ELECTRICAL CONNECTION UNIT

Abstract

An electrical interconnect comprises a circuit assembly body, a heat sink, and one or more heat transfer elements. The circuit assembly body includes a plurality of resistors and a circuit board facing the plurality of resistors. The heat sink is designed to overlap the circuit assembly body in one thickness direction of the circuit board and is made of a material with a higher thermal conductivity than that of the circuit board. The heat transfer element is positioned between the circuit assembly body and the heat sink, thermally connecting the circuit assembly body to the heat sink.One or more weight reduction sections, which are thinner than other sections of the heat dissipation plate or which penetrate the heat dissipation plate in the thickness direction, are formed in the heat dissipation plate at positions which, viewed from the thickness direction, overlap the plate and do not overlap at least part of the heat transfer element.

Description

BACKGROUND OF THE INVENTION Area of ​​the invention

[0001] Embodiments of the present invention relate to an electrical connection unit. Description of relevant technology

[0002] There is an electrical connection unit with a plurality of electronic components. [State of the art document]Patent document

[0003] Patent document 1: Japanese unexamined patent application, first publication no. 2024-037492 PRESENTATION OF THE INVENTION

[0004] Furthermore, the weight of an electrical connection unit should be reduced.

[0005] One embodiment provides an electrical connection unit whose weight can be reduced.

[0006] An electrical connection unit according to one embodiment comprises a circuit assembly body, a heat dissipation plate, and one or more heat transfer elements. The circuit assembly body includes a plurality of resistors and a circuit board facing the plurality of resistors. The heat dissipation plate is designed to overlap the circuit assembly body in one thickness direction of the circuit board and is made of a material whose thermal conductivity is higher than that of the circuit board. The heat transfer element is provided between the circuit assembly body and the heat dissipation plate and thermally connects the circuit assembly body to the heat dissipation plate.One or more weight reduction sections, which are thinner than other sections of the heat dissipation plate or which penetrate the heat dissipation plate in the thickness direction, are formed in the heat dissipation plate at positions which, viewed from the thickness direction, overlap the plate and do not overlap at least part of the heat transfer element.

[0007] According to one embodiment, an electrical connection unit can be provided whose weight can be reduced. BRIEF DESCRIPTION OF THE DRAWINGS Fig. Figure 1 is a cross-sectional view illustrating an electrical connection unit according to one embodiment. Fig. Figure 2 is a perspective view to describe a main body of the embodiment. Fig. Figure 3 is a perspective view to describe a subunit of the embodiment. Fig. Figure 4 is a partially separated perspective view of the subunit of the embodiment. Fig. Figure 5 is a perspective view to describe an electronic component and a connecting component according to the embodiment. Fig. Figure 6 is a perspective view to describe the electronic component and the connection component according to the embodiment. Fig. Figure 7 is a perspective view illustrating a routing board of the embodiment. Fig. Figure 8 is a partially separated perspective view of the laying board according to the embodiment. Fig. 9 is a cross-sectional view along the line F9-F9 in Fig. 4. Fig. Figure 10 is a top view illustrating the laying board according to the embodiment. Fig. Figure 11 is a partially separated perspective view of the electrical connection unit according to the embodiment. Fig. Figure 12 is a view from below, illustrating the installation board of the embodiment. Fig. 13 is a cross-sectional view along line F13-F13 of a Fig. 10 illustrated structures. DETAILED DESCRIPTION OF THE INVENTION

[0008] The following descriptions illustrate embodiments with reference to the drawings. In the following description, assemblies with the same or similar functions are named using the same reference numerals. Redundant descriptions of these assemblies can be omitted. Note that the specific assembly described below does not limit the scope of application of the embodiment.

[0009] In the present disclosure, the terms are defined as follows. The term "connection" is not limited to a mechanical connection and may also include an electrical connection. That is, the term "connection" is not limited to a case in which two elements that are connection targets are directly connected and may include a case in which two elements that are connection targets are connected by another, intervening element. "Capture" is not limited to the case in which the entire component is captured, but may also include the case in which only a part of the component is captured. The term "facing" indicates that the virtual projection images of two target objects overlap when viewed from a certain direction.This means that the term "facing" is not limited to the case where two target objects are directly facing each other, but can also include the case where two target objects are facing each other in a state in which another element is located between the two target objects. "Parallel," "orthogonal," or "equal" can each include "substantially parallel," "substantially orthogonal," or "substantially equal," respectively.

[0010] In the present disclosure, a +X direction, a -X direction, a +Y direction, a -Y direction, a +Z direction, and a -Z direction are defined as follows. The +X direction is a direction from a first end 80e1 to a second end 80e2 of a metal plate 80, which is described later (see Fig. 11) The -X direction is a direction opposite to the +X direction. When the +X and -X directions are not distinguished, the directions are referred to simply as the "X direction" in the following. The +Y direction and the -Y direction are directions that intersect the X direction (for example, orthogonal to it). The +Y direction is a direction from a third end 80e3 to a fourth end 80e4 of the metal plate 80, which is described later (see Fig. 11) The -Y direction is a direction opposite to the +Y direction. When the +Y and -Y directions are not distinguished, the directions are simply referred to as the "Y direction" in the following. The +Z direction and the -Z direction are directions that intersect the X and Y directions (for example, are orthogonal to them). The +Z direction is a direction from the metal plate 80, which is described later, to a principal body MU (see Fig. 1) The -Z direction is the opposite direction to the +Z direction. When the +Z and -Z directions are not distinguished, they are simply referred to as the "Z direction" in the following. The Z direction is an example of a "thickness direction".

[0011] If the X and Y directions are not distinguished, the directions can be referred to as the "horizontal direction" in the following. The Z direction can be referred to as the "vertical direction" in the following. The side with the +Z direction can be referred to as "top" and the side with the -Z direction as "bottom". However, these terms are descriptive and do not define a gravity direction of an electrical connection unit 1 (an installation position of the electrical connection unit 1). <1. Structure of the electrical connection unit 1>

[0012] Fig. Figure 1 is a cross-sectional view illustrating an electrical connection unit 1 of an embodiment.

[0013] The in Fig. The illustrated electrical connection unit 1 is, for example, an in-vehicle device attached to a vehicle such as an electric vehicle (EV), a hybrid electric vehicle (HEV), or a plug-in hybrid electric vehicle (PHEV). The electrical connection unit 1 may be referred to, for example, as an "electrical junction box" or "junction box." However, the electrical connection unit 1 is not limited to a box-shaped device.

[0014] The electrical connection unit 1 contains, for example, a main body MU, a metal plate 80, an insulating film 91 (see Fig. 11), a plurality of heat transfer elements 92 and an insulating cover 93. <2. Main body MU>

[0015] First, the main body MU is described.

[0016] Fig. Figure 2 is a perspective view to describe the main body MU.

[0017] The in Fig. The main body MU, as illustrated in Figure 2, is a section that performs a main function (for example, switching electrical connection states or overcurrent protection) of the electrical connection unit 1. The main body MU is, for example, divided into a plurality of subunits SU. The main body MU is formed, for example, by connecting a plurality of subunits SU. In the present embodiment, the main body MU contains three subunits SU (first to third subunits SUX, SUY, and SUZ). Each subunit SU can be referred to as a "circuit assembly body".

[0018] The first subunit SUX has a primary electrical function. For example, the first subunit SUX contains a plurality of electronic components 10X and a first distribution board 40X. The majority of the electronic components 10X are electrically connected to the first distribution board 40X.

[0019] The second subunit SUY has a second electrical function. This second function is different from the first. For example, the second subunit SUY contains a plurality of electronic components 10Y and a second distribution board 40Y. The majority of the electronic components 10Y are electrically connected to the second distribution board 40Y.

[0020] The third subunit SUZ has a third electrical function. This third function differs from the first and second functions. For example, the third subunit SUZ contains a plurality of electronic components 10Z and a third routing board 40Z. The majority of the electronic components 10Z are electrically connected to the third routing board 40Z.

[0021] In the present embodiment, the three subunits SUX, SUY, and SUZ are arranged such that they lie in the X direction. For example, the first subunit SUX is arranged on the side in the +X direction relative to the second subunit SUY. The first subunit SUX and the second subunit SUY are electrically connected via a coupling busbar 75, which extends between the first routing board 40X and the second routing board 40Y. The third subunit SUZ, on the other hand, is arranged on the side in the -X direction relative to the second subunit SUY. The third subunit SUZ and the second subunit SUY are electrically connected via the coupling busbar 75, which extends between the third routing board 40Z and the second routing board 40Y. The coupling busbar 75 is arranged on the side opposite the metal plate 80 with respect to the majority of the subunits SU.

[0022] In the present embodiment, the three routing boards 40X, 40Y, and 40Z, contained in the three subunits SUX, SUY, and SUZ, are arranged in the same plane. In other words, the three routing boards 40X, 40Y, and 40Z are arranged at the same height in the Z-direction. A single large routing board 40M is formed from the three routing boards 40X, 40Y, and 40Z.

[0023] In the present embodiment, the three subunits SUX, SUY, and SUZ have the same or a similar basic structure. Therefore, one subunit, SU, will be described in detail below as a representative example. If the first subunit SUX, the second subunit SUY, and the third subunit SUZ are not distinguished, the subunits will simply be referred to as "subunit SU." If the electronic component 10X, the electronic component 10Y, and the electronic component 10Z are not distinguished, the electronic components will simply be referred to as "electronic component 10." If the first routing board 40X, the second routing board 40Y, and the third routing board 40Z are not distinguished, the routing boards will simply be referred to as "routing board 40." Routing boards 40, 40X, 40Y, 40Z, and 40M are examples of "boards." <3. Structure of the subunit SU>

[0024] Next, the structure of the subunit SU will be described.

[0025] Fig. Figure 3 is a perspective view to describe subunit SU. Fig. Figure 4 is a partially unfolded perspective view of subunit SU.

[0026] As in Fig. 3 and Fig. As illustrated in Figure 4, the subunit SU contains, for example, a plurality of electronic components 10, a plurality of connection components 20 for connecting components, a plurality of connection components 30 for external connection, a routing board 40, a plurality of fastening elements 71, 72 and 73 and a connection component 100 for connecting units (see Figure 4). Fig. 2). <3.1 Electronic component 10 and connection component 20 for connecting components>

[0027] First, the electronic component 10 and the connection component 20 are described.

[0028] Electronic component 10 is an electronic component attached according to a function required for subunit SU. Electronic component 10 could be, for example, a terminal, a fuse, a relay (for example, a mechanical relay or a solid-state relay), a capacitor, a branching component, any of several different sensors (for example, a current sensor or a voltage sensor), an electronic control unit, or an electronic component assembly in which two or more of these components are combined. Note that the type of electronic component 10 is not limited to the above example. Electronic component 10 could, for example, be a heat-generating component that produces heat when energy is supplied.The following describes an electronic component of the first kind 10M and an electronic component of the second kind 10N as examples of the electronic component 10. The electronic component 10 is an example of a "resistor".

[0029] The connecting component 20 is a component that electrically connects the electronic component 10 to the routing board 40. The connecting component 20 forms part of a power supply path in the subunit SU. The connecting component 20 is made of a metal (for example, copper or a copper alloy). A first-type connecting component 20M and a second-type connecting component 20N are described below as examples of the connecting component 20. The connecting component 20 is an example of a resistor. <3.1.1 Electronic component of the first type 10M>

[0030] Fig. Figure 5 is a perspective view illustrating the electronic component of the first kind 10M and the connection component of the first kind 20M.

[0031] As in Fig. Figure 5 shows that the first-type electronic component 10M is an electronic component 10 in which a plurality of terminals 13 are arranged at one end of the electronic component 10M. The electronic component 10M includes, for example, a housing 11, a component body 12, a plurality of terminals 13, and a plurality of mounting sections 14. (Case 11)

[0032] The housing 11 is an outer element that forms most of the outer shape of the electronic component 10M. The housing 11 is made of, for example, synthetic resin and has insulating properties. The housing 11 contains the component body 12. The housing 11 and the component body 12 can be formed from a single piece.

[0033] In the present embodiment, the housing 11 has an insulating rib 11a that projects horizontally (for example, in the X-direction) and extends in the Z-direction. The insulating rib 11a has, for example, a plate-like shape formed horizontally (for example, in the X-direction) and in the Z-direction. The insulating rib 11a extends, for example, over the entire length of the housing 11 in the Z-direction. The insulating rib 11a is arranged between the plurality of terminals 13. The insulating rib 11a electrically isolates the adjacent terminals 13 from one another. In the present embodiment, a portion of the insulating rib 11a is arranged between two connection components 20M that are connected to the electronic component 10M. The insulating rib 11a electrically isolates the two connection components 20M connected to the electronic component 10M from one another. (Component body 12)

[0034] The component body 12 is a section that performs a main function of the electronic component 10M. For example, if the electronic component 10M is a relay, the component body 12 contains a switch (for example, a contact) that toggles between a conductive and a non-conductive state. For example, if the electronic component 10M is a fuse, the component body 12 contains a melting section that blows when an overcurrent flows. For example, if the electronic component 10M is a capacitor, the component body 12 contains a section that stores electrical charge. (Connection 13)

[0035] The terminal 13 is an electrical connection section that is exposed to the outside of the housing 11. The terminal 13 is electrically connected to the component body 12 inside the housing 11. In the present embodiment, a plurality of terminals 13 are provided. One of the plurality of terminals 13 is a positive electrode-side terminal 13. The other terminal of the plurality of terminals 13 is the negative electrode-side terminal 13.

[0036] The majority of terminals 13 are provided at one end of the electronic component 10M in the horizontal direction (e.g., the X-direction). The terminals 13 are arranged so that they lie in the horizontal direction (e.g., the Y-direction). Each terminal 13 has a mounting hole 13h to which a fastening element 71 (e.g., a screw or a bolt) is attached. The mounting hole 13h is open in the horizontal direction (e.g., in the X-direction). An inner circumferential surface of the mounting hole 13h of the electronic component 10M has a groove for the screw. (Fortification section 14)

[0037] Mounting section 14 is a section for fixing the electronic component 10M. Mounting section 14 has a mounting hole 14h to which a fastening element 112 (for example, a screw or a bolt; see Fig. 11) is fastened. The fastening hole 14h penetrates the fastening section 14 in the Z-direction. The fastening hole 14h is an insertion hole through which the fastening element 112 passes. A fixing target of the fastening section 14 is described later. <3.1.2 Type I connection component 20M>

[0038] The connecting component of the first type 20M is a component that electrically connects the electronic component of the first type 10M to the distribution board 40. In the present embodiment, the connecting component 20M electrically connects the electronic component 10M to the busbar 42 (see Fig. 8), which is included in the routing board 40. The connection component 20M, for example, contains a first section 21 and a second section 22. (First Section 21)

[0039] The first section 21 of the connecting component 20M is a section connected to terminal 13 of the electronic component 10M. The first section 21 is a plate-shaped or prismatic section extending in the Z-direction. The first section 21 extends in the Z-direction along one end (for example, an end in the X-direction) of the electronic component 10M. The first section 21 is a vertical section oriented in the Z-direction with respect to the routing board 40 (for example, with respect to a busbar 42, which will be described later). The first section 21 borders the electronic component 10M in the horizontal direction (for example, in the X-direction).For example, the first section 21 borders the terminal 13 of the electronic component 10M in a horizontal direction (for example, in the X direction) and is connected to the terminal 13 of the electronic component 10M from a horizontal direction (for example, in the X direction).

[0040] The first section 21 of the connecting component 20M has a first mounting hole 21h through which the fastening element 71 (for example, a screw or a bolt) passes. The first mounting hole 21h is open in the horizontal direction (for example, in the X direction). The fastening element 71, passing through the first mounting hole 21h, is connected to the electronic component 10M via the mounting hole 13h of terminal 13, so that the first section 21 is physically and electrically connected to terminal 13 of the electronic component 10M. (Second Section 22)

[0041] The second section 22 of the connection component 20M is a section that is connected to the busbar 42 (see Fig. 8) The second section 22 projects horizontally (for example, in the X direction) from the end of the first section 21 on the -Z direction side. The second section 22 is a plate section provided in the horizontal direction. The second section 22 borders the busbar 42 in the Z direction and is connected to the busbar 42 in the Z direction. The second section 22 of the connecting component 20M is attached in the Z direction to the fastening element 43 (for example, a screw or a bolt; see Fig. 8) is attached, projecting from the busbar 42 in the +Z direction, and is physically and electrically connected to the busbar 42. In the present embodiment, the second section 22 of the connecting component 20M has a second mounting hole 22h through which the fastening element 43 passes. The second mounting hole 22h is open in the Z direction. In the second section 22, the fastening element 43 passes through the second mounting hole 22h. When the coupling element 44 (for example, a nut, as in Fig. (as shown in Figure 3) is coupled to the tip of the fastening element 43 passing through the second fastening hole 22h, the second section 22 is fixed to the busbar 42. In the present embodiment, the first section 21 and the second section 22 form an L-shaped connecting component 20M. <3.1.3 Electronic component of the second kind 10N>

[0042] Fig. Figure 6 is a perspective view illustrating the second type electronic component 10N and the second type connecting component 20N.

[0043] As in Fig. As shown in Figure 6, the second type of electronic component 10N is an electronic component in which two terminals 13 are arranged separately at both ends of the electronic component 10N in a horizontal direction. The electronic component 10N includes, for example, a housing 11, a component body 12, and a plurality of terminals 13. Note that among the configurations of the electronic component 10N, those configurations that have similar functions to the electronic component 10M are named with the same reference numerals. In this case, in the description of the electronic component 10N, the “electronic component 10M” can be replaced by the “electronic component 10N” in the description of the electronic component 10M described above.

[0044] In electronic component 10N, the terminals 13 are arranged separately at both ends of the electronic component 10N in a horizontal direction (for example, in the X-direction). Each terminal 13 has a mounting hole 13h to which a fastening element 72 (for example, a screw or a bolt) is attached. The mounting hole 13h penetrates each terminal 13 in the Z-direction. For example, the mounting hole 13h of electronic component 10N is an insertion hole through which the fastening element 72 passes. <3.1.4 Second type connecting component 20N>

[0045] The connecting component of the second type 20N is a component that electrically connects the electronic component of the second type 10N and the routing board 40. In the present embodiment, the connecting component 20N electrically connects the electronic component 10N to the busbar 42 (see Fig. 8), which is included in the routing board 40. The connection component 20N, for example, contains a first section 21, a second section 22, and a third section 23. (First Section 21)

[0046] The first section 21 of the connecting component 20N is a section connected to terminal 13 of the electronic component 10N. The first section 21 is a prismatic section extending in the Z-direction. The first section 21 is a vertical section oriented in the Z-direction relative to the routing board 40 (for example, relative to the busbar 42). The first section 21 borders terminal 13 of the electronic component 10N in the Z-direction and is connected to terminal 13 of the electronic component 10N in the Z-direction. The first section 21 of the connecting component 20N has a first mounting hole 21h into which the fastening element 72 engages. The first mounting hole 21h is open on the +Z-direction side of the first section 21. An inner circumferential surface of the first mounting hole 21h of the connecting component 20N has a groove for the screw.The fastening element 72, which passes through the mounting hole 13h of the electronic component 10N, is connected to the first section 21 via the mounting hole 21h of the first section 21, so that the first section 21 is physically and electrically connected to the terminal 13 of the electronic component 10N. (Second Section 22)

[0047] The second section 22 of the connecting component 20N is a section that is connected to the busbar 42 (see Fig. 8) The second section 22 projects horizontally (for example, in the X direction) from the end of the first section 21 on the -Z direction side. The second section 22 is a plate section provided in the horizontal direction. The second section 22 borders the busbar 42 in the Z direction and is connected to the busbar 42 in the Z direction. The second section 22 of the connecting component 20N is attached in the Z direction to the fastening element 43 (for example, a screw or a bolt; see Fig. 8) is attached, projecting from the busbar 42 in the +Z direction, and is physically and electrically connected to the busbar 42. In the present embodiment, the second section 22 of the connecting component 20N has a second mounting hole 22h through which the fastening element 43 passes. The second mounting hole 22h penetrates the second section 22 in the Z direction. In the second section 22, the fastening element 43 passes through the second mounting hole 22h. A coupling element 44 (for example, a nut; see Fig. 3) is coupled to the tip of the fastening element 43, which passes through the second fastening hole 22h, thereby fixing the second section 22 to the busbar 42. (Third Section 23)

[0048] The third section 23 is a standing wall (side wall) extending horizontally in the +Z direction from both ends of the second section 22. The third section 23 is a wall provided in the Z direction. The third section 23 is connected to the first section 21 and also to the second section 22. For example, the third section 23 extends diagonally, increasing in the X direction as it extends in the -Z direction. The third section 23 can be provided in the connection component 20M. The connection component 20N, however, does not need to include the third section 23. <3.2 Connection component 30 for external connection>

[0049] Next, the connection component 30 for the external connection will be described.

[0050] As in Fig. 3 and Fig. As shown in Figure 4, the connecting component 30 is a component that electrically connects the external connecting busbar 76 to the routing board 40. In the present embodiment, the connecting component 30 electrically connects the external connecting busbar 76 to the busbar 42 contained in the routing board 40. The external connecting busbar 76 is electrically connected to an external device. In the present disclosure, the "external device" is an electrical device that exists outside of the electrical connecting unit 1. The external device is, for example, a battery unit attached to a vehicle or an inverter for driving a vehicle's engine. However, the external device is not limited to a battery unit or an inverter. The busbar 42 is an example of a "resistor".

[0051] Similar to connecting component 20, connecting component 30 also consists of a metal (e.g., copper or a copper alloy). As in Fig. As shown in Figure 2, the connecting component 30 is provided in a state where it is positioned on the side in the +Z direction at the outer circumferential section (the end on the side in the X direction) of the routing board 40M. A first end (one end on the side in the -Z direction) of the connecting component 30 is connected to the busbar 42 via a fastening element 43 (e.g., a bolt). A second end (one end on the side in the +Z direction) of the connecting component 30 is connected to the external connecting busbar 76 via a fastening element 73 (e.g., a screw or a bolt). <3.3 Connection component 100 for connecting units>

[0052] Next, the connection component 100 for connecting units will be described.

[0053] As in Fig. As shown in Figure 2, the connecting component 100 electrically connects the adjacent subunits SU to each other. In the present embodiment, the connecting component 100 connects the busbar 42 contained in one subunit SU (e.g., the second subunit SUY) to the busbar 42 contained in the other subunit SU (e.g., the third subunit SUZ) beneath the adjacent subunits SU. <3.4 Installation board 40>

[0054] First, the routing board 40 is described.

[0055] Fig. Figure 7 is a perspective view illustrating the laying board 40.

[0056] As in Fig. As illustrated in Figure 7, the busbar 40 is a component that forms at least part of a power supply path between the plurality of electronic components 10 and / or at least part of a power supply path between the electronic component 10 and an external device. In the present disclosure, the “busbar” denotes a board-like routing structure. The term “board-like” denotes a plate-like shape along a plane when viewed as a whole, regardless of any fine detail. In the present disclosure, the term “plate-like,” “sheet-like,” or “flat” shape is not limited to the case that it is completely flat and may include a case in which a fixing structure, a rib, or the like, projecting in the Z-direction, is partially present, a case in which a non-uniform shape following the thickness of the busbar is present on the surface, and the like.In the present embodiment, the laying plate 40 has a plate-shaped form in the X and Y directions.

[0057] The distribution board 40 includes, for example, a base plate 41, one or more (for example, a plurality of) busbars 42, and a plurality of fastening elements 43. In the present embodiment, the base plate 41 and the plurality of busbars 42 are integrated by insert forming. For example, the distribution board 40 is formed as a single element by insert forming the busbar 42 with the base plate 41 after the fastening element 43 has been fixed to the busbar 42. That is, the busbar 42 is integrated with the base plate 41 without the use of a fastening element such as a screw or bolt. Note that the distribution board 40 can also be formed by a different structure instead of insert forming.

[0058] Fig. Figure 8 is a partially separated perspective view of the routing board 40. For the sake of simplicity, the base plate 41, the busbars 42 and the fastening elements 43 are described below with reference to the drawings in which the routing board 40 is partially separated. (Base plate 41)

[0059] As in Fig. As shown in Figure 8, the base plate 41 is a retaining element that holds the majority of busbars 42 arranged horizontally at intervals in one piece. The base plate 41 is made, for example, of synthetic resin and has insulating properties. The base plate 41 is, for example, rectangular in shape, with the X-direction being a longitudinal direction and the Y-direction a transverse direction. The base plate 41 electrically insulates the majority of the busbars 42 from each other. The base plate 41 includes, for example, a flat surface section 51 and a majority of fixing sections 52.

[0060] The flat surface section 51 is a section formed in the base plate 41 in the form of a plate. The flat surface section 51 forms a main section of the base plate 41. The flat surface section 51 extends in a horizontal direction. In the present embodiment, the flat surface section 51 extends over the entire width in the X direction of the base plate 41 and over the entire width in the Y direction of the base plate 41, with the exception of the four corner sections of the base plate 41.

[0061] The flat surface section 51 has a first surface 51a and a second surface 51b. The first surface 51a is a surface oriented laterally in the +Z direction. The first surface 51a is a flat surface provided in the horizontal direction. The first surface 51a faces the majority of electronic components 10 and is adjacent to the insulating cover 93 (see Fig. 1) facing the electrical connection unit 1. The second surface 51b is located on the side opposite the first surface 51a. The second surface 51b is a surface oriented laterally in the -Z direction. The second surface 51b is a flat surface provided in a horizontal direction. The second surface 51b faces the metal plate 80 (see Fig. 1) One thickness direction (plate thickness direction) of the flat surface section 51 is the Z-direction.

[0062] In the flat surface section 51, for example, one or more (e.g., a plurality of) receiving sections 55 are formed in which the busbars 42 are received. The plurality of receiving sections 55 are spaced apart from one another in the X or Y direction. Each receiving section 55 is, for example, a through-hole that penetrates the flat surface section 51 in the Z direction. That is, each receiving section 55 is open in the Z direction on both the first surface 51a and the second surface 51b. Note that the receiving section 55 can be a recess provided on the first surface 51a or the second surface 51b of the flat surface section 51 and is recessed in the Z direction, instead of a through-hole.In the present disclosure, the phrase “the receiving section penetrates the flat surface section in the first direction (Z-direction)” may include a case in which part of the total length of the receiving section 55 penetrates the flat surface section 51 in the Z-direction (for example, the remaining part of the receiving section 55 may be a recess in the Z-direction or be provided within the base plate 41 and not be exposed to the outside of the base plate 41).Similarly, in the present disclosure, the phrase “the receiving section is recessed in the first direction (Z direction)” may include a case in which part of the total length of the receiving section 55 is recessed in the Z direction (for example, a remaining part of the receiving section 55 may be a through hole penetrating the flat surface section 51 in the Z direction, or it may be provided within the base plate 41 and is not exposed to the outside of the base plate 41).

[0063] As in Fig. As shown in Figure 8, each receiving section 55 is formed in an outer shape which, viewed from the Z-direction, corresponds to the shape of the received busbar 42. In the present embodiment, the flat surface section 51, for example, contains five receiving sections 55A, 55B, 55C, 55D and 55E as the majority of the receiving sections 55.

[0064] In the flat surface section 51, a through-hole 51h is formed at a position displaced in the X-direction or in the Y-direction relative to the receiving section 55. As shown in Fig. As shown in Figure 4, the through-hole 51h is, for example, formed in a position that, viewed from the Z-direction, overlaps the mounting section 14 of the electronic component 10. The mounting section 14 is a section for attaching the electronic component 10 to the metal plate 80. The mounting section 14 projects in the X or Y direction from a -Z-side end of the housing of the electronic component 10.

[0065] Fig. 9 is a cross-sectional view along the line F9-F9 in Fig. 4.

[0066] As in Fig. 4 and Fig. As shown in Figure 9, the fixing section 52 is a section for fixing the metal plate 80 and the base plate 41. The fixing section 52 is provided at a corner section of the base plate 41. The fixing section 52 includes, for example, a vertical plate section 52a and a horizontal plate section 52b.

[0067] The vertical plate section 52a projects laterally in the +Z direction from the end of the flat surface section 51 of the base plate 41. Viewed from the Z direction, the vertical plate section 52a is, for example, L-shaped. That is, the vertical plate section 52a extends in the Z direction in a state where part of it is open in the horizontal direction.

[0068] The horizontal plate section 52b extends horizontally from the end of the standing plate section 52a laterally in the +Z direction. The horizontal plate section 52b is a plate section provided horizontally. The horizontal plate section 52b extends in an eaves-like shape to cover an area enclosed by the standing plate section 52a laterally in the +Z direction. (Busbar 42)

[0069] As in Fig. 5 and Fig. As shown in Figure 6, the busbar 42 is a routing element (electrical connection element) contained in the routing board 40. The busbar 42 is, for example, a routing element for electrically connecting a plurality of electronic components 10 to one another. The busbar 42 can be a routing element for connecting an electronic component 10 to an external device. The busbar 42 is made of a metal (for example, copper or a copper alloy) and is conductive. In the present embodiment, the routing board 40 contains, for example, five busbars 42A, 42B, 42C, 42D, 42E as a plurality of busbars 42. The five busbars 42A, 42B, 42C, 42D, and 42E are arranged such that they are positioned at intervals in the horizontal direction. The five busbars 42A, 42B, 42C, 42D and 42E are held by the flat surface section 51 of the base plate 41.

[0070] At least a portion of each busbar 42 has a plate-like shape formed in the horizontal direction. At least a portion of each busbar 42 extends along the flat surface section 51 in a state in which it is received in the receiving section 55. At least a portion of each busbar 42 extends along the first surface 51a of the flat surface section 51. At least a portion of each busbar 42 extends horizontally in the receiving section 55. In the present embodiment, each busbar 42 has a plate-like shape formed horizontally over the entire busbar 42. Each of the busbars 42 extends along the flat surface section 51 in a state in which it is received in the receiving section 55 over the entire length of the busbar 42.In the following, in each busbar 42, a section housed in the receiving section 55 (a section extending along the flat surface section 51) can be referred to as "plate section 42p".

[0071] Fig. Figure 10 is a top view to illustrate the installation board 40.

[0072] As in Fig. As shown in Figure 10, the plate section 42p of each busbar 42 has, for example, a first connecting section 61, a second connecting section 62 and an extending section 63.

[0073] The first connection section 61 is a section that is in contact with a connection component 20 (hereinafter referred to as "first connection component 20") among the plurality of connection components 20. The first connection component 20 is a connection component that connects an electronic component 10 (hereinafter referred to as "first electronic component 10") among the plurality of electronic components 10 to the busbar 42. The first connection section 61 is a section of the busbar 42 that overlaps the first connection component 20 when viewed from the Z-direction. The first connection section 61 is adjacent to the first connection component 20 in the Z-direction. The first connection section 61 is connected to the first connection component 20 in the Z-direction.

[0074] The second connection section 62 is a section that is in contact with the connection component 20 (hereinafter referred to as "second connection component 20"), which is distinct from the first connection component 20 among the plural of connection components 20. The second connection component 20 is a connection component that connects the electronic component 10 (hereinafter referred to as "second electronic component 10"), which is distinct from the first electronic component 10 among the plural of electronic components 10, to the busbar 42. The second connection section 62 is a section of the busbar 42 that overlaps the second connection component 20 when viewed from the Z-direction. The second connection section 62 is adjacent to the second connection component 20 in the Z-direction. The second connection section 62 is connected to the second connection component 20 in the Z-direction.

[0075] The second connecting section 62 can be a section that is in contact with the connecting component 30. The connecting component 30 is a connecting component for connecting an external device to the busbar 42. In this case, the second connecting section 62 is a section of the busbar 42 that overlaps the connecting component 30 when viewed from the Z-direction. The second connecting section 62 is adjacent to the connecting component 30 in the Z-direction. The second connecting section 62 is connected to the connecting component 30 in the Z-direction.

[0076] The second connection section 62 can be a section that is in contact with the coupling busbar 75 in order to be connected to a different subunit SU instead of the connection components 20 and 30. In this case, the second connection section 62 is a section of the busbar 42 that overlaps the coupling busbar 75 when viewed from the Z-direction. The second connection section 62 is adjacent to the coupling busbar 75 in the Z-direction. The second connection section 62 is connected to the coupling busbar 75 in the Z-direction.

[0077] The extending section 63 extends from the first connecting section 61 in the X-direction or in the Y-direction. The extending section 63 is provided between the first connecting section 61 and the second connecting section 62. The extending section 63 extends over the first connecting section 61 and the second connecting section 62. The extending section 63 connects the first connecting section 61 with the second connecting section 62.

[0078] In the present embodiment, the first connecting section 61, the second connecting section 62, and the extending section 63 have a plate-like shape in the horizontal direction. In the present embodiment, each busbar 42 extends along the flat surface section 51 in a state in which it is received in the receiving section 55 at least over the first connecting section 61 and the second connecting section 62. For example, the first connecting section 61, the second connecting section 62, and the extending section 63 extend along the flat surface section 51 in a state in which they are received in the receiving section 55. A portion of each busbar 42 received in the receiving section 55 is exposed on the first surface 51a and the second surface 51b of the flat surface section 51.This means that the Z-direction-oriented surface of each busbar 42 is exposed through the opening of the receiving section 55 to the outside of the base plate 41 (e.g., in the +Z direction and the -Z direction). However, a portion of the busbar 42 may be recessed into the base plate 41.

[0079] In the present embodiment, the extending sections 63 of some busbars 42 are received in the receiving section 55 such that they extend over both sides of a region R, specifically through the region R that overlaps the electronic component 10 as viewed from the Z direction. For example, the extending section 63 extends linearly in the X direction. The extending section 63 extends over a region R that overlaps the electronic component 10 as viewed from the Z direction, over both the +X-direction and -X-direction sides of region R.

[0080] The one or more busbars 42 may, in addition to the first connecting section 61, the second connecting section 62, and the extending section 63, have an extension 64. The extension 64 is a section in which the busbar 42 extends to increase a heat dissipation area and / or to increase heat storage capacity (heat absorption). The extension 64 is a section that is not used for electrical connection. For example, the extension 64 is located on the side opposite the extending section 63 with respect to the first connecting section 61 (or the second connecting section 62). The extension 64 has a plate-like shape formed in the horizontal direction. The extension 64 extends along the flat surface section 51 in a state in which it is received in the receiving section 55.Extension 64 is recorded in recording section 55 such that it extends to region R, which overlaps the electronic component 10 when viewed from the Z direction. Extension 64 has an end 42e1 of busbar 42 at a position that overlaps region R when viewed from the Z direction.

[0081] Some installation examples for the busbar 42 are described below. The majority of electronic components 10 contain three electronic components 10A, 10B, and 10C. The majority of connection components 20 contain six connection components 20A, 20B, 20C, 20D, 20E, and 20F. The majority of connection components 30 contain two connection components 30A and 30B. (First installation example)

[0082] First, an installation example (or routing example) for busbar 42A is described.

[0083] The busbar 42A has a first connection section 61, a second connection section 62, and an extending section 63. Viewed from the Z-direction, the first connection section 61 is located in the +X direction with respect to the electronic component 10A. The first connection section 61 is electrically connected to terminal 13 (for example, a positive electrode terminal; see [reference]) via the connection component 20A. Fig. 5) connected to the electronic component 10A. The second connection section 62 is located in the -X direction relative to the electronic component 10A when viewed from the Z direction. The second connection section 62 is electrically connected to another subunit SU via the coupling busbar 75.

[0084] The extending section 63 is captured in the receiving section 55 such that, viewed from the Z-direction, it extends over both sides of region R through region R, which overlaps the electronic component 10A. For example, the extending section 63 extends linearly in the X-direction. The extending section 63 extends over region R, which overlaps the electronic component 10A viewed from the Z-direction, over the side in the +X-direction and the side in the -X-direction of region R. The busbar 42A, for example, is a busbar contained in the positive electrode line PL in the electrical connection unit 1. (Second installation example)

[0085] Next, an installation example for busbar 42B is described.

[0086] The busbar 42B has a first connection section 61, a second connection section 62, an extending section 63, and an extension 64. The first connection section 61 is electrically connected to terminal 13 (for example, a negative electrode terminal; see connection component 20B, which differs from the first connection component 20) via the connection component 20B. Fig. 5) of the electronic component 10A. The second connection section 62 is electrically connected to the external connection busbar 76 via the connection component 30A. The extension 64 extends to region R, which overlaps the electronic component 10A when viewed from the Z direction. The extension 64 has an end 42e1 of the busbar 42 at a position that overlaps region R when viewed from the Z direction. It should be noted that the extending section 63 of the busbar 42B can extend over both sides of region R through region R, which overlaps the electronic component 10A when viewed from the Z direction, similar to the extending section 63 of the busbar 42A. Busbar 42B is, for example, a busbar contained in the positive electrode line PL in the electrical connection unit 1. (Third laying example)

[0087] Next, an installation example for the busbar 42C is described.

[0088] The busbar 42C has a first connection section 61, a second connection section 62, an extending section 63, and an extension 64. The first connection section 61 is electrically connected to terminal 13 (for example, a negative electrode terminal; see connection component 20C). Fig. 5) of the electronic component 10B. The second connection section 62 is electrically connected to another subunit SU via the coupling busbar 75. The extension 64 extends to a region R that overlaps the electronic component 10B when viewed from the Z direction. In the extension 64, the busbar 42C is connected to the end 42e1 of the busbar 42 at a position that overlaps the region R when viewed from the Z direction, for example, a busbar that is contained in a negative electrode line NL of the electrical connection unit 1. (Fourth laying example)

[0089] Next, an installation example for the busbar 42D is described.

[0090] The busbar 42D has a first connection section 61, a second connection section 62, and an extending section 63. The first connection section 61 is electrically connected to terminal 13 (for example, a positive electrode terminal; see [reference]) via the connection component 20D. Fig. 5) the electronic component 10B. The second connection section 62 is electrically connected via the connection component 20E to terminal 13 (for example, a negative electrode terminal; see Fig. 6) connected to the electronic component 10C. The busbar 42D, for example, is a busbar contained in the negative electrode line NL in the electrical connection unit 1. (Fifth laying example)

[0091] Next, an installation example for busbar 42E is described.

[0092] The busbar 42E has a first connection section 61, a second connection section 62, and an extending section 63. The first connection section 61 is electrically connected to terminal 13 (for example, a negative electrode terminal; see [reference]) via the connection component 20F. Fig. 6) of the electronic component 10C. The second connection section 62 is electrically connected to the external connection busbar 76 via the connection component 30B. The busbar 42E is, for example, a busbar contained in the negative electrode line NL in the electrical connection unit 1. In the present embodiment, the electronic component 10C (second-type electronic component 10N) bridges the connection components 20D and 20F (second-type connection component 20N). As in Fig. 6 and Fig. As shown in Figure 10, the electronic component 10C is supported by the connecting components 20D and 20F in a state in which the housing 11 is separated from the routing board 40 in the Z direction by both terminals 13, which are supported by the first section 21 from the side in the +Z direction. (Fastening element 43)

[0093] Next, with further reference to Fig. 8 describes the fastening element 43.

[0094] The fastening element 43 is a component for fixing the busbar 42 and a connection target component (the connection component 20, the connection component 30, or the coupling busbar 75) of the busbar 42. The fastening element 43 is, for example, a crimping bolt fixed to the busbar 42. The fastening element 43 penetrates the busbar 42 in the Z-direction. The fastening element 43 is electrically and physically connected to the busbar 42 in a state in which it protrudes laterally from the busbar 42 in the +Z-direction. It should be noted that the fastening element 43 is not limited to fixing by crimping, but can also be fixed to the busbar 42 by welding or other methods.

[0095] The connecting component 20 is fixed to the fastening element 43, whereas it was previously fixed to the electronic component 10 via the fastening element 71 or the fastening element 72. For example, the fastening element 43 penetrates the second section 22 (see Fig. 5 and Fig. 6) the connecting component 20. As in Fig. As shown in Figure 3, a coupling element 44 (for example, a nut) is attached to a section of the fastening element 43 that projects laterally in the +Z direction from the connecting component 20. This fastening secures the connecting component 20 to the routing board 40. In the present disclosure, the phrase "an electronic component is attached to a board" is not limited to a case where the electronic component is directly connected to the board, but also includes a case where the electronic component is connected to the board via another component (e.g., the connecting component 20).In the present disclosure, the phrase “an electronic component is attached to a circuit board” means that at least the electronic component is electrically connected to the circuit board and includes a case in which the electronic component is fixed to an element different from the circuit board (e.g. the metal plate 80) instead of / in addition to the circuit board. <4. Connection structure>

[0096] Next, a connection structure of the subunit SU will be described.

[0097] As in Fig. As shown in Figure 2, the first subunit SUX, the second subunit SUY, and the third subunit SUZ are arranged in that order from the side in the +X direction to the side in the -X direction. The first subunit SUX and the second subunit SUY are electrically connected via a 75A busbar. The second subunit SUY and the third subunit SUZ are electrically and physically connected via a 75B busbar.

[0098] The adjacent subunits SU are arranged in a state in which their ends facing each other in the X-direction overlap in the Z-direction. Specifically, the fixing section 52 (horizontal plate section 52b) located on the side in the +X direction in the second subunit SUY overlaps the fixing section 52 (horizontal plate section 52b) located on the side in the -X direction in the first subunit SUX from the side in the +Z direction. The fixing section 52 (horizontal plate section 52b) located on the side in the -X direction in the second subunit SUY overlaps the fixing section 52 (horizontal plate section 52b) located on the side in the +X direction in the third subunit SUX from the side in the +Z direction. <5. Metal plate 80, insulating film 91, heat transfer element 92 and insulating cover 93>

[0099] Next, the metal plate 80, the insulating film 91, the heat transfer element 92 and the insulating cover 93 are described. <5.1 Metal plate 80>

[0100] Fig. Figure 11 is a partially unfolded perspective view of electrical connection unit 1.

[0101] As in Fig. As shown in Figure 11, the metal plate 80 is an element for ensuring the rigidity of the electrical connection unit 1 and for improving the heat dissipation properties of the electrical connection unit 1. The metal plate 80 is made of a metal (for example, aluminum or an aluminum alloy). The metal plate 80 is an example of a "heat dissipation plate." The heat dissipation plate is not limited to one metal, and various materials can be used as long as the heat dissipation plate is made of a material that has a better thermal conductivity than, for example, the base plate 41.

[0102] The metal plate 80 has a rectangular shape formed in the X direction, viewed from the Z direction. The metal plate 80 has a first end 80e1, a second end 80e2, a third end 80e3, and a fourth end 80e4. The first end 80e1 and the second end 80e2 are a pair of ends of the metal plate 80 in the longitudinal direction and are separated in the X direction. The third end 80e3 and the fourth end 80e4 are a pair of ends of the metal plate 80 in the lateral direction, separated from each other in the Y direction. In the present embodiment, the metal plate 80 is large enough to cover all three subunits SU (main body MU) from below. In particular, the length of the metal plate 80 in the X direction is greater than the length of the main body MU in the X direction. The length of the metal plate 80 in the Y direction is greater than the length of the main body MU in the Y direction.Therefore, the area of ​​the metal plate 80, viewed from the Z-direction, is larger than the area of ​​the main body MU.

[0103] The metal plate 80 contains, for example, a flat surface section 81, a plurality of fixing sections 82, a plurality of fixing sections 83 and a circumferential wall section 84.

[0104] The flat surface section 81 is a section formed in the metal plate 80 in a plate-like shape. The flat surface section 81 has a plate-like shape formed in the horizontal direction. The flat surface section 81 forms a main section of the metal plate 80. The flat surface section 81 forms a base section (metal base section) of the metal plate 80. In the present embodiment, the flat surface section 81 has a size that covers all three subunits SU (main body MU) from below. The flat surface section 81 faces the laying plates 40 of the three subunits SU. In the present embodiment, the metal plate 80 of the second surface 51b of each subunit SU has a gap S1 (see Fig. 9) between the metal plate 80 and the flat surface section 51 (second surface 51b) facing each subunit SU. It should be noted that a mounting flange or the like, attached to an external device, may be provided in an outer circumferential section of the flat surface section 81 (at a position that does not overlap the routing plate 40 when viewed from the Z direction).

[0105] As in Fig. 9 and Fig. As shown in Figure 11, the fixing section 82 is a section for fixing the base plate 41 of each subunit SU to the metal plate 80. The fixing section 82 is provided in a position corresponding to the fixing section 52 of each subunit SU when viewed from the Z-direction. The fixing section 82 is a cylindrical or prismatic projection that extends in the +Z direction from the flat surface section 81 of the metal plate 80.

[0106] The fixing section 83 is a section for directly fixing the electronic component 10 of each subunit SU to the metal plate 80 without using the base plate 41. The fixing section 83 is provided in a position corresponding to the mounting section 14 of the electronic component 10 of each subunit SU when viewed from the Z-direction. The fixing section 83 is a cylindrical or prismatic projection that extends from the flat surface section 81 in the +Z direction. The projection of the fixing section 83 in the Z direction is smaller than the projection of the fixing section 82 in the Z direction.

[0107] As in Fig. As shown in Figure 2, the circumferential wall section 84 extends from the outer circumferential edge of the flat surface section 81 to the side in the +Z direction. The circumferential wall section 84 extends over the entire circumference of the flat surface section 81. The length of the circumferential wall section 84 in the Z direction is shorter than the length of the fixing sections 82 and 83 in the Z direction. <5.2 Insulating film 91>

[0108] The insulating film 91 is an insulating element for the electrical insulation of the metal plate 80 and the busbars 42 of each subunit SU. The insulating film 91 consists, for example, of a synthetic resin such as polyester or polyimide and has insulating properties. Viewed from the Z-direction, the insulating film 91 has a rectangular shape. The insulating film 91 is designed to cover the entire flat surface section 81 of the metal plate 80 from the side in the +Z direction. Therefore, the main body MU faces the metal plate 80, with the insulating film 91 positioned between it and the metal plate 80.

[0109] The insulating film 91 is attached to the flat surface section 81 of the metal plate 80. A notch or opening is formed in the insulating film 91 to bypass the fixing section 82 and the fixing section 83 of the metal plate 80. In the present embodiment, the thickness of the insulating film 91 in the Z-direction is less than the thickness of the circumferential wall section 84 in the Z-direction. Therefore, the insulating film 91 is positioned horizontally with respect to the metal plate 80 and is surrounded by the circumferential wall section 84. <5.3 Heat transfer element 92>

[0110] As in Fig. As shown in Figure 9, the heat transfer element 92 is an element for transferring the heat generated by the electronic component 10 at the time of energy supply and / or the heat generated by the busbar 42 itself at the time of energy supply to the metal plate 80. The heat transfer element 92 is, for example, a heat transfer film (for example, a thermally conductive silicone film) that is elastic. However, the heat transfer element 92 is not limited to the above example, but can also be a heat transfer element made of a thermally conductive gel or another material.

[0111] The plurality of heat transfer elements 92, for example, comprises one or more (e.g., a plurality of) heat transfer elements 92 corresponding to the first subunit SUX, or one or more (e.g., a plurality of) heat transfer elements 92 corresponding to the second subunit SUY, and one or more (e.g., a plurality of) heat transfer elements 92 corresponding to the third subunit SUZ. The heat transfer element 92 corresponding to the first subunit SUX is arranged in a position that overlaps the first subunit SUX when viewed from the Z-direction and transfers the heat generated by the first subunit SUX to the metal plate 80. The heat transfer element 92 corresponding to the second subunit SUY is arranged in a position that overlaps the second subunit SUY when viewed from the Z-direction and transfers the heat generated by the second subunit SUY to the metal plate 80.The heat transfer element 92 corresponding to the third subunit SUZ is arranged in a position that overlaps the third subunit SUZ seen from the Z direction and transfers the heat generated by the third subunit SUZ to the metal plate 80.

[0112] Fig. Figure 12 is a view from below, illustrating the installation board 40.

[0113] As in Fig. As shown in Figure 12, the heat transfer element 92 transfers the heat transferred from the electronic component 10 to the busbar 42 and / or the heat generated in the busbar 42 from the busbar 42 to the metal plate 80. The majority of the heat transfer elements 92 are partially provided in the mounting plate 40 in a horizontal direction. For example, the majority of the heat transfer elements 92 are arranged in positions that overlap a portion of the busbar 42 in the mounting plate 40 when viewed from the Z-direction. The majority of the heat transfer elements 92 are arranged in positions that overlap a portion of the busbar 42 near the electronic components 10 (for example, electronic components 10A and 10B) when viewed from the Z-direction.In the present embodiment, the majority of the heat transfer elements 92 are arranged at positions that overlap the connecting component 20 (a connecting section between the busbar 42 and the electronic component 10) as seen from the Z direction.

[0114] Fig. 13 is a cross-sectional view along line F13-F13 of the in Fig. 10 illustrated structures.

[0115] As in Fig. As shown in Figure 13, the heat transfer element 92 is arranged in the Z-direction, squeezed between the main body MU and the insulating film 91. A section of the heat transfer element 92, located on the side in the -Z direction, is in contact with the metal plate 80 via the insulating film 91. The heat transfer element 92 can be positioned between the insulating film 91 and the metal plate 80.

[0116] A section of the heat transfer element 92, located on the side in the +Z direction, is in contact with the busbar 42. In the present embodiment, the heat transfer element 92 is in contact with the busbar 42 at a position that overlaps the connecting component 20 when viewed from the Z direction. In this case, the heat transfer element 92 easily transfers the heat transferred from the electronic component 10 to the connecting component 20 from the connecting component 20 via the busbar 42 to the metal plate 80. A portion of the heat transfer element 92 is arranged at a position that overlaps the fastening element 43 when viewed from the Z direction and is in contact with the fastening element 43.In this case, the heat transfer element 92 easily transfers the heat transferred from the electronic component 10 to the connecting component 20 from the fastening element 43 to the metal plate 80.

[0117] In the present embodiment, part of the heat transfer element 92 is in contact with the busbar 42 at a position that overlaps the electronic component 10 when viewed from the Z-direction. In this case, the heat transfer element 92 readily transfers the heat transferred from the electronic component 10 to the busbar 42 from the busbar 42 to the metal plate 80. In the Fig. In the illustrated example 11, the upper surface of the busbar 42 is in contact with the electronic component 10, and thus the busbar 42 is thermally connected to the electronic component 10. Note that the busbar 42 can be thermally connected to the electronic component 10 at the extending section 63 or at the extension 64. The electronic component 10, the connecting component 20, and the busbar 42 are examples of a "first resistor". <5.4 Insulating cover 93>

[0118] Referring to Fig. In Figure 1, the insulating cover 93 is described. The insulating cover 93 is an element for ensuring the safety of the main body MU with respect to the energy supply path. The insulating cover 93 is made, for example, of a synthetic resin and has insulating properties. The insulating cover 93 has, for example, a box-shaped form that is open on the -Z side. The insulating cover 93 is attached to the metal plate 80 to cover the main body MU from the side in the +Z direction. In the present embodiment, a plurality of vent holes 93h are formed in the upper wall of the insulating cover 93. Note that the insulating cover 93 is not limited to a box-shaped form but can also be a sheet-like element that covers the energy supply path of the main body MU. <6. Fixing structure>

[0119] Next, a fixing structure of the subunit SU is described.

[0120] As in Fig. As shown in Figure 7, the main body MU is stacked on the metal plate 80 in the Z-direction in a state in which the fixing sections 52 of the adjacent subunits SU overlap the fixing section 82 of the metal plate 80. The fixing sections 52 and 82, which overlap in the Z-direction, are fixed to one another by means of the fastening element 111 (e.g., a screw or a bolt). The fastening element 111 penetrates the fixing section 52 of the subunit SU and is then attached to the fixing section 82 of the metal plate 80.

[0121] In a state where the main body MU and the metal plate 80 are stacked, the fixing section 83 of the metal plate 80 penetrates the through-hole 51h of the sub-unit SU. The mounting section 14 of the electronic component 10 overlaps the fixing section 83 in the Z-direction. The mounting section 14 and the fixing section 83, overlapping in the Z-direction, are fixed to one another by a fastening element 112 (e.g., a screw or a bolt). The fastening element 112 penetrates the mounting section 14 and is then attached to the fixing section 83 of the metal plate 80. A gap through which air can flow is provided between the inner circumferential surface of the through-hole 51h and the fixing section 83. <7. Weight Loss Section 88>

[0122] Next, a weight reduction section 88 formed in the metal plate 80 is described.

[0123] As in Fig. As shown in Figure 11, one or more (e.g., a plurality of) weight reduction sections 88 are formed in sections of the flat surface section 81 of the metal plate 80, with the fixing sections 82 and 83 being recessed. As shown in Fig. As shown in Figure 9, the weight reduction section 88 is a through hole that penetrates the flat surface section 81 in the Z direction.

[0124] The weight reduction section 88 is provided such that it corresponds to each subunit SU. That is, the weight reduction section 88 is provided at each position of the metal plate 80 that overlaps the subunit SU when viewed from the Z-direction. In the present embodiment, the weight reduction sections 88 are arranged at intervals in the X-direction at both ends of the metal plate 80 in the Y-direction. In the following description, the weight reduction section 88 corresponding to the first subunit SUX is taken as an example and described in detail.

[0125] As in Fig. As shown in Figure 12, each of the weight reduction sections 88 is formed at a position that, viewed from the Z-direction, overlaps the laying plate 40 and does not overlap at least part of the heat transfer element 92 in the flat surface section 81. In the present embodiment, each of the weight reduction sections 88 is provided at a position that, viewed from the Z-direction, is displaced relative to the entire heat transfer element 92. The weight reduction sections 88 comprise weight reduction sections 88A and 88B. Weight reduction sections 88A and 88B are arranged horizontally spaced apart from each other.

[0126] As in Fig. 9 and Fig. As shown in Figure 10, the weight reduction section 88A is positioned so that it overlaps the busbar 42A in the flat surface section 81 when viewed from the Z-direction. In the present embodiment, a portion of the weight reduction section 88A overlaps the extending section 63 when viewed from the Z-direction. That is, part of the weight reduction section 88A overlaps the busbar 42A and the remainder overlaps the flat surface section 51. However, the entire weight reduction section 88A can also overlap either the busbar 42A or the flat surface section 51.

[0127] The weight reduction section 88A is rectangular in shape, with the X-direction being the longitudinal direction and the Y-direction the transverse direction when viewed from the Z-direction. The weight reduction section 88A extends linearly in the extension direction of the busbar 42A (extending section 63). The length of the weight reduction section 88A in the X-direction is shorter than the length of the busbar 42A in the X-direction. The width of the weight reduction section 88A in the Y-direction is smaller than the width of the extending section 63 in the Y-direction. However, the size or shape of the weight reduction section 88A can be modified as required.

[0128] As in Fig. 10 and Fig. As shown in Figure 13, the weight reduction section 88B is positioned so that it overlaps the electronic component 10C and the connecting components 20E and 20F in the flat surface section 81 when viewed from the Z direction. The weight reduction section 88B is rectangular in shape, with the X direction being the longitudinal direction and the Y direction the transverse direction when viewed from the Z direction. In the present embodiment, the weight reduction section 88B is large enough to cover the entire electronic component 10C and the connecting components 20E and 20F when viewed from the Z direction. That is, the width of the weight reduction section 88B in the Y direction is greater than the width of the electronic component 10C and the connecting components 20E and 20F in the Y direction.The length of the weight reduction section 88B in the X direction is greater than the length of the electronic component 10C and the connecting components 20E and 20F in the X direction. However, the size or shape of the weight reduction section 88B can be changed as required.

[0129] The area of ​​each weight reduction section 88, viewed from the Z-direction, is larger than the area of ​​each heat transfer element 92, also viewed from the Z-direction. In the present embodiment, the total area of ​​the weight reduction sections 88 (weight reduction sections 88A and 88B) provided for the first subunit SUX is larger than the total area of ​​the heat transfer elements 92 provided for the first subunit SUX. However, the area of ​​the weight reduction section 88 can be smaller than the area of ​​the heat transfer element 92.

[0130] In the present embodiment, the area occupied by the weight reduction section 88 in the entire metal plate 80 (flat surface section 81) can be determined according to the heat capacity or the like of the metal plate 80. That is, the heat capacity of the metal plate 80, which serves as a heat dissipation plate, can be ensured by reducing the area of ​​the weight reduction section 88 when the amount of heat generated by the electronic component 10 or the busbar 42 increases. <8. Heat transfer>

[0131] As in Fig.As shown in Figure 11, heat is generated in subunit SU, for example, when energy is supplied to the electronic component 10 or when energy is supplied to the busbar 42. A portion of the heat generated in subunit SU is transferred to the metal plate 80 (flat surface section 81) via the heat transfer element 92 and the insulating film 91. A portion of the heat from the base plate 41 is transferred to the fixing section 82 of the metal plate 80 via the fixing section 52. Furthermore, a portion of the heat from the electronic component 10 is transferred to the fixing section 83 of the metal plate 80 via the mounting section 14. As described above, the heat generated in subunit SU is transferred to the metal plate 80 and then dissipated from the metal plate 80 to the outside.

[0132] Here, the warm air that has accumulated in the gap S1 between the metal plate 80 and the base plate 41 is released through the weight reduction section 88 to the outside of the electrical connection unit 1. This facilitates heat dissipation from the electrical connection unit 1.

[0133] In the electrical connection unit 1 of the present embodiment, one or more weight reduction sections 88, which penetrate the metal plate 80 in the Z direction, are formed in the metal plate 80 at positions which, viewed from the Z direction, overlap the subunit SU and do not overlap at least part of the heat transfer element 92.

[0134] Compared to a case where the entire metal plate 80 has a uniform thickness, the weight of the metal plate 80 can be reduced in this design because the weight-reduction section 88 is formed within the metal plate 80. This design allows for a reduction in the weight of the electrical connection unit 1. Furthermore, the heat transfer element 92, which thermally connects the subunit SU to the metal plate 80, is positioned on the metal plate 80 in a way that, viewed from the Z-direction, does not overlap the weight-reduction section 88. Therefore, the heat generated in the subunit SU can be effectively transferred to the metal plate 80. Since the weight-reduction section 88 penetrates the metal plate 80 in the Z-direction, heat is also prevented from becoming trapped between the metal plate 80 and the subunit SU.This design can also improve the heat dissipation properties of the electrical connection unit 1.

[0135] In the present embodiment, the heat transfer element 92 is provided at a position that overlaps the busbar 42 when viewed from the Z direction.

[0136] According to this design, in subunit SU, the busbar 42, which is one of the heat-generating sections, and the metal plate 80 are thermally connected via the heat transfer element 92. This connection further improves the heat dissipation properties.

[0137] In the present embodiment, the majority of weight reduction sections 88 are arranged spaced apart from each other in the horizontal direction.

[0138] According to this setup, the layout property of the weight reduction section 88 can be improved compared to a case where a large weight reduction section 88 is formed.

[0139] In the present embodiment, the area of ​​the weight reduction section 88, viewed from the Z direction, is larger than the area of ​​the heat transfer element 92.

[0140] According to this design, the area of ​​the weight reduction section 88 can be ensured and the weight of the electrical connection unit 1 can be further reduced.

[0141] In the present embodiment, the electronic component 10 (electronic component 10C) is provided, which is supported by the connecting component 20 (connecting components 20E and 20F) in a state in which it is separated from the routing board 40 in the Z-direction and electrically connected to the busbar 42 via the connecting component 20. The weight reduction section 88 (weight reduction section 88B) is provided at a position that overlaps the electronic component 10 when viewed from the Z-direction.

[0142] Since the electronic component 10 is in a state separated from the mounting board 40 in this assembly, very little heat is transferred directly below the electronic component 10. By positioning the weight reduction section 88 at a location where heat from the electronic component 10 is hardly transferred downwards, any deterioration in heat dissipation performance due to the weight reduction can be minimized. Furthermore, since the perimeter of the weight reduction section 88 is hardly stressed by the electronic component 10, it is easy to ensure the strength of the metal plate 80. <9. Further Modification Examples>

[0143] The following are some modification examples. Note that in each modification example, the structure differs from the one described below and corresponds to the structure of the embodiment described above. (First modification example)

[0144] The routing board 40 is not limited to a structure in which the base plate 41 and the busbar 42 are integrated by insert forming. For example, the busbar 42 can be positioned in the receiving section 55 after the base plate 41, which provides the receiving section 55 for receiving the busbar 42, has been formed. In this case, the busbar 42 can be fixed to the receiving section 55 by fitting or by using an adhesive or other fastener. In these cases, potting can be performed to fill any gap between the busbar 42 and the receiving section 55. (Second modification example)

[0145] A basic element of the busbar 40 is not limited to the base plate 41 with the plate-shaped, flat surface section 51. The busbar 40 can be a basic element (for example, an insulating film) with a sheet-like, flat surface section 51. In this case, the receiving section 55 can be formed by a portion of the flat surface section 51 that follows the outer shape of the busbar 42. In the present disclosure, the term "sheet-like" or "sheet" is not limited to an element with a thickness of 1 mm or more, and an element (a so-called film) with a thickness of less than 1 mm can also be used. (Third modification example)

[0146] The base plate 41 of the routing board 40 can contain a plurality of elements (plate elements or sheet metal elements). These elements are provided to accommodate the plurality of busbars 42, which are arranged, for example, horizontally, from both sides in the Z-direction. For example, the plurality of elements are integrated by joining the plurality of busbars 42 together, for example, by laminate forming. The plurality of elements forms the flat surface section 51. In this case, the receiving section 55 can be formed in a hollow shape within the base plate 41 (between the plurality of elements). The plurality of elements can be a plurality of plate elements, a plurality of sheet metal elements, or a combination of a plate element and a sheet metal element. The plate element can, for example, be a flexible plate element.The flat surface section 51 formed by the majority of elements has an opening through which at least the first connecting section 61 and the second connecting section 62 of the busbar 42 are exposed. For example, in this case, the receiving section 55 formed between the majority of elements corresponds to an example of a "recessed receiving section in the first direction (Z-direction)." (Fourth modification example)

[0147] The connection between the electronic component 10 and the busbar 42 is not limited to the connection via the connecting component 20. The electronic component 10 can be connected directly to the busbar 42 by means of a fastening element (for example, a bolt or a screw), by welding, or similar means.

[0148] Several embodiments and modification examples have been described above. However, the embodiments and modification examples are not limited to those described above. For example, a plurality of embodiments can be implemented in combination with one another. The present invention is not limited by the above description, but only by the appended claims.

[0149] In the embodiment described above, the electrical connection unit 1 for a vehicle was described, but the present invention is not limited to this structure.

[0150] The embodiment described above is an example in which the main body MU consists of the plurality of subunits SUX, SUY, and SUZ, but the present invention is not limited to this configuration. The electrical interconnection unit 1 can consist of a single circuit assembly body.

[0151] In the embodiment described above, the case in which the metal plate 80 is used as an example of a heat dissipation plate was described, but the present invention is not limited to this configuration. The heat dissipation plate can be made of a material whose thermal conductivity is higher than that of the routing plate 40.

[0152] In the embodiment described above, the structure is such that the metal plate 80 overlaps the entire main body MU, but the present invention is not limited to this structure. The metal plate 80 can overlap at least a part of the main body MU.

[0153] The embodiment described above features a structure in which a plurality of weight-reduction sections 88 are provided, but the present invention is not limited to this structure. The number of weight-reduction sections 88 can be one.

[0154] In the embodiment described above, the electronic component 10, the busbar 42, and the connecting component 20 are used as examples of a resistor, but the present invention is not limited to this configuration. Any resistor can be chosen as required, as long as the resistor is a heat-generating component that produces heat when energy is supplied.

[0155] In the embodiment described above, the structure is such that each weight-reduction section 88 is a large opening (through hole), but the present invention is not limited to this structure. The weight-reduction section 88 can be formed by grouping a plurality of small openings in the form of a grid, a honeycomb, or a slot. Since the surface of the metal plate 80 can be protected by a section of the metal plate 80 that divides the small openings, the heat dissipation properties can be improved in this case.

[0156] In the embodiment described above, the assembly is characterized by the distribution board 40 and the busbar 42 being formed as a single piece, but the present invention is not limited to this assembly. The busbar 42 can be formed separately from the distribution board 40.

[0157] In the embodiment described above, the structure is arranged in which the entire weight reduction section 88 is positioned at a location offset relative to the heat transfer element 92, but the present invention is not limited to this structure. A portion of the weight reduction section 88 and the heat transfer element 92 may overlap when viewed from the Z-direction.

[0158] In the embodiment described above, the structure is formed by a through-hole for the weight reduction section 88, but the present invention is not limited to this structure. The weight reduction section 88 can be a thin section that is thinner than other sections in the flat surface section 81. The thin section can be open on the side in the +Z direction or the side in the -Z direction of the flat surface section 81. Both a through-hole and a thin section can be formed in combination in a metal plate 80.

[0159] Although the embodiments of the present disclosure have been described and illustrated above, these embodiments are presented as examples and are not intended to limit the scope of the present disclosure. The embodiments described above can be implemented in various other forms, and the components in the embodiments described above can be replaced by known components, and various additions, omissions, substitutions, and modifications can be made without departing from the concept of the present disclosure. INDUSTRIAL APPLICABILITY

[0160] According to the present disclosure, it is possible to provide an electrical connection unit whose weight can be reduced. REFERENCE MARK LIST 1 electrical connection unit 10, 10A, 10B, 10C, 10M, 10N, 10X, 10Y, 10Z electronic component (resistor, first resistor) 20, 20A, 20B, 20C, 20D, 20E, 20F, 20M, 20N, 30A, 30B Connection component (resistor, first resistor) 40, 40X first routing board (circuit board) 40, 40Y second routing board (circuit board) 40, 40Z third routing board (circuit board) 42, 42A, 42B, 42C, 42D, 42E Busbar (resistor, first resistor) 80 Metal plate (heat dissipation plate) 88, 88A, 88B Weight Reduction Section 92 Heat transfer element 100 connection component (resistor) SU, SUX, SUY, SUZ Subunit (circuit assembly body)

Claims

[1] Electrical connection unit (1) comprising: a circuit assembly body (SU) with a plurality of resistors (10, 20, 30, 42, 100) and a circuit board (40) facing the plurality of resistors (10, 20, 30, 42, 100); a heat dissipation plate (80) which is provided to overlap the circuit assembly body (SU) in one thickness direction of the circuit board (40), wherein the heat dissipation plate (80) is made of a material whose thermal conductivity is higher than the thermal conductivity of the circuit board (40); and one or more heat transfer elements (92) which are provided between the circuit assembly body (SU) and the heat dissipation plate (80) and thermally connect the circuit assembly body (SU) to the heat dissipation plate (80), wherein one or more weight reduction sections (88) which are thinner than other sections of the heat dissipation plate (80) or which penetrate the heat dissipation plate (80) in the thickness direction are formed in the heat dissipation plate (80) at positions which, viewed from the thickness direction, overlap the board (40) and do not overlap at least part of the heat transfer element (92). [2] Electrical connection unit (1) according to claim 1, wherein the majority of resistors (10, 20, 30, 42, 100) include a first resistor (10, 20, 30, 42), and the heat transfer element (92) is arranged in a position that overlaps at least part of the first resistance (10, 20, 30, 42) as seen from the thickness direction. [3] Electrical connection unit (1) according to claim 1 or 2, wherein the one or more weight reduction sections (88) comprise a plurality of weight reduction sections (88) which are spaced apart from each other. [4] Electrical connection unit (1) according to claim 1 or 2, wherein an area of ​​one or more weight reduction sections (88) viewed from the thickness direction is larger than an area of ​​one or more heat transfer elements (92). [5] Electrical connection unit (1) according to claim 1 or 2, wherein the majority of resistors (10, 20, 30, 42, 100) include a first resistor (10, 20, 30, 42), where the first resistor (10, 20, 30, 42) has the following: a busbar (42) held by the circuit board (40) , a connecting component (20) which is electrically connected to the busbar (42) in a state in which it protrudes from the circuit board (40) in the thickness direction, and an electronic component (10) which is supported by the connecting component (20) in a state in which it is separated from the circuit board (40) in the thickness direction and electrically connected to the busbar (42) via the connecting component (20), and wherein the weight reduction section (88) is provided at a position which overlaps the electronic component (10) viewed from the thickness direction.

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