Processing device for processing a substrate for an electrochemical cell, and method for processing a substrate for an electrochemical cell

Abstract

The invention relates to a processing device (10) for processing a substrate (12) for an electrochemical cell, and to a method for processing a substrate (12) for an electrochemical cell using such a processing device (10), comprising a processing unit (14) for processing the substrate (12) and a holder (16) for the substrate (12). It is proposed to cool the holder (16) by means (18), in particular actively.

Description

[0001] The present invention relates to a processing device for processing a substrate for an electrochemical cell, and to a method for processing a substrate for an electrochemical cell using such a processing device, comprising a holder for the substrate. State of the art

[0002] There are known processing devices for processing a substrate for an electrochemical cell, which include means for active cooling of the substrate. Disclosure of the invention

[0003] In contrast, the present machining device with the features of the main claim has the advantage that it includes a means for, in particular actively, cooling the holder. This simplifies the design of the machining device with regard to cooling the substrate.

[0004] In this context, a "machining device" can be understood to mean, in particular, a device designed for machining a substrate. Specifically, the machining device is designed to machine a substrate for an electrochemical cell. Preferably, the machining device is designed in multiple parts. Preferably, a non-cutting machining process is carried out with the machining device. Furthermore, the machining device includes the aforementioned holder for the substrate for an electrochemical cell. Preferably, direct machining of the substrate is carried out in one machining step. Alternatively, indirect machining of the substrate by the machining device is also conceivable. Particularly preferably, the machining device is designed to perform all necessary machining steps.In particular, the processing device includes a processing unit for processing the substrate for an electrochemical cell.

[0005] In this context, a "processing unit" can be understood to mean, in particular, a unit designed to process a substrate. Preferably, the processing unit is designed to create recesses, especially through-holes, in the substrate. Preferably, the processing unit comprises at least one non-clamping tool for creating recesses. Preferably, the processing unit is designed in multiple parts. Preferably, the processing unit is designed to generate a laser pulse. Preferably, the processing unit is designed to generate a single laser pulse and / or several successive laser pulses. Particularly preferably, the processing unit is designed as a laser drill.In particular, the processing unit is configured to process at least one surface of the substrate for an electrochemical cell. Preferably, energy is introduced locally by the laser pulse generated by the processing unit. The energy is particularly preferably locally high enough that the surface of the substrate is at least substantially partially, preferably largely, and particularly preferably completely melted and / or vaporized. Alternatively, complete melting combined with at least substantially partial vaporization is also conceivable. Preferably, the processing of the surface of the substrate for an electrochemical cell creates at least one recess in the substrate for an electrochemical cell.Preferably, a through-hole is formed in the substrate for an electrochemical cell by processing its surface. Preferably, the through-hole is arranged perpendicular to a principal plane of extension of the substrate for an electrochemical cell. Preferably, the processing unit focuses the laser pulse.

[0006] In this context, a "substrate for an electrochemical cell" can preferably be understood to mean a substrate intended for use in a fuel cell. Preferably, the substrate for an electrochemical cell is designed as a sheet. Preferably, the substrate is intended for use in an electrolyte cell. Particularly preferably, the substrate for an electrochemical cell is used in a solid oxide fuel cell. Alternatively, the substrate is intended for use in a battery. Preferably, the substrate for an electrochemical cell is configured to provide a base for the electrolyte. Furthermore, a substrate made of a pre-sintered ceramic is conceivable. Other materials that would appear suitable to a person skilled in the art are also conceivable.In this context, a non-shrinking material is understood to mean materials which do not shrink further during a shrinkage process, such as a sintering process, and / or which have already been shrunk beforehand, for example by a sintering process.

[0007] In this context, "active cooling" can be understood to mean, in particular, the active extraction and / or removal of thermal energy from an object and / or its environment. This is preferably achieved through the use of means such as fans, cooling systems, and cooling media, which typically consume additional energy to enable the extraction and / or removal of thermal energy.

[0008] In this context, "passive cooling" can be understood to mean, in particular, the passive extraction and / or removal of thermal energy from an object and / or its environment. This preferably occurs through natural physical processes such as convection, radiation, or heat dissipation, which typically do not consume additional energy to enable the extraction and / or removal of thermal energy.

[0009] The features listed in the dependent claims enable advantageous further developments of the machining device according to the main claim. For example, it is advantageous if the means is designed as a flow channel for a cooling medium, thereby enabling efficient cooling of the holder.

[0010] It is also advantageous if the medium, especially the flow channel for the cooling medium, is integrated into the holder, which allows for particularly efficient cooling of the holder.

[0011] It is also advantageous if the holder comprises a first, particularly upper, part and a second, particularly lower, part, with the means being incorporated in the first, particularly upper, part. This allows for a cost-effective manufacturing process.

[0012] It is particularly advantageous if the first, especially the upper, part of the bracket is not movable. This allows for a particularly cost-effective manufacturing process.

[0013] It is particularly advantageous if the holder is designed such that, when substrate is inserted, the holder, especially with respect to a main plane of extension of the substrate on both sides, at least substantially surrounds the substrate. This allows for efficient passive cooling of the substrate.

[0014] It is particularly advantageous if the means, especially the flow channel for the cooling medium, is designed such that, when a substrate is inserted, the medium, particularly with respect to a main plane of extension of the substrate, at least substantially surrounds the substrate on one side, preferably the upper side. This allows for particularly efficient passive cooling of the substrate.

[0015] A “principal extension plane” of a building unit shall in particular be understood to be a plane which is parallel to a largest side face of a smallest imaginary cuboid which just completely encloses the building unit, and in particular passes through the center of the cuboid.

[0016] In the context of the invention, the phrase "at least substantially" is to be understood in particular as meaning that a condition or property to which the phrase refers is present or fulfilled in its fundamental or important aspects or characteristics, but possibly not in all details or with perfect accuracy. In particular, the phrase indicates that, although there may be some minor tolerances, deviations, variations, or imperfections, the condition or property is nevertheless present. Specifically, the phrase indicates that a close approximation to the condition or property has been achieved, even if it is not 100% perfect or exact.

[0017] The method for processing a substrate for an electrochemical cell has the advantage that the holder is cooled by a means, particularly an active one. This also simplifies the design of the processing device with regard to cooling.

[0018] For this process, it is advantageous if the device is designed as a flow channel for a cooling medium and the holder is cooled, particularly actively, by the flow of a cooling medium through the channel. This allows for efficient cooling of the holder. Drawings

[0019] The drawings schematically illustrate an embodiment of the invention, which is explained in more detail in the following description. They show Fig. 1 a cross-section of an embodiment of a machining device for machining a substrate for an electrochemical cell, Fig. 2 a side view of the embodiment of the machining device for machining a substrate for an electrochemical cell made of Fig. 1 Fig. 3 a top view of the embodiment of the machining device for machining a substrate for an electrochemical cell made of Fig. 1. Description of the exemplary embodiment

[0020] In Fig. Figure 1 shows a cross-section of an embodiment of a machining device 10 for machining a substrate 12 for an electrochemical cell, while in Fig. 2 a side view and in Fig. 3 a top view of the embodiment of the machining device 10 for machining the substrate 12 for an electrochemical cell made of Fig.Figure 1 shows the machining device 10. In the illustrated embodiment, this device comprises a machining unit 14 for machining the substrate 12. Furthermore, in this illustrated embodiment, the machining device 10 comprises a holder 16 for the substrate 12. In this illustrated embodiment, the substrate 12 is inserted into, or held by, the holder 16.

[0021] The machining device 10 is characterized by a means 18 for the active cooling of the holder 16, as shown. Accordingly, the holder 16 is actively cooled by the means 18. This active cooling of the holder 16 allows thermal energy introduced into the substrate 12 during machining to be dissipated from the substrate 12 via the holder 16, in this case by heat dissipation. This enables passive cooling of the substrate 12. Consequently, the need for a complex active cooling system for the substrate 12 is eliminated. Thus, the design of the machining device 10 is simplified with regard to cooling the substrate 12.

[0022] The active cooling of the holder 16, and thus the passive cooling of the substrate 12, reduces or even completely prevents distortion that can occur due to the thermal energy introduced during processing of the substrate. Furthermore, any non-evaporating melt remaining in or on the substrate 12 is also reduced or even completely prevented.

[0023] In this case, the holder 16 can also be understood as a clamping device and / or workpiece carrier.

[0024] In the illustrated embodiment, the means 18 is designed as a flow channel 20 for a cooling medium. In this case, the holder 16 is actively cooled by the flow of a cooling medium through the flow channel 20. This enables efficient, active cooling of the holder 16.

[0025] In the illustrated embodiment, the means 18, or the flow channel 20 for the cooling medium, is incorporated into the holder 16. This can also be understood to mean that the means 18, or the flow channel 20, is integrated into the holder. This allows the coolant to act on the holder 16 from all sides. Thus, particularly efficient, and in this case active, cooling of the holder 16 can be achieved.

[0026] In the illustrated embodiment, the holder 16 comprises a first part 22 (upper part) and a second part 24 (lower part). The means 18, or flow channel 20, is located in the first part 22 (upper part). This allows the cooling functions of the first part 22 and the second part 24 to be separated. The second part 24, which in the illustrated embodiment does not contain the means 18 for cooling the holder 16, can be moved more easily, as, for example, the supply of a coolant does not need to be considered. Consequently, mass production, such as on a production line with a conveyor belt, can be implemented more easily. This enables a particularly cost-effective manufacturing process.

[0027] In the illustrated embodiment, the first, and in this case upper, part 22 of the holder 16 is not movable. This further reduces the complexity of the holder 16 with regard to cooling, making it more cost-effective and requiring less maintenance. Consequently, mass production, for example on a production line with a single conveyor belt, can be implemented even more easily. This, in turn, enables a particularly cost-effective manufacturing process.

[0028] In the case shown, the substrate 12 is inserted between the first part 22 and the second part 24. Accordingly, the substrate 12 can be inserted between the first part 22 and the second part 24. In the case of mass production, this can be achieved, for example, by placing a substrate 12 to be processed onto the second part 24, with the substrate 12 placed on it, and then pressing the second part 24, with the substrate 12 on it, against the first part 22.

[0029] In the illustrated embodiment, the holder is designed such that, when the substrate 12 is inserted, the holder 16 surrounds the substrate 12 on both sides, in the illustrated case with respect to a main plane of extension of the substrate 12. This allows thermal energy to be dissipated from the substrate 12 in all directions via the actively cooled holder 16, thereby enabling efficient passive cooling of the substrate 12.

[0030] The means 18, or the flow channel 20 for the cooling medium, is designed in the illustrated embodiment, or integrated into the holder 16, such that when the substrate 12 is inserted, the cooling medium, in the illustrated case with respect to a principal plane of extension of the substrate 12, at least on one side, in this case the upper side, surrounds the substrate 12. This allows the cooling medium to act on the holder 16 from all sides of the substrate 12, thereby enabling particularly efficient passive cooling of the substrate 12.

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