Method for manufacturing an electronic device and electronic device obtainable therefrom

Abstract

Method for manufacturing an electronic device, comprising the following steps: b) Applying a crack-forming coating (7) to a first support substrate (1) in first areas and drying the crack-forming coating (7), wherein the coating forms numerous cracks (8) in the form of a tightly meshed, continuous network during drying; c) Applying a metallization (9) to the first support substrate obtained in step b) in such a way that - in further areas outside the cracked coating, the metal is deposited on the substrate; and - in the areas of the cracked coating, the metal is deposited within the cracks on the substrate and outside the cracks above the cracked coating; d) separate provision of a second support substrate (14) which is provided with an adhesive coating (15); e) Fixing the separately provided second support substrate (14) by means of the adhesive coating (15) to the cracked coating of the first support substrate obtained according to steps b) and c); f) Detaching the second support substrate (14, 15) having the adhesive coating together with metal adhering to the adhesive coating (15) from the first support substrate (1), such that the resulting first support substrate is such that it - in the first areas has a transparent, conductive metallization (9) in the form of a tightly woven, continuous network; - in the further areas that do not belong to the first areas, exhibits an opaque, conductive metallization (9).

Description

[0001] The invention relates to a method for producing an electronic device and to an electronic device obtainable according to the method.

[0002] Electronic devices, especially semiconductor structures, solar cells, or electrodes, can be obtained, for example, using the lift-off process, which is well-known in the field of semiconductor manufacturing. Typically, the structuring of a soluble coating in the lift-off process is achieved by exposing the soluble coating to light in certain areas and then structuring it in a development step. A method for finely structuring vapor-deposited material has recently been described in the literature: KDM Rao, C. Hunger, R. Gupta, GU Kulkarni, M. Thelakkat: “A cracked polymer templated metal network as a transparent conducting electrode for ITO-free organic solar cells,” Phys. Chem. Chem. Phys., 2014, Volume 16, pages 15107-15110; and S. Kiruthika, R. Gupta, KDM Rao, S. Chakraborty, N. Padmavathy, GU Kulkarni: “Large area solution processed transparent conducting electrode based on highly interconnected Cu wire network”, J. Mater. Chem. C, 2014, Volume 2, pages 2089-2094.

[0003] According to the above literature, a coating is first applied to a film, which, upon drying, forms numerous cracks. These cracks form a dense, interconnected network. During subsequent vapor deposition of a material, the material is deposited both on (i.e., above) the coating and in the cracks. When the coating is removed, e.g., by washing with suitable solvents, the vapor-deposited material above the coating is also removed. Only the vapor-deposited material present in the crack lines remains.

[0004] WO 2010 / 034945 A1 and WO 2010 / 034944 A1 use a crack-forming material, whereby metal is applied to the cracked layer, so that after washing away the cracked layer, metallized areas are formed next to the metallized cracks. DE 103 49 963 A1 teaches the use of a structured adhesive layer to selectively remove a corresponding portion of a conductive layer.

[0005] The present invention is based on the object of improving the manufacturing process known in the prior art. In particular, it is intended to provide more advanced electronic devices.

[0006] This object is achieved by the combinations of features defined in the independent claims. Further developments of the invention are the subject of the dependent claims.

[0007] The method for manufacturing an (opto)electronic device comprises the following steps: a) providing a first carrier substrate; b) applying a crack-forming coating to the first carrier substrate in first areas forming a first motif and drying the crack-forming coating, wherein the coating forms numerous cracks in the form of a dense, interconnected network upon drying; c) applying a metallization to the first carrier substrate obtained in step b) in such a way that - in the areas outside the cracked coating, the metal is deposited on the carrier substrate; and - in the areas of the cracked coating, the metal is deposited within the cracks on the carrier substrate and d) separately providing a second carrier substrate provided with an adhesive coating; e) fixing the separately provided second carrier substrate by means of the adhesive coating to the cracked coating of the first carrier substrate obtained after steps a), b) and c); f) detaching the second carrier substrate having the adhesive coating together with metal adhering to the adhesive coating from the first carrier substrate, so that the resulting first carrier substrate is such that it - in the first areas forming a first motif, it has a transparent, conductive metallisation in the form of a dense, interconnected network; - has an opaque, conductive metallization in the areas which are not part of the first areas forming a first motif.

[0008] The crack-forming coating can be applied using printing technology, in particular by gravure printing, flexographic printing or by an inkjet process.

[0009] The term “opaque or continuous metallization” refers to a full-surface or continuous metal layer which, in particular, has a uniform layer thickness.

[0010] The provided carrier substrate can, in particular, be transparent, semi-transparent, or opaque. The carrier substrate can, for example, be a glass substrate, a film, or a multilayer structure. The multilayer structure can, in particular, comprise functional organic and / or inorganic layers that constitute part of an (opto)electronic device, e.g., a solar cell.

[0011] The step of removing the metal is carried out by means of a separately provided device having an adhesive layer, wherein the device is fixed to the material of the carrier substrate to be removed by means of the adhesive layer and, after fixing, is peeled off from the carrier substrate together with the material to be removed from the carrier substrate. Detailed description of the invention

[0012] The present invention is based on the idea of ​​applying technologies known in the field of security element production for valuable documents for the fine structuring of metallizations to provide (opto)electronic devices. These technologies include, among others, the use of a (photo)resist, the use of an etching medium, and the use of wash ink.

[0013] Security elements with characters that are visually recognizable in transmitted light and, where appropriate, also in reflected light are known. The characters can have any shape, such as numbers, letters, patterns, geometric or figurative representations, etc., and are generally referred to as "negative writing" regardless of their shape. The security elements are produced, for example, by providing a transparent substrate with a coating, generally a metallic coating (or metallization), which is then removed again at certain points. If the security element is held up to the light, the areas with the metallic or other coating appear dark. The areas where the coating has been removed, in contrast, appear light or at least significantly lighter than the coated areas, depending on the transparency of the substrate. The more transparent, i.e.The more translucent a substrate is, the more pronounced the contrast between coated and uncoated areas. On very transparent substrates, the negative writing is clearly visible not only in transmitted light but also in reflected light.

[0014] During vapor deposition processes, metallic coatings are essentially created over the entire surface. In the simplest case, the provision of recesses within the metallic coating can be achieved by inserting a cover or a shielding plate during the vapor deposition process. This measure only results in coarsely structured metallizations. Visually appealing security elements, however, require fine structuring. Finely structured metallizations can be created, for example, through etching processes. In a first step, the metal to be structured is applied over the entire surface of the substrate and, in a second step, coated with a suitable resist in specific motif areas. In a third step, the metal in the areas not protected by the resist is removed (or chemically converted) using an etching medium.The resist can also be applied over the entire surface and selectively modified by exposure in such a way that specific areas of the resist are selectively removed and the underlying metallization can be etched accordingly. The use of photoresist layers in security element production is known, for example, from EP 2 049 345 B1.

[0015] The fine structuring of a metallization can also be achieved using a so-called washing process. WO 99 / 13157 A1 describes a washing process in which a carrier film is printed with a high-pigment ink in the form of characters, coated with a thin cover layer (e.g., aluminum), and then the ink, along with the overlying cover layer, is removed by washing with a liquid to create coating-free areas in the form of characters.

[0016] WO 92 / 11142 A1 (corresponding to EP 0 516 790 A1) and its German priority application DE 4 041 025 A1 disclose heat-activatable printing inks, for example, wax-containing emulsions. Upon heating, these emulsions soften and thereby reduce their adhesion to the carrier film, so that in these poorly adhering areas, both the softened printing ink and the overlying layers can be removed with the aid of mechanical treatment, such as ultrasound, brushing, or rubbing. Furthermore, inks with foaming additives, such as those commonly used in the production of foams, are disclosed as activatable printing inks. These blowing agents release gas under the influence of heat and create foam structures.This increases the volume of the printing ink, reducing its adhesion to the carrier film and causing the layers above the printing ink to bulge outwards, providing a good point of attack for mechanical removal.

[0017] WO 97 / 23357 A1 refers to EP 0 516 790 A1 and further discloses activatable printing inks which are activated, i.e. washed out, by treatment with a suitable solvent.

[0018] According to the invention, a dispersion, more preferably a colloidal dispersion, is preferably used as the crack-forming coating. Dispersions of SiO2 nanoparticles or acrylic resin nanoparticles, for example, are particularly suitable. Furthermore, the crack-forming coating can be based on a polymer in solution. The polymer solution is applied to the substrate, e.g., by printing, to create a thin polymer film. The thin polymer film forms cracks during drying.

[0019] Crack formation depends on the choice of raw materials and substrate, the layer thickness of the crack-inducing coating, and the drying parameters. The line thicknesses achievable at the end of the manufacturing process, for example in the case of silver, range from 1 µm to 50 µm, whereby the lines are generally so fine that they are only recognizable as lines using a magnifying glass. The human eye cannot resolve the individual lines on a surface, but a difference can be seen in both incident light (or reflection) and transmitted light (or transmission) compared to the untreated or bare film. Because the fine lines form an irregular, coherent network, undesirable diffraction effects do not occur. By varying the island size and the crack width, the reflectivity or light transmittance can be adjusted as appropriate.

[0020] Compared to a conventional, full-surface, and very thin metal layer (hereinafter also referred to as "semitransparent metallization"), which exhibits constant optical reflection and transmission, the metallized network structure according to the invention is extremely advantageous in terms of its significantly higher chemical resistance. The metal in the metal lines is present in the "normal" layer thickness, whereas conventional semitransparent metallization is very thin and thus susceptible to corrosion, especially in the case of Al and Cu.

[0021] The inventive metallization, in the form of a dense, interconnected network, exhibits electrical conductivity and optical transmission comparable to a full-surface ITO layer. The fine metallic lines can be used in combination with conventional embossing lacquers, conventional primer compositions, and conventional heat-sealing lacquers, thereby acting as a reflector.

[0022] According to a first preferred embodiment for producing an (opto)electronic device, a wash ink is applied to a carrier substrate, such as a glass substrate, a film, or a multilayer structure, in first regions forming a first motif. A crack-forming coating is then applied to the carrier substrate in second regions forming a second motif, and the crack-forming coating is dried, whereby the coating forms numerous cracks in the form of a dense, interconnected network upon drying. These steps for creating the first and second regions can also be performed in reverse order, i.e., the crack-forming coating is applied to the carrier substrate first, followed by the wash ink application. Metal is vapor-deposited onto the substrate treated in this way (alternatively, the metal can also be applied wet-chemically).The metal is deposited both above the cracked coating and within the cracks. Outside the first and second regions, the metal is deposited onto the carrier substrate. The cracked coating is then removed, along with the metal deposited above the coating. The wash ink is also removed. Removal can be achieved, for example, by washing with a suitable solvent. After removing the cracked coating and the wash ink, the carrier substrate, which is provided with a metallic network structure on the one hand and a continuous metallization on the other, can optionally be overcoated with a conventional primer composition or with a layer whose refractive index differs significantly from the refractive index of the embossing lacquer layer.An overcoating with a metal that has a different color than the metal of the metallic mesh structure could also be applied. In this case, the viewer would see a mixed color. During further processing of the security element, additional primer layers and / or heat-sealing lacquer layers can be applied. Other optical effects, such as fluorescence, are also easily achieved by applying additional effect layers, since the reflector used, i.e., the metallic mesh structure, is only partially present.

[0023] The process for removing the wash paint and the cracked coating is advantageously carried out by dissolving it with a suitable solvent. The choice of solvent is expediently tailored to the coating. Typically, the following solvents can be used: methyl acetate, ethyl acetate, propyl acetate, butyl acetate, methoxypropyl acetate, acetone, methyl ethyl ketone, methyl isobutyl ketone, cyclopentanone, cyclohexanone, methylene chloride, chloroform, toluene, xylene, methanol, ethanol, 2-propanol. Furthermore, acetals or mixtures of the aforementioned solvents can be used. Alternatively, the cracked coating can also be removed by subsurface infiltration. In this case, in addition to the solvents mentioned, aqueous solutions, mixtures of solvents and water, if necessary with surfactants, if necessary with defoamers and other additives can be used.Dissolution of the cracked coating can also be assisted by spray nozzles or mechanically by brushes, rollers or felts.

[0024] According to a second preferred embodiment for producing an (opto)electronic device, a crack-forming coating is applied to a carrier substrate, such as a glass substrate, a film, or a multilayer structure, in first regions forming a first motif. After drying the crack-forming coating, during which the coating forms numerous cracks in the form of a dense, interconnected network, a metallization is applied in such a way that - in the areas outside the cracked coating, the metal is deposited on the carrier substrate; and - in the areas of the cracked coating, the metal is deposited inside the cracks on the carrier substrate and outside the cracks is deposited above the cracked coating.

[0025] A second carrier substrate provided with an adhesive coating is provided separately. The separately provided second carrier substrate is then fixed to the cracked coating of the first carrier substrate obtained above by means of the adhesive coating. The second carrier substrate having the adhesive coating is then detached from the first carrier substrate, together with the metal adhering to the adhesive coating, so that the resulting first carrier substrate is such that it has - in the first regions forming a first motif, a transparent, conductive metallization in the form of a dense, interconnected network; - has an opaque, conductive metallization in the areas which are not part of the first areas forming a first motif.

[0026] In the removal process described above by lamination (or bonding) and separation winding, the second, separate substrate, e.g. a film, is coated over a large area with a coating that is adhesive under the lamination (or bonding) conditions. The term “large area” means that the area is at least as large as the surface area of ​​the crack-forming layer to be removed. The layer thickness of the adhesive coating, after any physical drying that takes place, is e.g. 0.4 µm to 4 µm. In this process, the metal lying on the crack-forming coating bonds with the adhesive coating. The crack-forming coating acts as a spacer between the carrier substrate and the metal deposited directly on the carrier substrate. Depending on the choice of crack-forming coating, the subsequent separation winding either peels off the metal from the crack-forming coating or completely peels off the crack-forming coating.After separation winding, the adhesive-coated film (i.e., the second, separate substrate) retains at least the negative image of the metal. The film can be further processed if necessary. The film is metallic with very high reflection (e.g., higher than 85%), but is not electrically conductive. General remarks:

[0027] The metallization of the (opto)electronic device according to the invention can be based on a single metal. Suitable metals include, for example, aluminum, silver, copper, nickel, iron, chromium, cobalt, gold, titanium, tin, zinc, or an alloy of one or more of the aforementioned elements (e.g., an iron-silicon alloy). Furthermore, the metallization can be based on a multilayer metallization, obtainable, for example, by successive vapor deposition. An advantageous multilayer metallization is, for example, a Cr layer followed by an Al layer. The adhesion of the Al layer to the layer structure is improved by the Cr layer.

[0028] Furthermore, the electrical conductivity of the inventive metallization in the form of a dense, interconnected network can be improved by additional coating with an electrically conductive polymer. A suitable electrically conductive polymer is, for example, a thiophene-based electrically conductive polymer such as poly-3,4-ethylenedioxythiophene (PEDOT or PEDT). Alternatively, inorganic, transparent, and conductive layers, e.g., metal oxides such as titanium dioxide, indium tin oxide, or fluorine tin oxide, can be applied. These additional layers can also serve to controllably modify the electrical properties of the inventive metallization, such as the work function.

[0029] In the manufacturing method according to the invention, metal is deposited within the cracks of the cracked coating; if necessary, metal is also deposited above the cracked coating. The cracked coating is then removed, along with any metal deposited above the coating. The removal step is carried out using a separately provided device having an adhesive layer. The device is fixed to the cracked coating of the carrier substrate to be removed by means of the adhesive layer. After fixing, the device is peeled off the carrier substrate together with the cracked coating.

[0030] In the manufacturing method according to the invention, the carrier substrate can be provided with a crack-forming coating in certain areas. Furthermore, the carrier substrate can be additionally provided with a transparent lacquer that does not form cracks in certain areas (which are arranged, in particular, outside the areas of the crack-forming coating). After the step of applying a metallization, the step of removing the metallization located above the cracked coating on the one hand and above the transparent lacquer on the other hand follows. This step is carried out using the previously described, separately provided device having an adhesive layer. In this way, an optoelectronic device can be produced that has no metallization whatsoever in the area of ​​the transparent lacquer.This procedure is particularly advantageous in the manufacturing process according to the aspect of the invention described above.

[0031] The transparent, conductive metallization obtained in the inventive manufacturing process in the form of a dense, interconnected network can be subsequently removed in specific areas using laser radiation (so-called laser demetallization). In this way, structuring of the transparent, conductive metallization is possible, i.e., vacancies or demetallized areas can be provided. Likewise, the opaque or continuous, conductive metallization obtained in the inventive manufacturing process can be subsequently removed in specific areas using laser radiation. In this way, structuring of the opaque or continuous, conductive metallization is possible, i.e., vacancies or demetallized areas can be provided.

[0032] The electronic device can be referred to as an optoelectronic device, particularly due to its optical properties. The electronic device can be an optronic device, i.e., it can operate electronically and using light (e.g., a hybrid circuit with active light elements / conductors), it can operate electronically and be influenced by light (e.g., a light sensor, light switch), or it can operate electronically and process light (solar cell, light coupler, light filter, etc.). The partially transparent nature of the electronic device can, however, also serve as a purely passive element, e.g., for optical design or as a see-through area (for the viewer) of the electronic device. A pattern formed by conductive or non-conductive areas can be referred to as a motif.

[0033] Further embodiments and advantages of the invention are explained below with reference to the figures, in which a true-to-scale and true-to-proportion reproduction has been omitted in order to increase clarity.

[0034] They show: Fig. 1 the individual manufacturing steps for obtaining a transparent, conductive metallization in the form of a dense, interconnected network; Fig. 2 a transparent, conductive metallization in the form of a dense, interconnected network, schematically in plan view in an enlarged representation; Fig. 3-4 a manufacture of an electronic device according to the invention; Fig. 5 the electronic device of Fig. 4 in plan view; Fig. 6-9 shows a further production of an electronic device according to the invention; Fig. 10-12 a variant of the one in the Fig. 6, Fig. 7 and Fig. 9, whereby a transparent varnish is additionally used.

[0035] Fig. Figure 1 illustrates the individual manufacturing steps for obtaining a transparent, conductive metallization in the form of a dense, interconnected network. In a first step, the carrier substrate 1 is provided with a crack-forming coating 2. The crack-forming coating 2 is based, for example, on dispersions of SiO2 nanoparticles or acrylic resin nanoparticles. The application of the crack-forming coating 2 is preferably carried out by printing technology, e.g., by means of gravure printing, flexographic printing, or by means of an inkjet process. The crack-forming coating 2 forms numerous cracks 3 in the form of a dense, interconnected network upon drying. In a second step, a metallization 4 is applied. The metallization 4 is Fig. 1 is schematically represented in the form of individual black dots. The metallization 4 is deposited, on the one hand, above the cracked coating 2 and, on the other hand, within the cracks 3 of the coating 2. In a third step, the cracked coating 2, including the metallization 4 present above the coating 2, is removed. A transparent, conductive metallization 5 remains on the carrier substrate 1 in the form of a dense, interconnected network.

[0036] Fig. 2 shows the transparent, conductive metallization 5 in the form of a dense, interconnected network schematically in plan view in an enlarged representation.

[0037] Fig. 3 to 5 illustrate the manufacture of a security element according to the first aspect of the invention.

[0038] According to the Fig. 3, a carrier substrate 1 is printed with wash ink 6 in the form of a motif. Subsequently, additional motif elements are printed using a crack-forming coating 7. Upon drying, the crack-forming coating 7 forms numerous cracks 8 in the form of a dense, interconnected network.

[0039] This is followed by the step of metallization, e.g. by vapor deposition of metal 9. The metallization 9 is deposited on the one hand above the cracked coating 7 and above the wash color 6 and on the other hand is deposited within the cracks 8 of the coating 7.

[0040] Fig. Figure 4 shows the resulting (opto)electronic device after removing the wash-on ink 6 and the cracked coating 7 with a suitable solvent. An (opto)electronic device with the following areas is obtained: - first areas 10 forming a “true” negative writing (ie recesses or areas without any metal) without electrical conductivity; - second, metallic areas 11 with electrical conductivity; - third areas 12, which form a negative writing or a transparent area with electrical conductivity, produced by a metallic mesh structure.

[0041] Fig. 5 shows the (opto)electronic device of the Fig. 4 in top view.

[0042] Fig. Figures 6 to 9 illustrate the manufacture of an (opto)electronic device according to the second aspect of the invention. The cracked coating is removed not using a solvent, but by detachment in the form of a type of lamination (or bonding) and separation winding.

[0043] According to the Fig. 6, a carrier substrate 1 is printed with a crack-forming coating 7 in the form of a motif. Upon drying, the crack-forming coating 7 forms numerous cracks 8 in the form of a dense, interconnected network. This is followed by the metallization step, e.g., by vapor deposition of metal 9. The metallization 9 is deposited, on the one hand, above the cracked coating 7 and above the carrier substrate 1, and, on the other hand, is deposited within the cracks 8 of the coating 7.

[0044] According to the Fig. 7 Now the gluing of the Fig. 6, a precursor of an (opto)electronic device with a separate device 13, which has a substrate 14 (e.g., a film) provided with an adhesive coating 15. The metal lying on the cracked coating 7 bonds to the adhesive coating 15. The cracked coating 7 serves as a spacer to the carrier substrate 1 and the metal deposited directly on the carrier substrate 1.

[0045] Depending on the choice of the crack-forming coating 7, the subsequent separation winding either results in the metal being pulled off the cracked coating 7 (see Fig. 8) or to completely remove the cracked coating 7 (see Fig. 9).

[0046] Fig. 10-12 show a variant of the Fig. 6, Fig. 7 and Fig. 9, whereby a transparent varnish is additionally used.

[0047] According to the Fig. 10, a carrier substrate 1 is printed with a crack-forming coating 7 in the form of a motif. The crack-forming coating 7 forms numerous cracks 8 in the form of a dense, interconnected network upon drying. Additionally, the carrier substrate 1 is provided with areas 16 of a transparent lacquer. The transparent lacquer 16 does not form cracks. This is followed by the metallization step, e.g., by vapor deposition of metal 9. The metallization 9 is deposited, on the one hand, above the cracked coating 7, above the transparent lacquer 16, and above the carrier substrate 1, and, on the other hand, is deposited within the cracks 8 of the coating 7.

[0048] According to the Fig. 11 the gluing of the Fig. 10, with a separate device 13 comprising a substrate 14 (e.g., a film) provided with an adhesive coating 15. The metal lying on the cracked coating 7 and the metal lying on the transparent lacquer 16 bond to the adhesive coating 15.

[0049] During the subsequent separation winding, the metal is removed from the cracked coating 7 and from the transparent lacquer 16 (see Fig. 12). The (opto)electronic device obtained in this way has no metallization in the region 16 of the transparent resist.

[0050] Of course, the transparent lacquer 16 can be selected with regard to its physical properties in such a way that the separation winding either results in the metal being pulled off the transparent lacquer 16 (see Fig. 12) or to completely remove the transparent varnish 16 (similar to the Fig. 9 shown).

Claims

[1] A method of manufacturing an electronic device, comprising the following steps: b) applying a crack-forming coating (7) to a first carrier substrate (1) in first regions and drying the crack-forming coating (7), wherein the coating forms numerous cracks (8) in the form of a dense, interconnected network during drying; c) applying a metallization (9) to the first carrier substrate obtained in step b) in such a way that - in further areas outside the cracked coating, the metal is deposited on the carrier substrate; and - in the areas of the cracked coating, the metal is deposited inside the cracks on the carrier substrate and outside the cracks is deposited above the cracked coating; d) separately providing a second carrier substrate (14) provided with an adhesive coating (15); e) fixing the separately provided second carrier substrate (14) by means of the adhesive coating (15) to the cracked coating of the first carrier substrate obtained after steps b) and c); f) detaching the second carrier substrate (14, 15) having the adhesive coating together with metal adhering to the adhesive coating (15) from the first carrier substrate (1), so that the resulting first carrier substrate is such that it - in the first regions has a transparent, conductive metallization (9) in the form of a dense, interconnected network; - in the other areas which do not belong to the first areas, it has an opaque, conductive metallization (9). [2] A method according to claim 1, comprising: a) applying a further coating (16), formed by a transparent lacquer, to the carrier substrate (1) in third areas; wherein in step c) of applying a metallization (9) in the third regions - outside the first regions and outside the second, further regions - the metal is deposited onto the further coating (16); and wherein in the step of detaching f) the metal in the third regions is removed so that the resulting carrier substrate has no metallization (9) in the third regions. [3] Method according to claim 2, wherein in the step of detaching f) the metal detaches from the further coating (16) or the metal detaches together with the further coating (16) from the first carrier substrate (1). [4] Method according to one of claims 1 to 3, wherein in the step of detaching f) the metal detaches from the crack-forming coating (7) or the metal detaches together with the crack-forming coating (7) from the first carrier substrate (1). [5] Method according to one of claims 1 to 4, wherein the application of the crack-forming coating (7) is carried out by printing, in particular by means of gravure printing, flexographic printing or by means of an inkjet process. [6] Method according to one of claims 1 to 5, wherein a line thickness of the densely meshed interconnected network is selected such that the human eye does not resolve the individual lines in the area, but a difference compared to the untreated first carrier substrate (1) can be seen both in incident light and in transmitted light. [7] Method according to one of claims 1 to 6, wherein the transparent, conductive metallization (9) in the first regions and / or the opaque, conductive metallization (9) in the second regions is subsequently removed by means of laser radiation in certain subregions. [8] An electronic device manufactured by a method according to any one of claims 1 to 7.

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