Device and system for holding an element for a semiconductor technology system, element for a semiconductor technology system and method for transporting an element for a semiconductor technology system

Abstract

A device for holding a, preferably optical, element (10) for a semiconductor technology system is shown and described. The device comprises: a base body (110) including a connecting section for connecting the base body (110) to a lifting device, and a holding element (120) arranged on the base body (110) for holding the element for the semiconductor technology system. The holding element (120) is configured to exert a holding force for holding the element (10) for the semiconductor technology system, at least partially in the form of a compressive force. The device described above is proposed to reduce, and preferably eliminate, the risk of crack formation during the lifting, holding, and / or transport of, preferably optical, elements for a semiconductor technology system.Also shown and described are a system for holding an element, preferably optical, for a semiconductor technology system, an element, preferably an optical element, for a semiconductor technology system, and a method for transporting an element, preferably optical, for a semiconductor technology system.

Description

[0001] The present invention relates to a device for holding a, preferably optical, element for a semiconductor technology system. The present invention further relates to a system for holding a, preferably optical, element for a semiconductor technology system. The present invention further relates to an element, preferably an optical element, for a semiconductor technology system. The present invention further relates to a method for transporting a, preferably optical, element for a semiconductor technology system.

[0002] Microlithography, as part of semiconductor technology, is used to manufacture microstructured components, such as integrated circuits. The microlithography process is carried out using a projection exposure system, which includes illumination optics and / or projection optics. The structure of a mask (reticule) illuminated by the illumination optics is projected by the projection optics onto a substrate, such as a wafer (especially a silicon wafer), coated with a photosensitive layer (photoresist) and positioned in the image plane of the projection optics. This transfers the mask structure onto the photosensitive coating of the substrate.

[0003] One of the goals in the development of projection exposure systems is to lithographically produce structures with increasingly smaller dimensions on the substrate, for example, to achieve higher integration densities in semiconductor devices. One approach is to work with shorter wavelengths of electromagnetic radiation. For example, optical systems have been developed that use electromagnetic radiation from the so-called "deep ultraviolet" (DUV) range, preferably with operating wavelengths in the range between 150 nm and 400 nm, in particular 365 nm, 248 nm, or 193 nm, or from the extreme ultraviolet (EUV) range, preferably with operating wavelengths in the range between 5 nm and 30 nm, in particular 13.5 nm.

[0004] To produce smaller structures, it may be necessary to use electromagnetic radiation from a comparatively large angular range. The larger the angular range from which an optical system receives light, the smaller the structures that can be imaged with that system. An important measurement for the angular range of optical systems is the so-called numerical aperture (NA). For example, in EUV lithography, optical systems with numerical apertures greater than 0.3, preferably around 0.33, are used. Optical systems used in so-called high-NA EUV lithography have an NA greater than 0.5, preferably around 0.55. In so-called hyper-NA EUV lithography, numerical apertures greater than 0.7, preferably around 0.75, are even possible. To achieve such comparatively high values ​​for the numerical aperture, larger, and therefore heavier, optical elements and systems are required.

[0005] The lifting, holding, and / or transport of heavy bodies, preferably optical elements, in the field of semiconductor technology is currently carried out, for example, using lifting systems in which the body is lifted, held, and / or transported by means of a load hook, for example, by cranes. The load hook engages one or more lifting interfaces of the body and / or a device for holding the body.

[0006] Depending on the mass of the body to be lifted, held, and / or transported, such lifting systems can be subjected to a comparatively high tensile load on the one or more lifting interfaces and the device for holding the body. With very heavy or massive bodies, preferably optical components for semiconductor technology systems, for example, with a mass of several hundred to thousands of kilograms, this tensile load can cause cracks to form in the device for holding the body, including the one or more lifting interfaces, connecting elements that interact with the device for holding the body and the body itself, and / or in the body being lifted, held, and / or transported.This can occur particularly when one or more materials from which the body and / or the device for holding the body are made exhibit comparatively low ductility. Such materials can be described as brittle materials.

[0007] Therefore, there is a need for devices, systems, and methods for lifting, holding, and / or transporting heavy bodies, for example, optical elements for semiconductor technology equipment, which reduce, and preferably eliminate, the risk of crack formation in the body and / or the device holding the body. Consequently, there is a need for, preferably optical, elements for semiconductor technology equipment that are designed in such a way that the risk of crack formation during lifting, holding, and / or transporting the elements is reduced, and preferably eliminated.

[0008] Against this background, the present invention is based on the objective of providing a device for holding a, preferably optical, element for a semiconductor technology system, a system for holding a, preferably optical, element for a semiconductor technology system, an element, preferably an optical element, for a semiconductor technology system, and a method for transporting a, preferably optical, element for a semiconductor technology system, by means of which the risk of cracking can be reduced, preferably avoided.

[0009] The following describes various embodiments of the device, the system, the element for a semiconductor technology plant and the method, whereby the individual embodiments can be combined arbitrarily, regardless of whether they are described for the device, the system, the element for a semiconductor technology plant and / or the method.

[0010] The aforementioned problem is solved by a device for holding an element, preferably optical, for a semiconductor technology system, comprising: a base body comprising a connecting section for connecting the base body to a lifting device, and a holding element arranged on the base body for holding the element for a semiconductor technology system, wherein the holding element is configured to exert a holding force for holding the element for a semiconductor technology system at least partially in the form of a pressure force.

[0011] In particular, by designing the holding element to exert at least partially the holding force required to hold the element for a semiconductor technology system in the form of a compressive force, preferably rather than, for example, exclusively, in the form of a tensile force, the device according to the claim reduces, and preferably avoids, tensile stress on the element to be held (e.g., at one or more lifting interfaces of the element to be held) and / or on the device according to the claim, e.g., during lifting, holding, and / or transporting the element. As a result, the risk of cracking in the element to be held and / or on the device according to the claim is advantageously reduced. It has been found that the risk of cracking in elements for a semiconductor technology system and / or in devices for holding such elements is considerably lower in the case of compressive loads than in the case of tensile loads.

[0012] The device according to the claim can preferably be a lifting adapter. Preferably, the device can be configured to convert tensile forces occurring during lifting, holding, and / or transporting the component for a semiconductor technology system, preferably tensile forces acting on the device, at least partially into compressive forces acting on the device, the component for a semiconductor technology system, and / or the one or more connecting elements. In addition to holding the component for a semiconductor technology system, the device according to the claim can, for example, enable lifting, moving, setting down, and / or transporting the component for a semiconductor technology system. The device according to the claim is therefore preferably a device for holding, lifting, moving, setting down, and / or transporting the component for a semiconductor technology system.

[0013] The device according to the claim can, for example, be part of a system for holding an element, preferably optical, for a semiconductor technology system, preferably a system according to claim 12 or 13. Furthermore, the device according to the claim can, for example, be used in a method for transporting an element, preferably optical, for a semiconductor technology system, preferably in a method according to claim 15.

[0014] The element, preferably optical, for a semiconductor technology system can be part of a projection exposure system. The element for a semiconductor technology system is preferably an optical element and can preferably comprise at least one mirror and / or at least one lens. The element, preferably optical, for a semiconductor technology system can, for example, be a preferably optical element for a microlithography system, preferably a projection exposure system.

[0015] The preferably optical element for a semiconductor technology system can preferably be configured to generate and / or manipulate electromagnetic radiation from the DUV range, preferably with operating wavelengths in the range between 150 nm and 400 nm, in particular 365 nm, 248 nm or 193 nm, and / or from the EUV range, preferably with operating wavelengths in the range between 5 nm and 30 nm, in particular at 13.5 nm, for example by deflecting or filtering it. The preferably optical element for a semiconductor technology system can, for example, be a preferably optical element according to claim 14.

[0016] The base body is preferably designed to ensure sufficient mechanical stability of the device. Therefore, the base body can be made, at least partially, of steel, at least one steel alloy, titanium, at least one titanium alloy, and / or at least one fiber-reinforced composite material, preferably carbon fiber reinforced plastic (CFRP) and / or glass fiber reinforced plastic (GFRP). Preferably, the base body is made of steel.

[0017] The base body can, for example, be connected to the lifting device in the connecting section by means of a force-fit and / or form-fit connection. Such a force-fit and / or form-fit connection of the base body to the lifting device enables the device to be lifted by the lifting device, whereby the element held by the device, preferably an optical element, can also be indirectly lifted, held, and / or transported by the lifting device.

[0018] The lifting device can, for example, comprise a chain hoist, a cable hoist, preferably an electric cable hoist, a winch, and / or a crane, or correspond to one or more of these elements. As already mentioned, the lifting device can be configured to lift the device, thereby indirectly lifting, holding, and / or transporting an element held by the device, preferably an optical element. While the device according to the claim for holding an element can be understood as a device that can hold the element to be lifted or the lifted element, the lifting device can, for example, be understood as a device that can lift the device according to the claim for holding an element.

[0019] The connecting section preferably comprises a lifting interface, for example a lifting opening, for receiving a lifting device, for example a load hook. Preferably, the connecting section corresponds to the lifting interface, more preferably to the lifting opening. The lifting device can be part of the lifting device or a lifting system that includes the lifting device. In particular, the lifting interface can enable the base body, and thus the device according to the claim, to be connected to the lifting device by friction and / or positive locking. In particular, such a friction-fit and / or positive locking connection of the device according to the claim with the lifting device enables the device according to the claim to be lifted by the lifting device, whereby the element held by the device according to the claim can also be indirectly lifted, held, and / or transported by the lifting device.The lifting interface gives the device a high degree of compatibility with existing lifting devices and / or lifting systems, and can therefore be used in a particularly economical way.

[0020] In addition to the connecting section, the base body can include an end section, wherein the connecting section and the end section are preferably arranged at opposite ends of the base body.

[0021] Alternatively or additionally, the base body can also include an intermediate section. The intermediate section can be located adjacent to the connecting section and / or the end section. Alternatively or additionally, the intermediate section can be located between the connecting section and the end section. The intermediate section can have a longitudinal axis.

[0022] The end section is preferably connected to the intermediate section, preferably integrally formed with it, and / or the intermediate section is connected to the connecting section, preferably integrally formed with it. This advantageously enables a stable mechanical connection between the aforementioned sections.

[0023] The end section preferably extends at least partially obliquely, in particular perpendicularly, to a longitudinal axis of the base body, especially the intermediate section. The end section can serve as a stop and / or support for the retaining element. Advantageously, a tensile force acting on the connecting section can also be transferred to the retaining element as a compressive force via the end section. The base body, especially the end section and the intermediate section, preferably has a T-shape in cross-section. The end section, together with the intermediate section, can therefore, for example, be T-shaped and / or extend obliquely to the longitudinal axis of the base body, especially the intermediate section. Alternatively or additionally, the end section can extend, preferably obliquely to the longitudinal axis of the base body, especially the intermediate section, at least partially beyond the intermediate section.

[0024] The retaining element for holding the component of a semiconductor device preferably comprises one or more retaining sections for holding the component of a semiconductor device. Preferably, the one or more retaining sections are configured to exert the holding force for holding the component of a semiconductor device.

[0025] It is understood that whenever reference is made to the retaining element above and / or below, a reference to the one or more retaining sections of the retaining element shall be considered disclosed alternatively or additionally. Thus, for example, if it is described that the retaining element is configured to exert the holding force for holding the element in a semiconductor technology system, it shall be considered disclosed alternatively or additionally that the one or more retaining sections of the retaining element are configured to exert the holding force for holding the element in a semiconductor technology system.

[0026] The retaining element, preferably one or more retaining sections, is preferably arranged between the connecting section and the end section on the base body and / or around the base body. In other words, the base body is preferably movably arranged between the connecting section and the end section in an opening of the retaining element, preferably one or more retaining sections.

[0027] The retaining element, preferably one or more retaining sections, can be movably, preferably displaceably, arranged on and / or around the base body, preferably on and / or around the intermediate section of the base body. The retaining element, preferably one or more retaining sections, can preferably be movably, preferably displaceably, arranged along a longitudinal axis of the base body, preferably along a longitudinal axis of the intermediate section. The retaining element, preferably one or more retaining sections, can be arranged at least partially, preferably predominantly, and in particular completely, around the base body, preferably the intermediate section. In other words, the base body, preferably the intermediate section, can be movably, preferably displaceably, arranged in an opening, for example a cylindrical one, of the retaining element, preferably of the one or more retaining sections.The retaining element, preferably the one or more retaining sections, is therefore preferably not rigidly connected to the base body, in particular the intermediate section. This simplifies the secure guidance of the retaining element, preferably the one or more retaining sections.

[0028] As already mentioned, the retaining element is designed to exert the holding force for holding the semiconductor technology system element, at least partially, in the form of a compressive force. The holding force is preferably exerted on the semiconductor technology system element and / or on one or more connecting elements for a positive-locking and / or force-locking connection of the device to the semiconductor technology system element.

[0029] The retaining element, in particular the one or more retaining sections, is preferably designed to be bendable, especially elastically bendable. The retaining element, preferably the one or more retaining sections, can therefore, for example, be designed as an elastically deformable bending element. The retaining element can, for example, consist at least partially of steel and / or be designed as a molded part, e.g., a steel molded part.

[0030] This allows for a simple, structurally sound way to provide flexibility in the retaining element, preferably in one or more retaining sections. In particular, such flexibility, preferably elastic flexibility, allows the holding force for the element in a semiconductor technology system to be provided, at least partially, in the form of a compressive force. Furthermore, such a flexible retaining element (e.g., a steel molded part) advantageously enables a particularly compact design of the device according to the claim.

[0031] In one embodiment of the device, it is therefore provided that the holding element is bendable by means of a force exerted on the holding element, preferably by means of a pressing force exerted on the holding element by the base body and / or by means of a weight force of the element for a semiconductor technology system, and / or that the holding force for holding the element for a semiconductor technology system is based on a bending of the holding element.

[0032] The force exerted on the holding element, preferably on the one or more holding sections, can, for example, result from a holding force exerted on the device according to the claim to hold the element for a semiconductor technology system and be opposed to the weight force of the element for a semiconductor technology system.

[0033] The force exerted on the holding element, preferably on the one or more holding sections, can be exerted on the holding element from the aforementioned end section of the base body, preferably when a corresponding holding force acts on the connecting section connected to the end section, preferably via the intermediate section, on the device according to the claim, for example by the lifting device or the lifting system.

[0034] If the device according to the claim holds the element for a semiconductor technology system, there is preferably a balance of forces between a holding force exerted, for example, by the lifting device on the device according to the claim and the weight force acting on the device.

[0035] The one or more holding sections can, for example, be compressed in at least one direction by the holding force exerted on the device according to the claim and the opposing force of gravity, and consequently be deflectable, e.g., bendable, in at least one other direction. The at least one other direction in which the one or more holding sections can be deflected, e.g., bendable, is preferably different from the direction of the pressing force and / or the direction of the force of gravity, and particularly preferably substantially perpendicular to these directions.

[0036] The holding force for securing the element for a semiconductor technology system preferably acts in a different direction than the pressing force exerted by the base body on the holding element, in particular essentially perpendicular to it. In this way, the holding force for securing the element for a semiconductor technology system can advantageously be converted, at least partially, into a compressive force, e.g., on the element for a semiconductor technology system and / or on the one or more connecting elements.

[0037] In one embodiment of the device, one or more directions of the holding force for holding the semiconductor technology component are therefore different from the direction of a pressing force exerted by the base body on the holding element, and in particular, substantially perpendicular to the direction of the pressing force. In other words, the holding force preferably acts obliquely, and in particular substantially perpendicularly, to the pressing force and / or to the weight of the semiconductor technology component. The holding force required to hold the semiconductor technology component can thus be provided largely as a compressive force, thereby reducing the risk of cracking in the semiconductor technology component and / or in the device as explained above.

[0038] The holding element can preferably be configured so that the holding force for holding the element in a semiconductor technology system acts obliquely, in particular substantially perpendicularly, to a force acting on the holding element along an axis of symmetry and / or longitudinal axis of the holding element. Particularly preferably, the holding element is radially deflectable when an axial force acts on it. The force acting on the holding element, in particular axially, preferably corresponds to the pressing force. Thus, the holding element can preferably be configured so that the holding force for holding the element in a semiconductor technology system acts obliquely, in particular substantially perpendicularly, to a longitudinal axis of the base body, in particular to the longitudinal axis of the intermediate section.

[0039] In particular, in this way the holding element can exert the holding force for holding the element for a semiconductor technology system at least predominantly (e.g. at least 50%, preferably at least 90%, particularly preferably at least 99%) in the form of a, preferably radially acting, pressure force on the element for a semiconductor technology system, thereby reducing, and preferably avoiding, the risk of cracking as described above.

[0040] If the retaining element is deflectable (e.g., bendable) due to the previously described pressing force and / or weight force, then advantageously no active components (e.g., components requiring a power supply) are needed to deflect the retaining element. This results in a particularly low-complexity device that is especially economical to manufacture. Furthermore, such a deflectable (e.g., bendable) retaining element particularly allows for a very compact design of the device.

[0041] Alternatively or additionally, the holding force for holding the element in a semiconductor technology system can be provided, for example, using pneumatic and / or hydraulic pistons.

[0042] In one embodiment of the device, the holding element, preferably the one or more holding sections, comprises at least one pneumatic and / or hydraulic piston. Preferably, each piston rod of the at least one piston is configured to exert the holding force for holding the element for a semiconductor technology system, at least partially, in the form of a compressive force. Alternatively or additionally to a flexible holding element, the holding element, preferably the one or more holding sections, can be designed as a pneumatic and / or hydraulic holding element. The at least one pneumatic and / or hydraulic piston is preferably deflectable at an angle, preferably substantially perpendicular, to the longitudinal axis of the base body, preferably the longitudinal axis of the intermediate section, and / or to a weight force of the element for a semiconductor technology system.Due to the deflectability of at least one piston obliquely, preferably perpendicularly, to the weight force of the element for a semiconductor technology system, the at least one piston can exert the holding force for holding the element for a semiconductor technology system predominantly in the form of a pressure force on the element to be held, so that a risk of cracking as described above can be reduced.

[0043] In one embodiment of the device, it is provided that the device comprises a deflection element, wherein one or more deflection sections of the deflection element are adjustable between a retracted insertion position for inserting the device into an opening of the element for a semiconductor technology system and a deflected operating position for holding the element for a semiconductor technology system.

[0044] Preferably, the spatial extent of the one or more deflection sections in at least one spatial direction in the retracted insertion position is smaller than the spatial extent of the one or more deflection sections in at least one spatial direction in the extended operating position. In other words, the one or more deflection sections in the retracted insertion position are smaller in at least one spatial direction than in the extended operating position.

[0045] Particularly preferred is a spatial extent of the one or more deflection sections in at least one spatial direction in the retracted insertion position that is smaller than the diameter of the opening of the element for a semiconductor technology system. In this way, the insertion position allows the device to be inserted into the opening.

[0046] The one or more deflection sections are preferably movably mounted on the holding element, preferably on the one or more holding sections. For example, the one or more deflection sections can be configured to slide on the holding element, preferably on the one or more holding sections. For this purpose, a friction-reducing coating can be provided on the one or more holding sections. In particular, by movably mounting the deflection sections on the holding element, the deflection sections can be adjustable between the retracted insertion position and the deflected operating position.

[0047] In one embodiment of the device, it is provided that the device comprises one or more connecting elements for the positive locking and / or force locking connection of the device with the element for a semiconductor technology system and that, preferably, the one or more connecting elements are connected to the one or more deflection sections.

[0048] Alternatively or additionally, the one or more connecting elements can, for example, be part of a system for holding a, preferably optical, element for a semiconductor technology system, preferably a system according to claim 12 or 13, as explained in more detail below. It is understood that the foregoing and following description of the one or more connecting elements, irrespective of whether it relates to the claimed device and / or the claimed system, is to be considered disclosed for both the device and the system.

[0049] Because the one or more connecting elements are preferably connected to the one or more deflection sections, the deflection of the deflection element, in particular the one or more deflection sections, described above, can advantageously also deflect the one or more connecting elements. Therefore, the one or more connecting elements are preferably deflectable by means of a deflection of the one or more deflection sections.

[0050] By deflecting the deflection sections, which are preferably connected to the connecting elements, the one or more connecting elements can thus advantageously connect the device according to the claim, the one or more connecting elements and / or the element for a semiconductor technology system by means of a positive locking mechanism.

[0051] In other words, the one or more deflection sections can be configured to push the one or more connecting elements into corresponding connecting recesses of the element to be held when the one or more deflection sections are moved from the retracted insertion position to the deflected operating position. A force, for example a radial force, with which the one or more connecting elements are pushed and / or pressed by the deflection sections into the connecting recesses of the element to be held is preferably significantly lower (e.g., less than 10%) than the holding force required to hold the element in a semiconductor technology system.

[0052] The one or more connecting elements can advantageously increase the contact area over which the compressive forces acting to hold the element in a semiconductor technology system are applied. In this way, the pressure acting on the contact area, i.e., the force per unit area, can be reduced, thereby further minimizing the risk of cracking.

[0053] Because the one or more connecting elements can, among other things, create a positive-locking connection between the device and the semiconductor equipment component, they can also reduce the risk of the semiconductor equipment component falling off. For example, the holding force exerted by the device on the semiconductor equipment component may be temporarily insufficient to ensure a frictional connection between the device and the semiconductor equipment component. As a result, the semiconductor equipment component may slip within the frictional connection.Because the one or more connecting elements can preferably also create a positive-locking connection between the device and the element for a semiconductor technology system, they can at least prevent a complete loosening of the connection between the device and the element for a semiconductor technology system and thus prevent the element for a semiconductor technology system from falling off.

[0054] In one embodiment of the device, the one or more connecting elements comprise the following: at least one connecting element recess for the positive locking and / or force-locking connection of the device, preferably of the holding element, in particular of the one or more holding sections, with the respective connecting element and / or at least one projection for the positive locking and / or force-locking connection of the respective connecting element with the element for a semiconductor technology system.

[0055] The device and, preferably, the retaining element, in particular the one or more retaining sections, can preferably engage in the connecting element recess(s). Furthermore, the projection(s) of the connecting element(s) can preferably engage in corresponding connecting recesses of the element to be retained. While the connecting element recess(s) thus enable a positive and / or non-positive connection between the device according to the claim and the connecting element(s), the projection(s) enable a positive and / or non-positive connection between the connecting element(s) and the element to be retained. In this way, the connecting element(s) enable a reliable connection between the device according to the claim and the element for a semiconductor technology system. At the same time, such connecting elements are comparatively simple and economical to manufacture.

[0056] In one embodiment of the device, the at least one connecting element recess is designed such that the retaining element, preferably one or more retaining sections of the retaining element, can engage into the at least one connecting element recess and / or contact the at least one connecting element recess, preferably at least one side wall of the connecting element recess. In particular, by such engagement of the retaining element into the connecting element recess(s) and / or contact with the, preferably side walls of the, connecting element recess(s) by the retaining element, the positive and / or non-positive connection between the device according to the claim and the connecting element(s) can be reliably established.

[0057] In one embodiment of the device, it is provided that the device comprises an adjusting element, wherein the one or more deflection sections are adjustable between the insertion position and the operating position by means of the adjusting element, and that, preferably, the adjusting element is movably arranged on the base body and / or on the holding element and / or is adjustable between a basic position and a deflection position for deflecting the one or more deflection sections.

[0058] The adjusting element simplifies, in particular targeted, adjustment of one or more deflection sections between the insertion position and the operating position.

[0059] The base body and / or the retaining element may include a sliding section for guiding the adjusting element. The adjusting element is preferably arranged at least partially on and / or around the sliding section and / or the intermediate section. The adjusting element is preferably designed such that the one or more deflection sections are in the retracted insertion position when the adjusting element is in its home position, and that the one or more deflection sections are in the deflected operating position when the adjusting element is in the deflected position. The adjusting element can contact the deflection element, preferably the one or more deflection sections, at least partially in the insertion position and / or in the operating position.

[0060] The adjusting element preferably comprises a screw nut. Preferably, the base body, in particular the intermediate section, and / or the retaining element comprise a screw thread for adjustable mounting of the adjusting element, preferably the screw nut. Thus, preferably the adjusting element is a screw nut and / or the base body, in particular the intermediate section, and / or the retaining element comprise a screw thread for adjustable mounting of the screw nut. The screw thread serves to mechanically guide the screw nut and thus simplifies easy adjustment of the adjusting element. Depending on its position relative to the deflection element, preferably the one or more deflection sections, the screw nut can exert a force on the deflection element, preferably on the one or more deflection sections, which in turn can cause a deflection of the one or more deflection sections.Consequently, the one or more deflection sections are preferably adjusted between the insertion position and the operating position depending on the position of the adjustable nut. The combination of a nut and a threaded screw offers high stability, particularly mechanical stability, with comparatively low complexity and cost-effective manufacturing. However, it is understood that other suitable components can also be used as adjustment elements.

[0061] Alternatively or additionally, it is conceivable that the one or more deflection sections can be adjusted between the insertion position and the operating position by means of an external adjusting element, which is not part of the device according to the claim.

[0062] In one embodiment of the device, the one or more deflection sections are designed to be inserted and / or extended obliquely, preferably perpendicularly, to a longitudinal axis of the base body, and preferably adjustable between the insertion position and the operating position. This facilitates insertion of the device into the opening of the semiconductor technology component in the inserted position. In particular, the ability to insert the one or more deflection sections obliquely, especially perpendicularly, to the longitudinal axis of the base body makes it easier to ensure that the spatial extent of the one or more deflection sections in the inserted position is smaller in at least one spatial direction than in the extended operating position, and, more importantly, that the spatial extent of the one or more deflection sections is smaller than the diameter of the opening of the semiconductor technology component.

[0063] In one embodiment of the device, the deflection element comprises a spring element, preferably a disc spring and / or a coil spring disc, and preferably, the spring element is adjustable between the insertion position and the operating position. In particular, the spring element can be a disc spring or a coil spring disc. A disc spring can be understood to be a disc-shaped and / or at least partially conical spring. A coil spring disc preferably comprises a curved and / or convex disc on which a coil spring is arranged. The deflection element can therefore be understood, for example, as a two-dimensionally acting deflection element.

[0064] The aforementioned problem is further solved by a system for holding a, preferably optical, element for a semiconductor technology system, comprising: a device according to one of claims 1 to 11, and the element for a semiconductor technology system and / or one or more connecting elements for a positive and / or force-fit connection of the device with the element for a semiconductor technology system.

[0065] In a similar manner to the device according to the claim, the system according to the claim also enables, in particular by means of the holding element encompassed by the device, the holding force required to hold the element for a semiconductor technology system to be exerted at least partially in the form of a compressive force, thereby reducing, and preferably avoiding, tensile stress on the element to be held and / or on the system according to the claim, e.g., when lifting, holding, and / or transporting the element. As a result, the risk of cracking in the element to be held and / or on the system according to the claim is advantageously reduced.

[0066] Furthermore, the one or more connecting elements can increase the contact area over which the compressive force for holding the element in a semiconductor technology system is applied. In this way, the pressure acting on the contact area, i.e., the force per unit area, can be advantageously reduced, thereby further decreasing the risk of cracking.

[0067] Because the one or more connecting elements can, among other things, create a positive-locking connection between the device and the semiconductor equipment component, they can also, as described above, reduce the risk of the semiconductor equipment component falling off. This can be described, for example, as a supporting positive lock.

[0068] The system according to the claim can, for example, be used in a method for transporting an element, preferably optical, for a semiconductor technology system, preferably an element according to claim 14.

[0069] In one embodiment of the system, the semiconductor element has a mass of at least 1000 kg, preferably at least 2000 kg, and particularly preferably at least 4000 kg, and / or one or more materials from which the semiconductor element is made have a lower ductility than steel. The mass of the semiconductor element can, for example, be between 1000 kg and 20,000 kg, preferably between 2000 kg and 17,500 kg, and particularly preferably between 4000 kg and 15,000 kg. Elements with such masses are used, preferably optical ones, particularly in the aforementioned EUV lithography and high-NA EUV lithography.The one or more materials from which the component for a semiconductor device is manufactured, and which exhibit lower ductility than steel, may, for example, comprise aluminum, preferably cast aluminum, copper, at least one ceramic material, preferably a silicon carbide material, in particular SiSiC, at least one glass-ceramic material, and / or at least one glass, or correspond to one or more of these materials. Such materials may be described as brittle, depending, for example, on their respective elongation at break (e.g., in %).

[0070] Particularly in the case of, preferably optical, elements with such masses and / or in the case of, preferably optical, elements made of such materials, a force required to lift, hold, and / or transport the, preferably optical, element, which acts predominantly in the form of tensile forces on the, preferably optical, element, can cause cracks in the lifting interface(s) and / or in the, preferably optical, element itself. Therefore, the device and system according to the claim are particularly advantageous in the case of such, preferably optical, elements, since, as explained above, they can largely convert the tensile forces that occur into compressive forces.

[0071] The aforementioned problem is further solved by an element, preferably an optical element, for a semiconductor technology system, comprising at least one opening for receiving a device for holding the element for a semiconductor technology system, preferably a device according to one of claims 1 to 11, or a system for holding the element for a semiconductor technology system, preferably a system according to one of claims 12 or 13, wherein at least one connection recess for a positive-locking and / or force-locking connection of the device or the system with the element for a semiconductor technology system is provided on a respective inner wall of the at least one opening.

[0072] The opening(s), and in particular the connecting recesses provided on the respective inner wall of the opening(s), allow the element for a semiconductor technology system to be advantageously connected to the device or system for holding the element by means of a positive and / or force-fit connection. In particular, the connecting recesses enable the optical element to be lifted, held, and / or transported predominantly by means of compressive forces rather than tensile forces, as explained above.

[0073] The aforementioned problem is further solved by a method for transporting a, preferably optical, element for a semiconductor technology system, preferably an element according to claim 14, comprising: providing a device according to one of claims 1 to 11 or a system according to one of claims 12 or 13; inserting the device or the system into at least one opening of the element for a semiconductor technology system; lifting the element for a semiconductor technology system using the device or the system, wherein one or more retaining sections of the retaining element and / or the one or more connecting elements engage in at least one connecting recess provided on a respective inner wall of the at least one opening of the element for a semiconductor technology system.

[0074] Similar to the device, system, and element of the claim for a semiconductor technology system, the method of the claim allows, in particular, the engagement of one or more retaining sections of the retaining element and / or one or more connecting elements in the at least one connecting recess of the element to be transported to exert the holding force required for transporting the element, at least partially, in the form of a compressive force. This reduces, and preferably eliminates, tensile stress on the element to be transported and / or on the device or system of the claim. Consequently, the risk of cracking in the element to be transported and / or on the device or system of the claim is advantageously reduced.

[0075] The one or more connecting elements can also increase the contact area over which the compressive force for holding the element being transported acts. In this way, the pressure acting on the contact area, i.e., the force per unit area, can be advantageously reduced, thereby further decreasing the risk of cracking. Moreover, as described above, the one or more connecting elements can reduce the risk of the element being transported falling.

[0076] Alternatively or additionally, the one or more retaining sections of the retaining element can engage in the at least one connecting recess, the one or more retaining sections of the retaining element can engage in at least one connecting element recess provided on a respective side wall of the one or more connecting elements. Furthermore, respective projections of the connecting element(s) can preferably engage in the connecting recesses of the element to be transported.

[0077] While the one or more retaining sections, together with the connecting element recess(s), can thus enable a positive and / or non-positive connection between the device according to the claim and the connecting element(s), the projections of the connecting element(s), together with the connecting recesses of the element to be transported, can thus enable a positive and / or non-positive connection between the connecting element(s) and the element to be transported. In other words, the element to be transported can be held and / or transported directly, in particular by means of the retaining sections and the connecting recesses, and / or indirectly, in particular by means of the connecting element recesses and the projections of the connecting elements, by a device and / or system according to the claim.

[0078] In this way, the connecting element(s) enable a reliable connection between the device and the component for a semiconductor technology system. At the same time, such connecting elements are relatively simple and economical to manufacture.

[0079] The claimed method preferably further comprises adjusting the one or more deflection sections from the retracted insertion position to the deflected operating position. As a result, for example, the one or more connecting elements can establish a particularly positive-locking connection between the claimed device and the element for a semiconductor technology system. Preferably, the one or more deflection sections of the deflection element are in the retracted insertion position when the device or system is inserted into the at least one opening.

[0080] While the device according to the claim, which can be connected to one or more connecting elements and / or the element for a semiconductor technology system using the retaining element, can be connected in particular by means of a force-fit connection, the device according to the claim, which can be connected to one or more connecting elements and / or the element for a semiconductor technology system using the deflection element, can be connected in particular by means of a form-fit connection, e.g., a supporting one.

[0081] Further features and advantages of the device, the system, the element for a semiconductor technology plant and the method will become apparent from the following description of exemplary embodiments, with reference to the accompanying drawing.

[0082] The drawing shows: Fig. 1 an embodiment of the system according to the claim including an embodiment of the device according to the claim in a deflected operating position in a sectional view, Fig. 2 a part of a holding section of an exemplary holding element, an exemplary connecting element and an exemplary connecting recess in a sectional view, Fig. 3 the embodiment of the claimed system made of Fig. 1 including the embodiment of the device according to the claim Fig. 1 in a retracted insertion position in a sectional view, and Fig. 4 an exemplary deflection element in a perspective view.

[0083] Fig. Figure 1 shows an embodiment of a system for holding an element 10, e.g. an optical element, for a semiconductor technology system, consisting of a device 100 for holding the element 10 and connecting elements 200a, 200b.

[0084] The device 100 comprises a base body 110 and a holding element 120 arranged on the base body 110. The base body 110 comprises a lifting interface 111 (an example of a connecting section), in the embodiment shown in the form of a lifting opening, an end section 112 and an intermediate section 113 arranged between the lifting interface 111 and the end section 112, the longitudinal axis of which is in the Fig. The example shown runs along the vertical direction 1.

[0085] The retaining element 120 is arranged around the base body 110, preferably around the intermediate section 113, between the lifting interface 111 and the end section 112. In other words, the base body 110, preferably the intermediate section 113, is arranged at least partially in a central opening of the retaining element 120 between the lifting interface 111 and the end section 112.

[0086] The connecting elements 200a, 200b have connecting element recesses 220a, 220b (see reference numerals in Fig. 3) as well as projections 210a, 210b. As in Fig. As shown in Figure 1, the connecting element recesses 220a, 220b of the connecting elements 200a, 200b accommodate the respective outer ends of one or more retaining sections 122 of the retaining element 120. Furthermore, connecting recesses 12a, 12b are provided on an inner wall of an opening 11 of the element 10, which accommodate the projections 210a, 210b of the connecting elements 200a, 200b.

[0087] While the connecting element recesses 220a, 220b, together with the one or more retaining sections 122 of the retaining element 120, can enable a positive and / or non-positive connection between the device 100 for holding the element 10 and the connecting elements 200a, 200b, the projections 210a, 210b, together with the connecting recesses 12a, 12b, can enable a positive and / or non-positive connection between the connecting elements 200a, 200b and the element 10 to be held. In this way, the connecting elements 200a, 200b make it possible to connect the device 100 and the element 10 to be held in a positive and / or non-positive manner.

[0088] Thus, a lifting device (in Fig. (1 not shown), when the element 10 is lifted, held, and / or transported, a holding or load force F1 in the form of a tensile force is exerted on the device 100 via the lifting interface 111. The lifting device can thus lift the device 100 via the lifting interface 111, for example, by means of a load hook (an example of a lifting device). The load force F1 preferably acts along a vertical direction 1. Since the lifting interface 111 is connected to the end section 112 via the intermediate section 113, preferably by a material bond, for example, by welding, the load force F1 results in a pressing force of the end section 112 on the holding element 120. This pressing force of the end section 112 on the holding element 120 opposes the weight force of the element 10, which also acts on the holding element 120.As a result of the pressing force of the end section 112 and / or the weight force of the element 10, the retaining sections 122 of the retaining element 120 are deflected radially, e.g. by a bending of the retaining element 120, e.g. pressed outwards, resulting in a holding force exerted by the device 100 on the connecting elements 200a, 200b and, indirectly, on the element 10 to hold the element 10 to be held, in the form of a compressive force.

[0089] The retaining sections 122 of the retaining element 120 are therefore radially deflectable when an axial force acts on the retaining element 120. This radial deflection causes the one or more retaining sections 122 of the retaining element 120 to engage in the connecting element recesses 220a, 220b (see reference numerals in Fig. 3) and exert a respective compressive force or clamping force on the connecting elements 200a, 200b. The connecting elements 200a, 200b consequently exert a corresponding compressive force or clamping force on the inner wall of the opening 11 of the in Fig. 1 indicated element 10 to be held, whereby the element 10 can be held largely by means of compressive forces or contact forces.

[0090] In the manner described above, the device 100 enables the tensile forces occurring during lifting, holding, and / or transporting the element 10, such as the load force F1, to be largely converted into compressive forces for holding the element 10. This advantageously reduces the risk of cracking, as already explained in more detail above. Furthermore, the connecting elements 200a and 200b increase the contact area over which the compressive forces act to hold the element 10. As also already explained in more detail, this further reduces the risk of cracking.

[0091] Because the connecting elements 200a, 200b are at least partially positively connected to both the device 100 and the element 10 to be held by means of the connecting element recesses 220a, 220b and the projections 210a, 210b, they can also reduce the risk of the element 10 to be held falling. If, for example, a holding force exerted by the device 100 on the element 10 to be held is temporarily too low to ensure a frictional connection, the element 10 to be held could slip within the frictional connection. Because the connecting elements 200a, 200b create at least a partially positive connection between the device 100 and the element 10 to be held, they can prevent the connection from completely disengaging and thus prevent the element 10 from falling.In other words, the connecting elements 200a, 200b, which are at least partially positively connected to the device 100 and the element 10 to be held, serve as a fall-out protection device. This (additional) function of the connecting elements 200a, 200b can also be described as a supporting positive locking mechanism.

[0092] The device 100 further comprises an adjusting element 130 (in the present embodiment a screw nut) which can be adjustably mounted, in particular screwed, via a sliding section 114, for example in the form of a screw thread. Fig. Figure 1 shows the sliding section 114 as an example of part of the retaining element 120. Alternatively or additionally, the sliding section can also be part of the base body 110.

[0093] The adjusting element 130 can, as in Fig. The adjusting element 130 is shown by the arrow to the right of the adjusting element 130 and is mounted along the base body 110, preferably along a longitudinal axis 1 of the base body 110, in the direction of the end section 112. As a result, the adjusting element 130 exerts a comparatively large force on the deflecting element 140, which in turn causes a comparatively large deflection of deflection sections of the deflecting element 140. Due to the deflection of the deflection sections of the deflecting element 140, the projections 210a, 210b of the connecting elements 200a, 200b engage in the connecting recesses 12a, 12b provided on the inner wall of the element 10. The connecting elements can therefore also be referred to as locking blocks. The connecting elements 200a, 200b can be connected to the deflection sections of the deflecting element 140, preferably by a material bond, e.g., by means of a metal-to-metal bond. B. by means of welding, or by frictional connection, e.g. by means of a screw connection.The connection can be made, for example, by spot welding or by means of a screw. For example, by connecting the connecting elements 200a, 200b to the deflection element 140 in such a way that the connecting elements 200a, 200b can also be deflected by deflecting the deflection element 140.

[0094] Fig. Figure 2 shows a portion of a retaining section 122 of an exemplary retaining element 120, an exemplary connecting element 200', and an exemplary connecting recess 12 provided on an inner wall of an element 10 to be retained, in an enlarged sectional view. The retaining section 122 of the retaining element 120 engages in a connecting element recess 220' of the connecting element 200'. A projection 210' of the connecting element 200', in turn, engages in the connecting recess 12 provided on the inner wall of the element 10 to be retained. Unlike the one shown in the Fig. 1 and Fig. In the 3 illustrated connecting elements 200a, 200b, each having rectangular connecting element recesses 220a, 220b, the connecting element 200' has a concave, in particular semicircular, connecting element recess 220'.

[0095] As in Fig. As shown in Figure 2, the deflected retaining section 122 of the retaining element 120 exerts a force F. 1D on the connecting element 200'. Consequently, the connecting element 200' in turn exerts a corresponding force on the inner wall of the element 10 to be held. According to the principle of interaction, the inner wall of the element 10 to be held exerts counterforces F. G1 and F G2 according to F1D=FG1+FG2 on the connecting element 200'. For the frictional force F R between the connecting element 200' and the inner wall of the element 10 to be held, the following applies: FR=FN⋅μr with normal force F N = F 1Dand the coefficient of friction (or friction value) µ r between the connecting element 200' and the inner wall of the element 10 to be held. In order to lift, hold and / or transport the element 10 to be held, the frictional force F must R greater than or at least equal to the load force F1: FR≥F1

[0096] If this condition is met and a force-fit connection exists between the holding element 120, preferably the one or more holding sections 122 of the holding element 120, the connecting element 200' and the element 10 to be held, the element 10 to be held can be lifted, held and / or transported.

[0097] Notwithstanding the fall-out protection described above, a device and / or system according to the claim may preferably be designed such that the holding force for holding the element to be held 10 (e.g. in the form of the frictional force F)R ) a predetermined safety factor, e.g., two or three, is maintained. The holding force (e.g., in the form of the frictional force F) R The holding force can therefore be, for example, two to three times greater than the force required to hold the element 10 to be held. In this way, the probability that the holding force is temporarily too low to ensure a force-fit connection can be advantageously reduced.

[0098] While in Fig. 2 For illustration purposes only a connecting element 200' is shown, the required frictional force F R preferably exerted jointly by several connecting elements. For example, several connecting elements can be provided azimuthally in a cylindrical opening, such as a bore, of an element to be held, which exert a multiple of the aforementioned compressive force or contact force on the element 10 to be held.

[0099] The in Fig. The forces shown in Figure 2 act perpendicular to the aforementioned load force F1, which, as already mentioned, acts along a vertical direction (see reference numeral 1 in Figure 2). Fig. 1 and Fig. 3) acts. Therefore, the effects in Fig. The forces shown in Figure 2 are applied horizontally in the form of a compressive force to the element 10 to be held. As explained above, this can advantageously reduce, and preferably prevent, the risk of cracking in the element 10 to be held.

[0100] Furthermore, due to the coordinated geometric properties of the projection 210' and the connecting recess 12, there is at least a partially positive-locking connection between the connecting element 200' and the element 10 to be held. This reduces the risk of the element 10 falling, for example, if the previously described force-locking connection between the connecting element 200' and the element 10 cannot be maintained temporarily. This can be described as fall-prevention and / or a supporting positive lock.

[0101] Fig. Figure 3 shows the system for holding an element for a semiconductor technology system. Fig. 1 in a retracted insertion position. The adjusting element 130 is mounted along the base body 110, preferably along the displacement section 114, relatively far in the direction of the lifting interface 111. As a result, the adjusting element 130 exerts only a relatively small or no force on the holding element 120, which in turn causes a relatively small or no deflection of one or more deflection sections of the deflection element 140. Consequently, the spatial extent of the one or more deflection sections of the deflection element 140 in the radial direction (an example of at least one spatial direction) is less in the retracted insertion position than the spatial extent of the one or more deflection sections of the deflection element 140 in the radial direction in the (in Fig. (as shown in Figure 1) deflected operating position. In other words, the one or more deflection sections of the deflection element 140 in the retracted insertion position are smaller, at least in the radial direction, than in the deflected operating position. Furthermore, the spatial extent of the one or more deflection sections of the deflection element 140 in the radial direction is not shown in Figure 1. Fig. 3 in the retracted insertion position shown is smaller than a size, in particular a radial one, e.g. a diameter, of the opening 11 of the element 10 to be held. In this way, the Fig. Figure 3 shows the insertion position of the device 100 into the opening 11. To adjust the one or more deflection sections of the deflection element 140 from the retracted insertion position to the deflected operating position, these are preferably movably mounted on the retaining element 120, preferably on the retaining sections 122. For example, the deflection sections of the deflection element 140 can be configured to slide on the retaining sections 122 in order to adjust the deflection sections.

[0102] Fig. Figure 4 shows an exemplary deflection element 140 in the form of a spiral spring disk 140'. The spiral spring disk 140' comprises a curved or bent, or curved or bendable, disk 142'. A spiral spring 141' is arranged on the disk 142'. Similar to the one shown in the Fig.In the deflection element 140 shown in Figures 1 to 3, the spiral spring disc 140' can be deflected, for example, by an adjusting element, e.g., in the form of a screw nut. Such an adjusting element can exert a force on the spiral spring disc 140', which can cause a reduction in the curvature of the disc 142', thereby deflecting the spiral spring disc 140' in turn.

[0103] Alternatively or additionally to a spiral spring disc 140', the deflection element can comprise one or more movable disc elements that can be adjusted between the insertion position and the operating position. For example, the deflection element can comprise a double slide system or be designed as a double slide system that can be adjusted between the insertion position and the operating position. Furthermore, the deflection element can be implemented, for example, by means of a gripper concept in which one or more gripping elements can be adjusted between the insertion position and the operating position. Alternatively, the deflection element can be implemented, for example, by means of an inverted clamping jaw principle in which one or more, in particular inverted, clamping jaw elements can be adjusted between the insertion position and the operating position. Reference symbol list 1 Vertical direction 10 elements for a semiconductor technology plant 11 Opening of element 10 12, 12a, 12b Connection recesses 100 Device 110 basic bodies 111 Lifting interface 112 Final section 113 Intermediate section 114 Displacement section 120 retaining elements 122 stopping sections 130 Adjustment element 140 deflection element 140' spiral spring washer 141' spiral spring 142' disc 200a, 200b, 200' Connecting elements 210a, 210b, 210' projections 220a, 220b, 220' Connecting element recesses

Claims

[1] Device (100) for holding an element (10), preferably optical, for a semiconductor technology system, comprising: - a base body (110) comprising a connecting section for connecting the base body (110) to a lifting device, and - a holding element (120) arranged on the base body (110) for holding the element (10) for a semiconductor technology system, - wherein the holding element (120) is configured to exert a holding force to hold the element (10) for a semiconductor technology system, at least partially in the form of a pressure force. [2] Device (100) according to claim 1, characterized by, that the retaining element (120) is bendable by means of a force exerted on the retaining element (120), preferably by means of a pressing force exerted on the retaining element (120) by the base body (110) and / or by means of a weight force of the element (10) for a semiconductor technology system, and / or that the holding force for holding the element (10) for a semiconductor technology system is based on a bending of the retaining element (120). [3] Device (100) according to one of claims 1 or 2, characterized by , that one or more directions of the holding force for holding the element (10) for a semiconductor technology system are different from a direction of a pressing force exerted by the base body (110) on the holding element (120), in particular substantially perpendicular to the direction of the pressing force. [4] Device (100) according to any one of claims 1 to 3, characterized by, that the device (100) comprises a deflection element (140), wherein one or more deflection sections of the deflection element (140) are adjustable between a retracted insertion position for inserting the device (100) into an opening of the element (10) for a semiconductor technology system and a deflected operating position for holding the element (10) for a semiconductor technology system. [5] Device (100) according to any one of claims 1 to 4, characterized by , that the device (100) comprises one or more connecting elements (200a, 200b, 200') for positive locking and / or force locking connection of the device (100) with the element (10) for a semiconductor technology system and that, preferably, the one or more connecting elements (200a, 200b, 200') are connected to the one or more deflection sections. [6] Device (100) according to claim 5, characterized by, that the one or more connecting elements (200a, 200b, 200') comprise the following: - at least one connecting element recess (220a, 220b, 220') for a positive-locking and / or force-locking connection of the device (100), preferably of the retaining element (120), with the respective connecting element (200a, 200b, 200') and / or - at least a projection (210a, 210b, 210') for the positive and / or force-fit connection of the respective connecting element (200a, 200b, 200') with the element (10) for a semiconductor technology system. [7] Device (100) according to claim 6, characterized by, that the at least one connecting element recess (220a, 220b, 220') is designed such that the retaining element (120), preferably one or more retaining sections (122) of the retaining element (120), can engage in the at least one connecting element recess (220a, 220b, 220') and / or can contact the at least one connecting element recess (220a, 220b, 220'), preferably at least one side wall of the connecting element recess (220a, 220b, 220'). [8] Device (100) according to any one of claims 4 to 7, characterized by, that the device (100) comprises an adjusting element (130) wherein the one or more deflection sections are adjustable between the insertion position and the operating position by means of the adjusting element (130), and that, preferably, the adjusting element (130) is movably arranged on the base body (110) and / or on the retaining element (120) and / or is adjustable between a basic position and a deflection position for deflecting the one or more deflection sections. [9] Device (100) according to any one of claims 4 to 8, characterized by that the one or more deflection sections can be inserted and / or extended obliquely, preferably perpendicularly, to a longitudinal axis of the base body (110), and are preferably adjustable between the insertion position and the operating position. [10] Device (100) according to any one of claims 4 to 9, characterized by, that the deflection element (140) comprises a spring element, preferably a disc spring and / or a coil spring disc, and that, preferably, the spring element is adjustable between the insertion position and the operating position. [11] Device (100) according to any one of claims 1 to 10, characterized by , that the retaining element (120) comprises at least one pneumatic and / or hydraulic piston. [12] System for holding an element (10), preferably optical, for a semiconductor technology system, comprising: - a device (100) according to any one of claims 1 to 11, and - the element (10) for a semiconductor technology system and / or one or more connecting elements (200a, 200b, 200') for the positive locking and / or force locking connection of the device (100) with the element (10) for a semiconductor technology system. [13] System according to claim 12, characterized by , that the element (10) for a semiconductor technology system has a mass of at least 1000 kg, preferably at least 2000 kg, particularly preferably at least 4000 kg, and / or that one or more materials from which the element (10) for a semiconductor technology system is manufactured have a lower ductility than steel. [14] Element (10), preferably an optical element, for a semiconductor technology system, comprising at least one opening for receiving a device (100) for holding the element (10) for a semiconductor technology system, preferably a device (100) according to one of claims 1 to 11, or a system for holding the element (10) for a semiconductor technology system, preferably a system according to one of claims 12 or 13, - wherein at least one connection recess is provided on each inner wall of the at least one opening for the positive and / or force-fit connection of the device (100) or the system with the element (10) for a semiconductor technology system. [15] Method for transporting an element (10), preferably optical, for a semiconductor technology system, preferably an element according to claim 14, comprising: - Providing a device (100) according to one of claims 1 to 11 or a system according to one of claims 12 or 13; - Inserting the device (100) or system into at least one opening of the element (10) for a semiconductor technology system; - Lifting the element for (10) a semiconductor technology system using the device (100) or the system, wherein one or more retaining sections (122) of the retaining element (120) and / or the one or more connecting elements (200a, 200b, 200') engage in at least one connecting recess provided on a respective inner wall of the at least one opening of the element (10) for a semiconductor technology system.

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