, even if not explicitly mentioned. In such cases, the person skilled in the art will also add individual aspects as improvements or additions to the respective basic form of the invention.

[0084] Further advantageous embodiments and aspects of the invention are the subject of the dependent claims and the exemplary embodiments of the invention described below. The invention will be explained in more detail below with reference to preferred embodiments and the accompanying figures. Fig. Figure 1 shows a schematic meridional section of a projection exposure system for EUV projection lithography according to one embodiment; Fig. Figure 2 shows an optical system with an optical component of the projection exposure system. Fig. 1 according to one embodiment; Fig. Figure 3 shows a cooling device for cooling the optical component. Fig. 2 according to one embodiment; Fig. Figure 4 shows an enlarged section IV from Fig. 3 with a conductor section and a sound absorption element according to one embodiment; Fig. 5 shows a similar view Fig. 4, but without the sound absorption element; Fig. Figure 6 shows a cross-section of the pipe section made of Fig. 4 along line IV-IV; Fig. Figure 7 shows a conductor section and a sound absorption element according to a further embodiment; Fig. Figure 8 shows a cross-section of the pipe section made of Fig. 7 along line VIII-VIII; Fig. Figure 9 shows a conductor section and a sound absorption element according to a further embodiment; Fig. Figure 10 shows a conductor section and a sound absorption element according to a further embodiment; Fig. Figure 11 shows a cross-section of the pipe section made of Fig. 10 along line XI-XI; Fig. Figure 12 shows a conductor section and a sound absorption element according to a further embodiment; Fig. Figure 13 shows a conductor section and a sound absorption element according to a further embodiment; and Fig. Figure 14 shows a support element of the projection exposure system made of Fig. 1 with a conductor section attached to it and a conductor section formed therein.

[0085] In the figures, identical or functionally equivalent elements have been labelled with the same reference symbols, unless otherwise indicated. Furthermore, it should be noted that the representations in the figures are not necessarily to scale.

[0086] Fig. Figure 1 shows an embodiment of a projection exposure system 1 (lithography system), in particular an EUV lithography system. One embodiment of the illumination system 2 of the projection exposure system 1 has, in addition to a light or radiation source 3, an illumination optic 4 for illuminating an object field 5 in an object plane 6. In an alternative embodiment, the light source 3 can also be provided as a separate module from the rest of the illumination system 2. In this case, the illumination system 2 does not include the light source 3.

[0087] A reticule 7 arranged in the object field 5 is exposed. The reticule 7 is held by a reticule holder 8. The reticule holder 8 can be moved, particularly in a scanning direction, via a reticule displacement drive 9.

[0088] In the Fig. Figure 1 shows a Cartesian coordinate system with an x-direction x, a y-direction y, and a z-direction z. The x-direction x runs perpendicular to the plane of the drawing. The y-direction y runs horizontally, and the z-direction z runs vertically. The scan direction runs in the Fig. 1 along the y-direction y. The z-direction z runs perpendicular to the object plane 6.

[0089] The projection exposure system 1 comprises a projection optic 10. The projection optic 10 serves to image the object field 5 onto an image field 11 in an image plane 12. The image plane 12 is parallel to the object plane 6. Alternatively, an angle other than 0° between the object plane 6 and the image plane 12 is also possible.

[0090] A structure on the reticulum 7 is imaged onto a photosensitive layer of a wafer 13 located in the image plane 12 within the image field 11. The wafer 13 is held by a wafer holder 14. The wafer holder 14 can be moved, particularly along the y-direction y, via a wafer transfer drive 15. The movement of the reticulum 7 via the reticulum transfer drive 9 and of the wafer 13 via the wafer transfer drive 15 can be synchronized.

[0091] Light source 3 is an EUV radiation source. Light source 3 emits, in particular, EUV radiation 16, which is also referred to below as useful radiation, illumination radiation, or illumination light. The useful radiation 16 has a wavelength in the range between 5 nm and 30 nm. Light source 3 can be a plasma source, for example, an LPP source (Laser Produced Plasma) or a DPP source (Gas Discharged Produced Plasma). It can also be a synchrotron-based radiation source. Light source 3 can be a free-electron laser (FEL).

[0092] The illumination radiation 16 emanating from the light source 3 is focused by a collector 17. The collector 17 can be a collector with one or more ellipsoidal and / or hyperboloid reflective surfaces. The at least one reflective surface of the collector 17 can be illuminated by the illumination radiation 16 at grazing incidence (GI), i.e., with angles of incidence greater than 45°, or at normal incidence (NI), i.e., with angles of incidence less than 45°. The collector 17 can be structured and / or coated to optimize its reflectivity for the useful radiation and to suppress stray light.

[0093] After the collector 17, the illumination radiation 16 propagates through an intermediate focus in an intermediate focal plane 18. The intermediate focal plane 18 can represent a separation between a radiation source module, comprising the light source 3 and the collector 17, and the illumination optics 4.

[0094] The illumination optics 4 comprise a deflecting mirror 19 and, downstream in the beam path, a first faceted mirror 20. The deflecting mirror 19 can be a planar deflecting mirror or, alternatively, a mirror with an effect that influences the beam shape beyond the mere deflection effect. Alternatively or additionally, the deflecting mirror 19 can be designed as a spectral filter that separates a useful wavelength of the illumination radiation 16 from stray light of a different wavelength. If the first faceted mirror 20 is arranged in a plane of the illumination optics 4 that is optically conjugate to the object plane 6 as the field plane, it is also referred to as a field faceted mirror. The first faceted mirror 20 comprises a plurality of individual first facets 21, which can also be referred to as field facets. Of these first facets 21, the following are in the Fig. 1 only some examples are shown.

[0095] The first facets 21 can be designed as macroscopic facets, in particular as rectangular facets or as facets with an arcuate or semicircular border contour. The first facets 21 can be designed as planar facets or alternatively as convexly or concavely curved facets.

[0096] As is known, for example, from DE 10 2008 009 600 A1, the first facets 21 can themselves each be composed of a plurality of individual mirrors, in particular a plurality of micromirrors. The first facet mirror 20 can in particular be designed as a microelectromechanical system (MEMS system). For details, reference is made to DE 10 2008 009 600 A1.

[0097] Between the collector 17 and the deflecting mirror 19, the illumination radiation 16 runs horizontally, i.e. along the y-direction y.

[0098] In the beam path of the illumination optics 4, a second faceted mirror 22 is arranged downstream of the first faceted mirror 20. If the second faceted mirror 22 is arranged in a pupil plane of the illumination optics 4, it is also referred to as a pupil faceted mirror. The second faceted mirror 22 can also be arranged at a distance from a pupil plane of the illumination optics 4. In this case, the combination of the first faceted mirror 20 and the second faceted mirror 22 is also referred to as a specular reflector.

[0099] Specular reflectors are known from US 2006 / 0132747 A1, EP 1 614 008 B1 and US 6,573,978.

[0100] The second facet mirror 22 comprises a plurality of second facets 23. In the case of a pupil facet mirror, the second facets 23 are also referred to as pupil facets.

[0101] The second facets 23 can also be macroscopic facets, which may, for example, have round, rectangular, or hexagonal edges, or alternatively, facets composed of micromirrors. Reference is also made to DE 10 2008 009 600 A1 in this regard.

[0102] The second facets 23 can have planar or alternatively convex or concave curved reflective surfaces.

[0103] The illumination optics 4 thus form a double-faceted system. This basic principle is also known as a honeycomb condenser (English: Fly's Eye Integrator).

[0104] It can be advantageous not to arrange the second faceted mirror 22 exactly in a plane that is optically conjugate to a pupil plane of the projection optics 10. In particular, the second faceted mirror 22 can be arranged tilted relative to a pupil plane of the projection optics 10, as described, for example, in DE 10 2017 220 586 A1.

[0105] With the aid of the second faceted mirror 22, the individual first facets 21 are imaged into the object field 5. The second faceted mirror 22 is the last beam-shaping, or indeed the last, mirror for the illumination radiation 16 in the beam path before the object field 5.

[0106] In another embodiment of the illumination optics 4, not shown, a transmission optic can be arranged in the beam path between the second facet mirror 22 and the object field 5, which contributes in particular to imaging the first facets 21 into the object field 5. The transmission optic can have exactly one mirror, or alternatively two or more mirrors, arranged one behind the other in the beam path of the illumination optics 4. The transmission optic can, in particular, comprise one or two mirrors for normal incidence (NI mirrors) and / or one or two mirrors for grazing incidence (GI mirrors).

[0107] The lighting optics 4, in the version shown in the Fig. Figure 1 shows exactly three mirrors after the collector 17, namely the deflecting mirror 19, the first faceted mirror 20 and the second faceted mirror 22.

[0108] In a further embodiment of the lighting optics 4, the deflecting mirror 19 can also be omitted, so that the lighting optics 4 after the collector 17 can then have exactly two mirrors, namely the first faceted mirror 20 and the second faceted mirror 22.

[0109] The mapping of the first facets 21 by means of the second facets 23 or with the second facets 23 and a transmission optic into the object plane 6 is regularly only an approximate mapping.

[0110] The projection optics 10 comprise a plurality of mirrors Mi, which are numbered according to their arrangement in the beam path of the projection exposure system 1.

[0111] In the Fig. In the example shown, the projection optics 10 comprise six mirrors M1 to M6. Alternatives with four, eight, ten, twelve, or any other number of mirrors Mi are also possible. The projection optics 10 is a doubly obscured optic. The penultimate mirror M5 and the last mirror M6 each have an aperture for the illumination radiation 16. The projection optics 10 has an image-side numerical aperture that is greater than 0.5 and can also be greater than 0.6, for example, 0.7 or 0.75.

[0112] The reflective surfaces of the mirrors Mi can be designed as freeform surfaces without an axis of rotational symmetry. Alternatively, the reflective surfaces of the mirrors Mi can be designed as aspherical surfaces with exactly one axis of rotational symmetry of the reflective surface shape. The mirrors Mi, like the mirrors of the illumination optics 4, can have highly reflective coatings for the illumination radiation 16. These coatings can be designed as multilayer coatings, in particular with alternating layers of molybdenum and silicon.

[0113] The projection optics 10 has a large object-image offset in the y-direction y between a y-coordinate of a center of the object field 5 and a y-coordinate of the center of the image field 11. This object-image offset in the y-direction y can be approximately as large as a z-distance between the object plane 6 and the image plane 12.

[0114] The projection optics 10 can be anamorphic. In particular, they have different magnifications βx, βy in the x and y directions. The two magnifications βx, βy of the projection optics 10 are preferably (Bx, By) = (+ / - 0.25, + / - 0.125). A positive magnification β indicates a projection without image inversion. A negative magnification β indicates a projection with image inversion.

[0115] The projection optics 10 thus lead to a reduction in the x-direction x, that is, in the direction perpendicular to the scan direction, in a ratio of 4:1.

[0116] The projection optics 10 lead to a reduction of 8:1 in the y-direction y, that is, in the scan direction.

[0117] Other magnification ratios are also possible. Magnification ratios with the same sign and absolute value in the x and y directions (x, y), for example with absolute values ​​of 0.125 or 0.25, are also possible.

[0118] The number of intermediate image planes in the x and y directions x, y in the beam path between the object field 5 and the image field 11 can be the same or, depending on the design of the projection optics 10, different. Examples of projection optics with different numbers of such intermediate images in the x and y directions x, y are known from US 2018 / 0074303 A1.

[0119] Each of the second facets 23 is assigned to exactly one of the first facets 21 to form an illumination channel for illuminating the object field 5. This can result, in particular, in illumination according to Köhler's principle. The far field is divided into a multitude of object fields 5 with the help of the first facets 21. The first facets 21 generate a plurality of images of the intermediate focus on the second facets 23 assigned to each of them.

[0120] The first facets 21 are each superimposed on a corresponding second facet 23 to illuminate the object field 5 on the reticle 7. The illumination of the object field 5 is particularly homogeneous. It preferably exhibits a uniformity error of less than 2%. Field uniformity can be achieved by superimposing different illumination channels.

[0121] The illumination of the entrance pupil of the projection optics 10 can be geometrically defined by arranging the second facets 23. By selecting the illumination channels, in particular the subset of the second facets 23 that carry light, the intensity distribution in the entrance pupil of the projection optics 10 can be adjusted. This intensity distribution is also referred to as the illumination setting or illumination pupil filling.

[0122] Another preferred pupil uniformity in the area of ​​defined illuminated sections of an illumination pupil of the illumination optics 4 can be achieved by a redistribution of the illumination channels.

[0123] Further aspects and details of the illumination of the object field 5 and, in particular, the entrance pupil of the projection optics 10 are described below.

[0124] The projection optics 10 can, in particular, have a homocentric entrance pupil. This can be accessible. It can also be inaccessible.

[0125] The entrance pupil of the projection optics 10 cannot always be illuminated exactly by the second faceted mirror 22. When the projection optics 10 image the center of the second faceted mirror 22 telecentrically onto the wafer 13, the aperture rays often do not intersect at a single point. However, a surface can be found where the pairwise determined separation of the aperture rays is minimized. This surface represents the entrance pupil or a surface conjugate to it in real space. In particular, this surface exhibits a finite curvature.

[0126] The projection optics 10 may have different entrance pupil positions for the tangential and sagittal beam paths. In this case, an imaging element, in particular an optical component of the transmission optics, should be provided between the second faceted mirror 22 and the reticle 7. This optical element can accommodate the different positions of the tangential and sagittal entrance pupils.

[0127] During the Fig. In the arrangement of the components of the illumination optics 4 shown in Figure 1, the second faceted mirror 22 is arranged in a plane conjugate to the entrance pupil of the projection optics 10. The first faceted mirror 20 is arranged tilted relative to the object plane 6. The first faceted mirror 20 is arranged tilted relative to an arrangement plane defined by the deflecting mirror 19. The first faceted mirror 20 is arranged tilted relative to an arrangement plane defined by the second faceted mirror 22.

[0128] Fig. Figure 2 shows an optical system 100 with an optical component 102 (as an example of a position-sensitive component) according to an embodiment.

[0129] The optical component 102 is, for example, a mirror of the projection exposure system 1 (lithography system), in particular of the projection optics 10, made of Fig. 1. The optical component 102 is, for example, one of the mirrors M1 to M6. In the following, the position-sensitive component 102 is described as a mirror; however, in other examples, it may also be a different optical or mechanical component of the projection exposure system 1 than a mirror.

[0130] As in Fig. As shown in Figure 2, the mirror 102 comprises a coating 104 with an optically active surface 106. The mirror 102 also comprises a substrate 108. Cooling lines 110 are arranged in the substrate 108, through which a cooling fluid 112, such as water, is circulated to actively cool the mirror 102. Cooling the mirror 102 serves to prevent thermal deformations of the mirror 102, for example, when exposed to high-energy EUV radiation 16 ( Fig. 1) to avoid.

[0131] The mirror 102 is movably attached to a support frame 116 by means of an actuator assembly 114. The actuator assembly 114 comprises, for example, several actuators 118 and a drive unit (not shown). The actuator assembly 114 serves, for example, to move the mirror 102 with respect to six degrees of freedom (translation in the x, y, and z directions and rotation about the x, y, and z directions). Fig. 2) to position.

[0132] The optical system 100 further includes a sensor device 120 for detecting the current position of the mirror 102. The sensor device 120 is in Fig. 2 is only shown schematically. The sensor device 120 has one or more sensors, such as interferometers. The sensors of the sensor device 120 are, for example, attached to a sensor frame (not shown). The sensor frame is, for example, vibration-isolated from the support frame 116. For example, the current position of the mirror 102 is detected using laser beams 122. The sensor device 120 is, for example, configured to detect the position of the mirror 102 in its six degrees of freedom.

[0133] In Fig. Figure 3 shows a cooling device 200 (as an example of a temperature control device) for cooling a position-sensitive component 102 (e.g., the mirror 102). The cooling device 200 has a cooling circuit 202. The cooling device 200 comprises a cooling unit 204 for cooling a coolant 206 and a fluid line 208 (cooling line 208) for transporting the coolant 206. The cooling device 200 also includes one or more pumps 210 for generating a required coolant flow rate of the coolant 206. The cooling device 200 further includes one or more valves 212 for controlling the coolant flow.

[0134] Although not shown in the figures, the cooling device 200 can also be used to cool several position-sensitive components 102 of the lithography system 1.

[0135] Pumps of the cooling device 200, such as pump 210, cause local pressure fluctuations in the coolant 206. These pressure fluctuations are transmitted throughout the entire cooling circuit 202 via longitudinal water-borne sound waves. Furthermore, changes in cross-sectional area (not shown) of the cooling line 208, bends 214 of the cooling line 208, and valves 212 of the cooling device 200 can also be sources of disturbance that cause local pressure fluctuations in the coolant 206. Pressure fluctuations in the coolant 206 can also be generated by mechanical vibration excitation of the cooling line 208 (e.g., by vibration of a support frame) or other excitations. Such acoustic disturbance excitation is transmitted via water-borne sound to the cooled position-sensitive component 102 (e.g., the mirror 102). This can lead to an undesired change in the position of the position-sensitive component 102.

[0136] To dampen pressure fluctuations of the coolant 206, the cooling device 200 includes a silencer 216. The silencer 216 is arranged on a section 218 of the liquid line 208. The section 218 optionally has a cross-sectional expansion 220. The silencer 216 also includes a sound absorption element 222. The sound absorption element 222 is arranged within the section 218 of the liquid line 208. If a cross-sectional expansion 220 of the section 218 is provided, the sound absorption element 222 can, for example, be arranged in a region 224 of the cross-sectional expansion 220.

[0137] In the figures and the following figure description, the respective conduit section 218 is shown and described with the cross-sectional expansion 220. However, this is not to be understood as restrictive. Rather, each sound absorption element 222, 222', 322, 422, 522, 622 described herein can also be used in a conduit section 218, 218', 318, 418, 518, 618, 718, 818 without a cross-sectional expansion 220.

[0138] The silencer device 216, and in particular the sound absorption element 222, dampens pressure fluctuations in the coolant 206 by absorbing sound energy. The sound absorption element 222 is permeable to liquid, allowing the coolant 206 to penetrate it. The sound absorption element 222 is designed, for example, such that an incoming pressure wave is deflected (e.g., multiple times) and / or at least partially reflected within it. This converts the energy of the incoming pressure wave into heat, for example, through friction, and / or at least partially cancels it out through negative interference. Consequently, the silencer device 216 significantly reduces the propagation of pressure fluctuations through the coolant 206.Thus, acoustic interference with the position-sensitive component 102 can be reduced and / or avoided.

[0139] The sound absorption element 222 comprises, in particular, an absorber material 226. The sound absorption element 222 comprises, for example, a porous absorber material, a fibrous absorber material, an elastic absorber material and / or a particle-containing absorber material.

[0140] The sound absorption element 222 is, for example, attached within the conduit section 218. For instance, the sound absorption element 222 is held within the conduit section 218 between the inner walls of the conduit section 218 by positive locking and / or clamped (e.g., elastically). The sound absorption element 222 can also be glued, welded (e.g., by spot welding), and / or screwed to an inner wall or walls of the conduit section 218.

[0141] In Fig. Figure 4 is an enlarged section IV of fluid line 208 from Fig. 3 shown. In particular, in Fig. 4 of line section 218 is shown.

[0142] Pipe section 218 has a cross-sectional expansion 220 in region 224. Specifically, pipe section 218 has a first subsection 228 with a first cross-section Q1 (e.g., a first diameter D1 for a circular cross-section Q1). Furthermore, pipe section 218 has a second subsection 230 in region 224 with a second cross-section Q2 (e.g., a second diameter D2 for a circular cross-section Q2). Additionally, pipe section 218 has a third subsection 232 with a third cross-section Q3 (e.g., a third diameter D3 for a circular cross-section Q3). The second cross-section Q2 (e.g., the second diameter D2) is larger than the first cross-section Q1 (e.g., the first diameter D1). The reference numeral 234 thus denotes an expansion of the cross-section from the first cross-section Q1 to the second cross-section Q2. Additionally, the third cross-section Q3 (e.g.,The third diameter D3 is smaller than the second cross-section Q2 (e.g., the second diameter D2). The reference numeral 236 thus denotes a reduction in the cross-section from the second cross-section Q2 to the third cross-section Q3. In the example of... Fig. 4. The first and third subsections 228 and 232 have the same cross-sectional area Q1, Q3 (e.g., the same diameter D1, D3).

[0143] The three subsections 228, 230, 232 of the pipe section 218 are arranged sequentially with respect to a flow direction S of the coolant 206 in the pipe section 218. In the example of Fig. Furthermore, the three subsections 228, 230, and 232 are arranged in this order, directly consecutively, i.e., continuously connected. In other words, the first and second subsections 228 and 230 are directly adjacent to each other, and the second and third subsections 230 and 232 are directly adjacent to each other.

[0144] Furthermore, in the embodiment of Fig. 4. The extension 234 from the first cross-section Q1 to the second cross-section Q2 is designed discontinuously (i.e., abruptly). Furthermore, in Fig. 4. The reduction 236 from the second cross-section Q2 to the third cross-section Q3 is also designed discontinuously. It can also be said that an outer wall 237 of the conduit section 218 has a deflection 238, 240 with an angle α of essentially 90° at both the widening 234 and the narrowing 236.

[0145] As in Fig. As illustrated in Figure 5, the cross-sectional expansion 220 of the pipe section 218 provides, in addition to a first volume V1, a second volume V2 within the pipe section 218. As shown in Fig. As shown in Figure 4, the sound absorption element 222 completely fills the additional volume V2.

[0146] It is noted that in Fig. 4 For illustrative purposes, a gap is shown between the sound absorption element 222 and an inner wall of the conduit section 218. However, the sound absorption element 222 can be arranged directly adjacent to and / or in direct contact with the inner wall of the conduit section 218.

[0147] The volume V1 is in particular the volume within the pipe section 218 without the cross-sectional extension 220 (bounded by the two dashed lines in Fig. 5) For example, pipe section 218 has a length L. Furthermore, pipe section 218 has, for example, in the first and third subsections 228 and 232, the first cross-section Q1 (i.e., a first cross-sectional area Q1) (i.e., Q1 = Q3). Then the first volume V1 can be calculated as the mathematical product of the length L and the first cross-sectional area Q1.

[0148] In the embodiment of Fig. 4. The sound absorption element 222 does not completely fill the conductor section 218 when viewed in the cross-section of the conductor section 218. Fig. Figure 6 shows a cross-section of line section 218 along line VI-VI in Fig. 4. As in Fig. As can be seen in Figure 6, the sound absorption element 222 in the embodiment of Fig. 4 a ring-like shape. Furthermore, seen in the cross-section of conductor section 218 ( Fig. 6) The conduit section 218 in the region 224 of the cross-sectional expansion 220 comprises a liquid chamber 242, which is free of the sound absorption element 222, and a sound absorption chamber 244 in which the sound absorption element 222 is arranged. The liquid chamber 242 is configured to hold the cooling fluid 206. The sound absorption chamber 244 is configured to hold the sound absorption element 222 and the cooling fluid 206 (namely, in the liquid-permeable sound absorption element 222).

[0149] In the embodiment of Fig. 4 and Fig. 6 is the sound absorption chamber 244 seen in the cross-section of the conduit section 218 and, in relation to the liquid chamber 242, an external sound absorption chamber 244.

[0150] As in the Fig. 7 and Fig. As shown in Figure 8, a sound absorption chamber 244 with a sound absorption element 322 can, in other embodiments, be seen in the cross-section of the conduit section 318 and, with respect to a liquid chamber 342 that is free of the sound absorption element 322, can also be an internal sound absorption chamber 344. The reference numeral 320 denotes a cross-sectional enlargement of the conduit section 318.

[0151] In Fig. 9 is a variant of the embodiment of Fig. 4 and Fig. 6 shown. In particular, the one in Fig. Section 218' shown in Figure 9 - similar to the one in Figure 9 Fig. 4 and Fig. Figure 6 shows a conduit section 218 – a liquid chamber 242' which is free of the sound absorption element 222', and a sound absorption chamber 244' in which the sound absorption element 222' is arranged. Furthermore, the sound absorption device 216' in Fig. 9 At least one liquid-permeable separating element 246 is provided, which separates the sound absorption chamber 244' from the liquid chamber 242'. The separating element 246 has, for example, a grid 248. The separating element 246 prevents the sound absorption element 222' from being carried along with the cooling liquid. In other words, the separating element 246 ensures that the sound absorption element 222' remains within the sound absorption chamber 244'. Reference numeral 220' in Fig. 9 denotes a cross-sectional expansion of the conductor section 218' similar to the cross-sectional expansion 220 in Fig. 4.

[0152] In the example of Fig. 4, Fig. 6, Fig. 9 is the sound absorption element 222, 222', a ring-shaped sound absorption element 222, 222'. Furthermore, in the example of Fig. 9 the separating element 246 a ring-shaped separating element.

[0153] In Fig. Figure 10 shows a silencer device 416 according to a further embodiment. The following essentially only highlights the differences from the embodiment in Fig. 4 described.

[0154] In the embodiment of Fig. 10 is - similar to in Fig. 4 - a sound absorption element 422 is arranged in the area 424 of a line section 418. In contrast to Fig. 4 fills the sound absorption element 422 in the embodiment of Fig. 10, the section of pipe 418 seen in the cross-section of section of pipe 418 ( Fig. 11) and in the area of ​​the cross-sectional expansion 420 of the line section 418, however, completely.

[0155] Optionally, the silencer unit 416 can be fitted in Fig. 10 at least one separating element 446 - similar to the separating element 246 in Fig. 9 - be provided to prevent the sound absorption element 422 from being carried along with the liquid 206.

[0156] In Fig. Figure 12 shows a silencer device 516 according to a further embodiment. The following essentially only describes the differences from the embodiment in Fig. 4 described.

[0157] In the embodiment of Fig. 12 is - similar to in Fig. 4 - a sound absorption element 522 in the area 524 of a cross-sectional expansion 520 of a line section 518 of the liquid line 208 ( Fig. 3) arranged. In contrast to Fig. 4 is a continuous extension 534 from a first cross-section Q1' to a second cross-section Q2'. Furthermore, a continuous reduction 536 from the second cross-section Q2' to a third cross-section Q3' is also designed.

[0158] In particular, pipe section 518 has a first subsection 528 with a first cross-section Q1'. Furthermore, pipe section 518 has, in area 524, a first intermediate subsection 530, a second subsection 532, and a second intermediate subsection 535. The second subsection 532 has a second cross-section Q2'. Pipe section 518 also has a third subsection 539 with a third cross-section Q3'. The second cross-section Q2' is larger than the first cross-section Q1'. Furthermore, the third cross-section Q3' is smaller than the second cross-section Q2'. The third cross-section Q3' is, for example, the same size as the first cross-section Q1'. Within the first intermediate subsection 530, the cross-section increases continuously from the first cross-section Q1' to the second cross-section Q2'.Reference numeral 534 denotes a continuous enlargement of the cross-section of the conduit section 518 (in the area of ​​the first intermediate subsection 530) from the first cross-section Q1' to the second cross-section Q2'. Reference numeral 536 denotes a continuous reduction in the cross-section of the conduit section 518 (in the area of ​​the second intermediate subsection 535) from the second cross-section Q2' to the third cross-section Q3'. It can also be said that an outer wall 537 of the conduit section 518, in order to realize the enlargement 534 and the reduction 536, accordingly has a deflection 538, 540 with an angle β1, β2, β3, β4 of greater than 90° (and less than 180°). It is noted that the angles β1 to β4 can all have the same value (i.e., β1 = β2 = β3 = β4), can have different values ​​in pairs (e.g., β1 = β3 ≠ β2 = β4), or can all have different values ​​(i.e., β1 ≠ β2 ≠ β3 ≠ β4).

[0159] In Fig. Figure 13 shows a silencer device 616 according to a further embodiment. The following essentially only describes the differences from the embodiment in Fig. 12 described.

[0160] In the embodiment of Fig. 13 is - similar to in Fig. 12 - a sound absorption element 622 in the area 624 of a cross-sectional expansion 620 of a line section 618 of the liquid line 208 ( Fig. 3) arranged. Also in the embodiment of Fig. 13 is a continuous enlargement 634 and a continuous reduction 636 of the cross-section of the line section 618 (and not abruptly as in Fig. 4) designed. In contrast to Fig. 12 The sound absorption element 622 is designed such that it completely fills the conductor section 618 in the area 624 of the cross-sectional expansion 620 as seen in the cross-section of the conductor section 618 (similar to the sound absorption element 422 in Fig. 10). Although in Fig. 13 not shown, the silencer device 616 may also have at least one separating element (similar to the two separating elements 446 in Fig. 10) be provided.

[0161] As in Fig. As illustrated in Figure 14, each section 718 of the liquid line 208 described herein can have a liquid pipe 718' attached to a support frame K. Furthermore, each section 818 of the liquid line 208 described herein can have a liquid channel 818' formed in a solid body K of the lithography system 1. The solid body K can, for example, be a support frame of the lithography system 1.

[0162] Each of the temperature control devices 200 (e.g. cooling device) and / or each of the silencer devices 216 to 616 described herein can, for example, also be used in a DUV lithography system.

[0163] Although the present invention has been described using exemplary embodiments, it can be modified in many ways. REFERENCE MARK LIST 1 Projection exposure system 2 Lighting system 3 light source 4 Lighting optics 5 object field 6 Object level 7 reticles 8 label holders 9 Reticle displacement drive 10 Projection optics 11 Image field 12 Image plane 13 wafers 14 wafer holders 15 wafer transfer drive 16 Lighting radiation 17 Collector 18 Intermediate focus plane 19 deflecting mirrors 20 first faceted mirror 21 first facet 22 second faceted mirror 23 second facet 100 optical system 102 components 104 Coating 106 area 108 Substrat 110 Cooling line 112 Coolant 114 Actuator setup 116 support frames 118 Actuator 120 sensor device 122 Laser beam 200 cooling device 202 Cooling circuit 204 Cooling unit 206 Coolant 208 Liquid line 210 pump 212 Valve 214 Deflection 216, 216' Silencer device 218, 218' Line section 220, 220' Cross-sectional expansion 222, 222' Sound absorption element 224 area 226 Absorber material 228 Subsection 230 Subsection 232 Subsection 234 Extension 236 Reduction 237 Exterior wall 238 Deflection 240 deflection 242, 242' Liquid chamber 244, 244' Sound absorption chamber 246 separating element 248 grids 318 Line section 320 Cross-section expansion 322 Sound absorption element 342 Liquid chamber 344 Sound absorption chamber 416 Silencer device 418 Line section 420 Cross-section expansion 422 Sound absorption element 424 area 446 Separating element 516 Silencer device 518 Line section 520 Cross-section expansion 522 Sound absorption element 524 area 528 Subsection 530 Intermediate section 532 Subsection 534 Extension 535 Intermediate section 536 Reduction 537 Exterior wall 538 Deflection 539 Subsection 540 deflection 616 Silencer device 618 Line section 620 Cross-section expansion 622 Sound absorption element 624 area 634 Extension 636 Reduction 718 Line section 718' Liquid pipe 818 Line section 818' Liquid channel α angle β1 - β4 angles D1-D3 diameter K body L, L2 length Q1-Q3 Cross-section Q1'-Q3' Cross section M1-M6 mirrors S Flow direction V1, V2 Volume x, y, z direction QUOTES INCLUDED IN THE DESCRIPTION

[0000] This list of documents cited by the applicant was automatically generated and is included solely for the reader's convenience. The list is not part of the German patent or utility model application. The DPMA accepts no liability for any errors or omissions. Cited patent literature

[0000] WO 2021 013 441 A1

[0006] DE 10 2008 009 600 A1 [0096, 0101] US 2006 / 0132747 A1

[0099] EP 1 614 008 B1

[0099] US 6,573,978

[0099] DE 10 2017 220 586 A1

[0104] US 2018 / 0074303 A1

[0118]

Claims

[1] Temperature control device (200) for temperature control of a position-sensitive component (102) of a lithography system (1), comprising: a liquid line (208) for transporting a temperature control liquid (206), wherein the liquid line (208) has a line section (218), and a silencer device (216) for damping a pressure fluctuation of the temperature control fluid (206), wherein the silencer device (216) has a sound absorption element (222) arranged within the line section (218), which has a fluid-permeable absorber material (226). [2] Temperature control device according to claim 1, wherein the conduit section (218) has a cross-sectional expansion (220) and the sound absorption element (222) is arranged in a region (234) of the cross-sectional expansion (220). [3] Temperature control device according to claim 1 or 2, wherein the sound absorption element (222) comprises a porous absorber material (226), a fibrous absorber material (226), an elastic absorber material (226) and / or a movable absorber material (226). [4] Temperature control device according to claim 2 or 3, wherein the cross-sectional expansion (220) of the conduit section (218) comprises an expansion (234) from a first cross-section (Q1) to a second cross-section (Q2) which is larger than the first cross-section (Q1), and a reduction (236) from the second cross-section (Q2) to a third cross-section (Q3) which is smaller than the second cross-section (Q2). [5] Temperature control device according to claim 4, wherein the expansion (234) from the first cross-section (Q1, Q1') to the second cross-section (Q2, Q2') is designed discontinuously or continuously, and / or the reduction (236) from the second cross-section (Q2, Q2') to the third cross-section (Q3, Q3') is designed discontinuously or continuously. [6] Temperature control device according to one of claims 2 to 5, wherein the cross-sectional extension (220) of the conduit section (218) provides an additional volume (V2) within the conduit section (218) and the sound absorption element (222) completely fills the additional volume (V2). [7] Temperature control device according to one of claims 1 to 6, wherein, viewed in cross-section of the conduit section (418), the sound absorption element (422) completely fills the conduit section (418). [8] Temperature control device according to one of claims 1 to 6, wherein, viewed in cross-section of the conduit section (218), the conduit section (218) comprises a liquid chamber (242) which is free of the sound absorption element (222) and a sound absorption chamber (244) in which the sound absorption element (222) is arranged. [9] Temperature control device according to claim 8, wherein the sound absorption chamber (244) is seen in the cross-section of the conduit section (218) and is an external sound absorption chamber (244) with respect to the liquid chamber (242). [10] Temperature control device according to claim 8, wherein the sound absorption chamber (344) is seen in the cross-section of the conduit section (318) and is an internal sound absorption chamber (344) with respect to the liquid chamber (342). [11] Temperature control device according to any one of claims 1 to 10, wherein the conduit section (218') has a liquid chamber (242') which is free of the sound absorption element (222') and a sound absorption chamber (244') in which the sound absorption element (222') is arranged, and the sound absorption device (216') has at least one liquid-permeable separating element (246) that tightly separates the sound absorption chamber (244') from the liquid chamber (242') with respect to the sound absorption element (222'). [12] Temperature control device according to claim 11, wherein the separating element (246) has a grid (248). [13] Temperature control device according to one of claims 1 to 12, wherein the silencer device (216) is configured to dampen pressure fluctuations of the temperature control fluid (206) in a frequency range of 1 Hz to 2 kHz, 1 Hz to 1 kHz, 1 Hz to 800 Hz, 1 Hz to 500 Hz, 1 Hz to 400 Hz, 1 Hz to 200 Hz, 1 Hz to 100 Hz and / or 50 Hz to 150 Hz. [14] Temperature control device according to any one of claims 1 to 13, wherein the section (718) of the liquid line (208) has a liquid pipe (718'), or the line section (818) of the liquid line (208) has a liquid channel (818') which is formed in a solid body (K) of the lithography system (1). [15] Lithography system (1) with a position-sensitive component (102) and a temperature control device (216) according to one of claims 1 to 14 for temperature control of the position-sensitive component (102).

Images