Optoelectronic component and electronic device with optoelectronic component

Abstract

Optoelectronic component (100) with a housing (200) having a top (210), a bottom (220), a first end face (250), a second end face (260) and an outer surface (230), wherein the housing (200) has a chip receiving space (270) on the top (210) in which an optoelectronic semiconductor chip (500) is arranged, wherein the first end face (250) and the second end face (260) each extend in an upward direction (10) between the bottom (220) and the top (210), wherein a projecting first contact ridge (300) is formed on the first end face (250) and a projecting second contact ridge (400) is formed on the second end face (260), wherein the first contact ridge (300) and the second contact ridge (400) are oriented in a direction perpendicular to the upward direction (10). transverse direction (20) are at most half as wide as the first end face (250) and the second end face (260), wherein the housing (200) has a first solder contact surface (331),a second solder contact surface (431), a third solder contact surface (321), and a fourth solder contact surface (421), wherein the first solder contact surface (331) and the second solder contact surface (431) point in the same spatial direction as the outer surface (230), wherein the first solder contact surface (331) and the second solder contact surface (431) are recessed from the outer surface (230), wherein the third solder contact surface (321) and the fourth solder contact surface (421) point in the same spatial direction as the underside (220), wherein the third solder contact surface (321) and the fourth solder contact surface (421) are recessed from the underside (220), wherein the first solder contact surface (331) is formed by a first metallization (370) arranged on the first contact ridge (300) on the surface of the housing (200), wherein the second solder contact surface (431) is formed by a metallization (370) arranged on the second contact ridge (300) on the surface of the housing (200). A second metallization (470) is formed on the surface of the housing (200) by means of a contact bridge (400).wherein the housing (200) comprises an electrically insulating plastic material and is partially coated with the metallizations (370, 470).

Description

The present invention relates to an optoelectronic component according to patent claim 1 and to an electronic device having an optoelectronic component according to patent claim 10.German priority application DE 10 2013 203 759 A1 describes an optoelectronic component and an electronic device with an optoelectronic component.Optoelectronic components, for example light-emitting diode components, are known in various embodiments. For numerous applications, it is necessary to form optoelectronic components with housings that are as space-saving as possible. Such optoelectronic components are frequently formed as SMT components which are provided for being arranged on a printed circuit board of an electronic device according to a method for surface mounting. The housings of such optoelectronic components must have a certain minimum size so that the optoelectronic component can have desired optical properties. This minimum size of an optoelectronic component results in a minimum height of a construction space required for mounting the optoelectronic component over a printed circuit board. This limits possible miniaturization of an electronic device including the circuit board.US 2010 / 0025722 A1 describes a light-emitting component having a housing, contact surfaces being formed on the side surface of which and being set back by a step.US 2009 / 0315068 A1 describes a light-emitting component which is suitable for mounting with emission direction perpendicular to the mounting plane and for mounting with emission direction parallel to the mounting plane.US 2011 / 0175119 A1 describes a light-emitting component which is suitable for mounting in a cutout.JP H04 63 163 U describes a light-emitting component which is suitable for mounting with radiation perpendicular or parallel to the mounting plane.US 2008 / 0230790 A1 likewise describes a light-emitting component which is suitable for mounting with radiation perpendicular to the mounting plane or parallel to the mounting plane.An object of the present invention is to provide an optoelectronic component. This object is achieved by an optoelectronic component having the features of claim 1. A further object of the present invention is to provide an electronic device having an optoelectronic component. This object is achieved by an electronic device having the features of claim 10. Various refinements are specified in the dependent claims.An optoelectronic component has a housing with an outer surface. On an upper side, the housing has a chip receiving space in which an optoelectronic semiconductor chip is arranged. The housing also includes a first solder pad and a second solder pad. The first solder contact surface and the second solder contact surface point in the same spatial direction as the outer surface. In this case, the first soldering contact surface and the second soldering contact surface are set back with respect to the outer surface. Advantageously, this optoelectronic component can be arranged in a cutout of a printed circuit board of an electronic device, as a result of which the installation space required for the optoelectronic component above the printed circuit board and below the printed circuit board is reduced. In this case, the first soldering contact surface and the second soldering contact surface can electrically contact soldering surfaces arranged on an upper side of the printed circuit board. The optoelectronic component can be mounted, for example, according to a method for surface mounting, for example by reflow soldering (reflow soldering).The first soldering contact surface is formed by a first metallization arranged on the surface of the housing. In addition, the second soldering contact area is formed by a second metallization arranged on the surface of the housing. This enables production of the housing of the optoelectronic component by a method of MID technology. This advantageously results in a great freedom in the geometric configuration of the housing of the optoelectronic component.The housing comprises an electrically insulating material, for example a plastic material. In this case, the housing is coated in sections with the metallizations. Advantageously, the housing of the optoelectronic component can be produced cost-effectively by, for example, an injection molding method and subsequently coated. The optoelectronic component can thus be produced, for example, by an MID method. All electrically conductive structures of the optoelectronic component can thus be arranged completely on the surface of the housing.The housing has a bottom side, a first end side and a second end side. The first end face and the second end face each extend in an upward direction between the lower side and the upper side. On the first end side, a projecting first contact web is formed. On the second end side, a projecting second contact web is formed. The first contact web and the second contact web have a smaller width than the first end side and the second end side in a transverse direction oriented perpendicularly to the upward direction. The first soldering contact surface is formed on the first contact web. The second soldering contact surface is formed on the second contact web. The solder contact surfaces can be metallizations arranged on the surface of a plastic structure. Advantageously, this optoelectronic component can be supported on the edge of a cutout of a printed circuit board by means of its contact webs, while a more voluminous part of the housing of this optoelectronic component is arranged in a space-saving manner in the cutout of the printed circuit board. The contact webs can advantageously serve simultaneously for the electrical contacting of the optoelectronic component.In one embodiment of the optoelectronic component, the first contact web and the second contact web are arranged uncentred in the transverse direction on the first end side and on the second end side. Advantageously, this makes it possible to arrange a substantial portion of the housing of the optoelectronic component in a cutout of a printed circuit board below a level of an upper side of the printed circuit board, while the first contact web and the second contact web of the optoelectronic component are arranged above the upper side of the printed circuit board and are electrically contacted there.The first contact web and the second contact web are at most half as wide in the transverse direction as the first end side and the second end side. Advantageously, this makes it possible to arrange the substantial part of the housing of the optoelectronic component substantially symmetrically between an upper side and an underside of a printed circuit board in a cutout of the printed circuit board. As a result, the installation space required for the optoelectronic component on both sides of the printed circuit board is advantageously minimized.In one embodiment of the optoelectronic component, the chip receiving space is formed as a substantially funnel-shaped depression. Advantageously, the optoelectronic semiconductor chip arranged in the chip receiving space is thereby protected from mechanical damage. In addition, the funnel-shaped depression of the chip receiving space can advantageously bring about beam radiation of electromagnetic radiation emitted by the optoelectronic semiconductor chip.In one embodiment of the optoelectronic component, the first metallization extends over all outer surfaces of the first contact web. Alternatively or additionally, the second metallization can extend over all outer surfaces of the second contact web. The plastic structure of the contact webs can be completely covered with the metallization. Advantageously, when the optoelectronic component is electrically contacted, a solder can thereby wet and electrically contact other outer surfaces of the contact webs in addition to the lateral solder contact surfaces, as a result of which a low-resistance and reliable electrically conductive connection to the optoelectronic component can be ensured.In one embodiment of the optoelectronic component, the optoelectronic semiconductor chip is electrically conductively connected to the first metallization by a bonding wire. Advantageously, the electrically conductive connection can thereby be produced in a simple and automated manner.In one embodiment of the optoelectronic component, the second metallization forms an optical reflector in the region of the chip receiving space. Advantageously, the optoelectronic component can thereby achieve a high light yield. Due to the dual function of the second metallization as an optical reflector and as an electrical conductor, the optoelectronic component can advantageously be produced particularly simply and cost-effectively.The housing also includes a third solder pad and a fourth solder pad. The third solder contact surface and the fourth solder contact surface point in the same spatial direction as the underside. The third soldering contact surface and the fourth soldering contact surface are set back with respect to the underside. Advantageously, the optoelectronic component can thereby also be arranged in a cutout of a printed circuit board in such a way that the third solder contact surface and the fourth solder contact surface face an upper side of the printed circuit board and are connected to solder surfaces of the printed circuit board by means of solder connections. A voluminous part of the housing of the optoelectronic component is arranged in a space-saving manner in the cutout of the printed circuit board, as a result of which the installation space required for the optoelectronic component above and below the printed circuit board is reduced.In an arrangement of the optoelectronic component in which the third solder contact area and the fourth solder contact area face the top side of the printed circuit board, the housing and the optoelectronic semiconductor chip arranged in the chip receiving space of the housing of the optoelectronic component are rotated through 90° with respect to an arrangement of the optoelectronic component in which the first solder contact area and the second solder contact area of the housing of the optoelectronic component face the top side of the printed circuit board. Consequently, a radiation direction of the optoelectronic component also differs by 90° in the two arrangements of the optoelectronic component. The optoelectronic component can thus advantageously be mounted both in a toplooker arrangement in which an emission direction is oriented perpendicularly to a top side of a printed circuit board and in a sidelooker arrangement in which the emission direction of the optoelectronic component is oriented parallel to the top side of the printed circuit board.In one embodiment of the optoelectronic component, the first contact web and the second contact web have a lower height in the upward direction than the first end side and the second end side. In this case, the third soldering contact surface is formed on the first contact web. The fourth solder contact surface is formed on the second contact web.Advantageously, the optoelectronic component can be arranged in a cutout of a printed circuit board in such a way that the contact webs of the housing of the optoelectronic component are supported on an edge of the cutout and the third solder contact surface and the fourth solder contact surface of the optoelectronic component are in contact with solder surfaces of the printed circuit board, while a bulky housing part of the optoelectronic component between the first contact web and the second contact web is arranged in a space-saving manner in the cutout of the printed circuit board.In one embodiment of the optoelectronic component, the first contact web and the second contact web are arranged uncentred in the upward direction on the first end side and the second end side. Advantageously, as a result, a substantial volume proportion of the housing of the optoelectronic component can be arranged below a level of a top side of a printed circuit board in a cutout of a printed circuit board, while the first contact web and the second contact web of the housing of the optoelectronic component are arranged above the top side of the printed circuit board and the third and fourth solder contact surfaces of the optoelectronic component face the top side of the printed circuit board.In one embodiment of the optoelectronic component, the first contact web and the second contact web are at most half as high as the first end side and the second end side in the upward direction. Advantageously, this enables an arrangement of the optoelectronic component in a cutout of a printed circuit board, in which the volume of the optoelectronic component is arranged approximately symmetrically between an upper side and an underside of the printed circuit board in the cutout of the printed circuit board. As a result, the installation space required for the optoelectronic component on both sides of the printed circuit board is advantageously minimized.An electronic device includes a circuit board having a recess. In this case, an optoelectronic component of the described type is arranged in the cutout. Advantageously, the optoelectronic component in this electronic device requires a very small installation space above and below the printed circuit board. As a result, the electronic device can advantageously be designed to be particularly compact.The above-described characteristics, features and advantages of this invention and the manner in which these are achieved become clearer and more clearly comprehensible in conjunction with the following description of the exemplary embodiments, which are explained in more detail in conjunction with the drawings. In each case, the following are shown in schematic representation: FIG. 1 shows a perspective illustration of an optoelectronic component; FIG. 2 shows a side view of a first electronic device with the optoelectronic component in a first arrangement; FIG. 3 shows a side view of a second electronic device with the optoelectronic component in a second arrangement; and FIG. 4 shows a side view of a third electronic device with the optoelectronic component in a third arrangement.FIG. 1 shows a slightly schematic perspective illustration of an optoelectronic component 100. The optoelectronic component 100 can be a light-emitting diode component, for example.The optoelectronic component 100 comprises a housing 200. The housing 200 comprises an electrically insulating material and is coated in sections with an electrically conductive material. The electrically insulating material is preferably a plastic material. The housing 200 of the optoelectronic component 100 can be produced, for example, according to a method of MID technology.The housing 200 of the optoelectronic component 100 has a substantially cuboidal main body having an upper side 210, an underside 220 opposite the upper side 210, a first side surface 230, a second side surface 240 opposite the first side surface 230, a first end side 250 and a second end side 260 opposite the first end side 250. The top side 210 of the housing 200 is arranged above the bottom side 220 in an upward direction 10. The first side surface 230 and the second side surface 240 extend in the upward direction 10 between the bottom side 220 and the top side 210. In addition, the first side surface 230 and the second side surface 240 extend between the second end side 260 and the first end side 250 in a longitudinal direction 30 perpendicular to the upward direction 10. The first end side 250 and the second end side 260 extend in the upward direction 10 between the lower side 220 and the upper side 210 of the housing 200. In addition, the first end side 250 and the second end side 260 extend between the second side surface 240 and the first side surface 230 in a transverse direction 20 perpendicular to the upward direction 10 and to the longitudinal direction 30. Thus, the upward direction 10 is oriented perpendicular to the top side 210. The transverse direction 20 is oriented perpendicular to the first side surface 230. The longitudinal direction 30 is oriented perpendicular to the first end side 250.In the transverse direction 20, the first end side 250 and the second end side 260 each have a width 251. In the upward direction 10, the first end side 250 and the second end side 260 each have a height 252.The first side surface 230 and the second side surface 240 of the housing 200 may be saw surfaces along which the housing 200 has been separated from other similar housings during its manufacture.A first contact web 300 is formed on the first end side 250 of the housing 200 of the optoelectronic component 10. The first contact web 300 has an approximately cuboidal basic shape and is oriented perpendicularly to the first end side 250 of the housing 200. Outer edges and outer surfaces of the first contact web 300 run substantially parallel to outer edges and outer surfaces of the approximately cuboidal main body of the housing 200. The first contact web 300 comprises a plastic structure formed integrally with the main body of the housing 200. A metallization explained in more detail below is arranged on the surface of the plastic structure.The first contact web 300 has a first outer upper side 310 and a first outer lower side 320 opposite the first outer upper side 310. Furthermore, the first contact web 300 has a first inner side surface 330 and a first outer side surface 340 opposite the first inner side surface 330. In addition, the first contact web 300 has a first outer end side 350. The first outer upper side 310 is oriented parallel to the upper side 210 of the approximately cuboidal main body of the housing 200 and, like this, points in the upward direction 10. The first inner side surface 330 of the first contact web 300 is oriented parallel to the first side surface 230 of the housing 200 and points in the transverse direction 20. The first outer end side 350, like the first end side 250 of the housing 200, points in the longitudinal direction 30.In the transverse direction 20, the first outer end side 350 of the first contact web 300 has a width 351 which is less than the width 251 of the first end side 250 of the housing 200. In the upward direction 10, the first outer end side 350 of the first contact web 300 has a height 352 which is less than the height 252 of the first end side 250 of the housing 200. The width 351 of the first outer end face 350 of the first contact web 300 is preferably less than half the width 251 of the first end face 250 of the housing 200. The height 352 of the first outer end face 350 of the first contact web 300 is also preferably less than half the height 252 of the first end face 250 of the housing 200. Thus, the first contact web 300 covers only a part of the first end side 250 of the housing 200, preferably less than a quarter of the first end side 250 of the housing 200.The first contact web 300 is preferably arranged neither in the upward direction 10 nor centered on the first end side 250 of the housing 200 in the transverse direction 20. In the example illustrated in FIG. 1, the first outer top side 310 of the first contact web 300 adjoins flush the top side 210 of the housing 200. The first outer bottom side 320 is set back in the upward direction 10 with respect to the bottom side 220 of the housing 200. The first outer side surface 340 of the first contact web 300 is slightly recessed in the transverse direction 20 against the second side surface 240 of the housing 200. However, the first outer side surface 340 could also be flush with the second side surface 240 of the housing 200. The first inner side surface 330 is set back significantly in the transverse direction 20 with respect to the first side surface 230.On the second end side 260 of the cuboidal main body of the housing 200 of the optoelectronic component 100, a second contact web 400 is formed. The second contact web 400 is substantially mirror-symmetrical to the first contact web 300. The second contact web 400 comprises a plastic structure formed integrally with the main body of the housing 200. A metallization explained in more detail below is arranged on the surface of the plastic structure.The second contact web 400 has a second outer upper side 410 and a second outer lower side 420 opposite the second outer upper side 410. Furthermore, the second contact web 400 has a second inner side surface 430 and a second outer side surface 440 opposite the second inner side surface 430. In addition, the second contact web 400 has a second outer end side 460. The second outer top side 410 is oriented like the first outer top side 310 of the first contact web 300. The second outer underside 420 of the second contact web 400 is oriented like the first outer underside 320 of the first contact web 300. The second inner side surface 430 of the second contact web 400 is oriented like the first inner side surface 330 of the first contact web 300. The second outer side surface 440 is oriented like the first outer side surface 340 of the first contact web 300. The second outer end face 460 is oriented parallel to the second end face 260 of the approximately cuboidal main body of the housing 200 and, like this, points in a spatial direction opposite the longitudinal direction 30.The second outer end side 460 has the same width 351 as the first outer end side 350 of the first contact web 300. In addition, the second outer end side 460 of the second contact web 400 has the same height 352 as the first outer end side 350 of the first contact web 300. The second outer underside 420 of the second contact web 400, like the first outer underside 320 of the first contact web 300, is set back in the upward direction 10 with respect to the underside 220 of the housing 200. The second inner side surface 430 of the second contact web 400, like the first inner side surface 330 of the first contact web 300, is set back in the transverse direction 20 with respect to the first side surface 230 of the housing 200.A chip receiving space 270 is formed on the upper side 210 of the housing 200. The chip receiving space 270 extends from the top 210 of the package 200 into the package 200. In this case, the chip receiving space 270 narrows in a funnel-shaped manner. In the example shown, the chip receiving space 270 has a truncated cone shape, the circular disk-shaped cross section of which reduces from the upper side 210 of the housing 200 into the housing 200. The chip receiving space 270 has a bottom portion 271 that forms a top surface of the chip receiving space 270 in the shape of a truncated cone. A side wall 272 forms a lateral surface of the frustoconical chip receiving space 270.A bond contact space 280 is furthermore formed on the top side 210 of the housing 200 of the optoelectronic component 100. The bond contact space 280 is formed by a depression on the upper side 210 of the housing 200 which adjoins the chip receiving space 270. The depth of the depression forming the bond contact space 280 does not reach the depth of the chip receiving space 270 in the example shown. However, the bonding contact space 280 can also be formed differently than illustrated.The housing 200 of the optoelectronic component 100 comprises electrically conductive coatings, which form a first metallization 370 and a second metallization 470. The first metallization 370 and the second metallization 470 may have been arranged on the outer surfaces of the housing 200, for example, according to a method of MID technology. The first metallization 370 and the second metallization 470 each form contiguous electrically conductive areas. The first metallization 370 and the second metallization 470 are electrically insulated from one another.The second metallization 470 covers the side wall 272 and the bottom region 271 of the chip receiving space 270, the second outer underside 420 of the second contact web 400, the second inner side surface 430 of the second contact web 400 and the second outer side surface 440 of the second contact web 400. On the second outer underside 420 of the second contact web 400, the second metallization 470 forms a second lower solder contact surface 421. On the second inner side surface 430 of the second contact web 400, the second metallization 470 forms a second lateral soldering contact surface 431. On the second outer side surface 440 of the second contact web 400, the second metallization 470 forms a second outer solder contact surface 441.The second metallization 470 may also cover further parts of the surface of the housing 200 of the optoelectronic component 100. In the example shown, the second metallization 470 covers, for example, the second end side 260 of the housing 200, a part of the top side 210 of the housing 200, a part of the first side surface 230 of the housing 200, a part of the second side surface 240 of the housing 200 and a part of the bottom side 220 of the housing 200. In addition, the second metallization 470 also covers the second outer top side 410 of the second contact web 400 and the second outer end side 460 of the second outer contact web 400. The second outer contact web 400 is thus completely covered by the second metallization 470.The first metallization 370 covers a portion of the bond contact space 280 of the housing 200, the first outer bottom side 320 of the first contact fin 300, the first inner side surface 330 of the first contact fin 300 and the first outer side surface 340 of the first contact fin 300. In the region of the first outer underside 320 of the first contact web 300, the first metallization 370 forms a first lower solder contact surface 321. In the region of the first inner side surface 330 of the first contact web 300, the first metallization 370 forms a first lateral soldering contact surface 331. In the region of the first outer side surface 340 of the first contact web 300, the first metallization 370 forms a first outer solder contact surface 341.The first metallization 370 may cover further parts of the surface of the housing 200 of the optoelectronic component 100. In the illustrated example, the first metallization 370 additionally covers a portion of the top side 210 of the housing 200, a portion of the first side surface 230 of the housing 200, a portion of the second side surface 240 of the housing 200, a portion of the bottom side 220 of the housing 200, and the first end side 250 of the housing 200. In addition, the first metallization 370 covers the first outer top side 310 of the first contact web 300 and the first outer end side 350 of the first contact web 300. The first contact web 300 is thus completely covered by the first metallization 370.An optoelectronic semiconductor chip 500 is arranged in the chip receiving space 270 of the housing 200 of the optoelectronic component 100. The optoelectronic semiconductor chip 500 can be, for example, a light-emitting diode (LED) chip. The optoelectronic semiconductor chip 500 has a top side 510 and a bottom side 520 opposite the top side 510. Arranged on the top side 510 and the bottom side 520 of the optoelectronic semiconductor chip 500 are in each case one electrical contact for electrically contacting the optoelectronic semiconductor chip 500. The optoelectronic semiconductor chip 500 is configured to emit electromagnetic radiation in an emission direction 530 oriented perpendicularly to the top side 510 of the optoelectronic semiconductor chip 500 when an electrical voltage is applied to the optoelectronic semiconductor chip 500 via its electrical contacts.The optoelectronic semiconductor chip 500 is arranged in the base region 210 of the chip receiving space 270 of the housing 200 in such a way that the underside 520 of the optoelectronic semiconductor chip 500 faces the base region 271. In this case, the electrical contact arranged on the underside 520 of the optoelectronic semiconductor chip 500 is electrically conductively connected to the second metallization 470 arranged in the base region 271 of the chip receiving space 270 of the housing 200. A bonding wire 281 extends between the electrical contact of the optoelectronic semiconductor chip 500 arranged on the top side 510 of the optoelectronic semiconductor chip 500 and the bonding contact space 280, said bonding wire electrically conductively connecting the electrical contact arranged on the top side 510 of the optoelectronic semiconductor chip 500 to the first metallization 370.Due to the arrangement of the optoelectronic semiconductor chip 500 at the base region 271 of the chip receiving space 270 of the housing 200, the emission direction 530 of the optoelectronic semiconductor chip 500 is oriented approximately parallel to the upward direction 10. The part of the second metallization 470 arranged on the side wall 272 of the chip receiving space 270 can serve as a reflector for electromagnetic radiation emitted by the optoelectronic semiconductor chip 500. Electromagnetic radiation which is emitted by the optoelectronic semiconductor chip 500 obliquely to the upward direction 10 can be reflected at the second metallization 470 in the region of the side wall 272 of the chip receiving space 270 and thus be bundled approximately in the emission direction 530. This beam focusing is supported by the frustoconical shape of the chip receiving space 270.FIG. 2 shows a slightly schematic illustration of a first electronic device 110. Not all parts of the first electronic device 110 are shown in FIG. 2. The first electronic device 110 can be, for example, an electronic device with compact external dimensions and therefore only limited space available. The first electronic device 110 comprises the optoelectronic component 100 of FIG. 1.The first electronic device 110 includes a circuit board 600. The circuit board 600 may also be referred to as a circuit board. The printed circuit board 600 is illustrated in FIG. 2 in a sectional side view. The circuit board 600 has an upper side 610 and a lower side 620 opposite the upper side 610. The printed circuit board 600 further has a cutout 630 which forms an opening between the upper side 610 and the lower side 620. On the top side 610 of the circuit board 600, a first soldering surface 611 and a second soldering surface 612 are arranged on two opposite sides of the cutout 630. Further soldering surfaces and conductor tracks may be present on the upper side 610, which are not shown in FIG. 2.The optoelectronic component 100 is illustrated in a slightly simplified manner in FIG. 2 without the optoelectronic semiconductor chip 500 and the bond wire 281. The optoelectronic component 100 is arranged in the region of the cutout 630 of the printed circuit board 600 in such a way that the first side face 230 of the housing 200 of the optoelectronic component 100 points in the same spatial direction as the underside 620 of the printed circuit board 600. The second side surface 240 of the housing 200 points in the same spatial direction as the top side 610 of the printed circuit board 600. As a result, the top side 210 of the housing 200 of the optoelectronic component 100 is oriented perpendicularly to the top side 610 of the printed circuit board 600. The emission direction 530 of the optoelectronic semiconductor chip 500 of the optoelectronic component 100 thus runs parallel to the top side 610 of the printed circuit board 600. The orientation of the optoelectronic component 100 shown in FIG. 2 with respect to the printed circuit board 600 of the first electronic device 110 can be referred to as a sideloker arrangement.The approximately cuboidal main body of the housing 200 of the optoelectronic component 110 is arranged in the region of the cutout 630 in such a way that the first end side 250 and the second end side 260 of the housing 200 of the optoelectronic component 110 each face a side edge of the cutout 630. The second side surface 240 of the housing 200 is arranged above the top side 610 of the circuit board 600. The first side surface 230 of the housing 200 is arranged below the underside 620 of the printed circuit board 600.The first contact web 300 and the second contact web 400 of the housing 200 of the optoelectronic component 100 are supported on the top side 610 of the printed circuit board 600. In this case, the first inner side surface 330 with the first lateral soldering contact surface 331 of the first contact web 300 faces the first soldering surface 611 on the upper side 610 of the printed circuit board 600. The second inner side surface 430 with the second lateral soldering contact surface 431 of the second contact web 400 faces the second soldering surface 612 on the upper side 610 of the printed circuit board 600.A first soldered connection exists between the first lateral soldering contact surface 331 of the first contact web 300 of the optoelectronic component 100 and the first soldering surface 611 of the printed circuit board 600. A second soldered connection exists between the second lateral soldering contact surface 431 of the optoelectronic component 100 and the second soldering surface 612 of the printed circuit board 600. Preferably, a solder 613 in the region of the first solder connection not only covers a part of the first lateral solder contact surface 331 of the optoelectronic component 100, but also parts of the first outer end side 350 and / or of the first outer upper side 310 and / or of the first outer lower side 320 with the first lower solder contact surface 321 of the optoelectronic component 100. As a result, the first soldered connection can have a high mechanical stability and a low electrical resistance. Accordingly, a solder 613 preferably covers not only a part of the second lateral solder contact surface 431 on the second inner side surface 430 of the optoelectronic component 100 but also parts of the second outer end side 460 and / or of the second outer upper side 410 and / or of the second outer lower side 420 with the second lower solder contact surface 421 of the optoelectronic component 100 in the region of the second solder connection.In the arrangement of the optoelectronic component 100 shown in FIG. 2 in the region of the cutout 630 of the printed circuit board 600 of the first electronic device 110, the installation space required for the optoelectronic component 100 above the upper side 610 of the printed circuit board 600 and below the lower side 620 of the printed circuit board 600 is particularly small, since the thickness of the printed circuit board 600 between its upper side 610 and its lower side 620 is utilized in the region of the cutout 630. As a result, the first electronic device 110 can be formed with particularly compact dimensions.FIG. 3 shows a slightly schematic illustration of a second electronic device 120. Not all components of the second electronic device 120 are also shown.The second electronic device 120 comprises a printed circuit board 600 having an upper side 610 and a lower side 620 opposite the upper side 610. A first soldering surface 611 and a second soldering surface 612 are arranged on the upper side 610 of the printed circuit board 600. However, the circuit board 600 does not have a recess.The optoelectronic component 100 of FIG. 1 is arranged above the top side 610 of the printed circuit board 600 in a sideloker arrangement. The emission direction 530 of the optoelectronic semiconductor chip 500 of the optoelectronic component 100 not illustrated in FIG. 3 is oriented parallel to the top side 610 of the printed circuit board 600 of the second electronic device 120. The second side surface 240 of the housing 200, the first outer side surface 340 of the first contact web 300 and the second outer side surface 440 of the second contact web 400 of the housing 200 of the optoelectronic component 100 face the top side 610 of the printed circuit board 600. A first soldered connection exists between the first outer soldering contact surface 341 on the first outer side surface 340 of the first contact web 300 and the first soldering surface 611 of the printed circuit board 600. A second soldered connection exists between the second outer soldering contact surface 441 of the second outer side surface 440 of the second contact web 400 and the second soldering surface 612 of the printed circuit board 600. Preferably, a solder 613 in the region of the first solder connection covers not only a part of the first outer solder contact surface 341 on the first outer side surface 340 of the first contact web 340, but also a part of the first outer end side 350 and / or a part of the first outer upper side 310 and / or a part of the first lower solder contact surface 321 on the first outer lower side 320 of the first contact web 300.In addition, a solder 613 in the region of the second solder connection preferably covers not only a part of the second outer solder contact surface 441 on the second outer side surface 440 of the second contact web 400, but also parts of the second outer end side 460 and / or of the second outer upper side 410 and / or of the second lower solder contact surface 421 on the second outer lower side 420 of the second contact web 400 of the optoelectronic component 100. As a result, the soldered connections can in turn have a high mechanical robustness and low electrical resistances.FIG. 4 shows a schematic illustration of parts of a third electronic device 130. Also, the third electronic device 130 may be an electronic device having compact outer dimensions and limited internal space.The third electronic device 130 has a printed circuit board 600 illustrated in a sectioned side view, having an upper side 610 and a lower side 620 opposite the upper side 610. The printed circuit board 600 has a cutout 630 which is formed as an aperture between the upper side 610 and the lower side 620. On the upper side 610 of the printed circuit board 600, a first soldering surface 611 and a second soldering surface 612 are arranged on both sides of the cutout 630.The optoelectronic component 100 of FIG. 1 is arranged in a toploker arrangement in the region of the cutout 630 of the printed circuit board 600 of the third electronic device 130. The emission direction 530 of the optoelectronic semiconductor chip 500 of the optoelectronic component 100 which is not visible in FIG. 4 is oriented perpendicularly to the upper side 610 of the printed circuit board 600 and points in the same spatial direction as the upper side 610 of the printed circuit board 600.The top side 210 of the housing 200 of the optoelectronic component 100 is oriented parallel to the top side 610 of the printed circuit board 600 and is arranged above the top side 610 of the printed circuit board 600. The underside 220 of the housing 200 of the optoelectronic component 100 is arranged below the upper side 610 of the printed circuit board 600. The substantially cuboidal main body of the housing 200 of the optoelectronic component 100 is arranged in the region of the cutout 630 of the printed circuit board 600 in such a way that the first end side 250 and the second end side 260 of the housing 200 each face side edges of the cutout 630. As a result, the thickness of the printed circuit board 600 between its top side 610 and its bottom side 620 is utilized, resulting in a particularly space-saving arrangement of the optoelectronic component 100, in which a required installation space above the top side 610 and below the bottom side 620 of the printed circuit board 600 is particularly small.The first contact web 300 of the optoelectronic component 100 and the second contact web 400 of the optoelectronic component 100 are supported on the upper side 610 of the printed circuit board 600 outside the cutout 630 in such a way that the first outer underside 320 of the first contact web 300 and the second outer underside 420 of the second contact web 400 face the upper side 610 of the printed circuit board 600. A first soldered connection exists between the first lower soldering contact surface 321 on the first outer underside 320 of the first contact web 300 and the first soldering surface 611 of the printed circuit board 600. A second soldered connection exists between the second lower soldering contact surface 421 on the second outer underside 420 of the second contact web 400 and the second soldering surface 612 of the printed circuit board 600. Again, in addition to a part of the first lower solder contact surface 321, solder 613 of the first solder connection preferably also covers parts of the first outer end side 350 and / or of the first lateral solder contact surface 331 on the first inner side surface 330 and / or of the first outer solder contact surface 341 of the first outer side surface 340 of the first contact web 300. Accordingly, in addition to parts of the second lower solder contact surface 421 on the second outer underside 420 of the second contact strip 400, solder 613 of the second solder connection also covers parts of the second outer end side 460 and / or of the second lateral solder contact surface 431 on the second inner side surface 430 and / or of the second outer solder contact surface 441 of the second outer side surface 440 of the second contact strip 400.It is possible to form the first contact web 300 and the second contact web 400 of the housing 200 of the optoelectronic component 100 with a width 351 which corresponds to the width 251 of the end sides 250, 260 of the housing 200. In this case, the contact webs 300, 400 extend in the transverse direction 20 over the entire end faces 250, 260 of the housing 200. The optoelectronic component 100 can then be arranged in a Sideloker arrangement only above a top side 610 of a printed circuit board 600. However, in a toplooker arrangement, it may be disposed in a recess 630 of a circuit board 600 as shown in FIG. 4.Furthermore, it is also possible to form the first contact web 300 and the second contact web 400 of the housing 200 of the optoelectronic component 100 each with a height 352 which corresponds to the height 252 of the end sides 250, 260 of the housing 200 of the optoelectronic component 100. The contact webs 300, 400 then extend in the upward direction 10 over the entire end faces 250, 260 of the housing 200. The optoelectronic component 100 can then be arranged in a sideloker arrangement in a cutout 630 of a printed circuit board 600, as shown in FIG. 2, or can be arranged above a top side 610 of a printed circuit board 600, as shown in FIG. 3. In a toplooker arrangement, the optoelectronic component can likewise be arranged above a top side 610 of a printed circuit board 600.

Claims

Optoelectronic component (100) having a housing (200) with a top side (210), a bottom side (220), a first end side (250), a second end side (260) and an outer surface (230), wherein the housing (200) has a chip receiving space (270) on the top side (210), in which a optoelectronic semiconductor chip (500) is arranged, wherein the first end side (250) and the second end side (260) each extend in an upward direction (10) between the bottom side (220) and the top side (210), wherein a projecting first contact web (300) is formed on the first end side (250) and a projecting second contact web (400) is formed on the second end side (260), wherein the first contact web (300) and the second contact web (400) are at most half as wide as the first end face (250) and the second end face (260) in a transverse direction (20) oriented perpendicularly to the upward direction (10), wherein the housing (200) has a first soldering contact surface (331), a second soldering contact surface (431), a third soldering contact surface (321) and a fourth soldering contact surface (421), wherein the first soldering contact surface (331) and the second soldering contact surface (431) point in the same spatial direction as the outer surface (230), wherein the first soldering contact surface (331) and the second soldering contact surface (431) are set back against the outer surface (230), wherein the third soldering contact surface (321) and the fourth soldering contact surface (421) point in the same spatial direction as the lower surface (220), wherein the third solder contact surface (321) and the fourth solder contact surface (421) are set back with respect to the underside (220), wherein the first solder contact surface (331) is formed by a first metallization (370) arranged on the first contact web (300) on the surface of the housing (200), wherein the second solder contact surface (431) is formed by a second metallization (470) arranged on the second contact web (400) on the surface of the housing (200), wherein the housing (200) comprises an electrically insulating plastic material and is coated in sections with the metallizations (370, 470).Optoelectronic component (100) according to Claim 1, wherein the optoelectronic semiconductor chip (500) is electrically conductively connected to the first metallization (370) by a bonding wire (281).Optoelectronic component (100) according to either of Claims 1 and 2, wherein the second metallization (470) forms an optical reflector in the region of the chip receiving space (270).Optoelectronic component (100) according to one of the preceding claims, wherein the first contact web (300) and the second contact web (400) are arranged uncentrated in the transverse direction (20) on the first end side (250) and the second end side (260).Optoelectronic component (100) according to one of the preceding claims, wherein the first metallization (370) extends over all outer surfaces (310, 320, 330, 340, 350) of the first contact web (300) and / or the second metallization (470) extends over all outer surfaces (410, 420, 430, 440, 460) of the second contact web (400).Optoelectronic component (100) according to one of the preceding claims, wherein the chip receiving space (270) is formed as a substantially funnel-shaped depression.Optoelectronic component (100) according to one of the preceding claims, wherein the first contact web (300) and the second contact web (400) have a lower height (352) in the upward direction (10) than the first end side (250) and the second end side (260), wherein the third solder contact surface (321) is formed on the first contact web (300) and the fourth solder contact surface (421) is formed on the second contact web (400).Optoelectronic component (100) according to claim 7, wherein the first contact web (300) and the second contact web (400) are arranged uncentrated in the upward direction (10) at the first end side (250) and the second end side (260).Optoelectronic component (100) according to one of claims 7 and 8, wherein the first contact web (300) and the second contact web (400) are at most half as high as the first end side (250) and the second end side (260) in the upward direction (10).Electronic device (110, 130) having a printed circuit board (600) which has a cutout (630), wherein an optoelectronic component (100) according to one of the preceding claims is arranged in the cutout (630).

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