SUBSTANCE INSPECTION DEVICE

Abstract

Substrate testing device (21) arranged upstream of a component assembly machine (22) used to mount an electronic component (4) onto a solder (3, 3a, 3b) printed onto a substrate (1) by a solder printing machine (11), and designed to test a thermosetting adhesive (6, 6a) applied to the substrate (1) and the solder (3, 3a, 3b), wherein the substrate testing device (21) comprises: an irradiation unit (32) designed to irradiate at least the solder (3, 3a, 3b) and the adhesive (6, 6a) with light; an imaging unit (33) designed to capture an image of at least the solder (3, 3a, 3b) and the adhesive (6, 6a) being illuminated by the light; an actual plumb position information generation unit (45) designed to generate actual plumb position information (Pjh), which is position information of a plumb group (5, 5a) containing two or more plumb bobs (3, 3a, 3b) and on which the electronic component (4) is mounted, based on image data acquired by the imaging unit (33); an ideal solder inspection reference information generating unit (46) designed to generate ideal solder inspection reference information (Krh) specifying a reference inspection position and / or reference inspection area of ​​the solder (3, 3a, 3b) contained in the solder group (5, 5a) based on design data or manufacturing data; and an ideal adhesive test reference information generating unit (47) designed to generate ideal adhesive test reference information specifying a reference test position and / or reference test area of ​​the adhesive (6, 6a) based on the design data or the manufacturing data, wherein the adhesive (6, 6a) has a curing temperature that is set higher than the melting temperature of the solder (3, 3a, 3b), Information based on the magnitude and direction of a position misalignment of the actual solder position information (Pjh) relative to ideal solder position information (Prh), which specifies a position of the solder group (5, 5a) in the design data or in the manufacturing data, is output to the component assembly machine (22) as assembly position setting information (Cji), which specifies the magnitude and direction of a position misalignment of expected assembly position information, which specifies an expected assembly position of the electronic component (4) that is produced on the basis of actually printed solders, relative to ideal assembly position information, which specifies an ideal assembly position of the electronic component (4) to be mounted on the solder group (5, 5a).wherein the ideal mounting position of the electronic component (4) is generated on the basis of solder positions in the design data or manufacturing data, and , an investigation of the respective solders (3, 3a, 3b) contained in the solder group (5, 5a) is carried out on the basis of actual investigation reference information obtained by shifting the ideal solder investigation reference information (Krh) around the assembly position setting information (Cji), and an investigation of the adhesive (6, 6a) is carried out on the basis of the ideal adhesive investigation reference information.

Description

Technical field

[0001] The present invention relates to a substrate testing device designed to test a substrate such as a printed circuit board or similar. State of the art

[0002] A general procedure for mounting electronic components onto a printed circuit board (PCB) begins by printing solder paste onto electrode patterns laid out on the PCB. The procedure then temporarily adheres the electronic components to the printed PCB, taking into account the viscosity of the solder paste. A heat-curing adhesive may be applied to the PCB to prevent the electronic components from detaching when the PCB, with the mounted electronic components, passes through a predetermined reflow oven. After the electronic components are mounted, the PCB is fed into the reflow oven for a predetermined reflow soldering process. Generally, each electronic component has multiple electrode sections (electrodes and traces). The respective electrode sections are bonded to different portions of the solder paste.Accordingly, an electronic component is mounted on a respective solder group, which consists of several solder paste parts.

[0003] An investigation into the application quality of the adhesive and the printing quality of the solder paste is carried out in a stage prior to the reflow process. A known testing device for performing such an investigation uses an investigation algorithm to determine the printing quality of the solder paste in order to investigate the application quality of the adhesive (see, for example, JP 2002 - 328 100 A).

[0004] A proposed test device for examining the print quality of solder paste incorporates the use of a self-aligning effect during the reflow process. This self-alignment is achieved by a function that causes the solder paste to melt during the reflow process, becoming wet and spreading along the surface of the electrode pattern. A proposed configuration of this type of test device offsets or shifts a reference position of an investigation by a predetermined amount with respect to a given electronic component (with respect to a given solder group) relative to the positions of an actual printed solder paste and examines the print quality of each solder paste portion based on this shifted reference position (see, for example, JP 2009 - 192 282 A).This testing device outputs information regarding a position that is displaced by a predetermined amount from a mounting reference position of an electronic component to a component assembly machine as information regarding the mounting position of the electronic component.

[0005] JP H08 - 130 363 A discloses a method for firmly soldering an electronic part without impairing a self-alignment effect, wherein the curing temperature of the joining material used for the temporary attachment of an electronic part to a circuit board is set higher than the melting point of the solder, and the holding force of the joining material at a temperature at which the solder melts is set lower than that at room temperature.

[0006] JP 2002-271 096 A discloses a mounting method for electronic components that utilizes a self-alignment effect. When solder paste is printed onto a printed circuit board with contact pads and electronic components are mounted on it, the position of the printed solder paste on the circuit board is detected in order to mount the electronic components relative to the position of the printed solder paste.

[0007] JP 2015-119134A discloses a mounting system for electronic components. In this system, during the assembly of the electronic components, an adhesive for attaching the light-emitting element to the substrate is applied between contact points on a top surface of the substrate via a soldered connection. A positional displacement of a light-emitting component within the light-emitting element is detected, and the position of the light-emitting element is determined based on an image of its back side. When the light-emitting element is packed onto the substrate, it is aligned by utilizing the detected positional displacement and its position, being moved only by the amount of the displacement.The adhesive is then cured, a solder is melted in the state in which the light-emitting element is fixed, and a connection of the light-emitting element and the contact surface of the substrate are joined.

[0008] DE 10 2008 050 836 A1 discloses a device for inspecting solder applied by printing, comprising: a storage medium, an ideal solder information generation unit, and an image processing unit. Design data is stored in the storage medium. The ideal solder information generation unit generates "ideal solder position information" and an "ideal solder size" from the ideal solder areas in the design data. The image processing unit extracts the actual solder areas on the printed circuit board K from image data acquired by a CCD camera and generates "actual solder position information" from the actual solder areas.The image processing unit generates "position deviation amounts" between the "ideal solder position information" and the "actual solder position information", generates "print deviation rates" which indicate the extent of the "position deviation amounts" relative to the "ideal solder sizes", calculates a correction value with respect to a print position based on the "print deviation rates" and outputs a correction value signal to the solder printing machine.

[0009] US Patent 6,225,573 B1 discloses a method for mounting a connector on a printed circuit board (PCB). The method includes a coating step for applying solder paste to the PCB, a layering step for layering a connector end onto the solder paste-coated areas, and a heating step for heating and melting the solder paste to solder the connector end to the PCB. A further step for applying adhesive to the PCB is also included, and in the layering step, the connector end is brought into contact with the adhesive-coated areas. In the heating step, the solder paste is heated and melted while the connector end is bonded to the PCB by the adhesive. Summary Technical Problem

[0010] If the curing temperature of the adhesive is lower than the melting temperature of the solder paste, the adhesive will cure before the solder paste melts. This likely leads to insufficient utilization of the self-aligning effect. Consequently, outputting information to the component assembly machine regarding the position, which is offset by a predetermined amount from the mounting reference position of the electronic component, results in the electronic component being mounted in the wrong position.

[0011] If the curing temperature of the adhesive is higher than the melting temperature of the solder paste, the self-aligning effect is likely to be utilized. Provided that the self-aligning effect is utilized, a technique applicable to investigating the application quality of the adhesive can apply the investigation procedure of the latter investigation device (described in JP 2009 - 192 282 A) to the investigation procedure of the former investigation device (described in JP 2002 - 328 100 A). More precisely, this applicable technique can shift information by a predetermined amount relative to a reference position of an investigation, according to an investigation algorithm used to determine the printing quality of the solder paste, and investigate the application quality of the adhesive based on the information relative to the shifted reference position.

[0012] While the solder paste and electronic component are moved by self-alignment, the adhesive generally remains stationary. Consequently, adhesive applied in an unsuitable position is unlikely to be moved to a suitable position by self-alignment after the reflow process. Therefore, an investigation of adhesive application quality based on information regarding the displaced reference position, as described above, is likely to result in an error. Even if, for example, the investigation indicates "good application quality," the actual adhesive application quality may be poor.

[0013] Taking into account the circumstances described above, it is an object of the present invention to provide a substrate testing device designed to reliably mount an electronic component in a suitable position and to adequately examine at least the application quality of an adhesive. This object is achieved by a substrate testing device having the features of claim 1. The dependent claims are directed to advantageous embodiments of the invention. Solution to the problem

[0014] The following section describes various aspects that are equally designed to solve the problems described above. Functions and beneficial effects that are properties of each aspect are also described as needed.

[0015] Aspect 1. A substrate inspection device is provided, arranged upstream of a component assembly machine used to mount an electronic component onto a solder printed onto a substrate by a solder printing machine, and designed to inspect a thermosetting adhesive applied to the substrate and the solder. The substrate inspection device comprises: an irradiation unit designed to irradiate at least the solder and the adhesive with light; an imaging unit designed to capture an image of at least the solder and the adhesive being irradiated with light;an actual solder position information generating unit designed to generate actual solder position information, which is position information of a solder group containing two or more solders and on which the electronic component is mounted, based on image data acquired by the imaging unit; an ideal solder examination reference information generating unit designed to generate ideal solder examination reference information, which specifies a reference examination position and / or reference examination area of ​​the solder contained in the solder group, based on design or manufacturing data;and an ideal adhesive test reference information generation unit designed to generate ideal adhesive test reference information specifying a reference test position and / or reference test area of ​​the adhesive, based on the design data or the manufacturing data.

[0016] The adhesive has a curing temperature that is set higher than the melting temperature of the solder.

[0017] Information based on the magnitude and direction of a position misalignment of the actual solder position information relative to ideal solder position information, which specifies a position of the solder group in the design data or in the manufacturing data, is output to the component assembly machine as assembly position setting information, which specifies the magnitude and direction of a position misalignment of expected assembly position information, which specifies an expected assembly position of the electronic component, relative to ideal assembly position information, which specifies an ideal assembly position of the electronic component to be mounted on the solder group.

[0018] An investigation of the respective solders contained in the solder group is carried out on the basis of actual investigation reference information obtained by shifting the ideal solder investigation reference information around the assembly position setting information, and an investigation of the adhesive is carried out on the basis of the ideal adhesive investigation reference information.

[0019] The “(actual or ideal) plumb position information” specifies a relative position of a plumb group on a substrate and can be, for example, the center or centroid of an area (= plumb area) occupied by the respective plumb lines contained in the plumb group on the substrate, the center or centroid of a rectangle that circumscribes the plumb area, or a center point or centroid of the respective plumb areas (for example, a center point or centroid of the centers or the centroids of the respective plumb areas).

[0020] The "ideal mounting position information" specifies an ideal mounting position for an electronic component, generated based on, for example, plumb line positions in the data. This information can include, for instance, the ideal plumb line position information itself, or the center point or centroid of the respective plumb line areas.

[0021] The "expected mounting position information" specifies the expected mounting position of an electronic component, generated based on actually printed solder joints. This information can be, for example, the actual solder joint position information itself, or the center point or centroid of the respective solder joint areas.

[0022] The "ideal plumb line investigation reference information" specifies an investigation position or investigation area of ​​a given plumb line within the data. This information can be, for example, ideal plumb line position information, an investigation window (ideal plumb line investigation window) generated based on an area occupied by the plumb line (ideal plumb line area), or the center or centroid of the plumb line area within the data.

[0023] The "ideal adhesive investigation reference information" specifies an investigation position or area of ​​the adhesive within the data. This information can include, for example, information regarding the application position of the adhesive in the data (ideal adhesive position information), an investigation window (ideal adhesive investigation window) created based on an area occupied by the adhesive (ideal adhesive area) within the data, or the center or centroid of an adhesive area within the data.

[0024] The “mounting position adjustment information” is information that specifies the magnitude and direction of a position misalignment with respect to an actual printed solder group relative to a solder group in the data, and can be expressed, for example, by vector information or rotation angle information.

[0025] The "actual inspection reference information" is information that specifies an inspection reference position and inspection reference area of ​​a given printed plumb line. This information can be obtained, for example, by shifting the ideal plumb line inspection reference information (such as coordinate information or an inspection window) by a predetermined vector component, or by rotating the ideal plumb line inspection reference information (such as coordinate information or an inspection window) by a predetermined angle of rotation.

[0026] According to the configuration of aspect 1 described above, the adhesive has a curing temperature set higher than the melting temperature of the solder. This allows for the use of a self-aligning effect.

[0027] The configuration of aspect 1 above then outputs information to the component assembly machine as assembly position setting information. This information is based on the magnitude and direction of any positional misalignment of the actual plumb position information relative to the ideal plumb position information. Accordingly, this configuration enables the placement of an electronic component in a position determined by considering its self-aligning effect, and facilitates more reliable assembly of the electronic component in a suitable position. This configuration utilizes information generated during an investigation process for the assembly process. Therefore, there is no need to perform a sequence of processes similar to those carried out in the investigation process in a duplicated or redundant manner during the assembly process.This improves manufacturing efficiency.

[0028] Even when the self-aligning effect is applied, the configuration of aspect 1 above performs an examination of the adhesive based on ideal adhesive application reference information. Considering that the adhesive remains stationary even when the self-aligning effect is applied, an examination of the adhesive application quality is conducted based on the position and area of ​​the adhesive in the design data or manufacturing data (an ideal position and area of ​​the adhesive on the final substrate). This configuration therefore enables a suitable examination of the adhesive application quality.As a result, this configuration prevents, for example, an electronic component from being mounted on the substrate where the adhesive is not appropriately applied, thereby increasing the yield and preventing an increase in manufacturing costs.

[0029] While an investigation of the adhesive is carried out based on the ideal adhesive investigation reference information as described above, an investigation of the respective solders contained in a solder group on which an electronic component is to be mounted is carried out based on an investigation reference position (actual investigation reference information) obtained by shifting an investigation reference position of the solder of an ideal pressure state (ideal solder investigation reference information) around the mounting position setting information.Accordingly, the configuration of Aspect 1, taking into account the likely use of the self-alignment effect, modifies the reference position of an investigation with respect to a given electronic component (with respect to a given solder group) based on the positions of the actually printed solders and performs an investigation of the respective solders based on this modified reference position. For example, if the respective solders contained in the solder group exhibit a relatively large positional misalignment, but the magnitude and direction of the misalignment are appropriately fixed, it is expected that the solders and similar components will be arranged in suitable or correct positions by the self-alignment effect, thereby enabling the determination of "good print quality".If, as in another example, the individual solder joints exhibit a relatively small positional misalignment, but varying directions of misalignment, and it is unlikely that an electronic component will be properly or correctly mounted, this can, on the other hand, lead to a significant deviation of a particular solder joint from the reference position of an inspection and thus to the determination of "poor print quality." As described above, the configuration of aspect 1 above enables a suitable inspection of the solder's print quality, taking into account the self-aligning effect. In combination with a suitable inspection of the adhesive application quality, this configuration further increases the yield and prevents an increase in manufacturing costs.

[0030] Aspect 2. A substrate testing device is provided, arranged upstream of a component assembly machine used to mount an electronic component on a solder printed onto a substrate by a solder printing machine, and designed to test at least one thermosetting adhesive applied to the substrate from the adhesive and the solder.The substrate inspection device comprises: an irradiation unit designed to irradiate at least the solder and the adhesive with light; an imaging unit designed to capture an image of at least the solder and the adhesive being irradiated with light; an actual solder position information generation unit designed to generate actual solder position information, which is position information of a solder group containing two or more solders and on which the electronic component is mounted, based on image data captured by the imaging unit; and an ideal adhesive inspection reference information generation unit designed to generate ideal adhesive inspection reference information, which specifies a reference inspection position and / or reference inspection area of ​​the adhesive, based on design or manufacturing data.

[0031] The adhesive has a curing temperature that is set higher than the melting temperature of the solder.

[0032] Information based on the magnitude and direction of a position misalignment of the actual solder position information relative to ideal solder position information, which specifies a position of the solder group in the design data or in the manufacturing data, is output to the component assembly machine as assembly position setting information, which specifies the magnitude and direction of a position misalignment of expected assembly position information, which specifies an expected assembly position of the electronic component, relative to ideal assembly position information, which specifies an ideal assembly position of the electronic component to be mounted on the solder group.

[0033] An examination of at least the adhesive is carried out based on the ideal adhesive examination reference information.

[0034] According to the configuration of aspect 2 described above, the adhesive has a curing temperature that is set higher than the melting temperature of the solder. This enables the use of the self-aligning effect.

[0035] The configuration of aspect 1 above then outputs information to the component assembly machine as assembly position setting information. This information is based on the magnitude and direction of any positional misalignment of the actual plumb position information relative to the ideal plumb position information. Accordingly, this configuration enables the placement of an electronic component in a position determined by considering its self-aligning effect, and facilitates more reliable assembly of the electronic component in a suitable position. This configuration utilizes information generated during an inspection process for the assembly process. Therefore, there is no need to perform a sequence of processes similar to those carried out in the inspection process in a duplicated or redundant manner during the assembly process.This improves manufacturing efficiency.

[0036] Even when the self-aligning effect is applied, the configuration of aspect 2 above performs an investigation of at least the adhesive based on ideal adhesive application reference information. Considering that the adhesive does not move even when the self-aligning effect is applied, an investigation of the adhesive application quality is carried out based on the position and area of ​​the adhesive in the design data or in the manufacturing data (an ideal position and area of ​​the adhesive on a finally produced substrate). This configuration therefore enables a suitable investigation of the adhesive application quality.As a result, this configuration prevents, for example, an electronic component from being mounted on the substrate where the adhesive has not been properly applied, thus increasing the yield and preventing an increase in manufacturing costs.

[0037] Aspect 3. In the substrate testing device of Aspect 1 or Aspect 2 above, the adhesive can be an insulating adhesive. The substrate testing device can calculate an area of ​​overlap between the solder printed onto the substrate and the adhesive applied to the substrate, and determine successful or failed soldering based on the calculated area prior to a predetermined reflow process.

[0038] Even in the case where the adhesive, solder, and electronic component are positioned appropriately by self-alignment after the reflow process, the adhesion of a large amount of insulating adhesive to the solder before the reflow process likely results in insufficient electrical continuity or conduction across the solder, thus likely leading to a faulty solder joint.

[0039] However, the configuration of aspect 3 above determines whether a solder joint is successful or defective based on the area of ​​overlap between the adhesive and the solder (i.e., the area of ​​overlap between the adhesive and the solder in a top view of the adhesive and solder). Accordingly, this configuration allows for the proper detection of defective solder joints after the reflow process, even when the solder, electronic component, and similar items appear to be positioned correctly. This configuration improves the accuracy of the inspection.

[0040] Aspect 4. In the substrate testing device according to any of the aspects 1 to 3 above, the adhesive can be an insulating adhesive. The substrate testing device can calculate an area or region of coverage between an expected arrangement area of ​​an electrode section of the electronic component to be mounted on the solder and the adhesive applied to the substrate, and can determine successful or failed soldering based on the calculated area prior to a predetermined reflow process.

[0041] The term "electrode section" refers to an electrically conductive element that is arranged on the plumb line and is, for example, an electrode and a conductor.

[0042] Even in the case where the adhesive, solder, and electronic component are positioned appropriately by self-alignment after the reflow process, adhering a large amount of insulating adhesive to the solder before the reflow process is likely to result in insufficient electrical continuity or conduction across the solder, and thus a faulty solder joint is likely to be achieved.

[0043] However, the configuration of aspect 4 above determines whether a solder joint is successful or defective based on the area of ​​overlap between the insulating adhesive and the expected arrangement area of ​​the electrode section (i.e., the area of ​​overlap between the adhesive and the expected arrangement area of ​​the electrode section in a top view of the adhesive and the expected arrangement area of ​​the electrode section). Accordingly, this configuration allows for the proper detection of an actual defective solder joint after the reflow process, even if the solder, electronic component, and similar items appear to be positioned appropriately. This configuration improves the accuracy of the investigation. Brief description of the drawings Fig. Figure 1 is a block diagram that represents the schematic configuration of a manufacturing system. Fig. Figure 2 is a partially enlarged top view showing the schematic configuration of a printed circuit board. Fig. Figure 3 is a partially enlarged sectional view showing the schematic configuration of the printed circuit board. Fig. Figure 4 is a schematic diagram illustrating the schematic configuration of a substrate testing device and similar equipment. Fig. Figure 5 is a block diagram illustrating the configuration of a control device and similar items. Fig. Figure 6 is a flowchart that represents an investigation process. Fig. Figure 7 is a flowchart showing an initial extraction generation process. Fig. Figure 8 is a flowchart showing a second extraction generation process. Fig. Figure 9 is a schematic top view showing the pressure state of solder and similar items used in the description of the investigation process. Fig. Figure 10 is a schematic top view showing ideal plumb areas and ideal plumb position information. Fig. 11 is a schematic top view showing plumb line search areas. Fig. Figure 12 is a schematic top view showing solder points and similar features. Fig. Figure 13 is a schematic top view showing actual plumb areas, actual plumb position information, and the like. Fig. Figure 14 is a schematic top view showing an actual adhesive area and similar features. Fig. 15 is a schematic top view that provides ideal reference information for plumb line analysis. Fig. Figure 16 is a schematic top view that provides ideal adhesive testing reference information. Fig. Figure 17 is a schematic top view showing assembly position adjustment information and similar details. Fig. Figure 18 is a schematic top view showing electrode section arrangement areas. Fig. Figure 19 is a schematic top view that represents actual investigation-related information. Fig. Figure 20 is a schematic top view representing an investigation of solders and an adhesive using the actual investigation reference information and the ideal adhesive investigation reference information. Fig. Figure 21 is a schematic top view showing the actual adhesive area and similar features when a positional relationship between an adhesive and solders is incorrect. Fig. Figure 22 is a schematic top view showing the actual adhesive area and similar features when a positional relationship between an adhesive and expected arrangement areas of electrode sections is not correct. Fig. Figure 23 is a schematic top view showing an arrangement of plumb lines and similar items at suitable positions through a self-aligning effect. Fig. Figure 24 is a schematic top view illustrating the probability of solder and similar components being arranged in suitable positions by the self-aligning effect, even in the case of faulty soldering. Description of the embodiments

[0044] The following describes one embodiment with reference to the drawings. Fig. Figure 1 is a block diagram showing the schematic configuration of a manufacturing system for producing a printed circuit board (hereinafter referred to as the “substrate”). Fig. Figure 2 is a partially enlarged top view showing part of substrate 1. Fig. Figure 3 is a partially enlarged cross-sectional view showing part of substrate 1.

[0045] First, the configuration of substrate 1 is described. As it is in Fig. 2 and Fig. As shown in Figure 3, the substrate 1 has several electrically conductive electrode patterns 2. Solder paste 3 (hereinafter referred to as "solder" 3), which has a viscosity, is printed onto the electrode patterns 2.

[0046] The solder 3 used can be, for example, a Sn-Ag-based solder such as Sn - 3.0 Ag - 0.5 Cu or Sn - 0.3 Ag - 0.7 Cu, a Sn-Cu-based solder such as Sn - 0.7 Cu, a Sn-Zn-based solder such as Sn - 8 Zn - 3 Bi or a Sn-Pb-based solder such as Sn 67% - Pb 37%.

[0047] The melting point of solder 3, consisting of Sn - 3.0 Ag - 0.5 Cu or Sn - 0.3 Ag - 0.7 Cu, is approximately 217°C, and the melting point of solder 3, consisting of Sn - 0.7 Cu, is approximately 227°C. The melting point of solder 3, consisting of Sn - 8 Zn - 3 Bi, is approximately 187 to 196°C, and the melting point of solder 3, consisting of Sn 67% - Pb 37%, is approximately 183°C.

[0048] Electronic components 4, such as a chip or similar device, are mounted on the solders 3. More precisely, the electronic component 4 contains several electrode sections 7, which consist of electrodes and conductors or wires. Each of the electrode sections 7 is connected to a specific, predetermined solder 3. Accordingly, the electronic component 4 is mounted on a solder group 5, which consists of several solders 3.

[0049] Furthermore, the electronic component 4 is fixed by the solder 3. According to the embodiment, the electronic component 4 is connected to the substrate 1 by means of an adhesive 6, which is applied to the substrate 1, in order to improve its fixation. The adhesive 6 is an insulating adhesive that has a thermosetting property. The adhesive 6 has a curing temperature that is higher than the melting temperature of the solder 3.

[0050] The following describes a manufacturing system 11 designed to produce substrate 1. As it is described in Fig. As shown in Figure 1, the manufacturing system 11 of the embodiment includes a solder printing device 12 as a solder printing machine, an adhesive application device 13, a component assembly system 14, a reflow device 15 and a component assembly condition inspection device 16, which are arranged successively along a conveying line of the substrate 1 from a stream-up side (top side of the drawing).

[0051] The solder printing device 12 is designed to print a predetermined quantity of solder 3 at a predetermined position on the substrate 1 (for example, on the electrode pattern 2). More precisely, the solder printing device 12 has a metal screen (not shown) with multiple holes at positions corresponding to the electrode patterns 2 on the substrate 1. The solder printing device 12 uses this metal screen to apply the solder 3 to the substrate 1 by screen printing.

[0052] The adhesive application device 13 is designed to apply a predetermined quantity of the adhesive 6 to a predetermined position on the substrate 1 (for example, a position where an electronic component 4 is likely to be located). The adhesive application device 13 has, for example, a nozzle head (not shown) designed to move in an XY direction and sprays the adhesive 6 from this nozzle head to apply the adhesive 6 to the substrate 1.

[0053] The component assembly system 14 includes a substrate inspection device 21, designed to inspect the printed solder 3 and the applied adhesive 6, and a component assembly machine 22, designed to assemble the electronic components 4. The substrate inspection device 21 and the component assembly machine 22 will be described in more detail later.

[0054] The reflow device 15 is designed to heat and melt the solder 3 as well as to heat and cure the adhesive 6. In the substrate 1, after the reflow process performed by the reflow device 15, the electrode sections 7 of the electronic components 4 are connected to the electrode patterns 2 by means of the solder 3, and the electronic component 4 is securely fixed by the adhesive 6.

[0055] The component assembly condition inspection device 16 is designed to examine whether each of the electronic components 4 is mounted in a predetermined position and to examine whether the electrical connection with the respective electronic components 4 is suitable or correctly ensured.

[0056] The following describes the component assembly system 14. First, the substrate testing device 21 is described.

[0057] As it is in Fig. As shown in Figure 4, the substrate examination device 21 includes a mounting table 31 configured such that the substrate 1 is arranged on the mounting table 31, a lighting device 32 configured as the irradiation unit for irradiating the surface of the substrate 1 obliquely downwards with light, a CCD camera 33 configured as the imaging unit for capturing an image of the substrate 1 being irradiated with the light, and a control device 41 configured to perform various controls, image processing, and arithmetic processing in the substrate examination device 21.

[0058] The assembly table 31 has electric motors 34 and 35, each with rotating shafts arranged orthogonally to each other. The control device 41 drives and controls these electric motors 34 and 35 to move the substrate 1, which is arranged on the assembly table 31, in any desired direction (X-axis and Y-axis). This changes the imaging position of the substrate 1 by the CCD camera 33.

[0059] The lighting device 32 is designed to irradiate the substrate 1 with predetermined light and to emit light onto at least the solder 3 and the adhesive 6.

[0060] The CCD camera 33 has a sensitivity in a wavelength range of the light emitted by the illumination device 32 and is designed to capture an image of at least the solder and the adhesive 6 illuminated by the light. Image data captured by the CCD camera 33 is transmitted to an arithmetic device 43 of the control device 41 described later. According to the embodiment, the image data transmitted is luminance or brightness data with respect to the light reflected by the substrate 1. However, the image data transmitted is not limited to luminance data but can include color data, height data, or similar information about the substrate 1.

[0061] The following describes the control device 41. As it is in Fig. As shown in Figure 5, the control device 41 includes a storage device 42 designed to store various data and an arithmetic device 43 designed to perform various arithmetic operations. Fig. Section 5 represents areas and information elements provided by the respective units 44 to 49 described later, as well as the respective components of the control device 41. These areas and information elements are represented by dashed boxes in Fig. 5 shown.

[0062] The storage device 42 stores results of calculations performed by the arithmetic device 43, as well as design data, manufacturing data and similar information relating to substrate 1.According to the embodiment, the storage device 42 stores, for example, the positions and sizes of the electrode patterns 2 on the substrate 1, the expected printing positions of the solders 3, the sizes of the solders 3 (for example, the length of each side of each solder 3, the area and contour length of the solder 3, the length of the diagonal of the solder 3, the volume of the solder 3, and the like) of an ideal printing condition, the expected application positions of the adhesives 6, the sizes of the adhesives 6 (for example, the area, contour length, volume, and the like of each adhesive 6) of an ideal application condition, various information relating to the electronic components 4, including the sizes of the electrode sections 7 and the expected arrangement area of ​​the respective electronic components 4, and the size of the substrate 1 as design data and manufacturing data.The storage device 42 also stores, for example, information regarding which solder 3 is used to assemble a particular electronic component 4, and information regarding which solder 3 is contained in which solder group 5.

[0063] The arithmetic device 43 includes an ideal solder position information generation unit 44, an image processing unit 45, an ideal solder investigation reference information generation unit 46, an ideal adhesive investigation reference information generation unit 47, an assembly position setting information generation unit 48 and an electrode section arrangement area generation unit 49.

[0064] The ideal solder position information generation unit 44 is designed to generate ideal solder position information Prh, which specifies an ideal position of a respective solder group 5 in the design data or in the manufacturing data stored in the storage device 42. According to the embodiment, the ideal solder position information generation unit 44 first obtains an ideal solder area Arh of the respective solders 3 contained in a respective solder group 5, based on the data stored in the storage device 42. According to the embodiment, the ideal solder area Arh denotes a planar area in the data that is occupied by the respective solders 3 on the substrate 1.

[0065] The ideal perpendicular position information generation unit 44 then obtains the center-of-mass coordinates with respect to the respective ideal perpendicular ranges Arh. If the perpendicular group 5 contains two perpendiculars 3, the ideal perpendicular position information generation unit 44 generates midpoint coordinates (i.e., center-of-mass coordinates) [= (Lx, Ly)] of the two center-of-mass coordinates of these two ideal perpendicular ranges Arh as ideal perpendicular position information Prh. If the perpendicular group 5 contains three or more perpendiculars, the ideal perpendicular position information generation unit 44, on the other hand, generates midpoint coordinates (i.e., center-of-mass coordinates) [= (Lx, Ly)] of the center-of-mass coordinates of the respective ideal perpendicular ranges Arh as ideal perpendicular position information Prh.

[0066] A three-dimensional area or similar feature in the data, occupied by the respective solders 3 on the substrate 1, can also be obtained as an ideal solder area Arh. The center of a respective ideal solder area Arh, the centroid, or the center of a rectangle that circumscribes a respective ideal solder area Arh or similar feature, can also be used as ideal solder position information Prh. According to the embodiment, the ideal solder area Arh is identical to an area occupied by a respective electrode pattern 2 on the substrate 1.

[0067] The image processing unit 45 is designed to extract an actual solder area Ajh and an actual adhesive area Ajs based on the image data acquired by the CCD camera 33 and to generate actual solder position information Pjh based on the extracted actual solder area Ajh.

[0068] The actual solder area Ajh essentially refers to an area of ​​image data occupied by each of the 3 solders. However, the 3 solder that exhibits a significant print quality defect is not extracted as the actual solder area Ajh. The actual adhesive area Ajs refers to an area of ​​image data occupied by the adhesive 6. Furthermore, the actual solder position information Pjh refers to positional information of image data relative to each solder group 5 that was actually printed.

[0069] The extraction of the actual solder area Ajh is described in more detail below. The image processing unit 45 first performs a binarization process of the image data using a predetermined luminance value, which is set in advance as a reference value, and thereby extracts an area occupied by the respective solders 3 on the substrate 1. The image processing unit 45 then stores information regarding the extracted area of ​​the respective solders 3 in the storage device 42.

[0070] The image processing unit 45 then sets a predetermined plumb line search area. This search area has a similar shape to the ideal plumb line area Arh and features center coordinates identical to those of the ideal plumb line area Arh. However, the search area is set to be slightly larger than the ideal plumb line area Arh.

[0071] The image processing unit 45 then uses the information regarding the area of ​​each solder 3 stored in the storage device 42 and determines whether the area of ​​the solder 3 present in the solder search area occupies a predetermined or greater proportion of the area of ​​the solder search area. If this determination condition is met, the image processing unit 45 extracts the solder 3 present in the solder search area as a solder point. However, an area smaller than a predetermined area (for example, less than 1% of the area of ​​the solder search area) within the area of ​​the solder 3 present in the solder search area is not extracted as part of a solder point.

[0072] The image processing unit 45 then extracts a solder area to be connected to the extracted solder point (i.e., a solder area containing the extracted solder point) as the actual solder area Ajh based on the information regarding the area of ​​the solder 3 stored in the storage device 42. This extracts the actual solder area Ajh with respect to the respective solders 3 contained in the solder group 5, with the exception of the solder 3 that has a significant printing quality defect.

[0073] If the area of ​​the solder 3 present in the solder search area is smaller than the predetermined proportion of the area of ​​the solder search area, the image processing unit 45 does not extract this solder 3 as a solder point, but instead outputs a "print error signal" to the component assembly machine 22. This process is carried out because printing the solder 3 in a position that deviates significantly from its ideal printing position is likely to lead to difficulties in correcting the position of the solder 3 later, even when the self-aligning effect is used. The operations of the component assembly machine 22 in response to the input of the "print error signal" are described later.

[0074] If multiple areas of solder 3, each with a predetermined or larger area (for example, 20% or a higher percentage of the solder search area), are present in the solder search area, the image processing unit 45 does not extract this solder as a solder point but outputs the "print error signal" to the component assembly machine 22. This process is carried out because the solder 3 is likely to be excessively close to an adjacent solder 3 due to "bleeding" or similar issues, or the solder 3 is likely to be smeared.

[0075] The following describes the generation of the actual plumb line position information Pjh. The image processing unit 45 first determines the center-of-mass coordinates with respect to the respective actual plumb line areas Ajh contained in a given plumb line group 5. If the plumb line group 5 contains two plumb lines 3, the image processing unit 45 generates center-of-mass coordinates (i.e., midpoint coordinates) [= (x, y)] of the two center-of-mass coordinates of the two actual plumb line areas Ajh contained in the plumb line group 5 as actual plumb line position information Pjh. Conversely, if the plumb line group 5 contains three or more plumb lines, the image processing unit 45 generates center-of-mass coordinates (i.e., midpoint coordinates) [= (x, y)] of the center-of-mass coordinates of the actual plumb line areas Ajh contained in the plumb line group 5 as actual plumb line position information Pjh.According to the embodiment, the image processing unit 45 corresponds to the actual plumb position information generation unit.

[0076] The center coordinates (centroid coordinates) of the respective actual perpendicular range Ajh, the centroid, or the center of a rectangle that circumscribes a respective actual perpendicular range Ajh, or similar, can be generated as actual perpendicular position information Pjh. However, the actual perpendicular position information Pjh must be of the same type as the ideal perpendicular position information Prh (i.e., the same type of category and the same parameters). According to the embodiment, the center coordinates of the centroid coordinates of the ideal perpendicular range Arh are generated as ideal perpendicular position information Prh, as described above, and the center coordinates of the centroid coordinates of the actual perpendicular range Ajh are generated as actual perpendicular position information Pjh.

[0077] The following describes the extraction of the actual adhesive area Ajs. The image processing unit 45 first performs a binarization process of the image data using a predetermined luminance or brightness value, which is set in advance as a reference value, thereby extracting an area covered by the adhesive 6 on the substrate 1. The image processing unit 45 then determines the extracted area as the actual adhesive area Ajs.

[0078] The ideal plumb line investigation reference information generation unit 46 is designed to generate ideal plumb line investigation reference information Krh that specifies an investigation area corresponding to the ideal plumb line area Arh. According to the embodiment, the ideal plumb line investigation reference information generation unit 46 generates the ideal plumb line investigation reference information Krh based on the ideal plumb line area Arh obtained by the ideal plumb line position information generation unit 44.

[0079] More precisely, the ideal perpendicular investigation reference information generation unit 46 generates an ideal perpendicular investigation window that has a similar shape to the shape of the ideal perpendicular region Arh and has center coordinates identical to the center coordinates of the ideal perpendicular region Arh, as ideal perpendicular investigation reference information Krh. This ideal perpendicular investigation window specifies an investigation reference area for a given perpendicular 3 contained in the perpendicular group 5. The ideal perpendicular investigation window is set to be slightly larger than the size of the ideal perpendicular region Arh. The ideal perpendicular investigation reference information Krh can be suitably modified by changing the ideal perpendicular region Arh.

[0080] The ideal adhesive investigation reference information generating unit 47 generates ideal adhesive investigation reference information Krs, which specifies a reference investigation range of the adhesive 6, based on the design data or manufacturing data stored in the storage device 42.

[0081] More precisely, the ideal adhesive testing reference information generation unit 47 first obtains an area in the data occupied by the adhesive 6, as an ideal adhesive area Ars. The ideal adhesive testing reference information generation unit 47 then generates an ideal adhesive testing window, which has a similar shape to the shape of the ideal adhesive area Ars and has center coordinates identical to those of the ideal adhesive area Ars, as ideal adhesive testing reference information Krs. This ideal adhesive testing window specifies a testing reference area for the adhesive 6. The ideal adhesive testing window is set to be slightly larger than the size of the ideal adhesive area Ars.

[0082] A fixed area occupied by the adhesive 6 on the substrate 1, as defined in the data or similar, can be generated as the ideal adhesive area Ars. The ideal adhesive investigation reference information Krs can be suitably modified by changing the ideal adhesive area Ars.

[0083] The mounting position setting information generation unit 48 is designed to generate mounting position setting information Cji with respect to each solder group 5, in other words, with respect to the respective electronic components 4. The mounting position setting information Cji specifies the magnitude and direction of a position misalignment of expected mounting position information relative to ideal mounting position information. The ideal mounting position information specifies a mounting position in the design data or in the manufacturing data for the electronic component 4 to be mounted on the solder group 5 and is identical to the ideal solder position information Prh according to the embodiment.The expected mounting position information specifies an expected mounting position of the electronic component 4 to be mounted on the solder group 5 and is identical to the actual solder position information Pjh according to the embodiment.

[0084] According to this embodiment, the assembly position adjustment information Cji is generated based on the magnitude and direction of any position misalignment of the actual plumb position information Pjh relative to the ideal plumb position information Prh. More precisely, vector information based on the actual plumb position information Pjh [= (x, y)] and the ideal plumb position information Prh [= (Lx, Ly)] is generated as assembly position adjustment information Cji. An X component of the assembly position adjustment information Cji is "x - Lx", and a Y component of the assembly position adjustment information Cji is "y - Ly".

[0085] The electrode section arrangement area generation unit 49 uses the mounting position setting information Cji to generate an electrode section arrangement area Adh, which specifies an expected arrangement area of ​​the respective electrode sections 7 of the electronic component 4. According to the embodiment, the electrode section arrangement area generation unit 49 generates an area obtained by shifting the expected arrangement area of ​​the electrode section 7 in the data by the mounting position setting information Cji, as electrode section arrangement area Adh.

[0086] The arithmetic device 43 examines the good or poor quality of the solder group 5 and the adhesive 6 on the substrate 1 and the successful or failed soldering based, for example, on the information generated by the respective units 44 to 49 described above. The following describes an examination process performed by the arithmetic device 43.

[0087] The arithmetic device 43 checks whether the respective assembly position setting information Cji, obtained by the assembly position setting information generation unit 48, is suitable. More precisely, if the size of the assembly position setting information Cji, the size of the X-direction component of the assembly position setting information Cji, or the size of the Y-direction component of the assembly position setting information Cji exceeds a respective predetermined reference value that is set in advance, the arithmetic device 43 determines that the lot 3 is printed in a significantly deviating position and has poor print quality. In this case, the arithmetic device 43 outputs the "printing error signal" to the component assembly machine 22.

[0088] If the respective assembly position setting information Cji is suitable, the arithmetic device 43 shifts the ideal plumb line inspection reference information Krh (ideal plumb line inspection window) by the assembly position setting information Cji to generate actual inspection reference information Kjh. The actual inspection reference information Kjh is generated for each plumb line group 5. According to the embodiment, the arithmetic device 43 generates an inspection window (actual plumb line inspection window) as actual inspection reference information Kjh by shifting the ideal plumb line inspection window by the assembly position setting information Cji.The actual plumb line inspection window has center coordinates that are identical to coordinates determined by shifting the center coordinates of the ideal plumb line inspection window by the mounting position setting information Cji, and has a shape that is identical to the shape of the ideal plumb line inspection window.

[0089] The arithmetic device 43 then uses the actual test reference information Kjh to examine each plumb line 5. More precisely, the arithmetic device 43 determines, with respect to each plumb line 5, whether a proportion of an area occupied by an area other than the actual plumb line area Ajh exceeds a predetermined reference value in the actual test reference information Kjh (actual plumb line test window). If this determination condition is not met with respect to all respective plumb lines 5, the arithmetic device 43 determines the print quality of the plumb lines 3 to be "good print quality".

[0090] If the above determination condition is met with regard to at least one lot, the arithmetic device 43, on the other hand, determines the print quality of the lot 3 as "poor print quality" and outputs a "print error signal" to the component assembly machine 22.

[0091] Furthermore, the arithmetic device 43 uses the ideal adhesive testing reference information Krs (ideal adhesive testing window) to examine a given adhesive 6. More precisely, the arithmetic device 43 determines, with respect to each adhesive 6, whether a proportion of an area occupied by an area other than the actual adhesive area Ajs exceeds a predetermined reference value in the ideal adhesive testing reference information Krs (ideal adhesive testing window). If this determination condition is not met with respect to all respective adhesives 6, the arithmetic device 43 determines the application quality of the adhesives 6 as "good application quality".

[0092] If the above determination condition is met with regard to at least one adhesive 6, the arithmetic device 43, on the other hand, determines the application quality of the adhesive 6 as poor and outputs an "application error signal" to the component assembly machine 22. The operations of the component assembly machine 22 in response to the input of the "application error signal" are described later.

[0093] Furthermore, the arithmetic device 43 calculates the area of ​​a region of each adhesive 6 that overlaps with the solder 3. According to the embodiment, the arithmetic device 43 calculates the area of ​​a region where the actual solder area Ajh overlaps with the actual adhesive area Ajs in a top view of the substrate 1. If this calculated area exceeds a predetermined reference area, which is set in advance, the arithmetic device 43 determines the soldering to be a "failed soldering". The arithmetic device 43 then outputs a "failed soldering signal" to the component assembly machine 22. The operations of the component assembly machine 22 in response to the input of the "failed soldering signal" are described later.

[0094] Furthermore, the arithmetic device 43 calculates the area of ​​a region of the respective adhesive 6 that is expected to overlap with the electrode section 7. According to the embodiment, the arithmetic device 43 calculates the area of ​​a region in which the electrode section arrangement area Adh overlaps with the actual adhesive area Ajs. If this calculated area exceeds a predetermined reference area that is set in advance, the arithmetic device 43 determines the soldering as a "failed solder" and outputs the "failed solder signal" to the component assembly machine 22.

[0095] If the above determination result for the soldering indicates "not defective" with respect to all adhesives 6, the arithmetic device 43, on the other hand, determines the soldering as "successful soldering". The determination of "successful or defective" soldering can be carried out using the area of ​​a coverage area or using a value based on the area of ​​the coverage area, for example, a value obtained by dividing the area of ​​the coverage area by the area of ​​the solder 3, the area of ​​the adhesive 6, or the area of ​​the electrode section 7 (the area of ​​the actual solder area Ajh, the area of ​​the actual adhesive area Ajs, or the area of ​​the electrode section arrangement area Adh).

[0096] If the printing quality of the solders 3 and the application quality of the adhesives 6 are determined to be "good" and the soldering is determined to be "successful", the arithmetic device 43 determines that the substrate 1 is "not a defective product". The arithmetic device 43 then outputs several assembly position setting information Cji, which are set for the respective solder groups 5, to the component assembly machine 22.

[0097] The following describes the operation of the component assembly machine 22. When the assembly position setting information Cji is entered after completion of the inspection process by the substrate inspection device 21, i.e., when the substrate 1 is determined to be a "non-defective product," the component assembly machine 22 mounts the electronic component 4 onto the substrate 1. More precisely, the component assembly machine 22 mounts an electronic component 4 onto a respective lot group 5 such that the center of the electronic component 4 is positioned at a location offset by the entered assembly position setting information Cji from an assembly position (ideal assembly position information) of the electronic component 4 in the design data or the manufacturing data that is entered in advance.Accordingly, each electronic component 4 is mounted at an actual printing position of a respective solder group 5.

[0098] If the “printing error signal”, the “application error signal” or the “soldering error signal” is input by the arithmetic device 43, the component assembly machine 22, on the other hand, conveys the substrate 1 to a hopper or container for defective products (not shown) without mounting the electronic component 4 on the substrate 1.

[0099] The investigation process carried out by the substrate investigation device 21 will be described in more detail below with reference to the flowcharts of the Fig. 6 to 8 and other drawings described. In the Fig. 9 to 20 are an examination standard, for example of the plumb line search area, and the actual examination reference information Kjh (actual plumb line examination window) is shown with a thick line.

[0100] For illustrative purposes, the investigation process described below involves a solder group 5a, consisting of solders 3a and 3b printed on electrode patterns 2a and 2b, and an adhesive 6a corresponding to the solder group 5a (each in Fig. (9 shown). A similar investigation process is carried out for the other solder groups 5 and for the other adhesives 6. Solders 3a and 3b are assumed to be of identical sizes and printed such that they each deviate by 2 mm in an X-axis direction and 1 mm in a Y-axis direction from the corresponding electrode patterns 2a and 2b. Furthermore, solders 3a and 3b are assumed to be printed such that they are of substantially the same size (dimensions). Adhesive 6a is also assumed to be applied at an ideal position with an ideal size. These numerical values ​​are only examples.

[0101] The investigation process first carries out an initial extraction generation process in step S11 of the Fig. 6 through.

[0102] The first extraction generation process generates ideal plumb position information Prh based on the design data or similar in step S31, which is in Fig. Figure 7 shows that, according to the embodiment, the first extraction generation process generates a center point (Lx, Ly) of center coordinates of an ideal plumb area Arh1 with respect to plumb line 3a in the design or manufacturing data and center coordinates of an ideal plumb area Arh2 with respect to plumb line 3b in the design or manufacturing data as ideal plumb position information Prh (as shown in Figure 7). Fig. 10 is shown).

[0103] In steps S32 and S33, the first extraction generation process then extracts the respective surface areas covered by the lot 3 and the adhesive 6 on the substrate 1, based on the image data acquired by the CCD camera 33. Information concerning the extracted surface areas is stored in the storage device 42.

[0104] In step S34, the first extraction generation process then sets up perpendicular search areas SA1 and SA2, each with center coordinates that are identical to the center coordinates of the ideal perpendicular areas Arh1 and Arh2 and that are slightly larger than the ideal perpendicular areas Arh1 and Arh2 (as shown in Fig. 11 is shown).

[0105] According to Fig. In step S12, following the initial extraction generation process, the investigation process determines whether the print quality of the solder 3 exhibits a significant defect. More precisely, the investigation process determines whether a surface area of ​​the respective solders 3 present in the solder search area SA1 or SA2 occupies a predetermined or larger proportion of the area of ​​the solder search area SA1 or SA2. The investigation process then determines whether there are multiple surface areas of the solder 3 that each occupy predetermined or larger areas (for example, 20% of the area of ​​the solder search area SA1 or SA2) within the solder search area.

[0106] If the area of ​​the respective perpendiculars 3a and 3b occupies the predetermined or larger proportion of the area of ​​the perpendicular search area SA1 or SA2, and several area regions of perpendiculars 3a or 3b, each having the predetermined or larger areas, are not present in the perpendicular search area SA1 or SA2, i.e., in the case of a negative result in step S12, the investigation process proceeds to a second extraction generation process in step S13.

[0107] If the proportion of the area of ​​the respective solders 3a and 3b in the area of ​​the solder search area SA1 or SA2 is smaller than the predetermined proportion, or if several areas of solder 3, each with the predetermined or larger areas, are present in the solder search area SA1 or SA2 (i.e., in the case of a positive result in step S12), the investigation process proceeds to step S21. In step S21, the investigation process outputs the "printing error signal" to the component assembly machine 22 and then terminates.

[0108] The second extraction generation process is described below in step S13. As it is in Fig. As shown in Figure 8, the second extraction generation process first extracts the solders 3a and 3b, which are present in the solder search areas SA1 and SA2 respectively, as solder points K1 and K2 (areas marked by diagonal lines in Figure 8). Fig. 12 are shown) (as it is in Fig. 12 is shown).

[0109] In step S52 following step S51, the second extraction generation process extracts actual solder areas Ajh. More precisely, the second extraction generation process extracts solder areas drawn with the extracted solder dots K1 and K2 as actual solder areas Ajh1 and Ajh2 (areas represented by the dotted pattern in Fig. 13 are shown) (as it is in Fig. 13 is shown).

[0110] In step S53, the second extraction generation process then generates actual perpendicular position information Pjh. According to the embodiment, the second extraction generation process generates a midpoint (x, y) of the center of gravity coordinates of the actual perpendicular area Ajh1 and the center of gravity coordinates of the actual perpendicular area Ajh2 as actual perpendicular position information Pjh (as described in Fig. 13 is shown).

[0111] Furthermore, the second extraction generation process in step S54 extracts an actual adhesive area Ajs. According to the embodiment, the area covered by the adhesive 6 and extracted in step S33 is extracted as the actual adhesive area Ajs (area shown by diagonally dashed lines in Fig. 14 is shown) (as it is in Fig. 14 is shown).

[0112] In the subsequent step S55, the second extraction generation process generates ideal perpendicular investigation reference information Krh (ideal perpendicular investigation windows). According to the embodiment, the second extraction generation process generates ideal investigation windows, each with shapes similar to those of the ideal perpendicular regions Arh1 and Arh2, and which are slightly larger than the ideal perpendicular regions Arh1 and Arh2, and which each have center coordinates identical to the respective center-of-mass coordinates of the ideal perpendicular regions Arh1 and Arh2, as ideal perpendicular investigation reference information Krh1 and Krh2 (as described in Fig. 15 is shown).

[0113] Furthermore, the second extraction generation process in step S56 generates ideal adhesive investigation reference information Krs. More precisely, the second extraction generation process extracts an area occupied by the adhesive 6a in the data as the ideal adhesive area Ars and then generates an ideal adhesive investigation window that has a similar shape to the shape of the ideal adhesive area Ars, is slightly larger than the ideal adhesive area Ars, and has center coordinates identical to the center of mass coordinates of the ideal adhesive area Ars, as ideal adhesive investigation reference information Krs (as described in Fig. 16 is shown).

[0114] In step S57, the second extraction generation process then generates assembly position setting information Cji. More precisely, the second extraction generation process generates vector information [= (Px, Py)] based on the actual plumb position information Pjh [= (x, y)] generated in step S53 and the ideal plumb position information Prh [= (Lx, Ly)] generated in step S31, as assembly position setting information Cji (as it is in Fig. 17 is shown).

[0115] According to Fig. 6. Following the second extraction generation process, the investigation process in step S14 determines whether the generated assembly position setting information Cji is suitable. The investigation process checks, for example, the size or similar aspects of the assembly position setting information Cji. If the assembly position setting information Cji is unsuitable (step S14: No), the investigation process outputs the "print error signal" in step S21 and then terminates.

[0116] If the mounting position setting information Cji is suitable (step S14: Yes), the investigation process proceeds to step S15 to extract electrode section arrangement areas Adh1 and Adh2 based on the design data or similar (as described in Fig. 18 is shown).

[0117] In step S16, the investigation process then generates actual investigation reference information Kjh. According to the embodiment, the investigation process generates actual plumb line investigation windows, which are obtained by shifting the respective ideal plumb line investigation reference information (ideal plumb line investigation windows) Krh1 and Krh2 around the assembly position setting information Cji, as actual investigation reference information Kjh1 and Kjh2 (as described in Fig. 19 is shown).

[0118] In step S17, the investigation process then uses the actual investigation reference information Kjh1 and Kjh2 (ideal plumb line investigation windows) to determine whether the actual plumb line areas Ajh1 and Ajh2 are suitable. More precisely, the investigation process determines whether the proportion of an area occupied by an area other than the actual plumb line area Ajh1 or Ajh2 exceeds a reference value in the corresponding actual investigation reference information Kjh1 or Kjh2 (actual plumb line investigation window), which is preset (as described in Fig. 20 is shown). If the proportion of the area occupied by an area other than the actual plumb area Ajh1 in the actual investigation reference information Kjh1 is equal to or less than the reference value above, and the proportion of the area occupied by an area other than the actual plumb area Ajh2 in the actual investigation reference information Kjh2 is equal to or less than the reference value above (step S17: Yes), the investigation process determines the print quality of plumb group 5a as "good print quality" and proceeds to step S18.

[0119] If the proportion of the area occupied by an area other than the actual solder area Ajh1 in the actual inspection reference information Kjh1 is greater than the reference value above, or if the proportion of the area occupied by an area other than the actual solder area Ajh2 in the actual inspection reference information Kjh2 is greater than the reference value above (step S17: No), the inspection process, on the other hand, determines the print quality of solder group 5 as "poor print quality". Accordingly, the inspection process outputs the "print defect signal" in step S21 to the component assembly machine 22 and then terminates.

[0120] If the actual solder areas Ajh1 and Ajh2 are suitable (step S17: Yes), the investigation process in step S18 uses the ideal adhesive investigation reference information Krs (ideal adhesive investigation window) to determine whether the actual adhesive area Ajs is suitable. More precisely, the investigation process determines whether the proportion of an area occupied by an area other than the actual adhesive area Ajs exceeds a reference value in the ideal adhesive investigation reference information Krs, which is preset (as described in Fig. 20 is shown). If this determination condition is not met and the actual adhesive area Ajs is suitable (step S18: Yes), the investigation process determines the application quality of the adhesive 6a as "good application quality" and proceeds to step S19.

[0121] If the above determination condition is met and the application state of the adhesive 6a is unsuitable (step S18: No), the investigation process proceeds to step S22. In step S22, the investigation process outputs the "application error signal" to the component assembly machine 22 and then terminates.

[0122] In step S19, the investigation process determines whether a positional relationship between the adhesive 6a and the solders 3a and 3b is suitable. More precisely, the investigation process calculates the area of ​​an overlap region between the actual solder regions Ajh1 and Ajh2 and the actual adhesive region Ajs and determines whether this area of ​​the overlap region exceeds a predetermined reference surface that is set in advance. If the area of ​​the overlap region exceeds the aforementioned reference surface and the positional relationship between the adhesive 6a and the solders 3a and 3b is unsuitable (for example, in the state described in [reference missing]), the process is called off. Fig. (as shown in Figure 21), the inspection process identifies the soldering as defective. Accordingly, the inspection process outputs the "defective soldering signal" to the component assembly machine 22 in step S23 and then terminates. Regarding the specification of the positions of the actual solder areas Ajh and Ajh2 and the actual adhesive area Ajs on the substrate 1, the outer edges of the electrode patterns 2a and 2b are shown in Fig. 21 and Fig. 22 shown by dashed lines.

[0123] If, on the other hand, the area of ​​the coverage area is equal to or smaller than the reference area above and the positional relationship between the adhesive 6a and the solders 3a and 3b is suitable (step S19: Yes), the investigation process proceeds to step S20.

[0124] In step S20, the investigation process determines whether a positional relationship between the adhesive 6a and the electrode section arrangement areas Adh1 and Adh2 is suitable. More precisely, the investigation process calculates the area of ​​an overlap region between the actual adhesive region Ajs and the respective electrode section arrangement areas Adh1 and Adh2 and determines whether this area of ​​the overlap region exceeds a predetermined reference area that is set in advance. If the area of ​​the overlap region exceeds the aforementioned reference area and the positional relationship between the adhesive 6a and the respective electrode section arrangement areas Adh1 and Adh2 is unsuitable (for example, in the state described in Fig. (as shown in Figure 22), the inspection process identifies the soldering as defective. Accordingly, the inspection process outputs the "defective soldering signal" to the component assembly machine 22 in step S23 and then terminates.

[0125] If the area of ​​the coverage area is equal to or smaller than the reference area above and the positional relationship between the adhesive 6a and the electrode section arrangement areas Adh1 and Adh2 is suitable (step S20: Yes), the investigation process, on the other hand, determines the soldering as a successful soldering and is then terminated.

[0126] The above-described testing process is then carried out for a different solder group 5, for a different adhesive 6 than adhesive 6a, and so on. If the test result is "good quality" or "successful" for all solder groups 5, adhesive 6, and so on, the substrate 1 is determined to be a "non-defective product." Several assembly position setting information Cji, set for the respective solder groups 5, are then output to the component assembly machine 22.

[0127] If the determination result of "poor quality" or "defective" is provided for any of the respective solder groups 5, the respective adhesives 6, and the like, the substrate 1 is, on the other hand, determined to be a "defective product". In this case, no assembly position setting information Cji is output to the component assembly machine 22, and no electronic component 4 is mounted on the substrate 1.

[0128] The substrate 1, on which the electronic components 4 were mounted by the component assembly machine 22, is fed to the reflow device 15 described above. The self-aligning effect is utilized in a reflow process. As described in Fig. As shown in Figure 23, this results in the solder 3 being positioned on the electrode pattern 2, and in the electrode section 7 being positioned in a suitable location. As a result, the electronic component 4 is positioned in a suitable location (in Fig. 23 or Fig. 24 not shown).

[0129] When the electronic component 4 is mounted on the substrate 1, which exhibits the determination result of "defective soldering", and this substrate 1 with the electronic component 4 is fed to the reflow process, the use of the self-aligning effect causes the solder 3 to align itself on the electrode pattern 2, thereby aligning the electrode section 7 and the electronic component 4 in suitable positions, as shown in Fig.Figure 24 shows the solder 3, the electronic component 4, and similar items arranged in suitable positions. In reality, a large amount of the adhesive 6 likely adheres to the solder 3 or the electrode section 7, resulting in poor electrical conductivity. Therefore, if the substrate 1 exhibits the result of "defective soldering," no electronic component 4 will be mounted on this substrate 1 as described above.

[0130] As described in detail above, according to the embodiment, the curing temperature of the adhesive 6 is set higher than the melting temperature of the solder 3. This accordingly enables the use of the self-aligning effect.

[0131] Information based on the magnitude and direction of any positional misalignment of the actual solder position information Pjh relative to the ideal solder position information Prh is output to the component assembly machine 22 as assembly position setting information Cji. This configuration enables the electronic component 4 to be positioned according to its self-alignment effect, resulting in more reliable assembly of the electronic component 4 in a suitable position. This configuration utilizes information generated during the investigation process for the assembly process of the electronic component 4. Consequently, there is no need to perform a sequence of processes similar to those in the investigation process in a duplicated or redundant manner during the assembly process. This improves manufacturing efficiency.

[0132] According to the embodiment, even when using the self-aligning effect, an investigation of the adhesive 6 is carried out based on the ideal adhesive investigation reference information Krs. Considering that the adhesive 6 does not move even when using the self-aligning effect, an investigation of the application quality of the adhesive 6 is carried out based on the position and area of ​​the adhesive 6 in the design data or manufacturing data (ideal position and area of ​​the adhesive 6 on a finally produced substrate 1). This configuration accordingly enables a suitable investigation of the application quality of the adhesive 6.As a result, this configuration prevents electronic components 4 from being mounted on the substrate 1 where the adhesive 6 is not adequately applied, thus improving the yield and preventing an increase in manufacturing costs.

[0133] While an investigation of the adhesive 6 is performed based on the ideal adhesive investigation reference information Krs as described above, an investigation of the respective solders 3 contained in the solder group 5 is performed based on an investigation reference position (actual investigation reference information Kjh) obtained by shifting an investigation reference position of the solder 3 of an ideal printing condition (ideal solder investigation reference information Krh) by the assembly position setting information Cji. Accordingly, taking into account that the self-alignment effect is likely to be used, the reference position of the investigation is changed for the respective electronic component 4 (for the respective solder group 5) based on the position of the actually printed solder 3, and an investigation of each solder 3 is performed based on this changed reference position.This configuration allows for a suitable investigation of the printing quality of the solder 3, taking into account the self-aligning effect. In combination with a suitable investigation of the application quality of the adhesive 6, this configuration increases the yield even more effectively and prevents an increase in manufacturing costs.

[0134] Furthermore, successful or failed soldering is determined based on the coverage area between the adhesive 6 and the solder 3, and the coverage area between the adhesive 6 and the expected arrangement area of ​​the electrode section 7. Accordingly, this configuration enables suitable detection of actual soldering failures after the reflow process, even if the solder 3, the electronic component 4, and similar components appear to be positioned appropriately. This configuration improves the accuracy of the investigation.

[0135] The present invention is not limited to the description of the embodiment above, but can, for example, be implemented by the configurations described below. The present invention can, of course, also be implemented by other applications and modifications than those shown below. (a) According to the embodiment described above, coordinate information regarding each plumb group 5 is generated as ideal plumb position information Prh and as actual plumb position information Pjh. According to a modification, coordinate information regarding each plumb line 3 contained in each plumb group 5 can be generated as ideal plumb position information Prh and as actual plumb position information Pjh. For example, center-of-gravity coordinates of each plumb line 3 in the data can be generated as ideal plumb position information Prh, and center-of-gravity coordinates of each plumb line 3 that are actually printed can be generated as actual plumb position information Pjh. The type of ideal plumb position information must be identical to the type of actual plumb position information.

[0136] If multiple coordinate information is generated as ideal plumb position information Prh and as actual plumb position information Pjh, similar to the modification above, the ideal plumb line investigation reference information Krh, the assembly position adjustment information Cji, and the actual investigation reference information Kjh can also be suitably modified. For example, coordinates identical to the center of gravity coordinates of the ideal plumb line range Arh can be generated as ideal plumb line investigation reference information Krh. Vector information [= (Qx, Qy)] with respect to the respective plumb line groups 5 can be generated as assembly position adjustment information Cji.This vector information can, for example, consist of an average (Qx) of the magnitudes of a position misalignment Δx along the X-axis and an average (Qy) of the magnitudes of a position misalignment Δy along the Y-axis of the actual plumb position information Pjh relative to the ideal plumb position information Prh. Furthermore, coordinates obtained by shifting the ideal plumb line reference information Krh (coordinate information) by the vector information can be generated as actual reference information Kjh.

[0137] A modified procedure for examining the print quality of plumb line 3 can determine the good or poor print quality of plumb line group 5 by determining whether the respective absolute values ​​of positional misalignment along the X-axis and Y-axis of the actual plumb line position information Pjh, relative to the actual test reference information Kjh, lie within predetermined reference values ​​that are set in advance. More precisely, if the respective values ​​of positional misalignment are equal to or less than the respective reference values ​​with respect to the respective plumb lines 3 contained in plumb line group 5, the print quality of plumb line group 5 can be determined as "good print quality".If at least one of the respective sizes of a positional misalignment is greater than the corresponding reference value with respect to at least one of the plumb lines 3 included in plumb line group 5, the print quality of plumb line group 5 can be determined as "poor print quality".

[0138] Furthermore, a modified procedure can generate center-of-mass coordinates of the adhesive 6 in the data as ideal adhesive investigation reference information Krs and can generate center-of-mass coordinates of the actually applied adhesive 6 as the actual adhesive area Ajs. The modified procedure can then determine the good or poor application quality of the adhesive 6 based on the magnitude of any positional misalignment between the ideal adhesive investigation reference information Krs and the actual adhesive area Ajs.

[0139] (b) According to the embodiment described above, the testing process is carried out for all solder groups 5 and for all adhesives 6. According to a modification, the testing process can be carried out only for a predetermined solder group 5 or only for a predetermined adhesive 6, which is selected by an operator or similar. This simplifies the testing process and improves manufacturing efficiency. In this modification, an average of the assembly position setting information Cji with respect to a solder group 5 as the object of testing can be used as assembly position setting information Cji with respect to the solder groups 5 that are not the solder group 5 as the object of testing.

[0140] (c) According to the embodiment described above, the vector information is generated as mounting position setting information Cji, and the electronic component 4 is mounted at the position determined by shifting the ideal mounting position information by this vector information. In other words, the electronic component 4 is mounted at the position determined by shifting the ideal mounting position information in the X-axis and Y-axis directions. According to a modification, rotation angle information can be generated as mounting position setting information Cji. For example, a range of coordinates specifying the ideal plumb range Arh can be set to the ideal plumb position information Prh, and a range of coordinates specifying the actual plumb range Ajh can be set to the actual plumb position information Pjh.The magnitude and direction of rotation of the actual plumb position information Pjh around the center of the electronic component 4 in the data, as a center of rotation relative to the ideal plumb position information Prh, can be generated as mounting position setting information Cji. The mounting position of the electronic component 4 can be set based on the magnitude and direction of rotation. According to another modification, the mounting position setting information Cji can include both the vector information and the information regarding the magnitude and direction of rotation.

[0141] (d) The above embodiment determines the good or poor print quality of a respective plumb group 5 by determining whether the proportion of the area occupied by an area other than the actual plumb area Ajh in the actual inspection reference information Kjh (actual plumb inspection window) exceeds the predetermined reference value. A modification can determine the good or poor print quality of a respective plumb group 5 by determining whether the magnitude of a positional misalignment of the center-of-mass coordinates of the actual plumb area Ajh relative to the center coordinates of the actual inspection reference information Kjh (actual plumb inspection window) exceeds a predetermined reference value.Another modification can determine the good or poor print quality of a respective solder group 5 on the basis of a correspondence ratio of the actual solder area Ajh to the actual investigation reference information Kjh (actual solder investigation window).

[0142] Furthermore, this procedure can be used to determine the good or poor quality of the adhesive 6. More specifically, a modified procedure can determine the good or poor application quality of the adhesive 6 by determining whether a magnitude of positional misalignment of the center-of-mass coordinates of the actual adhesive area Ajs relative to the center coordinates of the ideal adhesive testing reference information Krs (ideal adhesive testing window) exceeds a predetermined reference value. Another modified procedure can determine the good or poor application quality of the adhesive based on a conformity ratio of the actual adhesive area Ajs with respect to the ideal adhesive testing reference information Krs (ideal adhesive testing window).

[0143] (e) At the time the “printing error signal”, the “application error signal”, or the “soldering error signal” is output, the inspection process carried out by the substrate inspection device 21 may be skipped and terminated with respect to uninspected solder groups 5 or uninspected adhesives 6, although this is not specifically described in the embodiment above. This modification prevents the continuation of the inspection process with respect to the substrate 1 that is a defective product and thereby improves inspection efficiency.

[0144] (f) According to the embodiment described above, the ideal solder inspection reference information Krh and the actual inspection reference information Kjh are set to be larger than the ideal solder area Arh. According to a modification, the ideal solder inspection reference information Krh and the actual inspection reference information Kjh can be set to be the same size as the ideal solder area Arh. The ideal adhesive inspection reference information Krs can be set to be the same size as the ideal adhesive area Ars.

[0145] (g) The above embodiment generates the ideal solder area Arh and then generates the ideal solder position information Prh based on the ideal solder area Arh. A modification can generate the ideal solder position information Prh directly from the design data or the manufacturing data without generating the ideal solder area Arh.

[0146] (h) The above embodiment generates the ideal solder inspection reference information Krh based on the ideal solder area Arh. A modification can pre-store information regarding an inspection reference position and an inspection reference area in the form of design data or in the form of manufacturing data in the storage device 42 and can generate the ideal solder inspection reference information Krh based on the stored information.

[0147] (i) If the “printing error signal” is output during the process of examining several solder groups 5, it is possible that a metal screen is positioned differently from the substrate 1, although this is not specifically described in the embodiment above. With a view to correcting such a positional misalignment of the metal screen, a modification can adjust the solder printing position by the solder printing machine 11 (i.e., it can move the metal screen) based on the assembly position setting information generated with respect to the respective solder groups 5. Reference symbol list 1 substrate 2, 2a, 2b Electrode pattern 3, 3a, 3b Solder paste (solder) 4 electronic components 5, 5a Lot group 6, 6a Adhesive 7 Electrode section 11 Manufacturing system 12 Solder printing device (solder printing machine) 13 adhesive application device 14-component assembly system 15 Reflow device 16 Component assembly condition inspection device 21 Substrate testing device 22 Component assembly machine 31 Assembly table 32 Lighting device (irradiation unit) 33 CCD camera (imaging unit) 34, 35 Electric motor 41 Control device 42 Storage device 43 Arithmetic device 44 Ideal plumb line position information generation unit 45 Image processing unit (Actual plumb position information generation unit) 46 Ideal plumb line analysis reference information generation unit 47 Ideal adhesive testing reference information generation unit 48 Assembly position setting information generation unit 49 Electrode section arrangement area generation unit Adh, Adh1, Adh2 Electrode section arrangement area Ajh, Ajh1, Ajh2 actual plumb line Ajs actual adhesive range Arh, Arh1, Arh2 ideal plumb line range Ars ideal adhesive range Cji Mounting Position Adjustment Information Kjh, Kjh1, Kjh2 actual examination reference information Krh, Krh1, Krh2 ideal plumb line reference information KRS' ideal adhesive testing reference information K1, K2 solder point Pjh actual plumb position information Prh ideal plumb position information SA1, SA2 plumb line search area

Claims

[1] Substrate testing device (21) arranged upstream of a component assembly machine (22) used to mount an electronic component (4) onto a solder (3, 3a, 3b) printed onto a substrate (1) by a solder printing machine (11), and designed to test a thermosetting adhesive (6, 6a) applied to the substrate (1) and the solder (3, 3a, 3b), wherein the substrate testing device (21) comprises: an irradiation unit (32) designed to irradiate at least the solder (3, 3a, 3b) and the adhesive (6, 6a) with light; an imaging unit (33) designed to capture an image of at least the solder (3, 3a, 3b) and the adhesive (6, 6a) being illuminated by the light; an actual plumb position information generation unit (45) designed to generate actual plumb position information (Pjh), which is position information of a plumb group (5, 5a) containing two or more plumb bobs (3, 3a, 3b) and on which the electronic component (4) is mounted, based on image data acquired by the imaging unit (33); an ideal solder inspection reference information generating unit (46) designed to generate ideal solder inspection reference information (Krh) specifying a reference inspection position and / or reference inspection area of ​​the solder (3, 3a, 3b) contained in the solder group (5, 5a) based on design data or manufacturing data; and an ideal adhesive test reference information generating unit (47) designed to generate ideal adhesive test reference information specifying a reference test position and / or reference test area of ​​the adhesive (6, 6a) based on the design data or the manufacturing data, wherein the adhesive (6, 6a) has a curing temperature that is set higher than the melting temperature of the solder (3, 3a, 3b), Information based on the magnitude and direction of a position misalignment of the actual solder position information (Pjh) relative to ideal solder position information (Prh), which specifies a position of the solder group (5, 5a) in the design data or in the manufacturing data, is output to the component assembly machine (22) as assembly position setting information (Cji), which specifies the magnitude and direction of a position misalignment of expected assembly position information, which specifies an expected assembly position of the electronic component (4) that is produced on the basis of actually printed solders, relative to ideal assembly position information, which specifies an ideal assembly position of the electronic component (4) to be mounted on the solder group (5, 5a).wherein the ideal mounting position of the electronic component (4) is generated on the basis of solder positions in the design data or manufacturing data, and, an investigation of the respective solders (3, 3a, 3b) contained in the solder group (5, 5a) is carried out on the basis of actual investigation reference information obtained by shifting the ideal solder investigation reference information (Krh) around the assembly position setting information (Cji), and an investigation of the adhesive (6, 6a) is carried out on the basis of the ideal adhesive investigation reference information. [2] Substrate testing device (21) arranged upstream of a component assembly machine (22) used to mount an electronic component (4) on a solder (3, 3a, 3b) printed onto a substrate (1) by a solder printing machine (11), and designed to test at least one thermosetting adhesive (6, 6a) applied to the substrate (1) from the adhesive (6, 6a) and the solder (3, 3a, 3b), wherein the substrate testing device (21) comprises: an irradiation unit (32) designed to irradiate at least the solder (3, 3a, 3b) and the adhesive (6, 6a) with light; an imaging unit (33) designed to capture an image of at least the solder (3, 3a, 3b) and the adhesive (6, 6a) being illuminated by the light; an actual plumb position information generation unit (45) designed to generate actual plumb position information (Pjh), which is position information of a plumb group (5, 5a) containing two or more plumb bobs (3, 3a, 3b) and on which the electronic component (4) is mounted, based on image data acquired by the imaging unit (33), and an ideal adhesive test reference information generating unit (47) designed to generate ideal adhesive test reference information specifying a reference test position and / or reference test area of ​​the adhesive (6, 6a) based on design data or manufacturing data, wherein the adhesive (6, 6a) has a curing temperature that is set higher than the melting temperature of the solder (3, 3a, 3b), Information based on the magnitude and direction of a position misalignment of the actual solder position information (Pjh) relative to ideal solder position information (Prh), which specifies a position of the solder group (5, 5a) in the design data or in the manufacturing data, is output to the component assembly machine (22) as assembly position setting information (Cji), which specifies the magnitude and direction of a position misalignment of expected assembly position information, which specifies an expected assembly position of the electronic component (4) that is produced on the basis of actually printed solders, relative to ideal assembly position information, which specifies an ideal assembly position of the electronic component (4) to be mounted on the solder group (5, 5a).wherein the ideal mounting position of the electronic component (4) is generated on the basis of solder positions in the design data or manufacturing data, and, an investigation of at least the adhesive (6, 6a) is carried out on the basis of the ideal adhesive investigation reference information. [3] Substrate testing device (21) according to claim 1 or 2, wherein the adhesive (6, 6a) is an insulating adhesive, wherein the substrate testing device (21) calculates an area of ​​an overlap region between the solder (3, 3a, 3b) printed on the substrate (1) and the adhesive (6, 6a) applied to the substrate (1) and determines a successful or failed soldering based on the calculated area prior to a predetermined reflow process. [4] Substrate testing device (21) according to one of claims 1 to 3, wherein the adhesive (6, 6a) is an insulating adhesive, wherein the substrate testing device (21) calculates an area of ​​an overlap region between an expected arrangement area of ​​an electrode section of the electronic component (4) to be mounted on the solder (3, 3a, 3b) and the adhesive (6, 6a) applied to the substrate (1) and determines whether a soldering operation is successful or unsuccessful based on the calculated area prior to a predetermined reflow process.

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